
MAX16815/MAX16828
High-Voltage, 100mA/200mA Adjustable Linear
High-Brightness LED Drivers with PWM Dimming
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VIN = 12V, VEN = 12V (SO only), CV5 = 0.1µF to GND, IV5 = 0, VDIM = 4V, VCS- = 0V (SO only), connect RSENSE = 2Ω(MAX16815)
and RSENSE = 1Ω(MAX16828) between CS+ and GND. TA= -40°C to +125°C, unless otherwise noted. Typical values are at
TA= +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
IN to GND ...............................................................-0.3V to +45V
CS+, CS-, V5 to GND ...............................................-0.3V to +6V
DIM, EN to GND...........................................-0.3V to (VIN + 0.3V)
OUT Short Circuited to GND Duration
(at VIN = +16V) .......................................................60 minutes
Maximum Current into Any Pin (except IN and OUT).......±20mA
Continuous Power Dissipation (TA= +70°C)
6-Pin, 3mm x 3mm TDFN
(derate 18.2mW/°C above +70°C)..........................1454.5mW
8-Pin SO (derate 23.3mW/°C above +70°C)...........1860.5mW
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature......................................................+150°C
Junction-to-Case Thermal Resistance (θJC) (Note 1)
6-Pin, 3mm x 3mm TDFN ...............................................9°C/W
8-Pin SO .........................................................................7°C/W
Junction-to-Ambient Thermal Resistance (θJA) (Note 1)
6-Pin, 3mm x 3mm TDFN .............................................42°C/W
8-Pin SO .......................................................................43°C/W
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage Range VIN (Note 3) 6.5 40.0 V
ILOAD = 100mA 0.82 2
Ground Current IGILOAD = 200mA 1 2 mA
Shutdown Supply Current ISHDN VEN ≤ 0.6V (SO only) 35 70 µA
RSENSE = 2_ (MAX16815) 100
Guaranteed Output Current IOUT RSENSE = 1_ (MAX16828) 200 mA
35mA < IOUT < 100mA (MAX16815) ±3.5
Output Current Accuracy 35mA < IOUT < 200mA (MAX16828) ±3.5 %
IOUT = 100mA (current pulsed),
12V < VIN < 40V (MAX16815) (Note 4) 0.1 0.4
IOUT = 100mA (current pulsed),
6.5V < VIN < 12V (MAX16815) (Note 4) 0.1 0.6
IOUT = 200mA (current pulsed),
12V < VIN < 40V (MAX16828) (Note 5) 0.27 0.55
Dropout Voltage ∆VDO
IOUT = 200mA (current pulsed),
6.5V < VIN < 12V (MAX16828) (Note 5) 0.27 0.7
V
Current rising 9.7
Output Current Slew Rate Current falling 9.7 mA/µs
VOUT = 0V, VIN = 12V, MAX16815 130 200 270
Short-Circuit Current VOUT = 0V, VIN = 12V, MAX16828 250 300 350 mA
EN INPUT (SO ONLY)
EN Input Current IEN -2.5 -1 -0.2 µA
EN Input Voltage High VIH 2.8 V
EN Input Voltage Low VIL 0.6 V
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.