Ver 201208
FEATURES
APPLICATION
DIMENSION
Type Dimension [mm]
L W t d
05 1.0±0.05 0.5±0.05 0.5±0.05 0.25±0.1
DESCRIPTION
Chip
ChipChip
Chip Bead
BeadBead
Bead
For
ForFor
For EMI
EMIEMI
EMI Suppression
SuppressionSuppression
Suppression
RECOMMENDED LAND PATTERN
CIB/CIM05 Series (1005/ EIA 0402)
Perfect shape for automatic mounting, with no directionality.
Excellent solderability and high heat resistance for either flow
or reflow soldering
Monolithic inorganic material construction for high reliability
Closed magnetic circuit configuration avoids crosstalk and is
suitable for high density PCBs.
Part no. Thickness
(mm) Impedance
(Ω)±25%@100MHz DC Resistance
(Ω)Max. Rated Current
(mA) Max.
CIB05J100 0.5±0.05 10 0.05 1200
CIM05U100 0.5±0.05 10 0.05 1200
CIM05U300 0.5±0.05 30 0.10 700
CIM05U600 0.5±0.05 60 0.15 600
CIM05U800 0.5±0.05 80 0.20 600
CIM05U121 0.5±0.05 120 0.25 600
CIM05U221 0.5±0.05 220 0.35 500
CIM05U241 0.5±0.05 240 0.35 400
CIM05U301 0.5±0.05 300 0.45 400
CIM05U471 0.5±0.05 470 0.55 300
CIM05U601 0.5±0.05 600 0.60 300
CIM05U102 0.5±0.05 1000 0.80 300
CIM05J300 0.5±0.05 30 0.20 700
CIM05J600 0.5±0.05 60 0.20 650
CIM05J800 0.5±0.05 80 0.25 600
CIM05J121 0.5±0.05 120 0.25 500
CIM05J221 0.5±0.05 220 0.35 400
CIM05J241 0.5±0.05 240 0.35 400
CIM05J301 0.5±0.05 300 0.45 400
CIM05J471 0.5±0.05 470 0.55 300
CIM05J601 0.5±0.05 600 0.60 300
High frequency EMI prevention application to computers, printers,
VCRs, TVs and mobile phones.
0.40~0.50mm 0.40~0.50mm
0.45~0.55mm
0.45~0.55mm
Ver 201208
CHARACTERISTIC DATA
Part no. Thickness
(mm) Impedance
(Ω)±25%@100MHz DC Resistance
(Ω)Max. Rated Current
(mA) Max.
CIM05J102 0.5±0.05 1000 0.80 250
CIM05J152 0.5±0.05 1500 1.00 250
CIM05J182 0.5±0.05 1800 1.40 200
CIM05N750 0.5±0.05 75 0.35 300
CIM05N121 0.5±0.05 120 0.55 300
CIM05N221 0.5±0.05 220 0.80 200
CIM05F050 0.5±0.05 5 0.08 500
CIM05F100 0.5±0.05 10 0.10 300
CIM05F220 0.5±0.05 22 0.20 300
CIM05F470 0.5±0.05 47 0.35 300
CIM05F750 0.5±0.05 75 0.40 300
CIM05F121 0.5±0.05 120 0.55 300
CIM05F221 0.5±0.05 220 0.80 200
CIM05H800 0.5±0.05 80 0.20 450
CIM05H121 0.5±0.05 120 0.25 400
CIM05H601 0.5±0.05 600 0.80 200
Ver 201208
Ver 201208
Ver 201208
CI M 05 U 121 N C
(1) (2) (3) (4) (5) (6) (7)
(1) Chip Beads (2) M: Multi-layer type B:Mono-layer type
(3) Dimension (4) Material Code
(5) Nominal impedance (100:10Ω, 121:120Ω)
(6) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(7) Packaging(C:paper tape, E:embossed tape)
PACKAGING
Packaging Style Quantity(pcs/reel)
Card Board Taping 10,000
RECOMMENDED SOLDERING CONDITION
PRODUCT IDENTIFICATION
REFLOW SOLDERING FLOW SOLDERING
■NOTICE :All specifications are subject to change without previous notice. Please contact with
product representatives or engineers to check specifications.
