2011-06-17
1
DSL70
Silicon TVS diodes Array
• ESD / transient protection of e.g. ADSL, VDSL,
ISDN, WAN, LAN, I²C Bus, Microcontroller Inputs,
Video and other high-speed data lines in telecom
applications:
IEC61000-4-2 (ESD): ± 15 kV (Air / Contact)
IEC61000-4-4 (EFT): 4 kV / 80 A (5/50 ns)
IEC61000-4-5 (Lightning): 27 A (8/20 µs)
• Very low capacitance
• Extremly low reverse current < 5 nA
• Pb-free (RoHS compliant) package
DSL70
2
1
D
2
D
1
43
D
3
D
4
Type Package Configuration Marking
DSL70 SOT143 2 channel, rail to rail E4s
Maximum Ratings at T
A
= 25°C, unless otherwise specified
Parameter Symbol Value Unit
ESD contact discharge per diode1) VESD 15 kV
Peak pulse current (t
p
= 8 / 20 µs)2) I
pp
27 A
Peak pulse power (t
p
= 8 / 20 µs) P
p
k245 W
Operating temperature range To
p
-55...125 °C
Storage temperature Tst
g
-65...150
1VESD according to IEC61000-4-2
2Ipp according to IEC61000-4-5
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DSL70
Electrical Characteristics at T
A
= 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
Characteristics -
Reverse working voltage VRWM - - 50 V
Reverse current
VR = 50 V
IR- - 5 nA
Forward clamping voltage1)
IPP = 1 A, tP = 8/20 µs
IPP = 10 A, tP = 8/20 µs
IPP = 24 A, tP = 8/20 µs
IPP = 27 A, tP = 8/20 µs
VFC
-
-
-
-
1
2.5
5
6
1.5
3
6
9
V
Diode capacitance
VR = 0 V, f = 1 MHz, between I/0 and GND
VR = 0 V, f = 1 MHz, between I/0 pins
CT
-
-
2.5
1.25
5
2.5
pF
1IPP according to IEC61000-4-5
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DSL70
Power derating curve Ppk = ƒ (TA)
0 25 50 75 100 °C 150
TA
0
10
20
30
40
50
60
70
80
90
110
Ppk or Ipp
Forward clamping voltage VFC = ƒ(IPP)
tp = 8 / 20 µs
0 5 10 15 20 25 A35
IPP
0
1
2
3
4
5
6
V
8
VFC
Diode capacitance CT = ƒ (VR)
f = 1MHz
0 5 10 15 20 V30
VR
0
1
pF
3
CT
I/O to GND
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DSL70
Application example DSL70
dual channel, rail to rail configuration
Protected signal line
Protected signal line
The protection diode should be placed
very close to the location where the
ESD or other transients can occur to
keep loops and inductances as small
as possible. Pin 1 should be connected
directly to a ground plane on the board.
Connector
ESD sensitive
device
I/O
I/O
2
1
D
2
D1
43
D
3
D
4
Vcc
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DSL70
Package SOT143
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
RF s
2005, June
Date code (YM)
BFP181
Type code
56
Pin 1
0.8 0.81.2
0.9 1.1 0.9
1.2
0.8
0.8
0.8
-0.05
+0.1
1.9
1.7
±0.1
2.9
+0.1
-0.05
0.4
0.1 MAX.
12
34
0.25
M
B
±0.1
1
10˚ MAX.
0.15 MIN.
0.2 A
M
2.4 ±0.15
0.2
10˚ MAX.
A
1.3 ±0.1
0...8˚
0.08...0.15
2.6
4
3.15
Pin 1
8
0.2
1.15
B
Manufacturer
2011-06-17
6
DSL70
Edition 2009-11-16
Published by
Infineon Technologies AG
81726 Munich, Germany
2009 Infineon Technologies AG
All Rights Reserved.
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of conditions or characteristics. With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of
the device, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices,
please contact the nearest Infineon Technologies Office (<www.infineon.com>).
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Due to technical requirements, components may contain dangerous substances.
For information on the types in question, please contact the nearest Infineon
Technologies Office.
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