1. Product profile
1.1 General description
PESD1CAN in small SOT23 SMD plastic package designed to protect two automotive
Control Area Network (CAN) bus lines from the damage caused by ElectroStatic
Discharge (ESD) and other transients.
1.2 Features
Due to the integrated diode structure only one small SOT23 package is needed to
protect two CAN bus lines
Max. peak pulse power: Ppp = 200 W at tp = 8/20 µs
Low clamping voltage: V(CL)R = 40 V at Ipp = 1 A
Ultra low leakage current: IRM < 1 nA
ESD protection of up to 23 kV
IEC 61000-4-2, level 4 (ESD)
IEC 61000-4-5 (surge); Ipp = 3 A at tp = 8/20 µs
Small SMD plastic package
1.3 Applications
CAN bus protection
Automotive applications
1.4 Quick reference data
PESD1CAN
CAN bus ESD protection diode in SOT23
Rev. 01 — 25 January 2005 Objective data sheet
Table 1: Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VRWM reverse stand-off voltage - - 24 V
Cddiode capacitance VR = 0 V;
f=1MHz -11-pF
9397 750 14197 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Objective data sheet Rev. 01 — 25 January 2005 2 of 12
Philips Semiconductors PESD1CAN
CAN bus ESD protection diode in SOT23
2. Pinning information
3. Ordering information
4. Marking
[1] * = p: made in Hong Kong
* = t: made in Hong Kong
* = W: made in China
5. Limiting values
[1] Non-repetitive current pulse 8/20 µs exponentially decaying waveform according to IEC61000-4-5; see
Figure 1.
[2] Measured from pin 1 to 3 or 2 to 3.
Table 2: Pinning
Pin Description Simplified outline Symbol
1 cathode 1
2 cathode 2
3 double cathode
SOT23
12
3
2
1
006aaa155
3
Table 3: Ordering information
Type number Package
Name Description Version
PESD1CAN - plastic surface mounted package; 3 leads SOT23
Table 4: Marking codes
Type number Marking code[1]
PESD1CAN *AN
Table 5: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Ppp peak pulse power 8/20 µs[1] [2] - 200 W
Ipp peak pulse current 8/20 µs[1] [2] -3A
Tjjunction temperature - 150 °C
Tamb ambient temperature 65 +150 °C
Tstg storage temperature 65 +150 °C
9397 750 14197 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Objective data sheet Rev. 01 — 25 January 2005 3 of 12
Philips Semiconductors PESD1CAN
CAN bus ESD protection diode in SOT23
[1] Device stressed with ten non-repetitive ElectroStatic Discharge (ESD) pulses; see Figure 2.
[2] Measured from pin 1 to 3 or 2 to 3.
Table 6: ESD maximum ratings
Symbol Parameter Conditions Min Max Unit
ESD electrostatic discharge
capability IEC 61000-4-2
(contact discharge) [1] [2] -23kV
HBM MIL-STD883 - 10 kV
Table 7: ESD standards compliance
ESD Standard Conditions
IEC 61000-4-2, level 4 (ESD); see Figure 2 > 15 kV (air); > 8 kV (contact)
HBM MIL-STD883, class 3 > 4 kV
Fig 1. 8/20 µs pulse waveform according to
IEC 61000-4-5 Fig 2. ElectroStatic Discharge (ESD) pulse waveform
according to IEC 61000-4-2
t (µs)
0403010 20
001aaa630
40
80
120
Ipp
(%)
0
et
100 % Ipp; 8 µs
50 % Ipp; 20 µs
001aaa631
Ipp
100 %
90 %
t
30 ns 60 ns
10 %
tr = 0.7 to 1 ns
9397 750 14197 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Objective data sheet Rev. 01 — 25 January 2005 4 of 12
Philips Semiconductors PESD1CAN
CAN bus ESD protection diode in SOT23
6. Characteristics
[1] Non-repetitive current pulse 8/20 µs exponentially decaying waveform according to IEC61000-4-5; see Figure 1.
[2] Measured from pin 1 to 3 or 2 to 3.
Table 8: Characteristics
T
amb
= 25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VRWM reverse stand-off voltage - - 24 V
IRM reverse leakage current VRWM = 24 V - < 1 50 nA
V(BR) breakdown voltage IR = 5 mA 25.4 27.8 30.3 V
Cddiode capacitance VR = 0 V; f = 1 MHz;
see Figure 5 -11-pF
V(CL)R clamping voltage IPP = 1 A [1] [2] --40V
IPP = 3 A [1] [2] --70V
rdif differential resistance IR = 1 mA - - 300
9397 750 14197 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Objective data sheet Rev. 01 — 25 January 2005 5 of 12
Philips Semiconductors PESD1CAN
CAN bus ESD protection diode in SOT23
Tamb = 25 °C.
Fig 3. Peak pulse power as a function of exponential
pulse duration tp; typical values Fig 4. Relative variation of peak pulse power as a
function of junction temperature; typical values
Tamb = 25 °C; f = 1 MHz.
Fig 5. Diode capacitance as a function of reverse voltage; typical values
006aaa257
103
102
104
Ppp
(W)
10
tp (µs)
110
4
103
10 102Tj (°C)
0 20015050 100
001aaa193
0.4
0.8
1.2
Ppp
0
Ppp(25˚C)
VR (V)
0252010 155
006aaa258
8
12
4
16
20
Cd
(pF)
0
9397 750 14197 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Objective data sheet Rev. 01 — 25 January 2005 6 of 12
Philips Semiconductors PESD1CAN
CAN bus ESD protection diode in SOT23
Fig 6. ESD clamping test set-up and waveforms
006aaa259
50
RZ
CZ
D.U.T.
(Device
Under
Test)
vertical scale = 200 V/div
horizontal scale = 50 ns/div
unclamped +1 kV ESD voltage waveform
(IEC 61000-4-2 network) clamped +1 kV ESD voltage waveform
(IEC 61000-4-2 network)
unclamped 1 kV ESD voltage waveform
(IEC 61000-4-2 network) clamped 1 kV ESD voltage waveform
(IEC 61000-4-2 network)
vertical scale = 200 V/div
horizontal scale = 50 ns/div
vertical scale = 20 V/div; horizontal scale = 50 ns/div
vertical scale = 20 V/div; horizontal scale = 50 ns/div
GND
GND
450 RG 223/U
50 coax
ESD TESTER
IEC 61000-4-2 network
CZ = 150 pF; RZ = 330
4 GHz DIGITAL
OSCILLOSCOPE
10×
ATTENUATOR
GND
GND
9397 750 14197 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Objective data sheet Rev. 01 — 25 January 2005 7 of 12
Philips Semiconductors PESD1CAN
CAN bus ESD protection diode in SOT23
7. Application information
The PESD1CAN is designed for the protection of two automotive CAN bus lines from the
damage caused by ElectroStatic Discharge (ESD) and surge pulses. The PESD1CAN
provides a surge capability of up to 200 W per line for a 8/20 µs waveform.
Circuit board layout and protection device placement:
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the protection device as close to the input terminal or connector as possible.
2. The path length between the protection device and the protected line should be
minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protection conductors in parallel with unprotected conductor.
5. Minimize all printed-circuit board conductive loops including power and ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer printed-circuit
boards, use ground vias.
Fig 7. Typical application: ESD protection of two automotive CAN bus lines
006aaa260
GND
PESD1CAN
line 2 to be protected
line 1 to be protected
9397 750 14197 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Objective data sheet Rev. 01 — 25 January 2005 8 of 12
Philips Semiconductors PESD1CAN
CAN bus ESD protection diode in SOT23
8. Package outline
Fig 8. Package outline SOT23 (TO-236AB)
UNIT A1
max. bpcDE e1HELpQwv
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
99-09-13
04-11-04
IEC JEDEC JEITA
mm 0.1 0.48
0.38 0.15
0.09 3.0
2.8 1.4
1.2 0.95
e
1.9 2.5
2.1 0.55
0.45 0.1
0.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15
SOT23 TO-236AB
bp
D
e1
e
A
A1
Lp
Q
detail X
HE
E
wM
vMA
B
AB
0 1 2 mm
scale
A
1.1
0.9
c
X
12
3
Plastic surface mounted package; 3 leads SOT23
9397 750 14197 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Objective data sheet Rev. 01 — 25 January 2005 9 of 12
Philips Semiconductors PESD1CAN
CAN bus ESD protection diode in SOT23
9. Packing information
[1] For further information and the availability of packing methods, see Section 14.
Table 9: Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 10000
PESD1CAN SOT23 4 mm pitch, 8 mm tape and reel -215 -235
9397 750 14197 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Objective data sheet Rev. 01 — 25 January 2005 10 of 12
Philips Semiconductors PESD1CAN
CAN bus ESD protection diode in SOT23
10. Revision history
Table 10: Revision history
Document ID Release date Data sheet status Change notice Doc. number Supersedes
PESD1CAN_1 20050125 Objective data sheet - 9397 750 14197 -
Philips Semiconductors PESD1CAN
CAN bus ESD protection diode in SOT23
9397 750 14197 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Objective data sheet Rev. 01 — 25 January 2005 11 of 12
11. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
12. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
13. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
14. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level Data sheet status[1] Product status[2] [3] Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification.Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.Date of release: 25 January 2005
Document number: 9397 750 14197
Published in The Netherlands
Philips Semiconductors PESD1CAN
CAN bus ESD protection diode in SOT23
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Application information. . . . . . . . . . . . . . . . . . . 7
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
9 Packing information. . . . . . . . . . . . . . . . . . . . . . 9
10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
11 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 11
12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
14 Contact information . . . . . . . . . . . . . . . . . . . . 11