VND5E025MK-E Double-channel high-side driver with analog current sense for automotive applications Features Max transient supply voltage VCC 41 V Operating voltage range VCC 4.5 to 28 V Max on-state resistance (per ch.) RON 25 m Current limitation (typ) ILIMH 60 A Off-state supply current IS 2 A(1) PowerSSO-24 - Reverse battery protected (see Figure 29: Application schematic(1)) - Electrostatic discharge protection 1. Typical value with all loads connected. General - Inrush current active management by power limitation - Very low standby current - 3.0V CMOS compatible inputs - Optimized electromagnetic emissions - Very low electromagnetic susceptibility - In compliance with the 2002/95/EC european directive - Very low current sense leakage Diagnostic functions - Proportional load current sense - High current sense precision for wide currents range - Current sense disable - Overload and short to ground (power limitation) indication - Thermal shutdown indication Protections - Undervoltage shutdown - Overvoltage clamp - Load current limitation - Self limiting of fast thermal transients - Protection against loss of ground and loss of VCC - Overtemperature shutdown with auto restart (thermal shutdown) October 2009 Applications All types of resistive, inductive and capacitive loads Suitable as LED driver Description The VND5E025MK-E is a double-channel highside drivers manufactured in the ST proprietary VIPowerTM M0-5 technology and housed in the tiny PowerSSO-24 package. The VND5E025MK-E is designed to drive 12V automotive grounded loads delivering protection, diagnostics and easy 3V and 5V CMOS compatible interface with any microcontroller. The device integrates advanced protective functions such as load current limitation, inrush and overload active management by power limitation, overtemperature shut-off with auto-restart and overvoltage active clamp. A dedicated analog current sense pin is associated with every output channel in order to provide Enhanced diagnostic functions including fast detection of overload and short-circuit to ground through power limitation indication and overtemperature indication. The current sensing and diagnostic feedback of the whole device can be disabled by pulling the CS_DIS pin high to allow sharing of the external sense resistor with other similar devices. Doc ID 16471 Rev 1 1/35 www.st.com 1 Contents VND5E025MK-E Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.4 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2.5 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 3.1 4 3.1.1 Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 23 3.1.2 Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 24 3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.3 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.4 Current sense and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3.5 Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . . 26 Package and thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 4.1 5 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 23 PowerSSO-24 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 5.1 ECOPACK(R) packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 5.2 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 5.3 Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 6 Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 2/35 Doc ID 16471 Rev 1 VND5E025MK-E List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Switching (VCC = 13V; Tj = 25C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Protections and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Current sense (8V < VCC < 18V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Electrical transient requirements (part 1/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Electrical transient requirements (part 2/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Electrical transient requirements (part 3/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 PowerSSO-24 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Doc ID 16471 Rev 1 3/35 List of figures VND5E025MK-E List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Figure 38. 4/35 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Current and voltage conventions(1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Current sense delay characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Output voltage drop limitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Delay response time between rising edge of output current and rising edge of current sense (CS enabled). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 IOUT/ISENSE vs IOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Maximum current sense ratio drift vs load current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Normal operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Overload or short to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Intermittent overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 TJ evolution in overload or short to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 On-state resistance vs VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 ILIMH vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 CS_DIS high level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 CS_DIS low level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 CS_DIS clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Application schematic(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Current sense and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Maximum turn-off current versus inductance (for each channel)(1) . . . . . . . . . . . . . . . . . . 26 PowerSSO-24 PC board(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Rthj-amb vs PCB copper area in open box free air condition (one channel ON) . . . . . . . . 27 PowerSSO-24 thermal impedance junction to ambient single pulse (one channel ON). . . 28 Thermal fitting model of a double-channel HSD in PowerSSO-24(1) . . . . . . . . . . . . . . . . . 28 PowerSSO-24 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 PowerSSO-24 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 PowerSSO-24 tape and reel shipment (suffix "TR") . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Doc ID 16471 Rev 1 VND5E025MK-E Block diagram and pin description Figure 1. Block diagram VCC Signal Clamp Undervoltage Control & Diagnostic 1 IN1 Power Clamp DRIVER IN2 VON Limitation Over temp. CH 1 Current Limitation CS_ DIS VSENSEH CS1 CONTROL & DIAGNOSTIC Channels 2 1 Block diagram and pin description CH 2 Current Sense OUT2 CS2 OUT1 LOGIC OVERLOAD PROTECTION (ACTIVE POWER LIMITATION) GND Table 1. Pin functions Name VCC OUTPUT1,2 GND INPUT1,2 Function Battery connection. Power output. Ground connection. Must be reverse battery protected by an external diode / resistor network. Voltage controlled input pin with hysteresis, CMOS compatible. Controls output switch state. CURRENT SENSE1,2 Analog current sense pin; delivers a current proportional to the load current. CS_DIS Active high CMOS compatible pin to disable the current sense pin. Doc ID 16471 Rev 1 5/35 Block diagram and pin description Figure 2. VND5E025MK-E Configuration diagram (top view) VCC GND N.C. INPUT2 N.C. INPUT1 N.C. CURRENT SENSE1 N.C. CURRENT SENSE2 CS_DIS. VCC 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 OUTPUT2 OUTPUT2 OUTPUT2 OUTPUT2 OUTPUT2 OUTPUT2 OUTPUT1 OUTPUT1 OUTPUT1 OUTPUT1 OUTPUT1 OUTPUT1 TAB = VCC Table 2. 6/35 Suggested connections for unused and not connected pins Connection / pin Current sense N.C. Output Input CS_DIS Floating Not allowed X X X X To ground Through 1k resistor X Through 22k resistor Through 10k resistor Through 10k resistor Doc ID 16471 Rev 1 VND5E025MK-E 2 Electrical specification Electrical specification Figure 3. Current and voltage conventions(1) IS VCC ICSD VCSD CS_DIS OUTPUT1 INPUT1 CURRENT SENSE1 VCC VOUT1 ISENSE1 IIN1 VIN1 VFn IOUT1 IIN2 IOUT2 VSENSE1 OUTPUT2 INPUT2 ISENSE2 VIN2 VOUT2 CURRENT SENSE2 GND VSENSE2 IGND 1. VFn = VOUTn - VCC during reverse battery condition. 2.1 Absolute maximum ratings Stressing the device above the rating listed in the "Absolute maximum ratings" table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to the conditions in table below for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality document. Table 3. Absolute maximum ratings Symbol Parameter Value VCC DC supply voltage 41 -VCC Reverse DC supply voltage 0.3 -IGND DC reverse ground pin current 200 IOUT DC output current - IOUT IIN ICSD V mA Internally limited A Reverse DC output current 24 DC input current -1 to 10 DC current sense disable input current -ICSENSE DC reverse CS pin current VCSENSE Current sense maximum voltage EMAX Unit Maximum switching energy (single pulse) (L = 0.8 mH; RL = 0; Vbat = 13.5V; Tjstart = 150C; IOUT = IlimL(Typ.)) Doc ID 16471 Rev 1 mA 200 VCC - 41 to +VCC V 140 mJ 7/35 Electrical specification Table 3. VND5E025MK-E Absolute maximum ratings (continued) Symbol Value Unit VESD Electrostatic discharge (Human Body Model: R = 1.5k; C = 100pF) - INPUT - CURRENT SENSE - CS_DIS - OUTPUT - VCC 4000 2000 4000 5000 5000 V V V V V VESD Charge device model (CDM-AEC-Q100-011) 750 V Tj Tstg 2.2 Parameter Junction operating temperature - 40 to 150 Storage temperature - 55 to 150 C Thermal data Table 4. Symbol Thermal data Parameter Rthj-case Thermal resistance junction-case (with one channel ON) Rthj-amb Thermal resistance junction-ambient 8/35 Doc ID 16471 Rev 1 Max. value Unit 1.35 C/W See Figure 33 VND5E025MK-E 2.3 Electrical specification Electrical characteristics Values specified in this section are for 8V<VCC<28V; -40C<Tj<150C, unless otherwise stated. Table 5. Power section Symbol Parameter Test conditions Min. Typ. Max. 4.5 13 28 4.5 VCC Operating supply voltage VUSD Undervoltage shutdown 3.5 VUSDhyst Undervoltage shutdown hysteresis 0.5 RON Vclamp IS IL(off1) VF On-state resistance(1) Clamp voltage IOUT = 3A; Tj = 25C 25 IOUT = 3A; Tj = 150C 50 IOUT = 3A; VCC = 5V; Tj = 25C 35 IS = 20 mA 41 Off-state output current(1) Output - VCC diode voltage(1) 0 VIN = VOUT = 0V; VCC = 13V; Tj = 125C 0 m 52 V 2(2) 5(2) A 3 6 mA 0.01 3 On-state; VCC = 13V; VIN = 5V; IOUT = 0A VIN = VOUT = 0V; VCC = 13V; Tj = 25C V 46 Off-state; VCC = 13V; Tj = 25C; VIN = VOUT = VSENSE = VCSD = 0V Supply current Unit A 5 -IOUT = 4 A; Tj = 150C 0.7 V 1. For each channel. 2. PowerMOS leakage included. Table 6. Symbol Switching (VCC = 13V; Tj = 25C) Parameter td(on) Turn-on delay time td(off) Turn-off delay time Test conditions RL = 4.3 (see Figure 5) (dVOUT/dt)on Turn-on voltage slope RL = 4.3 (dVOUT/dt)off Turn-off voltage slope WON Switching energy losses during tWON WOFF Switching energy losses during tWOFF RL = 4.3 (see Figure 5) Doc ID 16471 Rev 1 Min. Typ. Max. Unit 20 s 40 See Figure 24 V/s See Figure 25 0.6 mJ 0.35 9/35 Electrical specification Table 7. Symbol VND5E025MK-E Logic inputs Parameter VIL Input low level voltage IIL Low level input current VIH Input high level voltage IIH High level input current VI(hyst) Input hysteresis voltage VICL Input clamp voltage CS_DIS low level voltage ICSDL Low level CS_DIS current VCSDH CS_DIS high level voltage ICSDH High level CS_DIS current VCSD(hyst) CS_DIS hysteresis voltage Table 8. Symbol CS_DIS clamp voltage Parameter Unit 0.9 V 1 A 2.1 V VIN = 2.1V 10 IIN = 1mA 5.5 7 V -0.7 0.9 VCSD = 0.9V 1 A 2.1 V VCSD = 2.1V 10 A 7 V Max. Unit 0.25 ICSD = 1mA 5.5 -0.7 ILIML TTSD Shutdown temperature VCC = 13V Min. Typ. 43 60 85 5V < VCC < 28V TR Reset temperature TRS Thermal reset of STATUS A VCC = 13V; TR < Tj < TTSD 15 150 175 TRS + 1 TRS + 5 200 C 135 Thermal hysteresis (TTSD-TR) 7 Turn-Off output voltage clamp IOUT= 2A; VIN = 0; L = 6 mH Output voltage drop limitation IOUT = 0.1A; Tj = -40C to +150C (see Figure 6) VCC - 41 VCC - 46 VCC - 52 V 25 mV 1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles. 10/35 A 0.25 Test conditions Short circuit current during thermal cycling VON Max. Protections and diagnostics (1) DC short circuit current VDEMAG Typ. ICSD = -1mA ILIMH THYST VIN = 0.9V Min. IIN = -1mA VCSDL VCSCL Test conditions Doc ID 16471 Rev 1 VND5E025MK-E Electrical specification Table 9. Symbol Current sense (8V < VCC < 18V) Parameter Test conditions Min. Typ. Max. Unit KLED IOUT/ISENSE IOUT = 0.05A; VSENSE = 0.5V; VCSD = 0V; 1240 3350 4960 Tj = -40C to 150C K0 IOUT/ISENSE IOUT = 0.5A; VSENSE = 0.5V; VCSD = 0V; Tj = -40C to 150C IOUT/ISENSE IOUT = 2 A; VSENSE = 4 V; VCSD = 0V; Tj = -40C to 150C Tj = 25C to 150C Current sense ratio drift IOUT = 2 A; VSENSE = 4 V; VCSD = 0V; Tj = -40C to 150C IOUT/ISENSE IOUT = 3 A; VSENSE = 4V; VCSD = 0V; Tj = -40C to 150C Tj = 25C to150C Current sense ratio drift IOUT = 3 A; VSENSE = 4V; VCSD = 0V; Tj = -40C to 150C IOUT/ISENSE IOUT = 10 A; VSENSE = 4V; VCSD = 0V; Tj = -40C to 150C Tj = 25C to 150C Current sense ratio drift IOUT = 10 A; VSENSE = 4V; VCSD = 0V; Tj = -40C to 150C K1 dK1/K1(1) K2 dK2/K2(1) K3 dK3/K3(1) ISENSE0 Analog sense leakage current 1860 3150 4600 2100 3100 4400 2250 3100 3850 -13 13 2200 3000 4100 2450 3000 3550 -12 12 % 2550 2850 3280 2650 2850 3180 -6 +6 % IOUT = 0A; VSENSE = 0V; VCSD = 5V; VIN = 0V; Tj = -40C to 150C VCSD = 0V; VIN = 5V; Tj = -40C to 150C 0 0 1 2 A A IOUT = 2A; VSENSE = 0V; VCSD = 5V; VIN = 5V; Tj = -40C to 150C 0 1 A 30 mA Open-load onstate current detection threshold VIN = 5V, 8V<VCC<18V ISENSE= 5 A 5 VSENSE Max analog sense output voltage IOUT = 3 A; VCSD = 0V 5 VSENSEH Analog sense output voltage in VCC = 13V; RSENSE = 3.9k fault condition(2) 8 ISENSEH Analog sense output current in VCC = 13V; VSENSE = 5V fault condition(2) 9 IOL % V Doc ID 16471 Rev 1 mA 11/35 Electrical specification Table 9. Symbol VND5E025MK-E Current sense (8V < VCC < 18V) (continued) Parameter Test conditions tDSENSE1H Delay response V < 4V, 0.5 < I < 10A time from falling I SENSE= 90% of I OUT SENSEMAX edge of CS_DIS SENSE (see Figure 4) pin 30 100 tDSENSE1L Delay response V < 4V, 0.5 < I < 10A time from rising I SENSE= 10% of I OUT SENSE SENSEMAX edge of CS_DIS (see Figure 4) pin 5 20 tDSENSE2H Delay response time from rising edge of INPUT pin 80 300 Delay response time between rising edge of tDSENSE2H output current and rising edge of current sense tDSENSE2L Delay response time from falling edge of INPUT pin VSENSE < 4V, 0.5 < IOUT < 10A ISENSE = 90% of ISENSEMAX (see Figure 4) s VSENSE < 4V, ISENSE = 90% of ISENSEMAX, IOUT = 90% of IOUTMAX, IOUTMAX = 3A (see Figure 7) VSENSE < 4V, 0.5 < IOUT < 10A ISENSE = 10% of ISENSEMAX (see Figure 4) 1. Parameter guaranteed by design; it is not tested. 2. Fault condition includes: power limitation and overtemperature. 12/35 Min. Typ. Max. Unit Doc ID 16471 Rev 1 110 70 250 VND5E025MK-E Figure 4. Electrical specification Current sense delay characteristics INPUT CS_DIS LOAD CURRENT SENSE CURRENT tDSENSE2H Figure 5. tDSENSE1L tDSENSE1H tDSENSE2L Switching characteristics tWoff tWon VOUT 90% 80% dVOUT/dt(off) dVOUT/dt(on) tr tf 10% t INPUT td(on) td(off) t Figure 6. Output voltage drop limitation VCC - VOUT Tj = 150oC Tj = 25oC Tj = -40oC Von Von/Ron(T) Doc ID 16471 Rev 1 IOUT 13/35 Electrical specification Figure 7. VND5E025MK-E Delay response time between rising edge of output current and rising edge of current sense (CS enabled) VIN tDSENSE2H t IOUT IOUTMAX 90% IOUTMAX t ISENSE ISENSEMAX 90% ISENSEMAX t 14/35 Doc ID 16471 Rev 1 VND5E025MK-E Electrical specification Figure 8. IOUT/ISENSE vs IOUT Iout / Isense 4700 max Tj = -40 C to 150 C 4200 max Tj = 25 C to 150 C 3700 3200 typical value 2700 min Tj = 25 C to 150 C 2200 min Tj = -40 C to 150 C 1700 1200 2 3 4 5 6 7 8 9 10 IOUT (A) Figure 9. Maximum current sense ratio drift vs load current dk/k(%) 20 15 10 5 0 -5 -10 -15 -20 2 Note: 3 4 5 6 IOUT (A) 7 8 9 10 Parameter guaranteed by design; it is not tested. Doc ID 16471 Rev 1 15/35 Electrical specification Table 10. VND5E025MK-E Truth table Input Output Sense (VCSD=0V)(1) Normal operation L H L H 0 Nominal Overtemperature L H L L 0 VSENSEH Undervoltage L H L L 0 0 H X (no power limitation) Cycling (power limitation) Nominal Conditions Overload H VSENSEH Short circuit to GND (Power limitation) L H L L 0 VSENSEH Negative output voltage clamp L L 0 1. If the VCSD is high, the SENSE output is at a high impedance, its potential depends on leakage currents and external circuit. 16/35 Doc ID 16471 Rev 1 VND5E025MK-E Electrical specification Table 11. ISO 7637-2: 2004(E) Test pulse Electrical transient requirements (part 1/3) Test levels (1) III IV 1 -75V -100V 2a +37V 3a Number of pulses or test times Burst cycle / pulse repetition time Delays and Impedance Min. Max. 5000 pulses 0.5s 5s 2 ms, 10 +50V 5000 pulses 0.2s 5s 50s, 2 -100V -150V 1h 90ms 100ms 0.1s, 50 3b +75V +100V 1h 90ms 100ms 0.1s, 50 4 -6V -7V 1 pulse 100ms, 0.01 +65V +87V 1 pulse 400ms, 2 5b (2) 1. The above test levels must be considered referred to VCC = 13.5V except for pulse 5b. 2. Valid in case of external load dump clamp: 40V maximum referred to ground. Table 12. Electrical transient requirements (part 2/3) ISO 7637-2: 2004E Test pulse III VI 1 C C 2a C C 3a C C 3b C C 4 C C C C 5b (1) Test level results 1. Valid in case of external load dump clamp: 40V maximum referred to ground. Table 13. Class Electrical transient requirements (part 3/3) Contents C All functions of the device performed as designed after exposure to disturbance. E One or more functions of the device did not perform as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device. Doc ID 16471 Rev 1 17/35 Electrical specification 2.4 VND5E025MK-E Waveforms Figure 10. Normal operation Normal operation INPUT Nominal load Nominal load IOUT VSENSE VCS_DIS Figure 11. Overload or short to GND Overload or Short to GND INPUT ILimH > Power Limitation Thermal cycling ILimL > IOUT VSENSE VCS_DIS 18/35 Doc ID 16471 Rev 1 VND5E025MK-E Electrical specification Figure 12. Intermittent overload Intermittent Overload INPUT Overload ILimH > ILimL > Nominal load IOUT VSENSEH> VSENSE VCS_DIS Figure 13. TJ evolution in overload or short to GND TJ evolution in Overload or Short to GND INPUT Self-limitation of fast thermal transients TTSD THYST TR TJ_START TJ ILimH > Power Limitation < ILimL IOUT Doc ID 16471 Rev 1 19/35 Electrical specification 2.5 VND5E025MK-E Electrical characteristics curves Figure 14. Off-state output current Figure 15. High level input current Iloff (nA) Iih (A) 1000 5 900 4,5 Off State Vcc=13V Vin=Vout=0V 800 700 Vin = 2.1V VCC = 8 V 4 3,5 600 3 500 2,5 400 2 300 1,5 200 1 100 0,5 0 0 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 Tc (C) 50 75 100 125 150 175 100 125 150 175 150 175 Tc (C) Figure 16. Input clamp voltage Figure 17. Input high level Vicl (V) Vih (V) 7 4 6,8 3,5 lin=1mA 6,6 3 6,4 2,5 6,2 6 2 5,8 1,5 5,6 1 5,4 0,5 5,2 5 0 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 Tc (C) 75 Tc (C) Figure 18. Input low level Figure 19. Input hysteresis voltage Vil (V) Vihyst (V) 2 1 1,8 0,9 1,6 0,8 1,4 0,7 1,2 0,6 1 0,5 0,8 0,4 0,6 0,3 0,4 0,2 0,2 0,1 0 0 -50 -25 0 25 50 75 100 125 150 175 -50 Tc (C) 20/35 50 -25 0 25 50 75 Tc (C) Doc ID 16471 Rev 1 100 125 VND5E025MK-E Electrical specification Figure 20. On-state resistance vs Tcase Figure 21. On-state resistance vs VCC Ron (mOhm) Ron (mOhm) 70 60 60 Iout= 3A Vcc=13V 50 Tc=150C 50 40 40 Tc=125C 30 30 Tc=25C 20 20 Tc=-40C 10 10 0 0 -50 -25 0 25 50 75 100 125 150 175 0 5 10 15 Tc (C) 20 25 30 35 40 150 175 150 175 Vcc (V) Figure 22. Undervoltage shutdown Figure 23. ILIMH vs Tcase Vusd (V) Ilimh (A) 16 70 14 65 Vcc=13V 12 60 10 55 8 6 50 4 45 2 40 0 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 Figure 24. Turn-on voltage slope 75 100 125 Figure 25. Turn-off voltage slope (dVout/dt )On (V/ms) (dVout/dt )Off (V/ms) 700 600 600 50 Tc (C) Tc (C) Vcc=13V RI= 4.3 Ohm 500 Vcc=13V RI=4.3 Ohm 500 400 400 300 300 200 200 100 100 0 0 -50 -25 0 25 50 75 100 125 150 175 Tc (C) -50 -25 0 25 50 75 100 125 Tc (C) Doc ID 16471 Rev 1 21/35 Electrical specification VND5E025MK-E Figure 26. CS_DIS high level voltage Figure 27. CS_DIS low level voltage Vcsdh (V) Vcsdl (V) 4 3 3,5 2,5 3 2 2,5 2 1,5 1,5 1 1 0,5 0,5 0 0 -50 -25 0 25 50 75 100 125 150 175 -50 Tc (C) Vcsdcl(V) 10 9 Icsd = 1 mA 7 6 5 4 3 2 1 0 -50 -25 0 25 50 75 100 125 150 175 Tc (C) 22/35 0 25 50 75 Tc (C) Figure 28. CS_DIS clamp voltage 8 -25 Doc ID 16471 Rev 1 100 125 150 175 VND5E025MK-E 3 Application information Application information Figure 29. Application schematic(1) +5V VCC Rprot CS_DIS Dld CU Rprot INPUT OUTPUT Rprot CURRENT SENSE GND RSENSE VGND CEXT RGND DGND 1. Channel 2 has the same internal circuit as channel 1. 3.1 GND protection network against reverse battery This section provides two solutions for implementing a ground protection network against reverse battery. 3.1.1 Solution 1: resistor in the ground line (RGND only) This can be used with any type of load. The following is an indication on how to dimension the RGND resistor. 1. RGND 600mV / (IS(on)max) 2. RGND (-VCC) / (-IGND) where -IGND is the DC reverse ground pin current and can be found in the absolute maximum rating section of the device datasheet. Power dissipation in RGND (when VCC<0: during reverse battery situations) is: PD= (-VCC)2/RGND This resistor can be shared amongst several different HSDs. Please note that the value of this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the maximum On-state currents of the different devices. Please note that if the microprocessor ground is not shared by the device ground then the RGND produces a shift (IS(on)max * RGND) in the input thresholds and the status output values. This shift varies depending on how many devices are On in the case of several high side drivers sharing the same RGND. Doc ID 16471 Rev 1 23/35 Application information VND5E025MK-E If the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then ST suggests to utilize Solution 2 (see below). 3.1.2 Solution 2: diode (DGND) in the ground line A resistor (RGND=1k) should be inserted in parallel to DGND if the device drives an inductive load. This small signal diode can be safely shared amongst several different HSDs. Also in this case, the presence of the ground network produces a shift (600mV) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. This shift not varies if more than one HSD shares the same diode/resistor network. 3.2 Load dump protection Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the VCC max DC rating. The same applies if the device is subject to transients on the VCC line that are greater than the ones shown in the ISO 7637-2: 2004(E) table. 3.3 MCU I/Os protection If a ground protection network is used and negative transient are present on the VCC line, the control pins is pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent the MCU I/Os pins to latch-up. The value of these resistors is a compromise between the leakage current of MCU and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of MCU I/Os: -VCCpeak/Ilatchup Rprot (VOHC-VIH-VGND) / IIHmax Calculation example: For VCCpeak = - 100V and Ilatchup 20mA; VOHC 4.5V 5k Rprot 180k Recommended values: Rprot =10k, CEXT=10nF. 24/35 Doc ID 16471 Rev 1 VND5E025MK-E 3.4 Application information Current sense and diagnostic The current sense pin performs a double function (see Figure 30: Current sense and diagnostic): Current mirror of the load current in normal operation, delivering a current proportional to the load one according to a know ratio KX. The current ISENSE can be easily converted to a voltage VSENSE by means of an external resistor RSENSE. Linearity between IOUT and VSENSE is ensured up to 5V minimum (see parameter VSENSE in Table 9: Current sense (8V < VCC < 18V)). The current sense accuracy depends on the output current (refer to current sense electrical characteristics Table 9: Current sense (8V < VCC < 18V)). Diagnostic flag in fault conditions, delivering a fixed voltage VSENSEH up to a maximum current ISENSEH in case of the following fault conditions (refer to Truth table): - Power limitation activation - Overtemperature A logic level high on CS_DIS pin sets at the same time all the current sense pins of the device in a high impedance state, thus disabling the current monitoring and diagnostic detection. This feature allows multiplexing of the microcontroller analog inputs by sharing of sense resistance and ADC line among different devices. Figure 30. Current sense and diagnostic VBAT VCC Main MOSn 41V Overtemperature IOUT/KX ISENSEH Pwr_Lim CS_DIS OUTn VSENSEH CURRENT SENSEn GND Load RPROT To uC ADC RSENSE VSENSE Doc ID 16471 Rev 1 25/35 Application information 3.5 VND5E025MK-E Maximum demagnetization energy (VCC = 13.5V) Figure 31. Maximum turn-off current versus inductance (for each channel)(1) 100 A B C I (A) 10 1 0,1 1 L (mH) 10 100 A: Tjstart = 150C single pulse B: Tjstart = 100C repetitive pulse C: Tjstart = 125C repetitive pulse VIN, IL Demagnetization Demagnetization Demagnetization t 1. Values are generated with RL = 0 . In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves A and B. 26/35 Doc ID 16471 Rev 1 VND5E025MK-E Package and thermal data 4 Package and thermal data 4.1 PowerSSO-24 thermal data Figure 32. PowerSSO-24 PC board(1) 1. Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias, FR4 area = 77mm x 86mm, PCB thickness = 1.6mm, Cu thickness = 70m (front and back side), Copper areas: from minimum pad layout to 8cm2). Figure 33. Rthj-amb vs PCB copper area in open box free air condition (one channel ON) RTHj_amb(C/W) 55 50 45 40 35 30 0 2 4 6 8 10 PCB Cu heatsink area (cm^2) Doc ID 16471 Rev 1 27/35 Package and thermal data VND5E025MK-E Figure 34. PowerSSO-24 thermal impedance junction to ambient single pulse (one channel ON) ZTH (C/W) 1000 100 Footprint 2 cm2 8 cm2 10 1 0.1 0.0001 0.001 0.01 0.1 1 Time (s) 10 100 1000 Equation 1: pulse calculation formula Z TH = R TH +Z THtp (1 - ) where = tP/T Figure 35. Thermal fitting model of a double-channel HSD in PowerSSO-24(1) 1. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded protections (power limitation or thermal cycling during thermal shutdown) are not triggered. 28/35 Doc ID 16471 Rev 1 VND5E025MK-E Package and thermal data Table 14. Thermal parameters Area/Island (cm2) Footprint R1 (C/W) 0.28 R2 (C/W) 0.9 R3 (C/W) 6 R4 (C/W) 7.7 R5 (C/W) 2 8 9 9 8 R6 (C/W) 28 17 10 R7 (C/W) 0.28 R8 (C/W) 0.9 C1 (W.s/C) 0.001 C2 (W.s/C) 0.003 C3 (W.s/C) 0.025 C4 (W.s/C) 0.75 C5 (W.s/C) 1 4 9 C6 (W.s/C) 2.2 5 17 C7 (W.s/C) 0.001 C8 (W.s/C) 0.003 Doc ID 16471 Rev 1 29/35 Package and packing information VND5E025MK-E 5 Package and packing information 5.1 ECOPACK(R) packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 5.2 Package mechanical data Figure 36. PowerSSO-24 package dimensions 30/35 Doc ID 16471 Rev 1 VND5E025MK-E Package and packing information Table 15. PowerSSO-24 mechanical data Millimeters Symbol Min. Typ. Max. A 2.15 2.47 A2 2.15 2.40 a1 0 0.075 b 0.33 0.51 c 0.23 0.32 D 10.10 10.50 E 7.4 7.6 e 0.8 e3 8.8 G 0.1 G1 0.06 H 10.1 10.5 h 0.4 k L 5 0.55 N 0.85 10 X 4.1 4.7 Y 6.5 7.1 Doc ID 16471 Rev 1 31/35 Package and packing information 5.3 VND5E025MK-E Packing information Figure 37. PowerSSO-24 tube shipment (no suffix) C Base Qty Bulk Qty Tube length (0.5) A B C (0.1) B 49 1225 532 3.5 13.8 0.6 All dimensions are in mm. A Figure 38. PowerSSO-24 tape and reel shipment (suffix "TR") REEL DIMENSIONS Base Qty Bulk Qty A (max) B (min) C (0.2) F G (+2 / -0) N (min) T (max) 1000 1000 330 1.5 13 20.2 24.4 100 30.4 TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 (0.1) P D (0.05) D1 (min) F (0.1) K (max) P1 (0.1) 24 4 12 1.55 1.5 11.5 2.85 2 End All dimensions are in mm. Start Top cover tape No components Components 500mm min 500mm min Empty components pockets sealed with cover tape. User direction of feed 32/35 Doc ID 16471 Rev 1 No components VND5E025MK-E 6 Order codes Order codes Table 16. Device summary Order codes Package PowerSSO-24 Tube Tape and reel VND5E025MK-E VND5E025MKTR-E Doc ID 16471 Rev 1 33/35 Revision history 7 VND5E025MK-E Revision history Table 17. 34/35 Document revision history Date Revision 07-Oct-2009 1 Changes Initial release Doc ID 16471 Rev 1 VND5E025MK-E Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. 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