PROFET® Data Sheet BTS550P
Infineon Technologies AG 1 of 15 2003-Oct-01
Smart Highside High Current Power Switch
Reversave
Reverse battery protection by self turn on of
power MOSFET
Features
Overload protection
Current limitation
Short circuit protection
Overtemperature protection
Overvoltage protection (including load dump)
Clamp of negative voltage at output
Fast deenergizing of inductive loads 1)
Low ohmic inverse current operation
Diagnostic feedback with load current sense
Open load detection via current sense
Loss of Vbb protection2)
Electrostatic discharge (ESD) protection
Application
Power switch with current sense diagnostic
feedback for 12 V and 24 V DC grounded loads
Most suitable for loads with high inrush current
like lamps and motors; all types of resistive and
inductive loads
Replaces electromechanical relays, fuses and discrete circuits
General Description
N channel vertical power FET with charge pump, current controlled input and diagnostic feedback with load
current sense, integrated in Smart SIPMOS chip on chip technology. Providing embedded protective functions.
IN
Charge pump
Level shifter
Rectifier
Limit for
unclamped
ind. loads
Gate
protection
Current
limit
2
Overvoltage
protection
+ Vbb
PROFET
OUT
3 & Tab
1, 5
Load GND
Load
Output
Voltage
detection
RIS
IS
4
IIS
IL
VIS
IIN
Logic GND
Voltage
sensor
Voltage
source
Current
Sense
Logic
ESD
Temperature
sensor
Rbb
VIN
1) With additional external diode.
2) Additional external diode required for energized inductive loads (see page 9).
Product Summary
Overvoltage protection Vbb(AZ) 62 V
Output clamp VON(CL) 44 V
Operating voltage Vbb(on) 5.0 ... 34 V
On-state resistance RON 3.6 m
Load current (ISO) IL(ISO) 115 A
Short circuit current limitation IL(SC) 220 A
Current sense ratio I
L : IIS 21000
TO-218AB/5
5
1
Straight leads
Data Sheet BTS550P
Infineon Technologies AG 2 2003-Oct-01
Pin Symbol Function
1 OUT O
Output to the load. The pins 1 and 5 must be shorted with each other
especially in high current applications!3)
2 IN I Input, activates the power switch in case of short to ground
3 Vbb + Positive power supply voltage, the tab is electrically connected to this pin.
In high current applications the tab should be used for the Vbb connection
instead of this pin4).
4 IS S
Diagnostic feedback providing a sense current proportional to the load
current; zero current on failure (see Truth Table on page 7)
5 OUT O
Output to the load. The pins 1 and 5 must be shorted with each other
especially in high current applications!3)
Maximum Ratings at Tj = 25 °C unless otherwise specified
Parameter Symbol Values Unit
Supply voltage (overvoltage protection see page 4) Vbb 40 V
Supply voltage for short circuit protection,
Tj,start =-40 ...+150°C: (EAS limitation see diagram on page 9) Vbb 34 V
Load current (short circuit current, see page 5) IL self-limited A
Load dump protection VLoadDump = UA + Vs, UA = 13.5 V
RI5) = 2 , RL = 0.54 , td = 200 ms,
IN, IS = open or grounded
VLoad dum p6) 80 V
Operating temperature range
Storage temperature range Tj
Tstg -40 ...+150
-55 ...+150 °C
Power dissipation (DC), TC 25 °C Ptot 360 W
Inductive load switch-off energy dissipation, single pulse
Vbb = 12V, Tj,start = 150°C, TC = 150°C const.,
IL = 20 A, ZL = 15 mH, 0 , see diagrams on page 10
EAS 3J
Electrostatic discharge capability (ESD)
Human Body Model acc. MIL-STD883D, method 3015.7 and ESD
assn. std. S5.1-1993, C = 100 pF, R = 1.5 k
VESD 4kV
Current through input pin (DC)
Current through current sense status pin (DC)
see internal circuit diagrams on page 8
IIN
IIS +15 , -250
+15 , -250 mA
3) Not shorting all outputs will considerably increase the on-state resistance, reduce the peak current capability
and decrease the current sense accuracy
4) Otherwise add up to 0.5 m (depending on used length of the pin) to the RON if the pin is used instead of the
tab.
5) RI = internal resistance of the load dump test pulse generator.
6) VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839.
Data Sheet BTS550P
Infineon Technologies AG 3 2003-Oct-01
Thermal Characteristics
Parameter and Conditions Symbol Values Unit
min typ max
Thermal re sistance chip - case: RthJC7) -- -- 0.35 K/W
Junction - ambient (free air): RthJA -- 30 --
Electrical Characteristics
Parameter and Conditions Symbol Values Unit
at Tj = -40 ... +150 °C, Vbb = 12 V unless otherwise specified min typ max
Load Switching Capabilities and Characteristics
On-state resistance (Tab to pins 1,5, see measurement
circuit page 8) IL = 20 A, Tj = 25 °C:
VIN = 0, IL = 20 A, Tj = 150 °C:
RON
--
2.8
5.0 3.6
6.5 m
IL = 120 A, Tj = 150 °C: -- 6.5
Vbb = 6V8), IL = 20 A, Tj = 150 °C: RON(Static) -- 7 10
Nominal load current9) (Tab to pins 1,5)
ISO 10483-1/6.7: VON = 0.5 V, Tc = 85 °C 10) IL(ISO) 90 115 -- A
Maximum load current in resistive range
(Tab to pins 1,5) VON = 1.8 V, Tc = 25 °C:
see diagram on page 12 VON = 1.8 V, Tc = 150 °C:
IL(Max)
390
215
--
--
--
-- A
Turn-on time11) IIN to 90% VOUT:
Turn-off time IIN to 10% VOUT:
RL = 1 , Tj =-40...+150°C
ton
toff 120
40 250
90 600
150 µs
Slew rate on 11) (10 to 30% VOUT )
RL = 1 ,Tj =25°C dV/dton 0.2 0.5 0.8 V/µs
Slew rate off 11) (70 to 40% VOUT )
RL = 1 ,Tj =25°C -dV/dtoff 0.2 0.6 1 V/µs
7) Thermal resistance RthCH case to heatsink (about 0.25 K/W with silicone paste) not included!
8) Decrease of Vbb below 10 V causes a slowly a dynamic increase of RON to a higher value of RON(Static). As
long as VbIN > VbIN(u) max, RON increase is less than 10 % per second for TJ < 85 °C.
9) not subject to production test, specified by design
10) TJ is about 105°C under these conditions.
11) See timing diagram on page 13.
Data Sheet BTS550P
Parameter and Conditions Symbol Values Unit
at Tj = -40 ... +150 °C, Vbb = 12 V unless otherwise specified min typ max
Infineon Technologies AG 4 2003-Oct-01
Inverse Load Current Operation
On-state resistance (Pins 1,5 to pin 3)
VbIN = 12 V, IL = - 20 A Tj = 25 °C:
see diagram on page 10 Tj = 150 °C:
RON(inv)
--
2.8
5.0 3.6
6.5 m
Nominal inverse load current (Pins 1,5 to Tab)
VON = -0.5 V, Tc = 85 °C10 IL(inv) 90 115 -- A
Drain-source diode voltage (Vout > Vbb)
IL = - 20 A, IIN = 0, Tj = +150°C -VON -- 0.6 0.7 V
Operating Parameters
Operating voltage (VIN = 0) 8, 12) Vbb(on) 5.0 -- 34 V
Undervoltage shutdown 13) VbIN(u) 1.5 3.0 4.5 V
Undervoltage start of charge pump
see diagram page 14
VbIN(ucp)
3.0
4.5 6.0 V
Overvoltage protection14) Tj =-40°C:
Ibb = 15 mA Tj = 25...+150°C: VbIN(Z) 60
62 --
64
--
-- V
Standby current Tj =-40...+25°C:
IIN = 0 T
j = 150°C: Ibb(off) --
-- 15
25 25
50 µA
12) If the device is turned on before a Vbb-decrease, the operating voltage range is extended down to VbIN(u).
For the voltage range 0..34 V the device is fully protected against overtemperature and short circuit.
13) VbIN = Vbb - VIN see diagram on page 8. When VbIN increases from less than VbIN(u) up to VbIN(ucp) = 5 V
(typ.) the charge pump is not active and VOUT Vbb - 3 V.
14) See also VON(CL) in circuit diagram on page 9.
Data Sheet BTS550P
Parameter and Conditions Symbol Values Unit
at Tj = -40 ... +150 °C, Vbb = 12 V unless otherwise specified min typ max
Infineon Technologies AG 5 2003-Oct-01
Protection Functions15)
Short circuit current limit (Tab to pins 1,5)16
VON = 12 V, time until shutdown max. 350 µs Tc =-40°C:
Tc =25°C:
Tc =+150°C:
IL(SCp) 100
110
120
190
220
210
350
330
310
A
Short circuit shutdown delay after input current
positive slope, VON > VON(SC)
min. value valid only if input "off-signal" time exceeds 30 µs
td(SC)
80
-- 350 µs
Output clamp 17) IL= 40 mA:
(inductive load switch off) -VOUT(CL) 14
17
20 V
Output clamp (inductive load switch off)
at VOUT = Vbb - VON(CL) (e.g. overvoltage)
IL= 40 mA
VON(CL)
40
44 47 V
Short circuit shutdown detection voltage
(pin 3 to pins 1,5)
VON(SC)
--
6 -- V
Thermal overload trip temperature Tjt 150 -- -- °C
Thermal hysteresis
Tjt -- 10 -- K
Reverse Battery
Reverse battery voltage 18) -Vbb -- -- 32 V
On-state resistance (Pins 1,5 to pin 3) Tj = 25 °C:
Vbb = -12V, VIN = 0, IL = - 20 A, RIS = 1 k Tj = 150 °C: RON(rev) -- 3.4
-- 4.3
7.5 m
Integrated resistor in Vbb line Tj=25°C:
Tj=150°C:
Rbb 90
105
110
125
135
150
15) Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not
designed for continuous repetitive operation.
16 ) Short circuit is a failure mode. The device is not designed to operate continuously into a short circuit by
permanent resetting the short circuit latch function. The lifetime will be reduced under such conditions.
17) This output clamp can be "switched off" by using an additional diode at the IS-Pin (see page 8). If the diode
is used, VOUT is clamped to Vbb- VON(CL) at inductive load switch off.
18) The reverse load current through the intrinsic drain-source diode has to be limited by the connected load (as
it is done with all polarity symmetric loads). Note that under off-conditions (IIN = IIS = 0) the power transistor
is not activated. This results in raised power dissipation due to the higher voltage drop across the intrinsic
drain-source diode. The temperature protection is not active during reverse current operation! Increasing
reverse battery voltage capability is simply possible as described on page 9.
Data Sheet BTS550P
Parameter and Conditions Symbol Values Unit
at Tj = -40 ... +150 °C, Vbb = 12 V unless otherwise specified min typ max
Infineon Technologies AG 6 2003-Oct-01
Diagnostic Characteristics
Current sense ratio, IL = 120 A,Tj =-40°C:
static on-condition, Tj =25°C:
kILIS = IL : IIS, Tj =150°C:
VON < 1.5 V19), IL = 20 A,Tj =-40°C:
VIS <VOUT - 5 v, Tj =25°C:
VbIN > 4.0 V Tj =150°C:
see diagram on page 11 IL = 12 A,Tj =-40°C:
Tj =25°C:
Tj =150°C:
IL = 6 A,Tj =-40°C:
Tj =25°C:
Tj =150°C:
kILIS 19 000
19 000
18 000
18 500
18 500
18 000
16 000
17 000
17 500
12 000
14 000
16 000
20 600
20 500
19 000
22 300
21 400
19 500
23 500
22 000
19 900
28 000
24 000
20 500
23 000
22 500
21 500
26 000
25 000
23 000
30 000
26 500
24 500
46 000
34 000
30 000
IIS=0 by IIN =0 (e.g. during deenergizing of inductive loads):
Sense current saturation IIS,lim 6.5 -- -- mA
Current sense leakage current
IIN = 0:
V
IN = 0, IL 0:
IIS(LL)
IIS(LH)
--
--
--
2
0.5
-- µA
Current sense settling time20) ts(IS) -- -- 500 µs
Overvoltage protection Tj =-40°C:
Ibb = 15 mA Tj = 25...+150°C: VbIS(Z) 60
62 --
64
--
-- V
Input
Input and operating current (see diagram page 12)
IN grounded (VIN = 0) IIN(on) -- 0.8 1.5 mA
Input current for turn-off21) IIN(off) -- -- 80 µA
19) If VON is higher, the sense current is no longer proportional to the load current due to sense current
saturation, see IIS,lim .
20) not subject to production test, specified by design
21) We recommend the resistance between IN and GND to be less than 0.5 k for turn-on and more than
500k for turn-off. Consider that when the device is switched off (IIN = 0) the voltage between IN and GND
reaches almost Vbb.
Data Sheet BTS550P
Infineon Technologies AG 7 2003-Oct-01
Truth Table
Input
current Output Current
Sense Remark
level level IIS
Normal
operation L
H L
H 0
nominal
=IL / kilis, up to IIS=IIS,lim
Very high
load current H H IIS, lim up to VON=VON(Fold back)
IIS no longer proportional to IL
Current-
limitation H H 0 VON > VON(Fold back)
if VON>VON(SC), shutdown will occure
Short circuit to
GND L
H L
L 0
0
Over-
temperature L
H L
L 0
0
Short circuit to
Vbb L
H H
H 0
<nominal 22)
Open load L
H Z23)
H 0
0
Negative output
voltage clamp L L 0
Inverse load
current L
H H
H 0
0
L = "Low" Level
H = "High" Level
Options Overview
Type BTS
6510P 550P
650P 555
Overtemperatur e protection w ith hysteresi s X X X
Tj >150 °C, latch function24)
Tj >150 °C, with auto-restart on cooling
X
X X
Short circuit to GND protection
with overtemperature shutdown
switches off when VON>6 V typ.
(when first turned on after approx. 180 µs)
X
X
X
Overvoltage shutdown - - -
Output negative voltage transient limit
to Vbb - VON(CL) X X X
to VOUT = -19 V typ X25) X
25) X25)
Overtemperature reset by cooling: Tj < Tjt (see diagram on page 14)
Short circuit to GND: Shutdown remains latched until next reset via input (see diagram on page 13)
22) Low ohmic short to Vbb may reduce the output current IL and can thus be detected via the sense current IIS.
23) Power Transistor "OFF", potential defined by external impedance.
24) Latch except when Vbb -VOUT < VON(SC) after shutdown. In most cases VOUT = 0 V after shutdown (VOUT
0 V only if forced externally). So the device remains latched unless Vbb < VON(SC) (see page 5). No latch
between turn on and td(SC).
25) Can be "switched off" by using a diode DS (see page 8) or leaving open the current sense output.
Data Sheet BTS550P
Infineon Technologies AG 8 2003-Oct-01
Terms
PROFET
V
IN
IS
OUT
bb
VIN IIS
IIN
Vbb
Ibb
IL
VOUT
VON
2
4
3
1,5
RIS
VIS
VbIN
RIN
DS
VbIS
Two or more devices can easily be connected in
parallel to increase load current capability.
RON measurement layout
Sense
V force contacts Out Force
bb contacts
5.5 mm
contacts
(both out
pins parallel)
Input circuit (ESD protection)
IN
ZD
IN
I
Vbb
Rbb
VZ,IN
VbIN
VIN
When the device is switched off (IIN = 0) the
voltage between IN and GND reaches almost Vbb.
Use a mechanical switch, a bipolar or MOS
transistor with appropriate breakdown voltage as
driver. VZ,IN = 64 V (typ).
Current sense status output
IS
IS
R
IS
I
ZD
IS
V
bb
V
bb
R
Z,IS
V
VZ,IS = 64 V (typ.), RIS = 1 k nominal (or 1 k /n, if
n devices are connected in parallel). IS = IL/kilis can
be driven only by the internal circuit as long as Vout -
VIS > 5 V. If you want to measure load currents up
to IL(M), RIS should be less than Vbb - 5 V
IL(M) / Kilis.
Note: For large values of RIS the voltage VIS can
reach almost Vbb. See also overvoltage protection.
If you don't use the current sense output in your
application, you can leave it open.
Short circuit detection
Fault Condition: VON > VON(SC) (6 V typ.) and t> td(SC)
(80 ...350 µs).
Short circuit
detection
Logic
unit
+ Vbb
OUT
VON
Inductive and overvoltage output clamp
+ Vbb
OUT
PROFET
VZ1
VON
DS
IS VOUT
VZG
VON is clamped to VON(Cl) = 42 V typ. At inductive
load switch-off without DS, VOUT is clamped to
Data Sheet BTS550P
Infineon Technologies AG 9 2003-Oct-01
VOUT(CL) = -19 V typ. via VZG. With DS, VOUT is
clamped to Vbb - VON(CL) via VZ1. Using DS gives
faster deenergizing of the inductive load, but higher
peak power dissipation in the PROFET. In case of a
floating ground with a potential higher than 19V
referring to the OUT – potential the device will
switch on, if diode DS is not used.
Overvoltage protection of logic part
+ Vbb
VOUT
IN
bb
R
Signal GND
Logic
PROFET
VZ,IS
RIS
IN
R
IS
VZ,IN
RVVZ,VIS
Rbb = 120 typ., VZ,IN = VZ,IS = 64 V typ., RIS = 1 k
nominal. Note that when overvoltage exceeds 69 V
typ. a voltage above 5V can occur between IS and
GND, if RV, VZ,VIS are not used.
Reverse battery protection
Logic
IS
IN
IS
RV
R
OUT
L
R
Power GND
Signal GND
Vbb
-
Power
Transistor
IN
R
bb
R
D
S
D
RV 1 kΩ, RIS = 1 k nominal. Add RIN for reverse
battery protection in applications with Vbb above
16 V18); recommended value: 1
RIN + 1
RIS + 1
RV =
0.1A
|Vbb| - 12V if DS is not used (or 1
RIN = 0.1A
|Vbb| - 12V if
DS is used).
To minimize power dissipation at reverse battery
operation, the summarized current into the IN and
IS pin should be about 120mA. The current can be
provided by using a small signal diode D in parallel
to the input switch, by using a MOSFET input switch
or by proper adjusting the current through RIS and
RV.
Vbb disconnect with energized
inductive load
Provide a current path with load current capability
by using a diode, a Z-diode, or a varistor. (VZL < 72
V or VZb < 30 V if RIN=0). For higher clamp voltages
currents at IN and IS have to be limited to 250 mA.
Version a:
PROFET
V
IN OUT
IS
bb
Vbb
VZL
Version b:
PROFET
V
IN OUT
IS
bb
Vbb
VZb
Note that there is no reverse battery protection
when using a diode without additional Z-diode VZL,
VZb.
Version c: Sometimes a neccessary voltage clamp
is given by non inductive loads RL connected to the
same switch and eliminates the need of clamping
circuit:
PROFET
V
IN OUT
IS
bb
Vbb RL
Data Sheet BTS550P
Infineon Technologies AG 10 2003-Oct-01
Inverse load current operation
PROFET
V
IN OUT
IS
bb
Vbb
VOUT
- IL
RIS
VIS
VIN
+
-+
-
IIS
The device is specified for inverse load current
operation (VOUT > Vbb > 0V). The current sense
feature is not available during this kind of operation
(IIS = 0). With IIN = 0 (e.g. input open) only the intrin-
sic drain source diode is conducting resulting in
considerably increased power dissipation. If the
device is switched on (VIN = 0), this power
dissipation is decreased to the much lower value
RON(INV) * I2 (specifications see page 4).
Note: Temperature protection during inverse load
current operation is not possible!
Inductive load switch-off energy
dissipation
PROFET
V
IN OUT
IS
bb
E
E
E
EAS
bb
L
R
ELoad
L
R
L
{
Z
L
R
IS
I
IN
V
bb
i (t)
L
Energy stored in load inductance:
EL = 1/2·L·I2
L
While demagnetizing load inductance, the energy
dissipated in PROFET is
EAS= Ebb + EL - ER= VON(CL)·iL(t) dt,
with an approximate solution for RL > 0 :
EAS= IL· L
2·RL(Vbb + |VOUT(CL)|) ln (1+ IL·RL
|VOUT(CL)| )
Maximum allowable load inductance for
a single switch off
L = f (IL ); Tj,start = 150°C, Vbb = 12 V, RL = 0
L [µH]
I
L [A]
Externally adjustable current limit
If the device is conducting, the sense current can be
used to reduce the short circuit current and allow
higher lead inductance (see diagram above). The
device will be turned off, if the threshold voltage of
T2 is reached by IS*RIS . After a delay time defined
by RV*CV T1 will be reset. The device is turned on
again, the short circuit current is defined by IL(SC)
and the device is shut down after td(SC) with latch
function.
PROFET
IS
IN
IS
R
V
R
Powe
r
GND
Signal
GND
Vbb
OUT
V
C
load
R
T1 T2
IN
Signal
Vbb
1
10
100
1000
10000
100000
1 10 100 1000
Data Sheet BTS550P
Infineon Technologies AG 11 2003-Oct-01
Characteristics
Current sense versus load current:
IIS = f(IL)
IIS [mA]
I
L [A]
Current sense ratio:
KILIS = f(IL), TJ = -40 °C
Kilis
I
L [A]
Current sense ratio:
KILIS = f(IL), TJ = 25 °C
kilis
I
L [A]
Current sense ratio:
KILIS = f(IL), TJ = 150 °C
Kilis
I
L [A]
0
1
2
3
4
5
6
7
0 20 40 60 80 100 120
max
min
12000
14000
16000
18000
20000
22000
24000
26000
28000
30000
32000
34000
36000
38000
40000
42000
44000
46000
0 20 40 60 80 100 120
min
typ
max
16000
18000
20000
22000
24000
26000
28000
30000
32000
34000
0 20 40 60 80 100 120
min
typ
max
16000
18000
20000
22000
24000
26000
28000
30000
0 20 40 60 80 100 120
typ
min
max
Data Sheet BTS550P
Infineon Technologies AG 12 2003-Oct-01
Typ. current limitation characteristic
IL = f (VON, Tj )
IL [A]
V
ON [V]
In case of VON > VON(SC) (typ. 6 V) the device will be
switched off by internal short circuit detection.
Typ. on-state resistance
RON = f (Vbb, Tj ); IL = 20 A; VIN = 0
RON [mOhm]
Vbb [V]
Typ. input current
IIN = f (VbIN), VbIN = Vbb - VIN
IIN [mA]
VbIN [V]
0
1
2
3
4
5
6
7
8
9
10
0 5 10 15 20
static
dynamic
T
j
= 150°C
85°C
25°C
-40°C
40
0
100
200
300
400
500
600
700
800
0 5 10 15 20
VON > VON(SC)
only for t < td(SC)
(otherwise imm edi ate shutdown)
TJ = -40°C
TJ = 25°C
TJ= 150°C
VON(FB)
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0 20406080
Data Sheet BTS550P
Infineon Technologies AG 13 2003-Oct-01
Timing diagrams
Figure 1a: Switching a resistive load,
change of load current in on-condition:
IIN
t
VOUT
IL
IIS tson(IS)
tt
slc(IS)
Load 1 Load 2
soff(IS)
t
t
t
on
off
slc(IS)
90%
dV/dton
dV/dtoff
10%
The sense signal is not valid during a settling time
after turn-on/off and after change of load current.
Figure 2a: Switching motors and lamps:
IIN
t
VOUT
IIL
IIS
Sense current saturation can occur at very high
inrush curren ts (see I IS,lim on page 6).
Figure 2b: Switching an inductive load:
IIN
t
VOUT
IL
IIS
Figure 3a: Short circuit:
shut down by short circuit detection, reset by IIN = 0.
IIN
IL
IL(SCp)
IIS
t
td(SC)
VOUT=0
VOUT>>0
Shut down remains latched until next reset via input.
Data Sheet BTS550P
Infineon Technologies AG 14 2003-Oct-01
Figure 4a: Overtemperature
Reset if Tj<Tjt
IIN
t
IIS
VOUT
Tj
Auto Restart
Figure 6a: Undervoltage restart of charge pump,
overvoltage clamp
0
2
4
6
04
VOUT
VbIN(ucp)
VIN = 0
IIN = 0
VON(CL)
VbIN(u)
VbIN(u)
dynamic, short
Undervoltage
not below
V ON(CL)
Vbb
Data Sheet BTS550P
Infineon Technologies AG 15 2003-Oct-01
Package and Ordering Code
All dimensions in mm
TO-218AB/5 Option E3146 Ordering code
E3146 Q67060-S6952A3
Published by
Infineon Technologies AG,
St.-Martin-Strasse 53,
D-81669 München
© Infineon Technologies AG 2001
All Rights Reserved.
Attention please!
The information herein is given to describe certain
components and shall not be considered as a guarantee of
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not
limited to warranties of non-infringement, regarding circuits,
descriptions and charts stated herein.
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Information
For further information on technology, delivery terms and
conditions and prices please contact your nearest Infineon
Technologies Office in Germany or our Infineon
Technologies Representatives worldwide (see address list).
Warnings
Due to technical requirements components may contain
dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies
Office.
Infineon Technologies Components may only be used in life-
support devices or systems with the express written
approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the
failure of that life-support device or system, or to affect the
safety or effectiveness of that device or system. Life support
devices or systems are intended to be im planted in the
human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to
assume that the health of the user or other persons ma y be
endangered.