CHIP
CAPACITORS
Document Number: 61033 For technical questions, contact: efi@vishay.com www.vishay.com
Revision: 25-Feb-10 101
NC Series
Vishay Electro-Films
Thin Film Single Value
Chip and Wire Capacitors
The NC series of thin film capacitors has the advantage of
increased performance and smaller size when compared
with its thick film counterparts. These chips are available in
sizes down to 20 mil square and in capacitances up to
1000 pF.
Parts require epoxy or eutectic die attach to substrate and
one wire bond.
These chips are manufactured using Vishay Electro-Films
(EFI) sophisticated Thin Film equipment and manufacturing
technology. The NC’s are 100 % electrically tested and
visually inspected to MIL-STD-883.
FEATURES
Wire bondable
Small size: 0.020 inches square to 0.060 inches square
Substrate: Silicon with gold backing
Dielectric: Silicon dioxide/silicon nitride
Capacitance range: 0.5 pF to 1000 pF
APPLICATIONS
The NC series of capacitor chips are designed for assembly in hybrid circuits using conventional wire-bonding techniques. They
provide excellent stability and performance, and their small size gives the hybrid designer greater layout flexibility. They are
available as MNOS or MOS capacitors. The MOS version is to be preferred when low dielectric absorption is required.
ELECTRICAL SCHEMATIC
NCAA/NCBB/NCCC
ELECTRICAL SCHEMATIC
NCDD/NCEE
Product may not
be to scale
TOP BONDING PADS
BACK OF CHIP
TOP BONDING PADS
BACK OF CHIP
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Peak Voltage at + 25 °C 1.5 x working voltage
Dissipation Factor, 1 kHz, 1 VRMS, + 25 °C 0.05 % MNOS
0.1 % MOS
Q at 1 mHz, 50 mVRMS, + 25 °C 1000 min.
TCC, - 55 °C to + 150 °C + 45 ± 25 ppm/°C MNOS
+ 15 ± 25 ppm/°C MOS
Insulation Resistance at Working Voltage, + 25 °C 109 min.
Operating Temperature Range - 55 °C to + 125 °C
Thermal Shock ± 0.25 % + 0.25 pF max. ΔC/C
Moisture Resistance, MIL-STD-202, Method 106 ± 1.0 % + 0.25 pF max. ΔC/C
Short Time Overload, + 25 °C, 5 s, 1.5 x Working Voltage ± 0.25 % + 0.25 pF max.
High Temperature Exposure, 100 h at 150 °C Ambient ± 0.25 % + 0.25 pF max. ΔC/C
Life, MIL-STD-202, Method 108
Condition D, + 125 °C Ambient, 100 h at Working Voltage ± 0.25 % + 0.25 pF max. ΔC/C
CHIP
CAPACITORS
www.vishay.com For technical questions, contact: efi@vishay.com Document Number: 61033
102 Revision: 25-Feb-10
NC Series
Vishay Electro-Films Thin Film Single Value
Chip and Wire Capacitors
DC WORKING VOLTAGES VALUES AND TOLERANCES
NCAA 0.020 inches square
CAPACITANCE
VALUE pF
DC WORKING
VOLTAGE
MOS
100
NA
NA
± 5 %
± 10 %
± 20 %
± 25 %
4.3
3.9
3.6
3.3
3.0
2.7
2.4
2.2
2.00
1.80
1.60
1.50
1.30
1.20
1.10
1.0
0.91
0.82
0.75
0.68
0.62
0.56
0.50
NA = NOT AVAILABLE
CAPACITANCE
VALUE pF
DC WORKING
VOLTAGE
NA
± 2.5 %
± 10 %
± 20 %
± 5 %
51
47
43
39
36
33
30
27
24
22
20
18
16
15
13
12
11
10
8.2
6.8
5.6
4.7
MNOS MOS
40
45
50
55
60
65
75
80
90
95
105
120
135
140
150
160
180
200
200
200
200
200
-
-
-
-
-
-
35
39
44
48
54
60
68
73
85
93
102
114
160
193
200
200
** ± 0.5 pF
**
**
*
CAPACITANCE
VALUE pF DC WORKING
VOLTAGE
± 2.5 %
± 10 %
± 20 %
± 5 %
100
91
82
75
68
62
56
51
47
43
39
36
33
MNOS MOS
55
60
65
65
70
90
95
105
120
130
135
140
150
-
-
-
-
38
42
47
52
56
62
68
74
81
NA
CAPACITANCE
VALUE pF
DC WORKING
VOLTAGE
± 2.5 %
± 10 %
± 20 %
± 5 %
220
200
180
160
150
130
120
110
100
91
82
75
68
62
56
MNOS MOS
50
55
60
65
70
80
90
100
110
120
135
140
165
180
190
-
-
-
-
-
40
45
49
54
60
66
72
81
88
97
NA
CAPACITANCE
VALUE pF DC WORKING
VOLTAGE
± 2.5 %
± 10 %
± 20 %
± 5 %
1000
910
820
750
680
620
560
510
470
430
390
360
330
300
270
240
220
200
180
160
150
MNOS MOS
20
25
30
30
35
40
40
50
50
60
65
75
80
90
100
100
110
120
135
140
140
-
-
-
-
-
-
-
-
20
25
28
30
34
38
40
47
52
57
63
70
76
NA
NCE
NCD
NCBB 0.030 inches square NCCC 0.040 inches square NCDD 0.055 inches square
NCEE 0.060 inches square
Document Number: 61033 For technical questions, contact: efi@vishay.com www.vishay.com
Revision: 25-Feb-10 103
NC Series
Thin Film Single Value
Chip and Wire Capacitors Vishay Electro-Films
CHIP
CAPACITORS
DIMENSIONS
Options: Gold bond pads 15 kÅ
Lower profile version is available, consult applications engineer
0.5 pF to 1.3 pF 1.4 pF to 3.9 pF 4 pF to 9.1 pF 10 pF to 51 pF
NCAA
0.020 ± 0.003 inches square
33 pF to 100 pF 56 pF to 220 pF 150 pF to 510 pF 360 pF to 1000 pF
NCBB
0.030 ± 0.003 inches square
NCCC
0.040 ± 0.003 inches square
NCDD
0.055 ± 0.003 inches square
NCEE
0.060 ± 0.003 inches square
MECHANICAL SPECIFICATIONS
Chip Size Per diagrams
Chip Thickness 0.010" ± 0.002" (0.25 mm ± 0.05 mm)
Chip Substrate Material Semiconductor silicon
Dielectric Silicon dioxide/silicon nitride
Bond Pad 0.005" x 0.005" min., 10 kÅ aluminum
Backing 3 kÅ min. gold
GLOBAL PART NUMBER INFORMATION
SAP Part Number: NCAA4700CKMAHWS NCEE10000KNGKWS
SAP Description: NCAA 4.7 pF 10 % MOS Al H WS NCEE 1000 pF 10 % MNOS Au K WS
MODEL CAPACITANCE
(pF)
CAPACITANCE
MULTIPLIER
CODE
TOLERANCE
CODE DIELECTRIC TERMINATION VISUAL
CLASS PACKAGIN G
CODE
NCAA
NCBB
NCCC
NCDD
NCEE
First 4 digits
are significant
figures of
capacitance
D = 0.0001
C = 0.001
B = 0.01
A = 0.1
0 = 1
D = ± 0.5 pF
H = 2.5 %
J = 5.0 %
K = 10 %
M = 20 %
M = MOS
N = MNOS
G = Au
A = Al
H = Class H
K = Class K
WS =
Waffle pack
100 min.,
1 mult
700C MAHKA WSANC 4
Document Number: 91000 www.vishay.com
Revision: 18-Jul-08 1
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