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STPS30L30CT/CG/CG-1
March 2000 - Ed: 4B
LOW DROP POWER SCHOTTKY RECTIFIER
®
Dual center tap Schottky rectifiers suited for
Switch Mode Power Supply and high frequency
DC to DC converters.
Packaged in TO-220AB and D2PAK these devices
areintendedfor useinlowvoltage,highfrequency
inverters, free-wheeling and polarity protection
applications.
DESCRIPTION
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VERY SMALL CONDUCTION LOSSES
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NEGLIGIBLE SWITCHING LOSSES
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EXTREMELY FAST SWITCHING
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LOW FORWARD VOLTAGE DROP
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LOW THERMAL RESISTANCE
FEATURES AND BENEFITS
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 30 V
IF(RMS) RMS forward current 30 A
IF(AV) Average forward current Tc = 140°C
δ= 0.5 Per diode
Per device 15
30 A
IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 220 A
IRRM Peak repetitive reverse current tp = 2 µs F = 1kHz square 1A
I
RSM Non repetitive peak reverse current tp = 100µs square 3A
T
stg Storage temperature range - 65 to + 150 °C
Tj Maximum operating junction temperature * 150 °C
dV/dt Critical rate of rise reverse voltage 10000 V/µs
ABSOLUTE RATINGS (limiting values, per diode)
A1
K
A2
IF(AV) 2x15A
V
RRM 30 V
Tj (max) 150 °C
VF(max) 0.37 V
MAIN PRODUCT CHARACTERISTICS
D2PAK
STPS30L30CG
A1 KA2
TO-220AB
STPS30L30CT
*:
dPtot
dTj Rth j a
<−
1
()
thermal runaway condition for a diode on its own heatsink
A2
K
A1
A1
A2
K
I2PAK
STPS30L30CG-1
STPS30L30CT/CG/CG-1
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Symbol Parameter Tests Conditions Min. Typ. Max. Unit
IR*Reverse leakage cur-
rent Tj = 25°C VR=V
RRM 1.5 mA
Tj = 125°C 170 350 mA
VF*Forward voltage drop Tj = 25°C IF=15A 0.46 V
Tj = 125°C IF=15A 0.33 0.37
Tj = 25°C IF=30A 0.57
Tj = 125°C IF=30A 0.43 0.5
Pulse test : * tp = 380 µs, δ<2%
To evaluate the conduction losses use the following equation :
P = 0.24x IF(AV) + 0.009 IF2(RMS)
STATIC ELECTRICAL CHARACTERISTICS (per diode)
Symbol Parameter Value Unit
Rth (j-c) Junction to case Per diode
Total 1.5
0.8 °C/W
Rth (c) Coupling 0.1 °C/W
THERMAL RESISTANCE
When the diodes 1 and 2 are used simultaneously :
∆Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
0 2 4 6 8 101214161820
0
1
2
3
4
5
6
7
8
9
10
IF(av) (A)
PF(av)(W)
T
δ=tp/T tp
δ= 1
δ= 0.5
δ= 0.2
δ= 0.1
δ= 0.05
Fig. 1: Average forward power dissipation versus
average forward current (per diode).
0 25 50 75 100 125 150
0
2
4
6
8
10
12
14
16 IF(av)(A)
Rth(j-a)=15°C/W
Rth(j-a)=Rth(j-c)
Rth(j-a)=50°C/W
T
δ=tp/T tp Tamb(°C)
Fig. 2: Average current versus ambient
temperature (δ=0.5) (per diode).
STPS30L30CT/CG/CG-1
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1E-3 1E-2 1E-1 1E+0
0
25
50
75
100
125
150
175
200
225
250 IM(A)
Tc=25°C
Tc=110°C
Tc=75°C
t(s)
IM
t
δ=0.5
Fig. 3: Non repetitive surge peak forward current
versus overload duration (maximum values) (per
diode).
1E-4 1E-3 1E-2 1E-1 1E+0
0.0
0.2
0.4
0.6
0.8
1.0
tp(s)
Zth(j-c)/Rth(j-c)
T
δ=tp/T tp
Single pulse
δ= 0.5
δ= 0.2
δ= 0.1
Fig. 4: Relative variation of thermal transient
impedancejunctiontocaseversuspulseduration.
0 5 10 15 20 25 30
1E-2
1E-1
1E+0
1E+1
1E+2
1E+3
VR(V)
IR(mA)
Tj=125°C
Tj=25°C
Tj=150°C
Fig. 5: Reverse leakage current versus reverse
voltage applied (typical values) (per diode).
12 51020 50
0.1
1.0
5.0
VR(V)
C(nF)
F=1MHz
Tj=25°C
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values) (per diode).
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
1
10
100
200
VFM(V)
IFM(A)
Tj=150°C
(typical values)
Tj=125°C
Tj=25°C
Fig. 7: Forward voltage drop versus forward
current (maximum values - per diode).
0 4 8 12 16 20 24 28 32 36 40
0
10
20
30
40
50
60
70
80
S(Cu) (cm²)
Rth(j-a) (°C/W)
Fig. 8: Thermal resistance junction to ambient
versus copper surface under tab (epoxy printed
circuit board FR4, e(Cu) = 35 µm)
(STPS30L30CG).
STPS30L30CT/CG/CG-1
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PACKAGE MECHANICAL DATA
TO-220AB
A
C
D
L7
Dia
L5
L6
L9
L4
F
H2
G
G1
L2 F2
F1
E
M
REF. DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
F2 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
G1 2.40 2.70 0.094 0.106
H2 10 10.40 0.393 0.409
L2 16.4 typ. 0.645 typ.
L4 13 14 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Diam. 3.75 3.85 0.147 0.151
PACKAGE MECHANICAL DATA
I2PAK
REF.
DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
b 0.70 0.93 0.028 0.037
b1 1.14 1.17 0.044 0.046
b2 1.14 1.17 0.044 0.046
c 0.45 0.60 0.018 0.024
c2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
e 2.40 2.70 0.094 0.106
E 10.0 10.4 0.394 0.409
L 13.1 13.6 0.516 0.535
L1 3.48 3.78 0.137 0.149
L2 1.27 1.40 0.050 0.055
e
D
L
L1
L2
b1
b
b2
E
A
c2
A1
c
n
Cooling method: C
n
Recommended torque value: 0.55 m.N
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Maximum torque value: 0.70 m.N
STPS30L30CT/CG/CG-1
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PACKAGE MECHANICAL DATA
D2PAK
A
C2
D
R
A2
MV2
C
A1
G
L
L3
L2
B
B2
E
*
* FLAT ZONE NO LESS THAN 2mm
REF. DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
B2 1.14 1.70 0.045 0.067
C 0.45 0.60 0.017 0.024
C2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
M 2.40 3.20 0.094 0.126
R 0.40 typ. 0.016 typ.
V2 0° 8° 0° 8°
8.90 3.70
1.30
5.08
16.90
10.30
FOOT PRINT (in millimeters)
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useofsuch information nor for anyinfringement of patents or otherrightsof third parties which mayresultfrom its use. No licenseis granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
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Ordering type Marking Package Weight Base qty Delivery mode
STPS30L30CT STPS30L30CT TO-220AB 2g 50 Tube
STPS30L30CG STPS30L30CG D2PAK 1.8g 50 Tube
STPS30L30CG-TR STPS30L30CG D2PAK 1.8g 1000 Tape & reel
STPS30L30CG-1 STPS30L30CG-1 I2PAK 1.49g 50 Tube
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Epoxy meets UL94,V0
