Description
Avago Power PLCC-4 is an extension of our PLCC-2 SMT
LEDs. The package can be driven at higher current due to
its superior package design. The product is able to dissi-
pate heat more efficiently compared to the conventional
PLCC-2 SMT LEDs. In proportion to the increase in driving
current, this family of LEDs is able to produce higher light
output compared to the conventional PLCC-2 SMT LEDs.
These SMT LEDs have higher reliability and better perfor-
mance and are designed to work under a wide range of
environmental conditions. This higher reliability makes
them suitable for use under harsh environment and con-
ditions like automotive. In addition, they are also suitable
to be used in electronic signs and signals.
To facilitate easy pick and place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel will be
shipped in single intensity and color bin (except for red
color), to provide close uniformity.
These LEDs are compatible with IR solder reflow process.
Due to the high reliability feature of these products, they
also can be mounted using through-the-wave soldering
process.
There are a variety of colors and various viewing angles
(30°, 60° and 120°) available in these SMT LEDs. Ideally, the
30° parts are suitable for light piping where focused inten-
sities are required. As for the 60° and 120°, they are most
suitable for automotive interior and exterior lighting and
electronic signs applications.
CAUTION: HSMN-, HSMK-, HSMM-A40x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate
precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
HSMx-A4xx-xxxxx
SMT LED Surface Mount LED Indicator
Data Sheet
Features
x
Industry standard PLCC-4
x
High reliability LED package
x
High brightness using AlInGaP and InGaN dice
technologies
x
High optical efficiency
x
Higher ambient temperature at the same current
possible compared to PLCC-2
x
Available in full selection of colors
x
Super wide viewing angle at 120˚
x
Available in 8mm carrier tape on 7-inch reel
x
Compatible with both IR and TTW soldering process
x
JEDEC MSL 2a
x
High reliability LED package due to enhanced silicone
resin material for InGaN family
Applications
x
Interior automotive
– Instrument panel backlighting
– Central console backlighting
– Cabin backlighting
– Navigation and audio system
– Dome lighting
– Push button backlighting
x
Exterior automotive
– Turn signals
– CHMSL
– Rear combination lamp
– Puddle light
x
Electronic signs and signals
– Interior full color sign
– Variable message sign
x
Office automation, home appliances, industrial
equipment
– Front panel backlighting
– Push button backlighting
– Display backlighting
2
Package Dimensions
Device Selection Guide
Color Part Number Min. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology
Red HSMC-A400-S30M1 180.00 355.00 50 AlInGaP
HSMC-A401-T40M1 285.00 715.00 50 AlInGaP
HSMC-A401-T80M1 355.00 900.00 50 AlInGaP
HSMZ-A400-U80M1 560.00 1400.00 50 AlInGaP
Red Orange
HSMJ-A401-T40M1 285.00 715.00 50 AlInGaP
HSMJ-A401-U40M1 450.00 1125.00 50 AlInGaP
Orange HSML-A401-U40M1 450.00 1125.00 50 AlInGaP
Amber HSMA-A400-T35M1 285.00 560.00 50 AlInGaP
HSMA-A401-U45M1 450.00 1125.00 50 AlInGaP
HSMU-A400-U85M1 560.00 1400.00 50 AlInGaP
Emerald Green HSME-A401-P4PM1 45.00 112.50 50 AlInGaP
Blue HSMN-A400-S8QM2 224.00 560.00 30 InGaN
HSMN-A400-S8PM2 224.00 560.00 30 InGaN
HSMN-A400-S4QM2 180.00 450.00 30 InGaN
Green HSMM-A400-U4QM2 450.00 1125.00 30 InGaN
Notes:
1. The luminous intensity IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be
aligned with this axis.
2. IV tolerance = ±12 %.
0.8 ± 0.3
3.5 ± 0.2
2.8 ± 0.2
0.5 ± 0.1
3.2 ± 0.2
2.2 ± 0.2
1.9 ± 0.2
0.1 TYP. 0.8 ± 0.1
CATHODE MARKING
0.7 ± 0.1
CC
AC
NOTES:
ALL DIMENSIONS IN mm.
ELECTRICAL CONNECTION BETWEEN ALL CATHODES IS RECOMMENDED.
3
Absolute Maximum Ratings (TA = 25°C)
Parameters HSMC/J/L/A/E HSMZ/V/U HSMM/K/N
DC Forward Current[1] 70 mA[3,4] 70 mA[3,4] 30 mA
Peak Forward Current [2] 200 mA 200 mA 90 mA
Power Dissipation 180 mW 240 mW 114 mW
Reverse Voltage 5 V
Junction Temperature 110°C
Operating Temperature –40°C to +100°C
Storage Temperature –40°C to +100°C
Notes:
1. Derate linearly as shown in figure 5.
2. Duty factor = 10%, Frequency = 1 kHz.
3. Drive current between 10 mA and 70 mA is recommended for best long-term performance.
4. Operation at currents below 5 mA is not recommended.
Part Numbering System
HSM x1 – A x2 x3x4 – x5x6 x7 x8x9
Packaging Option
Color Bin Selection
Intensity Bin Select
Device Specific Configuration
Package Type
LED Chip Color
4
Optical Characteristics (TA = 25°C)
Peak Dominant Luminous Luminous Intensity/
Wavelength Wavelength Viewing Angle Efficacy Kv[3] Total Flux
Part OPEAK (nm) OD[1] (nm) 2T1/2[2] (Degrees) (lm/W) Iv (mcd)/)v (mlm)
Color Number Typ. Typ. Typ. Typ. Typ.
Red HSMC 635 626 120 150 0.45
HSMZ 639 630 120 155 0.45
Red Orange HSMJ 621 615 120 240 0.45
HSMV 623 617 120 263 0.45
Orange HSML 609 605 120 320 0.45
Amber HSMA 592 590 120 480 0.45
HSMU 594 592 120 500 0.45
Yellow Green HSME 576 575 120 560 0.45
Emerald Green HSME 568 567 120 610 0.45
Green HSMM 518 525 120 500 0.45
Cyan HSMK 502 505 120 300 0.45
Blue HSMN 468 470 120 75 0.45
Notes:
1. The dominant wavelength, OD, is derived from the CIE Chromaticity Diagram and represents the color of the device.
2. T1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
3. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = Iv/Kv, where Iv is the luminous intensity in candelas and Kv is the
luminous efficacy in lumens/watt.
Electrical Characteristics (TA = 25°C)
Forward Voltage Reverse Voltage
V
F (Volts) @ IF = 50 mA VR @ 100 μA
Part Number Typ. Max. Min.
HSMC/J/L/A/E 2.2 2.5 5
HSMZ/V/U 2.8 3.4 5
Forward Voltage Reverse Voltage
V
F (Volts) @ IF = 30 mA VR @ 10 μA
Part Number Typ. Max. Min.
HSMM/K/N 3.8 4.6 5
Figure 1. Relative intensity vs. wavelength
WAVELENGTH – nm
EMERALD GREEN
RELATIVE INTENSITY
1.0
0.8
0
380 480 580 680 730 780
630530430
BLUE
CYAN
0.6
0.4
0.2
GREEN
YELLOW GREEN
AMBER
ORANGE
RED ORANGE
RED
0.1
0.3
0.5
0.7
0.9
5
Figure 2. Forward current vs. forward voltage Figure 3. Relative intensity vs. forward current
(AlInGaP)
Figure 4. Relative intensity vs. forward current
(InGaN)
Figure 5a. Maximum forward current vs. ambi-
ent temperature, derated based on TJmax =
110°C (AlInGaP)
Figure 6. Dominant wavelength vs. forward
current – InGaN devices
Figure 7. Radiation pattern
040
FORWARD CURRENT – mA
0
0.4
RELATIVE INTENSITY
(NORMALIZED AT 50 mA)
80
0.8
0.2
1.0
20
0.6
1.2
6010 30 70
1.4
50
020
CURRENT – mA
460
480
540
DOMINANT WAVELENGTH – nm
35
500
470
510
10
490
520
25
InGaN GREEN
515 30
530
InGaN CYAN
InGaN BLUE
RELATIVE INTENSITY
1.0
0
ANGLE – DEGREES
0.8
0.6
0.2
0.4
-70 -50 -30 30 50 70 90-90 -10 10
0.1
0.3
0.5
0.7
0.9
0
80
020 60 80 120
MAXIMUM FORWARD CURRENT – mA
AMBIENT TEMPERATURE – °C
40
40
60
30
300°C/W
20
70
100
10
350°C/W
470°C/W
50
0
020 60 80 120
MAXIMUM FORWARD CURRENT – mA
AMBIENT TEMPERATURE – °C
40
20
30
15
300°C/W
10
35
100
5
350°C/W
470°C/W
25
Figure 5b. Maximum forward current vs. ambi-
ent temperature, derated based on TJmax =
110°C (InGaN)
03
FORWARD VOLTAGE – V
0
20
70
80
FORWARD CURRENT – mA
10
50
40
60
12 45
HSMM/K/N
HSMZ/V/U
HSMC/J/L/A/E
30
020
FORWARD CURRENT – mA
0
0.4
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 30 mA)
35
0.8
0.2
1.0
10
0.6
1.2
30515
25
6
Figure 8a. Recommended soldering pad pattern
Figure 8b. Recommended soldering pad pattern (TTW)
Thermal Resistance Solder Pad Area (xy)
300°C/W >16 mm2
350°C/W >12 mm2
470°C/W >8 mm2
2.60
(0.103)
SOLDER RESIST REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
4.50 (0.178)
Y
X
0.40 (0.016)
X
0.50
(0.020)
Y
1.10
(0.043)
1.50 (0.059)
DIMENSIONS IN mm (INCHES).
X X
0.5 (0.020)
Y
Y
1.0 (0.039)
2.0 (0.079)
2.0 (0.079)
6.0 (0.236)
3.0 (0.118)
2.8 (0.110)
6.1 (0.240)
DIMENSIONS IN mm (INCHES). REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
7
Figure 9a. Recommended SnPb reflow soldering profile
Figure 10. Recommended wave soldering profile
Figure 9b. Recommended Pb-free reflow soldering profile.
Note: For detailed information on reflow soldering of Avago
surface mount LEDs, refer to Avago Application Note AN 1060
Surface Mounting SMT LED Indicator Components.
240°C MAX.
20 SEC. MAX.
3°C/SEC.
MAX.
120 SEC. MAX.
TIME
TEMPERATURE
183°C
100-150°C
–6°C/SEC.
MAX.
60-150 SEC.
3°C/SEC. MAX.
217 °C
MAX. 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
125 °C ± 25 °C
255 °C
60 to 150 SEC.
10 to 20 SEC.
TIME
TEMPERATURE
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
+5 °C
-0 °C
LAMINAR WAVE
BOTTOM SIDE
OF PC BOARD
HOT AIR KNIFE
TURBULENT WAVE
FLUXING
PREHEAT
01020
30
50
100
150
200
250
30 40 50
TIME – SECONDS
TEMPERATURE – °C
60 70 80 90 100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
Figure 11. Recommended Pick and Place Nozzle Size for InGaN Family
D
Note: Diameter "D" should
be smaller than 2.2mm
8
Figure 12. Tape leader and trailer dimensions
200 mm MIN. FOR ∅180 REEL.
200 mm MIN. FOR ∅330 REEL.
TRAILER COMPONENT LEADER
480 mm MIN. FOR ∅180 REEL.
960 mm MIN. FOR ∅330 REEL.
C
A
USER FEED DIRECTION
Figure 14. Reeling orientation
Figure 13. Tape dimensions
CATHODE SIDE
PRINTED LABEL
USER FEED DIRECTION
C
A
3.8 ± 0.1
2.29 ± 0.1
0.229 ± 0.01
C
C
ALL DIMENSIONS IN mm.
2 ± 0.054 ± 0.14 ± 0.1
3.05 ± 0.1
3.5 ± 0.05
8+0.3
–0.1
1.75 ± 0.1
Ø1.5 +0.1
–0
8°
Ø1+0.1
–0
9
Intensity Bin Select (X5X6)
Individual reel will contain parts from
one half bin only.
X5 Min. Iv Bin
X6
0 Full Distribution
2 2 half bins starting from X51
3 3 half bins starting from X51
4 4 half bins starting from X51
5 5 half bins starting from X51
6 2 half bins starting from X52
7 3 half bins starting from X52
8 4 half bins starting from X52
9 5 half bins starting from X52
Intensity Bin Limits
Bin ID Min. (mcd) Max. (mcd)
N1 28.50 35.50
N2 35.50 45.00
P1 45.00 56.00
P2 56.00 71.50
Q1 71.50 90.00
Q2 90.00 112.50
R1 112.50 140.00
R2 140.00 180.00
S1 180.00 224.00
S2 224.00 285.00
T1 285.00 355.00
T2 355.00 450.00
U1 450.00 560.00
U2 560.00 715.00
V1 715.00 900.00
V2 900.00 1125.00
W1 1125.00 1400.00
W2 1400.00 1800.00
Tolerance of each bin limit = ± 12%
Color Bin Select (X7)
Individual reel will contain parts from
one full bin only.
X7
0 Full Distribution
Z A and B only
Y B and C only
W C and D only
V D and E only
U E and F only
T F and G only
S G and H only
Q A, B and C only
P B, C and D only
N C, D and E only
M D, E and F only
L E, F and G only
K F, G and H only
1 A, B, C and D only
2 E, F, G and H only
3 B, C, D and E only
4 C, D, E and F only
5 A, B, C, D and E only
6 B, C, D, E and F only
Color Bin Limits
Blue Min. (nm) Max. (nm)
A 460.0 465.0
B 465.0 470.0
C 470.0 475.0
D 475.0 480.0
Cyan Min. (nm) Max. (nm)
A 490.0 495.0
B 495.0 500.0
C 500.0 505.0
D 505.0 510.0
Green Min. (nm) Max. (nm)
A 515.0 520.0
B 520.0 525.0
C 525.0 530.0
D 530.0 535.0
Packaging Option (X8X9)
Test Package Reel
Option Current Type Size
M1 50 mA Top Mount 7 inch
M2 30 mA Top Mount 7 inch
Color Bin Limits
Emerald
Green Min. (nm) Max. (nm)
A 552.5 555.5
B 555.5 558.5
C 558.5 561.5
D 561.5 564.5
Yellow
Green Min. (nm) Max. (nm)
E 564.5 567.5
F 567.5 570.5
G 570.5 573.5
H 573.5 576.5
Amber/
Yellow Min. (nm) Max. (nm)
A 582.0 584.5
B 584.5 587.0
C 587.0 589.5
D 589.5 592.0
E 592.0 594.5
F 594.5 597.0
Orange Min. (nm) Max. (nm)
A 597.0 600.0
B 600.0 603.0
C 603.0 606.0
D 606.0 609.0
E 609.0 612.0
Red
Orange Min. (nm) Max. (nm)
A 611.0 616.0
B 616.0 620.0
Red Min. (nm) Max. (nm)
Full Distribution
Tolerance of each bin limit = ± 1 nm
Forward Voltage Bin Table
For HSMZ/V/U – A4xx-xxxxx only
BIN MIN. MAX.
VA 1.9 2.2
VB 2.2 2.5
VC 2.5 2.8
VD 2.8 3.1
VE 3.1 3.4
Tolerance of each bin limit = ± 0.05
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. Obsoletes AV01-0312EN
AV02-0479EN - March 31, 2010
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level 2a per
JEDEC J-STD-020. Precaution when handling this moisture
sensitive product is important to ensure the reliability of
the product. Refer to Avago Application Note AN 5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
A. Storage before use
– Unopen moisture barrier bag (MBB) can be stored at
<40°C/90% RH for 12 months. If the actual shelf life
has exceeded 12 months and the HIC indicates that
baking is not required, then it is safe to reflow the
LEDs per the original MSL rating.
– It is not recommended to open the MBB prior to
assembly (e.g., for IQC).
B. Control after opening the MBB
– The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
– The LEDs must be kept at <30°C/60% RH at all
times and all high temperature related processes,
including soldering, curing or rework, need to be
completed within 672 hours.
C. Control of unfinished reel
– Unused LEDs need to be stored in sealed MBB with
desiccant or in desiccator at <5% RH.
D. Control of assembled boards
– If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB
needs to be stored in sealed MBB with desiccant
or in desiccator at <5% RH to ensure no LEDs have
exceeded their floor life of 672 hours.
E. Baking is required if:
– “10%” is Not blue and “5%” HIC indicator turns pink.
– The LEDs are exposed to conditions of >30°C/60%
RH at any time.
– The LEDs' floor life exceeds 672 hours.
Recommended baking conditions: 60±5°C for 20 hours.
Handling Precautions
The encapsulation material of the InGaN family product
is made of silicone for better reliability of the product.
As silicone is a soft material, please do not press on the
silicone or poke a sharp object onto the silicone. These
might damage the product and cause premature failure.
During assembly or handling, the unit should be held on
the body only. Please refer to Avago Application Note AN
5288 for detail information.
