REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) . APPROVED A Changes in accordance with NOR 5962-R028-94. 93-11-05 M. A. Frye B Updated boilerplate. Added device types 04-07. 94-04-15 M. A. Frye Removed programming requirements from drawing. Editorial changes throughout. SHEET REV STATUS REV B B B B B B B 8 B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 1 PREPARED BY PMIC N/A Monica L. Poelking DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 STANDARDIZED CHECKED BY MILITARY Ray Monnin DRAWING MICROCIRCUIT, MEMORY, DIGITAL, CMOS APPROVED BY Michael A. Frye 512 X 8 REGISTERED PROM, MONOLITHIC THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS SILICON AND AGENCIES OF THE DRAWING APPROVAL DATE DEPARTMENT OF DEFENSE 88-07-11 SIZE CAGE CODE 5962-88518 AMSC N/A REVISION LEVEL A 67268 B SHEET 1 OF 1. DESC FORM 193 JUL 91 5962-E191-94 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. Me 5004708 0001143 7751. 1.1 SCOPE Scope. This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". Drawing number 1.2.3 Lead finish. Tt Device type (see 1.2.1) Case outline (see 1.2.2) 1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example: 5962-88518 xX a Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic number 1/ Circuit function Access time 01 512 X 8-bit registered PROM 30 02 512 X 8-bit registered PROM 35 03 512 X 8-bit registered PROM 40 04 512 X 8-bit registered PROM 30 05 512 X 8-bit registered PROM 35 06 512 X 8-bit registered PROM 40 07 512 X 8-bit registered PROM 25 1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows: Outline Letter Descriptive designator Terminals Package style L CDIP4-T24 or GDIP3-T24 24 Dual-in-line 3 CQCC1-N28 28 Square chip carrier The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein). Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference. 1.3 Absolute maximum ratings. 2/ Supply voltage range to ground potential (Ve ) -0.5 V de to +7.0 V de DC voltage range applied to the outputs in fe high 2 state - - -0.5 V de to +7.0 V de DC input voltage ------------+--+--+----5.- 3.0 V de to +7.0 V de Maximum power dissipation -------+-++-+--+--+-+-- 1.0W 3/ Lead temperature (soldering, 10 seconds) ------+----- +300C Thermal resistance, junction-to-case (850) i See MIL-STD-1835 Junction temperature te +150C 4/ Storage temperature range (Torq) cot ot tm te ee eee ee -65C to +150C Temperature under bias - ------+--+-+-++---+-+--- -55C to +125C Data retention ----+--+---+----+-+--+------- 10 years, minimum 1.4 Recommended operating conditions. +4.5 V de minimum to +5.5 V dc maximum Supply voltage range Wer) Input high voltage range WViw Input low voltage range Wi +2.0 V de +0.8 V dc 55C to +125C Case operating temperature range (Td Generic numbers are listed on the Standardized Military Drawing Source Approval Bulletin and will also be Listed in MIL-BUL-103. 1 ~ 2/ Unless otherwise specified, all voltages are referenced to ground. 3/ Must withstand the added P, due to short circuit test; -9-, Ings 4/ Maximum junction temperature may be inceased to +175C during brn in and steady state life tests. STANDARDIZED SIZE 5962-88518 MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET E 2 DESC FORM 193A JUL 91 Me 9004708 0001144 6012. APPLICABLE DOCUMENTS 2.1 Government specification, standards, bulletin, and handbook. Unless otherwise specified, the following specification, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICATION MILITARY MIL-1-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS MILITARY MIL-STD-883 - Test Methods and Procedures for Microelectronics. MIL-STD- 1835 - Microcircuit Case Outlines. BULLETIN MILITARY MIL-BUL-103 - List of Standardized Military Drawings (SMDs). (Copies of the specifications, standards, bulletin, and handbook required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices" and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-1-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-1-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-[-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-STD-883 (see 3.1 herein) and herein. 3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.2 Truth table. The truth table shall be as specified on figure 2. 3.2.2.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing shall be as specified on figure 2. When required in groups A, B, C, or D (see 4.4), the devices shall be programmed by the manufacturer prior to test with a checkerboard pattern or equivalent (a minimum of 50 percent of the total number of bits programmed) or to any altered item drawing pattern which includes at least 25 percent of the total number of bits programmed. 3.2.2.2 Programmed devices. The truth table for programmed devices shall be as specified by an attached altered item drawing. 3.2.3 Logic diagram(s). The logic diagram shall be as specified on figure 3. 3.2.4 AC test loads and waveforms. The ac test loads and waveforms shall be as specified on figure 4. STANDARDIZED SIZE 5962-88518 MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET B 3 DESC FORM 193A JUL 91 Me 5004706 c001145 S463.2.5 Switching waveforms. The switching waveforms shall be as specified on figure 5. 3.2.6 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full (case or ambient) operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table 1. 3.5 Marking. Marking shall be in accordance with MIL-STD-883 (see 3.1 herein). The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as Listed in MIL-BUL-103 (see 6.6 herein). 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-BUL-103 (see 6.6 herein). The certificate of compliance submitted to DESC-EC prior to Listing as an approved source of supply shat| affirm that the manufacturers product meets the requirements of MIL-STD-883 (see 3.1 herein) and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-STD-883 (see 3.1 herein) shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DESC-EC shatl be required in accordance with MIL-STD-883 (see 3.1 herein). 3.9 Verification and review. DESC, DESCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shatl be done initially and after any design or process change which may affect data retention. The methods and procedures may be vendor specific, but will guarantee the number of years listed in section 1.3 herein over the full military temperature range. The vendors procedure shall be kept under document control and shall be made available upon request. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-STD-883 (see 3.1 herein). 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on ait devices prior to quality conformance inspection. The foltowing additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shalt specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) Ta = +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. STANDARDIZED SIZE 5962-88518 MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET B 4 DESC FORM 193A JUL 91 M 5004706 OOO1L4b 444TABLE I. Electrical performance characteristics. Conditions Limits Test Symbol 55C ST. Ss +125C Group A {Device Unit 4.5 VSVo. 85.5 V subgroups| types Min | Max unless otherwise specified Output voltage high Von Ver = 4.5 V, Toy = -4 mA 1,2, 3 ALL 2.4 V Vig = 2-0 , Vip = 0-8 V Output voltage low Vor Vec = 4.5 V, Toy = 16 mA 1, 2, 3 ALL 0.4 v Vin = 2-0 , Vin = 0.8 Vv Vee = 5-5 V Input leakage current Ihy Vig = 5-5 and GND. 1, 2, 3 Alt -10 10 | BA Von 7 SV Output leakage current Io7 v = 5.5 and GND 1/ 1, 2, 3 ALL -10 10 | BA Outputs disabled Output short circuit los v ce 5.5 V, Vout = GND 1, 2,3 ALL -20 | -90 | mA current Unused outputs are open 2/ 3/ Power supply current lec nce = 5.5 Vv, 1, 2, 3 ALL 120 | mA O.0VE VN s Vec Input capacitance Cn Vec 79-0 V, f = 1 MHz 4 ALL 10 pF See 4.3.1 Output capacitance Cour Vee = 5-0 V, f = 1 MHZ 4 All 10 pF See 4.3.1c Functional tests See 4.3.1e 7, 8A,8B All 01,04 30 Address setup to clock ton See figure 4 and 5 as 9, 10, 11 02,05 35 ns high applicable 03,06 40 07 25 Address hold from clock tua 9, 10, 11] ALL 0 ns high 01,04 15 Clock high to output teo 9, 10, 11]__ 02,05 20 _/ ns valid 03,06 25 07 12 Clock pulse width toyc 9, 10, 11). 01,04 15 ns 02,03, 05,06 20 07 10 Es setup to clock high toes 9, 10, 11] All 10 ns 3/ Es hold from clock HIGH tues 9, 10, 11|__014-06 5 ns 3/ 07 0 See footnotes at end of table. STANDARDIZED SIZE 5962-88518 MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET B 5 DESC FORM 193A JUL 91 me 9004708 oooLL4y? 310 =TABLE I. Electrical performance characteristics. Conditions Limits Test Symbol -55C < Ts +#125C Group A [Device Unit 4.5 VEVpp 35.5 V subgroups| types Min | Max unless otherwise specified Output valid from tcos See figure 4 and 5 as 9, 10, 11|_01,04,07 20 ns clock high applicable, 3/ 4/ 02,05 25 03,06 30 Output inactive from tuze See figure 4 and 5 as 9, 10, 111_01,04,07 20 ns clock high applicable, 3/ 4/ 5/ 02,05 25 03,06 30 Output valid from E oor See figure 4 and 5 as 9, 10, 11]_01,04,07 20 ns low applicable, 3/ 6/ 02,05 25 03,06 30 Output inactive tuze See figure 4 and 5 as 9, 10, 11|_01,04,07 20 ns from E high applicable, 3/ 4/ 5/ 02,05 25 03,06 30 Delay from PRESET or CLEAR to top See figure 4 and 5 9, 10, 11 All ; 20 ns valid output toc PRESET or CLEAR trp See figure 4 and 5 9, 10, 11]_ 04-06 20 ns recovery to clock high tec 07 15 PRESET or CLEAR tpyp See figure 4 and 5 3/ 9, 10, 11 01-06 20 ns pulse width touc 07 15 i/ For the tests using synchronous enable, the device must be clocked after applying these voltages to perform this measurement. 2/ For test purposes, not more than one output at a time should be shorted. Short circuit test duration should not exceed 30 seconds. 3/ Tested initially and after any design or process changes that affect that parameter, and therefore shall be guaranteed to the limits specified in table I. 4/ Applies only when the synchronous (Es) function is used. 3/ Transition is measured at steady state high level -500 mV or steady state Low level +500 mV on the output from the 1.5 V level on the input with loads shown on figure 4; c= 5 pF. 6/ Applies only when the asynchronous (E) function is used. STANDARDIZED SIZE 5962-88518 MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET B 6 DESC FORM 193A JUL 91 me 9004708 0001148 25?Device types ALL Case outlines L 3 Terminal Terminal number symbol ; Ay NC Ae Az 3 As Ag 4 Ay As 5 Ag Ay 6 A> Ag 7 Ay Ay 9 a " ro | of | ae 11 05 % 12 GND 0, 13 0; 05 14 Oo, GND 15 O5 NC 16 0 6 Og 17 07 0, 18 PGM (CP) 0, 19 VFY (Es) 0 20 Vpp (CLR)| 0, 21 E NC 22 PS PGM (CP) 23 Ag VFY (Es) 24 Vee CLR 25 --- E 26 --- PS 27 7s: A 8 28 + Vee NC = no connection FIGURE 1. Terminal connections. STANDARDIZED SIZE 5962-88518 MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET B 7 DESC FORM 193A JUL 91 MM 9004708 0001145 193Read or output disable cp E CLR E PS Outputs Other PGM VEY Vpp E PS Mode Read 1/ 2/ 3/ X Yoo VY ry Vir | yy | Data out Output disable 1/ 4/ Xx Vin VY ry X |Viy [High 2 Output disable 1/ Xx X [Vig Vin TYiy [High 2 CLEAR 1/ x Vin Ure Vie | Yry | Zeros PRESET 1/ x Yin Min Vin EV, | Ones X = dont care, but not to exceed V eeee ROW DECODER 1 OF 32 32 X 128 PROGRAMMABLE ARRAY COLUMN DECODER 1 OF 16 FIGURE 3. FIGURE 2. = 13.0 V, maximum. During read operation, the output latches are loaded on a "0" to Pin Es must be LOW prior to the "0" to "1" transition on CP that loads the register. Es must be HIGH prior to the "0" to "1" transition on CP that loads the register. Truth table. 6X 1 OF 16 MULTIPLEXER Logic diagram 8 BIT EOGE TRIGGERED REGISTER "14 transition of CP. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE 5962-88518 REVISION LEVEL B SHEET DESC FORM 193A JUL 91 Me 5004708 0001150 505ALL INPUT PULSES 2502 VvV oO AA Ry OUTPUT O | Ro 167), SEE NOTE NOTES: 1. c includes probe and jig capacitance. c= 50 pF for all switching characteristics except tuze and tuze- , = 5 pF for tuge and tuze: 2. Tests are performed with rise and fall times of 5 ns or less. 3. All device test loads should be tocated within two inches of device outputs. FIGURE 4. Output load circuit and test conditions. tua tsa ta Ao - Alo cp teuc tpwc teyc y , T tpuc tewc teyc SEE aor OTE _ Ty NOTE N Og - 07 ~ K mtco tyzc re tops oI me tcp tooE oT! TN r FIGURE 5. Switching waveforms. STANDARDIZED SIZE 5962-88518 MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHTO 45444 REVISION LEVEL SHEET B 9 DESC FORM 193A JUL 91 MB 9004708 0002151 44)4.3.1 TABLE II. Electrical test requirements. 1/ 2/ 3/ 4/ Subgroups Cin accordance with method 5005, table I) MIL-STD-883 test requirements Interim electrical parameters oo (method 5004) 1*, 2, 3, 7*, 8A, 8B, 9, 10, 11 Final electrical test parameters (method 5004) 1, 2, 3, 4**, 7,8A, Group A test requirements 8B, 9, 10, 11 (method 5005) Groups C and D end-point 2, 3, 7, 8A, 8B electrical parameters (method 5005) 1/ Indicates PDA applies to subgroups 1 and 7. 2/ Any or all subgroups may be combined when using high-speed testers. 3/ ** See 4.3.1c. 4/ As a minimum, subgroups 7 and 8 shall consist of verifying the data pattern. Group A inspection. Tests shall be as specified in table IIA herein. b. Subgroups 5 and 6 of table I of method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 4 (Cry and cqyy measurement) shall be measured only for the initial test and after process or design changes which may affect capacitance. Sample size is 15 devices with no failures, and all input and output terminals tested. d. Unprogrammed devices shall be tested for programmability and ac performance compliance to the requirements of group A, subgroups 9, 10, and 11. Either of two techniques is acceptable: (1) Testing the entire lot using additional built-in test circuitry which allows the manufacturer to verify progranmability and ac performance without programming the user array. If this is done, the resulting test patterns shall be verified on all devices during subgroups 9, 10, and 11, group A testing in accordance with the sampling plan specified in MIL-STD-883, method 5005. (2) If such compliance cannot be tested on an unprogrammed device, a sample shall be selected to satisfy programmability requirements prior to performing subgroups 9, 10, and 11. Twelve devices shall be submitted to programming (see 3.2.2.2). If more than two devices fail to program, the Lot shall be rejected. At the manufacturer's option, the sample may be increased to 24 total devices with no more than 4 total device failures allowable. Ten devices from the programmability sample shall be submitted to the requirements of group A, subgroups 9, 10, and 11. If more than two devices fail, the lot shall be rejected. At the manufacturers option, the sample may be increased to 20 total devices with no more than 4 total device failures allowable. e. Subgroups 7 and 8 shall include verification of the truth table. STANDARDIZED SIZE 5962-88518 MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET B 10 DESC FORM 193A JUL 91 mM 9004704 oo01152 75664.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision tevel control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. (2) T= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. c. Group C, subgroup 1 sample shall include devices tested in accordance with 4.3.1d. 4.4 Programming procedure. The programming procedures shall be as specified by the device manufacturer and shall be made available upon request. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-STD-883 (see 3.1 herein). 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished in accordance with MIL-STD-973 using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shalt inform Defense Electronics Supply Center when a system application requires configuration control and the applicable SMD. DESC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DESC-EC, telephone (513) 296-6047. 6.5 Comments. Comments on this drawing should be directed to DESC-EC, Dayton, Ohio 45444-5270, or telephone (513) 296-5377. 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-BUL-103. The vendors listed in MIL-BUL-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DESC-EC. STANDARDIZED SIZE 5962-88518 MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET B 11 DESC FORM 193A JUL 91 Mf 9004708 0001153 b14