SPEC NO: DSAH7160 REV NO: V.3 DATE: FEB/15/2011 PAGE: 1 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP:1201200207
Part Number: AAD1-9090SE9ZC/2
Reddish-Orange
Applications
ztraffic signaling.
zbacklighting (illuminated advertising , general lighting).
zinterior and exterio r automotive lighting.
zsubstitution of micro incandes cent lamps.
zportable light source (e.g. bicycle flashlight).
zsignal and symbol luminaire for orientation.
zmarker lights (e.g. steps, e xit ways, etc).
zdecorative and entertainme nt lighting.
zindoor and outdoo r commercial and residential
architectural lighting.
Package Dimensions
Features
zSuper high flux output and high luminance.
zDesigned for high current operation.
zLow thermal resistance.
zLow voltage DC operated.
zSuperior ESD protection.
zPackage: 500pcs/reel.
zNot reflow compatible.
zThe component is internally protected with
silicone gel.
zRoHS compliant.
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
Application Note
Static electricity and surge damage the LEDS.
It is recommended to use a wrist band or anti-electrostatic
glove when handling the LEDs.
All devices, equipment and machinery must be electrically
grounded.
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
SPEC NO: DSAH7160 REV NO: V.3 DATE: FEB/15/2011 PAGE: 2 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP:1201200207
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of
leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.
4.1. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner
diameter of the nozzle should be as large as possible.
4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
SPEC NO: DSAH7160 REV NO: V.3 DATE: FEB/15/2011 PAGE: 3 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP:1201200207
Selection Guide
Part No. Dice Lens Type
luminous Intensity
Iv (cd)@ 500 mA [2]
Φv (lm)
@ 500 mA [2]
V
iewing
Angle [1]
Min. Typ. Min. Typ. 2θ1/2
AAD1-9090SE9ZC/2 REDDISH-ORANGE
(AlGaInP) Water Clear 12 20 35 50 100°
Parameter Symbol Value Unit
Power dissipation PD 1.65 W
Junction temperature TJ 110 °C
Operating Temperature Top -40 To +100 °C
S torage Temperature Tstg -40 To +100 °C
DC Forward Current [1] IF 500 mA
Peak Forward Current [2] IFM 700 mA
Thermal resistance [1] Rth j-slug 12 °C/W
8000 V
Iron Soldering [3] 350°C For 3 Seconds
Electrostatic Discharge Threshold (HBM)
Reverse Voltage VR 5 V
Absolute Maximum Ratings at TA=25°C
Electrical / Optical Characteristics at TA=25°C
Parameter Symbol Value Unit
Wavelength at peak emission IF=500mA [Typ.] λpeak 635 nm
Dominant Wavelength IF=500mA [Typ.] λ dom [1] 623 nm
Spectral bandwidth at 50%ΦREL MAX IF=500mA [Typ.] Δλ 22 nm
Forward Voltage IF=500mA [Min.]
VF [2]
-
V Forward Voltage IF=500mA [Typ.] 2.7
Forward Voltage IF=500mA [Max.] 3.3
Temperature coefficient of λpeak
IF=500mA, -10°C≤ T≤100°C [Typ.] TCλpeak 0.08 nm/°C
Temperature coefficient of λdom
IF=500mA, -10°C≤ T≤100°C [Typ.] TCλdom 0.03 nm/°C
Temperature coefficient of VF
IF=500mA, -10°C≤ T≤100°C [Typ.] TCV -2.8 mV/°C
Allowable Reverse Current [Max.] IR 85 mA
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity/ luminous Flux: +/-15%.
Notes:
1.Wavelength: +/-1nm.
2. Forward Voltage: +/-0.1V.
Notes:
1. Results from mounting on MCPCB.
2.1/10 Duty Cycle, 0.1ms Pulse Width.
3.1.29mm distance from solder joint to package.
SPEC NO: DSAH7160 REV NO: V.3 DATE: FEB/15/2011 PAGE: 4 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP:1201200207
AAD1-9090SE9ZC/2
SPEC NO: DSAH7160 REV NO: V.3 DATE: FEB/15/2011 PAGE: 5 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP:1201200207
Tape Specifications
(Units : mm)
AAD1-9090SE9ZC/2
Recommended Soldering Pattern
(Units : mm; Tolerance: ±0.1)
Reel Dimension
SPEC NO: DSAH7160 REV NO: V.3 DATE: FEB/15/2011 PAGE: 6 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP:1201200207
AAD1-9090SE9ZC/2
Recommended Solder Steps
SPEC NO: DSAH7160 REV NO: V.3 DATE: FEB/15/2011 PAGE: 7 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP:1201200207
PACKING & LABEL SPECIFICATIONS AAD1-9090SE9ZC/2
