ESDZV5-1BF4 Ultra low clamping single line bidirectional ESD protection Datasheet - production data Description The ESDZV5-1BF4 is a bidirectional single line TVS diode designed to protect the data line or other I/O ports against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required. Figure 1: Functional diagram 0201 package Features Ultra low clamping voltage: 7 V (IEC 610004-2 contact discharge 8 kV at 30 ns/ 16 A TLP) Bidirectional device Low leakage current 0201 package ECOPACK(R)2 compliant component Exceeds the followig standard: IEC 61000-4-2 level 4 = 30 kV (air discharge) and 18 kV (contact discharge) Applications Where transient over voltage protection in ESD sensitive equipment is required, such as: Smartphones, mobile phones and accessories Tablets and notebooks Portable multimedia devices and accessories Wearable, home automation, healthcare Highly integrated systems July 2017 DocID030034 Rev 2 This is information on a product in full production. 1/9 www.st.com Characteristics 1 ESDZV5-1BF4 Characteristics Table 1: Absolute ratings (Tamb = 25 C) Symbol Parameter VPP Peak pulse voltage Value Unit 18 30 kV 70 W Contact discharge Air discharge PPP Peak pulse power dissipation (8/20 s) IPP Peak pulse current (8/20 s) 7 A Tj Operating junction temperature range -55 to +150 C Tstg Storage temperature range -65 to +150 C TL Maximum lead temperature for soldering during 10 s 260 C Figure 2: Electrical characteristics (definitions) I Symbol VTrig VCL IRM VRM IPP = = = = = Parameter Trigger voltage Clamping voltage Leakage current @ VRM Stand-off voltage Peak pulse current RD VH = = Dynamic resistance Holding voltage CLINE = Input capacitance per line RD VRM VCL VTrig VH V IRM IPP Table 2: Electrical characteristics (Tamb = 25 C) Symbol VTrig Test condition Higher voltage than VTrig guarantees the protection turn-on VH Lower voltage than VH guarantees the protection turn-off IRM VRM(1) = 5.5 V VCL 8 kV contact discharge after 30 ns, IEC 61000-4-2 VCL 8/20 s waveform, IPP = 7 A CLINE RD F = 1 MHz, VLINE = 0 V, VOSC = 30 mV Pulse duration 100 ns Min. Typ. 5.8 4 Max. Unit 10 V 100 nA 4.6 7 6 0.18 V 10 V 7.5 pF Notes: (1)Application note: when used to protect a line connected to a DC source, the DC voltage must be lower than the minimum VH to enable the diode to return to its non-conducting state after the transient. 2/9 DocID030034 Rev 2 ESDZV5-1BF4 1.1 Characteristics Characteristics (curves) Figure 3: Leakage current versus junction temperature (typical values) Figure 4: Junction capacitance versus reverse voltage applied (typical values) Figure 5: ESD response to IEC 61000-4-2 (+8 kV contact discharge) Figure 6: ESD response to IEC 61000-4-2 (-8 kV contact discharge) Figure 7: TLP characteristic Figure 8: S21 attenuation measurement result I(A) 18 16 14 12 10 8 6 4 2 0 0 1 2 3 4 5 6 7 8 9 V(V) DocID030034 Rev 2 3/9 Package information 2 ESDZV5-1BF4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 2.1 0201 package information Figure 9: 0201 package outline The marking codes can be rotated by 90 or 180 to differentiate assembly location. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. 4/9 DocID030034 Rev 2 Package information ESDZV5-1BF4 Table 3: 0201 package mechanical data Dimensions Ref. Millimeters Min. Typ. Max. A 0.270 0.300 0.330 b 0.1675 0.1875 0.2075 D 0.560 0.580 0.600 D1 0.3375 E 0.260 0.280 0.300 E1 0.205 0.225 0.245 fD 0.0175 0.0275 0.0375 fE 0.0175 0.0275 0.0375 Figure 10: Marking A Figure 11: Tape and reel specification (in mm) DocID030034 Rev 2 5/9 Recommendation on PCB assembly ESDZV5-1BF4 3 Recommendation on PCB assembly 3.1 Footprint 1. Footprint in mm a. SMD footprint design is recommended. Figure 12: Footprint in mm 3.2 Stencil opening design 1. Reference design a. Stencil opening thickness: 75 m / 3 mils Figure 13: Recommended stencil window position in mm 3.3 Solder paste 1. 2. 3. 4. 6/9 Halide-free flux qualification ROL0 according to ANSI/J-STD-004. "No clean" solder paste is recommended. Offers a high tack force to resist component movement during high speed. Use solder paste with fine particles: powder particle size 20-38 m. DocID030034 Rev 2 Recommendation on PCB assembly ESDZV5-1BF4 3.4 Placement 1. 2. 3. 4. 5. 6. 3.5 PCB design preference 1. 2. 3.6 Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of 0.05 mm is recommended. 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. Reflow profile Figure 14: ST ECOPACK(R) recommended soldering reflow profile for PCB mounting Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC JSTD-020. DocID030034 Rev 2 7/9 Ordering information 4 ESDZV5-1BF4 Ordering information Figure 15: Ordering information scheme ESD Z V 5 - 1 B F4 ESD protection Z : Ultra low Clamping snapback effect V : Very Low Capacitance 5 : Stand- off voltage at 5.5 V max. Number of lines B = Bi-directional Package F4 = 0201 Table 4: Ordering information Order code Marking Package Weight Base qty. Delivery mode ESDZV5-1BF4 A(1) 0201 0.116 mg 15000 Tape and reel Notes: (1)The 5 marking can be rotated by multiples of 90 to differentiate assembly location Revision history Table 5: Document revision history 8/9 Date Revision Changes 06-Apr-2017 1 First issue. 28-Jul-2017 2 Updated footprint title. 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All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2017 STMicroelectronics - All rights reserved DocID030034 Rev 2 9/9