MT9T031P12STC - Aptina - Datasheet.Directory

Applications

Features

MT9T031: 1/2-Inch 3-Mp Digital Image Sensor

Products and specifications discussed herein are subject to change by Micron without notice.

MT9T031 Image Sensor

Product Brief

Micron’s MT9T031 is a QXGA-format 1/2-inch CMOS active-

pixel digital image sensor with an active imaging pixel array of

2048H x 1536V. It incorporates sophisticated camera functions

on-chip such as windowing, column and row skip mode, and

snapshot mode. It is programmable through a simple two-wire

serial interface. The 3-megapixel CMOS image sensor features Digi-

talClarity™—Micron’s breakthrough low-noise CMOS imaging

technology that achieves CCD image quality (based on signal-to-

noise ratio and low-light sensitivity) while maintaining the inher-

ent size, cost, and integration advantages of CMOS.

•Micron

® DigitalClarity®

imaging technology

•High frame rate

• Global reset release

• Horizontal and vertical

binning

• Column and row skip modes

• Superior low-light

performance

•Low dark current

• Simple two-wire serial

interface

• Programmable controls: Gain,

frame rate, frame size,

exposure

• Pin-for-pin compatible with

Micron’s 1.3-megapixel

MT9M001

• High-resolution network

cameras

• Wide field of view cameras

• Dome cameras with electronic

pan, tilt, and zoom

• Security video cameras with

high resolution stills

• Detailed feature extraction for

smart cameras

Parameter

Optical format 1/2-inch (4:3)

Active imager size 6.55mm(H) x 4.92mm(V)

8.19 (diagonal)

Active pixels 2048H x 1536V

Pixel size 3.2μm x 3.2μm

Color filter array RGB Bayer pattern

Shutter type Global reset release (GRR),

electronic rolling shutter

(ERS)

Maximum data rate/

master clock

48 Mp/s/48 MHz

Frame rate

QXGA (2048 x 1536) Programmable up to 12 fps

UXGA (1600 x 1200) Programmable up to 20 fps

HDTV (1280 x 720) Programmable up to 39 fps

XGA (1024 x 768) Programmable up to 43 fps

VGA (640 x 480) Programmable up to 93 fps

ADC resolution 10-bit, on-chip

Responsivity >1.0 V/lux-s (550nm)

Dynamic range 61dB

SNRMAX 43dB

Supply voltage 3.0V−3.6V (3.3V nominal)

Power consumption 228mW (nominal);

1.65µW (standby)

Operating temp 0°C to 60°C

Packaging 48-pin PLCC

Output gain 25 e-/LSB

Read noise 6 e-RMS at 16X

Dark current 100 e-/pixel/s at 55°C

Ordering Information

Part Number Description

MT9T031P12STC 48-pin PLCC

MT9T031P12STCD ES Demo kit

MT9T031P12STCH ES Demo kit headboard

Draft 8/ 31/ 2006

PDF: 09005aef824c997f/Source: 09005aef824c998a Micron Technology, Inc., reserves the right to change products or specifications without notice.

MT9T031: 1/2-Inch 3-Mp Digital Image Sensor

General Description

The MT9T031 produces extraordinarily clear, sharp digital pictures, and its ability to

capture both continuous video and single frames makes it the perfect choice for a wide

range of consumer and industrial applications, including high-resolution network

cameras, electronic PTZ cameras, and security video cameras that can also produce

high-resolution still images.

The sensor can be operated in its default mode or programmed for frame size, exposure,

gain setting, and other parameters. The default mode outputs a QXGA image at 12

frames per second (fps). An on-chip analog-to-digital converter (ADC) provides 10 bits

per pixel. FRAME_VALID and LINE_VALID signals are output on dedicated pins, along

with a pixel clock that is synchronous with valid data.

Figure 1: Block Diagram

Figure 2 illustrates the MT9T031’s quantum efficiency in relation to wavelength.

Figure 2: MT9T031 Quantum Efficiency

Active-Pixel

Sensor (APS)

Array

Two-Wire

Serial Interface

10-bit

Data

Sync

Signals

Timing

and

Control

Control Register

Analog ProcessingADC

Clock

350 400 450 500 550 600 650 700 750 800

Wavelength (nm)

Quantum Efficiency (%)

Blue

Green

Red

Draft 8/ 31/ 2006

PDF: 09005aef824c997f/Source: 09005aef824c998a Micron Technology, Inc., reserves the right to change products or specifications without notice.

MT9T031: 1/2-Inch 3-Mp Digital Image Sensor

General Description

Figure 3: Typical Configuration (connection)

Notes: 1. Resistor value 1.5KΩ is recommended, but resistance may be greater for slower two-wire

speed.

Figure 4: 48-Pin PLCC

STROBE

MASTER CLOCK

0.01µF 0.1µF

1.5KΩ1

10µF

1KΩ

SDATA

SCLK

OE#

STANDBY

RESET#

FRAME_VALID

PIXCLK

LINE_VALID

DOUT[9:0]

TEST

GND

EXTCLK

VAAPIX

TRIGGER

GSHT_CTL

2.2µF

0.1µF

GND

1.5KΩ1

TWO-WIRE

SERIAL BUS

12345648 47 4645 44 43

19 20 21 22 23 24 25 2627 28 29 30

STANDBY

TRIGGER

RESET#

GSHT_CTL

OE#

AGND

VAA

AGND

FRAME_VALID

LINE_VALID

STROBE

DGND

VDD

DOUT[9]

DOUT[8]

DOUT[7]

DOUT[6]

DOUT[5]

PIXCLK

VAA

AGND

VDD

DGND

DOUT[0]

DOUT[1]

DOUT[2]

DOUT[3]

DOUT[4]

EXTCLK

DGND

VDD

VAAPIX

AGND

SCLK

DATA

DGND

Draft 8/ 31/ 2006

PDF: 09005aef824c997f/Source: 09005aef824c998a Micron Technology, Inc., reserves the right to change products or specifications without notice.

MT9T031: 1/2-Inch 3-Mp Digital Image Sensor

General Description

.Table 3: Pin Descriptions

Pin Numbers Symbol Type Description

7 STANDBY Input Standby: Activates (HIGH) standby mode, disables analog bias circuitry

for power saving mode.

8TRIGGERInput

Trigger: Activates (HIGH) snapshot sequence.

10 RESET# Input Reset: Activates (LOW) asynchronous reset of sensor. All registers

assume factory defaults.

13 OE# Input Output enable: OE# when HIGH, places outputs DOUT[9:0],

FRAME_VALID, LINE_VALID, PIXCLK, and STROBE into a tri-state

configuration.

29 EXTCLK Input Clock in: Master clock into sensor (48 MHz maximum).

46 SCLK Input Serial clock: Clock for serial interface.

12 GSHT_CTL Input Global shutter control.

45 SDATA I/O Serial data: Serial data bus, requires 1.5KΩ resistor to 3.3V for pull-up.

24, 25, 26, 27, 28,

32, 33, 34, 35, 36

DOUT[9:0] Output Data out: Pixel data output bit 0, DOUT[9] (MSB), DOUT[0] (LSB).

31 PIXCLK Output Pixel clock: Pixel data outputs are valid during falling edge of this

clock. Frequency = master clock.

39 STROBE Output Strobe: Output is pulsed HIGH to indicate sensor reset operation of

pixel array has completed.

40 LINE_VALID Output Line valid: Output is pulsed HIGH during line of selectable valid pixel

data (see R0x20 for options).

41 FRAME_VALID Output Frame valid: Output is pulsed HIGH during frame of valid pixel data.

1 VAAPIX Supply Analog pixel power: Provides power supply for pixel array, 3.3V

±0.3V.

4, 22, 37 VDD Supply Digital power: Provides power supply for digital block, 3.3V ±0.3V.

5, 23, 38, 43 DGND Supply Digital ground: Provides isolated ground for digital block.

16, 20 VAA Supply Analog power: Provides power supply for analog block, 3.3V ±0.3V.

15, 17, 18, 21, 47, 48 AGND Supply Analog ground: Provides isolated ground for analog block and pixel

array.

2, 3, 6, 9, 11,14,19,

30 42, 44

NC – No connect: These pins must be left unconnected.

Draft 8/ 31/ 2006

PDF: 09005aef824c997f/Source: 09005aef824c998a Micron Technology, Inc., reserves the right to change products or specifications without notice.

MT9T031: 1/2-Inch 3-Mp Digital Image Sensor

Feature Description

Output Data Format

The MT9T031 image data is read out in a progressive scan. Valid image data is

surrounded by horizontal blanking and vertical blanking, as shown in Figure 5.

Figure 5: Spatial Illustration of Image Readout

Feature Description

Window Size

The default programmed window size is 2,048 columns by 1,536 rows (2048H x 1536V),

though the window size can be changed through the control logic. Table 4 shows exam-

ples of register settings that may be used to achieve various resolutions and frame rates.

Electronic Panning

The location of the readout window can be changed. This enables a zooming function,

since only a segment of the imager array is read out. Figure 6 on page 5 shows some

examples of the electronic pan/zoom and windowing capabilities of the sensor.

Table 4: Standard Resolutions

Resolution Frame Rate Column_Size Row_Size Shutter Width

2048 x 1536 QXGA 12 fps 2047 1535 <1552

1600 x 1200 UXGA 20 fps 1599 1199 <1216

1280 x 1024 SXGA 27 fps 1279 1023 <1040

1024 x 768 XGA 43 fps 1023 767 <784

800 x 600 SVGA 65 fps 799 599 <616

640 x 480 VGA 93 fps 639 479 <496

Table 5: Wide-Screen (16:9) Resolutions

Resolution Frame Rate Column_Size Row_Size Shutter Width

1920 x 1080 HDTV 18 fps 1919 1079 <1096

1280 x 720 HDTV 39 fps 1279 719 <736

P0,0 P0,1 P0,2.....................................P0,n-1 P0,n

P1,0 P1,1 P1,2.....................................P1,n-1 P1,n

00 00 00 .................. 00 00 00

Pm-1,0 Pm-1,1.....................................Pm-1,n-1 Pm-1,n

Pm,0 Pm,1.....................................Pm,n-1 Pm,n

00 00 00 .................. 00 00 00

00 00 00 ..................................... 00 00 00

VALID IMAGE HORIZONTAL

BLANKING

VERTICAL BLANKING VERTICAL/HORIZONTAL

BLANKING

Draft 8/ 31/ 2006

PDF: 09005aef824c997f/Source: 09005aef824c998a Micron Technology, Inc., reserves the right to change products or specifications without notice.

MT9T031: 1/2-Inch 3-Mp Digital Image Sensor

Feature Description

Figure 6: Windowing Capabilities

Blanking Control

Registers control the blanking time in a row (called column fill-in or horizontal blanking)

and between frames (vertical blanking). Horizontal blanking is specified in terms of

pixel clocks. Vertical blanking is specified in terms of row readout times.

Frame Time

The user can change the number of columns and rows read out as well as the horizontal

and vertical blanking times to obtain different frame rates.

High Frame Rate Readout Modes

In addition to having the flexibility to read out smaller standard formats, the sensor can

also read out nonstandard formats. This is particularly useful for zooming in on a partic-

ular segment of the image to perform high-speed mathematical calculations (for

example, a high-speed viewfinder or autofocus applications).

Applications with an autofocus mode may require more horizontal than vertical resolu-

tion. That way, the imager can window to the midsection of the array by changing the

row start address and the window height.

The MT9T031change registers can obtain the different frame rates. The imager can also

perform row skip modes to obtain a larger field of view when high-frequency vertical

resolution is not critical.

Size

2048 x 1536

128 x 128

512 x 512

400 x 96

Window A

Window B

Window C

Window D

Window

Draft 8/ 31/ 2006

PDF: 09005aef824c997f/Source: 09005aef824c998a Micron Technology, Inc., reserves the right to change products or specifications without notice.

MT9T031: 1/2-Inch 3-Mp Digital Image Sensor

Feature Description

Pixel Integration Time Control

Sensor integration time can be changed by adjusting the amount of time the pixels are

set to collect charge generated from light. The sensor also supports sub-row integration

time for fine control of pixel integration time.

Note that not all integration times may be desired under certain lighting conditions. If

the light source has a flicker component, then the integration time needs to be set prop-

erly to avoid banding in the image.

Snapshot Mode and Flash Control

Setting Up for Snapshot Mode

There are two important signals used for snapshot mode: TRIGGER and STROBE. The

TRIGGER signal initiates the start of a single-frame capture, and STROBE is an output

pulse that may be used to turn on a flash and/or activate a mechanical shutter.

Triggering a Snapshot

An external trigger signal input allows the snapshot operation to begin after the

TRIGGER pulse moves from a HIGH to LOW state. Alternately, an internal register can

be set through the serial inteface.

Strobe Pulse Output

After the TRIGGER pulse has signaled a snapshot operation, each row of the imager

array is reset in sequence to clear out any accumulated signal. Once each row of the

imager is reset, the STROBE pulse is output from the imager

Global Shutter Release Snapshot Mode

In addition to the standard snapshot mode, the MT9T031 has a global shutter release

mode which may be combined with a mechanical shutter to achieve simultaneous

exposure of all rows in the image. Two global shutter modes are available: programmed

exposure and bulb mode.

Skip and Bin Modes

Row and column skip modes use subsampling to reduce the output resolution without

reducing the field of view. The MT9T031 also has row and column binning modes, which

can reduce the impact of aliasing introduced by the use of skip modes. Both 2X and 3X

binning modes are supported. Rows and columns can be binned independently.

Smaller Format Resolution

With the flexible windowing capability of the sensor, the user is able to read out different

resolution formats from default of QXGA to UXGA, SXGA, XGA, SVGA, VGA, CIF, QVGA,

QCIF, and so on.

Draft 8/ 31/ 2006

PDF: 09005aef824c997f/Source: 09005aef824c998a Micron Technology, Inc., reserves the right to change products or specifications without notice.

MT9T031: 1/2-Inch 3-Mp Digital Image Sensor

Feature Description

Signal Path

The MT9T031 sensor analog signal path consists of the pixel array, the column sample

and hold (S/H) circuitry, the programmable gain stage, the analog offset correction, and

the analog-to-digital converter (ADC).

The reset and signal voltages from the pixel are sampled onto the column sample and

hold circuitry by row. After signal sampling is complete, the differential signal

(reset - signal) is transferred to the programmable gain stage.

After the gain stage, the differential signal goes through the analog offset correction

circuitry. The user can decide if a positive or negative offset or no offset needs to be

added to the differential signal. The signal is then sampled onto the sample and hold

circuitry of the ADC before being converted to a digital signal.

Figure 7: Signal Path

Gain Settings

The analog programmable gain stage consists of two stages of gain that operate in a

pipelined manner. The first stage has programmable gain of 1 or 2 while the second

stage has programmable gain of 1 to 4 with steps of 0.125, for a maximum analog gain of

8. The gain settings can be adjusted independently for the colors of green1, blue, red,

and green2.

Black Level Calibration

The digital black level of the MT9T031 sensor potentially varies with temperature or gain

setting changes. The MT9T031 sensor enables the flexibility of automatic black level

calibration or manual black level control.

Manual Black Level Calibration

The programmable analog offset stage corrects for analog offset that might be present in

the analog signal. The analog offset settings can be independently adjusted for the

colors of green1, green2, red, and blue.

Black Level

Digital offset is applied such that the average black level of a frame in a resulting image

equals the value of this register. This adjustment happens after black-level calibration.

Pixel Voltage

Analog Offset

(color-wise)

10-bit ADC

Digital Gain

(color-wise)

Analog Gain

(color-wise)

DOUT[9:0]

Digital Offset

(color-wise)

Black Level

Calibration

Draft 8/ 31/ 2006

PDF: 09005aef824c997f/Source: 09005aef824c998a Micron Technology, Inc., reserves the right to change products or specifications without notice.

MT9T031: 1/2-Inch 3-Mp Digital Image Sensor

Serial Bus Description

Registers are written to and read from the MT9T031 through the two-wire serial inter-

face bus. The MT9T031 is a serial interface slave and is controlled by the serial clock

(SCLK), which is driven by the serial interface master. Data is transferred into and out of

the MT9T031 through the serial data (SDATA) line. Either the slave or master device can

pull the SDATA line down—the serial interface protocol determines which device is

allowed to pull the SDATA line down at any given time.

Sequence

A typical read or write sequence begins with the master sending a start bit. After the start

bit, the master sends the slave device's 8-bit address. The last bit of the address deter-

mines if the request is a read or a write (“0” indicates a write and a “1” indicates a read).

The slave device acknowledges its address by sending an acknowledge bit back to the

master.

If the request was a write, the master then transfers the 8-bit register address to which a

write should take place. The slave sends an acknowledge bit to indicate that the register

address has been received. The master then transfers the data 8 bits at a time, with the

slave sending an acknowledge bit after each 8 bits.

The MT9T031 uses 16-bit data for its internal registers, thus requiring two 8-bit transfers

to write to one register. After 16 bits are transferred, the register address is automatically

incremented so that the next 16 bits are written to the next register address. The master

stops writing by sending a start or stop bit.

A typical read sequence is executed as follows:

1. The master sends the write-node slave address and 8-bit address, just as in the write

request.

2. The master sends a start bit and the read-mode slave address.

3. The master clocks out the register data 8 bits at a time.

4. The master sends an acknowledge bit after each 8-bit transfer.

5. The register address is auto-incremented after every 16 bits transferred.

6. The data transfer is stopped when the master sends a no-acknowledge bit.

Draft 8/ 31/ 2006

PDF: 09005aef824c997f/Source: 09005aef824c998a Micron Technology, Inc., reserves the right to change products or specifications without notice.

MT9T031: 1/2-Inch 3-Mp Digital Image Sensor

Electrical Specifications

Notes: 1. Stresses greater than those listed may cause permanent damage to the device. This is a

stress rating only, and functional operation of the device at these or any other conditions

above those indicated in the operational sections of this specification is not implied. Expo-

sure to absolute maximum rating conditions for extended periods may affect reliability.

2. To keep dark current and shot noise artifacts from impacting image quality, keep operating

temperature at a minimum.

Table 6: DC Electrical Characteristics

fEXTCLK = 48 MHz, VDD = 3.3V, VAA = 3.3V, VAAPIX = 3.3V, TA = 25°C

Symbol Definition Condition Min Typ Max Units

VDD Core digital voltage 33.33.6V

VAA Analog voltage 33.33.6V

VAAPIX Pixel supply voltage 33.33.6V

VIH Input high voltage –1.84 – V

VIL Input low voltage –1.54 – V

IIN Input leakage current No pull-up resistor;

VIN = VDD or DGND

–5 – +5 µA

VOH Output high voltage At specified IOH = 0mA 2.54 2.72 2.82 V

VOL Output low voltage At specified IOL 0.13 0.19 0.3 V

IOH Output high current At specified VOH –11.5mA

IOL Output low current At specified VOL –12.5mA

IOZ Tri-state output leakage current –5µA

IDD Digital operating current 0 lux, 48 MHz –2023.0mA

IAA Analog operating current 0 lux, 48 MHz – 45.0 54.0 mA

IAAPIX Pixel supply current 0 lux, 48 MHz –4.05.0mA

ISTDBYD Digital standby current Input clock disabled, 0 lux –0.22.0µA

ISTDBYA Analog standby current Input clock disabled, 0 lux –0.22.0µA

ISTDBYDA Pixel standby current Input clock disabled, 0 lux –0.11.0µA

Table 7: Absolute Maximum Ratings

Symbol Definition Conditions Min Max Units

VDD_MAX Core digital voltage –0.3 +3.6 V

VAA_MAX Analog voltage –0.3 +3.6 V

VAAPIX_MAX Pixel supply voltage –0.3 +3.6 V

VIN_MAX Input voltage –1.9V

IDD_MAX Digital operating current –29.5μA

IAA_MAX Analog operating current –56.3μA

IAAPIX_MAX Pixel supply current –6.4μA

TOP2Operating temperature Measured at junction 060°C

TST Storage temperature –40 +125 °C

Draft 8/ 31/ 2006

PDF: 09005aef824c997f/Source: 09005aef824c998a Micron Technology, Inc., reserves the right to change products or specifications without notice.

MT9T031: 1/2-Inch 3-Mp Digital Image Sensor

Package Dimensions

Figure 8: 48-Pin PLCC

Notes: 1. All dimensions in millimeters.

SEATING

PLANE

5.588

14.220 ±0.075

6.56

7.11 ±0.05

LID MATERIAL: BOROSILICATE GLASS 0.55 THICKNESS

MOLD COMPOUND: EPOXY NOVOLAC

SUBSTRATE: PLASTIC LAMINATE

11.176

5.588

1.200 ±0.075

0.500 FOR

REFERENCE ONLY

1.050 ±0.075

1.016

TYP

1.016

TYP

11.176

48 1

47X 0.90 1.90

48X 0.50

7.11 ±0.05

6.56

14.220 ±0.075

13.00

CTR

13.00

CTR

LEAD FINISH:

GOLD PLATING,

0.50 MICRONS

MINIMUM THICKNESS

0.078 FOR

REFERENCE ONLY

OPTICAL CENTER

2.25 FOR

REFERENCE

ONLY

7.188 ±0.075

OPTICAL CENTER

0.934 FOR

REFERENCE ONLY

PACKAGE CENTER

6.176 ±0.075

OPTICAL CENTER

OPTICAL

AREA

DIE AND

PACKAGE

CENTER

MAXIMUM ROTATION OF OPTICAL AREA RELATIVE TO PACKAGE EDGES B AND C : 1º

MAXIMUM TILT OF OPTICAL AREA RELATIVE TO SEATING PLANE A : 50 MICRONS

MAXIMUM TILT OF OPTICAL AREA RELATIVE TO TOP OF COVER GLASS D : 50 MICRONS

Draft 8/ 31/ 2006

8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900

prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992

Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of

their respective owners.

This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range

for production devices. Although considered final, these specifications are subject to change, as further product

development and data characterization sometimes occur.

MT9T031: 1/2-Inch 3-Mp Digital Image Sensor

Revision History

PDF: 09005aef824c997f/Source: 09005aef824c998a Micron Technology, Inc., reserves the right to change products or specifications without notice.

Revision History

Rev. A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8/06

•Initial release