GRM1555C1E5R1DA01_ (0402, C0G:EIA, 5.1pF, DC25V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Mar.5,2016,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
(3) Temperature Characteristics
(Public STD Code):C0G(EIA)
g
0.15 to 0.35
(5) Nominal
Capacitance
mark
(4)
Rated
Voltage
Packaging Unit
DC 25 V
Temp. Range
(Ref.Temp.)
(8) Packaging
0±30 ppm/°C
25 to 125 °C
(25 °C)
0.3 min.
(1)-1 L
1.0±0.05
(1)-2 W
0.5±0.05
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
(2) T
e
Chip Monolithic Ceramic Capacitor for General
Specifications and Test
Methods
(Operating
Temp. Range)
Temp. coeff
or Cap. Change
±0.5 pF
(6)
Capacitance
Tolerance
5.1 pF
0.5±0.05
-55 to 125 °C
J
f330mm Reel
PAPER W8P2
50000 pcs./Reel
D
f180mm Reel
PAPER W8P2
10000 pcs./Reel
W
f180mm Reel
PAPER W8P1
20000 pcs./Reel
(1)L/W
Dimensions
(2)T
Dimensions
(3)Temperature
Characteristics
(4)Rated
Voltage
(5)Nominal
Capacitance
(6)Capacitance
Tolerance
(8)Packaging
Code
Control Code
GRM 15 55C 1E 5R1 D A01 D
GRM1555C1E5R1DA01-01 1
1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage
which may be applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage,
VP-P or VO-P, whichever is larger, should be maintained
within the rated voltage range.
2 Appearance No defects or abnormalities. Visual inspection.
3 Dimension Within the specified dimensions. Using calipers. (GRM02 size is based on Microscope)
4 Voltage proof No defects or abnormalities. Measurement Point : Between the terminations
Test Voltage : 300% of the rated voltage
(Temperature compensating type)
250% of the rated voltage
(High dielectric constant type)
Applied Time : 1s to 5 s
Charge/discharge current : 50mA max.
5 Insulation Resistance(I.R.)
C≦ Measurement Point : Between the terminations
C＞ Measurement Voltage : DC Rated Voltage
C:Nominal Capacitance Charging Time : 2 min
Charge/discharge current : 50mA max.
Measurement Temperature : Room Temperature
6 Capacitance Shown in Rated value. Measurement Temperature : Room Temperature
7 Q
30pF and over:Q≧1000
30pF and below:Q≧400+20C
C:Nominal Capacitance(pF)
8
Temperature No bias
Nominal values of the temperature coefficient is shown in Rated value.
The capacitance change should be measured after 5 min
Characteristics at each specified temp. stage.
of Capacitance
But,the Capacitance Change under 25℃ is shown in Table A. In case of applying voltage, the capacitance change should be
measured after 1 min with applying voltage in equilibration of
Capacitance Drift each temp. stage.
Within +/-0.2% or +/-0.05pF Capacitance value as a reference is the value in step 3.
(Whichever is larger.) The capacitance drift is calculated by dividing the differences
between the maximum and minimum measured values in the
step 1,3 and 5 by the cap. value in step 3.
9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3.
of Termination should occur.
Holding Time : 10+/-1s
Applied Direction : In parallel with the test substrate and vertical with
the capacitor side.
Specification
■ Specifications and Test Methods
No
Item
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Type Applied Force(N)
GRM02 1
GRM03 2
GRM15/GRM18 5
GRM21/GRM31/GRM32 10
Step
Temperature(C)
1
Reference Temp.+/-2
2
Min. Operating Temp.+/-3
3
Reference Temp.+/-2
4
Max. Operating Temp.+/-3
5
Reference Temp.+/-2
Capacitance
Frequency
Voltage
C≦1000pF
1.0+/-0.1MHz
0.5 to 5.0Vrms
C＞1000pF
1.0+/-0.1kHz
1.0+/-0.2Vrms
JEMCGS-0015S 2
10 Vibration Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Capacitance Within the specified initial value.
Q Within the specified initial value. Kind of Vibration : A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
Total amplitude : 1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1.
Bending test
Capacitance Within +/-5% or +/-0.5pF
Change (Whichever is larger) Pressurization method : Shown in Fig.2
Flexure : 1mm
Holding Time : 5+/-1s
Soldering Method : Reflow soldering
12 Solderability 95% of the terminations is to be soldered evenly and continuously. Test Method : Solder bath method
Flux Solution of rojin ethanol 25(wt)%
Preheat :
80℃ to 120℃ for 10s to 30s
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
245+/-5℃
Immersion time :
2+/-0.5s
13
Resistance to Appearance No defects or abnormalities. <GRM03 size min.>
Soldering Heat Capacitance Within +/-2.5% or +/- 0.25pF Test Method : Solder bath method
Change (Whichever is larger) Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
270+/-5℃
Q Within the specified initial value.
Immersion time :
10+/-0.5s
Exposure Time : 24+/-2h
I.R. Within the specified initial value. Preheat :
GRM31 size max.: 120℃ to 150℃ for 1 min
GRM32 size : 100℃ to 120℃ for 1 min
Voltage proof No defects.
and 170℃ to 200℃ for 1 min
<GRM02 size only>
Test Method : Reflow soldering (hot plate)
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
270+/-5℃
Reflow Time : 10+/-0.5s
Test Substrate : Glass epoxy PCB
Exposure Time : 24+/-2h
Preheat :
120℃ to 150℃ for 1 min
14
Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Sudden Change Capacitance Within +/-2.5% or+/- 0.25pF
Change (Whichever is larger) Perform the five cycles according to the four heat treatments
shown in the following table.
Q Within the specified initial value.
I.R. Within the specified initial value.
Voltage proof No defects.
Exposure Time : 24+/-2h
Specification
No
Item
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Type Applied Force(N)
GRM02 1
GRM03 2
GRM15/GRM18 5
GRM21/GRM31/GRM32 10
Step
Temp.(C)
Time (min)
1
Min.Operating Temp.+0/-3
30+/-3
2
Room Temp.
2 to 3
3
Max.Operating Temp.+3/-0
30+/-3
4
Room Temp
2 to 3
JEMCGS-0015S 3
15
High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Temperature
High Humidity Capacitance Within +/-7.5% or +/-0.75pF
Test Temperature :
40+/-2℃
(Steady) Change (Whichever is larger)
Test Humidity :
90%RH to 95%RH
Test Time :
500+/-12h
Q 30pF and over:Q≧200 Applied Voltage : DC Rated Voltage
30pF and below :Q≧100+10C/3 Charge/discharge current : 50mA max.
Exposure Time :
24+/-2h
C:Nominal Capacitance(pF)
I.R.
16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Capacitance Within +/-3% or +/-0.3pF Test Temperature : Max. Operating Temp. +/-3℃
Change (Whichever is larger)
Test Time :
1000+/-12h
Applied Voltage : 200% of the rated voltage
Q 30pF and over:Q≧350 Charge/discharge current : 50mA max.
10pF and over Exposure Time : 24+/-2h
30pF and below : Q≧275+5C/2
10pF and below : Q≧200+10C
C:Nominal Capacitance (pF)
I.R.
Specification
No
Item
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Type Applied Force(N)
GRM02 1
GRM03 2
GRM15/GRM18 5
GRM21/GRM31/GRM32 10
Table A
Char.
Capacitance Change from 25C (%)
-55C
-30C
-10C
Max.
Min.
Max.
Min.
Max.
Min.
5C
0.58
-0.24
0.40
-0.17
0.25
-0.11
6C
0.87
-0.48
0.59
-0.33
0.38
-0.21
6P
2.33
0.72
1.61
0.50
1.02
0.32
6R
3.02
1.28
2.08
0.88
1.32
0.56
6S
4.09
2.16
2.81
1.49
1.79
0.95
6T
5.46
3.28
3.75
2.26
2.39
1.44
7U
8.78
5.04
6.04
3.47
3.84
2.21
JEMCGS-0015S 4
Substrate Bending test
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)
Copper foil thickness : 0.035mm
: Solder resist
(Coat with heat resistant resin for solder)
Fig.1 (in mm)
・Test substrate
Kind of Solder : Sn-3.0Ag-0.5Cu
・Test substrate
Pressurization method
Fig.2 (in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)
High Temperature High Humidity(Steady) , Durability
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
・Test substrate
Kind of Solder : Sn-3.0Ag-0.5Cu
・Test substrate
Land Dimensions
Fig.3
Type Applied Force(N)
GRM02 1
GRM03 2
GRM15/GRM18 5
GRM21/GRM31/GRM32 10
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
100
40
a
c
b
Land
f4.5
c
Type
Dimension (mm)
a
b
c
GRM02
0.2
0.56
0.23
GRM03
0.3
0.9
0.3
GRM15
0.4
1.5
0.5
GRM18
1.0
3.0
1.2
GRM21
1.2
4.0
1.65
GRM31
2.2
5.0
2.0
GRM32
2.2
5.0
2.9
Type
Dimension (mm)
a
b
c
GRM02
0.2
0.56
0.23
GRM03
0.3
0.9
0.3
GRM15
0.4
1.5
0.5
GRM18
1.0
3.0
1.2
GRM21
1.2
4.0
1.65
GRM31
2.2
5.0
2.0
GRM32
2.2
5.0
2.9
c
b
a
Solder Resist
Chip Capacitor
Land
45
45
Flexure:≦1
Capacitance meter
Pressurization
speed
1.0mm/s
Support
Capacitor
Pressurize
45
45
R5
20
50 min.
JEMCGS-0015S 5
1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)
1.1 Minimum Quantity(pcs./reel)
3
5
1.2 Dimensions of Tape
(1)GRM01/02 (W4P1 CODE:L) (in:mm)
1
*3 Nominal value
10000(W8P2)
50000(W8P2)
4000
4000
GRM55
GRM43
F
E
S
M
GRM32
GRM31
GRM21
GRM15
5(LW Dimensions Tolerance:±0.2
and T Dimensions:0.5 +0/-0.1)
5(LWT Dimensions Tolerance:±0.1min.)
5(LWT Dimensions Tolerance:±0.05)
N
C
R/D/E
GRM01
GRM02
2
3/X
5 (LW Dimensions Tolerance:±0.1min.
and T Dimensions Tolerance:±0.05)
GRM03
2
GRM18
6
9
A/B
6/9
M/X
10000(W8P2)
10000(W8P2)
10000(W8P2)
4000
M
N/R/D
4000
50000(W4P1)
E
N/C/R/D
C
9
A/M
Package
GRM Type
15000(W8P2)
20000(W8P2)
10000(W8P2)
10000(W8P2)
Paper Tape
Plastic Tape
Paper Tape
Plastic Tape
4000
30000(W8P1)
20000(W8P1)
40000(W4P1)
3000
2000
3000
3000
300
50000(W8P2)
50000(W8P2)
50000(W8P2)
50000(W8P2)
2000
2000
1000
1000
10000
10000
500
1000
1000
500
1000
500
3000
10000
10000
40000(W8P2)
50000(W8P2)
10000
10000
1500
Code:D/E
Code:W
Code:L
Code:J/ F
Code:K
8000
6000
4000
10000
10000
6000
10000
L
Type
1500
5000
4000
5000
4000
2000
W
T
t
0.145
0.27
0.4 max.
0.2±0.02
0.2±0.02
0.23
0.43
0.125±0.013
0.125±0.013
0.4±0.05
0.25±0.013
Type
0.2±0.05
0.2±0.05
0.26
GRM02
GRM01
2
0.4±0.02
15000(W8P2)
50000(W8P2)
0.5 max.
0.46
Dimensions(Chip)
A *3
B *3
t
2.0±0.04
＊2
＊1
φ0.8±0.04
0.9±0.05
4.0±0.05
1.8±0.02
＊1,2：1.0±0.02
0.05以下
Ａ
Ｂ
0.15～0.4
*1,2：1.0±0.02
2.0±0.04
*1
0.9±0.05
4.0±0.05
1.8±0.02
Ａ
Ｂ
t
*2
0.05 max.
φ0.8±0.04
0.15～0.25
JEMCGP-01796E 6
(2)GRM03/15(W8P2 CODE:D/E/J/F)
(in:mm)
L W
T
2 0.2 +0.02/-0.04
0.3±0.03 0.5 max.
0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69
0.3±0.09 0.6 max.
5 0.5±0.05
2 0.2 +0.02/-0.04
X 0.25±0.05
1.0±0.2 0.5±0.2 0.78 1.29
1.0±0.05 0.5±0.05 0.5±0.05
1.0±0.07 0.5±0.07 0.5±0.07
1.0±0.1 0.5±0.1 0.5±0.1 0.70 1.20
1.0±0.15 0.5±0.15 0.5±0.15 0.72 1.25
0.5 +0/-0.1
0.5±0.2
0.5±0.05 *3 Nominal value
(3)GRM033/155(W8P1 CODE:W) (in:mm)
L W
T
0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67
0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69
0.6±0.09 0.3±0.09 0.3±0.09 0.44 0.74 0.6 max.
GRM15 5 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max.
*3 Nominal value
0.5 max.
Dimensions(Chip)
A *3
B *3
t
1.0±0.2
0.5±0.2
0.65
0.78
1.15
1.29
0.74
0.8 max.
0.5±0.05
0.3±0.03
0.65
1.15
Type
Dimensions(Chip)
0.6±0.03
GRM03
3
0.6±0.09
0.3±0.03
0.3±0.09
Package
GRM Type
A *3
B *3
t
0.37
5
0.67
GRM03
3
GRM15
3
1.0±0.05
Type
0.44
*1,2：2.0±0.05
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
*2
0.05 max.
1.0±0.05
4.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
1.0±0.05
JEMCGP-01796E 7
(4)GRM18/21/31/32 (in:mm)
<Paper Tape> <Plastic Tape>
L W
T
1.6±0.1 0.8±0.1 1.05±0.10 1.85±0.10
50.5±0.05
6 0.6 +0/-0.1
7 0.7±0.1
1.6±0.1 0.8±0.1 0.8±0.1
8 1.6±0.15 0.8±0.15 0.8±0.15
1.6±0.2 0.8±0.2 0.8±0.2 1.10±0.10 2.00±0.10
0.6±0.1
0.6 +0/-0.15
0.85±0.05
0.85±0.1
0.85 +0.15/-0.1
0.85 +0/-0.2
2.0±0.15 1.25±0.15
0.85 +0.15/-0.05 1.50±0.20 2.30±0.20
2.0±0.1 1.25±0.1 1.0 +0/-0.2 1.45±0.20 2.25±0.20
2.0±0.2 1.25±0.2 1.0±0.2 1.50±0.20 2.30±0.20
2.0±0.1 1.25±0.1 1.25±0.1 1.45±0.20 2.25±0.20
B 2.0±0.15 1.25±0.15 1.25±0.15
2.0±0.2 1.25±0.2 1.25±0.2
6 0.6±0.1
3.2±0.2 1.6±0.2
B 1.25±0.1
1.15±0.1
1.15±0.15
X 1.2±0.1
1.6±0.2
3.2±0.3 1.6±0.3 1.6±0.3 2.10±0.20 3.60±0.20
9 0.85 +0.15/-0.05 2.80±0.20 3.60±0.20 1.15 max.
Paper Tape
A 1.0 +0/-0.2
M 1.15±0.1
N 1.35±0.15
C 1.6±0.2
R 1.8±0.2
D 2.0±0.2
E 2.5±0.2 3.7 max.
Dimensions
of Tape
Package
GRM Type
1.15 max.
2.0±0.1
2.0±0.2
1.25±0.1
0.85±0.1
1.7 max.
Plastic Tape
A
Type
Dimensions(Chip)
A
B
t
1.6±0.2
Plastic Tape
2.5 max.
3.0 max.
M
C
2.5 max.
3.2±0.3
1.6±0.15
1.6±0.2
2.5±0.2
GRM32
2.80±0.20
3.50±0.20
1.7 max.
GRM31
2.00±0.20
3.60±0.20
1.15 max.
0.85±0.1
1.6±0.15
Paper Tape
9
1.90±0.20
3.50±0.20
1.7 max.
Plastic Tape
2.0 max.
1.50±0.20
2.30±0.20
3.2±0.15
3.2±0.15
3.2±0.2
GRM21
6
1.55±0.15
2.30±0.15
9
Paper Tape
1.05±0.10
1.85±0.10
1.25±0.2
0.8±0.2
0.8 max.
0.5 +0/-0.1
GRM18
1.10±0.10
2.00±0.10
4.0±0.1
4.0±0.1
2.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
t
Ａ
Ｂ
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
Ａ
Ｂ
t
2.0±0.1
φ1.5
+0.1
-0
4.0±0.1
0.25±0.1(T≦2.0mm)
0.3±0.1(T：2.5mm)
JEMCGP-01796E 8
(5)GRM43/55 (in:mm)
L W
T
M 1.15±0.1
N 1.35±0.15
R 1.8±0.2
D 2.0±0.2
E 2.5±0.2
S 2.8±0.2 4.7 max.
M 1.15±0.1
N 1.35±0.15
C 1.6±0.2
R 1.8±0.2
D 2.0±0.2
E 2.5±0.2
F 3.2±0.2 4.7 max.
*1 Nominal value
t
3.7 max.
4.5±0.4
3.2±0.3
5.7±0.4
5.0±0.4
GRM55
5.2
6.1
2.5 max.
3.7 max.
Package
GRM Type
GRM43
3.6
4.9
2.5 max.
Type
Dimensions(Chip)
A *1
B *1
φ1.5
+0.1
-0
4.0±0.1
8.0±0.1
φ1.5
+0.2
-0
12.0±0.3
5.5±0.1
1.75±0.1
Ａ
*
2.0±0.1
4.0±0.1
Ｂ
t
*：2.0±0.1
0.3±0.1
JEMCGP-01796E 9
Package
GRM Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
ｗ1
W
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Base Tape : As specified in 1.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
W
w1
GRM01/02
8.0 max.
5±1.5
GRM03/15/18/21/31/32
16.5 max.
10±1.5
GRM43/55
20.5 max.
14±1.5
-3.0
min.
2.0±0.5
Chip
(in:mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
JEMCGP-01796E 10
1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows.
(in:mm)
1.5 Accumulate pitch : 10 of sprocket holes pitch = 20±0.3mm(GRM01/02)
40±0.3mm(GRM03 min.)
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min. (Only a bottom tape existence )
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 2.
There are possibly to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1N to 0.6N* in the direction as shown below.
* GRM01/02/03:0.05N～0.5N
1.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
Package
GRM Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
165～180°
Top tape
JEMCGP-01796E 11
Caution
■Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment
⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment
⑧Disaster prevention / crime prevention equipment ⑨Data-processing equipment
⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.
■Storage and Operation condition
1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.
1-1. Store the capacitors in the following conditions:
Room Temperature of +5℃ to +40℃ and a Relative Humidity of 20% to 70%.
(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere, or high temperature and humidity
conditions during storage may affect solderabi lity and packaging performance.
Therefore, please maintain the s torag e temperature and humidity. Use the product within six months,
as prolonged storage may cause oxidation of the terminations (outer electrodes).
(2) Please confirm solderability before using after six months.
Store the capacitors without opening the o rig inal bag.
Even if the storage period is short, do n ot exceed the specified atmospheric conditions.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen
sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the termin al electrodes and/or the resin/epoxy coatings, the solderability and
electrical performan ce may deteriorate. Do not store capac itors under direct sunlight or in high huimidity
conditions
■Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes. The following actions are recommended in order to ens ure suitable capac itance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
Whe n you us e a high dielectric c on stant type capacitor in a circuit that needs a tight (narrow) capacitance
tolerance (e.g., a time-con stant circuit), pleas e carefully consider the tempe rature characteristics, and
carefully confirm the various charac teri stics in actual u se conditions an d th e actual system.
[Example of Temperature Caracteristics X7R(R7)] [Example of Temperature Characteristics X5R(R6)]
!
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100 125 150
Capacitance Change (%)
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100
Capacitance Change (%)
JEMCGC-2701X 12
2.Measurement of Capacitance
1. Measure capacitance with the voltage and frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.
Please confirm whether a prescribed m easured voltage is impres sed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.
Please consider the AC voltage cha racteristics when selecting a capacitor to be used in a AC circuit.
3.Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.
Whe n AC voltage or pulse voltage is applied, the peak-to-peak voltage shall no t exceed the rated DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.
Typical Voltage Applied to the DC capacitor
DC Voltage DC Voltage+AC AC Voltage Pulse Voltage
(E：Maximum possible applied voltage.)
1-2. Influence of over voltage
Over voltage that is applied to the capacito r m ay result in an electrical s hort circuit caused by the break down
of the internal dielec tric layers .
The time duration until breakdown depends on the ap plied voltage and the ambien t temperature.
4.Type of Applied Voltage and Self-heating Temperature
1.Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the
continuous application of an AC voltage or pulse voltage.
When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit, the AC current
or pulse current will flow into the capacitor; therefore check the self-heating condition.
Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits
of the operating temperature, including the rise in temperature due to self-heating. When the capacitor is
used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.
<Applicable to Rated Voltage of less than 100VDC>
1-1. The load should be contained to the level
such that when measuring at atmospheric
temperature of 25°C, the product's self-heating
remains below 20°C and the surface
temperature of the capac itor in the actual circ uit
remains within the maximum operating
temperature.
Caution
!
1
10
100
0 1 2 3
Current (Ar.m.s.) 4 5 6
Temperature Rise (C)
[Example of Temperature Rise (Heat Generation) in Chip
Monolithic Ceramic Capacitors in Contrast to Ripple Current]
Sample: R(R1) characteristics 10 Rated voltage: DC10V
Ripple Current
100kHz
500kHz
1MHz
E
E
E
E
0
0
0
0
JEMCGC-2701X 13
5. DC Voltage and AC Voltage Characteristic
1. The capacitance value of a high dielectric constant type
capacitor changes depending on the DC voltage applied.
Please consider the DC voltage characteristics when a
capacitor is selected for use in a DC circuit.
1-1. The capacitance of ceramic capacitors may change
sharply depending on the appli ed voltage. (See figure)
Please confirm the fol lowing in order to secure the
capacitance.
(1) Determine whether the capacitance change caused
by the applied voltage is within the allowed range .
(2) In the DC voltage characteristics, the rate of
capacitance c hange becomes larger as voltage
increases, even if the applied voltage is below
the rated voltage. When a high dielectric constant
type capacitor is used in a circuit that requires a
tight (narrow) capacitance tolerance (e.g., a time
constant circuit), pl ease carefully consider the
voltage characteristics, and confirm the various
characteristics in the actual operating conditions
of the system.
2. The capacitance values of high dielectric
constant type capacitors changes depending
on the AC voltage applied.
Please consider the AC voltage characteristics
when selecting a capacitor to be used in a
AC circuit.
6. Capacitance Aging
[ Example of Change Over Time (Aging characteristics) ]
1. The high dielectric constant type capacitors
have an Aging characteristic in which the capacitance
value decreases with the passage of time.
When you use a high dielectric constant type
capacitors in a circuit that needs a tight (narrow)
capacitance tolerance (e.g., a time-constant circuit),
please carefully consider the characteristics
of these capacitors, such as their aging, voltage,
and temperature characteristics. In addition,
check capacitors using your actual appliances
at the intended environment and operating conditions.
7.Vibration and Shock
1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.
Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to being dropped may cause damage or
a crack in the dielectric material of the capacitor.
Do not use a dropped capacitor because the quality and reliability
may be deteriorated.
3. When printed circuit boards are piled up or handled, the corner
of another printed circuit board
should not be allowed to hit the capacitor in order to avoid
a crack or other damage to the capacitor.
Caution
-100
-80
-60
-40
-20
0
20
0 10 20 30
DC Voltage (V) 40 50
[Example of DC Voltage Characteristics]
Sample: X7R(R7) Characteristics
Capacitance Change (%)
0 0.5 1
AC Voltage (Vr.m.s.) 1.5 2
[Example of AC Voltage Characteristics]
Sample: X7R(R7) Characteristics
Capacitance Change (%)
30
20
10
0
-10
-20
-30
-40
-50
-60
Floor
Crack
Mounting printed circuit board
Crack
!
20
10
0
-10
-20
-30
-40
10
100
1000
10000
Time(h)
Capacitance Change(%)
C0G(5C)
X7R(R7)
X5R(R6)
JEMCGC-2701X 14
■Soldering and Mounting
1.Mounting Position
1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing
or bending the printed circuit board.
1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
[Component Direction]
Locate chip horizontal to the
direction in which stress acts.
(Bad Example) (Good Example)
[Chip Mounting Close to Board Separation Point]
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
A > D *1
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from the board separation surface.
A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
[Mounting Capacitors Near Screw Holes]
When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.
2.Information before Mounting
1. Do not re-use capacitors that were removed from the equipment.
2. Confirm capacitance characteristics under actual applied voltage.
3. Confirm the mechanical stress under actual process and equipment use.
4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.
5. Prior to use, confirm the solderability of capacitors that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.
7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.
Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.
Caution
Contents of Measures
Screw Hole Recommended
!
①
②
③
1C
1B
1A
Perforation
Slit
A
B
C
D
①
1A
JEMCGC-2701X 15
3.Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not applied to the capacitors.
1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept
to a minimum to prevent them from any damage or cracking. Please take into acc ou nt the following precautions
and recommendatio ns for use in your process.
(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.
(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.
[Incorrect]
[Correct]
2.Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent
the nozzle from moving smoothly. This imposes greater force upon the chip during mounting,
causing cracked chips. Also, the locating claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained,
checked and replaced periodically.
Caution
!
Board Guide
Board
Suction Nozzle
Deflection
Support Pin
JEMCGC-2701X 16
4-1.Reflow Soldering
1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering]
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
2. Solderability of tin plating termination chips might be
deteriorated when a low temperature soldering profile where
the peak solder temperature is below the melting point of
tin is used. Please confirm the solderability of tin plated
termination chips before use.
3. When components are immersed in solvent after mounting,
between the component and the solvent within the range [Allowable Reflow Soldering Temperature and Time]
shown in the table 1.
Table 1
Series
GRM
GRM
In the case of repeated soldering, the accumulated
Recommended Conditions
soldering time must be within the range shown above.
Lead Free Solder: Sn-3.0Ag-0.5Cu
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in a excessive solder fillet height.
This makes the chip m ore susceptible to mechanical and th ermal stress on the bo ard a nd may cause the chips to crack.
4-2. Too little solder paste results in a lack of adhesive strength on the termination, which may result in chips breaking loose
from the PCB.
4-3. Please confirm that solder has been applied smoothly to the termination.
Make sure not to impose any abnormal mechanical shocks to the PCB.
Caution
Lead Free Solder
Peak Temperature
Air or N2
Atmosphere
≦130℃
Temperature Differential
Inverting the PCB
240 to 260℃
Chip Dimension(L/W) Code
01/02/03/15/18/21/31
32/43/55
≦190℃
!
Temperature(℃)
Peak Temperature
Soldering
Gradual
Cooling
Preheating
ΔT
60-120 seconds
30-60 seconds
Time
190℃
170℃
150℃
220℃
Soldering Temperature(℃)
Soldering Time(s)
280
270
260
250
240
230
220
0
30
60
120
90
JEMCGC-2701X 17
4-2.Flow Soldering
1. Do not apply flow soldering to chips not listed in Table 2.
[Standard Conditions for Flow Soldering]
Table 2
Series
GRM
2. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both of the components and the PCB.
Preheating conditions are shown in table 2. It is required to
[Allowable Flow Soldering Temperature and Time]
keep the temperature differential between the solder and
3. Excessively long soldering time or high soldering
temperature can result in leaching of the terminations,
causing poor adhesion or a reduction in capacitance value
due to loss of contact between the inner electrodes and terminations.
4. When components are immersed in solvent after mounting,
between the component and solvent within the range
shown in the table 2. In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Recommended Conditions
Lead Free Solder: Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the
thickness of the components. If the s older amount is
excessive, the risk of cracking is higher during
board bending or any other stressful condition.
Atmosphere
100 to 120℃
250 to 260℃
Air or N2
Caution
Lead Free Solder
Preheating Peak Temperature
Soldering Peak Temperature
Chip Dimension(L/W) Code
18/21/31
≦150℃
Temperature Differential
!
Soldering mperature(℃)
Soldering Time(s)
280
270
260
250
240
230
220
0
10
20
40
30
Temperature(℃)
Soldering
Peak
Temperature
Preheating
Peak
Temperature
30-90 seconds
Preheating
5 seconds max.
Time
Gradual
Cooling
Soldering
ΔT
Up to Chip Thickness
Adhesive
in section
JEMCGC-2701X 18
4-3.Correction of Soldered Portion
When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs internally,
and can be the cause of cracks. Capacitors also tend to be affected by mechanical and thermal stress depending
on the board preheating temperature or the soldering fillet shape, and can be the cause of cracks.
Please refer to "1. PCB Design" or "3. Optimum solder amount" for the solder amount and the fillet shapes.
1. Correction with a Soldering Iron
1-1. In order to reduce damage to the capacitor, be sure to preheat the capacitor and the mounting board.
Preheat to the temperature range sho wn in Table 3. A hot plate, hot air type preheater, etc. can be used for preheating.
1-2. After soldering, do not allow the component/PCB to cool down rapidly.
1-3. Perform the corrections with a soldering iron as quickly as possible. If the soldering iron is applied too long,
there is a possibility of causing solder le aching on the terminal electrodes, which will cause deterioration of the
adhesive strength and other problems.
Table 3
Lead Free Solder: Sn-3.0Ag-0.5Cu
2. Correction with Spot Heater
Compared to local heating with a soldering iron, hot air heating by a spot heater heats the overall component
and board, therefore, it tends to lessen the thermal shock. In the case of a high density mounted board,
a spot heater can also prevent concerns of the soldering iron making direct contact with the component.
2-1. If the distance from the hot air outlet of the spot heater to the component is too close, cracks may occur due to
thermal shock. To prevent this problem , follow the conditions shown in Table 4.
2-2. In order to create an appropriate solder fillet shape, it is recommended that hot air be applied at the angle shown
in Figure 1.
Table 4
Distance 5mm or more
Hot Air Application angle 45° *Figure 1
Hot Air Temperature Nozzle Outlet 400°C max.
Less than 10 seconds
Application Time (3216M / 1206 size or smaller)
Less than 30 seconds
(3225M / 1210 size or larger) (3216M , 3225M : Metric size code)
3. Optimum solder amount when re-working with a soldering iron
3-1. If the solder amount is excessive, the risk of cracking is higher
during board bending or any other stressful condition.
Too little solder amount results in a lack of adhesive strength
on the termination, which may result in chips breaking
loose from the PCB.
Please confirm that s older has been applie d smoothly is in section
and rising to the end s urface of the chip.
3-2. A soldering iron with a tip of ø3mm or smaller should be used.
It is also neces sary to keep the soldering iron from touching
the components du rin g th e re-work.
3-3. Solder wire with ø0.5mm or smaller is required for soldering.
Series
GRM
GRM
03/15/18/21/31
Caution
32/43/55
Preheating
Temperature
Temperature
Chip Dimension
(L/W) Code
Temperature of
Soldering Iron Tip
Atmosphere
350℃ max.
150℃ min.
≦190℃
Air
Air
150℃ min.
280℃ max.
≦130℃
!
One-hole Nozzle
an Angle of 45
[Figure 1]
Solder Amount
JEMCGC-2701X 19
5.Washing
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips
or broken solder joints. Take note not to vibrate PCBs.
6.Electrical Test on Printed Circuit Board
1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a
capacitor after mounting on the printed circuit board.
1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc.
The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder
joints. Provide support pins on the back side of the PCB to prevent warping or flexing.
Install support pins as close to the test-probe as possib le.
1-2. Avoid vibration of the board by shock when a test -probe contacts a printed circuit board.
[Not Recommended] [Recommended]
7.Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that
caused bending or twisting the board.
1-1. In cropping the board, the stress as shown may cause the capacitor to crack.
Cracked capacitors may cause deterioration of the insulation resistance, and result in a short.
Avoid this type of stress to a capacitor.
[Bending] [Twisting]
2. Check the cropping method for the printed circuit board in advance.
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disc separator, router
type separator, etc.) to prevent the mechanic al stress that can occur to the board.
* When a board separation jig or disc separator is used, if the following precautions are not observed,
a large board deflection stress will occur and the capacitors may crack.
Use router type separator if at all possible.
Caution
High
Medium
Medium
Notes
Hand and nipper
separation apply a high
level of stress.
Use another method.
· Board handling
· Board bending direction
· Layout of capacitors
· Board handling
· Layout of slits
· Design of V groove
· Arrangement of blades
· Controlling blade life
Board handling
Recommended
Low
Level of stress on board
×
△*
△*
◯
Board Separation Method
Hand Separation
Nipper Separation
(1) Board Separation Jig
Board Separation Apparatus
2) Disc Separator
3) Router Type Separator
!
Peeling
Test-probe
Support Pin
Test-probe
①
1A
JEMCGC-2701X 20
(1) Example of a suitable jig
[In the case of Single-side Mounting]
An outline of the board separation jig is shown as follows.
Recommended example: Stress on the component mounting position can be minimized by holding the
portion close to the ji g, and bend in the direction towards the side where the capacitors are mounted.
Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress
being applied to the c omponent mounting position, if the portion away from the jig is held an d bent in the
direction opposite the side where the capacitors are mounte d.
[Outline of jig] [Hand Separation]
[In the case of Double-sid ed Mounting]
Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the
above method. Therefore, implement the following measures to prevent stress from being applied to the components.
(Measures)
(1) Consider introducing a router type separator.
If it is difficult to introduce a router type separator, implement the following measures.
(Refer to item 1. Mounting Position)
(2) Mount the components parallel to the board separation surface.
(3) When mounting components near the board separation point, add slits in the separation position
near the component.
(4) Keep the mounting position of the components away from the board separation point.
(2) Example of a Disc Separator
An outline of a disc s eparator is shown as follows. As shown in the Principle of Operation, the top
blade and bottom blad e are aligned with the V-grooves on the printed circuit board to separate the board.
In the following case, board deflec tion stress will be applied and c ause cracks in the capacitors.
(1) When the adjustment of the top and bottom blades are misaligned, s uch as deviating in the top-bottom,
left-right or front-rear directions
(2) The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligne d
top-bottom
IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth o f the
V groove with consideration about strength of materia l of the printed circuit bo ard.
[ Outline of Machine ] [ Principle of Operation ] [ Cross-section Diagram ]
[Disc Separator]
Top Blade Top Blade Top Blade Top Blade
Bottom Blade Bottom Blade Bottom Blade Bottom Blade
[V-groove Design]
Not recommended
Recommended
Top-bottom Misalignment
Left-right Misalignment
Front-rear Misalignment
Caution
Recommended
Not recommended
Depth too Shallow
Depth too Deep
Example of
Recommended
V-groove Design
Not Recommended
Left-right Misalignment
Low-Angle
Printed Circuit Board
Top Blade
V-groove Bottom Blade
Top Blade Printed Circuit Board
V-groove
!
Board Cropping Jig
V-groove
Printed Circuit Board
Printed circuit
board
Components
Load point
Direction of
load
Printed circuit
board
Component
s
Load point
Direction of load
JEMCGC-2701X 21
(3) Example of Router Type Separator
The router type separator performs cutting by a router
rotating at a high speed. Since the board does not
bend in the cutting process, stress on the board can
be suppressed during board separation.
When attaching or removing boards to/from the router type
separator, carefully handle the boards to prevent bending.
8. Assembly
1. Handling
If a board mounted with capacitors is held with one hand, the board may bend.
Firmly hold the edges of the board with both hands when handling.
If a board mounted with capacitors is dropped, cracks may occur in the capacito rs .
Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired.
2. Attachment of Other Components
2-1. Mounting of Other Components
Pay attention to the following items, when mounting other com ponents on the back side of the board after
capacitors have been mou nte d on the opposite sid e.
Whe n th e bottom dead point of the suction nozzle is set too low, board deflection stress may be applied
to the capacitors on the back side (bottom side), and cracks may occur in the capac itors.
· After the board is straightened, s et the bottom dead point of th e n ozzle on the upper s urface of the board.
· Periodically check and adjust the bottom dead po int.
2-2. Inserting Components with Leads into Boards
Whe n inserting compone nts (transformers, IC, etc.) into boards, bending the board may caus e cracks in the
capacitors or cracks in the solder. Pay attention to the following.
· Increase the size of the holes to insert the leads, to red uce the stress on the board during insertion.
· Fix the board with support pins or a dedicated jig be fore insertion.
· Support below the board so that the board does not bend. When using multiple support pins on the board,
periodically confirm that the re i s no difference in the height of each support pi n.
2-3. Attaching/Removing Sockets
Whe n th e board itself is a con nector, the board may bend when a socket is atta ched or removed.
Plan the work so that the board does not bend when a socket is attached or removed.
2-4. Tightening Screws
The board may be bent, when tightening screws, etc. during the attachmen t of the board to a shield or
chassis. Pay attention to the fo llowing items before performing the work.
· Plan the work to prevent the board from bending.
· Use a torque screwdriver, to prevent over-tightening of the screws.
· The board may bend after mounting by reflow soldering, etc. Please note, as stress may be applied
to the chips by forcibly flattening th e b oard when tightening the screws.
Caution
!
Suction Nozzle
Component with Leads
Socket
Screwdriver
[ Outline Drawing ] Router
JEMCGC-2701X 22
■ Others
1. Under Operation of Equipment
1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock.
1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit).
Do not expose a capacitor to a conductive liqui d, inducing any acid or alkali solutions.
1-3. Confirm the environment in which the equipment will operate is under the specified conditions.
Do not use the equipment un der the following environments.
(1) Being spattered with water or oil.
(2) Being exposed to direct sunlight.
(3) Being exposed to ozone, ultraviolet rays, or radiation.
(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.)
(5) Any vibrations or mechanical shoc ks exceeding the specified limits.
(6) Moisture condensing environments.
1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.
2. Others
2-1. In an Emergency
(1) If the equipment should generate smoke, fire, or smell, immediately turn off or unplug the equipment.
If the equipment is no t turne d off or unplugged, the hazards may be worsened by supplying continuo us power.
(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be caused
by the capacitor's high temperature.
2-2. Disposal of waste
When capacitors are disposed of, they must be burned or buried by an industrial waste vendor with the appropriate
licenses.
2-3. Circuit Design
(1) Addition of Fail Safe Function
Capacitors that are crack ed by dropping or bending of the board may cause deterioration of the
insulation resis tance, and result in a short. If the circuit being u sed may cause an elec trical shock,
smoke or fire when a capacitor is shorted, be sure to install fail-safe functions, such as a fuse,
to prevent secondary accidents.
(2) This series are not safety standard certified products.
2-4. Remarks
Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product is used.
The above notices are for standard applications and conditions. Contact us when the products are used in special
mounting conditions.
Select optimum conditions for operation as they determine the reliability of the product after assembly.
The data herein are given in typical values, not guaranteed ratings.
Caution
!
JEMCGC-2701X 23
■ Rating
1.Operating Temperature
1. The operating temperature limit depends on the capacitor.
1-1. Do not apply temperatures exceeding the maximum operating temperature.
It is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range .
It is also neces sary to consider the temperature d istribution in equipm ent and the seasonal temperature variable
factor.
1-2. Consider the self-heating factor of the capacitor
The surface temperature of the capacitor shall not exceed the maximum operating temperature including self-hea ting.
2.Atmosphere Surroundings (gaseous and liquid)
1. Restriction on the operating environment of capacitors.
1-1. Capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the corrosion
of the terminations and th e penetration of moisture into the capacitor.
1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject
to moisture condensation.
1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of terminal
electrodes may result in breakdown when the capacitor is exposed to corrosive or volatile gases or solvents
for long periods of time.
3.Piezo-electric Phenomenon
1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates
at specific frequencies and noise may be generated.
Moreover, when the mechanical vibration or shock is added to capacitor, noise may occur.
Notice
JEMCGC-2701X 24
■Soldering and Mounting
1.PCB Design
1. Notice for Pattern Forms
1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted
directly on the substrate.
They are also more sensitive to mechanic al and thermal stress es than leaded com po nents.
Excess solder fillet height can m ultiply these stresses and cause chip cracking.
Whe n d esigning substrates, take land patterns and dimensions into consideration to eliminate the possibility
of excess solder fillet height.
1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress
on a chip is differen t de pending on PCB material and structure.When the thermal expansion coefficient
greatly differs between the board used for mounting an d the chip,it will cause cracking of the chip due to
the thermal expansion and contraction. When c ap acitors are mounted on a fluorine resin printed circuit
board or on a single-layered glas s epoxy board, it may also cause cracking of the chip for the same reason.
Pattern Forms
in section in section
in section in section
in section in section
Notice
Placing of Leaded
Components
after Chip Component
Lateral Mounting
Prohibited
Correct
Placing Close to Chassis
Placing of Chip
Components
and Leaded
Components
Chassis
Solder (ground)
Electrode Pattern
Solder Resist
Lead Wire
Solder Resist
Lead Wire
Soldering Iron
Solder Resist
ｿﾙﾀﾞﾚｼﾞｽﾄ
Solder Resist
JEMCGC-2701X 25
2. Land Dimensions
2-1. Chip capacitors can be cracked due to the stress
of PCB bending , etc. if the land area is larger than
needed and has an excess amount of solder.
Please refer to the land dim en sions in table 1
for flow soldering, table 2 for reflow soldering.
Please confirm the s uitable land dimension by
evaluating of the actual SET / PCB.
Table 1 Flow Soldering Method
Flow soldering can only be used for products with a chip size of 1.6x0.8mm to 3.2x1.6mm.
(in mm)
Table 2 Reflow Soldering Method
1.0×0.5
(within ±0.10)
1.0×0.5
（±0.15/±0.20）
1.6×0.8
(within ±0.10)
1.6×0.8
(±0.15/±0.20)
2.0×1.25
(within ±0.10)
2.0×1.25
(±0.15)
2.0×1.25
(±0.20)
3.2×1.6
(within±0.20)
3.2×1.6
(±0.30)
(in mm)
GRM
01
0.25×0.125
0.10 to 0.11
0.07 to 0.12
0.4 to 0.6
GRM
31
3.2×1.6
2.2 to 2.6
GRM
02
0.4×0.2
0.16 to 0.2
Notice
Chip Dimension
(L/W) Code
Chip(L×W)
a
b
0.6 to 1.0
GRM
0.8 to 0.9
18
1.6×0.8
b
21
2.0×1.25
GRM
Chip(L×W)
(Dimensions
Tolerance)
Chip Dimension
(L/W) Code
1.0 to 1.2
0.9 to 1.0
1.0 to 1.1
a
0.12 to 0.18
GRM
03
0.6×0.3
1.2
0.6
GRM
1.0 to 1.4
0.2 to 0.3
0.2 to 0.35
1.0 to 1.3
1.2
0.6 to 0.8
0.35 to 0.45
0.4 to 0.5
0.6 to 0.8
0.6 to 0.7
0.7 to 0.9
0.7 to 0.8
0.3 to 0.5
GRM
32
3.2×2.5
2.0 to 2.4
1.0 to 1.2
43
3.0 to 3.5
1.2 to 1.4
55
5.7×5.0
4.5×3.2
4.0 to 4.6
1.4 to 1.6
GRM
GRM
GRM
GRM
GRM
0.6 to 0.8
1.8 to 2.0
0.9 to 1.2
1.9 to 2.1
Series
c
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
0.4 to 0.6
0.6 to 0.8
0.8 to 1.0
1.25
1.2 to 1.4
1.2 to 1.4
Series
c
0.125 to 0.145
0.2 to 0.23
0.2 to 0.4
1.5 to 1.7
1.7 to 1.9
1.8 to 2.3
2.3 to 3.0
3.5 to 4.8
15
18
21
31
0.5 to 0.7
c
b
a
Solder Resist
Chip Capacitor
Land
JEMCGC-2701X 26
3. Board Design
When designing the board, keep in mind that the amount of strain which occurs will increase depending on the size
and material of the board.
2.Adhesive Application
1. Thin or insufficient adhesive can cause the chips to loosen or become disconnected during flow soldering.
The amount of adhesive must be more than dimension c, shown in the drawing at right, to obtain the correct bonding
strength. The chip's electrode thickness and land thickness must also be taken into consideration.
2. Low viscosity adhesive can cause chips to slip after mounting. The adhesive must have a viscosity of
℃)
3. Adhesive Coverage
Size (L×W) (in mm) Adhesive Coverage*
1.6 × 0.8 0.05mg min.
2.0 × 1.25 0.1mg min.
3.2 × 1.6 0.15mg min.
*Nominal Value
3.Adhesive Curing
1. Insufficient curing of the adhesive can cause chips to disconnect during flow soldering and causes
deterioration in the insulation resistance between the terminations due to moisture absorption.
Control curing temperature and time in order to prevent insufficient hardening.
4.Flux (for Flow soldering)
1. An excessive amount of flux generates a large quantity of flux gas, which can cause a deterioration of solderability,
so apply flux thinly and evenly throughout. (A foaming system is generally used for flow solderring.)
2. Flux containing too high a percentage of halide may cause corrosion of the terminations unless there is
sufficient cleaning. Use flux with a halide content of 0.1% max.
3. Do not use strong acidic flux.
4. Do not use water-soluble flux.*
(*Water-soluble flux can be defined as non-rosin type flux including wash-type flux and non-wash-type flux.)
Notice
Land
Adhesive
Board
Chip Capacitor a
b c a=20 to
b=30 to
c=50 to 105m
Relationship with amount of strain to the board thickness, length, width, etc.]
3PL
2Ewh2
Relationship between load and strain
When the load is constant, the following relationship can be established.
· As the distance between the supporting points (L) increases,the amount of strain also increases.
uce the distance between the supporting points.
· As the elastic modulus (E) decreases, the amount of strain increases.
· As the board width (w) decreases, the amount of strain increases.
· As the board thickness (h) decreases, the amount of strain increases.
Since the board thickness is squared, the effect on the amount of strain becomes even greater.
：Strain on center of board (st)
L：Distance between supporting points (mm)
w ：Board width (mm)
h ：Board thickness (mm)
E ：Elastic modulus of board (N/m2=Pa)
Y ：Deflection (mm)
P ：Load (N)
Y
P
h
w
L
JEMCGC-2701X 27
5.Flow Soldering
Set temperature and time to ensure that leaching of the
terminations does not exceed 25% of the chip end
area as a single chip (full length of the edge A-B-C-D
shown at right) and 25% of the length A-B shown as
mounted on substrate.
6.Reflow soldering
The halogen system substance and organic acid are included in solder paste, and a chip corrodes
by this kind of solder paste.
Do not use strong acid flux.
Do not use water-soluble flux.*
(*Water-soluble flux can be defined as non-rosin type flux including wash-type flux and non-wash-type flux.)
7.Washing
1. Please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality,
and select the solvent for cleaning.
2. Unsuitable cleaning solvent may leave residual flux or other foreign substances, causing deterioration of
electrical characteristics and the reliability of the capacitors.
3. Select the proper cleaning conditions.
3-1. Improper cleaning conditions (excessive or insufficient) may result in the deterioration of the performance
of the capacitors.
8.Coating
1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during curing process.
The stress is affected by the amount of resin and curing contraction. Select a resin with low curing contraction.
The difference in the thermal expansion coefficient between a coating resin or a molding resin and the capacitor
may cause the destruction and deterioration of the capacitor such as a crack or peeling, and lead to the deterioration
of insulation resistance or dielectric breakdown.
Select a resin for which the thermal expansion coefficient is as close to that of the capacitor as possible.
A silicone resin can be used as an under-coating to buffer against the stress.
2. Select a resin that is less hygroscopic.
Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resistance
of a capacitor. An epoxy resin can be used as a less hygroscopic resin.
3．The halogen system substance and organic acid are included in coating material, and a chip corrodes
by the kind of Coating material. Do not use strong acid type.
Notice
A
B
D
C
Termination
［As a Single Chip］
［As Mounted on Substrate］
A
B
JEMCGC-2701X 28
■ Others
1.Transportation
1. The performance of a capacitor may be affected by the conditions during transportation.
1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force during transportation.
(1) Climatic condition
･ low air temperature : -40℃
･ change of temperature air/air : -25℃/+25℃
･ low air pressure : 30 kPa
･ change of air pressure : 6 kPa/min.
(2) Mechanical condition
Transportation shall be done in s uch a way that the boxes are not deformed and forces are not direc tly passed
on to the inner packaging.
1-2. Do not apply excessive vibration, shock, or pressure to the capacitor.
(1) When excessive mechanical shock or pressure is applie d to a capacitor, chipping or cracking may occ ur
in the ceramic body of the c ap acitor.
(2) When the sharp edge of an air driver, a solde rin g iron, tweezers, a chassis, etc. impac ts strongly on the surface
of the capacitor, the c ap acitor may crack and sho rt-circuit.
1-3. Do not use a capacitor to which excessive shock was applied by dropping etc.
A capacitor dropped accidentally during processing may be damaged.
2.Characteristics Evaluation in the Actual System
1. Evaluate the capacitor in the actual system,to confirm that there is no problem with the performance and specification
values in a finished product before using.
2. Since a voltage dependency and temperature dependency exists in the capacitance of high dielectric type ceramic
capacitors, the capacitance may change depending on the operating conditions in the actual system.
Therefore,be sure to evaluate the various characteristics, such as the leakage current and noise absorptivity,
which will affect the capacitance value of the capacitor.
3. In addition,voltages exceeding the predetermined surge may be applied to the capacitor by the inductance in
the actual system. Evaluate the surge resistance in the actual system as required.
Notice
JEMCGC-2701X 29
NOTE
1.Please make sure that your product has been evaluated in view of your specifications with our
product being mounted to your product.
2.Your are requested not to use our product deviating from this product specification.
3.We consider it not appropriate to include any terms and conditions with regard to the business
transaction in the product specifications, drawings or other technical documents. Therefore,
if your technical documents as above include such terms and conditions such as warranty clause,
product liability clause, or intellectual property infringement liability clause, they will be deemed to
be invalid.
!
JEMCGC-2701X 30
