SN54AC574, SN74AC574 OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS WITH 3-STATE OUTPUTS SCAS541E - OCTOBER 1995 - REVISED OCTOBER 2003 SN54AC574 . . . J OR W PACKAGE SN74AC574 . . . DB, DW, N, NS, OR PW PACKAGE (TOP VIEW) 2-V to 6-V VCC Operation Inputs Accept Voltages to 6 V Max tpd of 8.5 ns at 5 V 3-State Outputs Drive Bus Lines Directly OE 1D 2D 3D 4D 5D 6D 7D 8D GND description/ordering information These 8-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. The devices are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. The eight flip-flops of the AC574 devices are D-type edge-triggered flip-flops. On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 1Q 2Q 3Q 4Q 5Q 6Q 7Q 8Q CLK 2D 1D OE VCC SN54AC574 . . . FK PACKAGE (TOP VIEW) A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines in a bus-organized system without need for interface or pullup components. 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 2Q 3Q 4Q 5Q 6Q 8D GND CLK 8Q 7Q 3D 4D 5D 6D 7D 1Q D D D D OE does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. ORDERING INFORMATION PDIP - N SN74AC574N Tube SN74AC574DW Tape and reel SN74AC574DWR SOP - NS Tape and reel SN74AC574NSR AC574 SSOP - DB Tape and reel SN74AC574DBR AC574 Tube SN74AC574PW Tape and reel SN74AC574PWR CDIP - J Tube SNJ54AC574J SNJ54AC574J CFP - W Tube SNJ54AC574W SNJ54AC574W LCCC - FK Tube SNJ54AC574FK SNJ54AC574FK TSSOP - PW -55C 55 C to 125 125C C TOP-SIDE MARKING Tube SOIC - DW -40C 40 C to 85C 85 C ORDERABLE PART NUMBER PACKAGE TA SN74AC574N AC574 AC574 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright (c) 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SN54AC574, SN74AC574 OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS WITH 3-STATE OUTPUTS SCAS541E - OCTOBER 1995 - REVISED OCTOBER 2003 description/ordering information (continued) To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. FUNCTION TABLE (each flip-flop) INPUTS OE CLK D OUTPUT Q L H H L L L L H or L X Q0 H X X Z logic diagram (positive logic) OE CLK 1 11 C1 1D 2 19 1Q 1D To Seven Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to VCC + 0.5 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mA Package thermal impedance, JA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN54AC574, SN74AC574 OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS WITH 3-STATE OUTPUTS SCAS541E - OCTOBER 1995 - REVISED OCTOBER 2003 recommended operating conditions (see Note 3) VCC Supply voltage VCC = 3 V VIH High-level High level input voltage VIL Low-level Low level input voltage VI Input voltage VO Output voltage IOH High-level High level output current IOL Low-level Low level output current t/v Input transition rise or fall rate TA Operating free-air temperature SN54AC574 SN74AC574 MIN MAX MIN MAX 2 6 2 6 2.1 2.1 VCC = 4.5 V 3.15 3.15 VCC = 5.5 V 3.85 3.85 UNIT V V VCC = 3 V 0.9 0.9 VCC = 4.5V 1.35 1.35 VCC = 5.5 V 1.65 1.65 V 0 VCC 0 VCC V 0 VCC 0 VCC V VCC = 3 V -12 -12 VCC = 4.5 V -24 -24 VCC = 5.5 V -24 -24 VCC = 3 V 12 12 VCC = 4.5 V 24 24 VCC = 5.5 V 24 24 8 8 ns/V 85 C -55 125 -40 mA mA NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC IOH = -50 50 A VOH IOH = -12 mA IOH = -24 24 mA IOL = 50 A VOL IOL = 12 mA IOL = 24 mA TA = 25C MIN TYP MAX SN54AC574 SN74AC574 MIN MIN MAX 3V 2.9 2.9 2.9 4.5 V 4.4 4.4 4.4 5.5 V 5.4 5.4 5.4 3V 2.56 2.4 2.46 4.5 V 3.94 3.7 3.76 5.5 V 4.94 4.7 4.76 MAX UNIT V 3V 0.1 0.1 0.1 4.5 V 0.1 0.1 0.1 5.5 V 0.1 0.1 0.1 3V 0.36 0.5 0.44 4.5 V 0.36 0.5 0.44 5.5 V 0.36 0.5 0.44 V II VI = VCC or GND 5.5 V 0.1 1 1 A IOZ VO = VCC or GND 5.5 V 0.5 5 2.5 A ICC VI = VCC or GND, 4 80 40 A Ci VI = VCC or GND IO = 0 5.5 V 5V POST OFFICE BOX 655303 4.5 * DALLAS, TEXAS 75265 pF 3 SN54AC574, SN74AC574 OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS WITH 3-STATE OUTPUTS SCAS541E - OCTOBER 1995 - REVISED OCTOBER 2003 timing requirements over recommended operating free-air temperature range, VCC = 3.3 V 0.3 V (unless otherwise noted) (see Figure 1) TA = 25C MIN fclock Clock frequency tw Pulse duration, CLK high or low tsu th SN54AC574 MAX MIN SN74AC574 MAX 75 MIN UNIT MAX 55 60 MHz 6 7.5 7 ns Setup time, data before CLK 2.5 6.5 3 ns Hold time, data after CLK 1.5 2.5 1.5 ns timing requirements over recommended operating free-air temperature range, VCC = 5 V 0.5 V (unless otherwise noted) (see Figure 1) TA = 25C MIN SN54AC574 MAX MIN SN74AC574 MAX 95 MIN UNIT MAX fclock Clock frequency 85 85 MHz tw Pulse duration, CLK high or low 4 5 5 ns tsu Setup time, data before CLK 1.5 3.5 2 ns th Hold time, data after CLK 1.5 2.5 1.5 ns switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V 0.3 V (unless otherwise noted) (see Figure 1) PARAMETER TO (INPUT) TO (OUTPUT) fmax tPLH tPHL tPZH tPZL tPHZ tPLZ CLK Q OE Q OE Q TA = 25C SN54AC574 MAX MIN MAX SN74AC574 MIN TYP MIN 75 112 3.5 8.5 13.5 1 16.5 3.5 15 3.5 7.5 12 1 15 3.5 13.5 2.5 7 11 1 13 2.5 12 3 6.5 10.5 1 12.5 3 11.5 3.5 7.5 12 1 14 2.5 13 2 5.5 9 1 10.5 1.5 10 55 MAX 60 UNIT MHz ns ns ns switching characteristics over recommended operating free-air temperature range, VCC = 5 V 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER TO (INPUT) TO (OUTPUT) TA = 25C MIN TYP fmax 95 153 tPLH 2 tPHL tPZH tPZL tPHZ tPLZ CLK Q OE Q OE Q SN54AC574 MAX SN74AC574 MAX MIN 6 9.5 1.5 11.5 2 11 2 5.5 8.5 1.5 10.5 2 9.5 2 5 8.5 1.5 9.5 2 9 2 5 8 1.5 9.5 1.5 9 2 6 9.5 1.5 11.5 1.5 10.5 1 4.5 7.5 1.5 9 1 8.5 85 MIN MAX 85 UNIT MHz ns ns ns operating characteristics, VCC = 5 V, TA = 25C PARAMETER Cpd 4 Power dissipation capacitance TEST CONDITIONS CL = 50 pF, POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 f = 1 MHz TYP UNIT 40 pF SN54AC574, SN74AC574 OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS WITH 3-STATE OUTPUTS SCAS541E - OCTOBER 1995 - REVISED OCTOBER 2003 PARAMETER MEASUREMENT INFORMATION 2 x VCC S1 500 From Output Under Test CL = 50 pF (see Note A) Open TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 x VCC Open 500 LOAD CIRCUIT VCC 50% VCC Timing Input 0V tw tsu 3V Input 50% VCC 50% VCC th VCC 50% VCC Data Input 50% VCC 0V 0V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS VCC Input 50% VCC 50% VCC 0V 50% VCC tPHL Out-of-Phase Output VOH 50% VCC VOL tPLZ VCC 50%VCC tPZH VOH 50% VCC VOL 50% VCC 0V Output Waveform 1 S1 at 2 x VCC (see Note B) tPLH 50% VCC VCC 50% VCC tPZL tPHL tPLH In-Phase Output Output Control (low-level enabling) VOL tPHZ Output Waveform 2 S1 at Open (see Note B) VOLTAGE WAVEFORMS VOL + 0.3 V 50% VCC VOH - 0.3 V VOH 0 V VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns. D. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE LCCC FK 20 1 TBD Call TI Call TI 5962-9677301QRA ACTIVE CDIP J 20 1 TBD Call TI Call TI 1 TBD Call TI Call TI TBD Call TI Call TI 5962-9677301QSA ACTIVE CFP W 20 SN74AC574DBLE OBSOLETE SSOP DB 20 SN74AC574DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC574DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC574DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC574DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC574DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC574DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC574DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC574DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC574DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC574N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74AC574NE4 ACTIVE PDIP N 20 SN74AC574NSR ACTIVE SO NS 20 TBD Call TI Call TI SN74AC574NSRE4 ACTIVE SO NS 20 TBD Call TI Call TI SN74AC574NSRG4 ACTIVE SO NS 20 Call TI Call TI SN74AC574PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC574PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC574PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 Samples (Requires Login) 5962-9677301Q2A TBD (3) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 17-Aug-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) TBD Lead/ Ball Finish Call TI MSL Peak Temp (3) Samples (Requires Login) SN74AC574PWLE OBSOLETE TSSOP PW 20 Call TI SN74AC574PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC574PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC574PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54AC574FK ACTIVE LCCC FK 20 1 TBD SNJ54AC574J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type SNJ54AC574W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2012 OTHER QUALIFIED VERSIONS OF SN54AC574, SN74AC574 : * Catalog: SN74AC574 * Military: SN54AC574 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74AC574DBR Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74AC574DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74AC574PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AC574DBR SSOP DB 20 2000 367.0 367.0 38.0 SN74AC574DWR SOIC DW 20 2000 367.0 367.0 45.0 SN74AC574PWR TSSOP PW 20 2000 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. 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