1
Data Sheet
!Note:
1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifi cations are subject to change or our
products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
2. This datasheet has only typical specifi cations because there is no space for detailed specifi cations. Therefore, please approve our product
specifi cations or transact the approval sheet for product specifi cations before ordering.
http://www.murata.com/
1
Inductors (Coils) > Chip Inductor (Chip Coil) > Power Inductor (Wire Wound Type for Choke)
2011.11.2
oThis data sheet is applied for CHIP INDUCTORS (CHIP COILS) used for General Electronics equipment for your design.
Chip Inductor (Chip Coil) Power Inductor (Wire Wound Type for Choke)
LQH55D Series (2220 Size)
c Dimensions
4.7±0.3
5.0±0.3 5.0±0.3
5.7±0.3
1.7
min.
1.3
min.
1.3
min. (in mm)
c Packaging
Code Packaging Minimum Quantity
L180mm Embossed Tape 350
K330mm Embossed Tape 1500
c Rated Value (p: packaging code)
Part Number Inductance Test Frequency Rated Current DC Resistance Self Resonance Frequency (min.)
LQH55DNR12M03p0.12µH ±20% 1MHz 6000mA 0.007ohm ±40% 450MHz
LQH55DNR27M03p0.27µH ±20% 1MHz 5300mA 0.010ohm ±40% 300MHz
LQH55DNR47M03p0.47µH ±20% 1MHz 4800mA 0.013ohm ±40% 200MHz
LQH55DN1R0M03p1.0µH ±20% 1MHz 4000mA 0.019ohm ±40% 150MHz
LQH55DN1R5M03p1.5µH ±20% 1MHz 3700mA 0.022ohm ±40% 110MHz
LQH55DN2R2M03p2.2µH ±20% 1MHz 3200mA 0.029ohm ±40% 80MHz
LQH55DN3R3M03p3.3µH ±20% 1MHz 2900mA 0.036ohm ±40% 40MHz
LQH55DN4R7M03p4.7µH ±20% 1MHz 2700mA 0.041ohm ±40% 30MHz
LQH55DN6R8M03p6.8µH ±20% 1MHz 2000mA 0.074ohm ±40% 25MHz
LQH55DN100M03p10µH ±20% 1MHz 1700mA 0.093ohm ±40% 20MHz
LQH55DN150M03p15µH ±20% 1MHz 1400mA 0.15ohm ±40% 17MHz
LQH55DN220M03p22µH ±20% 1MHz 1200mA 0.19ohm ±40% 15MHz
LQH55DN330M03p33µH ±20% 1MHz 900mA 0.32ohm ±40% 12MHz
LQH55DN470M03p47µH ±20% 1MHz 800mA 0.40ohm ±40% 10MHz
LQH55DN680M03p68µH ±20% 1MHz 640mA 0.67ohm ±40% 7.6MHz
LQH55DN101M03p100µH ±20% 100kHz 560mA 0.86ohm ±40% 6.5MHz
LQH55DN151M03p150µH ±20% 100kHz 420mA 1.9ohm ±40% 5.0MHz
LQH55DN221M03p220µH ±20% 100kHz 320mA 2.4ohm ±40% 4.0MHz
LQH55DN331M03p330µH ±20% 100kHz 270mA 4.4ohm ±40% 3.1MHz
LQH55DN471M03p470µH ±20% 100kHz 240mA 5.4ohm ±40% 2.4MHz
LQH55DN681M03p680µH ±20% 100kHz 190mA 8.1ohm ±40% 1.9MHz
LQH55DN102M03p1000µH ±20% 10kHz 150mA 10.3ohm ±40% 1.7MHz
LQH55DN222M03p2200µH ±20% 10kHz 100mA 21.5ohm ±40% 1.2MHz
LQH55DN472M03p4700µH ±20% 10kHz 70mA 43.6ohm ±40% 0.8MHz
LQH55DN103M03p10000µH ±20% 10kHz 50mA 100ohm ±40% 0.5MHz
Class of Magnetic Shield: No magnetic shield
Operating Temperature Range (Self-temperature rise is not included): -40 to +80°C
Only for refl ow soldering.
Continued on the following page.
2
Data Sheet
!Note:
1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifi cations are subject to change or our
products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
2. This datasheet has only typical specifi cations because there is no space for detailed specifi cations. Therefore, please approve our product
specifi cations or transact the approval sheet for product specifi cations before ordering.
http://www.murata.com/
2
Inductors (Coils) > Chip Inductor (Chip Coil) > Power Inductor (Wire Wound Type for Choke)
2011.11.2
oThis data sheet is applied for CHIP INDUCTORS (CHIP COILS) used for General Electronics equipment for your design.
Continued from the preceding page.
c Impedance-Frequency Characteristics (Typ.)
10000μH
Frequency (MHz)
10
100
1000
10000
100000
1000000
1
0.01 0.1 1 10 100 1000
1000μH
100μH
10μH
1μH
Impedance (Ω)
c Inductance-Current Characteristics (Typ.)
Inductance (μH)
Current (A)
10000
1000
100000
100
10
1
0.1
0.010.001 0.1 1 10
1μH
10μH
10000μH
1000μH
100μH
c !Caution/Notice
!Caution (Rating)
Do not use products beyond the rated current as
this may create excessive heat.
Notice
Solderability of Tin plating termination chip might be
deteriorated when low temperature soldering profi le
where peak solder temperature is below the Tin melting
point is used. Please confi rm the solderability of Tin
plating termination chip before use.
