PDIUSBD12DAA - ST-Ericsson Inc - Datasheet.Directory

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1. General description

The PDIUSBD12 is a cost- and feature-optimized USB peripheral controller. It is normally

used in microcontroller-based systems and communicates with the system microcontroller

over the high-speed general-purpose parallel interface. It also supports local DMA

transfer.

This modular approach to implementing a USB interface allows the designer to choose

the optimum system microcontroller from the wide variety available. This ﬂexibility cuts

down development time, risks and costs, by allowing the use of the existing architecture,

minimizing ﬁrmware investments. This results in the fastest way to develop the most

cost-effective USB peripheral solution.

The PDIUSBD12 fully conforms to

Universal Serial Bus Speciﬁcation Rev. 2.0

, supporting

data transfer at full-speed (12 Mbit/s). It is also designed to be compliant with most device

class speciﬁcations: imaging class, mass storage devices, communication devices,

printing devices and human interface devices. The PDIUSBD12 is ideally suited for many

peripherals, such as printer, scanner, external mass storage (Zip drive) and digital still

camera. It offers an immediate cost reduction for applications that currently use SCSI

implementations.

The PDIUSBD12 low suspend power consumption along with the LazyClock output allows

for easy implementation of equipment that is compliant to the ACPI, OnNow and USB

power management requirements. The low operating power allows the implementation of

bus powered peripherals.

It also incorporates features, such as SoftConnect, GoodLink, programmable clock output,

low frequency crystal oscillator, and integration of termination resistors. All of these

features contribute to signiﬁcant cost savings in the system implementation and at the

same time ease the implementation of advanced USB functionality into peripherals.

2. Features

■Complies with

Universal Serial Bus speciﬁcation Rev. 2.0

■Supports data transfer at full-speed (12 Mbit/s)

■High performance USB peripheral controller with integrated SIE, FIFO memory,

transceiver and voltage regulator

■Compliant with most device class speciﬁcations

■High-speed (2 MB/s) parallel interface to any external microcontroller or

microprocessor

■Fully autonomous DMA operation

■Integrated 320 B of multi-conﬁguration FIFO memory

PDIUSBD12

Universal Serial Bus peripheral controller with parallel bus

Rev. 09 — 11 May 2006 Product data sheet

Product data sheet Rev. 09 — 11 May 2006 2 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

■Double buffering scheme for main endpoint increases throughput and eases real-time

data transfer

■Data transfer rates: 1 MB/s achievable in bulk mode, 1 Mbit/s achievable in

isochronous mode

■Bus-powered capability with very good EMI performance

■Controllable LazyClock output during suspend

■Software-controllable connection to the USB bus (SoftConnect)

■Good USB connection indicator that blinks with trafﬁc (GoodLink)

■Programmable clock frequency output

■Complies with the ACPI, OnNow and USB power management requirements

■Internal Power-On Reset (POR) and low-voltage reset circuit

■Available in SO28 and TSSOP28 pin packages

■Full industrial grade operation from −40 °C to +85 °C

■Full-scan design with high fault coverage (> 99 %) ensures high quality

■Operation with dual voltages: 3.3 V ±0.3 V or extended 5 V supply range of

4.0 V to 5.5 V

■Multiple interrupt modes to facilitate both bulk and isochronous transfers

3. Ordering information

Table 1. Ordering information

Outside North

America North America Package Temperature

range Version

Name Description

PDIUSBD12D PDIUSBD12D SO28 plastic small outline package; 28 leads;

body width 7.5 mm −40 °C to +85 °C SOT136-1

PDIUSBD12PW PDIUSBD12PW DH TSSOP28 plastic thin shrink small outline

package; 28 leads; body width 4.4 mm −40 °C to +85 °C SOT361-1

Product data sheet Rev. 09 — 11 May 2006 3 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

4. Block diagram

5. Pinning information

5.1 Pinning

This is a conceptual block diagram and does not include each individual signal.

Fig 1. Block diagram

6 MHz

D+ D−

PLL

SoftConnect

D+

3.3 V

1.5 kΩ

004aaa796

VOLTAGE

REGULATOR

ANALOG

TX/RX

PARALLEL

AND DMA

INTERFACE

MEMORY

MANAGEMENT

UNIT

INTEGRATED

RAM

PHILIPS

SIE

BIT CLOCK

RECOVERY

UPSTREAM

PORT

Fig 2. Pin conﬁguration

PDIUSBD12

DATA0 A0

DATA1 VOUT3.3

DATA2 D+

DATA3 D−

GND VCC

DATA4 XTAL2

DATA5 XTAL1

DATA6 GL_N

DATA7 RESET_N

ALE EOT_N

CS_N DMACK_N

SUSPEND DMREQ

CLKOUT WR_N

INT_N RD_N

004aaa532

Product data sheet Rev. 09 — 11 May 2006 4 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

5.2 Pin description

Table 2. Pin description

Symbol Pin Type[1] Description

DATA0 1 IO2 bit 0 of bidirectional data; slew-rate controlled

DATA1 2 IO2 bit 1 of bidirectional data; slew-rate controlled

DATA2 3 IO2 bit 2 of bidirectional data; slew-rate controlled

DATA3 4 IO2 bit 3 of bidirectional data; slew-rate controlled

GND 5 P ground

DATA4 6 IO2 bit 4 of bidirectional data; slew-rate controlled

DATA5 7 IO2 bit 5 of bidirectional data; slew-rate controlled

DATA6 8 IO2 bit 6 of bidirectional data; slew-rate controlled

DATA7 9 IO2 bit 7 of bidirectional data; slew-rate controlled

ALE 10 I Address Latch Enable: The falling edge is used to close the latch of

the address information in a multiplexed address or data bus.

Permanently tied to LOW for separate address or data bus

conﬁguration.

CS_N 11 I chip select (active LOW)

When the CS_N pin is LOW, ensure that the RESET_N pin is in

inactive state; otherwise, the device will enter test mode.

SUSPEND 12 I, OD4 device is in the suspend state

CLKOUT 13 O2 programmable output clock (slew-rate controlled)

INT_N 14 OD4 interrupt (active LOW)

RD_N 15 I read strobe (active LOW)

WR_N 16 I write strobe (active LOW).

DMREQ 17 O4 DMA request

DMACK_N 18 I DMA acknowledge (active LOW)

EOT_N 19 I end of DMA transfer (active LOW); double up as VBUS sensing.

EOT_N is only valid when asserted together with DMACK_N and

either RD_N or WR_N.

RESET_N 20 I reset (active LOW and asynchronous); built-in power-on reset circuit

is present on-chip, so the pin can be tied HIGH to VCC

When the RESET_N pin is LOW, ensure that the CS_N pin is in

inactive state; otherwise, the device will enter test mode.

GL_N 21 OD8 GoodLink LED indicator (active LOW)

XTAL1 22 I crystal connection 1 (6 MHz)

XTAL2 23 O crystal connection 2 (6 MHz); if the external clock signal, instead of

the crystal, is connected to XTAL1, then XTAL2 should be ﬂoated

VCC 24 P voltage supply (4.0 V to 5.5 V)

To operate the IC at 3.3 V, supply 3.3 V to both the VCC and VOUT3.3

pins.

D−25 A USB D− data line

Product data sheet Rev. 09 — 11 May 2006 5 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

[1] P: power or ground; A: analog; I: input; O: Output; O2: Output with 2 mA drive; OD4: Output open-drain with

4 mA drive; OD8: Output open-drain with 8 mA drive; IO2: Input and output with 2 mA drive; O4: Output

with 4 mA drive.

D+ 26 A USB D+ data line

VOUT3.3 27 P 3.3 V regulated output; to operate the IC at 3.3 V, supply a 3.3 V to

both the VCC and VOUT3.3 pins

A0 28 I address bit

A0=1 —Selects the command instruction

A0=0 —selects the data phase

This bit is a don’t care in a multiplexed address and data bus

conﬁguration and should be tied to HIGH.

Table 2. Pin description

…continued

Symbol Pin Type[1] Description

Product data sheet Rev. 09 — 11 May 2006 6 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

6. Functional description

6.1 Analog transceiver

The integrated transceiver directly interfaces to USB cables through termination resistors.

6.2 Voltage regulator

A 3.3 V regulator is integrated on-chip to supply the analog transceiver. This voltage is

also provided as an output to connect to the external 1.5 kΩpull-up resistor. Alternatively,

the PDIUSBD12 provides the SoftConnect technology with an integrated 1.5 kΩ pull-up

resistor.

6.3 PLL

A 6 MHz-to-48 MHz clock multiplier Phase-Locked Loop (PLL) is integrated on-chip. This

allows the use of a low-cost 6 MHz crystal. ElectroMagnetic Interference (EMI) is also

minimized because of the lower frequency crystal. No external components are needed

for the operation of the PLL.

6.4 Bit clock recovery

The bit clock recovery circuit recovers the clock from the incoming USB data stream using

4×over-sampling principle. It can track jitter and frequency drift speciﬁed by

Universal

Serial Bus Speciﬁcation Rev. 2.0

6.5 Philips Serial Interface Engine (PSIE)

The Philips SIE implements the full USB protocol layer. It is completely hardwired for

speed and needs no ﬁrmware intervention. The functions of this block include:

synchronization pattern recognition, parallel or serial conversion, bit stufﬁng or discarding

stuffed bits, CRC checking or generation, PID veriﬁcation or generation, address

recognition, and handshake evaluation or generation.

6.6 SoftConnect

The connection to the USB is accomplished by connecting D+ (for full-speed USB device)

to HIGH through a 1.5 kΩ pull-up resistor. In the PDIUSBD12, the 1.5 kΩ pull-up resistor

is integrated on-chip and is not connected to VCC by default. The connection is

established through a command sent by the external or system microcontroller. This

allows the system microcontroller to complete its initialization sequence before deciding to

establish connection to the USB. Re-initialization of the USB bus connection can also be

performed without requiring to pull out the cable.

The PDIUSBD12 will check for USB VBUS availability before the connection can be

established. The VBUS sensing is provided using pin EOT_N. For details, see Section 5.2.

Sharing of the VBUS sensing and EOT_N can be easily accomplished by using the VBUS

voltage as the pull-up voltage for the normally open-drain output of the DMA controller pin.

Remark: The tolerance of internal resistors is higher (25 %) than that speciﬁed in

Universal Serial Bus Speciﬁcation Rev. 2.0

(5 %). The overall voltage speciﬁcation for the

connection, however, can still be met with good margin. The decision to make sure of this

feature lies with users.

Product data sheet Rev. 09 — 11 May 2006 7 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

6.7 GoodLink

A good USB connection indication is provided through the GoodLink technology. During

enumeration, the LED indicator will momentarily blink on corresponding to the

enumeration trafﬁc. When the PDIUSBD12 is successfully enumerated and conﬁgured,

the LED indicator will be permanently on. Subsequent successful (with acknowledgment)

transfer to and from the PDIUSBD12 will blink off the LED. During suspend, the LED will

be off.

This feature provides a user-friendly indication on the status of the USB device, the

connected hub and the USB trafﬁc. It is a useful ﬁeld diagnostics tool to isolate faulty

equipment. This feature helps lower ﬁeld support and hotline costs.

6.8 Memory Management Unit (MMU) and integrated RAM

The difference between MMU and the integrated RAM buffer lies in the speed between

USB, running in bursts of 12 Mbit/s and the parallel interface to the microcontroller. This

allows the microcontroller to read and write USB packets at its own speed.

6.9 Parallel and DMA interface

A generic parallel interface is deﬁned for ease-of-use and speed, and allows direct

interfacing to major microcontrollers. To a microcontroller, the PDIUSBD12 appears as a

memory device with 8-bit data bus and 1-bit address line (occupying two locations). The

PDIUSBD12 supports both multiplexed and non-multiplexed address and data bus. The

PDIUSBD12 also supports Direct Memory Access (DMA) transfer that allows the main

endpoint (endpoint 2) to directly transfer to and from the local shared memory. Both

single-cycle and burst mode DMA transfers are supported.

6.10 Example of parallel interface to an 80C51 microcontroller

In the example shown in Figure 3, the ALE pin is permanently tied to LOW to signify a

separate address and data bus conﬁguration. The A0 pin of the PDIUSBD12 connects to

any of the 80C51 I/O ports. This port controls the command or data phase to the

PDIUSBD12. The multiplexed address and data bus of the 80C51 can now be directly

connected to the data bus of the PDIUSBD12. The address phase will be ignored by the

PDIUSBD12. The clock input signal of the 80C51 (pin XTAL1) can be provided by output

CLKOUT of the PDIUSBD12.

Fig 3. Example of a parallel interface to an 80C51 microcontroller

PDIUSBD12 80C51

INT_N

DATA[7:0]

WR_N

RD_N

CLKOUT

CS_N

ALE

XTAL1

RD/P3.7

WR/P3.6

P[0.7:0.0]/AD[7:0]

ANY I/O PORT (for example, P3.3)

INTO/P3.2

004aaa155

ANY I/O PORT

Product data sheet Rev. 09 — 11 May 2006 8 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

7. Direct Memory Access (DMA) transfer

DMA allows an efﬁcient transfer of a block of data between the host and local shared

memory. Using a DMA Controller (DMAC), the data transfer between the main endpoint

(endpoint 2) of the PDIUSBD12 and the local shared memory can occur autonomously,

without the local CPU intervention.

Preceding any DMA transfer, the local CPU receives from the host the necessary setup

information and accordingly programs the DMA controller. Typically, the DMA controller is

set up for demand transfer mode, and the Byte Count register and the address counter

are programmed with the correct values. In this mode, transfers occur only when the

PDIUSBD12 requests them and are terminated when the Byte Count register reaches

zero. After the DMA controller is programmed, the DMA ENABLE bit of the PDIUSBD12 is

set by the local CPU to initiate the transfer.

The PDIUSBD12 can be programmed for single-cycle DMA or burst mode DMA. In

single-cycle DMA, the DMREQ pin is deactivated for every single acknowledgment by

DMACK_N before being re-asserted. In burst mode DMA, the DMREQ pin is kept active

for the number of bursts programmed in the device before going inactive. This process

continues until the PDIUSBD12 receives a DMA termination notice through pin EOT_N.

This will generate an interrupt to notify the local CPU that the DMA operation is

completed.

For the DMA read operation, the DMREQ pin will only be activated whenever the buffer is

full, signaling that the host has successfully transferred a packet to the PDIUSBD12. With

the double buffering scheme, the host can start ﬁlling up the second buffer while the ﬁrst

buffer is being read out. This parallel processing increases the effective throughput. When

the host does not completely ﬁll up the buffer (less than 64 B or 128 B for single direction

ISO conﬁguration), the DMREQ pin will be deactivated at the last byte of the buffer,

regardless of the current DMA burst count. It will be re-asserted on the next packet with a

refreshed DMA burst count.

Similarly, for DMA write operations, the DMREQ pin remains active whenever the buffer is

not full. When the buffer is ﬁlled up, the packet is sent over to the host on the next IN token

and DMREQ will be reactivated if the transfer was successful. Also, the double buffering

scheme here will improve throughput. For non-isochronous transfer (bulk and interrupt),

the buffer needs to be completely ﬁlled up by the DMA write operation before data is sent

to the host. The only exception is at the end of DMA transfer, when the reception of the

EOT_N pin will stop the DMA write operation and the buffer content will be sent to the host

on the next IN token.

For isochronous transfers, the local CPU and DMA controller have to guarantee that they

can sink or source the maximum packet size in one USB frame (1 ms).

The assertion of pin DMACK_N automatically selects the main endpoint (endpoint 2),

regardless of the current selected endpoint. The DMA operation of the PDIUSBD12 can

be interleaved with normal I/O access to other endpoints.

The DMA operation can be terminated by resetting the DMA ENABLE register bit or the

assertion of EOT_N together with DMACK_N and either RD_N or WR_N.

Product data sheet Rev. 09 — 11 May 2006 9 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

The PDIUSBD12 supports DMA transfer in single address mode and it can also work in

dual address mode of the DMA controller. In single address mode, the DMA transfer is

done using the DREQ, DMACK_N, EOT_N, WR_N and RD_N control lines. In dual

address mode, pins DMREQ, DMACK_N and EOT_N are not used; instead CS_N,

WR_N and RD_N control signals are used. The I/O mode transfer protocol of the

PDIUSBD12 needs to be followed. The source of the DMAC is accessed during the read

cycle and the destination during the write cycle. Transfer needs to be done in two separate

bus cycles, temporarily storing data in the DMAC.

8. Endpoint description

The PDIUSBD12 endpoints are sufﬁciently generic to be used by various device classes

ranging from imaging, printer, mass storage and communication device classes. The

PDIUSBD12 endpoints can be conﬁgured for four operating modes, depending on the Set

Mode command. The four modes are:

Mode 0 Non-isochronous transfer (Non-ISO mode)

Mode 1 Isochronous output only transfer (ISO-OUT mode)

Mode 2 Isochronous input only transfer (ISO-IN mode)

Mode 3 Isochronous input and output transfer (ISO-I/O mode)

Product data sheet Rev. 09 — 11 May 2006 10 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

[1] IN: input for the USB host; OUT: output from the USB host.

[2] Generic endpoints can be used either as bulk or interrupt endpoint.

[3] The main endpoint (endpoint number 2) is double-buffered to ease synchronization with real-time

applications and to increase throughput. This endpoint supports DMA access.

[4] Denotes double buffering. The size shown is for a single buffer.

Table 3. Endpoint conﬁguration

Endpoint number Endpoint index Transfer type Direction[1] Max. Packet size (bytes)

Mode 0 (Non-ISO mode)

0 0 control OUT 16

1IN16

1 2 generic[2] OUT 16

3IN16

2 4 generic[2][3] OUT 64[4]

5IN64

[4]

Mode 1 (ISO-OUT mode)

0 0 control OUT 16

1IN16

1 2 generic[2] OUT 16

3IN16

2 4 isochronous[3] OUT 128[4]

Mode 2 (ISO-IN mode)

0 0 control OUT 16

1IN16

1 2 generic[2] OUT 16

3IN16

2 5 isochronous[3] IN 128[4]

Mode 3 (ISO-I/O mode)

0 0 control OUT 16

1IN16

1 2 generic[2] OUT 16

3IN16

2 4 isochronous[3] OUT 64[4]

5IN64

[4]

Product data sheet Rev. 09 — 11 May 2006 11 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

9. Main endpoint

The main endpoint (endpoint number 2) is the primary endpoint for sinking or sourcing

relatively large amounts of data. It implements the following features to ease this task:

•Double buffering. This allows parallel operation between the USB access and the

local CPU access, increasing throughput. Buffer switching is automatically handled.

This results in transparent buffer operation.

•DMA operation. This can be interleaved with normal I/O operation to other endpoints.

•Automatic pointer handling during the DMA operation. No local CPU intervention is

necessary when ‘crossing’ the buffer boundary.

•Conﬁgurable endpoint for either isochronous transfer or non-isochronous (bulk and

interrupt) transfer.

10. Command summary

Table 4. Command summary

Name Destination Code (Hex) Transaction

Initialization commands

Set Address/Enable device D0 write 1 B

Set Endpoint Enable device D8 write 1 B

Set Mode device F3 write 2 B

Set DMA device FB write or read 1 B

Data ﬂow commands

Read Interrupt register device F4 read 2 B

Select Endpoint control OUT 00 read 1 B (optional)

control IN 01 read 1 B (optional)

endpoint 1 OUT 02 read 1 B (optional)

endpoint 1 IN 03 read 1 B (optional)

endpoint 2 OUT 04 read 1 B (optional)

endpoint 2 IN 05 read 1 B (optional)

Read Last Transaction Status control OUT 40 read 1 B

control IN 41 read 1 B

endpoint 1 OUT 42 read 1 B

endpoint 1 IN 43 read 1 B

endpoint 2 OUT 44 read 1 B

endpoint 2 IN 45 read 1 B

Read Buffer selected endpoint F0 read n B

Write Buffer selected endpoint F0 write n B

Product data sheet Rev. 09 — 11 May 2006 12 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

11. Command description

11.1 Command procedure

There are three basic types of commands: initialization, data ﬂow and general.

Respectively, these are used to initialize the function; for data ﬂow between the function

and the host; and some general commands.

11.2 Initialization commands

Initialization commands are used during the enumeration process of the USB network.

These commands are used to enable function endpoints. They are also used to set the

USB assigned address.

11.2.1 Set Address/Enable

Code (Hex) — D0

Transaction — write 1 B

This command is used to set the USB assigned address and enable the function.

Set Endpoint Status control OUT 40 write 1 B

control IN 41 write 1 B

endpoint 1 OUT 42 write 1 B

endpoint 1 IN 43 write 1 B

endpoint 2 OUT 44 write 1 B

endpoint 2 IN 45 write 1 B

Acknowledge Setup selected endpoint F1 none

Clear Buffer selected endpoint F2 none

Validate Buffer selected endpoint FA none

General commands

Send Resume F6 none

Read Current Frame Number F5 read 1 or 2 B

Table 4. Command summary

…continued

Name Destination Code (Hex) Transaction

ADDRESS: The value written becomes the address.

ENABLE: Logic 1 enables this function.

Fig 4. Set Address/Enable command: bit allocation

7654320

0Power-on value

ADDRESS

ENABLE

004aaa797

0000

Product data sheet Rev. 09 — 11 May 2006 13 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

11.2.2 Set Endpoint Enable

Code (Hex) — D8

Transaction — write 1 B

The generic or isochronous endpoints can only be enabled when the function is enabled

using the Set Address/Enable command.

11.2.3 Set Mode

Code (Hex) — F3

Transaction — write 2 B

The Set Mode command is followed by two data writes. The ﬁrst byte contains

conﬁguration bits. The second byte is the clock division factor byte.

GENERIC OR ISOCHRONOUS ENDPOINTS: Logic 1 indicates that generic or isochronous

endpoints are enabled.

Fig 5. Set Endpoint Enable command: bit allocation

765432X

0Power-on value

GENERIC/ISOCHRONOUS ENDPOINTS

reserved; write 0

XXXXXX

004aaa798

For bit allocation, see Table 5.

Fig 6. Set Mode command, conﬁguration byte: bit allocation

Power-on value

reserved

NO LAZYCLOCK

CLOCK RUNNING

INTERRUPT MODE

SoftConnect

reserved; write 0

ENDPOINT CONFIGURATION

7654321

0100

004aaa799

Product data sheet Rev. 09 — 11 May 2006 14 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

Table 5. Set Mode command, conﬁguration byte: bit allocation

Bit Symbol Description

7 to 6 ENDPOINT

CONFIGURATION These two bits set endpoint conﬁgurations as follows:

Mode 0 (Non-ISO mode)

Mode 1 (ISO-OUT mode)

Mode 2 (ISO-IN mode)

Mode 3 (ISO-I/O mode)

For details, see Section 8.

4 SoftConnect Logic 1 indicates that the upstream pull-up resistor will be connected

if VBUS is available. Logic 0 means that the upstream resistor will not

be connected. The programmed value will not be changed by a bus

reset.

3 INTERRUPT

MODE Logic 1 indicates that all errors and ‘NAK’ are reported and will

generate an interrupt. Logic 0 indicates that only OK is reported. The

programmed value will not be changed by a bus reset.

2 CLOCK RUNNING Logic 1 indicates that internal clocks and PLL are always running

even during the suspend state. Logic 0 indicates that the internal

clock, crystal oscillator and PLL are stopped, whenever not needed.

To meet the strict suspend current requirement, this bit must be set to

logic 0. The programmed value will not be changed by a bus reset.

1 NO LAZYCLOCK Logic 1 indicates that CLKOUT will not switch to LazyClock. Logic 0

indicates that CLKOUT switches to LazyClock 1 ms after the

SUSPEND pin goes HIGH. LazyClock frequency is 30 kHz ±40 %.

The programmed value will not be changed by a bus reset.

For bit allocation, see Table 6.

Fig 7. Set Mode command, clock division factor byte: bit allocation

7654321

Power-on value

10XX00

CLOCK DIVISION FACTOR

reserved

004aaa800

SET_TO_ONE

SOF-ONLY INTERRUPT MODE

Product data sheet Rev. 09 — 11 May 2006 15 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

11.2.4 Set DMA

Code (Hex) — FB

Transaction — read or write 1 B

The Set DMA command is followed by one data write or read to or from the DMA

Conﬁguration register.

11.2.4.1 DMA Conﬁguration register

During the DMA operation, the 2 B buffer header (status and byte length information) is

not transferred to or from the local CPU. This allows the DMA data to be continuous and

not interleaved by chunks of these headers. For DMA read operations, the header will be

skipped by the PDIUSBD12. See Section 11.3.5 command. For DMA write operations, the

header will be automatically added by the PDIUSBD12. This provides a clean and simple

DMA data transfer.

Table 6. Set Mode command, clock division factor byte: bit allocation

Bit Symbol Description

7 SOF-ONLY

INTERRUPT MODE Setting this bit to logic 1 will cause the interrupt line to be activated

because of the Start-Of-Frame (SOF) clock only, regardless of the

setting of PIN-INTERRUPT MODE, bit 5 of Set DMA.

6 SET_TO_ONE This bit must be set to logic 1 before any DMA read or DMA write

operation. This bit should always be set to logic 1 after power. It is

zero after power-on reset.

3 to 0 CLOCK DIVISION

FACTOR The value indicates the clock division factor for CLKOUT. The

output frequency is 48 MHz / (N + 1), where N is the clock division

factor. The reset value is 11. This will produce an output frequency

of 4 MHz that can then be programmed up or down by the user.

The minimum value is 1, giving a frequency range of

4 MHz to 24 MHz. The minimum value of N is 0, giving a maximum

frequency of 48 MHz. The maximum value of N is 11, giving a

minimum frequency of 4 MHz. The PDIUSBD12 design ensures no

glitching during frequency change. The programmed value will not

be changed by a bus reset.

For bit allocation, see Table 7.

Fig 8. Set DMA command: bit allocation

Power-on value

INTERRUPT PIN MODE

ENDPOINT INDEX 4 INTERRUPT ENABLE

ENDPOINT INDEX 5 INTERRUPT ENABLE

7654320

DMA ENABLE

DMA DIRECTION

AUTO RELOAD

DMA BURST

004aaa801

Product data sheet Rev. 09 — 11 May 2006 16 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

11.3 Data ﬂow commands

Data ﬂow commands are used to manage the data transmission between USB endpoints

and the external microcontroller. Much of the data ﬂow is initiated using an interrupt to the

microcontroller. The microcontroller utilizes these commands to access and determine

whether endpoint FIFOs have valid data.

11.3.1 Read Interrupt register

Code (Hex) — F4

Transaction — read 2 B

Table 7. Set DMA command: bit allocation

Bit Symbol Description

7 ENDPOINT INDEX 5

INTERRUPT ENABLE Logic 1 allows an interrupt to be generated whenever the

endpoint buffer is validated (see Section 11.3.8 command).

Normally turned off for the DMA operation to reduce

unnecessary CPU servicing.

6 ENDPOINT INDEX 4

INTERRUPT ENABLE Logic 1 allows an interrupt to be generated whenever the

endpoint buffer contains a valid packet. Normally turned off

for the DMA operation to reduce unnecessary CPU

servicing.

5 INTERRUPT PIN MODE Logic 0 signiﬁes a normal interrupt pin mode in which an

interrupt is generated as a logical OR of all the bits in

interrupt registers. Logic 1 signiﬁes that the interrupt will

occur when SOF clock is seen on the upstream USB bus.

The other normal interrupts are still active.

4 AUTO RELOAD When this bit is set to logic 1, the DMA operation will

automatically restart.

3 DMA DIRECTION This bit determines the direction of data ﬂow during a DMA

transfer. Logic 1 means from the external shared memory to

the PDIUSBD12 (DMA write); logic 0 means from the

PDIUSBD12 to the external shared memory (DMA read).

2 DMA ENABLE Writing logic 1 to this bit will start the DMA operation through

the assertion of pin DMREQ. The main endpoint buffer must

be full (for DMA read) or empty (for DMA write), before

DMREQ is asserted. In single cycle DMA mode, the

DMREQ is deactivated on receiving DMACK_N. In burst

mode DMA, the DMREQ is deactivated after the number of

burst is exhausted. It is then asserted again for the next

burst. This process continues until EOT_N is asserted

together with DMACK_N and either RD_N or WR_N, which

will reset this bit to logic 0 and terminate the DMA operation.

The DMA operation can also be terminated by writing logic 0

to this bit.

1 to 0 DMA BURST Selects the burst length for DMA operation:

00 Single-cycle DMA

01 Burst (4-cycle) DMA

10 Burst (8-cycle) DMA

11 Burst (16-cycle) DMA

Product data sheet Rev. 09 — 11 May 2006 17 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

This command indicates the origin of an interrupt. The endpoint interrupt bits (bits 0 to 5)

are cleared by reading the Endpoint Last Transaction Status register through Read Last

Transaction Status command. The other bits are cleared after reading Interrupt registers.

For bit allocation, see Table 8.

Fig 9. Interrupt register, byte 1: bit allocation

DMA EOT: This bit signiﬁes that the DMA operation is completed.

Fig 10. Interrupt register, byte 2: bit allocation

Table 8. Read Interrupt register, byte 1: bit allocation

Bit Symbol Description

7 SUSPEND CHANGE When the PDIUSBD12 does not receive three SOFs, it will go into the

suspend state and the SUSPEND CHANGE bit will be HIGH. Any

change to the suspend or awake state will set this bit to HIGH and

generate an interrupt.

6 BUS RESET After a bus reset, an interrupt will be generated and this bit will be

logic 1. A bus reset is identical to a hardware reset through the

RESET_N pin, except a bus reset generates an interrupt notiﬁcation

and the device is enabled at default address 0.

Power-on value

MAIN OUT ENDPOINT

MAIN IN ENDPOINT

BUS RESET

SUSPEND CHANGE

7654320

0000

CONTROL IN ENDPOINT

ENDPOINT 1 OUT

ENDPOINT 1 IN

CONTROL OUT ENDPOINT

004aaa802

765432

0Power-on value

DMA EOT

reserved

XXXXXX

004aaa803

Product data sheet Rev. 09 — 11 May 2006 18 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

11.3.2 Select Endpoint

Code (Hex) — 00 to 05

Transaction — read 1 B (optional)

The Select Endpoint command initializes an internal pointer to the start of the selected

buffer. Optionally, this command can be followed by a data read, which returns this byte.

11.3.3 Read Endpoint Status

Code (Hex) — 80 to 85

Transaction — read 1 B

11.3.4 Read Last Transaction Status register

Code (Hex) — 40 to 45

Transaction — read 1 B

The Read Last Transaction Status command is followed by one data read that returns the

status of the last transaction of the endpoint. This command also resets the corresponding

interrupt ﬂag in the Interrupt register, and clears the status, indicating that it was read.

This command is useful for debugging purposes. The status information is overwritten for

each new transaction because it keeps track of every transaction.

FULL/EMPTY: Logic 1 indicates that the buffer is full, logic 0 indicates an empty buffer.

STALL: Logic 1 indicates that the selected endpoint is in the stall state.

Fig 11. Select Endpoint command: bit allocation

765432

Power-on value

FULL/EMPTY

STALL

XXXXXX

004aaa804

reserved

Fig 12. Read Endpoint Status: bit allocation

reserved

BUFFER 0 FULL

BUFFER 1 FULL

ENDPOINT STALLED

765432x

SETUP PACKET

reserved

004aaa056

Product data sheet Rev. 09 — 11 May 2006 19 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

For bit allocation, see Table 9.

Fig 13. Read Last Transaction Status register: bit allocation

Table 9. Read Last Transaction Status register: bit allocation

Bit Symbol Description

7 PREVIOUS STATUS NOT

READ Logic 1 indicates a second event occurred before the

previous status was read.

6 DATA0/1 PACKET Logic 1 indicates the last successful received or sent

packet had a DATA1 PID.

5 SETUP PACKET Logic 1 indicates the last successful received packet had a

SETUP token (this will always read 0 for IN buffers).

4 to 1 ERROR CODE See Table 10

0 DATARECEIVE/TRANSMIT

SUCCESS Logic 1 indicates that data has been successfully received

or transmitted.

Table 10. Error codes

Error code

(binary) Description

0000 no error

0001 PID encoding error; bits 7 to 4 are not the inversion of bits 3 to 0

0010 PID unknown; encoding is valid, but PID does not exist

0011 unexpected packet; packet is not of the type expected (= token, data or

acknowledge), or SETUP token to a non-control endpoint

0100 token CRC error

0101 data CRC error

0110 time-out error

0111 never happens

1000 unexpected End-Of-Packet (EOP)

1001 sent or received NAK

1010 sent stall, a token was received, but the endpoint was stalled

1011 overﬂow error, the received packet was longer than the available buffer space

1101 bit stuff error

1111 wrong DATA PID; the received DATA PID was not what was expected

Power-on value

DATA RECEIVE/TRANSMIT SUCCESS

ERROR CODE (see table)

SETUP PACKET

DATA 0/1 PACKET

PREVIOUS STATUS NOT READ

7654320

000000

004aaa805

Product data sheet Rev. 09 — 11 May 2006 20 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

11.3.5 Read Buffer

Code (Hex) — F0

Transaction — read multiple bytes (max. 130)

The Read Buffer command is followed by a number of data reads that return contents of

the selected endpoint data buffer. After each read, the internal buffer pointer is

incremented by 1.

The buffer pointer is reset to the top of the buffer by the Read Buffer command. This

means that reading or writing a buffer can be interrupted by any other command (except

for Select Endpoint).

The data in the buffer is organized as follows:

•Byte 0: reserved; can have any value

•Byte 1: number or length of data bytes

•Byte 2: data byte 1

•Byte 3: data byte 2

•and so on

The ﬁrst two bytes will be skipped in the DMA read operation. Therefore, the ﬁrst read will

get data byte 1, the second read will get data byte 2, and so on. The PDIUSBD12 can

determine the last byte of this packet through the EOP termination of the USB packet.

11.3.6 Write Buffer

Code (Hex) — F0

Transaction — write multiple bytes (max. 130)

The Write Buffer command is followed by a number of data writes that load the endpoints

buffer. Data must be organized in the same way as described in the Read Buffer

command. The ﬁrst byte (reserved) should always be 0.

During the DMA write operation, the ﬁrst two bytes will be bypassed. Therefore, the ﬁrst

write will write into data byte 1, the second write will write into data byte 2, and so on. For

non-isochronous transfer (bulk or interrupt), the buffer must be completely ﬁlled before

data is sent to the host and a switch to the next buffer occurs. The exception is at the end

of the DMA transfer indicated by activation of EOT_N, when the current buffer content

(completely full or not) will be sent to the host.

Remark: There is no protection against writing or reading over a buffer’s boundary, or

against writing into an OUT buffer or reading from an IN buffer. Any of these actions could

cause an incorrect operation. Data in an OUT buffer is only meaningful after a successful

transaction. The exception is during the DMA operation on the main endpoint

(endpoint 2), in which case the pointer is automatically pointed to the second buffer after

reaching the boundary (double buffering scheme).

11.3.7 Clear Buffer

Code (Hex) — F2

Transaction — none

Product data sheet Rev. 09 — 11 May 2006 21 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

When a packet is completely received, an internal endpoint buffer full ﬂag is set. All

subsequent packets will be refused by returning a NAK. When the microcontroller has

read data, it should free the buffer using the Clear Buffer command. When the buffer is

cleared, new packets will be accepted.

11.3.8 Validate Buffer

Code (Hex) — FA

Transaction — none

When the microprocessor has written data into an IN buffer, it should set the buffer full ﬂag

using the Validate Buffer command. This indicates that data in the buffer is valid and can

be sent to the host when the next IN token is received.

11.3.9 Set Endpoint Status

Code (Hex) — 40 to 45

Transaction — write 1 B

A stalled control endpoint is automatically un-stalled when it receives a SETUP token,

regardless of the content of the packet. If the endpoint should stay in its stalled state, the

microcontroller can re-stall it.

When a stalled endpoint is un-stalled (either by the Set Endpoint Status command or by

receiving a SETUP token), it is also re-initialized. This ﬂushes the buffer and if it is an OUT

buffer it waits for a DATA0 PID, if it is an IN buffer it writes a DATA0 PID.

Even when un-stalled, writing logic 0 to Set Endpoint Status initializes the endpoint.

11.3.10 Acknowledge Setup

Code (Hex) — F1

Transaction — none

The arrival of a SETUP packet ﬂushes the IN buffer, and disables the Validate Buffer and

Clear Buffer commands for both IN and OUT endpoints.

The microcontroller needs to re-enable these commands using the Acknowledge Setup

command. This ensures that the last SETUP packet stays in the buffer and no packet can

be sent back to the host, until the microcontroller has acknowledged explicitly that it has

seen the SETUP packet.

STALLED: Logic 1 indicates the endpoint is stalled.

Fig 14. Set Endpoint Status: bit allocation

765432X

0Power-on value

STALLED

reserved

XXXXXX

004aaa806

Product data sheet Rev. 09 — 11 May 2006 22 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

The microcontroller must send the Acknowledge Setup command to both the IN and OUT

endpoints.

11.4 General commands

11.4.1 Send Resume

Code (Hex) — F6

Transaction — none

Sends an upstream resume signal for 10 ms. This command is normally issued when the

device is in suspend. The Resume command is not followed by a data read or write.

11.4.2 Read Current Frame Number

Code (Hex) — F5

Transaction — read 1 or 2 B

This command is followed by one or two data reads and returns the frame number of the

last successfully received SOF. The frame number is returned least signiﬁcant byte ﬁrst.

12. Interrupt modes

[1] Bit 7 of the clock division factor byte of the Set Mode command (see Table 6).

[2] Bit 5 of the Set DMA command (see Table 7).

[3] Normal interrupts from the Interrupt register.

Fig 15. Read Current Frame Number

765432X

0least significant byte

XXXXXX

765432X

0most significant byte

0X0000

004aaa807

Table 11. Interrupt modes

SOF-ONLY INTERRUPT MODE[1] INTERRUPT PIN MODE[2] Interrupt types

0 0 Normal[3]

0 1 Normal + SOF[3]

1 X SOF only

Product data sheet Rev. 09 — 11 May 2006 23 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

13. Limiting values

[1] Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor.

14. Recommended operating conditions

[1] Supply voltage (main mode).

[2] Supply voltage (alternate mode).

[3] Operating ambient temperature in free air.

15. Static characteristics

Table 12. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VCC supply voltage −0.5 +6.0 V

VIinput voltage −0.5 VCC + 0.5 V V

Ilu latch-up current VI< 0 V or VI>V

CC - 100 mA

Vesd electrostatic discharge voltage ILI <1µA[1] −2000 +2000 V

Tstg storage temperature −60 +150 °C

Ptot total power dissipation VCC = 5.5 V - 95 mW

Table 13. Recommended operating conditions

Symbol Parameter Conditions Min Typ Max Unit

VCC1 supply voltage 1 apply VCC1 to VCC pin

only [1] 4.0 - 5.5 V

VCC2 supply voltage 2 apply VCC2 to both the

VCC and VOUT3.3 pins [2] 3.0 - 3.6 V

VIinput voltage 0 - 5.5 V

VI/O voltage on an input/output pin 0 - 5.5 V

VIA(I/O) input voltage on analog I/O

pins 0 - 3.6 V

VOoutput voltage 0 - VCC V

Tamb ambient temperature see Section 15 and

Section 16 per device [3] −40 - +85 °C

Table 14. Static characteristics (digital pins)

Symbol Parameter Conditions Min Typ Max Unit

Input levels

VIL LOW-level input voltage - - 0.8 V

VIH HIGH-level input voltage 2.0 - - V

Vhys hysteresis voltage Schmitt trigger pins 0.4 - 0.7 V

Output levels

VOL LOW-level output voltage IOL = rated drive - - 0.4 V

IOL =20µA - - 0.1 V

Product data sheet Rev. 09 — 11 May 2006 24 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

[1] Includes external resistors of 18 Ω±1 % on D+ and D−.

16. Dynamic characteristics

VOH HIGH-level output voltage IOH = rated drive 2.4 - - V

IOH =20µAV

CC −0.1 V - - V

Leakage current

IOZ off-state output current open-drain pins −5-+5µA

ILleakage current −5-+5µA

ISsuspend current oscillatorstopped and inputs

to GND/VCC

--15µA

ICC supply current - 15 mA

Table 14. Static characteristics (digital pins)

…continued

Symbol Parameter Conditions Min Typ Max Unit

Table 15. Static characteristics (AI/O pins)

Symbol Parameter Conditions Min Typ Max Unit

Leakage current

IL(dl) data line leakage current hi-Z; 0 V < VIN < 3.3 V −10 - +10 µA

Input levels

VDI differential input sensitivity |(D+) − (D−)|0.2 - - V

VCM differential common mode range includes VDI range 0.8 - 2.5 V

VSE single-ended receiver threshold 0.8 - 2.0 V

Output levels

VOL LOW-level output voltage RL of 1.5 kΩ to 3.6 V - - 0.3 V

VOH HIGH-level output voltage RL of 15 kΩ to GND 2.8 - 3.6 V

Capacitance

Cin input capacitance pin to GND - - 20 pF

Output resistance

ZDRV driver output impedance steady state drive [1] 29 - 44 Ω

Pull-up resistance

ZPU pull-up resistance SoftConnect = on 1.1 - 1.9 kΩ

Table 16. Dynamic characteristics (AI/O pins; full-speed)

= 50 pF; R

= 1.5 k

Ω

on D+ to V

; unless otherwise speciﬁed.

[1]

Symbol Parameter Conditions Min Typ Max Unit

Driver characteristics

tRrise time 10 % to 90 % 4 - 20 ns

tFfall time 10 % to 90 % 4 - 20 ns

tRFM rise time/fall time matching (tR/tF) 90 - 110 %

VCRS output signal crossover voltage 1.3 - 2.0 V

Driver timing

tEOPT source EOP width see Figure 16 160 - 175 ns

tDEOP differential data to EOP transition skew see Figure 16 −2 - +5 ns

Product data sheet Rev. 09 — 11 May 2006 25 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

[1] Test circuit, see Figure 22.

[2] Characterized but not implemented as production test. Guaranteed by design.

Receiver timing:

tJR1 receiver data jitter tolerance to next transition −18.5 - +18.5 ns

tJR2 receiver data jitter tolerance for paired transition −9 - +9 ns

tEOPR1 EOP width at receiver must reject as EOP;

see Figure 16 [2] 40 - - ns

tEOPR2 EOP width at receiver must accept as EOP;

see Figure 16 [2] 82 - - ns

Table 16. Dynamic characteristics (AI/O pins; full-speed)

…continued

= 50 pF; R

= 1.5 k

Ω

on D+ to V

; unless otherwise speciﬁed.

[1]

Symbol Parameter Conditions Min Typ Max Unit

tPERIOD is the bit duration corresponding with the USB data rate.

Fig 16. Differential data-to-EOP transition skew and EOP width

004aaa808

tPERIOD

DIFFERENTIAL

DATA LINES

CROSSOVER POINT

EXTENDED

DIFFERENTIAL DATA TO

SEO/EOP SKEW

N x tPERIOD + tDEOP

SOURCE EOP WIDTH: tEOPT

RECEIVER EOP WIDTH: tEOPR1, tEOPR2

Table 17. Dynamic characteristics (parallel interface)

Symbol Parameter Conditions Min Typ Max Unit

ALE timing

tLH ALE HIGH pulse width 20 - - ns

tAVLL address valid to ALE LOW time 10 - - ns

tLLAX ALE LOW to address transition time - - 10 ns

Write timing

tCLWL CS_N (DMACK_N) LOW to WR_N LOW time 0[1] --ns

tWHCH WR_N HIGH to CS_N (DMACK_N) HIGH time 5 - - ns

tAVWL A0 valid to WR_N LOW time 0[1] --ns

130[2] --ns

tWHAX WR_N HIGH to A0 transition time 5 - - ns

tWL WR_N LOW pulse width 20 - - ns

tWDSU write data setup time 30 - - ns

tWDH write data hold time 10 - - ns

tWC write cycle time 500[3] --ns

Product data sheet Rev. 09 — 11 May 2006 26 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

[1] Can be negative.

[2] For the DMA access only on the module 64th byte and the second last (EOT −1) byte.

[3] The tWC and tRC timing are valid for back-to-back data access only.

t(WC −WD) write command to write data 600 - - ns

Read timing

tCLRL CS_N (DMACK_N) LOW to RD_N LOW time 0[1] --ns

130[2] --ns

tRHCH RD_N HIGH to CS_N (DMACK_N) HIGH time 5 - - ns

tAVRL A0 valid to RD_N LOW time 0[1] --ns

tRL RD_N LOW pulse width 20 - - ns

tRLDD RD_N LOW to data driven time - - 20 ns

tRHDZ RD_N HIGH to data Hi-Z time - - 20 ns

tRC read cycle time 500[3] --ns

t(WC −RD) write command to read data 600 - - ns

Table 17. Dynamic characteristics (parallel interface)

…continued

Symbol Parameter Conditions Min Typ Max Unit

Fig 17. ALE timing

ALE

tLLAX

tAVLL

tLH

004aaa809

ADDRESS DATA

DATA[7:0]

Product data sheet Rev. 09 — 11 May 2006 27 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

Fig 18. Parallel interface timing (I/O and DMA)

DMACK_N

tWC

WR_N

DATA[7:0]

RD_N

DATA[7:0] VALID DATA

004aaa058

CS_N

VALID DATA

tWL

tAVRL

tAVWL tWHAX

tWDH

tWDSU

tRC

tRL

tRHDZ

tRLDD

tCLRL

tCLWL tRHCH

tWHCH

COMMAND = 1, DATA = 0

VALID DATA

tRLDD

t(WC - WD)

t(WC - RD)

tRHNDV

Table 18. Dynamic characteristics (DMA)

Symbol Parameter Conditions Min Typ Max Unit

Single-cycle DMA timing

tAHRH DMACK_N HIGH to DMREQ HIGH time - - 330 ns

tSHAH RD_N/WR_N HIGH to DMACK_N HIGH

time 130 - - ns

tRHSH DMREQ HIGH to RD_N/WR_N HIGH

time 120 - - ns

tEL EOT_N LOW pulse width simultaneous DMACK_N,

RD_N/WR_N and EOT_N

LOW time

10--ns

Burst DMA timing

tSLRL RD_N/WR_N LOW to DMREQ LOW time - - 40 ns

tRHNDV RD_N (only) HIGH to next data valid - - 420 ns

EOT timing

tELRL EOT_N LOW to DMREQ LOW time - - 40 ns

Product data sheet Rev. 09 — 11 May 2006 28 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

EOT_N is considered valid when DMACK_N, RD_N/WR_N and EOT_N are all LOW.

Fig 19. Single-cycle DMA timing

004aaa810

DMREQ

DMACK_N

RD_N/WR_N

EOT_N(1)

tRHSH tAHRH

tEL

tSHAH

Fig 20. Burst DMA timing

RD_N/WR_N

DMREQ

tRHSH

tSLRL

tSHAH

DMACK_N

004aaa811

Fig 21. DMA terminated by EOT

tELRL

RD_N/WR_N

DMREQ

DMACK_N

EOT_N

004aaa812

Product data sheet Rev. 09 — 11 May 2006 29 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

17. Test information

The dynamic characteristics of the analog I/O ports (D+ and D−) as listed in Table 16,

were determined using the circuit shown in Figure 22.

Fig 22. Load for D+ and D−

DUT test point

CL = 50 pF

1.5 kΩ is internal

15 kΩ

22 Ω

004aaa813

Product data sheet Rev. 09 — 11 May 2006 30 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

18. Package outline

Fig 23. Package outline SOT136-1 (SO28)

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZ

ywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

2.65 0.3

0.1 2.45

2.25 0.49

0.36 0.32

0.23 18.1

17.7 7.6

7.4 1.27 10.65

10.00 1.1

1.0 0.9

0.4 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.1

0.4

SOT136-1

detail X

vMA

(A )

0.25

075E06 MS-013

pin 1 index

0.1 0.012

0.004 0.096

0.089 0.019

0.014 0.013

0.009 0.71

0.69 0.30

0.29 0.05

1.4

0.055

0.419

0.394 0.043

0.039 0.035

0.016

0.01

0.25

0.01 0.004

0.043

0.016

0.01

0 5 10 mm

scale

SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1

99-12-27

03-02-19

Product data sheet Rev. 09 — 11 May 2006 31 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

Fig 24. Package outline SOT361-1 (TSSOP28)

UNIT A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.15

0.05 0.95

0.80 0.30

0.19 0.2

0.1 9.8

9.6 4.5

4.3 0.65 6.6

6.2 0.4

0.3 0.8

0.5 8

0.13 0.10.21

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT361-1 MO-153 99-12-27

03-02-19

0.25

114

28 15

pin 1 index

detail X

(A )

vMA

0 2.5 5 mm

scale

TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm SOT361-1

max.

1.1

Product data sheet Rev. 09 — 11 May 2006 32 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

19. Soldering

19.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account of

soldering ICs can be found in our

Data Handbook IC26; Integrated Circuit Packages

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface mount IC packages. Wave

soldering can still be used for certain surface mount ICs, but it is not suitable for ﬁne pitch

SMDs. In these situations reﬂow soldering is recommended.

19.2 Reﬂow soldering

Reﬂow soldering requires solder paste (a suspension of ﬁne solder particles, ﬂux and

binding agent) to be applied to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement. Driven by legislation and

environmental forces the worldwide use of lead-free solder pastes is increasing.

Several methods exist for reﬂowing; for example, convection or convection/infrared

heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)

vary between 100 seconds and 200 seconds depending on heating method.

Typical reﬂow peak temperatures range from 215 °Cto270°C depending on solder paste

material. The top-surface temperature of the packages should preferably be kept:

•below 225 °C (SnPb process) or below 245 °C (Pb-free process)

–for all BGA, HTSSON..T and SSOP..T packages

–for packages with a thickness ≥2.5 mm

–for packages with a thickness < 2.5 mm and a volume ≥350 mm3 so called

thick/large packages.

•below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a

thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

19.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices

(SMDs) or printed-circuit boards with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering method was speciﬁcally

developed.

If wave soldering is used the following conditions must be observed for optimal results:

•Use a double-wave soldering method comprising a turbulent wave with high upward

pressure followed by a smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

–larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

Product data sheet Rev. 09 — 11 May 2006 33 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

–smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

•For packages with leads on four sides, the footprint must be placed at a 45° angle to

the transport direction of the printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must be ﬁxed with a droplet of

adhesive. The adhesive can be applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C

or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated ﬂux will eliminate the need for removal of corrosive residues in most

applications.

19.4 Manual soldering

Fix the component by ﬁrst soldering two diagonally-opposite end leads. Use a low voltage

(24 V or less) soldering iron applied to the ﬂat part of the lead. Contact time must be

limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within

2 seconds to 5 seconds between 270 °C and 320 °C.

19.5 Package related soldering information

[1] For more detailed information on the BGA packages refer to the

(LF)BGA Application Note

(AN01026);

order a copy from your Philips Semiconductors sales ofﬁce.

[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal or

external package cracks may occur due to vaporization of the moisture in them (the so called popcorn

effect). For details, refer to the Drypack information in the

Data Handbook IC26; Integrated Circuit

Packages; Section: Packing Methods

[3] These transparent plastic packages are extremely sensitive to reﬂow soldering conditions and must on no

account be processed through more than one soldering cycle or subjected to infrared reﬂow soldering with

peak temperature exceeding 217 °C±10 °C measured in the atmosphere of the reﬂow oven. The package

body peak temperature must be kept as low as possible.

Table 19. Suitability of surface mount IC packages for wave and reﬂow soldering methods

Package[1] Soldering method

Wave Reﬂow[2]

BGA, HTSSON..T[3], LBGA, LFBGA, SQFP,

SSOP..T[3], TFBGA, VFBGA, XSON not suitable suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,

HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,

HVSON, SMS

not suitable[4] suitable

PLCC[5], SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended[5][6] suitable

SSOP, TSSOP, VSO, VSSOP not recommended[7] suitable

CWQCCN..L[8], PMFP[9], WQCCN..L[8] not suitable not suitable

Product data sheet Rev. 09 — 11 May 2006 34 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the

solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink

on the top side, the solder might be deposited on the heatsink surface.

[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is

deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger

than 0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on ﬂex foil. However, the image sensor package can be mounted by the client on a ﬂex foil by

using a hot bar soldering process. The appropriate soldering proﬁle can be provided on request.

[9] Hot bar soldering or manual soldering is suitable for PMFP packages.

20. Abbreviations

Table 20. Abbreviations

Acronym Description

ACPI Advanced Conﬁguration and Power Interface

CPU Central Processing Unit

CRC Cyclic Redundancy Code

DMA Direct Memory Access

DMAC Direct Memory Access Controller

EMI ElectroMagnetic Interference

FIFO First In, First Out

ISO Isochronous

MMU Memory Management Unit

NAK Not Acknowledged

OD Open-Drain

PID Packet Identiﬁer

PLL Phase-Locked Loop

POR Power-On Reset

PSIE Philips Serial Interface Engine

RAM Random Access Memory

SCSI Small Computer System Interface

SIE Serial Interface Engine

SOF Start-Of-Frame

USB Universal Serial Bus

Product data sheet Rev. 09 — 11 May 2006 35 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

21. Revision history

Table 21. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PDIUSBD12_9 20060511 Product data sheet - PDIUSBD12-08

Modiﬁcations: Updated the following:

•The format of this data sheet has been redesigned to comply with the new presentation and

information standard of Philips Semiconductors.

•The symbols and parameters have been changed, wherever applicable, to comply with the

new presentation and information standard of Philips Semiconductors.

•Changed terminology interface device to peripheral controller.

•Section 2 “Features”: removed 8 kV in circuit ESD protection from the list.

•Figure 2 “Pin conﬁguration” updated pin name for pin 24. Added additional description to

pin 11 and pin 20.

•Modiﬁed Figure 3 “Example of a parallel interface to an 80C51 microcontroller”.

•Section 11.3.5 “Read Buffer”: updated the second paragraph.

•Table 12 “Limiting values”: removed table note 2.

PDIUSBD12-08

(9397 750 08969) 20011220 Product data - PDIUSBD12-07

PDIUSBD12-07

(9397 750 08117) 20011127 Product data - PDIUSBD12-06

PDIUSBD12-06

(9397 750 04979) 20010423 Product data - -

Product data sheet Rev. 09 — 11 May 2006 36 of 39

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

22. Legal information

22.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Deﬁnitions”.

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.semiconductors.philips.com.

22.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. Philips Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local Philips Semiconductors

sales ofﬁce. In case of any inconsistency or conﬂict with the short data sheet,

the full data sheet shall prevail.

22.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, Philips Semiconductors does not give any representations

or warranties, expressed or implied, as to the accuracy or completeness of

such information and shall have no liability for the consequences of use of

such information.

Right to make changes — Philips Semiconductors reserves the right to

make changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — Philips Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of a Philips Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. Philips Semiconductors accepts no liability for inclusion and/or use

of Philips Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is for the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. Philips Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Terms and conditions of sale — Philips Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.semiconductors.philips.com/proﬁle/terms, including those

pertaining to warranty, intellectual property rights infringement and limitation

of liability, unless explicitly otherwise agreed to in writing by Philips

Semiconductors. In case of any inconsistency or conﬂict between information

in this document and such terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

22.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

GoodLink — is a trademark of Koninklijke Philips Electronics N.V.

SoftConnect — is a trademark of Koninklijke Philips Electronics N.V.

23. Contact information

For additional information, please visit: http://www.semiconductors.philips.com

For sales ofﬁce addresses, send an email to: sales.addresses@www.semiconductors.philips.com

Document status[1][2] Product status[3] Deﬁnition

Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development.

Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation.

Product [short] data sheet Production This document contains the product speciﬁcation.

Product data sheet Rev. 09 — 11 May 2006 37 of 39

continued >>

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

24. Tables

Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . .2

Table 2. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .4

Table 3. Endpoint conﬁguration . . . . . . . . . . . . . . . . . . .10

Table 4. Command summary . . . . . . . . . . . . . . . . . . . .11

Table 5. Set Mode command, conﬁguration byte: bit

allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Table 6. Set Mode command, clockdivision factor byte:bit

allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

Table 7. Set DMA command: bit allocation . . . . . . . . . .16

Table 8. Read Interrupt register, byte 1: bit allocation . .17

Table 9. Read Last Transaction Status register: bit

allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

Table 10. Error codes . . . . . . . . . . . . . . . . . . . . . . . . . . .19

Table 11. Interrupt modes . . . . . . . . . . . . . . . . . . . . . . . .22

Table 12. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .23

Table 13. Recommended operating conditions . . . . . . . .23

Table 14. Static characteristics (digital pins) . . . . . . . . . .23

Table 15. Static characteristics (AI/O pins) . . . . . . . . . . .24

Table 16. Dynamic characteristics (AI/O pins;

full-speed) . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

Table 17. Dynamic characteristics (parallel interface) . . .25

Table 18. Dynamic characteristics (DMA) . . . . . . . . . . . .27

Table 19. Suitability of surface mount IC packages for wave

and reﬂow soldering methods . . . . . . . . . . . . .33

Table 20. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .34

Table 21. Revision history . . . . . . . . . . . . . . . . . . . . . . . .35

Product data sheet Rev. 09 — 11 May 2006 38 of 39

continued >>

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

25. Figures

Fig 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

Fig 2. Pin conﬁguration . . . . . . . . . . . . . . . . . . . . . . . . . .3

Fig 3. Example of a parallel interface to an 80C51

microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

Fig 4. Set Address/Enable command: bit allocation . . .12

Fig 5. Set Endpoint Enable command: bit allocation . . .13

Fig 6. Set Mode command, conﬁguration byte: bit

allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

Fig 7. Set Mode command, clock division factor byte: bit

allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Fig 8. Set DMA command: bit allocation . . . . . . . . . . . .15

Fig 9. Interrupt register, byte 1: bit allocation. . . . . . . . .17

Fig 10. Interrupt register, byte 2: bit allocation. . . . . . . . .17

Fig 11. Select Endpoint command: bit allocation. . . . . . .18

Fig 12. Read Endpoint Status: bit allocation . . . . . . . . . .18

Fig 13. Read Last Transaction Status register: bit

allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

Fig 14. Set Endpoint Status: bit allocation. . . . . . . . . . . .21

Fig 15. Read Current Frame Number . . . . . . . . . . . . . . .22

Fig 16. Differential data-to-EOP transition skew and EOP

width. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

Fig 17. ALE timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

Fig 18. Parallel interface timing (I/O and DMA) . . . . . . . .27

Fig 19. Single-cycle DMA timing . . . . . . . . . . . . . . . . . . .28

Fig 20. Burst DMA timing. . . . . . . . . . . . . . . . . . . . . . . . .28

Fig 21. DMA terminated by EOT . . . . . . . . . . . . . . . . . . .28

Fig 22. Load for D+ and D- . . . . . . . . . . . . . . . . . . . . . . .29

Fig 23. Package outline SOT136-1 (SO28) . . . . . . . . . . .30

Fig 24. Package outline SOT361-1 (TSSOP28). . . . . . . .31

Philips Semiconductors PDIUSBD12

USB peripheral controller with parallel bus

For more information, please visit: http://www.semiconductors.philips.com.

For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com.

Date of release: 11 May 2006

Document identifier: PDIUSBD12_9

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

26. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

6 Functional description . . . . . . . . . . . . . . . . . . . 6

6.1 Analog transceiver . . . . . . . . . . . . . . . . . . . . . . 6

6.2 Voltage regulator. . . . . . . . . . . . . . . . . . . . . . . . 6

6.3 PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

6.4 Bit clock recovery . . . . . . . . . . . . . . . . . . . . . . . 6

6.5 Philips Serial Interface Engine (PSIE) . . . . . . . 6

6.6 SoftConnect . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

6.7 GoodLink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

6.8 Memory Management Unit (MMU) and

integrated RAM. . . . . . . . . . . . . . . . . . . . . . . . . 7

6.9 Parallel and DMA interface. . . . . . . . . . . . . . . . 7

6.10 Example of parallel interface to an 80C51

microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . 7

7 Direct Memory Access (DMA) transfer . . . . . . 8

8 Endpoint description. . . . . . . . . . . . . . . . . . . . . 9

9 Main endpoint. . . . . . . . . . . . . . . . . . . . . . . . . . 11

10 Command summary . . . . . . . . . . . . . . . . . . . . 11

11 Command description. . . . . . . . . . . . . . . . . . . 12

11.1 Command procedure . . . . . . . . . . . . . . . . . . . 12

11.2 Initialization commands . . . . . . . . . . . . . . . . . 12

11.2.1 Set Address/Enable . . . . . . . . . . . . . . . . . . . . 12

11.2.2 Set Endpoint Enable. . . . . . . . . . . . . . . . . . . . 13

11.2.3 Set Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

11.2.4 Set DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

11.2.4.1 DMA Conﬁguration register . . . . . . . . . . . . . . 15

11.3 Data ﬂow commands . . . . . . . . . . . . . . . . . . . 16

11.3.1 Read Interrupt register . . . . . . . . . . . . . . . . . . 16

11.3.2 Select Endpoint. . . . . . . . . . . . . . . . . . . . . . . . 18

11.3.3 Read Endpoint Status. . . . . . . . . . . . . . . . . . . 18

11.3.4 Read Last Transaction Status register . . . . . . 18

11.3.5 Read Buffer. . . . . . . . . . . . . . . . . . . . . . . . . . . 20

11.3.6 Write Buffer. . . . . . . . . . . . . . . . . . . . . . . . . . . 20

11.3.7 Clear Buffer. . . . . . . . . . . . . . . . . . . . . . . . . . . 20

11.3.8 Validate Buffer . . . . . . . . . . . . . . . . . . . . . . . . 21

11.3.9 Set Endpoint Status . . . . . . . . . . . . . . . . . . . . 21

11.3.10 Acknowledge Setup . . . . . . . . . . . . . . . . . . . . 21

11.4 General commands . . . . . . . . . . . . . . . . . . . . 22

11.4.1 Send Resume. . . . . . . . . . . . . . . . . . . . . . . . . 22

11.4.2 Read Current Frame Number. . . . . . . . . . . . . 22

12 Interrupt modes. . . . . . . . . . . . . . . . . . . . . . . . 22

13 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 23

14 Recommended operating conditions . . . . . . 23

15 Static characteristics . . . . . . . . . . . . . . . . . . . 23

16 Dynamic characteristics. . . . . . . . . . . . . . . . . 24

17 Test information. . . . . . . . . . . . . . . . . . . . . . . . 29

18 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 30

19 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

19.1 Introduction to soldering surface mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

19.2 Reﬂow soldering. . . . . . . . . . . . . . . . . . . . . . . 32

19.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 32

19.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 33

19.5 Package related soldering information. . . . . . 33

20 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 34

21 Revision history . . . . . . . . . . . . . . . . . . . . . . . 35

22 Legal information . . . . . . . . . . . . . . . . . . . . . . 36

22.1 Data sheet status. . . . . . . . . . . . . . . . . . . . . . 36

22.2 Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

22.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 36

22.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 36

23 Contact information . . . . . . . . . . . . . . . . . . . . 36

24 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

25 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

26 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39