TPCP8503
2006-11-16
1
TOSHIBA Transistor Silicon NPN Triple Diffused Type
TPCP8503
High-Voltage Switching Applications
High breakdown voltage: VCEO = 600 V
Low saturation voltage: VCE (sat) = 1.0 V (max)
(IC = 20 mA, IB = 0.5 mA)
Absolute Ma ximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
Collector-base voltage VCBO 600 V
Collector-emitter voltage VCEO 600 V
Emitter-base voltage VEBO 7 V
DC IC 50
Collector current (Note 1)
Pulse ICP 100
mA
Base current IB 25 mA
t=10s 2.2 W
Collector power dissipation
(Note 2) DC
PC
1.1 W
Junction temperature Tj 150 °C
Storage temperature range Tstg 55 to 150 °C
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc).
Unit: mm
0.33±0.05
0.28+0.1
-0.11
1.12+0.13
-0.12
2.4±0.1
0.475
0.65
2.8±0.1
A
0.05 M
2.9±0.1
41
5
8
0.8±0.05
0.17±0.02
BB
0.05 M
A
S
0.025
S
1.12+0.13
-0.12
0.28+0.1
-0.11
JEDEC
JEITA
TOSHIBA 2-3V1D
Weight: 0.36 g (typ.)
1. NC 5. NC
2. COLLECTOR 6. EMITTER
3. COLLECTOR 7. NC
4. COLLECTOR 8. B
A
SE
TPCP8503
2006-11-16
2
Electrical Characteristics (Ta = 25°C)
Characteristics Symbol Test Condition Min Typ. Max Unit
Collector cut-off current ICBO V
CB = 600 V, IE = 0 100 µA
Emitter cut-off current IEBO V
EB = 7 V, IC = 0 100 µA
Collector-emitter breakdown voltage VCEO I
C = 1 mA, IB = 0 600 V
hFE (1) V
CE = 5 V, IC = 1 mA 80
DC current gain
hFE (2) V
CE = 5 V, IC = 20 mA 100 300
Collector-emitter saturation voltage VCE (sat) IC = 20 mA, IB = 0.5 mA 1.0 V
Base-emitter voltage VBE V
CE = 5 V, IC = 20 mA 1.1 V
Collector output capacitance Cob V
CB = 10 V, IE = 0, f = 1 MHz 5.5 pF
Figure1. Circuit Configuration Figure2. Marking(Note 3)
Note 1 : Please use devices on condition that the junction temperature is below 150.
Note 2 : Mounted on FR4 board( glass epoxy, 1.6mm thick, Cu area: 645mm2)
Note 3 : on lower left of the marking indicates Pin 1.
Weekly code: (three digits)
1 2 3 4
8 7 6 5
8503
Lot No.
Type
Week of manufacture
(01 for first week of year, continues up to 52 or 53)
Year of manufacture
(One low-order digits of calendar year)
TPCP8503
2006-11-16
3
IC – VCE
hFEIC
VCE (sat) – IC
VBE (sat) – IC
VCE (sat) – IC
VBE (sat) – IC
Collector-emitter voltage VCE (V)
Collector current IC (mA)
Collector current IC (mA)
Collector current IC (mA)
Collector current IC (mA)
Collector current IC (mA)
DC current gain hFE
Collector current IC (mA)
Base emitter saturation voltage
VBE (sat) (V)
Collector-emitter saturation voltage
VCE (sat) (V)
Base emitter saturation voltage
VBE (sat) (V)
Collector-emitter saturation voltage
VCE (sat) (V)
0.2
0.5
1
2
3 4 5
Common emitter
Ta = 25°C
0
0
IB = 0.1 mA
2 4 6 8 10
20
40
60
80
100
Ta = 55°C
100
25
Common emitter
VCE = 5 V
1
0.1 1 10 100 0.3 3 30
10
100
1000
3
30
300
55
Ta = 100°C
0.01
0.1
Common emitter
IC/IB = 5
1 10 100
0.1
1
10
25
0.03
0.3
3
0.3 330
100
Ta = 55°C
0.01
0.1
Common emitter
IC/IB = 5
1 10 100
0.1
1
10
25
0.03
0.3
3
0.3 330
100
Ta = 55°C
0.01
0.1
Common emitter
IC/IB = 40
1 10 100
0.1
1
10
25
0.03
0.3
3
0.3 330
55
Ta = 100°C
0.01
0.1 1 10 100
0.1
1
100
25
0.03
0.3
3
0.3 330
10
30
Common emitter
IC/IB = 40
TPCP8503
2006-11-16
4
rth – tw
Pulse width tw (s)
Transient thermal resistance
rth (°C/W)
1
0.001 0.01 0.1 1 10 100 1000
10
100
1000
Curves should be applied in thermal limited area.
(Single non-repetitive pulse) Ta = 2 5
Mounted on FR4 board
Cu pad 645mm2,glass epoxy, t=1.6mm
Safe operating area
Collector-emitter voltage VCE (V)
Collector current IC (mA)
1
1 10 100 1000
10
100
1000
100 ms*
IC MAX. (PULSE)
VCEO MAX.
1 ms
:Single non-repetitive pulse Ta = 2 5
Note that the curves for 100ms*,10s* and
DC operation Will be different when the
devices aren’t mounted on an FR4
board(glass epoxy, 1.6mm thick, Cu area:
645mm2)
Curves must be de-rated linearly with
increase in temperature.
IC MAX.( CONTINUOUS)
10 ms100 µs
10 s*
DC OPERATION *
(Ta=25)
TPCP8503
2006-11-16
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RESTRICTION S ON PRODUCT USE 060116EAA
The information contained herein is subject to change without notice. 021023_D
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others. 021023_C