HLMP-Cxxx
T-13/4 (5 mm) Precision Optical Performance
InGaN Blue, Green and Cyan Lamps
Data Sheet
HLMP-CB15, HLMP-CB16, HLMP-CB30, HLMP-CB31, HLMP-CM15, HLMP-CM16, HLMP-CM30,
HLMP-CM31, HLMP-CE15, HLMP-CE16, HLMP-CE23, HLMP-CE24, HLMP-CE30, HLMP-CE31
Description
These high intensity blue, green and cyan LEDs are based
on InGaN material technology. InGaN is the most ecient
and cost eective material for LEDs in the blue and green
region of the spectrum. The 472 nm typical dominant
wavelength for blue and 526 nm typical dominant wave-
length for green are well suited to color mixing in full
color signs. The 505 nm typical dominant wavelength
matches international specications for green trac
signals. These LED lamps are untinted, nondiused, T-
13/4 packages incorporating second generation optics
which produce well dened spatial radiation patterns
at specic viewing cone angles. These lamps are made
with an advanced optical grade epoxy, oering superior
high temperature and high moisture resistance perfor-
mance in outdoor signal and sign applications. The high
maximum LED junction temperature limit of +130°C
enables high temperature operation in bright sunlight
conditions. The package epoxy contains both UV-A
and UV-B inhibitors to reduce the eects of long term
exposure to direct sunlight. These lamps are available
in two viewing angle for Green and Blue, and 3 viewing
angles options for Cyan to give the designer exibility
with optical design.
Features
• Well dened spatial radiation pattern
• Viewing angles: 15° , 23º and 30°
• High luminous output
• Colors: 472 nm Blue, 526 nm Green, 505 nm Cyan
• Superior resistance to moisture
• UV resistant epoxy
Benets
• Superior performance in outdoor environments
• Wavelengths suitable for color mixing in full color
(RGB) signs
Applications
• Commercial outdoor signs
• Automotive interior lights
• Front panel indicators
• Front panel backlighting
CAUTION: HLMP-CBxx, HLMP-CMxx and HLMP-CExx LEDs are Class 1C ESD sensitive. Please observe appropriate
precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
2
Device Selection Guide
Part Number
Typical
Viewing Angle
2q1/2 (Deg)[1]
Color and Typ.
Dominant Wavelength
λd (nm) [2]
Luminous Intensity,
Iv (mcd) at 20 mA [3,4,5] Leads with
Stand-Os
Package
Drawing Min. Max.
HLMP-CB15-P00xx 15° Blue 472 880 - No A
HLMP-CB15-QT0xx 15° Blue 472 1150 3200 No A
HLMP-CB15-R00xx 15° Blue 472 1500 - No A
HLMP-CB15-RSCxx 15° Blue 472 1500 2500 No A
HLMP-CB16-P00xx 15° Blue 472 880 - Yes B
HLMP-CB16-QT0xx 15° Blue 472 1150 3200 Yes B
HLMP-CM15-S00xx 15° Green 526 1900 - No A
HLMP-CM15-SV0xx 15° Green 526 1900 5500 No A
HLMP-CM15-VY0xx 15° Green 526 4200 12000 No A
HLMP-CM15-W00xx 15° Green 526 5500 - No A
HLMP-CM15-WXBxx 15° Green 526 5500 9300 No A
HLMP-CM15-WZ0xx 15° Green 526 5500 16000 No A
HLMP-CM16-S00xx 15° Green 526 1900 - Yes B
HLMP-CM16-VY0xx 15° Green 526 4200 12000 Yes B
HLMP-CM16-WYGxx 15° Green 526 5500 12000 Yes B
HLMP-CE15-VWCxx 15° Cyan 505 4200 7200 No A
HLMP-CE15-WZCxx 15° Cyan 505 5500 16000 No A
HLMP-CE15-WZQxx 15° Cyan 505 5500 16000 No A
HLMP-CE16-UXQxx 15° Cyan 505 3200 9300 Yes B
HLMP-CE16-WZBxx 15° Cyan 505 5500 16000 Yes B
HLMP-CE16-WZCxx 15° Cyan 505 5500 16000 Yes B
HLMP-CE16-WZQxx 15° Cyan 505 5500 16000 Yes B
HLMP-CE23-UVQxx 23° Cyan 505 3200 5500 No A
HLMP-CE23-UXCxx 23° Cyan 505 3200 9300 No A
HLMP-CE23-UXQxx 23° Cyan 505 3200 9300 No A
HLMP-CE23-VWCxx 23° Cyan 505 4200 7200 No A
HLMP-CE23-VWQxx 23° Cyan 505 4200 7200 No A
HLMP-CE23-VXQxx 23° Cyan 505 4200 9300 No A
HLMP-CE23-VYCxx 23° Cyan 505 4200 12000 No A
HLMP-CE24-UX0xx 23° Cyan 505 3200 9300 Yes B
HLMP-CE24-UXCxx 23° Cyan 505 3200 9300 Yes B
HLMP-CE24-UXQxx 23° Cyan 505 3200 9300 Yes B
HLMP-CE24-VXQxx 23° Cyan 505 4200 9300 Yes B
HLMP-CE24-VYCxx 23° Cyan 505 4200 12000 Yes B
HLMP-CE24-VYQxx 23° Cyan 505 4200 12000 Yes B
3
Device Selection Guide (Continued)
Part Number
Typical
Viewing Angle
2q1/2 (Deg)[1]
Color and Typ.
Dominant Wavelength
λd (nm) [2]
Luminous Intensity,
Iv (mcd) at 20 mA [3,4,5] Leads with
Stand-Os
Package
Drawing Min. Max.
HLMP-CB30-K00xx 30° Blue 472 310 - No A
HLMP-CB30-M00xx 30° Blue 472 520 - No A
HLMP-CB30-NPCxx 30° Blue 472 680 1150 No A
HLMP-CB30-NRGxx 30° Blue 472 680 1900 No A
HLMP-CB30-PQCxx 30° Blue 472 880 1500 No A
HLMP-CB31-M00xx 30° Blue 472 520 - Yes B
HLMP-CB31-NRGxx 30° Blue 472 680 1900 Yes B
HLMP-CB31-PQCxx 30° Blue 472 880 1500 Yes B
HLMP-CM30-M00xx 30° Green 526 520 - No A
HLMP-CM30-RSBxx 30° Green 526 1500 2500 No A
HLMP-CM30-S00xx 30° Green 526 1900 - No A
HLMP-CM30-TUCxx 30° Green 526 2500 4200 No A
HLMP-CM30-TW0xx 30° Green 526 2500 7200 No A
HLMP-CM30-TWAxx 30° Green 526 2500 7200 No A
HLMP-CM30-UVAxx 30° Green 526 3200 5500 No A
HLMP-CM30-UVCxx 30° Green 526 3200 5500 No A
HLMP-CM31-M00xx 30° Green 526 520 - Yes B
HLMP-CM31-S00xx 30° Green 526 1900 - Yes B
HLMP-CM31-S0Dxx 30° Green 526 1900 - Yes B
HLMP-CM31-TUCxx 30° Green 526 2500 4200 Yes B
HLMP-CM31-TW0xx 30° Green 526 2500 7200 Yes B
HLMP-CM31-TWAxx 30° Green 526 2500 7200 Yes B
HLMP-CM31-UVCxx 30° Green 526 3200 5500 Yes B
HLMP-CM31-VWCxx 30° Green 526 4200 7200 Yes B
HLMP-CE30-RSCxx 30° Cyan 505 1500 2500 No A
HLMP-CE30-RUCxx 30° Cyan 505 1500 4200 No A
HLMP-CE30-STQxx 30° Cyan 505 1900 3200 No A
HLMP-CE30-SVCxx 30° Cyan 505 1900 5500 No A
HLMP-CE30-SVQxx 30° Cyan 505 1900 5500 No A
HLMP-CE31-SVCxx 30° Cyan 505 1900 5500 Yes B
HLMP-CE31-SVQxx 30° Cyan 505 1900 5500 Yes B
Notes:
1. q1/2 is the o-axis angle where the luminous intensity is one half the on-axis intensity.
2. Dominant Wavelength, λd, is derived from the CIE Chromaticity. Diagram and represents the color of the lamp.
3. The luminous intensity is measured on the mechanical axis of the lamp package.
4. The optical axis is closely aligned with the package mechanical axis.
5. Tolerance for each intensity bin limit is ±15%.
4
Part Numbering System
HLMP - X X XX - X X X XX
Mechanical Options
00: Bulk
DD: Ammo Pack
YY: Flexi bin, Bulk
ZZ: Flexi bin, Ammo Pack
Color Bin Selection
0: Full color range
A: Color bin 1 & 2 only
B: Color bin 2 & 3 only
C: Color bin 3 & 4 only
G: Color bin 2, 3 & 4 only
Q: Color bin 7 & 8 only
Maximum Intensity Bin
0: No maximum Iv bin limit
Others: Refer to Intensity Bin Limit Table
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Angle and Standoff Options
15: 15 degree without standoff
16: 15 degree with standoff
23: 23 degree without standoff
24: 23 degree with standoff
30: 30 degree without standoff
31: 30 degree with standoff
Color
B: Blue
M: Green
E: Cyan
Package
C: T-1 3/4 (5 mm) round lamp
5
Package Dimensions
Package A Package B
HLMP-Cx16 HLMP-Cx24 HLMP-Cx31
d = 12.6 ± 0.18 d = 12.40 ± 0.25 d = 12.22 ± 0.50
(0.496 ± 0.007) (0.488 ± 0.010) (0.481 ± 0.020)
Notes:
1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
1.14 ± 0.20
(0.045 ± 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
31.60
(1.244) MIN.
0.70 (0.028)
MAX.
1.00
(0.039) MIN.
8.71 ± 0.20
(0.343 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
CATHODE
LEAD
2.35 (0.093)
MAX.
CATHODE
FLAT
1.14 ± 0.20
(0.045 ± 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
31.60
(1.244) MIN.
0.70 (0.028)
MAX.
1.00
(0.039) MIN.
8.71 ± 0.20
(0.343 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
CATHODE
LEAD
CATHODE
FLAT
d
1.50 ± 0.15
(0.059 ± 0.006)
6
Absolute Maximum Ratings at TA= 25°C
Parameter Value Units
DC Forward Current [1] 30 mA
Peak Forward Current 100 mA
Power Dissipation
Blue
Green / Cyan
111
117
mW
Reverse Voltage (IR= 100 µA) 5 V
LED Junction Temperature 130 °C
Operating Temperature Range -40 to +80 °C
Storage Temperature Range -40 to +100 °C
Note:
1. Derate linearly as shown in Figure 4 for temperatures above 50°C.
2. Duty Factor 10%, 1kHz
Electrical/Optical Characteristics at TA = 25°C
Parameter Symbol Min. Typ. Max. Units Test Conditions
Forward Voltage
Blue
Green / Cyan
VF
3.2
3.2
3.7
3.9
V IF= 20 mA
Reverse Voltage VR5 IR = 100 µA
Peak Wavelength
Blue (λd = 472 nm)
Green (λd = 526 nm)
Cyan (λd = 505 nm)
lpeak
470
524
502
nm Peak of Wavelength of
Spectral Distribution at IF = 20 mA
Spectral Halfwidth
Blue (λd = 472 nm)
Green (λd = 526 nm)
Cyan (λd = 505 nm)
Dl1/2
35
47
35
nm Wavelength Width at Spectral Power
Point at IF = 20 mA
Capacitance
Blue/ Green
Cyan
C
43
40
pF VF = 0, F = 1 MHz
Luminous Ecacy
Blue (λd = 472 nm)
Green (λd = 526 nm)
Cyan (λd = 505 nm)
ηv
75
520
350
lm/W Emitted Luminous Power/Emitted
Radiant Power
Thermal Resistance RqJ-PIN 240 °C/W LED Junction-to-Cathode Lead
Notes:
1. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
2. The radiant intensity, le in watts per steradian, may be found from the equation le = IV/hV, where Iv is the luminous intensity in candelas and hV is
the luminous ecacy in lumens/watt.
7
Figure 1. Relative intensity vs. wavelength. Figure 2 : Forward current vs. forward voltage.
Figure 3. Relative luminous intensity vs. forward current. Figure 4. Maximum forward current vs. ambient temperature.
Figure 5. Color vs. forward current
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
RELATIVE INTENSITY
Green
Blue
Cyan
0
5
10
15
20
25
30
35
0 0.5 1 1.5 2 2.5 3 3.5 4
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
Green/ Cyan
Blue
0
1.5
0.5
INTENSITY NORMALIZED AT 20 mA
IF
- FORWARD CURRENT - mA
30
1.0
10 25200 515
I
F
- FORWARD CURRENT - mA
0
0
TA - AMBIENT TEMPERATURE - oC
40 80
40
35
25
15
10
20 60 100
5
20
30
Figure 6. Spatial radiation pattern – 15° lamps.
Figure 8. Spatial radiation pattern – 30° lamps.Figure 7. Spatial radiation pattern – 23° lamps.
NORMALIZED INTENSITY
0
ANGULAR DISPLACEMENT - DEGREES
0.8
0.6
0.2
-30
0.4
10 20-20 -10 0 3 0
0.9
0.7
0.5
0.3
0.1
RELATIVE INTENSITY
1.0
0
ANGLE - DEGREES
0.5
-30 0 30 50-50 10-20 -10 20
-40 40
0.990
0.995
1.000
1.005
1.010
1.015
1.020
1.025
1.030
0 5 10 15 20 25 30 35
DC FORWARD CURRENT - mA
RELATIVE DOMINANT WAVELENGTH - nm
Blue
Cyan
Green
8
Color Bin Limits (nm at 20 mA)
Blue Color Range (nm)
Bin ID Min. Max.
1 460.0 464.0
2 464.0 468.0
3 468.0 472.0
4 472.0 476.0
5 476.0 480.0
Tolerance for each bin limit is ± 0.5 nm.
Green Color Range (nm at 20mA)
Bin ID Min. Max.
1 520.0 524.0
2 524.0 528.0
3 528.0 532.0
4 532.0 536.0
5 536.0 540.0
Tolerance for each bin limit is ± 0.5 nm.
Cyan Color Range (nm)
Bin ID Min. Max.
1
2 495 500
3 500 505
4 505 510
7 498 503
8 503 508
Tolerance for each bin limit is ± 0.5 nm
Intensity Bin Limits
Bin Name Min. Max.
K 310 400
L 400 520
M 520 680
N 680 880
P 880 1150
Q 1150 1500
R 1500 1900
S 1900 2500
T 2500 3200
U 3200 4200
V 4200 5500
W 5500 7200
X 7200 9300
Y 9300 12000
Z 12000 16000
Tolerance for each intensity bin limit is ± 15%.
Note:
1. All bin categories are established for classication of products.
Products may not be available in all bin categories. Please contact
your Avago representatives for further information.
Relative Light Output vs. Junction Temperature
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
-40 -20 0 20 40 60 80 100 120 140
TJ - JUNCTION TEMPERATURE -°C
RELATIVE LIGHT OUTPUT
( NORMALIZED AT TJ = ºC)
Green
Blue
Cyan
9
Avago Technologies LED conguration
Precautions:
Lead Forming:
• The leads of an LED lamp may be performed or cut to
length prior to insertion and soldering on PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress that
induced into the LED package. Otherwise, cut the
leads to applicable length after soldering process at
room temperature. The solder joint formed will absorb
the mechanical stress, due to the lead cutting, from
traveling to the LED chip die attach and wirebond.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
Soldering condition:
• Care must be taken during PCB assembly and
soldering process to prevent damage to the LED
component.
• The closest manual soldering distance of the soldering
heat source (soldering iron’s tip) to the body is
1.59mm. Soldering the LED closer than 1.59mm might
damage the LED.
• Recommended soldering condition:
Wave Soldering
Manual Solder
Dipping
Pre-heat temperature 105 °C Max. -
Preheat time 30 sec Max -
Peak temperature 250 °C Max. 260 °C Max.
Dwell time 3 sec Max. 5 sec Max
• Wave soldering parameter must be set and maintain
according to the recommended temperature and
dwell time. Customer is advised to daily check on the
soldering prole to ensure that the soldering prole
is always conforming to recommended soldering
condition.
Note:
1. PCB with dierent size and design (component density) will
have dierent heat mass (heat capacity). This might cause a
change in temperature experienced by the board if same wave
soldering setting is used. So, it is recommended to re-calibrate
the soldering prole again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high
eciency LED die with single wire bond as shown below.
Customer is advised to take extra precaution during wave
soldering to ensure that the maximum wave temperature is
not exceeding 250°C. Over-stressing the LED during soldering
process might cause premature failure to the LED due to
delamination.
Note: Electrical connection between bottom surface of LED die and
the lead frame material through conductive paste of solder.
• If necessary, use xture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• At elevated temperature, the LED is more susceptible
to mechanical stress. Therefore, PCB must allowed to
cool down to room temperature prior to handling,
which includes removal of jigs, xtures or pallet.
• Special attention must be given to board fabrication,
solder masking, surface platting and lead holes size
and component orientation to assure the solderability.
• Recommended PC board plated through holes size for
LED component leads.
LED component
lead size Diagonal
Plated through
hole diameter
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.646 mm
(0.025 inch)
0.976 to 1.078 mm
(0.038 to 0.042 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
0.718 mm
(0.028 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
• Over sizing of plated through hole can lead to twisting
or improper LED placement during auto insertion.
Under sizing plated through hole can lead to
mechanical stress on the epoxy lens during clinching.
Note: Refer to application note AN1027 for more information on
soldering LED components.
Cathode
1.59mm
10
Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless stando or non-stando
Ammo Packs Drawing
Recommended Wave Soldering Prole
BOTTOM SIDE
TOP SIDE
NOTE: ALLOW FOR BOARDS TO BE
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
250
200
150
FLUXING
TURBULENT WAVE
PREHEAT
TIME - SECONDS
TEMPERATURE - °C
100
50
30
0 10 20 30 40 50 60 70 80 90 100
LAMINAR WAVE
HOT AIR KNIFE
LEAD FREE SOLDER
96.5%Sn; 3.0%Ag; 0.5% Cu
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
OF PC BOARD
OF PC BOARD
PREHEAT SETTING = 150
°
C (100
°
C PCB)
SOLDER WAVE TEMPERATURE = 245
°
C ± 5˚C
AIR KNIFE AIR TEMPERATURE = 390
°
C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
SOLDER: SN63; FLUX: RMA
AIR KNIFE ANGLE = 40
AA
12.70±1.00
0.50±0.0394
20.50±1.00
0.807±0.039
18.00±0.50
0.7087±0.0197
9.125±0.625
0.3593±0.0246
12.70±0.30
0.50±0.0118
0.70±0.20
0.0276±0.0079
6.35±1.30
0.25±0.0512
∅4.00±0.20TYP.
0.1575±0.008
CATHODE
VIEW A-A
Note: For InGaN device, the ammo pack packaging box contain ESD logo
Packaging Box for Ammo Packs
DISCLAIMER
AVAGO TECHNOLOGIES’ PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AU-
THORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE
OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS
SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS,
DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved.
AV02-0213EN - March 21, 2007