©2012 Littelfuse, Inc.
Gas Discharge Tube (GDT) Products
10
Revised: June 6, 2012 Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
CG5 and SL0902A Series
CG5 and SL0902A Series
Note: These devices are not recommended for IR
or Convection Reflow process.
Reflow Condition 1Co'SFFBTTFNCMZ
Pre Heat
- Temperature Min (Ts(min))¡$
- Temperature Max (Ts(max))¡$
- Time (Min to Max) (ts)oTFDT
Average ramp up rate (Liquidus Temp
(TL) to peak ¡$TFDPOENBY
TS(max) to TL - Ramp-up Rate ¡$TFDPOENBY
Reflow - Temperature (TL) (Liquidus) ¡$
- Temperature (tL)oTFDPOET
Peak Temperature (TP)260+0/-5¡$
Time within 5°C of actual peak
Temperature (tp)oTFDPOET
Ramp-down Rate ¡$TFDPOENBY
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed ¡$
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
(t 25ºC to peak)
Ramp-down
Ramp-up
Preheat
Critical Zone
TL to TP
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
Soldering Parameters - Hand Soldering
Dwell Time
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
Time (Seconds)
Temperature (°C) - Measured on bottom side of board
Cooling Time
Preheat Time
Wave Parameter Lead-Free Recommendation
Preheat:
%FQFOETPO'MVY"DUJWBUJPO5FNQFSBUVSF 5ZQJDBM*OEVTUSZ3FDPNNFOEBUJPO
Temperature Minimum: 100¡C
Temperature Maximum: 150¡C
Preheat Time: 60-180 seconds
Solder Pot Temperature: 280¡C Maximum
Solder Dwell Time: 2-5 seconds
Recommended Process Parameters:
4PMEFS*SPO5FNQFSBUVSF¡$¡$
)FBUJOH5JNFTFDPOETNBY