BAV102,135 - NXP - Datasheet.Directory

1. Product profile

1.1 General description

Single general-purpose switching diodes, fabricated in planar technology, and

encapsulated in small hermetically sealed glass SOD80C Surface-Mounte d

Device (SMD) packages.

1.2 Features and benefits

1.3 Applications

1.4 Quick reference data

[1] Pulse test: tp≤300 μs; δ≤0.02.

[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[3] When switched from IF= 30 mA to IR=30mA; R

L= 100 Ω; measured at IR=3mA.

BAV102; BAV103

Single general-purpose switching diodes

Rev. 4 — 6 August 2010 Product data sheet

Table 1. Product overview

Type number Package Configuration

NXP JEITA

BAV102 SOD80C - single

BAV103

High switching speed: trr ≤50 ns Low capacitance: Cd≤5pF

Low leakage current Small hermetically sealed glass

SMD package

High-speed switching Voltage clamping

General-purpose switching Reverse polarity protection

Table 2. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

IFforward current [1][2] - - 250 mA

VRreverse volt age

BAV102 - - 150 V

BAV103 - - 200 V

trr reverse recovery time [3] --50ns

Product data sheet Rev. 4 — 6 August 2010 2 of 11

NXP Semiconductors BAV102; BAV103

Single general-purpose switching diodes

2. Pinning information

[1] The marking band indicates the cathode.

3. Ordering information

4. Marking

5. Limiting values

Table 3. Pinning

Pin Description Simplified outline Graphic symbol

1 cathode [1]

2 anode ka

006aab04

Table 4. Orderin g i nformation

Type number Package

Name Description Version

BAV102 - hermetically sealed glass surface-mounted package;

2 connectors SOD80C

BAV103

Table 5. Marking codes

Type number Marking code

BAV102 marking band

BAV103 marking band

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VRRM repetitive peak reverse

voltage

BAV102 - 200 V

BAV103 - 250 V

VRreverse volt age

BAV102 - 150 V

BAV103 - 200 V

IFforward current [1][2] -250mA

IFRM repetitive peak forward

current -625mA

IFSM non-repetitive peak

forward current square wave [3]

tp=1μs-9A

tp=100μs-3A

tp=1s - 1 A

Product data sheet Rev. 4 — 6 August 2010 3 of 11

NXP Semiconductors BAV102; BAV103

Single general-purpose switching diodes

[1] Pulse test: tp≤300 μs; δ≤0.02.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[3] Tj=25°C prior to surge.

6. Thermal characteristics

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

7. Characteristics

[1] Pulse test: tp≤300 μs; δ≤0.02.

[2] When switched from IF= 30 mA to IR=30mA; R

L= 100 Ω; measured at IR=3mA.

Ptot total power dissipation Tamb ≤25 °C[2] -400mW

Tjjunction temperature - 175 °C

Tamb ambient temperature −65 +175 °C

Tstg storage temperature −65 +175 °C

Table 6. Limiting values …continued

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Table 7. Thermal characteris tics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistance from

junction to ambient in free air [1] - - 375 K/W

Rth(j-t) thermal resistance from

junction to tie-point - - 300 K/W

Table 8. Characteristics

Tamb =25

C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VFforward voltage [1]

IF=100mA --1.0V

IF=200mA --1.25V

IRreverse current

BAV102 VR= 150 V - - 100 nA

VR=150V; T

j= 150 °C - - 100 μA

BAV103 VR= 200 V - - 100 nA

VR=200V; T

j= 150 °C - - 100 μA

Cddiode capacitance f = 1 MHz; VR=0V --5pF

trr reverse recovery time [2] --50ns

Product data sheet Rev. 4 — 6 August 2010 4 of 11

NXP Semiconductors BAV102; BAV103

Single general-purpose switching diodes

(1) Tamb = 150 °C; typical values

(2) Tamb =25°C; typical values

(3) Tamb =25°C; maximum values

Based on square wave currents.

Tj=25°C; prior to surge

Fig 1. Forward current as a function of forward

voltage Fig 2. No n-repetitive peak forward current as a

function of pulse duration; maximum values

VR=V

Rmax

Solid line: maximum values

Dotted line: typical values

f=1MHz; T

amb =25°C

Fig 3. Reverse current as a function of junction

temperature Fig 4. Diode capacitance as a function of reverse

voltage; typical values

mbg459

012

600

200

400

VF (V)

(mA)

(1) (2) (3)

mbg703

102

IFSM

(A)

10−1

tp (μs)

110

103

10 102

mgd009

0 100 Tj (°C) 200

103

102

10−1

10−2

(μA)

mgd005

01020

1.6

1.4

1.0

0.8

1.2

VR (V)

(pF)

Product data sheet Rev. 4 — 6 August 2010 5 of 11

NXP Semiconductors BAV102; BAV103

Single general-purpose switching diodes

8. Test information

FR4 PCB, standard footprint FR4 PCB, standard footprint

(1) BAV103

(2) BAV102

Fig 5. Forward current as a function of ambient

temperature; derating curve Fig 6. Reverse voltage as a function of ambient

temperature; derating cu rve

mbh278

0 100 200

300

200

100

Tamb (°C)

(mA)

mgl588

0 200

300

100

200

100

(1)

(V)

Tamb (°C)

(2)

(1) IR=1mA

Fig 7. Re verse recovery time test circuit and wav eforms

trr

(1)

+ I

output signal

10 %

90 %

input signal

V = V

= 50 ΩI

D.U.T.

= 50 Ω

SAMPLING

OSCILLOSCOPE

mga881

Product data sheet Rev. 4 — 6 August 2010 6 of 11

NXP Semiconductors BAV102; BAV103

Single general-purpose switching diodes

9. Package outline

10. Packing information

[1] For further information and the availability of packing methods, see Section 14.

Fig 8. Package outline SOD80C

06-03-16Dimensions in mm

1.60

1.45

0.3

3.7

3.3

0.3

Table 9. Packing methods

The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]

Type number Package Description Packing quantity

2500 10000

BAV102 SOD80C 4 mm pitch, 8 mm tape and reel -115 -135

BAV103

Product data sheet Rev. 4 — 6 August 2010 7 of 11

NXP Semiconductors BAV102; BAV103

Single general-purpose switching diodes

11. Soldering

Fig 9. Reflow soldering footprint SOD80C

Fig 10. Wave soldering footprint SOD80C

sod080c

2.30

4.30

4.55

1.601.702.25

0.90

(2x)

solder lands

solder resist

occupied area

solder paste

Dimensions in mm

sod080c

2.70

4.90

6.30

1.702.90

1.90

solder lands

tracks

solder resist

occupied area

Dimensions in mm

Product data sheet Rev. 4 — 6 August 2010 8 of 11

NXP Semiconductors BAV102; BAV103

Single general-purpose switching diodes

12. Revision history

Table 10. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BAV102_BAV103 v. 4 20100806 Product data sheet - BAV102_BAV103_3

Modifications: •Section 4 “Marking”: updated

•Section 13 “Legal information”: updated

BAV102_BAV103_3 20070816 Product data sheet - BAV100_2

BAV100_2 19960917 Product specification - BAV100_1

BAV100_1 19960423 Product specification - -

Product data sheet Rev. 4 — 6 August 2010 9 of 11

NXP Semiconductors BAV102; BAV103

Single general-purpose switching diodes

13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

13.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full informatio n see the relevant full dat a

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre va il.

Product specificat ion — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyon d those described in the

Product data sheet.

13.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental ,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregat e and cumulative liabil ity towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors pro duct can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or application s and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associate d with t heir

applications and products.

NXP Semiconductors does not accept any liabili ty related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo m er(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by cust omer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or inte llectual property right s.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contain s data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 4 — 6 August 2010 10 of 11

NXP Semiconductors BAV102; BAV103

Single general-purpose switching diodes

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors prod uct is automotive qualified,

the product is not suitable for aut omo tive use. It i s neither qua lif ied nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standards, custome r

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y

liability, damages or failed product cl aims resulting from custome r design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specif ications.

13.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors BAV102; BAV103

Single general-purpose switching diodes

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 6 August 2010

Document identifier : BA V 102 _B A V1 03

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

15. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6

10 Packing information . . . . . . . . . . . . . . . . . . . . . 6

11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9

13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

14 Contact information. . . . . . . . . . . . . . . . . . . . . 10

15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11