SMD NTC Thermistors (EPCOS)
Series/Type: B57471V2
The following products presented in this data sheet are being withdrawn.
Ordering Code Substitute Product Date of
Withdrawal Deadline Last
Orders Last
Shipments
B57471V2684J062 2020-10-02 2021-01-08 2021-04-09
B57471V2684H062 2020-10-02 2021-01-08 2021-04-09
Please contact your nearest TDK sales office if you need support in selecting a suitable
substitute. The addresses of our worldwide sales network are presented at www.tdk-
electronics.tdk.com/sales.
1) Depends on mounting situation
Applications
Temperature measurement and
compensation
Features
Multilayer SMD NTC with inner electrodes
Nickel barrier termination
For temperature measurement up to 125 °C
Excellent long-term aging stability in high
temperature environment
High mechanical robustness
Short response time
100% Pb free
UL approval (E69802)
Options
Alternative resistance ratings, resistance
tolerances and B value tolerances available
on request.
Delivery mode
Blister tape, 180-mm reel (standard);
330-mm reel (on request)
Dimensional drawing
Dimensions in mm
Approx. weight 13 mg
General technical data
Operating temperature range Top 55 ... 125 °C
Max. power (at 25 °C, on PCB) P251) 210 mW
Resistance tolerance ∆RR/RR±3, ±5 %
Rated temperature TR25 °C
Dissipation factor (on PCB) δth1) approx. 3.5 mW/K
Thermal cooling time constant (on PCB) τc1) approx. 10 s
Heat capacity Cth1) approx. 35 mJ/K
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 2 of 27Please read Cautions and warnings and
Important notes at the end of this document.
Electrical specification and ordering codes
R25
Ω∆RR/RR
%
No. of R/T
characteristic
B25/50
K
B25/85
K
B25/100
K
Ordering code
+ = Resistance tolerance
H = ±3%
J = ±5%
1.0 k ±3, ±5 8502 3940 3980 4000 ±3% B57421V2102+062
1.5 k ±3, ±5 8502 3940 3980 4000 ±3% B57421V2152+062
2.2 k ±3, ±5 8502 3940 3980 4000 ±3% B57421V2222+062
3.3 k ±3, ±5 8502 3940 3980 4000 ±3% B57421V2332+062
4.7 k ±3, ±5 8500 3590 3635 3650 ±3% B57401V2472+062
4.7 k ±3, ±5 8507 4386 4455 4480 ±3% B57471V2472+062
6.8 k ±3, ±5 8507 4386 4455 4480 ±3% B57471V2682+062
10 k ±3, ±5 8500 3590 3635 3650 ±3% B57401V2103+062
10 k ±5 1011 3660 3720 3730 ±3% B57620C5103J062
10 k ±3, ±5 8502 3940 3980 4000 ±3% B57421V2103+062
10 k ±3, ±5 8507 4386 4455 4480 ±3% B57471V2103+062
15 k ±5 8502 3940 3980 4000 ±3% B57421V2153J062
22 k ±3, ±5 8502 3940 3980 4000 ±3% B57421V2223+062
22 k ±3, ±5 8507 4386 4455 4480 ±3% B57471V2223+062
33 k ±3, ±5 8502 3940 3980 4000 ±3% B57421V2333+062
33 k ±3, ±5 8507 4386 4455 4480 ±3% B57471V2333+062
47 k ±3, ±5 8502 3940 3980 4000 ±3% B57421V2473+062
47 k ±3, ±5 8507 4386 4455 4480 ±3% B57471V2473+062
100 k ±3, ±5 8507 4386 4455 4480 ±3% B57471V2104+062
470 k ±3, ±5 8507 4386 4455 4480 ±3% B57471V2474+062
680 k ±3, ±5 8507 4386 4455 4480 ±3% B57471V2684+062
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 3 of 27Please read Cautions and warnings and
Important notes at the end of this document.
Reliability data
SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a
standardized PCB in accordance with IEC 60539-1.
Test Standard Test conditions ∆R25/R25
(typical)
Remarks
Storage in
dry heat
IEC
60068-2-2
JIS C 0021
Storage at upper
category temperature
T: (125 ±2) °C
t: 1000 h
< 2%1)
Storage in damp
heat, steady state
IEC
60068-2-78
JIS C 0022
Temperature of air: (40 ±2) °C
Relative humidity of air:
(93 +2/3)%
Duration: 56 days2)
< 2%2)
Rapid temperature
cycling
IEC
60068-2-14
JIS C 0025
Lower test temperature: 55 °C
Upper test temperature: 125 °C
Number of cycles: 1003)
< 2%3)
Endurance Pmax: 210 mW
T: (65 ±2) °C
t: 1000 h
< 2%4)
Solderability IEC
60068-2-58
JIS C 0054
Solderability:
(215 ±3) °C, (3 ±0.3) s
(245 ±5) °C, (3 ±0.3) s
Resistance to soldering heat:
(260 ±5) °C, (10 ±1) s
95% of
terminations
wetted
Resistance drift
after soldering
Reflow soldering profile
Wave soldering profile
< 1%4)
1) Except B57620C5102+062 ∆R25/R25 (typical): < 6%, B57620C5103+062 ∆R25/R25 (typical): < 3%
2) Except B57620C5102+062 and B57620C5103+062 duration: 21 days, ∆R25/R25 (typical): < 3%
3) Except B57620C5102+062 and B57620C5103+062 number of cycles: 10, ∆R25/R25 (typical): < 3%
4) Except B57620C5102+062 and B57620C5103+062 ∆R25/R25 (typical): < 5%
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 4 of 27Please read Cautions and warnings and
Important notes at the end of this document.
R/T characteristics
R/T No. 1011 8500 8502
T (°C) B25/100 = 3730 K B25/100 = 3650 K B25/100 = 4000 K
RT/R25 α(%/K) RT/R25 α(%/K) RT/R25 α(%/K)
55.0 70.014 6.9 63.917 6.8 96.158 7.4
50.0 49.906 6.7 45.889 6.5 66.892 7.1
45.0 36.015 6.4 33.344 6.3 47.127 6.9
40.0 26.296 6.2 24.504 6.1 33.606 6.6
35.0 19.411 6.0 18.201 5.8 24.243 6.4
30.0 14.479 5.8 13.657 5.6 17.681 6.2
25.0 10.903 5.6 10.347 5.5 13.032 6.0
20.0 8.2923 5.4 7.9114 5.3 9.702 5.8
15.0 6.3591 5.2 6.1019 5.1 7.2923 5.6
10.0 4.9204 5.1 4.7454 4.9 5.5314 5.4
5.0 3.8279 4.9 3.7198 4.8 4.2325 5.3
0.0 3.0029 4.8 2.938 4.6 3.2657 5.1
5.0 2.3773 4.6 2.3372 4.5 2.54 4.9
10.0 1.8959 4.5 1.8722 4.4 1.9907 4.8
15.0 1.5207 4.3 1.5096 4.2 1.5716 4.7
20.0 1.228 4.2 1.2249 4.1 1.2494 4.5
25.0 1.0000 4.1 1.0000 4.0 1.0000 4.4
30.0 0.81779 3.9 0.82111 3.9 0.80552 4.3
35.0 0.67341 3.8 0.67798 3.8 0.65288 4.1
40.0 0.55747 3.7 0.56279 3.7 0.53229 4.0
45.0 0.46357 3.6 0.46958 3.6 0.43645 3.9
50.0 0.3874 3.6 0.39374 3.5 0.35981 3.8
55.0 0.32368 3.5 0.33171 3.4 0.29819 3.7
60.0 0.272 3.4 0.28073 3.3 0.24837 3.6
65.0 0.23041 3.3 0.23863 3.2 0.20787 3.5
70.0 0.19604 3.2 0.2037 3.1 0.17479 3.4
75.0 0.16735 3.1 0.17459 3.0 0.14763 3.3
80.0 0.14342 3.0 0.15022 3.0 0.12523 3.2
85.0 0.12347 3.0 0.12975 2.9 0.10667 3.2
90.0 0.10668 2.8 0.11247 2.8 0.091227 3.1
95.0 0.092734 2.8 0.097838 2.8 0.078319 3.0
100.0 0.080903 2.8 0.085396 2.7 0.067488 2.9
105.0 0.070616 2.7 0.074781 2.6 0.058363 2.9
110.0 0.061826 2.6 0.065691 2.6 0.050647 2.8
115.0 0.054282 2.6 0.057883 2.5 0.044098 2.7
120.0 0.047793 2.5 0.051153 2.4 0.03852 2.7
125.0 0.042249 2.4 0.045335 2.4 0.033752 2.6
130.0 0.040289 2.3 0.029663 2.6
135.0 0.0359 2.3 0.026146 2.5
140.0 0.032071 2.2 0.023111 2.4
145.0 0.028723 2.2 0.020484 2.4
150.0 0.025786 2.1 0.018203 2.3
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 5 of 27Please read Cautions and warnings and
Important notes at the end of this document.
R/T characteristics
R/T No. 8507
T (°C) B25/100 = 4480 K T (°C) B25/100 = 4480 K T (°C) B25/100 = 4480 K
RT/R25 α(%/K) RT/R25 α(%/K) RT/R25 α(%/K)
55.0 142.71 7.9 15.0 1.6492 5.1 85.0 0.081823 3.6
50.0 96.913 7.6 20.0 1.2798 5.0 90.0 0.068589 3.5
45.0 66.637 7.4 25.0 1.0000 4.9 95.0 0.057735 3.4
40.0 46.366 7.1 30.0 0.78663 4.7 100.0 0.048796 3.3
35.0 32.629 6.9 35.0 0.62277 4.6 105.0 0.041403 3.2
30.0 23.213 6.7 40.0 0.4961 4.5 110.0 0.035263 3.2
25.0 16.686 6.5 45.0 0.39757 4.4 115.0 0.030143 3.1
20.0 12.115 6.3 50.0 0.32044 4.3 120.0 0.025858 3.0
15.0 8.8803 6.1 55.0 0.2597 4.1 125.0 0.022258 3.0
10.0 6.5692 5.9 60.0 0.21161 4.0 130.0 0.019223 2.9
5.0 4.9025 5.8 65.0 0.17331 3.9 135.0 0.016655 2.8
0.0 3.6896 5.6 70.0 0.14265 3.8 140.0 0.014476 2.8
5.0 2.7994 5.4 75.0 0.11799 3.8 145.0 0.012619 2.7
10.0 2.1406 5.3 80.0 0.098035 3.7 150.0 0.011033 2.7
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 6 of 27Please read Cautions and warnings and
Important notes at the end of this document.
Taping and packing
1 Taping of SMD NTC thermistors
Tape and reel packing according to IEC 60286-3.
Tape material: Cardboard or blister, tape width 8 ±0.30 mm
2 Reel packing
Dimensions in mm
8-mm tape
180-mm reel 330-mm reel
A 180 +0/3 330 +0/2.0
W18.4 +1.5/0 8.4 +1.5/0
W214.4 max. 14.4 max.
Leader, trailer
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 7 of 27Please read Cautions and warnings and
Important notes at the end of this document.
Packing units for discrete chip
Case size Chip thickness Cardboard tape Blister tape ∅180-mm reel ∅330-mm reel
inch/mm th W Wpcs. pcs.
0402/1005 0.5 mm 8 mm 10000 50000
0603/1608 0.8 mm 8 mm 8 mm 4000 16000
0805/2012 0.8 mm 8 mm 2000/ 4000 16000
1.2 mm 8 mm 3000 12000
1206/3216 0.8 mm 8 mm 2000 12000
1.2 mm 8 mm 4000 12000
3 Packing codes
The last two digits of the complete ordering code state the packing mode:
Last two digits
60 SMD Cardboard tape 180-mm reel packing
62 SMD Blister tape 180-mm reel packing
70 SMD Cardboard tape 330-mm reel packing
72 SMD Blister tape 330-mm reel packing
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 8 of 27Please read Cautions and warnings and
Important notes at the end of this document.
4 Taping of radial leaded NTC thermistors
Dimensions and tolerances
Lead spacing F = 2.5 mm and 5.0 mm (taping to IEC 60286-2)
Dimensions (mm)
Lead
spacing
2.5 mm
Lead
spacing
5 mm
Tolerance of
lead spacing
2.5/5 mm
Remarks
w 11.0 11.5 max.
th 5.0 6.0 max.
d 0.5/0.6 0.5/0.6 ±0.05
P012.7 12.7 ±0.3 ±1 mm / 20 sprocket holes
P15.1 3.85 ±0.7
F 2.5 5.0 +0.6/0.1
∆h 0 0 ±2.0 measured at top of component body
∆p 0 0 ±1.3
W 18.0 18.0 ±0.5
W05.5 5.5 min. peel-off force ≥5 N
W19.0 9.0 +0.75/0.5
W23.0 3.0 max.
H 18.0 18.0 +2.0/0
H016.0 16.0 ±0.5
H132.2 32.2 max.
D04.0 4.0 ±0.2
t 0.9 0.9 max. without wires
L 11.0 11.0 max.
L14.0 4.0 max.
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 9 of 27Please read Cautions and warnings and
Important notes at the end of this document.
Types of packing
Ammo packing
Ammo
type
xyz
I 80 240 210
Packing unit: 1000 - 2000 pcs./reel
Reel packing
Packing unit: 1000 - 2000 pcs./reel
Reel dimensions (in mm)
Reel type d f n w
I 360 max. 31 ±1 approx. 45 54 max.
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 10 of 27Please read Cautions and warnings and
Important notes at the end of this document.
Cassette packing
Packing unit: 1000 - 2000 pcs./cassette
Bulk packing
The components are packed in cardboard boxes, the size of which depends on the order quantity.
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 11 of 27Please read Cautions and warnings and
Important notes at the end of this document.
5 Packing codes
The last two digits of the complete ordering code state the packing mode:
Last two digits
00, 01, 02, 03,04,
05, 06, 07, 08 Bulk
40, 41 Bulk
45 Bulk
50 Radial leads, kinked Cardboard tape Cassette packing
51 Radial leads, kinked Cardboard tape 360-mm reel packing
52 Radial leads, straight Cardboard tape Cassette packing
53 Radial leads, straight Cardboard tape 360-mm reel packing
54 Radial leads, kinked Cardboard tape AMMO packing
55 Radial leads, straight Cardboard tape AMMO packing
(If no packing code is indicated, this corresponds to 40)
Example 1: B57164K0102J000 Bulk
B57164K0102J052 Cardboard tape, cassette packing
Example 2: B57881S0103F002 Bulk
B57881S0103F251 Cardboard tape, reel packing
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 12 of 27Please read Cautions and warnings and
Important notes at the end of this document.
Mounting instructions
1 Soldering
1.1 Leaded NTC thermistors
Leaded thermistors comply with the solderability requirements specified by CECC.
When soldering, care must be taken that the NTC thermistors are not damaged by excessive
heat. The following maximum temperatures, maximum time spans and minimum distances have
to be observed:
Dip soldering Iron soldering
Bath temperature max. 260 °C max. 360 °C
Soldering time max. 4 s max. 2 s
Distance from thermistor min. 6 mm min. 6 mm
Under more severe soldering conditions the resistance may change.
1.1.1 Wave soldering
Temperature characteristic at component terminal with dual wave soldering
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 13 of 27Please read Cautions and warnings and
Important notes at the end of this document.
1.2 Leadless NTC thermistors
In case of NTC thermistors without leads, soldering is restricted to devices which are provided
with a solderable metallization. The temperature shock caused by the application of hot solder
may produce fine cracks in the ceramic, resulting in changes in resistance.
To prevent leaching of the metallization, solder with silver additives or with a low tin content
should be used. In addition, soldering methods should be employed which permit short soldering
times.
1.3 SMD NTC thermistors
SMD NTC thermistors can be provided with a nickel barrier termination or on special request with
silver-palladium termination. The use of no-clean solder products is recommended. In any case
mild, non-activated fluxes should be used. Flux residues after soldering should be minimized.
SMD NTCs with AgPd termination are not approved for lead-free soldering.
Nickel barrier termination
Figure 1
SMD NTC thermistors, structure of nickel
barrier termination
The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the
silver base metallization layer. This allows great flexibility in the selection of soldering parameters.
The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The
nickel barrier termination is tested for all commonly-used soldering methods according to
IEC 60068-2-58. Insufficient preheating may cause ceramic cracks. Rapid cooling by dipping in
solvent is not recommended.
The following test and process conditions apply for nickel barrier termination.
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 14 of 27Please read Cautions and warnings and
Important notes at the end of this document.
1.3.1 Solderability (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Wetting of soldering areas ≥95%.
Solder Bath temperature (°C) Dwell time (s)
SnPb 60/40 215 ±3 3 ±0.3
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 245 ±3 3 ±0.3
1.3.2 Resistance to soldering heat (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Leaching of side edges ≤1/3.
Solder Bath temperature (°C) Dwell time (s)
SnPb 60/40 260 ±5 10 ±1
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 260 ±5 10 ±1
1.3.3 Reflow soldering
Temperature ranges for reflow soldering acc. to IEC 60068-2-58 recommendations.
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 15 of 27Please read Cautions and warnings and
Important notes at the end of this document.
Profile feature Sn-Pb eutectic assembly Pb-free assembly
Preheat and soak
- Temperature min Tsmin 100 °C 150 °C
- Temperature max Tsmax 150 °C 200 °C
- Time tsmin to tsmax 60 ... 120 s 60 ... 120 s
Average ramp-up rate Tsmax to Tp3°C/ s max. 3 °C/ s max.
Liquidous temperature TL183 °C 217 °C
Time at liquidous tL40 ... 150 s 40 ... 150 s
Peak package body temperature Tp215 °C ... 260 °C1) 235 °C ... 260 °C
Time above (TP5°C) tp10 ... 40 s 10 ... 40 s
Average ramp-down rate Tpto Tsmax 6°C/ s max. 6 °C/ s max.
Time 25 °C to peak temperature max. 8 minutes max. 8 minutes
1) Depending on package thickness.
Notes: All temperatures refer to topside of the package, measured on the package body
surface.
Number of reflow cycles: 3
Iron soldering should be avoided, hot air methods are recommended for repair
purposes.
Solder joint profiles for silver/nickel/tin terminations
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 16 of 27Please read Cautions and warnings and
Important notes at the end of this document.
1.3.4 Recommended geometry of solder pads
Recommended maximum dimensions (mm)
Case size
inch/mm
ABC
0402/1005 0.6 0.6 1.7
0603/1608 1.0 1.0 3.0
0805/2012 1.3 1.2 3.4
1206/3216 1.8 1.2 4.5
2 Conductive adhesion
An alternative to soldering for silver-palladium terminated components is the gluing of thermistors
with conductive adhesives. The benefit of this method is that it involves no thermal stress. The
adhesives used must be chemically inert.
3 Clamp contacting
Pressure contacting by means of clamps is particularly suitable for applications involving frequent
switching and high turn-on powers.
4 Robustness of terminations (leaded types)
The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm
from the solder joint on the thermistor body or from the point at which they leave the feed-
throughs. During bending, any mechanical stress at the outlet of the leads must be removed. The
bending radius should be at least 0.75 mm.
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 17 of 27Please read Cautions and warnings and
Important notes at the end of this document.
Tensile strength: Test Ua1:
Value of applied force for Ua1 test:
Diameter (d) of
corresponding round leads
Force with tolerance of ±10%
∅≤0.25 mm 1.0 N
0.25 < ∅≤0.35 mm 2.5 N
0.35 < ∅≤0.50 mm 5.0 N
0.50 < ∅≤0.80 mm 10.0 N
Bending strength: Test Ub:
Two 90°-bends in opposite directions
Value of applied force for Ub test:
Diameter (d) of
corresponding round leads
Force with tolerance of ±10%
∅≤0.25 mm 0.5 N
0.25 < ∅≤0.35 mm 1.25 N
0.35 < ∅≤0.50 mm 2.5 N
0.50 < ∅≤0.80 mm 5 N
Torsional strength: Test Uc: severity 2
The lead is bent by 90°at a distance of 6 to 6.5 mm from the thermistor body.
The bending radius of the leads should be approx. 0.75 mm. Two torsions of
180°each (severity 2).
When subjecting leads to mechanical stress, the following should be observed:
Tensile stress on leads
During mounting and operation tensile forces on the leads are to be avoided.
Bending of leads
Bending of the leads directly on the thermistor body is not permissible.
A lead may be bent at a minimum distance of twice the wire's diameter +4 mm from the solder
joint on the thermistor body. During bending the wire must be mechanically relieved at its outlet.
The bending radius should be at least 0.75 mm.
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 18 of 27Please read Cautions and warnings and
Important notes at the end of this document.
5 Sealing and potting
Sealing or potting processes can affect the reliability of the component.
When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused
by thermal expansion during the production process (curing / overmolding process) and during
later operation. The upper category temperature of the thermistor must not be exceeded. Ensure
that the materials used (sealing / potting compound and plastic material) are chemically neutral.
As thermistors are temperature sensitive components it should be considered that molding can af-
fect the thermal surrounding and may influence e.g. the response time.
Extensive testing is encouraged in order to determine whether overmolding or potting influences
the functionality and/ or reliability of the component.
6 Cleaning
Cleaning processes can affect the reliability of the component.
If cleaning is necessary, mild cleaning agents are recommended. Cleaning agents based on wa-
ter are not allowed. Washing processes may damage the product due to the possible static or
cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks which might lead to re-
duced reliability and/ or lifetime.
7 Storage
In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.
Humidity, temperature and container materials are critical factors.
Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing ma-
terial may be deformed or SMDs may stick together, causing problems during mounting. After
opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible.
The components should be left in the original packing. Touching the metallization of unsoldered
thermistors may change their soldering properties.
Storage temperature: 25 °Cupto45°C
Relative humidity (without condensation): ≤75% annual mean
<95%, maximum 30 days per annum
Solder the thermistors listed in this data book after shipment from TDK within the time specified:
SMDs with AgPd termination: 6 months
SMDs with nickel barrier termination: 12 months
Leadless components: 12 months
Leaded components: 24 months
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 19 of 27Please read Cautions and warnings and
Important notes at the end of this document.
8 Placement and orientation of SMD NTC thermistors on PCB
a) Component placement
It is recommended that the PC board
should be held by means of some
adequate supporting pins such as
shown left to prevent the SMDs from
being damaged or cracked.
b) Cracks
When placing a component near an
area which is apt to bend or a grid
groove on the PC board, it is advisable
to have both electrodes subjected to
uniform stress, or to position the
component's electrodes at right angles
to the grid groove or bending line (see
c) Component orientation).
c) Component orientation
Choose a mounting position that
minimizes the stress imposed on the
chip during flexing or bending of the
board.
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 20 of 27Please read Cautions and warnings and
Important notes at the end of this document.
Cautions and warnings
General
See "Important notes" at the end of this document.
Storage
Store thermistors only in original packaging. Do not open the package prior to processing.
Storage conditions in original packaging: storage temperature 25 °C ... +45 °C, relative
humidity ≤75% annual mean, <95% maximum 30 days per annum, dew precipitation is
inadmissible.
Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the
packing material may be deformed or components may stick together, causing problems during
mounting.
Avoid contamination of thermistor surface during storage, handling and processing.
Avoid storage of thermistors in harmful environments like corrosive gases (SOx, Cl etc).
Use the components as soon as possible after opening the original packaging.
Solder thermistors within the time specified after shipment from TDK.
For leaded components this is 24 months, for SMD components with nickel barrier termination
12 months, for leadless components this is 12 months, for SMD components with AgPd
termination 6 months.
Handling
NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused
during handling of NTCs.
Do not touch components with bare hands. Gloves are recommended.
Avoid contamination of thermistor surface during handling.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
Bending / twisting leads
A lead (wire) may be bent at a minimum distance of twice the wire’s diameter plus 4 mm from
the component head or housing. When bending ensure the wire is mechanically relieved at the
component head or housing. The bending radius should be at least 0.75 mm.
Soldering
Use resin-type flux or non-activated flux.
Insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended.
Complete removal of flux is recommended.
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 21 of 27Please read Cautions and warnings and
Important notes at the end of this document.
Mounting
Ensure that no thermo-mechanical stress occurs due to production processes (curing or
overmolding processes) when thermistors are sealed, potted or overmolded or during their
subsequent operation. The maximum temperature of the thermistor must not be exceeded.
Ensure that the materials used (sealing/potting compound and plastic material) are chemically
neutral.
Electrodes/contacts must not be scratched or damaged before/during/after the mounting
process.
Contacts and housing used for assembly with the thermistor must be clean before mounting.
Ensure that adjacent materials are designed for operation at temperatures comparable to the
surface temperature of the thermistor. Be sure that surrounding parts and materials can
withstand the temperature.
Avoid contamination of the thermistor surface during processing.
The connections of sensors (e.g. cable end, wire end, plug terminal) may only be exposed to
an environment with normal atmospheric conditions.
Tensile forces on cables or leads must be avoided during mounting and operation.
Bending or twisting of cables or leads directly on the thermistor body is not permissible.
Avoid using chemical substances as mounting aids. It must be ensured that no water or other
liquids enter the NTC thermistors (e.g. through plug terminals). In particular, water based
substances (e.g. soap suds) must not be used as mounting aids for sensors.
The use of no-clean solder products is recommended. In any case mild, non-activated fluxes
should be used. Flux residues after soldering should be minimized.
Operation
Use thermistors only within the specified operating temperature range.
Use thermistors only within the specified power range.
Environmental conditions must not harm the thermistors. Only use the thermistors under
normal atmospheric conditions or within the specified conditions.
Contact of NTC thermistors with any liquids and solvents shall be prevented. It must be
ensured that no water enters the NTC thermistors (e.g. through plug terminals). For
measurement purposes (checking the specified resistance vs. temperature), the component
must not be immersed in water but in suitable liquids (e.g. perfluoropolyethers such as Galden).
Avoid dewing and condensation unless thermistor is specified for these conditions.
Bending or twisting of cables and/or wires is not permissible during operation of the sensor in
the application.
Be sure to provide an appropriate fail-safe function to prevent secondary product damage
caused by malfunction.
This listing does not claim to be complete, but merely reflects the experience of TDK.
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 22 of 27Please read Cautions and warnings and
Important notes at the end of this document.
Display of ordering codes for TDK Electronics products
The ordering code for one and the same product can be represented differently in data sheets,
data books, other publications, on the company website, or in order-related documents such as
shipping notes, order confirmations and product labels. The varying representations of the or-
dering codes are due to different processes employed and do not affect the specifications
of the respective products.
Detailed information can be found on the Internet under
www.tdk-electronics.tdk.com/orderingcodes.
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 23 of 27Please read Cautions and warnings and
Important notes at the end of this document.
Symbols and terms
Symbol English German
A Area Fläche
AWG American Wire Gauge Amerikanische Norm für Drahtquerschnitte
B B value B-Wert
B25/100 B value determined by resistance
measurement at 25 °C and 100 °C
B-Wert, ermittelt durch Widerstands-
messungen bei 25 °C und 100 °C
Cth Heat capacitance Wärmekapazität
I Current Strom
N Number (integer) Anzahl (ganzzahliger Wert)
P25 Maximum power at 25 °C Maximale Leistung bei 25 °C
Pdiss Power dissipation Verlustleistung
Pel Electrical power Elektrische Leistung
Pmax Maximum power within stated
temperature range
Maximale Leistung im
angegebenenTemperaturbereich
∆RB/RBResistance tolerance caused by
spread of B value
Widerstandstoleranz, die durch die
Streuung des B-Wertes verursacht wird
Rins Insulation resistance Isolationswiderstand
RPParallel resistance Parallelwiderstand
RRRated resistance Nennwiderstand
∆RR/RRResistance tolerance Widerstandstoleranz
RSSeries resistance Serienwiderstand
RTResistance at temperature T
(e.g. R25 = resistance at 25 °C)
Widerstand bei Temperatur T
(z.B. R25 = Widerstand bei 25 °C)
T Temperature Temperatur
∆T Temperature tolerance Temperaturtoleranz
t Time Zeit
TAAmbient temperature Umgebungstemperatur
Tmax Upper category temperature Obere Grenztemperatur
(Kategorietemperatur)
Tmin Lower category temperature Untere Grenztemperatur
(Kategorietemperatur)
Top Operating temperature Betriebstemperatur
TRRated temperature Nenntemperatur
Tsurf Surface temperature Oberflächentemperatur
V Voltage Spannung
Vins Insulation test voltage Isolationsprüfspannung
Vop Operating voltage Betriebsspannung
Vtest Test voltage Prüfspannung
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 24 of 27Please read Cautions and warnings and
Important notes at the end of this document.
Symbol English German
αTemperature coefficient Temperaturkoeffizient
∆Tolerance, change Toleranz, Änderung
δth Dissipation factor Wärmeleitwert
τcThermal cooling time constant Thermische Abkühlzeitkonstante
τaThermal time constant Thermische Zeitkonstante
Abbreviations / Notes
Symbol English German
Surface-mounted devices Oberflächenmontierbares Bauelement
* To be replaced by a number in ordering
codes, type designations etc.
Platzhalter für Zahl im Bestellnummern-
code oder für die Typenbezeichnung.
+ To be replaced by a letter. Platzhalter für einen Buchstaben.
All dimensions are given in mm. Alle Maße sind in mm angegeben.
The commas used in numerical values
denote decimal points.
Verwendete Kommas in Zahlenwerten
bezeichnen Dezimalpunkte.
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 25 of 27Please read Cautions and warnings and
Important notes at the end of this document.
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical re-
quirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application.
As a rule, we are either unfamiliar with individual customer applications or less familiar with
them than the customers themselves. For these reasons, it is always ultimately incumbent on
the customer to check and decide whether a product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or
failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in
which the malfunction or failure of an electronic component could endanger human life or
health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by
means of suitable design of the customer application or other action taken by the customer
(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by
third parties in the event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Ma-
terial Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have
any more detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order. We also
reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the fore-
going for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to our General
Terms and Conditions of Supply.
Important notes
Page 26 of 27
7. Our manufacturing sites serving the automotive business apply the IATF 16949
standard. The IATF certifications confirm our compliance with requirements regarding the
quality management system in the automotive industry. Referring to customer requirements
and customer specific requirements (“CSR”) TDK always has and will continue to have the
policy of respecting individual agreements. Even if IATF 16949 may appear to support the
acceptance of unilateral requirements, we hereby like to emphasize that only requirements
mutually agreed upon can and will be implemented in our Quality Management System.
For clarification purposes we like to point out that obligations from IATF 16949 shall only
become legally binding if individually agreed upon.
8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP,
CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD,
MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine,
PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV,
ThermoFuse, WindCap are trademarks registered or pending in Europe and
in other countries. Further information will be found on the Internet at
www.tdk-electronics.tdk.com/trademarks.
Release 2018-10
Important notes
Page 27 of 27
