BAS116V
Document number: DS30562 Rev. 5 - 2 1 of 3
www.diodes.com March 2008
© Diodes Incorporated
BAS116
SURFACE MOUNT LOW LEAK AGE DIODE
Features
• Surface Mount Package Ideally Suited for Automated Insertion
• Very Low Leakage Current
• Lead Free By Design/RoHS Compliant (Note 1)
• "Green" Device (Note 4 and 5)
Mechanical Data
• Case: SOT-563
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminal Connections: See Diagram
• Terminals: Finish ⎯ Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.003 grams (approximate)
TOP VIEW BOTTOM VIEW
SOT-563
Internal Schematic
TOP VIEW
C
1
A
1
NC
NC
A
2
C
2
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR 85 V
RMS Reverse Voltage VR(RMS) 60 V
Forward Continuous Current (Note 2) IFM 215 mA
Repetitive Peak Forward Current IFRM 500 mA
Non-Repetitive Peak Forward Surge Current @ t = 1.0μs
@ t = 1.0ms
@ t = 1.0s IFSM 4.0
1.0
0.5 A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 2) PD 150 mW
Thermal Resistance Junction to Ambient Air (Note 2) RθJA 833 °C/W
Operating and Storage Temperature Range TJ, TSTG -65 to +150 °C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 3) V(BR)R 85 ⎯ ⎯ V IR = 100μA
Forward Voltage VFM ⎯ ⎯
0.90
1.0
1.1
1.25
V
IF = 1.0mA
IF = 10mA
IF = 50mA
IF = 150mA
Leakage Current (Note 3) IRM ⎯ ⎯ 5.0
80 nA
nA VR = 75V
VR = 75V, TJ = 150°C
Total Capacitance CT ⎯ 2 ⎯ pF VR = 0, f = 1.0MHz
Reverse Recovery Time trr ⎯ ⎯ 3.0 μs IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
Notes: 1. No purposefully added lead.
2. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. Short duration pulse test used to minimize self-heating effect.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.