74ABT00
Quad 2-input NAND gate
Product specification 1995 Sep 18
INTEGRATED CIRCUITS
IC23 Data Handbook
Philips Semiconductors Product specification
74ABT00Quad 2-input NAND gate
2
1995 Sep 18 853-1809 15755
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS
Tamb = 25°C;
GND = 0V TYPICAL UNIT
tPLH
tPHL
Propagation
delay
An or Bn
to YnCL = 50pF;
VCC = 5V
2.5
2.0 ns
tOSLH
tOSHL Output to
Output skew
CC
0.4 ns
CIN Input
capacitance VI = 0V or VCC 3 pF
ICC Total supply
current Outputs disabled;
VCC = 5.5V 50 µA
PIN CONFIGURATION
14
13
12
11
10
9
87
6
5
4
3
2
1
GND
VCC
B2
A2
Y2
Y3
B3
A3
A0
B0
Y1
Y0
A1
B1
SA00333
LOGIC SYMBOL
B1A0 B0 A1 A2 B2 A3 B3
Y0Y1Y2Y3
36811
12459101213
VCC = Pin 14
GND = Pin 7
SA00334
LOGIC DIAGRAM
A0
B0
A1
B1
A2
Y0
B2
A3
B3
Y1
Y2
Y3
VCC = Pin 14
GND = Pin 7
3
6
8
11
1
2
4
5
9
10
12
13
SA00360
PIN DESCRIPTION
PIN
NUMBER SYMBOL NAME AND FUNCTION
1, 2, 4, 5, 9,
10, 12, 13 An-Bn Data inputs
3, 6, 8, 11 Yn Data outputs
7 GND Ground (0V)
14 VCC Positive supply voltage
LOGIC SYMBOL (IEEE/IEC)
1
2
4
5
9
10
12
13
&3
6
8
11
SF00004
FUNCTION TABLE
INPUTS OUTPUT
A B Y
L L H
L H H
H L H
H H L
NOTES:
H = High voltage level
L = Low voltage level
ORDERING INFORMATION
PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER
14-Pin Plastic DIP –40°C to +85°C74ABT00 N 74ABT00 N SOT27-1
14-Pin plastic SO –40°C to +85°C74ABT00 D 74ABT00 D SOT108-1
14-Pin Plastic SSOP Type II –40°C to +85°C74ABT00 DB 74ABT00 DB SOT337-1
14-Pin Plastic TSSOP Type I –40°C to +85°C74ABT00 PW 74ABT00PW DH SOT402-1
Philips Semiconductors Product specification
74ABT00Quad 2-input NAND gate
1995 Sep 18 3
ABSOLUTE MAXIMUM RATINGS1, 2
SYMBOL PARAMETER CONDITIONS RATING UNIT
VCC DC supply voltage –0.5 to +7.0 V
IIK DC input diode current VI < 0 –18 mA
VIDC input voltage3–1.2 to +7.0 V
IOK DC output diode current VO < 0 –50 mA
VOUT DC output voltage3output in Off or High state –0.5 to +5.5 V
IOUT DC output current output in Low state 40 mA
Tstg Storage temperature range –65 to 150 °C
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
LIMITS
UNIT
SYMBOL
PARAMETER
MIN MAX
UNIT
VCC DC supply voltage 4.5 5.5 V
VIInput voltage 0 VCC V
VIH High-level input voltage 2.0 V
VIL Low-level input voltage 0.8 V
IOH High-level output current –15 mA
IOL Low-level output current 20 mA
∆t/∆vInput transition rise or fall rate 0 5 ns/V
Tamb Operating free-air temperature range –40 +85 °C
DC ELECTRICAL CHARACTERISTICS LIMITS
SYMBOL PARAMETER TEST CONDITIONS Tamb = +25°CTamb = –40°C
to +85°CUNIT
MIN TYP MAX MIN MAX
VIK Input clamp voltage VCC = 4.5V ; IIK = –18mA –0.9 –1.2 –1.2 V
VOH High-level output voltage VCC = 4.5V ; IOH = –15mA; VI = VIL or VIH 2.5 2.9 2.5 V
VOL Low-level output voltage VCC = 4.5V ; IOL = 20mA; VI = VIL or VIH 0.35 0.5 0.5 V
IIInput leakage current VCC = 5.5V ; V I = GND or 5.5V ±0.01 ±1.0 ±1.0 µA
IOFF Power-of f leakage current VCC = 0.0V ; V O or VI ≤ 4.5V ±5.0 ±100 ±100 µA
ICEX Output High leakage current VCC = 5.5V ; V O = 5.5V; VI = GND or VCC 5.0 50 50 µA
IOOutput current1VCC = 5.5V; VO = 2.5V –50 –75 –180 –50 –180 mA
ICC Quiescent supply current VCC = 5.5V ; V I = GND or VCC 2 50 50 µA
∆ICC Additional supply current per
input pin2VCC = 5.5V ; One data input at 3.4V, other
inputs at VCC or GND 0.25 500 500 µA
NOTES:
1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
2. This is the increase in supply current for each input at 3.4V.
Philips Semiconductors Product specification
74ABT00Quad 2-input NAND gate
1995 Sep 18 4
AC CHARACTERISTICS
GND = 0V ; tR = tF = 2.5ns; CL = 50pF, RL = 500Ω
LIMITS
SYMBOL PARAMETER WAVEFORM Tamb = +25°C
VCC = +5.0V Tamb = –40°C to +85°C
VCC = +5.0V ±0.5V UNIT
MIN TYP MAX MIN MAX
tPLH
tPHL Propagation delay
An or Bn to Yn11.0
1.0 2.5
2.0 3.6
2.8 1.0
1.0 4.1
3.4 ns
tOSHL
tOSLH1Output to Output skew
An or Bn to Yn20.4
0.4 0.5
0.5 0.5
0.5 ns
NOTE:
1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same
device. The specification applies to any outputs switching in the the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH);
parameter guaranteed by design.
AC WAVEFORMS
VM = 1.5V, VIN = GND to 3.0V
VM
VM
VM
VM
Yn
An, Bn
tPHL tPLH
SA00336
W aveform 1. Propagation delay for inverting outputs
OUTPUT N
same part
INPUT
SA00381
OUTPUT
tPLH
MIN
tPHL
MIN
tPLH MAX tPHLMAX
tOSLH tOSHL
W aveform 2. Common edge skew
TEST CIRCUIT AND WAVEFORMS
PULSE
GENERATOR
RT
VIN D.U.T. VOUT
CLRL
VCC
Test Circuit for Outputs
VMVM
tWAMP (V)
NEGATIVE
PULSE 10% 10%
90% 90%
0V
VMVM
tW
AMP (V)
POSITIVE
PULSE
90% 90%
10% 10% 0V
tTHL (tF)
tTLH (tR)t
THL (tF)
tTLH (tR)
VM = 1.5V
Input Pulse Definition
DEFINITIONS
RL = Load resistor; see AC CHARACTERISTICS for value.
CL = Load capacitance includes jig and probe capacitance;
see AC CHARACTERISTICS for value.
RT = Termination resistance should be equal to ZOUT of
pulse generators.
INPUT PULSE REQUIREMENTS
FAMILY
74ABT
SH00067
Amplitude Rep. Rate tWtF
3.0V 1MHz 500ns 2.5ns
tR
2.5ns
Philips Semiconductors Product specification
74ABT00Quad 2-input NAND gate
1995 Sep 18 5
DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1
Philips Semiconductors Product specification
74ABT00Quad 2-input NAND gate
1995 Sep 18 6
SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
Philips Semiconductors Product specification
74ABT00Quad 2-input NAND gate
1995 Sep 18 7
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm SOT337-1
Philips Semiconductors Product specification
74ABT00Quad 2-input NAND gate
1995 Sep 18 8
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1
Philips Semiconductors Product specification
74ABT00Quad 2-input NAND gate
1995 Sep 18 9
NOTES
Philips Semiconductors Product specification
74ABT00Quad 2-input NAND gate
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICATIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appl iances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
DEFINITIONS
Data Sheet Identification Product Status Definition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation
register eligible circuits under the Semiconductor Chip Protection Act.
Copyright Philips Electronics North America Corporation 1995
All rights reserved. Printed in U.S.A.
(print code) Date of release: July 1994
Document order number: 9397-750-04854
