PROTECTION PRODUCTS
1www.semtech.com
PROTECTION PRODUCTS - MicroClampTM
uClamp3324P
Low Voltage TVS
for ESD Protection
Description Features
Circuit Diagram Package
Revision 01/05/2005
The µClampTM series of TVS arrays are designed to
protect sensitive electronics from damage or latch-up
due to ESD, lightning, and other voltage-induced
transient events. Each device will protect up to four
lines operating at 3.3 volts.
The µClampTM3324P is a solid-state device designed
specifically for transient suppression. It is constructed
using Semtech’s proprietary EPD process technology.
The EPD process provides low standoff voltages with
significant reductions in leakage currents and capaci-
tance over traditional pn junction processes. They offer
desirable characteristics for board level protection
including fast response time, low clamping voltage and
no device degradation.
The µClamp3324P may be used to meet the immunity
requirements of IEC 61000-4-2, level 4 (±15kV air,
±8kV contact discharge). The “flow-thru” design of the
device results in enhanced ESD performance due to
reduced board trace inductance. The result is lower
clamping voltage and a higher level of protection when
compared to conventional TVS devices.
The µClamp3324P is in an 8-pin, RoHs compliant,
SLP2116P8 package. It measures 2.1 x 1.6 x
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPd. The small pack-
age makes it ideal for use in portable electronics such
as cell phones, digital still cameras, and notebook
computers.
Applications
Mechanical Characteristics
Cellular Handsets & Accessories
Personal Digital Assistants (PDA’s)
Notebooks & Handhelds
Portable Instrumentation
Digital Cameras
Peripherals
MP3 Players
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
Small package for use in portable electronics
Protects four I/O
Working voltage: 3.3V
Flow thru design for easy layout
Low leakage current
Low operating and clamping voltages
Solid-state silicon-avalanche technology
SLP2116P8 package
RoHs Compliant
Nominal Dimensions: 2.1 x 1.6 x 0.58 mm
Lead Pitch: 0.5mm
Lead Finish: NiPd
Marking : Orientation Mark and Marking Code
Packaging : Tape and Reel per EIA 481
GND
123 4
8765
8 Pin SLP package (Bottom Side View)
2.1 x 1.6 x 0.58mm (Nominal)
Device Schematic
2.10
1.60
12
0.50 BSC
0.58
2 2005 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3324P
Absolute Maximum Rating
Electrical Characteristics (T=25oC)
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2005 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3324P
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
0
10
20
30
40
50
60
70
80
90
100
110
0 25 50 75 100 125 150
Ambient Temperature - TA (oC)
% of Rated Power or IPP
Power Derating Curve
Clamping Voltage vs. Peak Pulse Current
Junction Capacitance vs. Reverse Voltage ESD Clamping
(8kV Contact per IEC 61000-4-2)
0.01
0.1
1
0.1 1 10 100 1000
Pulse Duration - tp (µs)
Peak Pulse Power - PPP (kW)
Forward Voltage vs. Forward Current
0
2
4
6
8
0123456
Forward Current - I
F
(A)
Forward Voltage - V
F
(V)
Waveform
Parameters:
tr = 8µs
td = 20µs
0
2
4
6
8
10
12
14
16
0123456
Peak Pulse Current (A)
Clamping Voltage (V)
Waveform
Parameters:
tr = 8µs
td = 20µs
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
00.511.522.533.5
Reverse Voltage - VR (V)
Normalized Capcitance - Cj (pF)
f = 1 MHz
Line-to-Line
Line-to-Gnd
4 2005 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3324P
Device Connection Options
The µClamp3324P is designed to protect four lines. It
will present a high impedance to the protected line up
to 3.3 volts. It will “turn on” when the line voltage
exceeds 3.5 volts. The device is unidirectional and
may be used on lines where the signal polarity is above
ground.
Flow Thru Layout
The µClamp3324P is designed for ease of PCB layout
by allowing the traces to enter one side of the device
and exit the other side. Figure 2 shows the
recommended way to design the PCB board traces in
order to use the flow through layout. The solid line
represents the PCB trace. Note that the PCB traces
enter at the input pin and exit from the opposite pin.
(pin 1 to pin 8, pin 2 to pin 9, pin 3 to pin 6, pin 4 to
pin 5). For example, line 1 enters at pin 1 and exits at
Pin 8. The bottom tab is connected to ground. This
connection should be made directly to a ground plane
on the board for best results. The path length is kept
as short as possible to minimize parasitic inductance.
EPD TVS Characteristics
These devices are constructed using Semtech’s
proprietary EPD technology. The structure of the EPD
TVS is vastly different from the traditional pn-junction
devices. At voltages below 5V, high leakage current
and junction capacitance render conventional ava-
lanche technology impractical for most applications.
However, by utilizing the EPD technology, these devices
can effectively operate at 3.3V while maintaining
excellent electrical characteristics.
The EPD TVS employs a complex nppn structure in
contrast to the pn structure normally found in tradi-
tional silicon-avalanche TVS diodes. The EPD mecha-
nism is achieved by engineering the center region of
the device such that the reverse biased junction does
not avalanche, but will “punch-through” to a conduct-
ing state. This structure results in a device with supe-
rior DC electrical parameters at low voltages while
maintaining the capability to absorb high transient
currents.
Applications Information
Figure 1 - Circuit Diagram
IPP
ISB
IPT
IR
V
RWM VV PT VC
VF
IF
SB
Figure 3 - EPD TVS IV Characteristic Curve
GND
123 4
8765
In 1
In 2
In 3
In 4
Out 1
Out 2
Out 3
Out 4
Figure 2 - Layout Example
5
2005 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3324P
Outline Drawing - SLP2116P8
Land Pattern - SLP2116P8
.010 .016 .020 0.25 0.40 0.50
2.10
1.60
.063
E
AB
A1
SEATING
C
PLANE
aaa C
bxN
D
E
bbb C A B
e
12
N
PIN 1
INDICATOR
(LASER MARK)
D/2
E/2
LxN
A2
A
2.202.00.087.079
1.701.50
.067.059
D1
E1
INCHES
.020 BSC
b.007
bbb
aaa
N
D1
L
e
D
.011
.061
DIM
A1
A2
A
MIN
-
.020
0.300.20.012 0.25.010
0.38
1.80
0.28
1.55
.004
.003
6
.013
.083
.067
.015
.071
0.08
0.10
6
0.33
1.70
0.50 BSC
MILLIMETERS
MAX
0.05
0.65
DIMENSIONS
MIN
0.00
NOM
(.006)
.023
.001
MAX
.002
.026
NOM
0.50
.003
(0.15)
0.58
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
NOTES:
2.
1.
E1
B .071 1.80
X
Z
P
B
Y
G(C)
C .060 1.52
F
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
NOTES:
1.
DIM
X
Y
P
G
F
MILLIMETERSINCHES
0.45
.012
.025
.035
.020
.018
0.30
0.63
0.50
0.89
DIMENSIONS
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2.15.085Z
6 2005 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3324P
Marking
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
Ordering Information
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MicroClamp, uClamp and µClamp are marks of Semtech
Corporation
Tape and Reel Specification
Device Orientation in Tape
PIN 1
INDICATOR
3324P
3324P
3324P
3324P
3324P
3324P
3324P
3324P
3324P
3324P
3324P
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