K4B2G0446C-HCH9 - Samsung - Datasheet.Directory

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K4B2G0446C

K4B2G0846C

Rev. 1.31, Nov. 2010

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2Gb C-die DDR3 SDRAM

78FBGA with Lead-Free & Halogen-Free

(RoHS compliant)

datasheet

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K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

Revision History

Revision No. History Draft Date Remark Editor

1.0 - First Release Dec. 2009 - S.H.Kim

1.01 - Corrected Current Data Dec. 2009 - S.H.Kim

1.1 - Deleted operation frequency of DDR3 800 (6-6-6) Jan. 2010 - S.H.Kim

1.2 - Added "CL5" to supported CL setting Feb. 2010 - S.H.Kim

1.21 - Corrected Typo. Feb. 2010 - S.H.Kim

1.22 - Corrected Typo. Apr. 2010 - S.H.Kim

1.3 - Updated JESD79-3E Jun. 2010 - S.H.Kim

1.31 - Corrected Typo. Nov. 2010 - S.H.Kim

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K4B2G0446C datasheet DDR3 SDRAM
Rev. 1.31
K4B2G0846C
Table Of Contents
2Gb C-die DDR3 SDRAM
Ordering Information ..................................................................................................................................................... 5
Key Features................................................................................................................................................................. 5
 Package pinout/Mechanical Dimension & Addressing................................................................................................. 6
1 x4 Package Pinout (Top view) : 78ball FBGA Package .......................................................................................... 6
2 x8 Package Pinout (Top view) : 78ball FBGA Package .......................................................................................... 7
3 FBGA Package Dimension (x4/x8).......................................................................................................................... 8
Input/Output Functional Description.............................................................................................................................. 9
DDR3 SDRAM Addressing ........................................................................................................................................... 10
Absolute Maximum Ratings .......................................................................................................................................... 11
1 Absolute Maximum DC Ratings............................................................................................................................... 11
2 DRAM Component Operating Temperature Range ................................................................................................ 11
AC & DC Operating Conditions..................................................................................................................................... 11
1 Recommended DC operating Conditions (SSTL_1.5)............................................................................................. 11
AC & DC Input Measurement Levels ............................................................................................................................ 12
1 AC & DC Logic input levels for single-ended signals .............................................................................................. 12
2 VREF Tolerances...................................................................................................................................................... 13
3  AC & DC Logic Input Levels for Differential Signals ............................................................................................... 14
3.1. Differential signals definition ............................................................................................................................ 14
3.2. Differential swing requirement for clock (CK - CK) and strobe (DQS - DQS) .................................................. 14
3.3. Single-ended requirements for differential signals ........................................................................................... 15
4 Differential Input Cross Point Voltage...................................................................................................................... 16
5 Slew rate definition for Differential Input Signals ..................................................................................................... 16
6 Slew rate definitions for Differential Input Signals ................................................................................................... 16
AC & DC Output Measurement Levels ......................................................................................................................... 17
1 Single-ended AC & DC Output Levels..................................................................................................................... 17
2 Differential AC & DC Output Levels......................................................................................................................... 17
3 Single-ended Output Slew Rate .............................................................................................................................. 17
4 Differential Output Slew Rate .................................................................................................................................. 18
5 Reference Load for AC Timing and Output Slew Rate ............................................................................................ 18
6 Overshoot/Undershoot Specification ....................................................................................................................... 19
6.1. Address and Control Overshoot and Undershoot specifications...................................................................... 19
6.2. Clock, Data, Strobe and Mask Overshoot and Undershoot Specifications ...................................................... 19
7 34ohm Output Driver DC Electrical Characteristics................................................................................................. 20
7.1. Output Drive Temperature and Voltage Sensitivity .......................................................................................... 21
8 On-Die Termination (ODT) Levels and I-V Characteristics ..................................................................................... 21
8.1. ODT DC Electrical Characteristics ................................................................................................................... 22
8.2.  ODT Temperature and Voltage sensitivity ...................................................................................................... 23
9 ODT Timing Definitions ........................................................................................................................................... 24
9.1. Test Load for ODT Timings.............................................................................................................................. 24
9.2. ODT Timing Definitions .................................................................................................................................... 24
IDD Current Measure Method..................................................................................................................................... 27
1 IDD Measurement Conditions ............................................................................................................................... 27
2Gb DDR3 SDRAM C-die IDD Specification Table .................................................................................................... 36
Input/Output Capacitance ........................................................................................................................................... 37
Electrical Characteristics and AC timing for DDR3-800 to DDR3-1600 ...................................................................... 38
1 Clock Specification ................................................................................................................................................ 38
1.1. Definition for tCK(avg).................................................................................................................................... 38
1.2. Definition for tCK(abs).................................................................................................................................... 38
1.3. Definition for tCH(avg) and tCL(avg).............................................................................................................. 38
1.4. Definition for note for tJIT(per), tJIT(per, Ick) ................................................................................................. 38
1.5. Definition for tJIT(cc), tJIT(cc, Ick) ................................................................................................................. 38
1.6. Definition for tERR(nper)................................................................................................................................ 38
2 Refresh Parameters by Device Density................................................................................................................. 39
3 Speed Bins and CL, tRCD, tRP, tRC and tRAS for corresponding Bin ................................................................. 39
3.1. Speed Bin Table Notes .................................................................................................................................. 42

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K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

14. Timing Parameters by Speed Grade .......................................................................................................................... 43

14.1 Jitter Notes ............................................................................................................................................................ 46

14.2 Timing Parameter Notes........................................................................................................................................ 47

14.3 Address/Command Setup, Hold and Derating : .................................................................................................... 48

14.4 Data Setup, Hold and Slew Rate Derating : .......................................................................................................... 54

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K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

1. Ordering Information

[ Table 1 ] Samsung 2Gb DDR3 C-die ordering information table

NOTE :

1. Speed bin is in order of CL-tRCD-tRP.

2. Backward compatible to DDR3-1333(9-9-9), DDR3-1066(7-7-7)

3. Backward compatible to DDR3-1066(7-7-7)

2. Key Features

[ Table 2 ] 2Gb DDR3 C-die Speed bins

Organization DDR3-1066 (7-7-7) DDR3-1333 (9-9-9)3DDR3-1600 (11-11-11)2Package

512Mx4 K4B2G0446C-HCF8 K4B2G0446C-HCH9 K4B2G0446C-HCK0 78 FBGA

256Mx8 K4B2G0846C-HCF8 K4B2G0846C-HCH9 K4B2G0846C-HCK0 78 FBGA

Speed DDR3-800 DDR3-1066 DDR3-1333 DDR3-1600 Unit

6-6-6 7-7-7 9-9-9 11-11-11

tCK(min) 2.5 1.875 1.5 1.25 ns

CAS Latency 6 7 9 11 nCK

tRCD(min) 15 13.125 13.5 13.75 ns

tRP(min) 15 13.125 13.5 13.75 ns

tRAS(min) 37.5 37.5 36 35 ns

tRC(min) 52.5 50.625 49.5 48.75 ns

• JEDEC standard 1.5V ± 0.075V Power Supply

•V

DDQ = 1.5V ± 0.075V

• 400 MHz fCK for 800Mb/sec/pin, 533MHz fCK for 1066Mb/sec/pin,

667MHz fCK for 1333Mb/sec/pin, 800MHz fCK for 1600Mb/sec/pin

• 8 Banks

• Programmable CAS Latency(posted CAS): 5,6,7,8,9,10,11

• Programmable Additive Latency: 0, CL-2 or CL-1 clock

• Programmable CAS Write Latency (CWL) = 5 (DDR3-800), 6

(DDR3-1066), 7 (DDR3-1333) and 8 (DDR3-1600)

• 8-bit pre-fetch

• Burst Length: 8 (Interleave without any limit, sequential with starting

address “000” only), 4 with tCCD = 4 which does not allow seamless

read or write [either On the fly using A12 or MRS]

• Bi-directional Differential Data-Strobe

• Internal(self) calibration : Internal self calibration through ZQ pin

(RZQ : 240 ohm ± 1%)

• On Die Termination using ODT pin

• Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at

85°C < TCASE < 95 °C

• Asynchronous Reset

• Package : 78 balls FBGA - x4/x8

• All of Lead-Free products are compliant for RoHS

• All of products are Halogen-free

The 2Gb DDR3 SDRAM C-die is organized as a 64Mbit x 4 I/Os x 8banks

or 32Mbit x 8 I/Os x 8banks device. This synchronous device achieves high

speed double-data-rate transfer rates of up to 1600Mb/sec/pin (DDR3-

1600) for general applications.

The chip is designed to comply with the following key DDR3 SDRAM fea-

tures such as posted CAS, Programmable CWL, Internal (Self) Calibration,

On Die Termination using ODT pin and Asynchronous Reset .

All of the control and address inputs are synchronized with a pair of exter-

nally supplied differential clocks. Inputs are latched at the crosspoint of dif-

ferential clocks (CK rising and CK falling). All I/Os are synchronized with a

pair of bidirectional strobes (DQS and DQS) in a source synchronous fash-

ion. The address bus is used to convey row, column, and bank address

information in a RAS/CAS multiplexing style. The DDR3 device operates

with a single 1.5V ± 0.075V power supply and 1.5V ± 0.075V VDDQ.

The 2Gb DDR3 C-die device is available in 78ball FBGAs(x4/x8).

NOTE : 1. This data sheet is an abstract of full DDR3 specification and does not cover the common features which are described in “DDR3 SDRAM Device Operation & Timing

Diagram”.

2. The functionality described and the timing specifications included in this data sheet are for the DLL Enabled mode of operation.

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K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

3. Package pinout/Mechanical Dimension & Addressing

3.1 x4 Package Pinout (Top view) : 78ball FBGA Package

1 2 3 4 5 6 7 8 9

AVSS VDD NC NC VSS VDD A

BVSS VSSQ DQ0 DM VSSQ VDDQ B

CVDDQ DQ2 DQS DQ1 DQ3 VSSQ C

DVSSQ NC DQS VDD VSS VSSQ D

EVREFDQ VDDQ NC NC NC VDDQ E

FNC VSS RAS CK VSS NC F

GODT VDD CAS CK VDD CKE G

HNC CS WE A10/AP ZQ NC H

JVSS BA0 BA2 NC VREFCA VSS J

KVDD A3 A0 A12/BC BA1 VDD K

LVSS A5 A2 A1 A4 VSS L

MVDD A7 A9 A11 A6 VDD M

NVSS RESET A13 A14 A8 VSS N

Populated ball

Ball not populated

Ball Locations (x4)

Top view

(See the balls through the package)

1234 89567

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K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

3.2 x8 Package Pinout (Top view) : 78ball FBGA Package

1 2 3 4 5 6 7 8 9

AVSS VDD NC NU/TDQS VSS VDD A

BVSS VSSQ DQ0 DM/TDQS VSSQ VDDQ B

CVDDQ DQ2 DQS DQ1 DQ3 VSSQ C

DVSSQ DQ6 DQS VDD VSS VSSQ D

EVREFDQ VDDQ DQ4 DQ7 DQ5 VDDQ E

FNC VSS RAS CK VSS NC F

GODT VDD CAS CK VDD CKE G

HNC CS WE A10/AP ZQ NC H

JVSS BA0 BA2 NC VREFCA VSS J

KVDD A3 A0 A12/BC BA1 VDD K

LVSS A5 A2 A1 A4 VSS L

MVDD A7 A9 A11 A6 VDD M

NVSS RESET A13 A14 A8 VSS N

Ball Locations (x8)

Populated ball

Ball not populated

Top view

(See the balls through the package)

1234 89567

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K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

3.3 FBGA Package Dimension (x4/x8)

7.50 ± 0.10

0.80 x 12 = 9.60

3.20

0.80

4.80

78 - ∅0.45 Solder ball

0.2 ABM

(Datum B)

(Datum A)

0.10MAX

1.10 ± 0.10

#A1

1.60

7.50 ± 0.10

11.00 ± 0.10

MOLDING AREA

0.35 ± 0.05

#A1 INDEX MARK

BOTTOM VIEW

TOP VIEW

11.00 ± 0.10

0.80 0.80

(Post Reflow ∅0.50 ± 0.05)

(0.95)

(1.90)

Units : Millimeters

876543219

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K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

4. Input/Output Functional Description

[ Table 3 ] Input/Output function description

Symbol Type Function

CK, CK Input Clock: CK and CK are differential clock inputs. All address and control input signals are sampled on the crossing of

the positive edge of CK and negative edge of CK. Output (read) data is referenced to the crossings of CK and CK

CKE Input

Clock Enable: CKE HIGH activates, and CKE Low deactivates, internal clock signals and device input buffers and

output drivers. Taking CKE Low provides Precharge Power-Down and Self Refresh operation (all banks idle), or

Active Power-Down (Row Active in any bank). CKE is asynchronous for self refresh exit. After VREFCA has become

stable during the power on and initialization sequence, it must be maintained during all operations (including Self-

Refresh). CKE must be maintained high throughout read and write accesses. Input buffers, excluding CK, CK, ODT

and CKE are disabled during power-down. Input buffers, excluding CKE, are disabled during Self -Refresh.

CS Input Chip Select: All commands are masked when CS is registered HIGH. CS provides for external Rank selection on

systems with multiple Ranks. CS is considered part of the command code.

ODT Input

On Die Termination: ODT (registered HIGH) enables termination resistance internal to the DDR3 SDRAM. When

enabled, ODT is only applied to each DQ, DQS, DQS and DM/TDQS, NU/TDQS (When TDQS is enabled via Mode

grammed to disable ODT.

RAS, CAS, WE Input Command Inputs: RAS, CAS and WE (along with CS) define the command being entered.

(DMU), (DML) Input

Input Data Mask: DM is an input mask signal for write data. Input data is masked when DM is sampled HIGH coinci-

dent with that input data during a Write access. DM is sampled on both edges of DQS. For x8 device, the function of

DM or TDQS/TDQS is enabled by Mode Register A11 setting in MR1.

BA0 - BA2 Input

Bank Address Inputs: BA0 - BA2 define to which bank an Active, Read, Write or Precharge command is being

applied. Bank address also determines if the mode register or extended mode register is to be accessed during a

MRS cycle.

A0 - A14 Input

Address Inputs: Provided the row address for Active commands and the column address for Read/Write commands

to select one location out of the memory array in the respective bank. (A10/AP and A12/BC have additional functions,

see below)

The address inputs also provide the op-code during Mode Register Set commands.

A10 / AP Input

Autoprecharge: A10 is sampled during Read/Write commands to determine whether Autoprecharge should be per-

formed to the accessed bank after the Read/Write operation. (HIGH:Autoprecharge; LOW: No Autoprecharge)

A10 is sampled during a Precharge command to determine whether the Precharge applies to one bank (A10 LOW) or

all banks (A10 HIGH). if only one bank is to be precharged, the bank is selected by bank addresses.

A12 / BC Input Burst Chop:A12 is sampled during Read and Write commands to determine if burst chop(on-the-fly) will be per-

formed. (HIGH : no burst chop, LOW : burst chopped). See command truth table for details

RESET Input

Active Low Asynchronous Reset: Reset is active when RESET is LOW, and inactive when RESET is HIGH.

RESET must be HIGH during normal operation. RESET is a CMOS rail to rail signal with DC high and low at 80% and

20% of VDD, i.e. 1.20V for DC high and 0.30V for DC low.

DQ Input/Output Data Input/ Output: Bi-directional data bus.

DQS, (DQS) Input/Output

Data Strobe: Output with read data, input with write data. Edge-aligned with read data, centered in write data. For the

x16, DQSL: corresponds to the data on DQL0-DQL7; DQSU corresponds to the data on DQU0-DQU7. The data

strobe DQS, DQSL and DQSU are paired with differential signals DQS, DQSL and DQSU, respectively, to provide dif-

ferential pair signaling to the system during reads and writes. DDR3 SDRAM supports differential data strobe only and

does not support single-ended.

TDQS, (TDQS)Output

Termination Data Strobe: TDQS/TDQS is applicable for X8 DRAMs only. When enabled via Mode Register A11=1 in

MR1, DRAM will enable the same termination resistance function on TDQS/TDQS that is applied to DQS/DQS. When

disabled via mode register A11=0 in MR1, DM/TDQS will provide the data mask function and TDQS is not used. x4/

x16 DRAMs must disable the TDQS function via mode register A11=0 in MR1.

NC No Connect: No internal electrical connection is present.

VDDQ Supply DQ Power Supply: 1.5V +/- 0.075V

VSSQ Supply DQ Ground

VDD Supply Power Supply: 1.5V +/- 0.075V

VSS Supply Ground

VREFDQ Supply Reference voltage for DQ

VREFCA Supply Reference voltage for CA

ZQ Supply Reference Pin for ZQ calibration

NOTE : Input only pins (BA0-BA2, A0-A14, RAS, CAS, WE, CS, CKE, ODT and RESET) do not supply termination.

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K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

5. DDR3 SDRAM Addressing

1Gb

2Gb

4Gb

8Gb

NOTE 1 : Page size is the number of bytes of data delivered from the array to the internal sense amplifiers when an ACTIVE command is registered.

Page size is per bank, calculated as follows: page size = 2 COLBITS * ORG÷8

where, COLBITS = the number of column address bits, ORG = the number of I/O (DQ) bits

Configuration 256Mb x 4 128Mb x 8 64Mb x 16

# of Bank 8 8 8

Bank Address BA0 - BA2 BA0 - BA2 BA0 - BA2

Auto precharge A10/AP A10/AP A10/AP

Row Address A0 - A13 A0 - A13 A0 - A12

Column Address A0 - A9,A11 A0 - A9 A0 - A9

BC switch on the fly A12/BC A12/BC A12/BC

Page size *1 1 KB 1 KB 2 KB

Configuration 512Mb x 4 256Mb x 8 128Mb x 16

# of Bank 8 8 8

Bank Address BA0 - BA2 BA0 - BA2 BA0 - BA2

Auto precharge A10/AP A10/AP A10/AP

Row Address A0 - A14 A0 - A14 A0 - A13

Column Address A0 - A9,A11 A0 - A9 A0 - A9

BC switch on the fly A12/BC A12/BC A12/BC

Page size *1 1 KB 1 KB 2 KB

Configuration 1Gb x 4 512Mb x 8 256Mb x 16

# of Bank 8 8 8

Bank Address BA0 - BA2 BA0 - BA2 BA0 - BA2

Auto precharge A10/AP A10/AP A10/AP

Row Address A0 - A15 A0 - A15 A0 - A14

Column Address A0 - A9,A11 A0 - A9 A0 - A9

BC switch on the fly A12/BC A12/BC A12/BC

Page size *1 1 KB 1 KB 2 KB

Configuration 2Gb x 4 1Gb x 8 512Mb x 16

# of Bank 8 8 8

Bank Address BA0 - BA2 BA0 - BA2 BA0 - BA2

Auto precharge A10/AP A10/AP A10/AP

Row Address A0 - A15 A0 - A15 A0 - A15

Column Address A0 - A9,A11,A13 A0 - A9,A11 A0 - A9

BC switch on the fly A12/BC A12/BC A12/BC

Page size *1 2 KB 2 KB 2 KB

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K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

6. Absolute Maximum Ratings

6.1 Absolute Maximum DC Ratings

[ Table 4 ] Absolute Maximum DC Ratings

NOTE :

1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the

device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions

for extended periods may affect reliability.

2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions, please refer to JESD51-2 standard.

3. VDD and VDDQ must be within 300mV of each other at all times; and VREF must be not greater than 0.6 x VDDQ, When VDD and VDDQ are less than 500mV; VREF may be

equal to or less than 300mV.

6.2 DRAM Component Operating Temperature Range

[ Table 5 ] Temperature Range

NOTE :

1. Operating Temperature TOPER is the case surface temperature on the center/top side of the DRAM. For measurement conditions, please refer to the JEDEC document

JESD51-2.

2. The Normal Temperature Range specifies the temperatures where all DRAM specifications will be supported. During operation, the DRAM case temperature must be main-

tained between 0-85°C under all operating conditions

3. Some applications require operation of the Extended Temperature Range between 85°C and 95°C case temperature. Full specifications are guaranteed in this range, but the

following additional conditions apply:

a) Refresh commands must be doubled in frequency, therefore reducing the refresh interval tREFI to 3.9us.

b) If Self-Refresh operation is required in the Extended Temperature Range, then it is mandatory to either use the Manual Self-Refresh mode with Extended Temperature

Range capability (MR2 A6 = 0b and MR2 A7 = 1b), in this case IDD6 current can be increased around 10~20% than normal Temperature range.

7. AC & DC Operating Conditions

7.1 Recommended DC operating Conditions (SSTL_1.5)

[ Table 6 ] Recommended DC Operating Conditions

NOTE :

1. Under all conditions VDDQ must be less than or equal to VDD.

2. VDDQ tracks with VDD. AC parameters are measured with VDD and VDDQ tied together.

Symbol Parameter Rating Units NOTE

VDD Voltage on VDD pin relative to Vss -0.4 V ~ 1.975 V V 1,3

VDDQ Voltage on VDDQ pin relative to Vss -0.4 V ~ 1.975 V V 1,3

VIN, VOUT Voltage on any pin relative to Vss -0.4 V ~ 1.975 V V 1

TSTG Storage Temperature -55 to +100 °C 1, 2

Symbol Parameter rating Unit NOTE

TOPER Operating Temperature Range 0 to 95 °C 1, 2, 3

Symbol Parameter Rating Units NOTE

Min. Typ. Max.

VDD Supply Voltage 1.425 1.5 1.575 V 1,2

VDDQ Supply Voltage for Output 1.425 1.5 1.575 V 1,2

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K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

8. AC & DC Input Measurement Levels

8.1 AC & DC Logic input levels for single-ended signals

[ Table 7 ] Single-ended AC & DC input levels for Command and Address

NOTE :

1. For input only pins except RESET

, VREF = VREFCA(DC)

2. See ’Overshoot/Undershoot Specification’ on page 19.

3. The AC peak noise on VREF may not allow VREF to deviate from VREF(DC) by more than ± 1% VDD (for reference : approx. ± 15mV)

4. For reference : approx. VDD/2 ± 15mV

5. VIH(dc) is used as a simplified symbol for VIH.CA(DC100)

6. VIL(dc) is used as a simplified symbol for VIL.CA(DC100)

7. VIH(ac) is used as a simplified symbol for VIH.CA(AC175) and VIH.CA(AC150); VIH.CA(AC175) value is used when VREF + 175mV is referenced and VIH.CA(AC150) value is

used when VREF + 150mV is referenced.

8. VIL(ac) is used as a simplified symbol for VIL.CA(AC175) and VIL.CA(AC150); VIL.CA(AC175) value is used when VREF - 175mV is referenced and VIL.CA(AC150) value is used

when VREF - 150mV is referenced.

[ Table 8 ] Single-ended AC & DC input levels for DQ and DM

NOTE :

1. For input only pins except RESET

, VREF = VREFDQ(DC)

2. See ’Overshoot/Undershoot Specification’ on page 19.

3. The AC peak noise on VREF may not allow VREF to deviate from VREF(DC) by more than ± 1% VDD (for reference : approx. ± 15mV)

4. For reference : approx. VDD/2 ± 15mV

5. VIH(dc) is used as a simplified symbol for VIH.DQ(DC100)

6. VIL(dc) is used as a simplified symbol for VIL.DQ(DC100)

7. VIH(ac) is used as a simplified symbol for VIH.DQ(AC175), VIH.DQ(AC150) ; VIH.DQ(AC175) value is used when VREF + 175mV is referenced, VIH.DQ(AC150) value is used

when VREF + 150mV is referenced.

8. VIL(ac) is used as a simplified symbol for VIL.DQ(AC175), VIL.DQ(AC150) ; VIL.DQ(AC175) value is used when VREF - 175mV is referenced, VIL.DQ(AC150) value is used when

VREF - 150mV is referenced.

Symbol Parameter DDR3-800/1066/1333/1600 Unit NOTE

Min. Max.

VIH.CA(DC100) DC input logic high VREF + 100 VDD mV 1,5

VIL.CA(DC100) DC input logic low VSS VREF - 100 mV 1,6

VIH.CA(AC175) AC input logic high VREF + 175 - mV 1,2,7

VIL.CA(AC175) AC input logic low - VREF - 175 mV 1,2,8

VIH.CA(AC150) AC input logic high VREF+150 - mV 1,2,7

VIL.CA(AC150) AC input logic low - VREF-150 mV 1,2,8

VREFCA(DC) Reference Voltage for ADD,

CMD inputs 0.49*VDD 0.51*VDD V3,4

Symbol Parameter DDR3-800/1066 DDR3-1333/1600 Unit NOTE

Min. Max. Min. Max.

VIH.DQ(DC100) DC input logic high VREF + 100 VDD VREF + 100 VDD mV 1,5

VIL.DQ(DC100) DC input logic low VSS VREF - 100 VSS VREF - 100 mV 1,6

VIH.DQ(AC175) AC input logic high VREF + 175 - - - mV 1,2,7

VIL.DQ(AC175) AC input logic low - VREF - 175 - - mV 1,2,8

VIH.DQ(AC150) AC input logic high VREF + 150 NOTE 2 VREF + 150 NOTE 2 mV 1,2,7

VIL.DQ(AC150) AC input logic low NOTE 2 VREF - 150 NOTE 2 VREF - 150 mV 1,2,8

VREFDQ(DC) Reference Voltage for DQ,

DM inputs 0.49*VDD 0.51*VDD 0.49*VDD 0.51*VDD V3,4

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K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

8.2 VREF Tolerances

The dc-tolerance limits and ac-noise limits for the reference voltages VREFCA and VREFDQ are illustrate in Figure 1. It shows a valid reference voltage

VREF(t) as a function of time. (VREF stands for VREFCA and VREFDQ likewise).

VREF(DC) is the linear average of VREF(t) over a very long period of time (e.g. 1 sec). This average has to meet the min/max requirement in Table 7 on

page 12. Furthermore VREF(t) may temporarily deviate from VREF(DC) by no more than ± 1% VDD.

Figure 1. Illustration of VREF(DC) tolerance and VREF ac-noise limits

The voltage levels for setup and hold time measurements VIH(AC), VIH(DC), VIL(AC) and VIL(DC) are dependent on VREF

"VREF" shall be understood as VREF(DC), as defined in Figure 1.

This clarifies, that dc-variations of VREF affect the absolute voltage a signal has to reach to achieve a valid high or low level and therefore the time to

which setup and hold is measured. System timing and voltage budgets need to account for VREF(DC) deviations from the optimum position within the

data-eye of the input signals.

This also clarifies that the DRAM setup/hold specification and derating values need to include time and voltage associated with VREF ac-noise. Timing

and voltage effects due to ac-noise on VREF up to the specified limit (+/-1% of VDD) are included in DRAM timings and their associated deratings.

voltage

VDD

VSS

time

- 14 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

8.3 AC & DC Logic Input Levels for Differential Signals

8.3.1 Differential signals definition

Figure 2. Definition of differential ac-swing and "time above ac level" tDVAC

8.3.2 Differential swing requirement for clock (CK - CK) and strobe (DQS - DQS)

[ Table 9 ] Differential AC & DC Input Levels

NOTE :

1. Used to define a differential signal slew-rate.

2. for CK - CK use VIH/VIL(AC) of ADD/CMD and VREFCA; for DQS - DQS, DQSL - DQSL, DQSU - DQSU use VIH/VIL(AC) of DQs and VREFDQ; if a reduced ac-high or ac-low

level is used for a signal group, then the reduced level applies also here.

3. These values are not defined, however they single-ended signals CK, CK, DQS, DQS, DQSL, DQSL, DQSU, DQSU need to be within the respective limits (VIH(DC) max,

VIL(DC)min) for single-ended signals as well as the limitations for overshoot and undershoot. Refer to "overshoot and Undershoot Specification"

[ Table 10 ] Allowed time before ringback (tDVAC) for CK - CK and DQS - DQS

Symbol Parameter DDR3-800/1066/1333/1600 unit NOTE

min max

VIHdiff differential input high +0.2 NOTE 3 V 1

VILdiff differential input low NOTE 3 -0.2 V 1

VIHdiff(AC) differential input high ac 2 x (VIH(AC) - VREF)NOTE 3 V 2

VILdiff(AC) differential input low ac NOTE 3 2 x (VIL(AC) - VREF)V2

Slew Rate [V/ns]

tDVAC [ps] @ |VIH/Ldiff(AC)| = 350mV tDVAC [ps] @ |VIH/Ldiff(AC)| = 300mV

min max min max

> 4.0 75 - 175 -

4.0 57 - 170 -

3.0 50 - 167 -

2.0 38 - 163 -

1.8 34 - 162 -

1.6 29 - 161 -

1.4 22 - 159 -

1.2 13 - 155 -

1.0 0 - 150 -

< 1.0 0 - 150 -

0.0

tDVAC

VIH.DIFF.MIN

half cycle

Differential Input Voltage (i.e. DQS-DQS, CK-CK)

time

tDVAC

VIH.DIFF.AC.MIN

VIL.DIFF.MAX

VIL.DIFF.AC.MAX

- 15 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

8.3.3 Single-ended requirements for differential signals

Each individual component of a differential signal (CK, DQS, DQSL, DQSU, CK, DQS, DQSL, or DQSU) has also to comply with certain requirements for

single-ended signals.

CK and CK have to approximately reach VSEHmin / VSELmax [approximately equal to the ac-levels { VIH(AC) / VIL(AC)} for ADD/CMD signals] in every

half-cycle.

DQS, DQSL, DQSU, DQS, DQSL have to reach VSEHmin / VSELmax [approximately the ac-levels { VIH(AC) / VIL(AC)} for DQ signals] in every half-cycle

proceeding and following a valid transition.

Note that the applicable ac-levels for ADD/CMD and DQ’s might be different per speed-bin etc. E.g. if VIH150(AC)/VIL150(AC) is used for ADD/CMD sig-

nals, then these ac-levels apply also for the single-ended signals CK and CK .

Figure 3. Single-ended requirement for differential signals

Note that while ADD/CMD and DQ signal requirements are with respect to VREF

, the single-ended components of differential signals have a requirement

with respect to VDD/2; this is nominally the same. The transition of single-ended signals through the ac-levels is used to measure setup time. For single-

ended components of differential signals the requirement to reach VSELmax, VSEHmin has no bearing on timing, but adds a restriction on the common

mode characteristics of these signals.

[ Table 11 ] Single-ended levels for CK, DQS, DQSL, DQSU, CK, DQS, DQSL, or DQSU

NOTE :

1. For CK, CK use VIH/VIL(AC) of ADD/CMD; for strobes (DQS, DQS, DQSL, DQSL, DQSU, DQSU) use VIH/VIL(AC) of DQs.

2. VIH(AC)/VIL(AC) for DQs is based on VREFDQ; VIH(AC)/VIL(AC) for ADD/CMD is based on VREFCA; if a reduced ac-high or ac-low level is used for a signal group, then the

reduced level applies also here

3. These values are not defined, however the single-ended signals CK, CK, DQS, DQS, DQSL, DQSL, DQSU, DQSU need to be within the respective

limits (VIH(DC) max, VIL(DC)min) for single-ended signals as well as the limitations for overshoot and undershoot. Refer to "Overshoot and Undershoot

Specification"

Symbol Parameter DDR3-800/1066/1333/1600 Unit NOTE

Min Max

VSEH

Single-ended high-level for strobes (VDD/2)+0.175 NOTE3 V 1, 2

Single-ended high-level for CK, CK (VDD/2)+0.175 NOTE3 V 1, 2

VSEL

Single-ended low-level for strobes NOTE3 (VDD/2)-0.175 V1, 2

Single-ended low-level for CK, CK NOTE3 (VDD/2)-0.175 V1, 2

VDD or VDDQ

VSEH min

VDD/2 or VDDQ/2

VSEL max

VSEH

VSS or VSSQ

VSEL

CK or DQS

time

- 16 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

8.4 Differential Input Cross Point Voltage

To guarantee tight setup and hold times as well as output skew parameters with respect to clock and strobe, each cross point voltage of differential input

signals (CK, CK and DQS, DQS) must meet the requirements in below table. The differential input cross point voltage VIX is measured from the actual

cross point of true and complement signal to the mid level between of VDD and VSS.

Figure 4. VIX Definition

[ Table 12 ] Cross point voltage for differential input signals (CK, DQS)

NOTE :

1. Extended range for VIX is only allowed for clock and if single-ended clock input signals CKand CK are monotonic, have a single-ended swing VSEL / VSEH of at least VDD/2

±250 mV, and the differential slew rate of CK-CK is larger than 3 V/ ns. Refer to Table 11 on page 15 for VSEL and VSEH standard values.

8.5 Slew rate definition for Differential Input Signals

See 14.3 “Address/Command Setup, Hold and Derating :” on page 48 for single-ended slew rate definitions for address and command signals.

See 14.4 “Data Setup, Hold and Slew Rate Derating :” on page 54 for single-ended slew rate definitions for data signals.

8.6 Slew rate definitions for Differential Input Signals

Input slew rate for differential signals (CK, CK and DQS, DQS) are defined and measured as shown in Table 13 and Figure 5.

[ Table 13 ] Differential input slew rate definition

NOTE :

The differential signal (i.e. CK - CK and DQS - DQS) must be linear between these thresholds.

Figure 5. Differential Input Slew Rate definition for DQS, DQS, and CK, CK

Symbol Parameter DDR3-800/1066/1333/1600 Unit NOTE

Min Max

VIX Differential Input Cross Point Voltage relative to VDD/2 for CK,CK -150 150 mV

-175 175 mV 1

VIX Differential Input Cross Point Voltage relative to VDD/2 for DQS,DQS -150 150 mV

Description Measured Defined by

From To

Differential input slew rate for rising edge (CK-CK and DQS-DQS)VILdiffmax VIHdiffmin

VIHdiffmin - VILdiffmax

Delta TRdiff

Differential input slew rate for falling edge (CK-CK and DQS-DQS)VIHdiffmin VILdiffmax

VIHdiffmin - VILdiffmax

Delta TFdiff

VDD

CK, DQS

VDD/2

CK, DQS

VSS

VIX

VIHdiffmin

VILdiffmax

delta TRdiff

delta TFdiff

- 17 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

9. AC & DC Output Measurement Levels

9.1 Single-ended AC & DC Output Levels

[ Table 14 ] Single-ended AC & DC output levels

NOTE : 1. The swing of +/-0.1 x VDDQ is based on approximately 50% of the static single ended output high or low swing with a driver impedance of 40Ω and an effective test

load of 25Ω to VTT=VDDQ/2.

9.2 Differential AC & DC Output Levels

[ Table 15 ] Differential AC & DC output levels

NOTE : 1. The swing of +/-0.2xVDDQ is based on approximately 50% of the static single ended output high or low swing with a driver impedance of 40Ω and an effective test

load of 25Ω to VTT=VDDQ/2 at each of the differential outputs.

9.3 Single-ended Output Slew Rate

With the reference load for timing measurements, output slew rate for falling and rising edges is defined and measured between VOL(AC) and VOH(AC)

for single ended signals as shown in Table 16 and Figure 6.

[ Table 16 ] Single-ended output slew rate definition

NOTE : Output slew rate is verified by design and characterization, and may not be subject to production test.

[ Table 17 ] Single-ended output slew rate

Description : SR : Slew Rate

Q : Query Output (like in DQ, which stands for Data-in, Query-Output)

se : Single-ended Signals

For Ron = RZQ/7 setting

Figure 6. Single-ended Output Slew Rate Definition

Symbol Parameter DDR3-800/1066/1333/1600 Units NOTE

VOH(DC) DC output high measurement level (for IV curve linearity) 0.8 x VDDQ V

VOM(DC) DC output mid measurement level (for IV curve linearity) 0.5 x VDDQ V

VOL(DC) DC output low measurement level (for IV curve linearity) 0.2 x VDDQ V

VOH(AC) AC output high measurement level (for output SR) VTT + 0.1 x VDDQ V1

VOL(AC) AC output low measurement level (for output SR) VTT - 0.1 x VDDQ V1

Symbol Parameter DDR3-800/1066/1333/1600 Units NOTE

VOHdiff(AC) AC differential output high measurement level (for output SR) +0.2 x VDDQ V1

VOLdiff(AC) AC differential output low measurement level (for output SR) -0.2 x VDDQ V1

Description Measured Defined by

From To

Single ended output slew rate for rising edge VOL(AC) VOH(AC) VOH(AC)-VOL(AC)

Delta TRse

Single ended output slew rate for falling edge VOH(AC) VOL(AC) VOH(AC)-VOL(AC)

Delta TFse

Parameter Symbol DDR3-800 DDR3-1066 DDR3-1333 DDR3-1600 Units

Min Max Min Max Min Max Min Max

Single ended output slew rate SRQse 2.5 5 2.5 5 2.5 5 2.5 5 V/ns

VOH(AC)

VOL(AC)

delta TRsedelta TFse

VTT

- 18 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

9.4 Differential Output Slew Rate

With the reference load for timing measurements, output slew rate for falling and rising edges is defined and measured between VOLdiff(AC) and VOH-

diff(AC) for differential signals as shown in Table 18 and Figure 7.

[ Table 18 ] Differential output slew rate definition

NOTE : Output slew rate is verified by design and characterization, and may not be subject to production test.

[ Table 19 ] Differential output slew rate

Description : SR : Slew Rate

Q : Query Output (like in DQ, which stands for Data-in, Query-Output)

diff : Differential Signals

For Ron = RZQ/7 setting

Figure 7. Differential Output Slew Rate Definition

9.5 Reference Load for AC Timing and Output Slew Rate

Figure 8 represents the effective reference load of 25 ohms used in defining the relevant AC timing parameters of the device as well as output slew rate

measurements.

It is not intended as a precise representation of any particular system environment or a depiction of the actual load presented by a production tester. Sys-

tem designers should use IBIS or other simulation tools to correlate the timing reference load to a system environment. Manufacturers correlate to their

production test conditions, generally one or more coaxial transmission lines terminated at the tester electronics.

Figure 8. Reference Load for AC Timing and Output Slew Rate

Description Measured Defined by

From To

Differential output slew rate for rising edge VOLdiff(AC) VOHdiff(AC) VOHdiff(AC)-VOLdiff(AC)

Delta TRdiff

Differential output slew rate for falling edge VOHdiff(AC) VOLdiff(AC) VOHdiff(AC)-VOLdiff(AC)

Delta TFdiff

Parameter Symbol DDR3-800 DDR3-1066 DDR3-1333 DDR3-1600 Units

Min Max Min Max Min Max Min Max

Differential output slew rate SRQdiff 5 10 5 10 5 10 5 10 V/ns

VOHdiff(AC)

VOLdiff(AC)

delta TRdiffdelta TFdiff

VTT

VDDQ

DUT

DQS

VTT = VDDQ/2

25Ω

CK/CK

Reference

Point

- 19 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

9.6 Overshoot/Undershoot Specification

9.6.1 Address and Control Overshoot and Undershoot specifications

[ Table 20 ] AC overshoot/undershoot specification for Address and Control pins (A0-A12, BA0-BA2. CS. RAS. CAS. WE. CKE, ODT)

Figure 9. Address and Control Overshoot and Undershoot Definition

9.6.2 Clock, Data, Strobe and Mask Overshoot and Undershoot Specifications

[ Table 21 ] AC overshoot/undershoot specification for Clock, Data, Strobe and Mask (DQ, DQS, DQS, DM, CK, CK)

Figure 10. Clock, Data, Strobe and Mask Overshoot and Undershoot Definition

Parameter Specification Unit

DDR3-800 DDR3-1066 DDR3-1333 DDR3-1600

Maximum peak amplitude allowed for overshoot area (See Figure 9) 0.4V 0.4V 0.4V 0.4V V

Maximum peak amplitude allowed for undershoot area (See Figure 9) 0.4V 0.4V 0.4V 0.4V V

Maximum overshoot area above VDD (See Figure 9) 0.67V-ns 0.5V-ns 0.4V-ns 0.33V-ns V-ns

Maximum undershoot area below VSS (See Figure 9) 0.67V-ns 0.5V-ns 0.4V-ns 0.33V-ns V-ns

Parameter Specification Unit

DDR3-800 DDR3-1066 DDR3-1333 DDR3-1600

Maximum peak amplitude allowed for overshoot area (See Figure 10) 0.4V 0.4V 0.4V 0.4V V

Maximum peak amplitude allowed for undershoot area (See Figure 10) 0.4V 0.4V 0.4V 0.4V V

Maximum overshoot area above VDDQ (See Figure 10) 0.25V-ns 0.19V-ns 0.15V-ns 0.13V-ns V-ns

Maximum undershoot area below VSSQ (See Figure 10) 0.25V-ns 0.19V-ns 0.15V-ns 0.13V-ns V-ns

Overshoot Area

Maximum Amplitude

VDD

Undershoot Area

Maximum Amplitude

VSS

Volts

(V)

Time (ns)

Overshoot Area

Maximum Amplitude

VDDQ

Undershoot Area

Maximum Amplitude

VSSQ

Volts

(V)

Time (ns)

- 20 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

9.7 34ohm Output Driver DC Electrical Characteristics

A functional representation of the output buffer is shown below. Output driver impedance RON is defined by the value of external reference resistor RZQ

as follows:

RON34 = RZQ/7 (Nominal 34.3ohms +/- 10% with nominal RZQ=240ohm)

The individual Pull-up and Pull-down resistors (RONpu and RONpd) are defined as follows

Figure 11. Output Driver : Definition of Voltages and Currents

[ Table 22 ] Output Driver DC Electrical Characteristics, assuming RZQ=240ohms ;

entire operating temperature range ; after proper ZQ calibration

NOTE :

1. The tolerance limits are specified after calibration with stable voltage and temperature. For the behavior of the tolerance limits if temperature or voltage changes after calibra-

tion, see following section on voltage and temperature sensitivity

2. The tolerance limits are specified under the condition that VDDQ = VDD and that VSSQ = VSS

3. Pull-down and pull-up output driver impedance are recommended to be calibrated at 0.5 X VDDQ. Other calibration schemes may be used to achieve the linearity spec shown

above, e.g. calibration at 0.2 X VDDQ and 0.8 X VDDQ

4. Measurement definition for mismatch between pull-up and pull-down, MMpupd: Measure RONpu and RONpd. both at 0.5 X VDDQ:

RONnom Resistor Vout Min Nom Max Units NOTE

34Ohms

RON34pd

VOLdc = 0.2 x VDDQ 0.6 1.0 1.1

RZQ/7

1,2,3

VOMdc = 0.5 x VDDQ 0.9 1.0 1.1 1,2,3

VOHdc = 0.8 x VDDQ 0.9 1.0 1.4 1,2,3

RON34pu

VOLdc = 0.2 x VDDQ 0.9 1.0 1.4 1,2,3

VOMdc = 0.5 x VDDQ 0.9 1.0 1.1 1,2,3

VOHdc = 0.8 x VDDQ 0.6 1.0 1.1 1,2,3

40Ohms

RON40pd

VOLdc = 0.2 x VDDQ 0.6 1.0 1.1

RZQ/6

1,2,3

VOMdc = 0.5 x VDDQ 0.9 1.0 1.1 1,2,3

VOHdc = 0.8 x VDDQ 0.9 1.0 1.4 1,2,3

RON40pu

VOLdc = 0.2 x VDDQ 0.9 1.0 1.4 1,2,3

VOMdc = 0.5 x VDDQ 0.9 1.0 1.1 1,2,3

VOHdc = 0.8 x VDDQ 0.6 1.0 1.1 1,2,3

Mismatch between Pull-up and Pull-down,

MMpupd VOMdc = 0.5 x VDDQ -10 10 % 1,2,4

RONpu =

VDDQ-VOUT

l Iout l

under the condition that RONpd is turned off

RONpd =

VOUT

l Iout l

under the condition that RONpu is turned off

VDDQ

VSSQ

RON

Ipd

RON

other

circuity

Output Driver

Ipu

Iout

Vout

MMpupd = RONpu - RONpd x 100

RONnom

- 21 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

9.7.1 Output Drive Temperature and Voltage Sensitivity

If temperature and/or voltage change after calibration, the tolerance limits widen according to Table 23 and Table 24.

∆T = T - T(@calibration); ∆V = VDDQ - VDDQ (@calibration); VDD = VDDQ

*dRONdT and dRONdV are not subject to production test but are verified by design and characterization

[ Table 23 ] Output Driver Sensitivity Definition

[ Table 24 ] Output Driver Voltage and Temperature Sensitivity

9.8 On-Die Termination (ODT) Levels and I-V Characteristics

On-Die Termination effective resistance RTT is defined by bits A9, A6 and A2 of MR1 register.

ODT is applied to the DQ,DM, DQS/DQS and TDQS,TDQS (x8 devices only) pins.

A functional representation of the on-die termination is shown below. The individual pull-up and pull-down resistors (RTTpu and RTTpd) are defined as

follows :

Chip in Termination Mode

Figure 12. On-Die Termination : Definition of Voltages and Currents

Min Max Units

RONPU@VOHDC 0.6 - dRONdTH * |∆T| - dRONdVH * |∆V| 1.1 + dRONdTH * |∆T| + dRONdVH * |∆V| RZQ/7

RON@VOMDC 0.9 - dRONdTM * |∆T| - dRONdVM * |∆V| 1.1 + dRONdTM * |∆T| + dRONdVM * |∆V| RZQ/7

RONPD@VOLDC 0.6 - dRONdTL * |∆T| - dRONdVL * |∆V| 1.1 + dRONdTL * |∆T| + dRONdVL * |∆V| RZQ/7

Speed Bin 800/1066/1333 1600 Units

Min Max Min Max

dRONdTM 01.501.5

%/°C

dRONdVM 0 0.15 0 0.13 %/mV

dRONdTL 01.501.5

%/°C

dRONdVL 0 0.15 0 0.13 %/mV

dRONdTH 01.501.5

%/°C

dRONdVH 0 0.15 0 0.13 %/mV

RTTpu =

VDDQ-VOUT

l Iout l

under the condition that RTTpd is turned off

RTTpd =

VOUT

l Iout l

under the condition that RTTpu is turned off

VDDQ

VSSQ

RTTPu

Ipd

RTTPd

other

circuitry

RCV,

...

ODT

Ipu

Iout

VOUT

Iout=Ipd-Ipu

- 22 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

9.8.1 ODT DC Electrical Characteristics

Table 25 provides and overview of the ODT DC electrical characteristics. They values for RTT60pd120, RTT60pu120, RTT120pd240, RTT120pu240, RTT40pd80,

RTT40pu80, RTT30pd60, RTT30pu60, RTT20pd40, RTT20pu40 are not specification requirements, but can be used as design guide lines:

[ Table 25 ] ODT DC Electrical Characteristics, assuming RZQ=240ohm +/- 1% entire operating temperature range; after proper ZQ calibration

MR1 (A9,A6,A2) RTT RESISTOR Vout Min Nom Max Unit NOTE

(0,1,0) 120 ohm

RTT120pd240

VOL(DC) 0.2XVDDQ 0.6 1.0 1.1 RZQ 1,2,3,4

0.5XVDDQ 0.9 1.0 1.1 RZQ 1,2,3,4

VOH(DC) 0.8XVDDQ 0.9 1.0 1.4 RZQ 1,2,3,4

RTT120pu240

VOL(DC) 0.2XVDDQ 0.9 1.0 1.4 RZQ 1,2,3,4

0.5XVDDQ 0.9 1.0 1.1 RZQ 1,2,3,4

VOH(DC) 0.8XVDDQ 0.6 1.0 1.1 RZQ 1,2,3,4

RTT120 VIL(AC) to VIH(AC) 0.9 1.0 1.6 RZQ/2 1,2,5

(0,0,1) 60 ohm

RTT60pd240

VOL(DC) 0.2XVDDQ 0.6 1.0 1.1 RZQ/2 1,2,3,4

0.5XVDDQ 0.9 1.0 1.1 RZQ/2 1,2,3,4

VOH(DC) 0.8XVDDQ 0.9 1.0 1.4 RZQ/2 1,2,3,4

RTT60pu240

VOL(DC) 0.2XVDDQ 0.9 1.0 1.4 RZQ/2 1,2,3,4

0.5XVDDQ 0.9 1.0 1.1 RZQ/2 1,2,3,4

VOH(DC) 0.8XVDDQ 0.6 1.0 1.1 RZQ/2 1,2,3,4

RTT60 VIL(AC) to VIH(AC) 0.9 1.0 1.6 RZQ/4 1,2,5

(0,1,1) 40 ohm

RTT40pd240

VOL(DC) 0.2XVDDQ 0.6 1.0 1.1 RZQ/3 1,2,3,4

0.5XVDDQ 0.9 1.0 1.1 RZQ/3 1,2,3,4

VOH(DC) 0.8XVDDQ 0.9 1.0 1.4 RZQ/3 1,2,3,4

RTT40pu240

VOL(DC) 0.2XVDDQ 0.9 1.0 1.4 RZQ/3 1,2,3,4

0.5XVDDQ 0.9 1.0 1.1 RZQ/3 1,2,3,4

VOH(DC) 0.8XVDDQ 0.6 1.0 1.1 RZQ/3 1,2,3,4

RTT40 VIL(AC) to VIH(AC) 0.9 1.0 1.6 RZQ/6 1,2,5

(1,0,1) 30 ohm

RTT60pd240

VOL(DC) 0.2XVDDQ 0.6 1.0 1.1 RZQ/4 1,2,3,4

0.5XVDDQ 0.9 1.0 1.1 RZQ/4 1,2,3,4

VOH(DC) 0.8XVDDQ 0.9 1.0 1.4 RZQ/4 1,2,3,4

RTT60pu240

VOL(DC) 0.2XVDDQ 0.9 1.0 1.4 RZQ/4 1,2,3,4

0.5XVDDQ 0.9 1.0 1.1 RZQ/4 1,2,3,4

VOH(DC) 0.8XVDDQ 0.6 1.0 1.1 RZQ/4 1,2,3,4

RTT60 VIL(AC) to VIH(AC) 0.9 1.0 1.6 RZQ/8 1,2,5

(1,0,0) 20 ohm

RTT60pd240

VOL(DC) 0.2XVDDQ 0.6 1.0 1.1 RZQ/6 1,2,3,4

0.5XVDDQ 0.9 1.0 1.1 RZQ/6 1,2,3,4

VOH(DC) 0.8XVDDQ 0.9 1.0 1.4 RZQ/6 1,2,3,4

RTT60pu240

VOL(DC) 0.2XVDDQ 0.9 1.0 1.4 RZQ/6 1,2,3,4

0.5XVDDQ 0.9 1.0 1.1 RZQ/6 1,2,3,4

VOH(DC) 0.8XVDDQ 0.6 1.0 1.1 RZQ/6 1,2,3,4

RTT60 VIL(AC) to VIH(AC) 0.9 1.0 1.6 RZQ/12 1,2,5

Deviation of VM w.r.t VDDQ/2, ∆VM -5 5 % 1,2,5,6

- 23 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

NOTE :

1. The tolerance limits are specified after calibration with stable voltage and temperature. For the behavior of the tolerance limits if temperature or voltage changes after calibra-

tion, see following section on voltage and temperature sensitivity

2. The tolerance limits are specified under the condition that VDDQ = VDD and that VSSQ = VSS

3. Pull-down and pull-up ODT resistors are recommended to be calibrated at 0.5XVDDQ. Other calibration schemes may be used to achieve the linearity spec shown above, e.g.

calibration at 0.2XVDDQ and 0.8XVDDQ.

4. Not a specification requirement, but a design guide line

5. Measurement definition for RTT:

Apply VIH(AC) to pin under test and measure current I(VIH(AC)), then apply VIL(AC) to pin under test and measure current I(VIL(AC)) respectively

6. Measurement definition for VM and ∆VM : Measure voltage (VM) at test pin (midpoint) with no load

9.8.2 ODT Temperature and Voltage sensitivity

If temperature and/or voltage change after calibration, the tolerance limits widen according to table below

∆T = T - T(@calibration); ∆V = VDDQ - VDDQ (@calibration); VDD = VDDQ

[ Table 26 ] ODT Sensitivity Definition

[ Table 27 ] ODT Voltage and Temperature Sensitivity

NOTE : These parameters may not be subject to production test. They are verified by design and characterization.

Min Max Units

RTT 0.9 - dRTTdT * |∆T| - dRTTdV * |∆V| 1.6 + dRTTdT * |∆T| + dRTTdV * |∆V| RZQ/2,4,6,8,12

Min Max Units

dRTTdT 01.5

%/°C

dRTTdV 00.15%/mV

RTT =

VIH(AC) - VIL(AC)

I(VIH(AC)) - I(VIL(AC))

∆ VM =

2 x VM

VDDQ

x 100

- 1

- 24 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

9.9 ODT Timing Definitions

9.9.1 Test Load for ODT Timings

Different than for timing measurements, the reference load for ODT timings is defined in Figure 13.

Figure 13. ODT Timing Reference Load

9.9.2 ODT Timing Definitions

Definitions for tAON, tAONPD, tAOF, tAOFPD and tADC are provided in Table 28 and subsequent figures. Measurement reference settings are provided

in Table 29 .

[ Table 28 ] ODT Timing Definitions

[ Table 29 ] Reference Settings for ODT Timing Measurements

Symbol Begin Point Definition End Point Definition Figure

tAON Rising edge of CK - CK defined by the end point of ODTLon Extrapolated point at VSSQ Figure 14

tAONPD Rising edge of CK - CK with ODT being first registered high Extrapolated point at VSSQ Figure 15

tAOF Rising edge of CK - CK defined by the end point of ODTLoff End point: Extrapolated point at VRTT_Nom Figure 16

tAOFPD Rising edge of CK - CK with ODT being first registered low End point: Extrapolated point at VRTT_Nom Figure 17

tADC Rising edge of CK - CK defined by the end point of ODTLcnw,

ODTLcwn4 of ODTLcwn8

End point: Extrapolated point at VRTT_Wr and VRTT_Nom

respectively Figure 18

Measured

Parameter RTT_Nom Setting RTT_Wr Setting VSW1[V] VSW2[V] NOTE

tAON RZQ/4 NA 0.05 0.10

RZQ/12 NA 0.10 0.20

tAONPD RZQ/4 NA 0.05 0.10

RZQ/12 NA 0.10 0.20

tAOF RZQ/4 NA 0.05 0.10

RZQ/12 NA 0.10 0.20

tAOFPD RZQ/4 NA 0.05 0.10

RZQ/12 NA 0.10 0.20

tADC RZQ/12 RZQ/2 0.20 0.30

VDDQ

CK,CK

DUT DQ, DM

DQS , DQS

TDQS , TDQS RTT

=25 ohm

VTT=

VSSQ

Timing Reference Points

VSSQ

- 25 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

Figure 14. Definition of tAON

Figure 15. Definition of tAONPD

Figure 16. Definition of tAOF

Begin point : Rising edge of CK - CK

defined by the end point of ODTLon

AON

DQ, DM

DQS , DQS

TDQS , TDQS V

SSQ

SW1

SW2

SW1

SW2

End point Extrapolated point at V

SSQ

Begin point : Rising edge of CK - CK

with ODT being first registered high

AONPD

DQ, DM

DQS , DQS

TDQS , TDQS V

SSQ

SW1

SW2

SW1

SW2

End point Extrapolated point at V

SSQ

Begin point : Rising edge of CK - CK

defined by the end point of ODTLoff

AOF

DQ, DM

DQS , DQS

TDQS , TDQS

RTT_Nom

SW1

SW2

SW1

SW2

End point Extrapolated point at V

RTT_Nom

SSQ

TD_TAON_DEF

- 26 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

Figure 17. Definition of tAOFPD

Figure 18. Definition of tADC

Begin point : Rising edge of CK - CK

with ODT being first registered low

AOFPD

DQ, DM

DQS , DQS

TDQS , TDQS

RTT_Nom

SW1

SW2

SW1

SW2

End point Extrapolated point at V

RTT_Nom

SSQ

Begin point : Rising edge of CK - CK

defined by the end point of ODTLcnw

ADC

DQ, DM

DQS , DQS

TDQS , TDQS

RTT_Nom

SW11

SW21

SW1

End point Extrapolated point at V

RTT_Nom

RTT_Wr

End point Extrapolated point at V

RTT_Wr

ADC

SW2

Begin point : Rising edge of CK - CK defined by

the end point of ODTLcwn4 or ODTLcwn8

End point

Extrapolated point

at V

RTT_Nom

SW12

SW22

RTT_Nom

SSQ

- 27 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

10. IDD Current Measure Method

10.1 IDD Measurement Conditions

In this chapter, IDD and IDDQ measurement conditions such as test load and patterns are defined. Figure 19 shows the setup and test load for IDD and

IDDQ measurements.

- IDD currents (such as IDD0, IDD1, IDD2N, IDD2NT, IDD2P0, IDD2P1, IDD2Q, IDD3N, IDD3P, IDD4R, IDD4W, IDD5B, IDD6, IDD6ET, IDD6TC and

IDD7) are measured as time-averaged currents with all VDD balls of the DDR3 SDRAM under test tied together. Any IDDQ current is not included in

IDD currents.

- IDDQ currents (such as IDDQ2NT and IDDQ4R) are measured as time-averaged currents with all VDDQ balls of the DDR3 SDRAM under test tied

together. Any IDD current is not included in IDDQ currents.

Attention : IDDQ values cannot be directly used to calculate IO power of the DDR3 SDRAM. They can be used to support correlation of simulated IO

power to actual IO power as outlined in Figure 20. In DRAM module application, IDDQ cannot be measured separately since VDD and VDDQ

are using one merged-power layer in Module PCB.

For IDD and IDDQ measurements, the following definitions apply :

- "0" and "LOW" is defined as VIN <= VILAC(max).

- "1" and "HIGH" is defined as VIN >= VIHAC(min).

- "FLOATING" is defined as inputs are VREF = VDD / 2.

- "Timing used for IDD and IDDQ Measured - Loop Patterns" are provided in Table 30

- "Basic IDD and IDDQ Measurement Conditions" are described in Table 31

- Detailed IDD and IDDQ Measurement-Loop Patterns are described in Table 32 on page 31 through Table 39.

- IDD Measurements are done after properly initializing the DDR3 SDRAM. This includes but is not limited to setting

RON = RZQ/7 (34 Ohm in MR1);

Qoff = 0B (Output Buffer enabled in MR1);

RTT_Nom = RZQ/6 (40 Ohm in MR1);

RTT_Wr = RZQ/2 (120 Ohm in MR2);

TDQS Feature disabled in MR1

- Attention : The IDD and IDDQ Measurement-Loop Patterns need to be executed at least one time before actual IDD or IDDQ measurement is started.

- Define D = {CS, RAS, CAS, WE} := {HIGH, LOW, LOW, LOW}

- Define D = {CS, RAS, CAS, WE} := {HIGH, HIGH, HIGH, HIGH}

- RESET Stable time is : During a Cold Bood RESET (Initialization), current reading is valid once power is stable and RESET has been LOW for 1ms;

During Warm Boot RESET(while operating), current reading is valid after RESET has been LOW for 200ns + tRFC

[ Table 30 ] Timing used for IDD and IDDQ Measured - Loop Patterns

Parameter Bin DDR3-800 DDR3-1066 DDR3-1333 DDR3-1600 Unit

6-6-6 7-7-7 9-9-9 11-11-11

tCKmin(IDD) 2.5 1.875 1.5 1.25 ns

CL(IDD) 6 7 9 11 nCK

tRCDmin(IDD) 6 7 9 11 nCK

tRCmin(IDD) 21 27 33 39 nCK

tRASmin(IDD) 15 20 24 28 nCK

tRPmin(IDD) 6 7 9 11 nCK

tFAW(IDD) x4/x816202024nCK

x1620273032nCK

tRRD(IDD) x4/x8 4 4 4 5 nCK

x16 4 6 5 6 nCK

tRFC(IDD) - 512Mb 36 48 60 72 nCK

tRFC(IDD) - 1Gb 44 59 74 88 nCK

tRFC(IDD) - 2Gb 64 86 107 128 nCK

tRFC(IDD) - 4Gb 120 160 200 240 nCK

tRFC(IDD) - 8Gb 140 187 234 280 nCK

- 28 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

Figure 19. Measurement Setup and Test Load for IDD and IDDQ Measurements

Figure 20. Correlation from simulated Channel IO Power to actual Channel IO Power supported by IDDQ Measurement.

DDQ

RESET

CK/CK

CKE

RAS, CAS, WE

A, BA

ODT

SSQ

DQS, DQS

DQ, DM,

TDQS, TDQS

DDQ

= 25 Ohm

[

NOTE

: DIMM level Output test load condition may be different from above]

Application specific

memory channel

environment

Channel

IO Power

Simulation

IDDQ

Measurement

Correlation

Correction

Channel IO Power

Number

IDDQ

Test Load

IDDQ

Simulation

- 29 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

[ Table 31 ] Basic IDD and IDDQ Measurement Conditions

Symbol Description

IDD0

Operating One Bank Active-Precharge Current

CKE: High; External clock: On; tCK, nRC, nRAS, CL: see Table 30 on page 27 ; BL: 81); AL: 0; CS: High between ACT and PRE; Command, Address,

Bank Address Inputs: partially toggling according to Table 32 on page 31 ; Data IO: FLOATING; DM:stable at 0; Bank Activity: Cycling with one bank active

at a time: 0,0,1,1,2,2,... (see Table 32); Output Buffer and RTT: Enabled in Mode Registers2); ODT Signal: stable at 0; Pattern Details: see Table 32

IDD1

Operating One Bank Active-Read-Precharge Current

CKE: High; External clock: On; tCK, nRC, nRAS, nRCD, CL: see Table 30 on page 27 ; BL: 81); AL: 0; CS: High between ACT, RD and PRE; Command,

Address, Bank Address Inputs, Data IO: partially toggling according to Table 33 on page 32 ; DM:stable at 0; Bank Activity: Cycling with one bank active at

a time: 0,0,1,1,2,2,... (see Table 33); Output Buffer and RTT: Enabled in Mode Registers2); ODT Signal: stable at 0; Pattern Details: see Table 33

IDD2N

Precharge Standby Current

CKE: High; External clock: On; tCK, CL: see Table 30 on page 27 ; BL: 81); AL: 0; CS: stable at 1; Command, Address, Bank Address Inputs: partially tog-

gling according to Table 34 on page 32 ; Data IO: FLOATING; DM:stable at 0; Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode

Registers2); ODT Signal: stable at 0; Pattern Details: see Table 34

IDD2NT

Precharge Standby ODT Current

CKE: High; External clock: On; tCK, CL: see Table 30 on page 27 ; BL: 81); AL: 0; CS: stable at 1; Command, Address, Bank Address Inputs: partially tog-

gling according to Table 35 on page 33 ; Data IO: FLOATING;DM:stable at 0; Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode

Registers2); ODT Signal: toggling according to Table 35 ; Pattern Details: see Table 35

IDDQ2NT Precharge Standby ODT IDDQ Current

Same definition like for IDD2NT, however measuring IDDQ current instead of IDD current

IDD2P0

Precharge Power-Down Current Slow Exit

CKE: Low; External clock: On; tCK, CL: see Table 30 on page 27 ; BL: 81); AL: 0; CS: stable at 1; Command, Address, Bank Address Inputs: stable at 0;

Data IO: FLOATING; DM:stable at 0; Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode Registers2); ODT Signal: stable at 0; Pre-

charge Power Down Mode: Slow Exi3)

IDD2P1

Precharge Power-Down Current Fast Exit

CKE: Low; External clock: On; tCK, CL: see Table 30 on page 27; BL: 81); AL: 0; CS: stable at 1; Command, Address, Bank Address Inputs: stable at 0;

Data IO: FLOATING; DM:stable at 0; Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode Registers2); ODT Signal: stable at 0; Pre-

charge Power Down Mode: Fast Exit3)

IDD2Q

Precharge Quiet Standby Current

CKE: High; External clock: On; tCK, CL: see Table 30 on page 27 ; BL: 81); AL: 0; CS: stable at 1; Command, Address, Bank Address Inputs: stable at 0;

Data IO: FLOATING; DM:stable at 0;Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode Registers2); ODT Signal: stable at 0

IDD3N

Active Standby Current

CKE: High; External clock: On; tCK, CL: see Table 30 on page 27 ; BL: 81); AL: 0; CS: stable at 1; Command, Address, Bank Address Inputs: partially tog-

gling according to Table 34 on page 32 ; Data IO: FLOATING; DM:stable at 0;Bank Activity: all banks open; Output Buffer and RTT: Enabled in Mode

Registers2); ODT Signal: stable at 0; Pattern Details: see Table 34

IDD3P

Active Power-Down Current

CKE: Low; External clock: On; tCK, CL: see Table 30 on page 27 ; BL: 81); AL: 0; CS: stable at 1; Command, Address, Bank Address Inputs: stable at 0;

Data IO: FLOATING;DM:stable at 0; Bank Activity: all banks open; Output Buffer and RTT: Enabled in Mode Registers2); ODT Signal: stable at 0

IDD4R

Operating Burst Read Current

CKE: High; External clock: On; tCK, CL: see Table 30 on page 27 ; BL: 81); AL: 0; CS: High between RD; Command, Address, Bank Address Inputs: par-

tially toggling according to Table 36 on page 33 ; Data IO: seamless read data burst with different data between one burst and the next one according to

Table 36 ; DM:stable at 0; Bank Activity: all banks open, RD commands cycling through banks: 0,0,1,1,2,2,... (see Table 7 on page 12); Output Buffer and

RTT: Enabled in Mode Registers2); ODT Signal: stable at 0; Pattern Details: see Table 36

IDDQ4R Operating Burst Read IDDQ Current

Same definition like for IDD4R, however measuring IDDQ current instead of IDD current

IDD4W

Operating Burst Write Current

CKE: High; External clock: On; tCK, CL: see Table 30 on page 27 ; BL: 81); AL: 0; CS: High between WR; Command, Address, Bank Address Inputs: par-

tially toggling according to Table 37 on page 34 ; Data IO: seamless write data burst with different data between one burst and the next one according to

Table 37; DM: stable at 0; Bank Activity: all banks open, WR commands cycling through banks: 0,0,1,1,2,2,... (see Table 37); Output Buffer and RTT:

Enabled in Mode Registers2); ODT Signal: stable at HIGH; Pattern Details: see Table 37

IDD5B

Burst Refresh Current

CKE: High; External clock: On; tCK, CL, nRFC: see Table 30 on page 27 ; BL: 81); AL: 0; CS: High between REF; Command, Address, Bank Address

Inputs: partially toggling according to Table 38 on page 34 ; Data IO: FLOATING;DM:stable at 0; Bank Activity: REF command every nRFC (see Table 38);

Output Buffer and RTT: Enabled in Mode Registers2); ODT Signal: stable at 0; Pattern Details: see Table 38

IDD6

Self Refresh Current: Normal Temperature Range

TCASE: 0 - 85°C; Auto Self-Refresh (ASR): Disabled4); Self-Refresh Temperature Range (SRT): Normal5); CKE: Low; External clock: Off; CK and CK:

LOW; CL: see Table 30 on page 27 ; BL: 81); AL: 0; CS, Command, Address, Bank Address, Data IO: FLOATING;DM:stable at 0; Bank Activity: Self-

Refresh operation; Output Buffer and RTT: Enabled in Mode Registers2); ODT Signal: FLOATING

- 30 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

[ Table 31 ] Basic IDD and IDDQ Measurement Conditions

NOTE :

1) Burst Length: BL8 fixed by MRS: set MR0 A[1,0]=00B

2) Output Buffer Enable: set MR1 A[12] = 0B; set MR1 A[5,1] = 01B; RTT_Nom enable: set MR1 A[9,6,2] = 011B; RTT_Wr enable: set MR2 A[10,9] = 10B

3) Precharge Power Down Mode: set MR0 A12=0B for Slow Exit or MR0 A12=1B for Fast Exit

4) Auto Self-Refresh (ASR): set MR2 A6 = 0B to disable or 1B to enable feature

5) Self-Refresh Temperature Range (SRT): set MR2 A7=0B for normal or 1B for extended temperature range

6) Read Burst type : Nibble Sequential, set MR0 A[3]=0B

Symbol Description

IDD7

Operating Bank Interleave Read Current

CKE: High; External clock: On; tCK, nRC, nRAS, nRCD, nRRD, nFAW, CL: see Table 30 on page 27 ; BL: 81); AL: CL-1; CS: High between ACT and RDA;

Command, Address, Bank Address Inputs: partially toggling according to Table 39 on page 35 ; Data IO: read data bursts with different data between one

burst and the next one according to Table 39 ; DM:stable at 0; Bank Activity: two times interleaved cycling through banks (0, 1, ...7) with different addressing,

see Table 39 ; Output Buffer and RTT: Enabled in Mode Registers2); ODT Signal: stable at 0; Pattern Details: see Table 39

IDD8

RESET Low Current

RESET : Low; External clock : off; CK and CK : LOW; CKE : FLOATING ; CS, Command, Address, Bank Address, Data IO : FLOATING ; ODT Signal :

FLOATING

- 31 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

[ Table 32 ] IDD0 Measurement - Loop Pattern1)

NOTE :

1. DM must be driven LOW all the time. DQS, DQS are MID-LEVEL.

2. DQ signals are MID-LEVEL.

CK/CK

CKE

Sub-Loop

Cycle

Number

Command

RAS

CAS

ODT

BA[2:0]

A[15:11]

A[10]

A[9:7]

A[6:3]

A[2:0]

Data2)

toggling

Static High

0 0 ACT001100000000 -

1,2 D, D100000000000 -

3,4 D, D 111100000000 -

... repeat pattern 1...4 until nRAS - 1, truncate if necessary

nRAS PRE001000000000 -

... repeat pattern 1...4 until nRC - 1, truncate if necessary

1*nRC + 0 ACT00110000 0 0 F0-

1*nRC + 1, 2 D, D10000000 0 0 F0-

1*nRC + 3, 4 D, D 11110000 0 0 F0-

... repeat pattern 1...4 until 1*nRC + nRAS - 1, truncate if necessary

1*nRC + nRASPRE00100000 0 0 F0

... repeat 1...4 until 2*nRC - 1, truncate if necessary

1 2*nRC repeat Sub-Loop 0, use BA[2:0] = 1 instead

2 4*nRC repeat Sub-Loop 0, use BA[2:0] = 2 instead

3 6*nRC repeat Sub-Loop 0, use BA[2:0] = 3 instead

4 8*nRC repeat Sub-Loop 0, use BA[2:0] = 4 instead

5 10*nRC repeat Sub-Loop 0, use BA[2:0] = 5 instead

6 12*nRC repeat Sub-Loop 0, use BA[2:0] = 6 instead

7 14*nRC repeat Sub-Loop 0, use BA[2:0] = 7 instead

- 32 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

[ Table 33 ] IDD1 Measurement - Loop Pattern1)

NOTE :

1. DM must be driven LOW all the time. DQS, DQS are used according to RD Commands, otherwise MID-LEVEL.

2. Burst Sequence driven on each DQ signal by Read Command. Outside burst operation, DQ signals are MID-LEVEL.

[ Table 34 ] IDD2 and IDD3N Measurement - Loop Pattern1)

NOTE :

1. DM must be driven Low all the time. DQS, DQS are MID-LEVEL.

2. DQ signals are MID-LEVEL.

CK/CK

CKE

Sub-Loop

Cycle

Number

Command

RAS

CAS

ODT

BA[2:0]

A[15:11]

A[10]

A[9:7]

A[6:3]

A[2:0]

Data2)

toggling

Static High

0 0 ACT 001100000000 -

1,2 D, D 100000000000 -

3,4 D, D 111100000000 -

... repeat pattern 1...4 until nRCD- 1, truncate if necessary

nRCD RD 010100000000 00000000

... repeat pattern 1...4 until nRAS - 1, truncate if necessary

nRAS PRE 001000000000 -

... repeat pattern 1...4 until nRC - 1, truncate if necessary

1*nRC+0 ACT 00110000 0 0 F0-

1*nRC + 1, 2 D, D 10000000 0 0 F0-

1*nRC + 3, 4 D, D 11110000 0 0 F0-

... repeat pattern nRC + 1,..., 4 until nRC + nRCD - 1, truncate if necessary

1*nRC + nRCD RD 01010000 0 0 F0 00110011

... repeat pattern nRC + 1,..., 4 until nRC +nRAS - 1, truncate if necessary

1*nRC + nRAS PRE 00100000 0 0 F0-

... repeat pattern nRC + 1,..., 4 until 2 * nRC - 1, truncate if necessary

1 2*nRC repeat Sub-Loop 0, use BA[2:0] = 1 instead

2 4*nRC repeat Sub-Loop 0, use BA[2:0] = 2 instead

3 6*nRC repeat Sub-Loop 0, use BA[2:0] = 3 instead

4 8*nRC repeat Sub-Loop 0, use BA[2:0] = 4 instead

5 10*nRC repeat Sub-Loop 0, use BA[2:0] = 5 instead

6 12*nRC repeat Sub-Loop 0, use BA[2:0] = 6 instead

7 14*nRC repeat Sub-Loop 0, use BA[2:0] = 7 instead

CK/CK

CKE

Sub-Loop

Cycle

Number

Command

RAS

CAS

ODT

BA[2:0]

A[15:11]

A[10]

A[9:7]

A[6:3]

A[2:0]

Data2)

toggling

Static High

0 0 D 100000000000 -

1 D 100000000000 -

11110000 0 0 F0-

1 4-7 repeat Sub-Loop 0, use BA[2:0] = 1 instead

2 8-11 repeat Sub-Loop 0, use BA[2:0] = 2 instead

3 12-15 repeat Sub-Loop 0, use BA[2:0] = 3 instead

4 16-19 repeat Sub-Loop 0, use BA[2:0] = 4 instead

5 20-23 repeat Sub-Loop 0, use BA[2:0] = 5 instead

6 24-27 repeat Sub-Loop 0, use BA[2:0] = 6 instead

7 28-31 repeat Sub-Loop 0, use BA[2:0] = 7 instead

- 33 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

[ Table 35 ] IDD2NT and IDDQ2NT Measurement - Loop Pattern1)

NOTE :

1. DM must be driven Low all the time. DQS, DQS are MID-LEVEL.

2. DQ signals are MID-LEVEL.

[ Table 36 ] IDD4R and IDDQ4R Measurement - Loop Pattern1)

NOTE :

1. DM must be driven LOW all the time. DQS, DQS are used according to WR Commands, otherwise MID-LEVEL.

2. Burst Sequence driven on each DQ signal by Write Command. Outside burst operation, DQ signals are MID-LEVEL.

CK/CK

CKE

Sub-Loop

Cycle

Number

Command

RAS

CAS

ODT

BA[2:0]

A[15:11]

A[10]

A[9:7]

A[6:3]

A[2:0]

Data2)

toggling

Static High

0 0 D 100000000000 -

1 D 100000000000

11110000 0 0 F0

1 4-7 repeat Sub-Loop 0, but ODT = 0 and BA[2:0] = 1

2 8-11 repeat Sub-Loop 0, but ODT = 1 and BA[2:0] = 2

3 12-15 repeat Sub-Loop 0, but ODT = 1 and BA[2:0] = 3

4 16-19 repeat Sub-Loop 0, but ODT = 0 and BA[2:0] = 4

5 20-23 repeat Sub-Loop 0, but ODT = 0 and BA[2:0] = 5

6 24-27 repeat Sub-Loop 0, but ODT = 1 and BA[2:0] = 6

7 28-31 repeat Sub-Loop 0, but ODT = 1 and BA[2:0] = 7

CK/CK

CKE

Sub-Loop

Cycle

Number

Command

RAS

CAS

ODT

BA[2:0]

A[15:11]

A[10]

A[9:7]

A[6:3]

A[2:0]

Data2)

toggling

Static High

0 0 RD 010100000000 00000000

1 D 100000000000 -

2,3 D,D 111100000000 -

4 RD 01010000 0 0 F0 00110011

5 D 10000000 0 0 F0-

6,7 D,D 11110000 0 0 F0-

1 8-15 repeat Sub-Loop 0, but BA[2:0] = 1

2 16-23 repeat Sub-Loop 0, but BA[2:0] = 2

3 24-31 repeat Sub-Loop 0, but BA[2:0] = 3

4 32-39 repeat Sub-Loop 0, but BA[2:0] = 4

5 40-47 repeat Sub-Loop 0, but BA[2:0] = 5

6 48-55 repeat Sub-Loop 0, but BA[2:0] = 6

7 56-63 repeat Sub-Loop 0, but BA[2:0] = 7

- 34 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

[ Table 37 ] IDD4W Measurement - Loop Pattern1)

NOTE :

1. DM must be driven LOW all the time. DQS, DQS are used according to WR Commands, otherwise MID-LEVEL.

2. Burst Sequence driven on each DQ signal by Write Command. Outside burst operation, DQ signals are MID-LEVEL.

[ Table 38 ] IDD5B Measurement - Loop Pattern1)

NOTE :

1. DM must be driven LOW all the time. DQS, DQS are MID-LEVEL.

2. DQ signals are MID-LEVEL.

CK/CK

CKE

Sub-Loop

Cycle

Number

Command

RAS

CAS

ODT

BA[2:0]

A[15:11]

A[10]

A[9:7]

A[6:3]

A[2:0]

Data2)

toggling

Static High

0 0 WR 010010000000 00000000

1 D 100010000000 -

2,3 D,D 111110000000 -

4 WR 01001000 0 0 F0 00110011

5 D 10001000 0 0 F0-

6,7 D,D 11111000 0 0 F0-

1 8-15 repeat Sub-Loop 0, but BA[2:0] = 1

2 16-23 repeat Sub-Loop 0, but BA[2:0] = 2

3 24-31 repeat Sub-Loop 0, but BA[2:0] = 3

4 32-39 repeat Sub-Loop 0, but BA[2:0] = 4

5 40-47 repeat Sub-Loop 0, but BA[2:0] = 5

6 48-55 repeat Sub-Loop 0, but BA[2:0] = 6

7 56-63 repeat Sub-Loop 0, but BA[2:0] = 7

CK/CK

CKE

Sub-Loop

Cycle

Number

Command

RAS

CAS

ODT

BA[2:0]

A[15:11]

A[10]

A[9:7]

A[6:3]

A[2:0]

Data2)

toggling

Static High

0 0 REF 000100000000 -

1 1,2 D 100000000000 -

3,4 D,D 11110000 0 0 F 0 -

5...8 repeat cycles 1...4, but BA[2:0] = 1

9...12 repeat cycles 1...4, but BA[2:0] = 2

13...16 repeat cycles 1...4, but BA[2:0] = 3

17...20 repeat cycles 1...4, but BA[2:0] = 4

21...24 repeat cycles 1...4, but BA[2:0] = 5

25...28 repeat cycles 1...4, but BA[2:0] = 6

29...32 repeat cycles 1...4, but BA[2:0] = 7

2 33...nRFC - 1 repeat Sub-Loop 1, until nRFC - 1. Truncate, if necessary.

- 35 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

[ Table 39 ] IDD7 Measurement - Loop Pattern1)

NOTE :

1. DM must be driven LOW all the time. DQS, DQS are used according to RD Commands, otherwise MID-LEVEL.

2. Burst Sequence driven on each DQ signal by Read Command. Outside burst operation. DQ signals are MID-LEVEL.

CK/CK

CKE

Sub-Loop

Cycle

Number

Command

RAS

CAS

ODT

BA[2:0]

A[15:11]

A[10]

A[9:7]

A[6:3]

A[2:0]

Data2)

toggling

Static High

0 ACT 00110000 0 0 00-

1 RDA 01010000 1 0 00 00000000

2 D 10000000 0 0 00-

... repeat above D Command until nRRD - 1

nRRD ACT 00110100 0 0 F0-

nRRD + 1 RDA 01010100 1 0 F0 00110011

nRRD + 2 D 10000100 0 0 F0-

... repeat above D Command until 2*nRRD-1

2 2 * nRRD repeat Sub-Loop 0, but BA[2:0] = 2

3 3 * nRRD repeat Sub-Loop 1, but BA[2:0] = 3

44 * nRRD D 10000300 0 0 F0-

Assert and repeat above D Command until nFAW - 1, if necessary

5 nFAW repeat Sub-Loop 0, but BA[2:0] = 4

6 nFAW+nRRD repeat Sub-Loop 1, but BA[2:0] = 5

7 nFAW+2*nRRD repeat Sub-Loop 0, but BA[2:0] = 6

8 nFAW+3*nRRD repeat Sub-Loop 1, but BA[2:0] = 7

9 nFAW+4*nRRD D 10000700 0 0 F0-

Assert and repeat above D Command until 2*nFAW - 1, if necessary

2*nFAW+0 ACT 00110000 0 0 F0-

2*nFAW+1 RDA 01010000 1 0 F0 00110011

2*nFAW+2 D 10000000 0 0 F0-

Repeat above D Command until 2*nFAW + nRRD - 1

2*nFAW+nRRD ACT 00110100 0 0 00-

2*nFAW+nRRD+1 RDA 01010100 1 0 00 00000000

2*nFAW+nRRD+2 D 10000100 0 0 00-

Repeat above D Command until 2*nFAW + 2*nRRD - 1

12 2*nFAW+2*nRRD repeat Sub-Loop 10, but BA[2:0] = 2

13 2*nFAW+3*nRRD repeat Sub-Loop 11, but BA[2:0] = 3

14 2*nFAW+4*nRRD D 10000300 0 0 00-

Assert and repeat above D Command until 3*nFAW - 1, if necessary

15 3*nFAW repeat Sub-Loop 10, but BA[2:0] = 4

16 3*nFAW+nRRD repeat Sub-Loop 11, but BA[2:0] = 5

17 3*nFAW+2*nRRD repeat Sub-Loop 10, but BA[2:0] = 6

18 3*nFAW+3*nRRD repeat Sub-Loop 11, but BA[2:0] = 7

19 3*nFAW+4*nRRD D 10000700 0 0 00-

Assert and repeat above D Command until 4*nFAW - 1, if necessary

- 36 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

11. 2Gb DDR3 SDRAM C-die IDD Specification Table

[ Table 40 ] IDD Specification for 2Gb DDR3 C-die

Symbol

512Mx4 (K4B2G0446C)

Unit NOTEDDR3-1066 DDR3-1333 DDR3-1600

7-7-7 9-9-9 11-11-11

IDD0 55 60 65 mA

IDD1 65 70 75 mA

IDD2P0(slow exit) 12 12 12 mA

IDD2P1(fast exit) 20 20 25 mA

IDD2N303535mA

IDD2NT 35 40 40 mA

IDDQ2NT404040mA

IDD2Q303035mA

IDD3P303035mA

IDD3N505560mA

IDD4R 90 100 115 mA

IDDQ4R 35 35 35 mA

IDD4W 105 120 140 mA

IDD5B 170 170 180 mA

IDD6 12 12 12 mA

IDD7 160 200 205 mA

IDD8 12 12 12 mA

Symbol

256Mx8 (K4B2G0846C)

Unit NOTEDDR3-1066 DDR3-1333 DDR3-1600

7-7-7 9-9-9 11-11-11

IDD0 55 60 65 mA

IDD1 70 75 80 mA

IDD2P0(slow exit) 12 12 12 mA

IDD2P1(fast exit) 20 20 25 mA

IDD2N 30 35 35 mA

IDD2NT 35 40 40 mA

IDDQ2NT 70 70 70 mA

IDD2Q 30 30 35 mA

IDD3P 30 30 35 mA

IDD3N 50 55 60 mA

IDD4R 100 115 130 mA

IDDQ4R 50 50 50 mA

IDD4W 115 140 150 mA

IDD5B 170 170 180 mA

IDD6 12 12 12 mA

IDD7 170 210 215 mA

IDD8 12 12 12 mA

- 37 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

12. Input/Output Capacitance

[ Table 41 ] Input/Output Capacitance

NOTE :

1. Although the DM, TDQS and TDQS pins have different functions, the loading matches DQ and DQS

2. This parameter is not subject to production test. It is verified by design and characterization.

The capacitance is measured according to JEP147("PROCEDURE FOR MEASURING INPUT CAPACITANCE USING A VECTOR NETWORK ANALYZER( VNA)") with

VDD, VDDQ, VSS, VSSQ applied and all other pins floating (except the pin under test, CKE, RESET and ODT as necessary). VDD=VDDQ=1.5V, VBIAS=VDD/2 and on-die

termination off.

3. This parameter applies to monolithic devices only; stacked/dual-die devices are not covered here

4. Absolute value of CCK-CCK

5. Absolute value of CIO(DQS)-CIO(DQS)

6. CI applies to ODT, CS, CKE, A0-A15, BA0-BA2, RAS, CAS, WE.

7. CDI_CTRL applies to ODT, CS and CKE

8. CDI_CTRL=CI(CTRL)-0.5*(CI(CLK)+CI(CLK))

9. CDI_ADD_CMD applies to A0-A15, BA0-BA2, RAS, CAS and WE

10. CDI_ADD_CMD=CI(ADD_CMD) - 0.5*(CI(CLK)+CI(CLK))

11. CDIO=CIO(DQ,DM) - 0.5*(CIO(DQS)+CIO(DQS))

12. Maximum external load capacitance on ZQ pin: 5pF

Parameter Symbol DDR3-800 DDR3-1066 DDR3-1333 DDR3-1600 Units NOTE

Min Max Min Max Min Max Min Max

Input/output capacitance

(DQ, DM, DQS, DQS, TDQS, TDQS)CIO 1.5 3.0 1.5 2.7 1.5 2.5 1.5 2.3 pF 1,2,3

Input capacitance

(CK and CK) CCK 0.8 1.6 0.8 1.6 0.8 1.4 0.8 1.4 pF 2,3

Input capacitance delta

(CK and CK) CDCK 0 0.15 0 0.15 0 0.15 0 0.15 pF 2,3,4

Input capacitance

(All other input-only pins) CI 0.75 1.5 0.75 1.5 0.75 1.3 0.75 1.3 pF 2,3,6

Input capacitance delta

(DQS and DQS) CDDQS 0 0.2 0 0.2 0 0.15 0 0.15 pF 2,3,5

Input capacitance delta

(All control input-only pins) CDI_CTRL -0.5 0.3 -0.5 0.3 -0.4 0.2 -0.4 0.2 pF 2,3,7,8

Input capacitance delta

(all ADD and CMD input-only pins) CDI_ADD_CMD -0.5 0.5 -0.5 0.5 -0.4 0.4 -0.4 0.4 pF 2,3,9,10

Input/output capacitance delta

(DQ, DM, DQS, DQS, TDQS, TDQS)CDIO -0.5 0.3 -0.5 0.3 -0.5 0.3 -0.5 0.3 pF 2,3,11

Input/output capacitance of ZQ pin CZQ - 3 - 3 - 3 - 3 pF 2, 3, 12

- 38 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

13. Electrical Characteristics and AC timing for DDR3-800 to DDR3-1600

13.1 Clock Specification

The jitter specified is a random jitter meeting a Gaussian distribution. Input clocks violating the min/max values may result in malfunction of the DDR3

SDRAM device.

13.1.1 Definition for tCK(avg)

tCK(avg) is calculated as the average clock period across any consecutive 200 cycle window, where each clock period is calculated from rising edge to

rising edge.

13.1.2 Definition for tCK(abs)

tCK(abs) is defind as the absolute clock period, as measured from one rising edge to the next consecutive rising edge. tCK(abs) is not subject to produc-

tion test.

13.1.3 Definition for tCH(avg) and tCL(avg)

tCH(avg) is defined as the average high pulse width, as calculated across any consecutive 200 high pulses:

tCL(avg) is defined as the average low pulse width, as calculated across any consecutive 200 low pulses:

13.1.4 Definition for note for tJIT(per), tJIT(per, Ick)

tJIT(per) is defined as the largest deviation of any single tCK from tCK(avg). tJIT(per) = min/max of {tCKi-tCK(avg) where i=1 to 200}

tJIT(per) defines the single period jitter when the DLL is already locked.

tJIT(per,lck) uses the same definition for single period jitter, during the DLL locking period only.

tJIT(per) and tJIT(per,lck) are not subject to production test.

13.1.5 Definition for tJIT(cc), tJIT(cc, Ick)

tJIT(cc) is defined as the absolute difference in clock period between two consecutive clock cycles: tJIT(cc) = Max of {tCKi+1-tCKi}

tJIT(cc) defines the cycle to cycle jitter when the DLL is already locked.

tJIT(cc,lck) uses the same definition for cycle to cycle jitter, during the DLL locking period only.

tJIT(cc) and tJIT(cc,lck) are not subject to production test.

13.1.6 Definition for tERR(nper)

tERR is defined as the cumulative error across n multiple consecutive cycles from tCK(avg). tERR is not subject to production test.

j=1

tCKj NN=200

∑

j=1

tCHj N x tCK(avg) N=200

j=1

tCLj N x tCK(avg) N=200

∑

- 39 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

13.2 Refresh Parameters by Device Density

[ Table 42 ] Refresh parameters by device density

NOTE :

1. Users should refer to the DRAM supplier data sheet and/or the DIMM SPD to determine if DDR3 SDRAM devices support the following options or requirements referred to in

this material.

13.3 Speed Bins and CL, tRCD, tRP, tRC and tRAS for corresponding Bin

DDR3 SDRAM Speed Bins include tCK, tRCD, tRP, tRAS and tRC for each corresponding bin.

[ Table 43 ] DDR3-800 Speed Bins

[ Table 44 ] DDR3-1066 Speed Bins

Parameter Symbol 1Gb 2Gb 4Gb 8Gb Units NOTE

All Bank Refresh to active/refresh cmd time tRFC 110 160 300 350 ns

Average periodic refresh interval tREFI

0 °C ≤ TCASE ≤ 85°C7.8 7.8 7.8 7.8 µs

85 °C < TCASE ≤ 95°C3.9 3.9 3.9 3.9 µs 1

Speed DDR3-800

Units NOTECL-nRCD-nRP 6 - 6 - 6

Parameter Symbol min max

Internal read command to first data tAA 15 20 ns

ACT to internal read or write delay time tRCD 15 -ns

PRE command period tRP 15 -ns

ACT to ACT or REF command period tRC 52.5 -ns

ACT to PRE command period tRAS 37.5 9*tREFI ns

CL = 5 CWL = 5 tCK(AVG) 3.0 3.3 ns 1,2,3,4,9,10

CL = 6 CWL = 5 tCK(AVG) 2.5 3.3 ns 1,2,3

Supported CL Settings 5,6 nCK

Supported CWL Settings 5nCK

Speed DDR3-1066

Units NOTECL-nRCD-nRP 7 - 7 - 7

Parameter Symbol min max

Internal read command to first data tAA 13.125 20 ns

ACT to internal read or write delay time tRCD 13.125 -ns

PRE command period tRP 13.125 -ns

ACT to ACT or REF command period tRC 50.625 -ns

ACT to PRE command period tRAS 37.5 9*tREFI ns

CL = 5 CWL = 5 tCK(AVG) 3.0 3.3 ns 1,2,3,4,5,9,10

CWL = 6 tCK(AVG) Reserved ns 4

CL = 6 CWL = 5 tCK(AVG) 2.5 3.3 ns 1,2,3,5

CWL = 6 tCK(AVG) Reserved ns 1,2,3,4

CL = 7 CWL = 5 tCK(AVG) Reserved ns 4

CWL = 6 tCK(AVG) 1.875 <2.5 ns 1,2,3,4,8

CL = 8 CWL = 5 tCK(AVG) Reserved ns 4

CWL = 6 tCK(AVG) 1.875 <2.5 ns 1,2,3

Supported CL Settings 5,6,7,8 nCK

Supported CWL Settings 5,6 nCK

- 40 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

[ Table 45 ] DDR3-1333 Speed Bins

Speed DDR3-1333

Units NOTECL-nRCD-nRP 9 -9 - 9

Parameter Symbol min max

Internal read command to first data tAA 13.5

(13.125)820 ns

ACT to internal read or write delay time tRCD 13.5

(13.125)8-ns

PRE command period tRP 13.5

(13.125)8-ns

ACT to ACT or REF command period tRC 49.5

(49.125)8-ns

ACT to PRE command period tRAS 36 9*tREFI ns

CL = 5 CWL = 5 tCK(AVG) 3.0 3.3 ns 1,2,3,4,6,9,10

CWL = 6,7 tCK(AVG) Reserved ns 4

CL = 6

CWL = 5 tCK(AVG) 2.5 3.3 ns 1,2,3,6

CWL = 6 tCK(AVG) Reserved ns 1,2,3,4,6

CWL = 7 tCK(AVG) Reserved ns 4

CL = 7

CWL = 5 tCK(AVG) Reserved ns 4

CWL = 6 tCK(AVG) 1.875 <2.5 ns 1,2,3,4,6

CWL = 7 tCK(AVG) Reserved ns 1,2,3,4

CL = 8

CWL = 5 tCK(AVG) Reserved ns 4

CWL = 6 tCK(AVG) 1.875 <2.5 ns 1,2,3,6

CWL = 7 tCK(AVG) Reserved ns 1,2,3,4

CL = 9 CWL = 5,6 tCK(AVG) Reserved ns 4

CWL = 7 tCK(AVG) 1.5 <1.875 ns 1,2,3,4,8

CL = 10 CWL = 5,6 tCK(AVG) Reserved ns 4

CWL = 7 tCK(AVG) Reserved ns 1,2,3

Supported CL Settings 5,6,7,8,9 nCK

Supported CWL Settings 5,6,7 nCK

- 41 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

[ Table 46 ] DDR3-1600 Speed Bins

Speed DDR3-1600

Units NOTECL-nRCD-nRP 11-11-11

Parameter Symbol min max

Internal read command to first data tAA 13.75

(13.125)820 ns

ACT to internal read or write delay time tRCD 13.75

(13.125)8-ns

PRE command period tRP 13.75

(13.125)8-ns

ACT to ACT or REF command period tRC 48.75

(48.125)8-ns

ACT to PRE command period tRAS 35 9*tREFI ns

CL = 5 CWL = 5 tCK(AVG) 3.0 3.3 ns 1,2,3,4,7,9,10

CWL = 6,7,8 tCK(AVG) Reserved ns 4

CL = 6

CWL = 5 tCK(AVG) 2.5 3.3 ns 1,2,3,7

CWL = 6 tCK(AVG) Reserved ns 1,2,3,4,7

CWL = 7, 8 tCK(AVG) Reserved ns 4

CL = 7

CWL = 5 tCK(AVG) Reserved ns 4

CWL = 6 tCK(AVG) 1.875 <2.5 ns 1,2,3,4,7

CWL = 7 tCK(AVG) Reserved ns 1,2,3,4,7

CWL = 8 tCK(AVG) Reserved ns 4

CL = 8

CWL = 5 tCK(AVG) Reserved ns 4

CWL = 6 tCK(AVG) 1.875 <2.5 ns 1,2,3,7

CWL = 7 tCK(AVG) Reserved ns 1,2,3,4,7

CWL = 8 tCK(AVG) Reserved ns 1,2,3,4

CL = 9

CWL = 5,6 tCK(AVG) Reserved ns 4

CWL = 7 tCK(AVG) 1.5 <1.875 ns 1,2,3,4,7

CWL = 8 tCK(AVG) Reserved ns 1,2,3,4

CL = 10

CWL = 5,6 tCK(AVG) Reserved ns 4

CWL = 7 tCK(AVG) 1.5 <1.875 ns 1,2,3,7

CWL = 8 tCK(AVG) Reserved ns 1,2,3,4

CL = 11 CWL = 5,6,7 tCK(AVG) Reserved ns 4

CWL = 8 tCK(AVG) 1.25 <1.5 ns 1,2,3,8

Supported CL Settings 5,6,7,8,9,10,11 nCK

Supported CWL Settings 5,6,7,8 nCK

- 42 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

13.3.1 Speed Bin Table Notes

Absolute Specification (TOPER; VDDQ = VDD = 1.5V +/- 0.075 V);

NOTE :

1. The CL setting and CWL setting result in tCK(AVG).MIN and tCK(AVG).MAX requirements. When making a selection of tCK(AVG), both need to be fulfilled: Requirements

from CL setting as well as requirements from CWL setting.

2. tCK(AVG).MIN limits: Since CAS Latency is not purely analog - data and strobe output are synchronized by the DLL - all possible intermediate frequencies may not be guar-

anteed. An application should use the next smaller JEDEC standard tCK(AVG) value (2.5, 1.875, 1.5, or 1.25 ns) when calculating CL [nCK] = tAA [ns] / tCK(AVG) [ns],

rounding up to the next "Supported CL".

3. tCK(AVG).MAX limits: Calculate tCK(AVG) = tAA.MAX / CL SELECTED and round the resulting tCK(AVG) down to the next valid speed bin (i.e. 3.3ns or 2.5ns or 1.875 ns or

1.25 ns). This result is tCK(AVG).MAX corresponding to CL SELECTED.

4. "Reserved" settings are not allowed. User must program a different value.

5. Any DDR3-1066 speed bin also supports functional operation at lower frequencies as shown in the table which are not subject to Production Tests but verified by Design/

Characterization.

6. Any DDR3-1333 speed bin also supports functional operation at lower frequencies as shown in the table which are not subject to Production Tests but verified by Design/

Characterization.

7. Any DDR3-1600 speed bin also supports functional operation at lower frequencies as shown in the table which are not subject to Production Tests but verified by Design/

Characterization.

8. For devices supporting optional downshift to CL=7 and CL=9, tAA/tRCD/tRP min must be 13.125 ns or lower. SPD settings must be programmed to match. For example,

DDR3-1333(CL9) devices supporting downshift to DDR3-1066(CL7) should program 13.125 ns in SPD bytes for tAAmin (Byte 16), tRCDmin (Byte 18), and tRPmin (Byte

20). DDR3-1600(CL11) devices supporting downshift to DDR3-1333(CL9) or DDR3-1066(CL7) should program 13.125 ns in SPD bytes for tAAmin (Byte16), tRCDmin (Byte

18), and tRPmin (Byte 20). Once tRP (Byte 20) is programmed to 13.125ns, tRCmin (Byte 21,23) also should be programmed accordingly. For example, 49.125ns (tRASmin

+ tRPmin=36ns+13.125ns) for DDR3-1333(CL9) and 48.125ns (tRASmin+tRPmin=35ns+13.125ns) for DDR3-1600(CL11).

9. DDR3 800 AC timing apply if DRAM operates at lower than 800 MT/s data rate.

10. For CL5 support, refer to DIMM SPD information. DRAM is required to support CL5. CL5 is not mandatory in SPD coding.

- 43 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

14. Timing Parameters by Speed Grade

[ Table 47 ] Timing Parameters by Speed Bins for DDR3-800 to DDR3-1600

Speed DDR3-800 DDR3-1066 DDR3-1333 DDR3-1600

Units NOTE

Parameter Symbol MIN MAX MIN MAX MIN MAX MIN MAX

Clock Timing

Minimum Clock Cycle Time (DLL off mode) tCK(DLL_OF

F) 8 - 8 - 8 - 8 - ns 6

Average Clock Period tCK(avg) See Speed Bins Table ps

Clock Period tCK(abs) tCK(avg)min +

tJIT(per)min

tCK(avg)max +

tJIT(per)max

tCK(avg)min +

tJIT(per)min

tCK(avg)max +

tJIT(per)max

tCK(avg)min +

tJIT(per)min

tCK(avg)max +

tJIT(per)max

tCK(avg)min +

tJIT(per)min

tCK(avg)max +

tJIT(per)max ps

Average high pulse width tCH(avg) 0.47 0.53 0.47 0.53 0.47 0.53 0.47 0.53 tCK(avg)

Average low pulse width tCL(avg) 0.47 0.53 0.47 0.53 0.47 0.53 0.47 0.53 tCK(avg)

Clock Period Jitter tJIT(per) -100 100 -90 90 -80 80 -70 70 ps

Clock Period Jitter during DLL locking period tJIT(per, lck) -90 90 -80 80 -70 70 -60 60 ps

Cycle to Cycle Period Jitter tJIT(cc) 200 180 160 140 ps

Cycle to Cycle Period Jitter during DLL locking period tJIT(cc, lck) 180 160 140 120 ps

Cumulative error across 2 cycles tERR(2per) - 147 147 - 132 132 - 118 118 -103 103 ps

Cumulative error across 3 cycles tERR(3per) - 175 175 - 157 157 - 140 140 -122 122 ps

Cumulative error across 4 cycles tERR(4per) - 194 194 - 175 175 - 155 155 -136 136 ps

Cumulative error across 5 cycles tERR(5per) - 209 209 - 188 188 - 168 168 -147 147 ps

Cumulative error across 6 cycles tERR(6per) - 222 222 - 200 200 - 177 177 -155 155 ps

Cumulative error across 7 cycles tERR(7per) - 232 232 - 209 209 - 186 186 -163 163 ps

Cumulative error across 8 cycles tERR(8per) - 241 241 - 217 217 - 193 193 -169 169 ps

Cumulative error across 9 cycles tERR(9per) - 249 249 - 224 224 - 200 200 -175 175 ps

Cumulative error across 10 cycles tERR(10per) - 257 257 - 231 231 - 205 205 -180 180 ps

Cumulative error across 11 cycles tERR(11per) - 263 263 - 237 237 - 210 210 -184 184 ps

Cumulative error across 12 cycles tERR(12per) - 269 269 - 242 242 - 215 215 -188 188 ps

Cumulative error across n = 13, 14 ... 49, 50 cycles tERR(nper) tERR(nper)min = (1 + 0.68ln(n))*tJIT(per)min

tERR(nper)max = (1 = 0.68ln(n))*tJIT(per)max ps 24

Absolute clock HIGH pulse width tCH(abs) 0.43 -0.43 -0.43 -0.43 -tCK(avg) 25

Absolute clock Low pulse width tCL(abs) 0.43 -0.43 -0.43 -0.43 -tCK(avg) 26

Data Timing

DQS,DQS to DQ skew, per group, per access tDQSQ -200 -150 -125 -100 ps 13

DQ output hold time from DQS, DQS tQH 0.38 -0.38 -0.38 -0.38 -tCK(avg) 13, g

DQ low-impedance time from CK, CK tLZ(DQ) -800 400 -600 300 -500 250 -450 225 ps 13,14, f

DQ high-impedance time from CK, CK tHZ(DQ) -400 -300 -250 -225 ps 13,14, f

Data setup time to DQS, DQS referenced to

VIH(AC)VIL(AC) levels

tDS(base)

AC175 75 -25 -- - - ps d, 17

tDS(base)

AC150 125 -75 -30 -10 ps d, 17

Data hold time to DQS, DQS referenced to

VIH(AC)VIL(AC) levels

tDH(base)

DC100 150 -100 -65 -45 ps d, 17

DQ and DM Input pulse width for each input tDIPW 600 -490 -400 -360 ps 28

Data Strobe Timing

DQS, DQS differential READ Preamble tRPRE 0.9 NOTE 19 0.9 NOTE 19 0.9 NOTE 19 0.9 NOTE 19 tCK 13, 19, g

DQS, DQS differential READ Postamble tRPST 0.3 NOTE 11 0.3 NOTE 11 0.3 NOTE 11 0.3 NOTE 11 tCK 11, 13, b

DQS, DQS differential output high time tQSH 0.38 -0.38 -0.4 -0.4 -tCK(avg) 13, g

DQS, DQS differential output low time tQSL 0.38 -0.38 -0.4 -0.4 -tCK(avg) 13, g

DQS, DQS differential WRITE Preamble tWPRE 0.9 -0.9 -0.9 -0.9 - tCK

DQS, DQS differential WRITE Postamble tWPST 0.3 -0.3 -0.3 -0.3 - tCK

DQS, DQS rising edge output access time from rising

CK, CK tDQSCK -400 400 -300 300 -255 255 -225 225 ps 13,f

DQS, DQS low-impedance time (Referenced from RL-1) tLZ(DQS) -800 400 -600 300 -500 250 -450 225 ps 13,14,f

DQS, DQS high-impedance time (Referenced from

RL+BL/2) tHZ(DQS) -400 -300 -250 -225 ps 12,13,14

DQS, DQS differential input low pulse width tDQSL 0.45 0.55 0.45 0.55 0.45 0.55 0.45 0.55 tCK 29, 31

DQS, DQS differential input high pulse width tDQSH 0.45 0.55 0.45 0.55 0.45 0.55 0.45 0.55 tCK 30, 31

DQS, DQS rising edge to CK, CK rising edge tDQSS -0.25 0.25 -0.25 0.25 -0.25 0.25 -0.27 0.27 tCK(avg) c

DQS,DQS falling edge setup time to CK, CK rising edge tDSS 0.2 -0.2 -0.2 -0.18 -tCK(avg) c, 32

DQS,DQS falling edge hold time to CK, CK rising edge tDSH 0.2 -0.2 -0.2 -0.18 -tCK(avg) c, 32

- 44 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

[ Table 47 ] Timing Parameters by Speed Bins for DDR3-800 to DDR3-1600 (Cont.)

Speed DDR3-800 DDR3-1066 DDR3-1333 DDR3-1600

Units NOTE

Parameter Symbol MIN MAX MIN MAX MIN MAX MIN MAX

Command and Address Timing

DLL locking time tDLLK 512 -512 -512 -512 -nCK

internal READ Command to PRECHARGE Command

delay tRTP

max

(4nCK,7.5ns

)

-max

(4nCK,7.5ns) -max

(4nCK,7.5ns) - e

Delay from start of internal write transaction to internal

read command tWTR

max

(4nCK,7.5ns

)

-max

(4nCK,7.5ns) -max

(4nCK,7.5ns) -e,18

WRITE recovery time tWR 15 -15 -15 -15 -ns e

Mode Register Set command cycle time tMRD 4 - 4 - 4 - 4 - nCK

Mode Register Set command update delay tMOD

max

(12nCK,15n

max

(12nCK,15ns

)

max

(12nCK,15ns

)

-max

(12nCK,15ns) -

CAS# to CAS# command delay tCCD 4 - 4 - 4 - 4 - nCK

Auto precharge write recovery + precharge time tDAL(min) WR + roundup (tRP / tCK(AVG)) nCK

Multi-Purpose Register Recovery Time tMPRR 1 - 1 - 1 - 1 - nCK 22

ACTIVE to PRECHARGE command period tRAS See “Speed Bins and CL, tRCD, tRP, tRC and tRAS for corresponding Bin” on page 42 ns e

ACTIVE to ACTIVE command period for 1KB page size tRRD max

(4nCK,10ns) -max

(4nCK,7.5ns) -max

(4nCK,6ns) -max

(4nCK,6ns) - e

ACTIVE to ACTIVE command period for 2KB page size tRRD max

(4nCK,10ns) -max

(4nCK,7.5ns) -max

(4nCK,7.5ns) - e

Four activate window for 1KB page size tFAW 40 -37.5 -30 -30 -ns e

Four activate window for 2KB page size tFAW 50 -50 -45 -40 -ns e

Command and Address setup time to CK, CK referenced

to VIH(AC) / VIL(AC) levels

tIS(base)

AC175 200 -125 -65 -45 -ps b,16

tIS(base)

AC150 200 + 150 -125 + 150 -65+125 -45+125 -ps b,16,27

Command and Address hold time from CK, CK refer-

enced to VIH(AC) / VIL(AC) levels

tIH(base)

DC100 275 -200 -140 -120 -ps b,16

Control & Address Input pulse width for each input tIPW 900 -780 -620 -560 -ps 28

Calibration Timing

Power-up and RESET calibration time tZQinitI 512 -512 -512 -512 -nCK

Normal operation Full calibration time tZQoper 256 -256 -256 -256 -nCK

Normal operation short calibration time tZQCS 64 -64 -64 -64 -nCK 23

Reset Timing

Exit Reset from CKE HIGH to a valid command tXPR

max(5nCK,

tRFC +

10ns)

-max(5nCK,

tRFC + 10ns) -max(5nCK,

tRFC + 10ns) -

Self Refresh Timing

Exit Self Refresh to commands not requiring a locked

DLL tXS max(5nCK,t

RFC + 10ns) -max(5nCK,tR

FC + 10ns) -max(5nCK,tR

FC + 10ns) -

Exit Self Refresh to commands requiring a locked DLL tXSDLL tDLLK(min) -tDLLK(min) -tDLLK(min) -tDLLK(min) -nCK

Minimum CKE low width for Self refresh entry to exit tim-

ing tCKESR tCKE(min) +

1tCK -tCKE(min) +

1tCK -

Valid Clock Requirement after Self Refresh Entry (SRE)

or Power-Down Entry (PDE) tCKSRE max(5nCK,

10ns) -max(5nCK,

10ns) -

Valid Clock Requirement before Self Refresh Exit (SRX)

or Power-Down Exit (PDX) or Reset Exit tCKSRX max(5nCK,

10ns) -max(5nCK,

10ns) -

- 45 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

[ Table 47 ] Timing Parameters by Speed Bins for DDR3-800 to DDR3-1600 (Cont.)

Speed DDR3-800 DDR3-1066 DDR3-1333 DDR3-1600

Units NOTE

Parameter Symbol MIN MAX MIN MAX MIN MAX MIN MAX

Power Down Timing

Exit Power Down with DLL on to any valid com-

mand;Exit Precharge Power Down with DLL

frozen to commands not requiring a locked DLL

tXP

max

(3nCK,

7.5ns)

max

(3nCK,

7.5ns)

-max

(3nCK,6ns) -max

(3nCK,6ns) -

Exit Precharge Power Down with DLL frozen to com-

mands requiring a locked DLL tXPDLL

max

(10nCK,

24ns)

max

(10nCK,

24ns)

max

(10nCK,

24ns)

max

(10nCK,

24ns)

- 2

CKE minimum pulse width tCKE

max

(3nCK,

7.5ns)

max

(3nCK,

5.625ns)

max

(3nCK,

5.625ns)

-max

(3nCK,5ns) -

Command pass disable delay tCPDED 1 - 1 - 1 - 1 - nCK

Power Down Entry to Exit Timing tPD tCKE(min) 9*tREFI tCKE(min) 9*tREFI tCKE(min) 9*tREFI tCKE(min) 9*tREFI tCK 15

Timing of ACT command to Power Down entry tACTPDEN 1 - 1 - 1 - 1 - nCK 20

Timing of PRE command to Power Down entry tPRPDEN 1 - 1 - 1 - 1 - nCK 20

Timing of RD/RDA command to Power Down entry tRDPDEN RL + 4 +1 -RL + 4 +1 -RL + 4 +1 -RL + 4 +1 -

Timing of WR command to Power Down entry

(BL8OTF, BL8MRS, BC4OTF) tWRPDEN

WL + 4

+(tWR/

tCK(avg))

WL + 4

+(tWR/

tCK(avg))

WL + 4

+(tWR/

tCK(avg))

WL + 4

+(tWR/

tCK(avg))

-nCK 9

Timing of WRA command to Power Down entry

(BL8OTF, BL8MRS, BC4OTF) tWRAPDEN WL + 4

+WR +1 -WL + 4

+WR +1 -WL + 4 +WR

+1 -WL + 4 +WR

+1 -nCK 10

Timing of WR command to Power Down entry

(BC4MRS) tWRPDEN

WL + 2

+(tWR/

tCK(avg))

WL + 2

+(tWR/

tCK(avg))

WL + 2

+(tWR/

tCK(avg))

WL + 2

+(tWR/

tCK(avg))

-nCK 9

Timing of WRA command to Power Down entry

(BC4MRS) tWRAPDEN WL +2 +WR

+1 -WL +2 +WR

+1 -nCK 10

Timing of REF command to Power Down entry tREFPDEN 1 - 1 - 1 - 1 - 20,21

Timing of MRS command to Power Down entry tMRSPDEN tMOD(min) -tMOD(min) - tMOD(min) - tMOD(min) -

ODT Timing

ODT high time without write command or with write

command and BC4 ODTH4 4 - 4 - 4 - 4 - nCK

ODT high time with Write command and BL8 ODTH8 6 - 6 - 6 - 6 - nCK

Asynchronous RTT turn-on delay (Power-Down with

DLL frozen) tAONPD 28.5 28.5 28.5 28.5 ns

Asynchronous RTT turn-off delay (Power-Down with

DLL frozen) tAOFPD 28.5 28.5 28.5 28.5 ns

RTT turn-on tAON -400 400 -300 300 -250 250 -225 225 ps 7,f

RTT_NOM and RTT_WR turn-off time from ODTLoff

reference tAOF 0.3 0.7 0.3 0.7 0.3 0.7 0.3 0.7 tCK(avg

)8,f

RTT dynamic change skew tADC 0.3 0.7 0.3 0.7 0.3 0.7 0.3 0.7 tCK(avg

Write Leveling Timing

First DQS pulse rising edge after tDQSS margining

mode is programmed tWLMRD 40 -40 -40 -40 -tCK 3

DQS/DQS delay after tDQS margining mode is pro-

grammed tWLDQSEN 25 -25 -25 -25 -tCK 3

Write leveling setup time from rising CK, CK crossing to

rising DQS, DQS crossing tWLS 325 -245 -195 -165 -ps

Write leveling hold time from rising DQS, DQS crossing

to rising CK, CK crossing tWLH 325 -245 -195 -165 -ps

Write leveling output delay tWLO 0 9 0 9 0 9 0 7.5 ns

Write leveling output error tWLOE 0 2 0 2 0 2 0 2 ns

- 46 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

14.1 Jitter Notes

Specific Note a Unit ’tCK(avg)’ represents the actual tCK(avg) of the input clock under operation. Unit ’nCK’ represents one clock cycle of the

input clock, counting the actual clock edges.ex) tMRD = 4 [nCK] means; if one Mode Register Set command is registered at Tm,

another Mode Register Set command may be registered at Tm+4, even if (Tm+4 - Tm) is 4 x tCK(avg) + tERR(4per),min.

Specific Note b These parameters are measured from a command/address signal (CKE, CS, RAS, CAS, WE, ODT, BA0, A0, A1, etc.) transition

edge to its respective clock signal (CK/CK) crossing. The spec values are not affected by the amount of clock jitter applied (i.e.

tJIT(per), tJIT(cc), etc.), as the setup and hold are relative to the clock signal crossing that latches the command/address. That is,

these parameters should be met whether clock jitter is present or not.

Specific Note c These parameters are measured from a data strobe signal (DQS(L/U), DQS(L/U)) crossing to its respective clock signal (CK, CK)

crossing. The spec values are not affected by the amount of clock jitter applied (i.e. tJIT(per), tJIT(cc), etc.), as these are relative

to the clock signal crossing. That is, these parameters should be met whether clock jitter is present or not.

Specific Note d These parameters are measured from a data signal (DM(L/U), DQ(L/U)0, DQ(L/U)1, etc.) transition edge to its respective data

strobe signal (DQS(L/U), DQS(L/U)) crossing.

Specific Note e For these parameters, the DDR3 SDRAM device supports tnPARAM [nCK] = RU{ tPARAM [ns] / tCK(avg) [ns] }, which is in clock

cycles, assuming all input clock jitter specifications are satisfied. For example, the device will support tnRP = RU{tRP / tCK(avg)},

which is in clock cycles, if all input clock jitter specifications are met. This means: For DDR3-800 6-6-6, of which tRP = 15ns, the

device will support tnRP = RU{tRP / tCK(avg)} = 6, as long as the input clock jitter specifications are met, i.e. Precharge com-

mand at Tm and Active command at Tm+6 is valid even if (Tm+6 - Tm) is less than 15ns due to input clock jitter.

Specific Note f When the device is operated with input clock jitter, this parameter needs to be derated by the actual tERR(mper),act of the input

clock, where 2 <= m <= 12. (output deratings are relative to the SDRAM input clock.)

For example, if the measured jitter into a DDR3-800 SDRAM has tERR(mper),act,min = - 172 ps and tERR(mper),act,max = +

193 ps, then tDQSCK,min(derated) = tDQSCK,min - tERR(mper),act,max = - 400 ps - 193 ps = - 593 ps and tDQSCK,max(der-

ated) = tDQSCK,max - tERR(mper),act,min = 400 ps + 172 ps = + 572 ps. Similarly, tLZ(DQ) for DDR3-800 derates to

tLZ(DQ),min(derated) = - 800 ps - 193 ps = - 993 ps and tLZ(DQ),max(derated) = 400 ps + 172 ps = + 572 ps. (Caution on the

min/max usage!)

Note that tERR(mper),act,min is the minimum measured value of tERR(nper) where 2 <= n <=

12, and tERR(mper),act,max is the maximum measured value of tERR(nper) where 2 <= n <= 12.

Specific Note g When the device is operated with input clock jitter, this parameter needs to be derated by the actual tJIT(per),act of the input

clock. (output deratings are relative to the SDRAM input clock.) For example, if the measured jitter into a DDR3-800 SDRAM has

tCK(avg),act = 2500 ps, tJIT(per),act,min = - 72 ps and tJIT(per),act,max = + 93 ps, then tRPRE,min(derated) = tRPRE,min +

tJIT(per),act,min = 0.9 x tCK(avg),act + tJIT(per),act,min = 0.9 x 2500 ps - 72 ps = + 2178 ps. Similarly, tQH,min(derated) =

tQH,min + tJIT(per),act,min = 0.38 x tCK(avg),act + tJIT(per),act,min = 0.38 x 2500 ps - 72 ps = + 878 ps. (Caution on the min/

max usage!)

- 47 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

14.2 Timing Parameter Notes

1. Actual value dependant upon measurement level definitions which are TBD.

2. Commands requiring a locked DLL are: READ (and RAP) and synchronous ODT commands.

3. The max values are system dependent.

4. WR as programmed in mode register

5. Value must be rounded-up to next higher integer value

6. There is no maximum cycle time limit besides the need to satisfy the refresh interval, tREFI.

7. For definition of RTT turn-on time tAON see "Device Operation & Timing Diagram Datasheet"

8. For definition of RTT turn-off time tAOF see "Device Operation & Timing Diagram Datasheet".

9. tWR is defined in ns, for calculation of tWRPDEN it is necessary to round up tWR / tCK to the next integer.

10. WR in clock cycles as programmed in MR0

11. The maximum read postamble is bound by tDQSCK(min) plus tQSH(min) on the left side and tHZ(DQS)max on the right side. See "Device Operation & Timing

Diagram Datasheet.

12. Output timing deratings are relative to the SDRAM input clock. When the device is operated with input clock jitter, this parameter needs to be derated

by TBD

13. Value is only valid for RON34

14. Single ended signal parameter. Refer to chapter 8 and chapter 9 for definition and measurement method.

15. tREFI depends on TOPER

16. tIS(base) and tIH(base) values are for 1V/ns CMD/ADD single-ended slew rate and 2V/ns CK, CK differential slew rate, Note for DQ and DM signals,

VREF(DC) = VREFDQ(DC). For input only pins except RESET, VREF(DC)=VREFCA(DC).

See "Address/Command Setup, Hold and Derating :" on page 48.

17. tDS(base) and tDH(base) values are for 1V/ns DQ single-ended slew rate and 2V/ns DQS, DQS differential slew rate. Note for DQ and DM signals,

VREF(DC)= VREFDQ(DC). For input only pins except RESET, VREF(DC)=VREFCA(DC).

See "Data Setup, Hold and Slew Rate Derating :" on page 54.

18. Start of internal write transaction is defined as follows ;

For BL8 (fixed by MRS and on-the-fly) : Rising clock edge 4 clock cycles after WL.

For BC4 (on-the-fly) : Rising clock edge 4 clock cycles after WL

For BC4 (fixed by MRS) : Rising clock edge 2 clock cycles after WL

19. The maximum read preamble is bound by tLZDQS(min) on the left side and tDQSCK(max) on the right side. See "Device Operation & Timing Diagram

Datasheet"

20. CKE is allowed to be registered low while operations such as row activation, precharge, autoprecharge or refresh are in progress, but power-down

IDD spec will not be applied until finishing those operations.

21. Although CKE is allowed to be registered LOW after a REFRESH command once tREFPDEN(min) is satisfied, there are cases where additional time

such as tXPDLL(min) is also required. See "Device Operation & Timing Diagram Datasheet".

22. Defined between end of MPR read burst and MRS which reloads MPR or disables MPR function.

23. One ZQCS command can effectively correct a minimum of 0.5 % (ZQCorrection) of RON and RTT impedance error within 64 nCK for all speed bins assuming

the maximum sensitivities specified in the ’Output Driver Voltage and Temperature Sensitivity’ and ’ODT Voltage and Temperature Sensitivity’ tables. The

appropriate interval between ZQCS commands can be determined from these tables and other application specific parameters.

One method for calculating the interval between ZQCS commands, given the temperature (Tdriftrate) and voltage (Vdriftrate) drift rates that the SDRAM is sub-

ject to in the application, is illustrated. The interval could be defined by the following formula:

where TSens = max(dRTTdT, dRONdTM) and VSens = max(dRTTdV, dRONdVM) define the SDRAM temperature and voltage sensitivities.

For example, if TSens = 1.5% /°C, VSens = 0.15% / mV, Tdriftrate = 1°C / sec and Vdriftrate = 15 mV / sec, then the interval between ZQCS commands is calcu-

lated as:

24. n = from 13 cycles to 50 cycles. This row defines 38 parameters.

25. tCH(abs) is the absolute instantaneous clock high pulse width, as measured from one rising edge to the following falling edge.

26. tCL(abs) is the absolute instantaneous clock low pulse width, as measured from one falling edge to the following rising edge.

27. The tIS(base) AC150 specifications are adjusted from the tIS(base) specification by adding an additional 100 ps of derating to accommodate for the lower alter-

nate threshold of 150 mV and another 25 ps to account for the earlier reference point [(175 mv - 150 mV) / 1 V/ns].

28. Pulse width of a input signal is defined as the width between the first crossing of VREF(DC) and the consecutive crossing of VREF(DC)

29. tDQSL describes the instantaneous differential input low pulse width on DQS-DQS, as measured from one falling edge to the next consecutive rising edge.

30. tDQSH describes the instantaneous differential input high pulse width on DQS-DQS, as measured from one rising edge to the next consecutive falling edge.

31. tDQSH, act + tDQSL, act = 1 tCK, act ; with tXYZ, act being the actual measured value of the respective timing parameter in the application.

32. tDSH, act + tDSS, act = 1 tCK, act ; with tXYZ, act being the actual measured value of the respective timing parameter in the application.

ZQCorrection

(TSens x Tdriftrate) + (VSens x Vdriftrate)

0.5

(1.5 x 1) + (0.15 x 15) = 0.133

128ms

- 48 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

14.3 Address/Command Setup, Hold and Derating :

For all input signals the total tIS (setup time) and tIH (hold time) required is calculated by adding the data sheet tIS(base) and tIH(base) value (see

Table 48) to the ∆tIS and ∆tIH derating value (see Table 49) respectively.

Example: tIS (total setup time) = tIS(base) + ∆tIS Setup (tIS) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of

VREF(DC) and the first crossing of VIH(AC)min. Setup (tIS) nominal slew rate for a falling signal is defined as the slew rate between the last crossing of

VREF(DC) and the first crossing of VIL(AC)max. If the actual signal is always earlier than the nominal slew rate line between shaded ’VREF(DC) to ac

region’, use nominal slew rate for derating value (see Figure 21). If the actual signal is later than the nominal slew rate line anywhere between shaded

’VREF(DC) to ac region’, the slew rate of a tangent line to the actual signal from the ac level to dc level is used for derating value (see Figure 23).

Hold (tIH) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of VIL(DC)max and the first crossing of VREF(DC).

Hold (tIH) nominal slew rate for a falling signal is defined as the slew rate between the last crossing of VIH(DC)min and the first crossing of VREF(DC). If

the actual signal is always later than the nominal slew rate line between shaded ’dc to VREF(DC) region’, use nominal slew rate for derating value (see

Figure 22). If the actual signal is earlier than the nominal slew rate line anywhere between shaded ’dc to VREF(DC) region’, the slew rate of a tangent line

to the actual signal from the dc level to VREF(DC) level is used for derating value (see Figure 24).

For a valid transition the input signal has to remain above/below VIH/IL(AC) for some time tVAC (see Table 51).

Although for slow slew rates the total setup time might be negative (i.e. a valid input signal will not have reached VIH/IL(AC) at the time of the rising clock

transition) a valid input signal is still required to complete the transition and reach VIH/IL(AC).

For slew rates in between the values listed in Table 49, the derating values may obtained by linear interpolation.

These values are typically not subject to production test. They are verified by design and characterization.

[ Table 48 ] ADD/CMD Setup and Hold Base-Values for 1V/ns

NOTE :

1. AC/DC referenced for 1V/ns Address/Command slew rate and 2 V/ns differential CK-Ck slew rate

2. The tIS(base)-AC150 specifications are adjusted from the tIS(base) specification by adding an additional 125ps for DDR3-800/1066 or 100ps for

DDR3-1333/1600 of derating to accommodate for the lower alternate threshold of 150mV and another 25ps to account for the earlier reference point

[(175mV-150mV)/1 V/ns]

[ Table 49 ] Derating values DDR3-800/1066/1333/1600 tIS/tIH-AC/DC based

[ps] DDR3-800 DDR3-1066 DDR3-1333 DDR3-1600 reference

tIS(base) AC175 200 125 65 45 VIH/L(AC)

tIS(base) AC150 350 275 190 170 VIH/L(AC)

tIH(base)-DC100 275 200 140 120 VIH/L(DC)

∆tIS, ∆tIH Derating [ps] AC/DC based

AC175 Threshold -> VIH(AC) = VREF(DC) + 175mV, VIL(AC) = VREF(DC) - 175mV

CLK,CLK Differential Slew Rate

4.0 V/ns 3.0 V/ns 2.0 V/ns 1.8 V/ns 1.6 V/ns 1.4V/ns 1.2V/ns 1.0V/ns

∆tIS ∆tIH ∆tIS ∆tIH ∆tIS ∆tIH ∆tIS ∆tIH ∆tIS ∆tIH ∆tIS ∆tIH ∆tIS ∆tIH ∆tIS ∆tIH

CMD/

ADD

Slew

rate

V/ns

2.08850885088509658104661127412084128100

1.559345934593467427550835891689984

1.0000000881616242432344050

0.9-2-4-2-4-2-4 6 41412222030303846

0.8-6-10-6-10-6-10 2 -2 10 6 181426243440

0.7 -11 -16 -11 -16 -11 -16 -3 -8 5 0 13 8 21 18 29 34

0.6 -17 -26 -17 -26 -17 -26 -9 -18 -1 -10 7 -2 15 8 23 24

0.5 -35 -40 -35 -40 -35 -40 -27 -32 -19 -24 -11 -16 -2 -6 5 10

0.4 -62 -60 -62 -60 -62 -60 -54 -52 -46 -44 -38 -36 -30 -26 -22 -10

- 49 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

[ Table 50 ] Derating values DDR3-800/1066/1333/1600 tIS/tIH-AC/DC based - Alternate AC150 Threshold

[ Table 51 ] Required time tVAC above VIH(AC) {blow VIL(AC)} for valid transition

∆tIS, ∆tIH Derating [ps] AC/DC based

Alternate AC150 Threshold -> VIH(AC) = VREF(DC) + 150mV, VIL(AC) = VREF(DC) - 150mV

CLK,CLK Differential Slew Rate

4.0 V/ns 3.0 V/ns 2.0 V/ns 1.8 V/ns 1.6 V/ns 1.4V/ns 1.2V/ns 1.0V/ns

∆tIS ∆tIH ∆tIS ∆tIH ∆tIS ∆tIH ∆tIS ∆tIH ∆tIS ∆tIH ∆tIS ∆tIH ∆tIS ∆tIH ∆tIS ∆tIH

CMD/

ADD

Slew

rate

V/ns

2.075507550755083589166997410784115100

1.550345034503458426650745882689084

1.0000000881616242432344050

0.9 0 -4 0 -4 0 -4 8 4 16 12 24 20 32 30 40 46

0.8 0-10 0-10 0-10 8 -2 16 6 241432244040

0.7 0 -16 0 -16 0 -16 8 -8 16 0 24 8 32 18 40 34

0.6 -1 -26 -1 -26 -1 -26 7 -18 15 -10 23 -2 31 8 39 24

0.5 -10 -40 -10 -40 -10 -40 -2 -32 6 -24 14 -16 22 -6 30 10

0.4 -25 -60 -25 -60 -25 -60 -17 -52 -9 -44 -1 -36 7 -26 15 -10

Slew Rate[V/ns] tVAC @175mV [ps] tVAC @150mV [ps]

min max min max

>2.0 75 - 175 -

2.0 57 - 170 -

1.5 50 - 167 -

1.0 38 - 163 -

0.9 34 - 162 -

0.8 29 - 161 -

0.7 22 - 159 -

0.6 13 - 155 -

0.5 0 - 150 -

< 0.5 0 - 150 -

- 50 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

Figure 21. Illustration of nominal slew rate and tVAC for setup time tDS (for DQ with respect to strobe) and tIS

(for ADD/CMD with respect to clock).

VSS

tDS tDH

Setup Slew Rate

Rising Signal

Falling Signal

∆ TF ∆ TR

VREF(DC) - VIL(AC)max

∆ TF

=VIH(AC)min - VREF(DC)

∆ TR

VDDQ

VIH(AC) min

VIH(DC) min

VREF(DC)

VIL(DC) max

VIL(AC) max

nominal slew

rate

nominal

slew rate

VREF to ac

region

VREF to ac

region

tIS tIH

tDS tDH

tIS tIH

tVAC

NOTE :Clock and Strobe are drawn on a different time scale.

DQS

- 51 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

Figure 22. Illustration of nominal slew rate for hold time tDH (for DQ with respect to strobe) and tIH

(for ADD/CMD with respect to clock).

VSS

Hold Slew Rate

Falling Signal

Rising Signal

∆ TR ∆ TF

VREF(DC) - VIL(DC)max

∆ TR

=VIH(DC)min - VREF(DC)

∆ TF

VDDQ

VIH(AC) min

VIH(DC) min

VREF(DC)

VIL(DC) max

VIL(AC) max

nominal

slew rate

nominal

slew rate

dc to VREF

region

tIS tIH tIS tIH

dc to VREF

region

NOTE :Clock and Strobe are drawn on a different time scale.

tDS tDH tDS tDH

DQS

- 52 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

Figure 23. Illustration of tangent line for setup time tDS (for DQ with respect to strobe) and tIS

(for ADD/CMD with respect to clock)

VSS

Setup Slew Rate

Rising Signal

Falling Signal

∆ TF

∆ TR

tangent line[VREF(DC) - VIL(AC)max]

∆ TF

tangent line[VIH(AC)min - VREF(DC)]

∆ TR

VDDQ

VIH(AC) min

VIH(DC) min

VREF(DC)

VIL(DC) max

VIL(AC) max

tangent

VREF to ac

region

VREF to ac

region

line

nominal

line

nominal

line

tIS tIH tIS tIH

tVAC

NOTE :Clock and Strobe are drawn on a different time scale.

tDS tDH tDS tDH

DQS

tVAC

- 53 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

Figure 24. Illustration of tangent line for hold time tDH (for DQ with respect to strobe) and tIH

(for ADD/CMD with respect to clock)

VSS

Hold Slew Rate

∆ TF

∆ TR

tangent line [ VIH(DC)min - VREF(DC) ]

∆ TF

VDDQ

VIH(AC) min

VIH(DC) min

VREF(DC)

VIL(DC) max

VIL(AC) max

tangent

dc to VREF

region

dc to VREF

region

line

nominal

line

nominal

line

Falling Signal

Hold Slew Rate tangent line [ VREF(DC) - VIL(DC)max ]

∆ TR

Rising Signal

tIS tIH tIS tIH

NOTE :Clock and Strobe are drawn on a different time scale.

tDS tDH tDS tDH

DQS

- 54 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

14.4 Data Setup, Hold and Slew Rate Derating :

For all input signals the total tDS (setup time) and tDH (hold time) required is calculated by adding the data sheet tDS(base) and tDH(base) value (see

Table 52) to the ∆ tDS and ∆tDH (see Table 55) derating value respectively. Example: tDS (total setup time) = tDS(base) + ∆tDS.

Setup (tDS) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of VREF(DC) and the first crossing of VIH(AC)min.

Setup (tDS) nominal slew rate for a falling signal is defined as the slew rate between the last crossing of VREF(DC) and the first crossing of VIL(AC)max

(see Figure 25). If the actual signal is always earlier than the nominal slew rate line between shaded ’VREF(DC) to ac region’, use nominal slew rate for

derating value. If the actual signal is later than the nominal slew rate line anywhere

between shaded ’VREF(DC) to ac region’, the slew rate of a tangent line to the actual signal from the ac level to dc level is used for derating value (see

Figure 27).

Hold (tDH) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of VIL(DC)max and the first crossing of VREF(DC).

Hold (tDH) nominal slew rate for a falling signal is defined as the slew rate between the last crossing of VIH(DC)min and the first crossing of VREF(DC)

(see Figure ). If the actual signal is always later than the nominal slew rate line between shaded ’dc level to VREF(DC) region’, use nominal slew rate for

derating value. If the actual signal is earlier than the nominal slew rate line anywhere between shaded ’dc to VREF(DC) region’, the slew rate of a tangent

line to the actual signal from the dc level to VREF(DC) level is used for derating value (see Figure 28).

For a valid transition the input signal has to remain above/below VIH/IL(AC) for some time tVAC (see Table 56).

Although for slow slew rates the total setup time might be negative (i.e. a valid input signal will not have reached VIH/IL(AC) at the time of the rising clock

transition) a valid input signal is still required to complete the transition and reach VIH/IL(AC).

For slew rates in between the values listed in the tables the derating values may obtained by linear interpolation.

These values are typically not subject to production test. They are verified by design and characterization.

[ Table 52 ] Data Setup and Hold Base-Values

NOTE : AC/DC referenced for 1V/ns DQ-slew rate and 2 V/ns DQS slew rate)

[ Table 53 ] Derating values DDR3-800/1066 tDS/tDH - (AC175)

NOTE : 1. Cell contents shaded in red are defined as ’not supported’.

[ Table 54 ] Derating values for DDR3-800/1066/1333/1600 tDS/tDH - (AC150)

NOTE : 1. Cell contents shaded in red are defined as ’not supported’.

[ps] DDR3-800 DDR3-1066 DDR3-1333 DDR3-1600 reference

tDS(base) AC175 75 25 --V

IH/L(AC)

tDS(base) AC150 125 75 30 10 VIH/L(AC)

tDS(base) AC135 ----V

IH/L(AC)

tDH(base) DC100 150 100 65 45 VIH/L(DC)

∆tDS, ∆tDH Derating in [ps] AC/DC based1

DQS,DQS Differential Slew Rate

4.0 V/ns 3.0 V/ns 2.0 V/ns 1.8 V/ns 1.6 V/ns 1.4V/ns 1.2V/ns 1.0V/ns

∆tDS ∆tDH ∆tDS ∆tDH ∆tDS ∆tDH ∆tDS ∆tDH ∆tDS ∆tDH ∆tDS ∆tDH ∆tDS ∆tDH ∆tDS ∆tDH

DDR3

800/

1066

Slew

rate

V/ns

2.0885088508850----------

1.55934593459346742 - - - - - - - -

1.0000000881616- - - - - -

0.9- - -2-4-2-4 6 414122220 - - - -

0.8 - - - - -6 -10 2 -2 10 6 18 14 26 24 - -

0.7-------3-85013821182934

0.6---------1-107-21582324

0.5-----------11-16-2-6610

0.4-------------30-26-22-10

∆tDS, ∆tDH Derating in [ps] AC/DC based1

DQS,DQS Differential Slew Rate

4.0 V/ns 3.0 V/ns 2.0 V/ns 1.8 V/ns 1.6 V/ns 1.4V/ns 1.2V/ns 1.0V/ns

∆tDS ∆tDH ∆tDS ∆tDH ∆tDS ∆tDH ∆tDS ∆tDH ∆tDS ∆tDH ∆tDS ∆tDH ∆tDS ∆tDH ∆tDS ∆tDH

Slew

rate

V/ns

2.0755075507550 - - - - - - - - - -

1.55034503450345842 - - - - - - - -

1.0000000881616- - - - - -

0.9- - 0-40-48 416122420- - - -

0.8 - - - - 0 -10 8 -2 16 6 24 14 32 24 - -

0.7 - - - - - - 8 -8 16 0 24 8 32 18 40 34

0.6--------15-1023-23183924

0.5----------14-1622-63010

0.4------------7-2615-10

- 55 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

[ Table 55 ] Required time tVAC above VIH(AC) {blow VIL(AC)} for valid transition

Slew Rate[V/ns] tVAC[ps] DDR3-800/1066 (AC175) tVAC[ps] DDR3-800/1066/1333/1600 (AC150)

min max min max

>2.0 75 - 175 -

2.0 57 -170 -

1.5 50 - 167 -

1.0 38 -163 -

0.9 34 - 162 -

0.8 29 -161 -

0.7 22 - 159 -

0.6 13 -155 -

0.5 0 - 155 -

<0.5 0 -150 -

- 56 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

Figure 25. Illustration of nominal slew rate and tVAC for setup time tDS (for DQ with respect to strobe) and tIS

(for ADD/CMD with respect to clock).

VSS

tDS tDH

Setup Slew Rate

Rising Signal

Falling Signal

∆ TF ∆ TR

VREF(DC) - VIL(AC)max

∆ TF

=VIH(AC)min - VREF(DC)

∆ TR

VDDQ

VIH(AC) min

VIH(DC) min

VREF(DC)

VIL(DC) max

VIL(AC) max

nominal slew

rate

nominal

slew rate

VREF to ac

region

VREF to ac

region

tIS tIH

tDS tDH

tIS tIH

tVAC

NOTE :Clock and Strobe are drawn on a different time scale.

DQS

- 57 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

Figure 26. Illustration of nominal slew rate for hold time tDH (for DQ with respect to strobe) and tIH

(for ADD/CMD with respect to clock).

VSS

Hold Slew Rate

Falling Signal

Rising Signal

∆ TR ∆ TF

VREF(DC) - VIL(DC)max

∆ TR

=VIH(DC)min - VREF(DC)

∆ TF

VDDQ

VIH(AC) min

VIH(DC) min

VREF(DC)

VIL(DC) max

VIL(AC) max

nominal

slew rate

nominal

slew rate

dc to VREF

region

tIS tIH tIS tIH

dc to VREF

region

NOTE :Clock and Strobe are drawn on a different time scale.

tDS tDH tDS tDH

DQS

- 58 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

Figure 27. Illustration of tangent line for setup time tDS (for DQ with respect to strobe) and tIS

(for ADD/CMD with respect to clock)

VSS

Setup Slew Rate

Rising Signal

Falling Signal

∆ TF

∆ TR

tangent line[VREF(DC) - VIL(AC)max]

∆ TF

tangent line[VIH(AC)min - VREF(DC)]

∆ TR

VDDQ

VIH(AC) min

VIH(DC) min

VREF(DC)

VIL(DC) max

VIL(AC) max

tangent

VREF to ac

region

VREF to ac

region

line

nominal

line

nominal

line

tIS tIH tIS tIH

tVAC

NOTE :Clock and Strobe are drawn on a different time scale.

tDS tDH tDS tDH

DQS

tVAC

- 59 -

K4B2G0446C datasheet DDR3 SDRAM

Rev. 1.31

K4B2G0846C

Figure 28. Illustration of tangent line for hold time tDH (for DQ with respect to strobe) and tIH

(for ADD/CMD with respect to clock)

VSS

Hold Slew Rate

∆ TF

∆ TR

tangent line [ VIH(DC)min - VREF(DC) ]

∆ TF

VDDQ

VIH(AC) min

VIH(DC) min

VREF(DC)

VIL(DC) max

VIL(AC) max

tangent

dc to VREF

region

dc to VREF

region

line

nominal

line

nominal

line

Falling Signal

Hold Slew Rate tangent line [ VREF(DC) - VIL(DC)max ]

∆ TR

Rising Signal

tIS tIH tIS tIH

NOTE :Clock and Strobe are drawn on a different time scale.

tDS tDH tDS tDH

DQS