67-21S/NB3C-D6575B8L52936Z15/2T - EVERLIGHT ELECTRONICS

SMD  Middle Power LED

67-21S/NB3C-D6575B8L52936Z15/2T

Preliminary

Features

‧PLCC-2 package

Top view‧ Blue LED

‧Wide viewing angle

‧Pb-free

‧RoHS compliant

Description

The Everlight 67-21S package has high efficacy, middle power consumption, wide viewing angle and a compact form

factor. These features make this package an ideal LED for all lighting applications.

Applications

‧Decorative and Entertainment Lighting

‧Agriculture Lighting

‧General use

DATASHEET

SMD  Middle Power LED

67-21S/NB3C-D6575B8L52936Z15/2T

Device Selection Guide

Chip

Materials Emitted Color Resin Color

InGaN Blue Water Clear

Absolute Maxi mum Ratings (TSoldering=25℃)

Parameter Symbol Rating Unit

Forward Current IF 150 mA

Peak Forward Current (Duty 1/10 @10ms) IFP 300 mA

Power Dissipation Pd 540 mW

Operating Temperature Topr -40 ~ +85

℃

Storage Temperature Tstg -40 ~ +100

℃

Thermal Resistance (Junction / Soldering point) Rth J-S 50 ℃/W

Junction Temperature T j 125

℃

Soldering Temperature Tsol Reflow Soldering : 260 ℃ for 10 sec.

Hand Soldering : 350 ℃ for 3 sec.

Note:

The products are sensitive to static electricity and must be carefully taken when handling products

Electro-Optical Characteristics (TSoldering=25 )℃

Parameter Symbol Min. Typ. Max. Unit Condition

Luminous flux (1) Ø 9.0 ----- 15.0

lm IF=150mA

Forward Voltage(2) V

F 2.9 ----- 3.6

V IF=150mA

Viewing Angle 2θ1/2 ----- 120 -----

deg IF=150mA

Reverse Current IR ----- ----- 50

μA VR =5V

Notes:

1. Tolerance of Radiometric Luminous flux: ±11%.

2. Tolerance of Forward Voltage: ±0.1V.

DATASHEET

SMD  Middle Power LED

67-21S/NB3C-D6575B8L52936Z15/2T

Bin Range of Photometric

Bin Code Min. Max. Unit Condition

B8 9.0 9.5

lm IF=150mA

B9 9.5 10.0

L1 10.0 11.0

L2 11.0 12.0

L3 12.0 13.0

L4 13.0 14.0

L5 14.0 15.0

Notes:

Tolerance of Luminous flux: ±11%

Bin Range of Forward Voltage

Bin Code Min. Max. Unit Condition

36 2.9 3.0

V IF=150mA

37 3.0 3.1

38 3.1 3.2

39 3.2 3.3

40 3.3 3.4

41 3.4 3.5

42 3.5 3.6

Note:

Tolerance of Forward Voltage: ±0.1V.

Dominant Wa velength Bins

Bin Code Min. Max. Unit Condition

B54 465 470 nm IF=150mA

B55 470 475

Notes:

Dominant / Peak wavelength measurement tolerance: ±1nm.

DATASHEET

SMD  Middle Power LED

67-21S/NB3C-D6575B8L52936Z15/2T

Spectrum Distribution

360 400 440 480 520 560 600

0.0

0.2

0.4

0.6

0.8

1.0

Relative Luminous Intenstiy

Wavelength(nm)

Typical Electro-Optical Characteristics Curves

25 35 45 55 65 75 85 95 105 115 125

-0.30

-0.25

-0.20

-0.15

-0.10

-0.05

0.00

0.05

Forward Voltage Shift (V)

Tj - Junction Temperature (oC)

0 15 30 45 60 75 90 105 120 135 150

0.0

0.2

0.4

0.6

0.8

1.0

Relative Radiometric Power

Forward Current(mA)

Fig.1

–

Forward Voltage Shift vs.

Junction Temperature

Fig.2 - Relative Radiometric Power

vs. Forward Current

DATASHEET

SMD  Middle Power LED

67-21S/NB3C-D6575B8L52936Z15/2T

Typical Electro-Optical Characteristics Curves

25 35 45 55 65 75 85 95 105 115 125

0.0

0.2

0.4

0.6

0.8

1.0

1.2

Tj - Junction Temperature( oC )

Relative Luminous Flux

2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5

105

120

135

150

TS=25

IF-Forward Current(mA)

VF- Forward Voltage (V)

0 102030405060708090100

105

120

135

150

165

Forward Current (mA)

Soldering Temperature (oC)

0.7

0.8

0.9

1.0

0.10.30.5 0.2 0.4

80°

90°

0.6

50°

60°

70°

40°

20°0° 10°

30°

Fig.3 - Relative Luminous Intensit

vs.

Junction Temperature

Fig.4 - Forward Current vs. Forward

Voltage

Fig.5

–

Max. Driving Forward Current vs.

Soldering Temperature

Rth

-s=50。C/W

Fig.6 – Radiation Diagram

DATASHEET

SMD  Middle Power LED

67-21S/NB3C-D6575B8L52936Z15/2T

Package Dimension

Note:

Tolerance unless mentioned is ±0.15 mm; Unit = mm

DATASHEET

SMD  Middle Power LED

67-21S/NB3C-D6575B8L52936Z15/2T

Moisture Resistant Packing Materials

Label Explanation

‧CPN: Customer’s Product Number

‧P/N: Product Number

‧QTY: Packing Quantity

‧CAT: Luminous Intensity Rank

‧HUE: Dom. Wavelength Rank

‧REF: Forward Voltage Rank

‧LOT No: Lot Number

Reel Dimensions

Note:

Tolerances unless mentioned ±0.1mm. Unit = mm

DATASHEET

SMD  Middle Power LED

67-21S/NB3C-D6575B8L52936Z15/2T

Carrier Tape Dimensions: Loaded Quantity 4000 pcs. Per Reel

1.5+0.1

Progressive direction

Note:

Tolerance unless mentioned is ±0.1mm; Unit = mm

Moisture Resistant Packing Process

Label Aluminum moisture-proof bag Desiccant Label

DATASHEET

SMD  Middle Power LED

67-21S/NB3C-D6575B8L52936Z15/2T

Reliability Test Items and Conditions

The reliability of products shall be satisfied with items listed below.

Confidence level：90%

LTPD：10%

No. Items Test Condition Test Hours/Cycles Sample Size Ac/Re

1 Reflow Soldering

Temp. : 260℃/10sec. 6 Min. 22 PCS. 0/1

2 Thermal Shock

H : +100℃ 20min

∫ 10 sec

L : -10℃ 20min

200 Cycles 22 PCS. 0/1

3 Temperature Cycle

H : +100℃ 30min

∫ 5 min

L : -40℃ 30min

200 Cycles 22 PCS. 0/1

4 High Temperature/Humidity

Storage Ta=85℃,85%RH 1000 Hrs. 22 PCS. 0/1

5 High Temperature/Humidity

Operation

Ta=85℃,85%RH,

IF = 75mA 1000 Hrs. 22 PCS. 0/1

6 Low Temperature Storage Ta=-40℃ 1000 Hrs. 22 PCS. 0/1

7 High Temperature Storage Ta=85℃ 1000 Hrs. 22 PCS. 0/1

8 Low Temperature

Operation Life

Ta=-40℃,

IF = 150 mA 1000 Hrs. 22 PCS. 0/1

9 High Temperature

Operation/ Life#1

Ta=25℃,

IF = 150 mA 1000 Hrs. 22 PCS. 0/1

10 High Temperature

Operation/ Life#2

Ta=55℃,

IF =150mA 1000 Hrs. 22 PCS. 0/1

11 High Temperature

Operation/ Life#3

Ta=85℃,

IF = 75 mA 1000 Hrs. 22 PCS. 0/1

DATASHEET

SMD  Middle Power LED

67-21S/NB3C-D6575B8L52936Z15/2T

Precautions for Use

1. Over-current-proof

Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out will

happen).

2. Storage

2.1 Do not open moisture proof bag before the products are ready to use.

2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.

2.3 After opening the package: The LED's floor life is 168 Hrs under 30℃ or less and 60% RH or less. If unused LEDs

remain, it should be stored in moisture proof packages.

2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking

treatment should be performed using the following conditions.

Baking treatment: 60±5℃ for 24 hours.

3. Soldering Condition

3.1 Pb-free solder temperature profile 260 Max.

10sec. Max.

6 C/sec.Max.

Above255 C

30sec.Max.

Above 217

60~150 sec.

3 C/sec.Max.

Pre-heating

150~200 C

60~120sec.

3.2 Reflow soldering should not be done more than two times.

3.3 When soldering, do not put stress on the LEDs during heating.

3.4 After soldering, do not warp the circuit board.

4. Soldering Iron

Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the

soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful

because the damage of the product is often started at the time of the hand solder.

5. Repairing

Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering

iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or

will not be damaged by repairing.