CPC1130N Single-Pole, Normally Closed 4-Pin SOP OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 350 120 30 Units VP mArms / mADC Features * 1500Vrms Input/Output Isolation * Low Drive Power Requirements (TTL/CMOS Compatible) * No Moving Parts * High Reliability * Arc-Free With No Snubbing Circuits * No EMI/RFI Generation * Small 4-Pin SOP Package * Machine Insertable, Wave Solderable * Tape & Reel Version Available Description The CPC1130N is a miniature single-pole, normally closed (1-Form-B) solid state relay that uses optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. The efficient MOSFET switches and photovoltaic die use IXYS Integrated Circuits Division's patented OptoMOS(R) architecture while the optically coupled output is controlled by a highly efficient GaAIAs infrared LED. The CPC1130N offers board space savings of at least 20% when compared to competitive 4-pin SOP solid state relays. Approvals * UL 1577 Approved Component: File E76270 * CSA Certified Component: Certificate 1172007 * EN 60950 Certified Component: TUV Certificate B 10 05 49410 006 Applications * Telecommunications * Telecom Switching * Tip/Ring Circuits * Modem Switching (Laptop, Notebook, Pocket Size) * Hook Switch * Dial Pulsing * Ground Start * Ringing Injection * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment-Patient/Equipment Isolation * Security * Aerospace * Industrial Controls Ordering Information Part # CPC1130N CPC1130NTR Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel) Pin Configuration + Control - Control 1 4 Load 3 2 Load Switching Characteristics of Normally Closed Devices Form-B IF ILOAD 90% 10% toff Pb DS-CPC1130N-R07 ton e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC1130N Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation Total Power Dissipation 1 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Ratings 350 5 50 1 150 400 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms C C Derate linearly 3.33 mW / C Electrical Characteristics @ 25C Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 3 2 Conditions Symbol Min Typ Max Units t =10ms IL=120mA IF=2mA, VL=350VP IL ILPK RON ILEAK - 25 - 120 350 30 5 mArms / mADC mAP A VL=50V, f=1MHz ton toff COUT - 25 2 2 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.3 0.9 - 0.6 0.55 1.2 - 2 1.4 10 mA mA V A 1 - pF IF=5mA, VL=10V CI/O Load current derates linearly from 120mA @ 25oC to 80mA @ 85oC. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60C) a LED drive current of 4mA is recomended. www.ixysic.com ms pF R07 INTEGRATED CIRCUITS DIVISION CPC1130N PERFORMANCE DATA* Typical Turn-On Time (N=50, IF=5mA, IL=120mA, TA=25C) 25 15 10 5 Typical On-Resistance Distribution (N=50, IL=120mA, TA=25C) 35 30 20 Device Count (N) 20 Device Count (N) Device Count (N) 25 Typical Turn-Off Time (N=50, IF=5mA, IL=120mA, TA=25C) 15 10 5 25 20 15 10 5 0 0 0.23 0.24 0.25 Turn-On (ms) 0.26 0.27 0.50 Typical IF for Switch Operation (N=50, IL=120mA, TA=25C) 25 20 15 10 5 0.60 0.70 0.80 0.90 Turn-Off (ms) 1.00 0 1.10 23.5 Typical IF for Switch Dropout (N=50, IL=120mA, TA=25C) 25 Device Count (N) Device Count (N) 0.22 35 24 24.5 25 25.5 On-Resistance (:) 26 26.5 Typical Blocking Voltage Distribution (N=50, TA=25C) 30 20 Device Count (N) 0.21 15 10 5 25 20 15 10 5 0 0 0.55 0.60 0.65 LED Current (mA) 0.70 0.75 0.45 Typical LED Forward Voltage Drop (N=50, IF=5mA, TA=25C) 0.6 25 0.5 20 15 10 0.55 0.60 0.65 0.70 LED Current (mA) 0 0.75 395 0.4 0.3 0.2 0 0 1.17 1.19 1.21 1.23 0 1.25 5 10 15 20 25 30 35 40 400 405 410 415 420 425 Blocking Voltage (VP) 0.1 5 45 50 Typical Turn-Off vs. LED Forward Current (IL=120mA) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30 35 40 45 LED Forward Voltage Drop (V) LED Forward Current (mA) LED Forward Current (mA) Typical LED Forward Voltage Drop vs. Temperature Typical Turn-On vs. Temperature (IL=50mA) Typical Turn-Off vs. Temperature (IL=50mA) 1.6 1.4 IF=50mA IF=30mA IF=20mA IF=10mA IF=5mA 1.2 1.0 0.8 -40 -20 0 20 40 60 Temperature (C) 80 100 120 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 Turn-Off (ms) 1.8 Turn-On (ms) LED Forward Voltage Drop (V) 0.50 Typical Turn-On vs. LED Forward Current (IL=120mA) 0.7 30 Turn-On (ms) Device Count (N) 35 0.50 Turn-Off (ms) 0.45 IF=10mA IF=5mA -40 -20 0 20 40 60 Temperature (C) 80 100 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 50 IF=5mA IF=10mA -40 -20 0 20 40 60 80 100 Temperature (C) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R07 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1130N PERFORMANCE DATA* Typical IF for Switch Operation vs. Temperature (IL=50mA) On-Resistance (:) 2.0 1.5 1.0 0.5 35 100 30 25 20 15 -40 180 -20 0 20 40 60 80 100 Typical Load Current vs. Load Voltage (IF=5mA, TA=25C) 50 0 -50 -100 10 0 -40 -20 0 20 40 60 80 -150 100 -6 -4 -2 0 2 4 Temperature (C) Temperature (C) Load Voltage (V) Typical Load Current vs. Temperature (IF=0mA, IL=AC Peak) Typical Blocking Voltage vs. Temperature Typical Leakage vs. Temperature Measure Across Pins 3&4 (IF=5mA, VL=350V) Blocking Voltage (VP) 160 Load Current (mA) 150 140 120 100 80 60 40 425 0.016 420 0.014 415 410 405 400 20 395 0 390 -40 -20 0 20 40 60 80 Temperature (C) 100 Leakage (PA) LED Current (mA) 2.5 40 Load Current (mA) 3.0 Typical On-Resistance vs. Temperature (IF=5mA, IL=120mA) 0.012 0.010 0.008 0.006 0.004 0.002 -40 120 6 -20 0 20 40 60 80 100 Temperature (C) 0 -40 -20 0 20 40 60 Temperature (C) 80 100 Load Current (A) Energy Rating Curve 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10s 100s 1ms 10ms 100ms 1s 10s 100s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION CPC1130N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1130N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1130N 260C for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R07 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1130N MECHANICAL DIMENSIONS CPC1130N 4.089 0.203 (0.161 0.008) Recommended PCB Land Pattern 0.200 0.025 (0.008 0.001) 0.60 (0.0217) 6.096 0.102 (0.240 0.004) 3.810 0.076 (0.150 0.003) 0.432 0.127 (0.017 0.005) 5.60 (0.2205) 1.02 0.025 (0.040 0.001) Pin 1 2.54 Typ (0.100 Typ) 1.30 (0.0512) 2.184 Max (0.086 Max) 2.54 (0.10) Lead to package standoff: 0.0637 0.0383 (0.0025 0.0015) 0.762 0.102 (0.030 0.004) Dimensions mm (inches) 0.381 TYP. (0.015 TYP.) CPC1130NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) P=8.00 (0.315) A0=6.50 (0.256) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1130N-R07 (c)Copyright 2012, IXYS Integrated Circuits Division OptoMOS(R) is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/14/2012 6