MAX16011TAA+T - Hytronics - Datasheet.Directory

General Description

The MAX16010–MAX16014 is a family of ultra-small, low-

power, overvoltage protection circuits for high-voltage,

high-transient systems such as those found in automotive,

telecom, and industrial applications. These devices oper-

ate over a wide 5.5V to 72V supply voltage range, making

them also suitable for other applications such as battery

stacks, notebook computers, and servers.

The MAX16010 and MAX16011 offer two independent

comparators for monitoring both undervoltage and

overvoltage conditions. These comparators offer open-

drain outputs capable of handling voltages up to 72V.

The MAX16010 features complementary enable inputs

(EN/EN), while the MAX16011 features an active-high

enable input and a selectable active-high/low OUTB

output.

The MAX16012 offers a single comparator and an inde-

pendent reference output. The reference output can be

directly connected to either the inverting or noninverting

input to select the comparator output logic.

The MAX16013 and MAX16014 are overvoltage protec-

tion circuits that are capable of driving two p-channel

MOSFETs to prevent reverse-battery and overvoltage

conditions. One MOSFET (P1) eliminates the need for

external diodes, thus minimizing the input voltage drop.

The second MOSFET (P2) isolates the load or regulates

the output voltage during an overvoltage condition. The

MAX16014 keeps the MOSFET (P2) latched off until the

input power is cycled.

The MAX16010 and MAX16011 are available in small

8-pin TDFN packages, while the MAX16012/MAX16013/

MAX16014 are available in small 6-pin TDFN packages.

These devices are fully specified from -40°C to +125°C.

Applications

Automotive

Industrial

48V Telecom/Server/Networking

FireWire®

Notebook Computers

Multicell Battery-Stack Powered Equipment

Features

oWide 5.5V to 72V Supply Voltage Range

oOpen-Drain Outputs Up to 72V

(MAX16010/MAX16011/MAX16012)

oFast 2µs (max) Propagation Delay

oInternal Undervoltage Lockout

op-Channel MOSFET Latches Off After an

Overvoltage Condition (MAX16014)

oAdjustable Overvoltage Threshold

o-40°C to +125°C Operating Temperature Range

oSmall 3mm x 3mm TDFN Package

MAX16010–MAX16014

Ultra-Small, Overvoltage Protection/

Detection Circuits

________________________________________________________________

Maxim Integrated Products

Ordering Information

MAX16013

MAX16014

GATE1

SET

GATE2

VCC

GND

VBATT

2MΩ*

*OPTIONAL

Typical Operating Circuit

19-3693; Rev 4; 9/08

For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,

or visit Maxim’s website at www.maxim-ic.com.

Note: Replace the “_” with “A” for 0.5% hysteresis, “B” for 5%

hysteresis, and “C” for 7.5% hysteresis.

FireWire is a registered trademark of Apple, Inc.

Pin Configurations appear at end of data sheet.

PART* TEMP RANGE PIN-PACKAGE

MAX16010TA_-T -40°C to +125°C 8 TDFN-EP**

MAX16011TA_-T -40°C to +125°C 8 TDFN-EP**

MAX16012TT-T -40°C to +125°C 6 TDFN-EP**

MAX16013TT-T -40°C to +125°C 6 TDFN-EP**

MAX16014TT-T -40°C to +125°C 6 TDFN-EP**

Replace -T with +T for lead-free packages.

EP = Exposed pad.

MAX16010–MAX16014

Ultra-Small, Overvoltage Protection/

Detection Circuits

2 _______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VCC = 14V, TA= -40°C to +125°C, unless otherwise noted. Typical values are at TA= +25°C.) (Note 1)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

(All pins referenced to GND, unless otherwise noted.)

VCC .........................................................................-0.3V to +80V

EN, EN, LOGIC...........................................-0.3V to (VCC + 0.3V)

INA+, INB-, IN+, IN-, REF, SET ..............................-0.3V to +12V

OUTA, OUTB, OUT.................................................-0.3V to +80V

GATE1, GATE2 to VCC ...........................................-12V to +0.3V

GATE1, GATE2...........................................-0.3V to (VCC + 0.3V)

Current Sink/Source (all pins) .............................................50mA

Continuous Power Dissipation (TA= +70°C)

6-Pin TDFN (derate 18.2mW/°C above +70°C) .........1455mW

8-Pin TDFN (derate 18.2mW/°C above +70°C) .........1455mW

Operating Temperature Range .........................-40°C to +125°C

Maximum Junction Temperature .....................................+150°C

Storage Temperature Range .............................-60°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Supply Voltage Range VCC 5.5 72.0 V

VCC = 12V 20 30

Input Supply Current ICC No load VCC = 48V 25 40 µA

VCC Undervoltage Lockout VUVLO

VCC rising, part enabled, VINA+ = 2V, OUTA

deasserted (MAX16010/MAX16011),

VIN = 2V, VOUT deasserted (MAX16012),

VSET = 0V, GATE2 = VCLMP (MAX16013/

MAX16014)

4.75 5 5.25 V

VTH+ 1.215 1.245 1.265

0.5% hysteresis, MAX16010/MAX16011 1.21 1.223 1.26

5.0% hysteresis, MAX16010/MAX16011/

MAX16013/MAX16014 1.15 1.18 1.21

INA+/INB-/SET Threshold Voltage VTH-

7.5% hysteresis MAX16010/MAX16011 1.12 1.15 1.18

MAX16010TAA/MAX16011TAA 0.5

MAX16010TAB/MAX16011TAB/

MAX16013/MAX16014 5.0

Threshold-Voltage Hysteresis

MAX16010TAC/MAX16011TAC 7.5

SET/IN_ Input Current SET/IN_ = 2V -100 +100 nA

IN_ Operating Voltage Range 0 4 V

Startup Response Time tSTART VCC rising from 0 to 5.5V 100 µs

IN_ to OUT/SET to GATE2

Propagation Delay tPROP

IN_/SET rising from (VTH - 100mV) to

(VTH + 100mV) or falling from (VTH +

100mV) to (VTH - 100mV) (no load)

2µs

VCC ≥ 5.5V, ISINK = 3.2mA 0.4 V

OUT_ Output-Voltage Low VOL VCC ≥ 2.8V, ISINK = 100µA 0.4 V

OUT_ Leakage Current ILEAK OUT_ = 72V 500 nA

MAX16010–MAX16014

Ultra-Small, Overvoltage Protection/

Detection Circuits

_______________________________________________________________________________________ 3

ELECTRICAL CHARACTERISTICS (continued)

(VCC = 14V, TA= -40°C to +125°C, unless otherwise noted. Typical values are at TA= +25°C.) (Note 1)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

VIL 0.4

EN/EN, LOGIC Input Voltage VIH 1.4 V

EN/EN, LOGIC Input Current 12µA

EN/EN, LOGIC Pulse Width 10 µs

VCC to GATE_ Output Low

Voltage

IGATE_SINK = 75µA, IGATE_SOURCE = 1µA,

VCC = 14V 711V

VCC to GATE_ Clamp Voltage VCC = 24V 12 18 V

MAX16012

Reference Output Voltage VREF No load 1.275 1.3 1.320 V

Reference Short-Circuit Current ISHORT REF = GND 100 µA

Sourcing, 0 ≤ IREF ≤ 1µA 0.1

Reference Load Regulation Sinking, -1µA ≤ IREF ≤ 0 0.1 mV/µA

Input Offset Voltage VCM = 0 to 2V -12.5 +12.5 mV

Input Offset Current 3nA

Input Hysteresis 8mV

Common-Mode Voltage Range CMVR 0 2.0 V

Common-Mode Rejection Ratio CMRR DC 70 dB

Comparator Power-Supply

Rejection Ratio PSRR MAX16012, DC 70 dB

Note 1: 100% production tested at TA= +25°C and TA= +125°C. Specifications at TA= -40°C are guaranteed by design.

Typical Operating Characteristics

(VIN = 14V, TA = +25°C, unless otherwise noted.)

SUPPLY CURRENT

vs. SUPPLY VOLTAGE

MAX16010 toc01

SUPPLY VOLTAGE (V)

SUPPLY CURRENT (µA)

655545352515

575

MAX16013/MAX16014

SET = GND, EN = VCC

MAX16010/MAX16011

INA+ = INB- = GND

OUTPUTS ENABLED

MAX16012

IN+ = IN- = GND

SUPPLY CURRENT

vs. TEMPERATURE

MAX16010 toc02

TEMPERATURE (°C)

SUPPLY CURRENT (µA)

1109565 80-10 5 20 35 50-25

26.05

26.10

26.15

26.20

26.25

26.30

26.35

26.40

26.45

26.50

26.00

-40 125

MAX16013/MAX16014

SET = GND, EN = VCC

GATE VOLTAGE

vs. SUPPLY VOLTAGE

MAX16010 toc03

SUPPLY VOLTAGE (V)

GATE VOLTAGE (V)

655545352515

575

MAX16013/MAX16014

SET = GND, EN = VCC

VGATE

VCC - VGATE

MAX16010–MAX16014

Ultra-Small, Overvoltage Protection/

Detection Circuits

4 _______________________________________________________________________________________

Typical Operating Characteristics (continued)

(VIN = 14V, TA = +25°C, unless otherwise noted.)

UVLO THRESHOLD

vs. TEMPERATURE

MAX16010 toc04

TEMPERATURE (°C)

UVLO THRESHOLD (V)

1109565 80-10 520 35 50-25

4.6

4.7

4.8

4.9

5.0

5.1

5.2

5.3

5.4

5.5

4.5

-40 125

INA+/INB-/SET = GND

EN = VCC

RISING

FALLING

INA+/INB-/SET THRESHOLD

vs. TEMPERATURE

MAX16010 toc05

TEMPERATURE (°C)

INA+/INB-/SET THRESHOLD (V)

1109565 80-10 5 20 35 50-25

1.21

1.22

1.23

1.24

1.25

1.26

1.27

1.28

1.29

1.30

1.20

-40 125

INA+/INB-/SET RISING

EN = VCC

GATE VOLTAGE

vs. TEMPERATURE

MAX16010 toc06

TEMPERATURE (°C)

(VCC - VGATE) (V)

1109565 80-10 5 20 35 50-25

9.1

9.2

9.3

9.4

9.5

9.6

9.7

9.8

9.9

10.0

9.0

-40 125

MAX16013/MAX16014

SET = GND, EN = VCC

STARTUP WAVEFORM

(ROUT = 100Ω, CIN = 10µF, COUT = 10nF)

MAX16010 toc07

VGATE

5V/div

VOUT

10V/div

VCC

10V/div

200µs/div

STARTUP WAVEFORM

(ROUT = 100Ω, CIN = 10µF, COUT = 10nF)

MAX16010 toc08

VGATE

10V/div

VOUT

10V/div

VCC

1V/div

20µs/div

VEN = 0 TO 2V

OVERVOLTAGE SWITCH FAULT

(ROUT = 100Ω, CIN = 80µF, COUT = 10nF)

MAX16010 toc09

VGATE

20V/div

VOUT

20V/div

VCC

20V/div

1ms/div

VIN = 12V TO 40V, TRIP THRESHOLD = 28V

OVERVOLTAGE LIMIT

(ROUT = 100Ω, CIN = 80µF, COUT = 10nF)

MAX16010 toc10

VGATE

20V/div

VOUT

20V/div

VCC

20V/div

1ms/div

VIN = 12V TO 40V

TRIP THRESHOLD = 28V

MAX16010–MAX16014

Ultra-Small, Overvoltage Protection/

Detection Circuits

_______________________________________________________________________________________ 5

Pin Description

MAX16010

MAX16011

MAX16012

MAX16013

MAX16014

NAME FUNCTION

1111 V

CC Positive-Supply Input Voltage. Connect VCC to a 5.5V to 72V supply.

2 2 2 2 GND Ground

3——— EN Active-Low Enable Input. Drive EN low to turn on the voltage detectors. Drive EN high to force the

OUTA and OUTB outputs low. EN is internally pulled up to VCC. Connect EN to GND if not used.

4 4 — — OUTB

Open-Drain Monitor B Output. Connect a pullup resistor from OUTB to VCC. OUTB goes low when

INB- exceeds VTH+ and goes high when INB- drops below VTH- (with LOGIC connected to GND for

the MAX16011). Drive LOGIC high to reverse OUTB’s logic state. OUTB is usually used as an

overvoltage output. OUTB goes low (LOGIC = low) or high (LOGIC = high) when VCC drops below

the UVLO threshold voltage.

5 5 — — INB- Adjustable Voltage Monitor Threshold Input

66—5 EN

Active-High ENABLE Input. For the MAX16010/MAX16011, drive EN high to turn on the voltage

detectors. Drive EN low to force OUTA low and OUTB low (LOGIC = low) or high (LOGIC = high). For

the MAX16013/MAX16014, drive EN high to enhance the p-channel MOSFET (P2), and drive EN low

to turn off the MOSFET. EN is internally pulled down to GND. Connect EN to VCC if not used.

7 7 — — OUTA

Open-Drain Monitor A Output. Connect a pullup resistor from OUTA to VCC. OUTA goes low when

INA+ drops below VTH- and goes high when INA+ exceeds VTH+. OUTA is usually used as an

undervoltage output. OUTA also goes low when VCC drops below the UVLO threshold voltage.

8 8 — — INA+ Adjustable Voltage Monitor Threshold Input

— 3 — — LOGIC OUTB Logic-Select Input. Connect LOGIC to GND or VCC to configure the OUTB logic. See the

MAX16011 output logic table.

— — 3 — OUT Open-Drain Comparator Output. Connect a pullup resistor from OUT to VCC. OUT goes low when

IN+ drops below IN-. OUT goes high when IN+ exceeds IN-.

— — 4 — IN- Inverting Comparator Input

— — 5 — REF

Internal 1.30V Reference Output. Connect REF to IN+ for active-low output. Connect REF to IN- for

active-high output. REF can source and sink up to 1µA. Leave REF floating if not used. REF output is

stable with capacitive loads from 0 to 50pF.

— — 6 — IN+ Noninverting Comparator Input

— — — 3 GATE2

Gate-Driver Output. Connect GATE2 to the gate of an external p-channel MOSFET pass switch.

GATE2 is driven low to the higher of VCC - 10V or GND during normal operations and quickly shorted

to VCC during an overvoltage condition (SET above the internal threshold). GATE2 is shorted to VCC

when the supply voltage goes below the UVLO threshold voltage. GATE2 is shorted to VCC when EN

is low.

— — — 4 SET

Device Overvoltage Threshold Adjustment Input. Connect SET to an external resistive divider network

to adjust the desired overvoltage disable or overvoltage limit threshold (see the Typical Application

Circuit and Overvoltage Limiter section).

— — — 6 GATE1 Gate-Driver Output. Connect GATE1 to the gate of an external p-channel MOSFET to provide low

drop reverse voltage protection.

— — — — EP Exposed Pad. Connect EP to GND.

MAX16010–MAX16014

Detailed Description

The MAX16010–MAX16014 is a family of ultra-small, low-

power, overvoltage protection circuits for high-voltage,

high-transient systems such as those found in automo-

tive, telecom, and industrial applications. These devices

operate over a wide 5.5V to 72V supply voltage range,

making them also suitable for other applications such as

battery stacks, notebook computers, and servers.

The MAX16010 and MAX16011 offer two independent

comparators for monitoring both undervoltage and

overvoltage conditions. These comparators offer open-

drain outputs capable of handling voltages up to 72V.

The MAX16010 features complementary enable inputs

(EN/EN), while the MAX16011 features an active-high

enable input and a selectable active-high/low OUTB

output.

The MAX16012 offers a single comparator and an inde-

pendent reference output. The reference output can be

directly connected to either the inverting or noninvert-

ing input to select the comparator output logic.

The MAX16013 and MAX16014 are overvoltage protec-

tion circuits that are capable of driving two p-channel

MOSFETs to prevent reverse battery and overvoltage

conditions. One MOSFET (P1) eliminates the need for

external diodes, thus minimizing the input voltage drop.

While the second MOSFET (P2) isolates the load or reg-

ulates the output voltage during an overvoltage condi-

tion. The MAX16014 keeps the MOSFET (P2) latched

off until the input power is cycled.

Voltage Monitoring

The MAX16010/MAX16011 include undervoltage and

overvoltage comparators for window detection (see

Figure 1). OUT_ asserts high when the monitored volt-

age is within the selected “window.” OUTA asserts low

when the monitored voltage falls below the lower

(VTRIPLOW) limit of the window, or OUTB asserts low if

the monitored voltage exceeds the upper limit

(VTRIPHIGH). The application in Figure 1 shows OUT_

enabling the DC-DC converter when the monitored volt-

age is in the selected window.

The resistor values R1, R2, and R3 can be calculated

as follows:

where RTOTAL = R1 + R2 + R3.

Use the following steps to determine the values for R1,

R2, and R3.

1) Choose a value for RTOTAL, the sum of R1, R2, and

R3. Because the MAX16010/MAX16011 have very

high input impedance, RTOTAL can be up to 5MΩ.

2) Calculate R3 based on RTOTAL and the desired

upper trip point:

3) Calculate R2 based on RTOTAL, R3, and the desired

lower trip point:

4) Calculate R1 based on RTOTAL, R3, and R2:

R1 = RTOTAL - R2 - R3

The MAX16012 has both inputs of the comparator avail-

able with an integrated 1.30V reference (REF). When the

voltage at IN+ is greater than the voltage at IN- then OUT

goes high. When the voltage at IN- is greater than the

voltage at IN+ then OUT goes low. Connect REF to IN+

or IN- to set the reference voltage value. Use an external

resistive divider to set the monitored voltage threshold.

RVR

TH TOTAL

TRIPLOW

23 =×

−−

RVR

TH TOTAL

TRIPHIGH

=×

TRIPHIGH TH TOTAL

=⎛

⎝

⎜⎞

⎠

⎟

TRIPLOW TH TOTAL

⎛

⎝

⎜⎞

⎠

⎟

−23

Ultra-Small, Overvoltage Protection/

Detection Circuits

6 _______________________________________________________________________________________

MAX16010

DC-DC

REGULATOR

INA+

INB-

OUTB

OUTA

+48V

GND

VCC

Figure 1. MAX16010 Monitor Circuit

MAX16010–MAX16014

Ultra-Small, Overvoltage Protection/

Detection Circuits

_______________________________________________________________________________________ 7

The MAX16013/MAX16014 can be configured as an

overvoltage switch controller to turn on/off a load (see

the

Typical Application Circuit

). When the programmed

overvoltage threshold is tripped, the internal fast com-

parator turns off the external p-channel MOSFET (P2),

pulling GATE2 to VCC to disconnect the power source

from the load. When the monitored voltage goes below

the adjusted overvoltage threshold, the MAX16013

enhances GATE2, reconnecting the load to the power

source (toggle ENABLE on the MAX16014 to reconnect

the load). The MAX16013 can be configured as an

overvoltage limiter switch by connecting the resistive

divider to the load instead of VCC (Figure 3). See the

Overvoltage Limiter

section.

Supply Voltage

Connect a 5.5V to 72V supply to VCC for proper opera-

tion. For noisy environments, bypass VCC to GND with a

0.1µF or greater capacitor. When VCC falls below the

UVLO voltage the following states are present (Table 1).

Hysteresis

Hysteresis adds noise immunity to the voltage monitors

and prevents oscillation due to repeated triggering

when the monitored voltage is near the threshold trip

voltage. The hysteresis in a comparator creates two trip

points: one for the rising input voltage (VTH+) and one

for the falling input voltage (VTH-). These thresholds are

shown in Figure 4.

Enable Inputs (EN or

)

The MAX16011 offers an active-high enable input (EN),

while the MAX16010 offers both an active-high enable

input (EN) and active-low enable input (EN). For the

MAX16010, drive EN low or EN high to force the output

low. When the device is enabled (EN = high and EN =

low) the state of OUTA and OUTB depends on INA+

and INB- logic states.

MAX16012

IN+

REF

IN-

OUT

RPULLUP

GND

VBATT

VCC

OUT

Figure 2. Typical Operating Circuit for the MAX16012

MAX16013

GATE1

SET

GATE2

VCC

GND

P2P1

VBATT

Figure 3. Overvoltage Limiter Protection

Table 1. UVLO State (VCC < VUVLO)

PART OUTA OUTB OUT GATE2

MAX16010 Low Low — —

MAX16011 Low Low, LOGIC = low

High, LOGIC = high ——

MAX16012 — — Low —

MAX16013

MAX16014 — — — High

VIN+

VOUT

VTH+

VTH-

VCC

VHYST

tPROP tPROP tPROP

Figure 4. Input and Output Waveforms

MAX16010–MAX16014

For the MAX16011, drive EN low to force OUTA low,

OUTB low when LOGIC = low, and OUTB high when

LOGIC = high. When the device is enabled (EN = high)

the state of OUTA and OUTB depends on the INA+,

INB-, and LOGIC input (see Table 2).

For the MAX16013/MAX16014, drive EN low to pull

GATE2 to VCC, turning off the p-channel MOSFET (P2).

When the device is enabled (EN = high), GATE2 is

pulled to the greater of (VCC - 10V) or GND turning on

the external MOSFET (P2).

Applications Information

Load Dump

Most automotive applications are powered by a multi-

cell, 12V lead-acid battery with a voltage between 9V

and 16V (depending on load current, charging status,

temperature, battery age, etc.). The battery voltage is

distributed throughout the automobile and is locally

regulated down to voltages required by the different

system modules. Load dump occurs when the alterna-

tor is charging the battery and the battery becomes

disconnected. Power in the alternator inductance flows

into the distributed power system and elevates the volt-

age seen at each module. The voltage spikes have rise

times typically greater than 5ms and decays within sev-

eral hundred milliseconds but can extend out to 1s or

more depending on the characteristics of the charging

system. These transients are capable of destroying

sensitive electronic equipment on the first fault event.

The MAX16013/MAX16014 provide the ability to dis-

connect the load from the charging system during an

overvoltage condition to protect the module. In addi-

tion, the MAX16013 can be configured in a voltage-lim-

iting mode. This allows continuous operation while

providing overvoltage protection. See the

Overvoltage

Limiter

section.

Input Transients Clamping

When the external MOSFET is turned off during an

overvoltage occurrence, stray inductance in the power

path may cause voltage ringing to exceed the

MAX16013/MAX16014 absolute maximum input (VCC)

supply rating. The following techniques are recom-

mended to reduce the effect of transients:

• Minimize stray inductance in the power path using

wide traces, and minimize loop area including the

power traces and the return ground path.

• Add a zener diode or transient voltage suppresser

(TVS) rated below VCC absolute maximum rating

(Figure 3).

Overvoltage Limiter

When operating in overvoltage-limiter mode, the

MAX16013 drives the external p-channel MOSFET (P2),

resulting in the external MOSFET operating as a voltage

regulator.

During normal operation, GATE2 is pulled to the greater

of (VCC - 10V) or GND. The external MOSFET’s drain

voltage is monitored through a resistor-divider between

the P2 output and SET. When the output voltage rises

above the adjusted overvoltage threshold, an internal

comparator pulls GATE2 to VCC. When the monitored

voltage goes below the overvoltage threshold, the

p-channel MOSFET (P2) is turned on again. This

process continues to keep the voltage at the output reg-

ulated to within approximately a 5% window. The output

voltage is regulated during the overvoltage transients

and the MOSFET (P2) continues to conduct during the

overvoltage event, operating in switched-linear mode.

Caution must be exercised when operating the

MAX16013 in voltage-limiting mode for long durations

due to the MOSFET’s power dissipation consideration

(see the

MOSFET Selection and Operation

section).

MOSFET Selection and Operation

(MAX16013 and MAX16014)

Most battery-powered applications must include reverse

voltage protection. Many times this is implemented with a

diode in series with the battery. The disadvantage in

using a diode is the forward voltage drop of the diode,

which reduces the operating voltage available to down-

stream circuits (VLOAD = VBATTERY - VDIODE). The

MAX16013 and MAX16014 include high-voltage GATE1

drive circuitry allowing users to replace the high-voltage-

drop series diode with a low-voltage-drop MOSFET

device (as shown in the

Typical Operating Circuit

and

Figure 3). The forward voltage drop is reduced to ILOAD

x RDS-ON of P1. With a suitably chosen MOSFET, the

voltage drop can be reduced to millivolts.

Ultra-Small, Overvoltage Protection/

Detection Circuits

8 _______________________________________________________________________________________

Table 2. MAX16011 Output Logic

LOGIC INA+ INB- OUTA OUTB

Low > VTH+ > VTH+ High

Impedance Low

Low < VTH- < VTH- Low High

Impedance

High > VTH+ > VTH+ High

Impedance

High

Impedance

High < VTH- < VTH- Low Low

In normal operating mode, internal GATE1 output cir-

cuitry enhances P1 to a 10V gate-to-source (VGS) for

11V < VCC < 72V. The constant 10V enhancement

ensures P1 operates in a low RDS-ON mode, but the

gate-source junction is not overstressed during high-

battery-voltage application or transients (many MOSFET

devices specify a ±20V VGS absolute maximum). As

VCC drops below 10V GATE1 is limited to GND, reduc-

ing P1 VGS to VCC - GND. In normal operation the P1

power dissipation is very low:

P1 = ILOAD2x RDS-ON

During reverse-battery applications, GATE1 is limited to

GND and the P1 gate-source junction is reverse

biased. P1 is turned off and neither the MAX16013/

MAX16014 nor the load circuitry is exposed to the

reverse-battery voltage. Care should be taken to place

P1 (and its internal drain-to-source diode) in the correct

orientation for proper reverse battery operation.

P2 protects the load from input overvoltage conditions.

During normal operating modes (the monitored voltage

is below the adjusted overvoltage threshold), internal

GATE2 output circuitry enhances P2 to a 10V gate-to-

source (VGS) for 11V < VCC < 72V. The constant 10V

enhancement ensures P2 operates in a low RDS-ON

mode but the gate-to-source junction is not over-

stressed during high-battery-voltage applications

(many pFET devices specify a ±20V VGS absolute max-

imum). As VCC drops below 10V, GATE2 is limited to

GND, reducing P2 VGS to VCC - GND. In normal opera-

tion, the P2 power dissipation is very low:

P2 = ILOAD2x RDS-ON

During overvoltage conditions, P2 is either turned com-

pletely off (overvoltage-switch mode) or cycled off-on-

off (voltage-limiter mode). Care should be taken to

place P2 (and its internal drain-to-source diode) in the

correct orientation for proper overvoltage protection

operation. During voltage-limiter mode, the drain of P2

is limited to the adjusted overvoltage threshold, while

the battery (VCC) voltage rises. During prolonged over-

voltage events, P2 temperature can increase rapidly

due to the high power dissipation. The power dissipat-

ed by P2 is:

P2 = VDS-P2 x ILOAD

= (VCC - VOV-ADJUSTED) x ILOAD

where VCC ~ VBATTERY and VOV-ADJUSTED is the desired

load limit voltage. For prolonged overvoltage events with

high P2 power dissipation, proper heatsinking is required.

Adding External Pullup Resistors

It may be necessary to add an external resistor from

VCC to GATE1 to provide enough additional pullup

capability when the GATE1 input goes high. The

GATE_ output can only source up to 1µA current. If the

source current is less than 1µA, no external resistor

may be necessary. However, to improve the pullup

capability of the GATE_ output when it goes high, con-

nect an external resistor between VCC and the GATE_.

The application shows a 2MΩresistor, which is large

enough not to impact the sinking capability of the

GATE_ (during normal operation) while providing

enough pullup during an overvoltage event. With an

11V (worst case) VCC-to-gate clamp voltage and a

sinking current of 75µA, the smallest resistor should be

11V/75µA, or about 147kΩ. However, since the GATE_

is typically low most of the time, a higher value should

be used to reduce overall power consumption.

MAX16010–MAX16014

Ultra-Small, Overvoltage Protection/

Detection Circuits

_______________________________________________________________________________________ 9

MAX16010–MAX16014

Ultra-Small, Overvoltage Protection/

Detection Circuits

10 ______________________________________________________________________________________

Functional Diagrams

MAX16010

HYST

REGULATOR

ENABLE CIRCUITRY

1.23V

~4V

INA+

INB-

OUTA

OUTB

GND EN

VCC

Figure 5. MAX16010 Functional Diagram

MAX16011

HYST

REGULATOR

ENABLE

CIRCUITRY

OUTB

LOGIC

1.23V

~4V

INA+

INB-

OUTA

OUTB

GND EN

LOGIC

VCC

Figure 6. MAX16011 Functional Diagram

MAX16012

REGULATOR

1.30V

~4V

IN- OUT

GND

VCC

IN+

REF

Figure 7. MAX16012 Functional Diagram

MAX16013

MAX16014

HYST

ENABLE

CIRCUITRY

LATCH

CLEAR

1.23V

SET

GND EN

VCC

GATE1

GATE2

Figure 8. MAX16013/MAX16014 Functional Diagram

MAX16010–MAX16014

Ultra-Small, Overvoltage Protection/

Detection Circuits

______________________________________________________________________________________ 11

Chip Information

PROCESS: BiCMOS

8765

1234

INA+ OUTA EN INB-

VCC GND EN OUTB

TOP VIEW

MAX16010

TDFN (3mm x 3mm)

8765

1234

INA+ OUTA EN INB-

VCC GND LOGIC OUTB

MAX16011

TDFN (3mm x 3mm)

IN+

REF

IN-

VCC

GND

OUT

MAX16012

TDFN (3mm x 3mm)

GATE1

SET

VCC

GND

GATE2

MAX16013

MAX16014

TDFN (3mm x 3mm)

Pin Configurations

Package Information

For the latest package outline information and land patterns, go

to www.maxim-ic.com/packages.

PACKAGE TYPE PACKAGE CODE DOCUMENT NO.

6 TDFN T633-2 21-0137

8 TDFN T833-2 21-0137

MAX16010–MAX16014

Ultra-Small, Overvoltage Protection/

Detection Circuits

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are

implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600

Revision History

REVISION

NUMBER

REVISION

DATE DESCRIPTION PAGES

CHANGED

0 6/05 Initial release —

1 12/05 Removed future product designation for MAX16010/MAX16011 1, 12

2 1/07 Edited Figure 7 1, 10, 12

3 12/07 Fixed text in Voltage Monitoring section and updated Package Outline 6, 12

4 9/08 Revised Figures 6 and 8. 10