_______________General Description
The MAX4565/MAX4566/MAX4567 are low-voltage
T-switches designed for switching RF and video signals
from DC to 350MHz in 50Ωand 75Ωsystems. The
MAX4565 contains four normally open single-pole/single-
throw (SPST) switches. The MAX4566 contains two dual
SPST switches (one normally open, one normally closed.)
The MAX4567 contains two single-pole/double-throw
(SPDT) switches.
Each switch is constructed in a “T” configuration, ensuring
excellent high-frequency off isolation and crosstalk of
-83dB at 10MHz. They can handle Rail-to-Rail®analog sig-
nals in either direction. On-resistance (60Ωmax) is
matched between switches to 2.5Ωmax and is flat (2Ω
max) over the specified signal range, using ±5V supplies.
The off leakage current is less than 5nA at +25°C and
50nA at +85°C.
These CMOS switches can operate with dual power sup-
plies ranging from ±2.7V to ±6V or a single supply
between +2.7V and +12V. All digital inputs have 0.8V/2.4V
logic thresholds, ensuring both TTL- and CMOS-logic com-
patibility when using ±5V or a single +5V supply.
________________________Applications
RF Switching
Video Signal Routing
High-Speed Data Acquisition
Test Equipment
ATE Equipment
Networking
____________________________Features
♦High 50ΩOff Isolation: -83dB at 10MHz
♦Low 50ΩCrosstalk: -87dB at 10MHz
♦DC to 350MHz -3dB Signal Bandwidth
♦60ΩSignal Paths with ±5V Supplies
♦2.5ΩSignal-Path Matching with ±5V Supplies
♦2ΩSignal-Path Flatness with ±5V Supplies
♦Low 50ΩInsertion Loss: 2.5dB at 100MHz
♦±2.7V to ±6V Dual Supplies
+2.7V to +12V Single Supply
♦Low Power Consumption: <1µW
♦Rail-to-Rail Bidirectional Signal Handling
♦Pin Compatible with Industry-Standard DG540,
DG542, DG643
♦>2kV ESD Protection per Method 3015.7
♦TTL/CMOS-Compatible Inputs
with Single +5V or ±5V
MAX4565/MAX4566/MAX4567
Quad/Dual, Low-Voltage,
Bidirectional RF/Video Switches
________________________________________________________________
Maxim Integrated Products
1
TOP VIEW
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
MAX4566
DIP/SO/QSOP
IN2
COM2
GND2
NO2
V+
NC3
GND3
COM3
N01
GND1
COM1
IN1
COM4
GND4
NC4
V-
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
IN2
COM2
GND2
NO2N01
GND1
COM1
IN1
V+
GND6
N03
GND3GND4
N04
GND5
V-
12
11
9
10
COM3
IN3IN4
COM4
MAX4565
DIP/SO/SSOP
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
MAX4567
DIP/SO/QSOP
N02
V+
GND2
COM2
GND3
V-
NC2
IN2
GND1
V-
N01
IN1
NC1
V+
GND4
COM1
MAX4565
SWITCHES SHOWN
FOR LOGIC “0” INPUT
LOGIC SWITCH
0
1OFF
ON
MAX4567
LOGIC NO-COM
0
1OFF
ON
NC-COM
ON
OFF
MAX4566
LOGIC 1, 2
0
1OFF
ON
3, 4
ON
OFF
_____________________Pin Configurations/Functional Diagrams/Truth Tables
19-1252; Rev 0; 7/97
______________Ordering Information
Ordering Information continued at end of data sheet.
Rail-to-Rail is a registered trademark of Nippon Motorola Ltd.
PART
MAX4565CPP
MAX4565CWP 0°C to +70°C
0°C to +70°C
TEMP. RANGE PIN-PACKAGE
20 Plastic DIP
20 Wide SO
For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800.
For small orders, phone 408-737-7600 ext. 3468.
MAX4565/MAX4566/MAX4567
Quad/Dual, Low-Voltage,
Bidirectional RF/Video Switches
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS—Dual Supplies
(V+ = +4.5V to +5.5V, V- = -4.5V to -5.5V, VINL = 0.8V, VINH = 2.4V, VGND_ = 0V, TA= TMIN to TMAX, unless otherwise noted. Typical
values are at TA= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(Voltages Referenced to GND)
V+...........................................................................-0.3V, +13.0V
V-............................................................................-13.0V, +0.3V
V+ to V-...................................................................-0.3V, +13.0V
All Other Pins (Note 1)..........................(V- - 0.3V) to (V+ + 0.3V)
Continuous Current into Any Terminal..............................±25mA
Peak Current into Any Terminal
(pulsed at 1ms, 10% duty cycle)..................................±50mA
ESD per Method 3015.7 ..................................................>2000V
Continuous Power Dissipation (TA= +70°C) (Note 2)
16-Pin Plastic DIP
(derate 10.53mW/°C above +70°C)..........................842mW
16-Pin Narrow SO
(derate 8.70mW/°C above +70°C)............................696mW
16-Pin QSOP (derate 8.3mW/°C above +70°C).......... 667mW
20-Pin Plastic DIP (derate 8.0mW/°C above +70°C) ...640mW
20-Pin Wide SO (derate 10.00mW/°C above +70°C) .. 800mW
20-Pin SSOP (derate 8.0mW/°C above +70°C) .......... 640mW
Operating Temperature Ranges
MAX456_C_ E.....................................................0°C to +70°C
MAX456_E_ E ..................................................-40°C to +85°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10sec).............................+300°C
Note 1: Voltages on all other pins exceeding V+ or V- are clamped by internal diodes. Limit forward diode current to maximum cur-
rent rating.
V+ = 4.5V, V- = -4.5V,
VCOM_ = ±2V, ICOM_ = 10mA
(Note 3)
V+ = 5.5V, V- = -5.5V,
VCOM_ = ±4.5V
V+ = 4.5V, V- = -4.5V,
VCOM_ = ±2V, ICOM_ = 10mA
V+ = 5V; V- = -5V; VCOM_ = 1V,
0V, -1V; ICOM = 10mA
V+ = 5.5V, V- = -5.5V,
VCOM_ = ±4.5V, VN_ = 4.5V
V+ = 5.5V, V- = -5.5V,
VCOM_ = ±4.5V, VN_ = 4.5V
VIN_ = 0.8V or 2.4V
CONDITIONS
µA-1 0.03 1IINH_, IINL_
IN_ Input Current Logic High or
Low
Ω
46 60
RON
Signal-Path On-Resistance
VV- V+
VCOM_,
VNO_,VNC_
Analog Signal Range
V0.8 1.5VIN_L
IN_ Input Logic Threshold Low V1.5 2.4VIN_H
IN_ Input Logic Threshold High
nA
-2 0.04 2
ICOM_(ON)
COM_ On Leakage Current
(Note 6)
Ω
1 2.5
∆RON
Signal-Path On-Resistance Match
Between Channels (Note 4)
Ω0.3 2RFLAT(ON)
Signal-Path On-Resistance
Flatness (Note 5)
nA
-1 0.02 1
INO_(OFF),
INC_(OFF)
NO_, NC_ Off Leakage Current
(Note 6)
nA
-1 0.02 1
ICOM_(OFF)
COM_ Off Leakage Current
(Note 6)
UNITS
MIN TYP MAX
(Note 2)
SYMBOLPARAMETER
+25°C
C, E
C, E
C, E
+25°C
+25°C
+25°C
+25°C
+25°C
C, E
TA
C, E
C, E
C, E -10 10
-10 10
-20 20
C, E
C, E 3
80
ANALOG SWITCH
LOGIC INPUT
±
±
MAX4565
MAX4565/MAX4566/MAX4567
Quad/Dual, Low-Voltage,
Bidirectional RF/Video Switches
_______________________________________________________________________________________ 3
VIN = 5Vp-p, f < 20kHz,
600Ωin and out
Figure 6, RL= 50Ω
VNO_ = GND, f = 1MHz, Figure 7
CL= 1.0nF, VNO_ = 0V, RS= 0Ω,
Figure 5
VCOM_ = ±3V, V+ = 5V, V- = -5V,
Figure 4
VCOM_ = ±3V, V+ = 5V, V- = -5V,
Figure 3
VCOM_ = ±3V, V+ = 5V, V- = -5V,
Figure 3
CONDITIONS
%0.02THD+NDistortion
MHz350BW-3dB Bandwidth (Note 9)
-83
6
COM_ Off Capacitance
pF2.5CN_(OFF)
NO_, NC_ Off Capacitance
pC25 60Q
Charge Injection
(Note 3)
ns5 30tBBM
Break-Before-Make Time Delay
(MAX4566/MAX4567 only)
ns
30 100
tOFF
Turn-Off Time
ns
75 150
tON
Turn-On Time
UNITS
MIN TYP MAX
(Note 2)
SYMBOLPARAMETER
V- = -5.5V
V+ = 5.5V, all VIN_ = 0V or V+
µA
-1 0.05 1
I-V - Supply Current
µA
-1 0.05 1
I+V+ Supply Current
V-6 +6V+, V-Power-Supply Range
+25°C
+25°C
+25°C
+25°C
+25°C
+25°C
+25°C
TA
+25°C
+25°C
C, E
2.5
VCOM_ = 0V,
f = 1MHz,
Figure 7 pFCCOM_(OFF) +25°C
6
VCOM_ = VNO_ = 0V,
f = 1MHz, Figure 7 pF
7
CCOM_(ON)
COM_ On Capacitance +25°C
-82
RL= 50Ω,
VCOM_ = 1VRMS,
f = 10MHz, Figure 6 dB
-83
VISO
Off Isolation (Note 7) +25°C
MAX4565
MAX4566
MAX4567
MAX4565
MAX4566
MAX4567
C, E -10 10
C, E -10 10
C, E 120
C, E 200
ELECTRICAL CHARACTERISTICS—Dual Supplies (continued)
(V+ = +4.5V to +5.5V, V- = -4.5V to -5.5V, VINL = 0.8V, VINH = 2.4V, VGND_ = 0V, TA= TMIN to TMAX, unless otherwise noted. Typical
values are at TA= +25°C.)
MAX4565,
MAX4566
-92MAX4565
MAX4566
MAX4567 -85
RL= 50Ω, VCOM_ =
1VRMS, f = 10MHz,
Figure 6 dB
-87
VCT
Channel-to-Channel Crosstalk
(Note 8) +25°C
SWITCH DYNAMIC CHARACTERISTICS
POWER SUPPLY
MAX4567
MAX4565/MAX4566/MAX4567
Quad/Dual, Low-Voltage,
Bidirectional RF/Video Switches
4 _______________________________________________________________________________________
RL= 50Ω, Figure 6
CL= 1.0nF, VNO = 2.5V,
RS= 0Ω, Figure 5
VCOM_ = 3V, V+ = 5V,
Figure 4
V+ = 4.5V, VCOM_ = 3.5V,
ICOM_ = 1mA
VCOM_ = 3V, V+ = 5V,
Figure 3
(Note 3)
VCOM_ = 3V, V+ = 5V,
Figure 3
VIN_ = 0.8V or 2.4V
V+ = 5.5V; VCOM_ = 1V, 4.5V
V+ = 5.5V, VCOM_ = 1V,
VN_ = 4.5V
V+ = 4.5V, VCOM_ = 3.5V,
ICOM_ = 1mA
V+ = 5.5V, VCOM_ = 1V,
VN_ = 4.5V
CONDITIONS
320BW-3dB Bandwidth (Note 9)
pC7 25QCharge Injection
ns10 90tBBM
Break-Before-Make Time Delay
(MAX4566/MAX4567 only)
ns
150
30 120
tOFF
Turn-Off Time
ns
250
130 200
tON
Turn-On Time
µA-1 0.001 1IINH_, IINL_
IN_ Input Current Logic High or
Low
V0.8 1.5VIN_L
IN_ Input Logic Threshold Low V1.5 2.4VIN_H
IN_ Input Logic Threshold High
nA
-20 20
68 120
RON
Signal-Path On-Resistance
V0 V+
VCOM_,
VNO_, VNC_
Analog Signal Range
-2 2
ICOM_(ON)
COM_ On Leakage Current
(Notes 6, 10)
nA
-10 10
-1 1
ICOM_(OFF)
COM_ Off Leakage Current
(Notes 6, 10)
nA
-10 10
Ω
150
2 5
∆RON
Signal-Path On-Resistance
Match Ω
6
-1 1
INO_(OFF),
INC_(OFF)
NO_, NC_ Off Leakage Current
(Notes 6, 10)
UNITS
MIN TYP MAX
(Note 2)
SYMBOLPARAMETER
MHz+25°C
+25°C
+25°C
+25°C
C, E
+25°C
+25°C
C, E
+25°C
C, E
+25°C
C, E
C, E
C, E
+25°C
C, E
C, E
+25°C
C, E
+25°C
C, E
TA
ELECTRICAL CHARACTERISTICS—Single +5V Supply
(V+ = +4.5V to +5.5V, V- = 0V, VINL = 0.8V, VINH = 2.4V, VGND_ = 0V, TA= TMIN to TMAX, unless otherwise noted. Typical values are
at TA= +25°C.)
V+ = 5.5V, all VIN_ = 0V or V+ -1 0.05 1
I+V+ Supply Current µA
-10 10
+25°C
C, E
RL= 50Ω, f = 10MHz,
VCOM_ = 1VRMS,
Figure 6 dB-81VISO
Off-Isolation
(Note 7) +25°C
RL= 50Ω, f = 10MHz,
VCOM_ = 1VRMS,
Figure 6 dB-86VCT
Channel-to-Channel Crosstalk
(Note 8) +25°C
ANALOG SWITCH
LOGIC INPUT
SWITCH DYNAMIC CHARACTERISTICS
POWER SUPPLY
V+ Supply Current
MAX4565/MAX4566/MAX4567
Quad/Dual, Low-Voltage,
Bidirectional RF/Video Switches
_______________________________________________________________________________________ 5
ELECTRICAL CHARACTERISTICS—Single +3V Supply
(V+ = +2.7V to +3.6V, V- = 0V, VINL = 0.8V, VINH = 2.4V, VGND_ = 0V, TA= TMIN to TMAX, unless otherwise noted. Typical values are
at TA= +25°C.)
V+ = 2.7V, VCOM_ = 1V,
ICOM_ = 1mA
(Note 3)
V+ = 3.6V, all VIN_ = 0V or V+
VCOM_ = 1.5V, V+ = 2.7V,
Figure 3 (Note 3)
VCOM_ = 1.5V, V+ = 2.7V,
Figure 4 (Note 3)
VIN_ = 0.8V or 2.4V (Note 3)
(Note 3)
(Note 3)
VCOM_ = 1.5V, V+ = 2.7V,
Figure 3 (Note 3)
CONDITIONS
µA
-1 0.05 1
I+V+ Supply Current
ns10 120tBBM
Break-Before-Make Time Delay
(MAX4566/MAX4567 only)
ns
120
40 100
tOFF
Turn-Off Time
150 350
RON
Signal-Path On-Resistance
V0 V+
VCOM_,
VNO_, VNC_
Analog Signal Range
ns
600
270 500
tON
Turn-On Time
µA-1 1IINH_, IINL_
IN_ Input Current Logic High or
Low
Ω
450
V1.0 2.4VIN_H
IN_ Input Logic Threshold High V0.8 1.0VIN_L
IN_ Input Logic Threshold Low
UNITS
MIN TYP MAX
(Note 2)
SYMBOLPARAMETER
+25°C
+25°C
+25°C
C, E
+25°C
+25°C
C, E
C, E
C, E
C, E
C, E
+25°C
TA
-10 10C, E
ANALOG SWITCH
LOGIC INPUT
SWITCH DYNAMIC CHARACTERISTICS (Note 3)
POWER SUPPLY
Note 2: The algebraic convention is used in this data sheet; the most negative value is shown in the minimum column.
Note 3: Guaranteed by design.
Note 4: ∆RON = ∆RON(MAX) - ∆RON(MIN).
Note 5: Resistance flatness is defined as the difference between the maximum and the minimum value of on-resistance as mea-
sured over the specified analog signal range.
Note 6: Leakage parameters are 100% tested at the maximum rated hot temperature and guaranteed by correlation at +25°C.
Note 7: Off isolation = 20log10 [VCOM / (VNC or VNO)], VCOM = output, VNC or VNO = input to off switch.
Note 8: Between any two switches.
Note 9: -3dB bandwidth is measured relative to 100kHz.
Note 10: Leakage testing for single-supply operation is guaranteed by testing with dual supplies.
MAX4565/MAX4566/MAX4567
Quad/Dual, Low-Voltage,
Bidirectional RF/Video Switches
6 _______________________________________________________________________________________
__________________________________________Typical Operating Characteristics
(V+ = +5V, V- = -5V, TA= +25°C, GND = 0V, packages are surface mount, unless otherwise noted.)
1000
10 -5 -3-4 0 1 2 3 4-1-2 5
ON RESISTANCE vs. VCOM
(DUAL SUPPLIES)
MAX4565TOC01
VCOM (V)
RON (Ω)
100
V+ = 1.2V,
V- = -1.2V
V+ = 5V,
V- = -5V V+ = 3.3V,
V- = -3.3V
V+ = 2V,
V- = -2V
V+ = 2.7V,
V- = -2.7V
5
25
35
15
45
55
65
-5 -3 -2-4 -1 0 1 2 3 4 5
ON-RESISTANCE vs. VCOM
AND TEMPERATURE
(DUAL SUPPLIES)
MAX4565 TOC03
VCOM (V)
RON (Ω)
TA = -40°C
TA = +85°C
TA = 0°C
TA = +25°C
TA = +125°C
1000
10 0 21 5 6 7 8 943 10
ON RESISTANCE vs. VCOM
(SINGLE SUPPLY)
MAX4565TOC02
VCOM (V)
RON (Ω)
100
V+ = 10V
V+ = 5V
V+ = 7.5V
V+ = 3.3V
V+ = 2.7V
V+ = 2V
V- = 0V
10
30
50
70
110
90
130
0 1.0 1.50.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
ON-RESISTANCE vs. VCOM
AND TEMPERATURE
(SINGLE SUPPLY)
MAX4565 TOC04
VCOM (V)
RON (Ω)
TA = 0°C
TA = +25°C
TA = +125°C
TA = -55°C
TA = +85°C
0
50
100
150
200
250
±2 ±3 ±4 ±5 ±6 ±8
ON/OFF TIME vs.
SUPPLY VOLTAGE
MAX4565 TOC07
V+, V- (V)
tON, tOFF (ns)
tON
tOFF
0.0001
0.001
0.01
0.1
1
10
-75 -50 -25 0 25 7550 100 125
ON/OFF-LEAKAGE CURRENT vs.
TEMPERATURE
MAX4565 TOC05
TEMPERATURE (°C)
LEAKAGE (nA)
ON LEAKAGE
OFF LEAKAGE
-10
10
20
0
30
50
40
60
-5 -3 -2-4 -1 0 1 2 3 4 5
CHARGE INJECTION vs. VCOM
MAX4565 TOC06
VCOM (V)
Qj (pC)
DUAL
SUPPLIES
SINGLE
SUPPLY
10
30
50
70
90
110
20
40
60
80
100
-75 -25 0 75 125-50 25 50 100
ON/OFF TIME vs.
TEMPERATURE
MAX4565 TOC08
TEMPERATURE (°C)
tON, tOFF (ns)
tON
tOFF
tON
tOFF
0.00001
0.0001
0.001
I-
I+
0.01
0.1
1
-75 -25 0 75 125-50 25 50 100
POWER-SUPPLY CURRENT
vs. TEMPERATURE
MAX4565 TOC09
TEMPERATURE (°C)
I+, I- (µA)
MAX4565/MAX4566/MAX4567
Quad/Dual, Low-Voltage,
Bidirectional RF/Video Switches
_______________________________________________________________________________________
7
0
1.0
0.5
2.0
1.5
2.5
3.0
0 4 62 8 10 12
LOGIC-LEVEL THRESHOLD VOLTAGE vs.
V+ SUPPLY VOLTAGE
MAX4565TOC10
V+ (V)
LOGIC-LEVEL THRESHOLD (V)
0
-120
-100
-110
0.1 1 10 100 1000
MAX4566
FREQUENCY RESPONSE
-60
-70
-80
-90
-30
-40
-50
-20
-10
MAX4565 TOC12
FREQUENCY (MHz)
LOSS (dB)
60
-60
-40
-50
0
-10
-20
-30
30
20
10
40
50
PHASE (DEGREES)
INSERTION LOSS (ON)
PHASE (ON)
OFF
ISOLATION
ADJACENT
CHANNEL
CROSSTALK
(ON)
OPPOSITE
CHANNEL
CROSSTALK (ON)
0
-100 1 1000
MAX4567
FREQUENCY RESPONSE
-90
-80
-70
-60
-50
-30
-20
-10
-40
100
-100
-80
-60
-40
-20
0
40
60
80
20
MAX4565toc13
FREQUENCY (MHz)
SWITCH LOSS (dB)
ON PHASE (DEGREES)
10 100
ON LOSS
ON PHASE
CROSSTALK
OFF
ISOLATION
100
0.01 10 1k 100k10k100
MAX4567
TOTAL HARMONIC DISTORTION
vs. FREQUENCY
MAX14565 TOC14
FREQUENCY (Hz)
TOTAL HARMONIC DISTORTION (%)
0.1
1
10
V+ = +5V
V- = -5V
SIGNAL = 5Vp-p
600Ω IN AND OUT
____________________________Typical Operating Characteristics (continued)
(V+ = +5V, V- = -5V, TA= +25°C, GND = 0V, packages are surface mount, unless otherwise noted.)
_______________Theory of Operation
The MAX4565/MAX4566/MAX4567 are high-frequency
“T” switches. Each “T” switch consists of two series
CMOS switches, with a third N-channel switch at the
junction that shunts capacitively-coupled signals to
ground when the series switches are off. This produces
superior high-frequency signal isolation when the
switch is turned off.
Logic-Level Translators
The MAX4565/MAX4566/MAX4567 are constructed as
high-frequency “T” switches, as shown in Figure 1. The
logic-level input, IN_, is translated by amplifier A1 into a
V+ to V- logic signal that drives amplifier A2. (Amplifier
A2 is an inverter for normally closed switches.)
Amplifier A2 drives the gates of N-channel MOSFETs
N1 and N2 from V+ to V-, turning them fully on or off.
The same signal drives inverter A3 (which drives the
P-channel MOSFETs P1 and P2) from V+ to V-, turning
them fully on or off, and drives the N-channel MOSFET
N3 off and on.
The logic-level threshold is determined by V+ and
GND_. The voltage on GND_ is usually at ground
potential, but it may be set to any voltage between
(V+ - 2V) and V-. When the voltage between V+ and
GND_ is less than 2V, the level translators become very
slow and unreliable. Since individual switches in each
package have individual GND_ pins, they may be set to
different voltages. Normally, however, they should all
be connected to the ground plane.
Switch On Condition
When the switch is on, MOSFETs N1, N2, P1, and P2
are on and MOSFET N3 is off. The signal path is COM_
to NO_, and because both N-channel and P-channel
MOSFETs act as pure resistances, it is symmetrical
(i.e., signals may pass in either direction). The off
MOSFET, N3, has no DC conduction, but has a small
MAX4565/MAX4566/MAX4567
Quad/Dual, Low-Voltage,
Bidirectional RF/Video Switches
8 _______________________________________________________________________________________
______________________________________________________________Pin Description
NAME FUNCTION*
MAX4565
1, 10, 11,
20 IN_ Digital Control Input
PIN
3, 6, 8, 13,
15, 18 GND_ RF and Logic Ground. Grounds are not internally connected to each other,
and should all be connected to a ground plane (see
Grounding
section).
16 V+ Positive Supply-Voltage Input (analog and digital)
2, 9, 12, 19 COM_ Analog Switch Common** Terminals
— NC_ Analog Switch Normally Closed** Terminals
4, 7, 14, 17 NO_ Analog Switch Normally Open** Terminals
5 V- Negative Supply-Voltage Input. Connect to ground plane for single-supply
operation.
MAX4566
1, 16
3, 7, 10, 14
12
2, 8, 9, 15
6, 11
4, 13
5
MAX4567
1, 9
4, 6, 12, 14
7, 15
5, 13
8, 10
2, 16
3, 11
* All pins have ESD diodes to V- and V+.
** NO_ (or NC_) and COM_ pins are identical and interchangeable. Either may be considered as an input or output; signals pass
equally well in either direction.
A1 A2 A3
A2 (NC)
S
S
P1
N3
D
D
DN1
V-
GND_
IN_
V+
V+
V-
COM_ NO_
S D N2 S
SP2 D
NORMALLY OPEN SWITCH CONSTRUCTION
COM_ - NO_IN_
0
1OFF
ON
ESD DIODES
ON GND_, IN_,
COM_, NO_, AND NC_
Figure 1. T-Switch Construction
amount of capacitance to GND_. The four on
MOSFETs also have capacitance to ground that,
together with the series resistance, forms a lowpass fil -
ter. All of these capacitances are distributed evenly
along the series resistance, so they act as a transmis-
sion line rather than a simple R-C filter. This helps to
explain the exceptional 350MHz bandwidth when the
switches are on.
Typical attenuation in 50Ωsystems is -2.5dB and is
reasonably flat up to 300MHz. Higher-impedance cir-
cuits show even lower attenuation (and vice versa), but
slightly lower bandwidth due to the increased effect of
the internal and external capacitance and the switch’s
internal resistance.
The MAX4565/MAX4566/MAX4567 are optimized for
±5V operation. Using lower supply voltages or a single
supply increases switching time, increases on-resis-
tance (and therefore on-state attenuation), and increas-
es nonlinearity.
Switch Off Condition
When the switch is off, MOSFETs N1, N2, P1, and P2
are off and MOSFET N3 is on. The signal path is
through the off-capacitances of the series MOSFETs,
but it is shunted to ground by N3. This forms a high-
pass filter whose exact characteristics are dependent
on the source and load impedances. In 50Ωsystems,
and below 10MHz, the attenuation can exceed 80dB.
This value decreases with increasing frequency and
increasing circuit impedances. External capacitance
and board layout have a major role in determining over-
all performance.
__________Applications Information
Power-Supply Considerations
Overview
The MAX4565/MAX4566/MAX4567 construction is typi-
cal of most CMOS analog switches. It has three supply
pins: V+, V-, and GND. V+ and V- are used to drive the
internal CMOS switches and set the limits of the analog
voltage on any switch. Reverse ESD protection diodes
are internally connected between each analog signal
pin and both V+ and V-. If the voltage on any pin
exceeds V+ or V-, one of these diodes will conduct.
During normal operation these reverse-biased ESD
diodes leak, forming the only current drawn from V-.
Virtually all the analog leakage current is through the
ESD diodes. Although the ESD diodes on a given sig-
nal pin are identical, and therefore fairly well balanced,
they are reverse biased differently. Each is biased by
either V+ or V- and the analog signal. This means their
leakages vary as the signal varies. The
difference
in the
two diode leakages from the signal path to the V+ and
V- pins constitutes the analog signal-path leakage cur-
rent. All analog leakage current flows to the supply ter-
minals, not to the other switch terminal. This explains
how both sides of a given switch can show leakage
currents of either the same or opposite polarity.
There is no connection between the analog signal
paths and GND. The analog signal paths consist of an
N-channel and P-channel MOSFET with their sources
and drains paralleled and their gates driven out of
phase with V+ and V- by the logic-level translators.
V+ and GND power the internal logic and logic-level
translators, and set the input logic thresholds. The
logic-level translators convert the logic levels to
switched V+ and V- signals to drive the gates of the
analog switches. This drive signal is the only connec-
tion between the logic supplies and the analog sup-
plies. All pins have ESD protection to V+ and to V-.
Increasing V- has no effect on the logic-level thresh-
olds, but it does increase the drive to the P-channel
switches, reducing their on-resistance. V- also sets the
negative limit of the analog signal voltage.
The logic-level thresholds are CMOS and TTL compati-
ble when V+ is +5V. As V+ is raised, the threshold
increases slightly; when V+ reaches +12V, the level
threshold is about 3.1V, which is above the TTL output
high-level minimum of 2.8V, but still compatible with
CMOS outputs.
Bipolar-Supply Operation
The MAX4565/MAX4566/MAX4567 operate with bipolar
supplies between ±2.7V and ±6V. The V+ and V- sup-
plies need not be symmetrical, but their sum cannot
exceed the absolute maximum rating of 13.0V. Do not
connect the MAX4565/MAX4566/MAX4567 V+ pin to
+3V and connect the logic-level input pins to TTL
logic-level signals. TTL logic-level outputs can
exceed the absolute maximum ratings, causing
damage to the part and/or external circuits.
CAUTION:
The absolute maximum V+ to V- differential
voltage is 13.0V. Typical “±6-Volt” or “12-Volt”
supplies with ±10% tolerances can be as high
as 13.2V. This voltage can damage the
MAX4565/MAX4566/MAX4567. Even ±5% toler-
ance supplies may have overshoot or noise
spikes that exceed 13.0V.
MAX4565/MAX4566/MAX4567
Quad/Dual, Low-Voltage,
Bidirectional RF/Video Switches
_______________________________________________________________________________________ 9
MAX4565/MAX4566/MAX4567
Single-Supply Operation
The MAX4565/MAX4566/MAX4567 operate from a sin-
gle supply between +2.7V and +12V when V- is con-
nected to GND. All of the bipolar precautions must be
observed. Note, however, that these parts are opti-
mized for ±5V operation, and most AC and DC charac-
teristics are degraded significantly when departing
from ±5V. As the overall supply voltage (V+ to V-) is
lowered, switching speed, on-resistance, off isolation,
and distortion are degraded. (See
Typical Operating
Characteristics
.)
Single-supply operation also limits signal levels and
interferes with grounded signals. When V- = 0V, AC sig-
nals are limited to -0.3V. Voltages below -0.3V can be
clipped by the internal ESD-protection diodes, and the
parts can be damaged if excessive current flows.
Power Off
When power to the MAX4565/MAX4566/MAX4567 is off
(i.e., V+ = 0V and V- = 0V), the Absolute Maximum
Ratings still apply. This means that neither logic-level
inputs on IN_ nor signals on COM_, NO_, or NC_ can
exceed ±0.3V. Voltages beyond ±0.3V cause the inter-
nal ESD-protection diodes to conduct, and the parts
can be damaged if excessive current flows.
Grounding
DC Ground Considerations
Satisfactory high-frequency operation requires that
careful consideration be given to grounding. For most
applications, a ground plane is strongly recom-
mended, and all GND_ pins should be connected to
it with solid copper. While the V+ and V- power-supply
pins are common to all switches in a given package,
each switch has separate ground pins that are not
internally connected to each other. This contributes to
the overall high-frequency performance and provides
added flexibility in some applications, but it can cause
problems if it is overlooked. All the GND_ pins have
ESD diodes to V+ and V-.
In systems that have separate digital and analog (sig-
nal) grounds, connect these switch GND_ pins to ana-
log ground. Preserving a good signal ground is much
more important than preserving a digital ground.
The logic-level inputs, IN_, have voltage thresholds
determined by V+ and GND_. (V- does not influence
the logic-level threshold.) With +5V and 0V applied to
V+ and GND_, the threshold is about 1.6V, ensuring
compatibility with TTL- and CMOS-logic drivers.
The various GND_ pins can be connected to separate
voltage potentials if any or all of the logic-level inputs is
not a normal logic signal. (The GND_ voltages cannot
exceed (V+ - 2V) or V-.) Elevating GND_ reduces off
isolation. For example, using the MAX4565, if GND2–
GND6 are connected to 0V and GND1 is connected to
V-, then switches 2, 3, and 4 would be TTL/CMOS com-
patible, but switch 1 (IN1) could be driven with the rail-
to-rail output of an op amp operating from V+ and V-.
Note, however, that IN_ can be driven more negative
than GND_, as far as V-. GND_ does not have to be
removed from 0V when IN_ is driven from bipolar
sources, but the voltage on IN_ should never exceed V-.
GND_ should be separated from 0V only if the logic-
level threshold has to be changed.
Any GND_ pin not connected to 0V should be
bypassed to the ground plane with a surface-mount
10nF capacitor to maintain good RF grounding. DC
current in the IN_ and GND_ pins is less than 1nA, but
increases with switching frequency.
On the MAX4565 only, two extra ground pins—GND5
and GND6—are provided to improve isolation and
crosstalk. They are not connected to the logic-level cir-
cuit. These pins should always be connected to the
ground plane with solid copper.
AC Ground and Bypassing
A ground plane is mandatory for satisfactory high-
frequency operation. (Prototyping using hand wiring or
wire-wrap boards is strongly discouraged.) Connect all
0V GND_ pins to the ground plane with solid copper.
(The GND_ pins extend the high-frequency ground
through the package wire-frame, into the silicon itself,
thus improving isolation.) The ground plane should be
solid metal underneath the device, without interruptions.
There should be no traces under the device itself. For
DIP packages, this applies to both sides of a two-
sided board. Failure to observe this will have a minimal
effect on the “on” characteristics of the switch at high
frequencies, but it will degrade the off isolation and
crosstalk.
Bypass all V+ and V- pins to the ground plane with sur-
face-mount 10nF capacitors. For DIP packages, mount
the capacitors as close as possible to the pins on the
same side of the board as the device. Do not use
feedthroughs or vias for bypass capacitors.
For surface-mount packages, bypass capacitors
should be mounted on the opposite side of the board
from the device. In this case, use short feedthroughs or
vias, directly under the V+ and V- pins. Any GND_ pin
not connected to 0V should be similarly bypassed. If V-
is 0V, connect it directly to the ground plane with solid
copper. Keep all leads short.
Quad/Dual, Low-Voltage,
Bidirectional RF/Video Switches
10 ______________________________________________________________________________________
MAX4565/MAX4566/MAX4567
Quad/Dual, Low-Voltage,
Bidirectional RF/Video Switches
______________________________________________________________________________________ 11
The MAX4567 has two V+ and two V- pins. Make DC
connections to only one of each to minimize crosstalk.
Do not route DC current into one of the V+ or V- pins
and out the other V+ or V- pin to other devices. The
second set of V+ and V- pins is for AC bypassing only.
For dual-supply operation, the MAX4567 should have
four 10nF bypass capacitors connected to each V+
and V- pin as close to the package as possible. For sin-
gle-supply operation, the MAX4567 should have two
10nF bypass capacitors connected (one to each V+
pin) as close to the package as possible.
On the MAX4565, GND5 and GND6 should always be
connected to the ground plane with solid copper to
improve isolation and crosstalk.
Signal Routing
Keep all signal leads as short as possible. Separate all
signal leads from each other and other traces with the
ground plane on both sides of the board. Where possible,
use coaxial cable instead of printed circuit board traces.
Board Layout
IC sockets degrade high-frequency performance and
should not be used if signal bandwidth exceeds 5MHz.
Surface-mount parts, having shorter internal lead
frames, provide the best high-frequency performance.
Keep all bypass capacitors close to the device, and
separate all signal leads with ground planes. Such
grounds tend to be wedge-shaped as they get closer to
the device. Use vias to connect the ground planes on
each side of the board, and place the vias in the apex of
the wedge-shaped grounds that separate signal leads.
Logic-level signal lead placement is not critical.
MAX4565
GND6
COM1
COM2
COM3
COM4
GND1 NO1
NO2
NO3
NO4
50/75Ω
OUT/IN
50/75Ω
OUT/IN
GND5
V-
V-
10nF
V+
V+
10nF
GND2
GND3
GND4
IN1
IN1
IN2
IN2
IN3
IN3
IN4
IN4
MAX4565
MAX4565
MAX4565
1 OUT
2
3
4
1
2
3
4
1OUT
TO
ADDITIONAL
MUXES
2
3
4
5
6
7
8
1 OUT
2
3
4
ADDRESS
DECODING
Figure 2. 4-Channel Multiplexer
Multiplexer
With its excellent off isolation, the MAX4565 is ideal for
use in high-frequency video multiplexers. Figure 2
shows such an application for switching any one of four
video inputs to a single output. The same circuit may
be used as a demultiplexer by simply reversing the sig-
nal direction.
Stray capacitance of traces and the output capacitance
of switches placed in parallel reduces bandwidth, so the
outputs of no more than four individual switches should
be placed in parallel to maintain a high bandwidth. If
more than four mux channels are needed, the 4-channel
circuit should be duplicated and cascaded.
MAX4565/MAX4566/MAX4567
Quad/Dual, Low-Voltage,
Bidirectional RF/Video Switches
12 ______________________________________________________________________________________
50% 50%
tOFF tON
V+
0V
VIN_
VOUT
VOUT
V+
IN_
NO_OR NC_
COM_
3V
REPEAT TEST FOR EACH SWITCH.
50Ω
MAX4565
MAX4566
MAX4567
RL = 300Ω
90%
90%
ALL GND_ PINS ARE CONNECTED TO GROUND PLANE (OV).
V- IS CONNECTED TO GND (OV) FOR SINGLE-SUPPLY OPERATION.
0V
VIN_
+5V
10nF
GND_ V-
10nF -5V
Figure 3. Switching Time
______________________________________________Test Circuits/Timing Diagrams
MAX4565/MAX4566/MAX4567
Quad/Dual, Low-Voltage,
Bidirectional RF/Video Switches
______________________________________________________________________________________ 13
50%
tBBM
tR < 20ns
tF < 20ns
V+
0V
VIN_
VOUT
VOUT
V+
IN_
* COM2
* COM3
* NC3
* N02
3V
* REPEAT TEST FOR OTHER PAIR OF SWITCHES.
50Ω
MAX4566
RL = 300Ω
80%
ALL GND_ PINS ARE CONNECTED TO GROUND PLANE (OV).
V+ IS CONNECTED TO GND (OV) FOR SINGLE-SUPPLY OPERATION.
0V
VIN_
+5V10nF
GND_ V-
10nF -5V
VOUT
V+
IN_
**NO_
**NC_
**COM_
1V
** REPEAT TEST FOR OTHER SWITCH.
50Ω
MAX4567
RL = 300Ω
VIN_
+5V10nF
GND_ V-
10nF -5V
Figure 4. Break-Before-Make Interval (MAX4566/MAX4567 only)
_________________________________Test Circuits/Timing Diagrams (continued)
MAX4565/MAX4566/MAX4567
Quad/Dual, Low-Voltage,
Bidirectional RF/Video Switches
14 ______________________________________________________________________________________
∆VOUT
V+
0V
VIN_
VOUT
∆VOUT IS THE MEASURED VOLTAGE DUE TO CHARGE TRANSFER
ERROR Q WHEN THE CHANNEL TURNS OFF.
Q = ∆VOUT x CL
VOUT
V+
IN_
NO_ OR NC_
COM_
VNO = 0V
V- IS CONNECTED TO GND (0V) FOR SINGLE-SUPPLY OPERATION.
50Ω
MAX4565
MAX4566
MAX4567
CL = 1000pF
VIN_
+5V
10nF
GND_ V-
10nF -5V
Figure 5. Charge Injection
MEASUREMENTS ARE STANDARDIZED AGAINST SHORT AT IC TERMINALS.
OFF ISOLATION IS MEASURED BETWEEN COM_ AND "OFF" NO_ OR NC_ TERMINAL ON EACH SWITCH.
ON LOSS IS MEASURED BETWEEN COM_ AND "ON" NO_ OR NC_TERMINAL ON EACH SWITCH.
CROSSTALK IS MEASURED FROM ONE CHANNEL TO ALL OTHER CHANNELS.
SIGNAL DIRECTION THROUGH SWITCH IS REVERSED; WORST VALUES ARE RECORDED.
V- IS CONNECTED TO GND (0V) FOR SINGLE-SUPPLY OPERATION.
+5V
VOUT
V+
IN_ NO_
COM_
VIN
MAX4565
MAX4566
MAX4567
OFF ISOLATION = 20log VOUT
VIN
ON LOSS = 20log VOUT
VIN
CROSSTALK = 20log VOUT
VIN
NETWORK
ANALYZER
50Ω
50Ω50Ω
50Ω
MEAS REF
10nF
0V OR V+
GND_ V-
10nF -5V
Figure 6. On Loss, Off Isolation, and Crosstalk
_________________________________Test Circuits/Timing Diagrams (continued)
MAX4565/MAX4566/MAX4567
Quad/Dual, Low-Voltage,
Bidirectional RF/Video Switches
______________________________________________________________________________________ 15
TRANSISTOR COUNT: 257
SUBSTRATE INTERNALLY CONNECTED TO V+
+5V10nF
0V OR V+ V+
IN_
ALL GND_ PINS ARE CONNECTED TO GROUND PLANE (0V).
NO_
NC_
COM_
MAX4565
MAX4566
MAX4567
1MHz
CAPACITANCE
ANALYZER
GND_ V-
10nF -5V
Figure 7. NO_, NC_, COM_ Capacitance
_________________Chip Topographies
Test Circuits/Timing
______________Diagrams (continued)
GND2
0.082"
(2.08mm)
0.072"
(1.83mm)
COM4 IN4 IN3 COM3
NO2
V+
GND6
NO3
GND3
N.C.
COM1 IN1 IN2 COM2
NO1
GND1
N.C.
NO4
GND4
GND5
V-
GND2
0.082"
(2.08mm)
0.072"
(1.83mm)
V+ NC1 IN2 NC2
N.C.
N.C.
COM2
N.C.
GND3
V-
NO1 IN1 NO2 V+
N.C.
GND1
V-
N.C.
GND4
COM1
N.C.
GND2
0.082"
(2.08mm)
0.072"
(1.83mm)
GND4 COM4 COM3 GND3
NO2
V+
N.C.
NC3
N.C.
N.C.
COM1 IN1 IN2 COM2
NO1
GND1
N.C.
NC4
N.C.
N.C.
V-
MAX4565
MAX4566 MAX4567
MAX4565/MAX4566/MAX4567
Quad/Dual, Low-Voltage,
Bidirectional RF/Video Switches
________________________________________________________Package Information
QSOP.EPS
PART
MAX4565CAP 0°C to +70°C
TEMP. RANGE PIN-PACKAGE
20 SSOP
MAX4565C/D
MAX4565EPP
MAX4565EWP -40°C to +85°C
-40°C to +85°C
0°C to +70°C Dice*
20 Plastic DIP
20 Wide SO
MAX4565EAP
MAX4566CPE
MAX4566CSE 0°C to +70°C
0°C to +70°C
-40°C to +85°C 20 SSOP
16 Plastic DIP
16 Narrow SO
MAX4566CEE
MAX4566C/D
MAX4566EPE -40°C to +85°C
0°C to +70°C
0°C to +70°C 16 QSOP
Dice*
16 Plastic DIP
MAX4566ESE -40°C to +85°C 16 Narrow SO
___________________________________________Ordering Information (continued)
*
Contact factory for dice specifications.
PART TEMP. RANGE PIN-PACKAGE
MAX4566EEE
MAX4567CPE 0°C to +70°C
-40°C to +85°C 16 QSOP
16 Plastic DIP
MAX4567CSE
MAX4567CEE
MAX4567C/D 0°C to +70°C
0°C to +70°C
0°C to +70°C 16 Narrow SO
16 QSOP
Dice*
MAX4567EPE
MAX4567ESE
MAX4567EEE -40°C to +85°C
-40°C to +85°C
-40°C to +85°C 16 Plastic DIP
16 Narrow SO
16 QSOP
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
16
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