IS61LSCS25672
IS61LSCS51236 ISSI®
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
1
ADVANDED INFORMATION Rev. 00A
06/13/02
Copyright © 2002 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI
assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device
specification before relying on any published information and before placing orders for products.
Bottom View
209-Ball, 14 mm x 22 mm BGA
1 mm Ball Pitch, 11 x 19 Ball Array
SIGMARAM FAMILY OVERVIEW
The IS61LSCS series SRAMs are built in compliance with
the SigmaRAM pinout standard for synchronous SRAMs.
The implementations are 18,874,368-bit (18Mb) SRAMs.
These are the first in a family of wide, very low voltage
CMOS
I/O SRAMs
designed to operate at the speeds needed to
implement economical high performance networking
systems.
ISSIs SRAMs are offered in a number of configurations that
emulate other synchronous SRAMs, such as Burst RAMs,
NBT RAMs, Late Write, or Double Data Rate (DDR) SRAMs.
The logical differences between the protocols employed by
these RAMs hinge mainly on various combinations of
address bursting, output data registering and write cueing.
SRAMs allow a user to implement the interface protocol best
suited to the task at hand.
This specific product is Common I/O, SDR, Pipelined, and
in the family is identified as 1x1Lp.
ADVANCE INFORMATION
JUNE 2002
SRAM 256K X 72, 512K X 36
18MB SYNCHRONOUS SRAM
FEATURES
• JEDEC SigmaRam pinout and package standard
• Single 1.8V power supply (VCC): 1.7V (min)
to 1.9V (max)
• Dedicated output supply voltage (VCCQ): 1.8V
or 1.5V typical
• LVCMOS-compatible I/O interface
• Common data I/O pins (DQs)
• Single Data Rate (SDR) data transfers
• Late Write Pipelined (PL) read operations
• Burst and non-burst read and write operations,
selectable via dedicated control pin (ADV)
• Internally controlled Linear Burst address
sequencing during burst operations
• Full read/write coherency
• Byte write capability
• Two cycle deselect
• Single-ended input clock (CLK)
• Data-referenced output clocks (CQ/, CQ)
• Selectable output driver impedance via dedicated
control pin (ZQ)
• Echo clock outputs track data output drivers
• Depth expansion capability (2 or 4 banks) via
programmable chip enables (E2, E3, EP2, EP3)
• JTAG boundary scan (subset of IEEE standard
1149.1)
• 209 Ball (11x19), 1mm pitch, 14mm x 22mm Ball
Grid Array (BGA) package
2
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ADVANCE INFORMATION Rev. 00A
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IS61LSCS25672
IS61LSCS51236 ISSI
®
FUNCTIONAL DESCRIPTION
Because SigmaRAM is a synchronous device, address,
data Inputs, and read/write control inputs are captured on
the rising edge of the input clock. Write cycles are
internally self-timed and initiated by the rising edge of the
clock input. This feature eliminates complex off-chip write
pulse generation required by asynchronous SRAMs and
simplifies input signal timing.
IS61NSCS25672 PINOUT
256K x 72 COMMON I/O —TOP VIEW
1234567891011
A DQg DQg A E2 A ADV A E3 A DQb DQb
(16M) (8M)
B DQg DQg Bc Bg NC WABb Bf DQb DQb
C DQg DQg Bh Bd NC E1 NC Be Ba DQb DQb
(128M)
D DQg DQg GND NC NC MCL NC NC GND DQb DQb
E DQPg DQPc VCCQ VCCQ VCC VCC VCC VCCQ VCCQ DQPf DQPb
F DQc DQc GND GND GND ZQ GND GND GND DQf DQf
G DQc DQc VCCQ VCCQ VCC EP2 VCC VCCQ VCCQ DQf DQf
H DQc DQc GND GND GND EP3 GND GND GND DQf DQf
J DQc DQc VCCQ VCCQ VCC M4 VCC VCCQ VCCQ DQf DQf
K CQ2 CQ2 CLK NC GND MCL GND NC NC CQ1 CQ1
L DQh DQh VCCQ VCCQ VCC M2 VCC VCCQ VCCQ DQa DQa
M DQh DQh GND GND GND M3 GND GND GND DQa DQa
N DQh DQh VCCQ VCCQ VCC MCH VCC VCCQ VCCQ DQa DQa
P DQh DQh GND GND GND MCL GND GND GND DQa DQa
R DQPd DQPh VCCQ VCCQ VCC VCC VCC VCCQ VCCQ DQPa DQPe
T DQd DQd GND NC NC MCL NC NC GND DQe DQe
U DQd DQd NC A NC A NC A NC DQe DQe
(64M) (32M)
V DQd DQd A A A A1 A A A DQe DQe
W DQd DQd TMS TDI A A0 A TDO TCK DQe DQe
11 x 19 Ball BGA—14 x 22 mm2 Body—1 mm Ball Pitch
Single data rate ΣRAMs incorporate a rising-edge-triggered
output register. For read cycles, ΣRAM’s output data is
temporarily stored by the edge-triggered output register
during the access cycle and then released to the output
drivers at the next rising edge of clock.
IS61LSCS series SRAMs are implemented with ISSI’s
high performance CMOS technology and are packaged in
a 209-Ball BGA.
IS61LSCS25672
IS61LSCS51236 ISSI
®
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3
ADVANCE INFORMATION Rev. 00A
06/13/02
IS61NSCS51236 PINOUT
512K x 36 COMMON I/O—TOP VIEW
1234567891011
A NC NC A E2 A ADV A E3 A DQb DQb
(16M)
BNC NC Bc NC A WABb NC DQb DQb
(x36)
CNC NC NC Bd NC E1 NC NC Ba DQb DQb
(128M)
D NC NC GND NC NC MCL NC NC GND DQb DQb
E NC DQPc VCCQ VCCQ VCC VCC VCC VCCQ VCCQ NC DQPb
F DQc DQc GND GND GND ZQ GND GND GND NC NC
G DQc DQc VCCQ VCCQ VCC EP2 VCC VCCQ VCCQ NC NC
H DQc DQc GND GND GND EP3 GND GND GND NC NC
J DQc DQc VCCQ VCCQ VCC M4 VCC VCCQ VCCQ NC NC
K CQ2 CQ2 CLK NC GND MCL GND NC NC CQ1 CQ1
LNC NC VCCQ VCCQ VCC M2 VCC VCCQ VCCQ DQa DQa
M NC NC GND GND GND M3 GND GND GND DQa DQa
NNC NC VCCQ VCCQ VCC MCH VCC VCCQ VCCQ DQa DQa
P NC NC GND GND GND MCL GND GND GND DQa DQa
RDQPd NC VCCQ VCCQ VCC VCC VCC VCCQ VCCQ DQPa NC
T DQd DQd GND NC NC MCL NC NC GND NC NC
U DQd DQd NC A NC A NC A NC NC NC
(64M) (32M)
V DQd DQd A A A A1 A A A NC NC
W DQd DQd TMS TDI A A0 A TDO TCK NC NC
11 x 19 Ball BGA—14 x 22 mm2 Body—1 mm Ball Pitch
4
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ADVANCE INFORMATION Rev. 00A
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IS61LSCS25672
IS61LSCS51236 ISSI
®
PIN DESCRIPTION TABLE
Symbol Pin Location Description Type Comments
A A3, A5, A7, A9, B7, U4, Address Input —
U6, U8, V3, V4, V5, V6,
V7, V8, V9, W5, W6, W7
A B5 Address Input x36 version
ADV A6 Advance Input Active High
Bx B3, C9 Byte Write Enable Input Active Low (all versions)
Bx B8, C4 Byte Write Enable Input
Active Low (x36 and x72 versions)
Bx B4, B9, C3, C8 Byte Write Enable Input
Active Low (x72 version only)
CK K3 Clock Input Active High
CQ K1, K11 Echo Clock Output Active High
CQ K2, K10 Echo Clock Output Active Low
DQ E2, F1, F2, G1, G2, H1, Data I/O Input/Output x36, and x72 versions
H2, J1, J2, L10, L11,
M10, M11, N10, N11,
P10, P11, R10
A10, A11, B10, B11, Data I/O Input/Output
C10, C11, D10, D11,
E11, R1, T1, T2, U1, U2,
V1, V2, W1, W2
DQ A1, A2, B1, B2, C1, C2, Data I/O Input/Output x72 version only
D1, D2, E1, E10, F10,
F11, G10, G11, H10,
H11, J10, J11, L1, L2,
M1, M2, N1, N2, P1, P2,
R2, R11, T10, T11, U10,
U11, V10, V11, W10,
W11
E1 C6 Chip Enable Input Active Low
E2 & E3 A4, A8 Chip Enable Input
Programmable Active High or Low
EP2 & EP3 G6, H6 Chip Enable Program Pin Input —
TCK W9 Test Clock Input Active High
TDI W4 Test Data In Input —
TDO W8 Test Data Out Output —
TMS W3 Test Mode Select Input —
M2, M3 & M4 L6, M6, J6 Mode Control Pins Input Must tie to High, High, Low
MC L B3, C9, D6, K6 Must Connect Low Input —
P6, T6, W6
MCH N6 Must Connect high Input —
IS61LSCS25672
IS61LSCS51236 ISSI
®
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ADVANCE INFORMATION Rev. 00A
06/13/02
PIN DESCRIPTION TABLE
Symbol Pin Location Description Type Comments
C5, D4, D5, D7, D8, K4,
NC K8, K9, T4, T5, T7, No Connect — Not connected to die (all versions)
T8, U3, U5, U7, U9
NC B5 No Connect — Not connected to die (x72 version)
NC C7 No Connect — Not connected to die (x72/x36 versions)
A1, A2, B1, B2, B4, B9,
C1, C2, C3, C8, D1, D2,
E1, E10, F10, F11, G10,
NC G11, H10, H11, J10, J11, No Connect — Not connected to die (x36 version)
L1, L2, M1, M2, N1, N2,
P1, P2, R2, R11, T10,
T11, U10, U11, V10,
V11, W10, W11
WB6 Write Input Active Low
E5, E6, E7, G5, G7,
VCC J5, J7, L5, L7, N5, Core Power Supply Input 1.8 V Nominal
N7, R5, R6, R7
E3, E4, E8, E9, J3, J4,
VCCQ J8, J9, L3, L4, L8, Output Driver Power Supply Inpu t 1.8 V or 1.5 V Nominal
L9, N3, N4, N8, N9,
R3, R4, R8, R9
D3, D9, F3, F4, F5, F7,
F8, F9, H3, H4, H5, H7,
GND H8, H9, K5, K7, M3, M4, Ground Input —
M5, M7, M8, M9, P3, P4,
P5, P7, P8, P9, T3, T9
Z Q F 6 Output Impedance Control Inpu t Low = Low Impedance [High Drive]
High = High Impedance [Low Drive]
Default = High
6
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ADVANCE INFORMATION Rev. 00A
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IS61LSCS25672
IS61LSCS51236 ISSI
®
BACKGROUND
The central characteristics of the ISSI ΣRAMs are that
they are extremely fast and consume very little power.
Because both operating and interface power is low,
ΣRAMs can be implemented in a wide (x72) configuration,
providing very high single package bandwidth (in excess
of 20 Gb/s in ordinary pipelined configuration) and very low
random access latency (~3 ns). The use of very low
voltage
circuits
in the core and 1.8V or 1.5V interface
voltages allow the speed, power and density performance
of ΣRAMs.
Although the
Sigma
RAM
family
pinouts
have been de-
signed to support a number of different common read and
write protocol options, not all SigmaRAM implementa-
tions will
support
all
possible
protocols. The following
timing diagrams provide a quick comparison between
read and write protocols options available in the context
of the SigmaRAM standard. This data sheet covers the
single data rate
(non-DDR)
, Pipelined Read SigmaRAM.
The character of the applications for fast synchronous
SRAMs in networking systems are extremely diverse.
ΣRAMs have been developed to address the diverse
needs of the networking market in a manner that can be
supported with a unified development and manufacturing
infrastructure. ΣRAMs address each of the bus protocol
options commonly found in networking systems. This
allows the ΣRAM to find application in radical shrinks and
speed-ups of existing networking chip sets that were
designed for use with older SRAMs, like the NBT or Nt,
Late Write, or Double Data Rate SRAMs, as well as with
new chip sets and ASIC’s that employ the Echo Clocks
and realize the full potential of the ΣRAMs.
LATE WRITE—PIPELINED READ (S1x1Lp). For reference only.
A B C D E F
R W R W R W
QA DB QC DD QE
CK
Address
Control
DQ
CQ
DOUBLE LATE WRITE—PIPELINED READ (S1x1Dp). For reference only.
A B C D E F
R X W R X W
QA DC QD DF
CK
Address
Control
DQ
CQ
COMMON I/O SigmaRAM FAMILY MODE COMPARISON—LATE WRITE VS. DOUBLE LATE WRITE
IS61LSCS25672
IS61LSCS51236 ISSI
®
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ADVANCE INFORMATION Rev. 00A
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READ OPERATIONS
Pipelined Read
Read operation is initiated when the following conditions
are satisfied at the rising edge of clock: All three chip
enables
(E1, E2, and E3)
are active, the write enable input
signal
(W)
is deasserted high, and ADV is asserted low.
The address presented to the address inputs is latched into
the address register and presented to the memory core
and control logic. The control logic determines that a read
access is in progress and allows the requested data to
propagate to the input of the output register. At the next
rising edge of clock the read data is allowed to propagate
through the output register and onto the output pins.
WRITE OPERATIONS
Write operation occurs when the following conditions are
satisfied at the rising edge of clock: All three chip enables
(E1, E2, and E3) are active and the write enable input
signal (W) is asserted low.
Data is taken at the next rising edge of clock, as a Late
Write operation.
A B C D E F
R X W R X W
CK
Address
Control
DQ
CQ
DC0
QA0 QA1 QD0 QD1 DF0DC1
DOUBLE DATA RATE WRITE—DOUBLE DATA RATE READ (S1x2Lp). For reference only.
8
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ADVANCE INFORMATION Rev. 00A
06/13/02
IS61LSCS25672
IS61LSCS51236 ISSI
®
SINGLE DATA RATE PIPELINED READ
LATE WRITE WITH PIPELINED READ
CLK
AXXCDEF
Address
E1
W
CQ
DQ
Read Deselect Read Read Read
QA
QC QD
Read
CLK
ACD
Address
E1
W
CQ
DQ
Read Deselect Write
DB
B
Read Deselect
Write
QA
QD
XX XX
Deselect
DC
XX
IS61LSCS25672
IS61LSCS51236 ISSI
®
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ADVANCE INFORMATION Rev. 00A
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SPECIAL FUNCTIONS
Burst Cycles
SRAMs provide an on-chip burst address generator that
can be utilized, if desired, to further simplify burst read or
write implementations. The ADV control pin, when driven
high, commands the SRAM to advance the internal ad-
dress counter and use the counter generated address to
read or write the SRAM. The starting address for the first
cycle in a burst cycle series is loaded into the SRAM by
driving the ADV pin low, into Load mode.
Burst Order
The burst address counter wraps around to its initial state
after four addresses (the loaded address and three more)
have been accessed. SigmaRAMs always count in linear
burst order.
Linear Burst Order
A[1:0] A[1:0] A[1:0] A[1:0]
1st address 00 01 10 11
2nd address 01 10 11 00
3rd address 10 11 00 01
4th address 11 00 01 10
Note:
1. The burst counter wraps to initial state on the 5th rising edge
of clock.
SIGMA PIPELINED BURST READS WITH COUNTER WRAP-AROUND
CLK
A2
Address
E1
W
CQ
DQ
Read
A2 A1 A3
A0
Internal
Address A3 A2
XX
XX
XX XX
XX
ADV
Continue
Bursting
10 11 00 01
QA2 QA3 QA0 QA1
Counter Wraps
Continue
Bursting Continue
Bursting Continue
Bursting Continue
Bursting
10
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IS61LSCS51236 ISSI
®
ECHO CLOCK CONTROL IN TWO BANKS OF SIGMA PIPELINED SRAMS
ECHO CLOCK
SRAMs feature Echo Clocks, CQ1,CQ2, CQ1, and CQ2
that track the performance of the output drivers. The Echo
Clocks are delayed copies of the main RAM clock, CLK.
Echo Clocks are designed to track changes in output
driver delays due to variance in die temperature and
supply voltage. The Echo Clocks are designed to fire with
the rest of the data output drivers. Sigma RAMs provide
both in-phase, or true, Echo Clock outputs (CQ1 and
CQ2) and inverted Echo Clock outputs (CQ1 and CQ2).
It should be noted that deselection of the RAM via E2 and
E3 also deselects the Echo Clock output drivers. The
deselection of Echo Clock drivers is always pipelined to
the same degree as output data. Deselection of the RAM
via E1 does not deactivate the Echo Clocks.
In some applications it may be appropriate to pause
between banks; to deselect both RAMs with E1 before
resuming read operations. An E1 deselect at a bank
switch will allow at least one clock to be issued from the
new bank before the first read cycle in the bank. Although
the following drawing illustrates a E1 read pause upon
switching from Bank 1 to Bank 2, a write to Bank 2 would
have the same effect, causing the RAM in Bank 2 to issue
at least one clock before it is needed.
A B C D E F
QA QC
QB QD
Read Read Read Read Read Read
CLK
Address
E1
E2 Bank 1
E2 Bank 2
DQ Bank 1
DQ Bank 2
CQ Bank 1
CQ Bank 2
CQ1+ CQ2
Note:
E1 does not deselect the Echo Clock Outputs. Echo Clock outputs are synchronously deselected by E2 or E3 being sampled false.
IS61LSCS25672
IS61LSCS51236 ISSI
®
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ADVANCE INFORMATION Rev. 00A
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PIPELINED READ BANK SWITCH WITH E1 DESELECT
A XX C D E F
QA
QC QD
Read No Op Read Read Read Read
CLK
Address
E1
E2 Bank 1
E2 Bank 2
DQ Bank 1
DQ Bank 2
CQ Bank 1
CQ Bank 2
CQ1+ CQ2
Note:
E1 does not deselect the Echo Clock Outputs. Echo Clock outputs are synchronously deselected by E2 or E3 being sampled false.
OUTPUT DRIVER IMPEDANCE CONTROL
SigmaRAMs may be supplied with either selectable (high) impedance output drivers. The ZQ pin of SigmaRAMs supplied
with selectable impedance drivers, allows selection between ΣRAM nominal drive strength (ZQ low) for multi-drop bus
applications and low drive strength (ZQ floating or high) point-to-point applications. The impedance of the data and clock
output drivers in these devices can be controlled via the static input ZQ. When ZQ is tied "low", output driver impedance
is set to ~25 Ω. When ZQ is tied "high" or left unconnected, output driver impedeance is set to ~50Ω. See the DC Electrical
Characteristics section for further information. The SRAM requires 32K cycles of power-up time after VCC reaches its
operating range.
OUTPUT DRIVER CHARACTERISTICS - TBD
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®
PROGRAMMABLE ENABLES
SRAMs feature two user-programmable chip enable inputs,
E2 and E3. The sense of the inputs, whether they function
as active low or active high inputs, is determined by the
state of the programming inputs, EP2 and EP3. For
example, if EP2 is held at VCC , E2 functions as an active
high enable. If EP2 is held to GND , E2 functions as an
active low chip enable input.
BANK ENABLE TRUTH TABLE
EP2 EP3 E2 E3
Bank 0 GND GND Active Low Active Low
Bank 1 GND Vcc Active Low Active High
Bank 2 Vcc GND Active High Active Low
Bank 3 Vcc Vcc Active High Active High
EXAMPLE FOUR BANK DEPTH EXPANSION SCHEMATIC
Programmability of E2 and E3 allows four banks of depth
expansion to be accomplished with no additional logic. By
programming the enable inputs of four SRAMs in binary
sequence (00, 01, 10, 11) and driving the enable inputs
with two address inputs, four SRAMs can be made to look
like one larger RAM to the system.
A
E3
E2
E1
CLK
W
DQ
CQ
A
E3
E2
E1
CLK
W
DQ
CQ
A0-An-2
An-1
An
A
E3
E2
E1
CLK
W
DQ
CQ
A
E3
E2
E1
CLK
W
DQ
CQ
A0-An-2
An-1
An
A
E3
E2
E1
CLK
W
DQ
CQ
A
E3
E2
E1
CLK
W
DQ
CQ
A0-An-2
An-1
An
A
E3
E2
E1
CLK
W
DQ
CQ
A
E3
E2
E1
CLK
W
DQ
CQ
A0-An-2
An-1
An
Bank 0 Bank 1 Bank 2 Bank 3
A0-An
E1
CLK
W
DQ0-DQn
CQ
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®
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ADVANCE INFORMATION Rev. 00A
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SYNCHRONOUS TRUTH TABLE
CLK
E1
E ADV
WBW
Previous Current Operation DQ/CQ DQ/CQ
(tn) (tn) (tn) (tn) (tn) Operation (tn) (tn+1)
0®1 X F 0 X X X Bank Deselect *** Hi-Z
0®1 X X 1 X X Bank Deselect
Bank Deselect (Continue)
Hi-Z Hi-Z
0®1 1 T 0 X X X Deselect * ** Hi-Z/CQ
0®1 X X 1 X X Deselect Deselect (Continue) Hi-Z/CQ Hi-Z/CQ
0®1 0 T 0 0 T X Write *** Dn/CQ
Loads new address
(tn)
Stores DQx if BWx = 0
0®1 0 T 0 0 F X Write (Abort) *** Hi-Z/CQ
Loads new address
No data stored
0®1 X X 1 X T Write Write Continue Dn-1/CQ Dn/CQ
Increments address by 1
(tn-1) (tn)
Stores DQx if BWx = 0
0®1 X X 1 X F Write Write Continue (Abort) Dn-1/CQ Hi-Z/CQ
Increments address by 1
(tn-1)
No data stored
0®1 0 T 0 1 X X Read *** Qn/CQ
Loads new address
(tn)
0®1 X X 1 X X Read Read Continue Qn-1/CQ Qn/CQ
Increments address by 1
(tn-1) (tn)
Notes:
1. If E2 = EP2 and E3 = EP3 then E = “T” else E = “F”.
2. If one or more BWx = 0 then BW = “T” else BW = “F”.
3. “1” = input “high”; “0” = input “low”; “X” = input “don’t care”; “T” = input “true”; “F” = input “false”.
4. “***” indicates that the DQ input requirement/output state and CQ output state are determined by the previous operation.
5. DQs are tri-stated in response to Bank Deselect, Deselect, and Write commands, one full cycle after the command is sampled.
6. CQs are tri-stated in response to Bank Deselect commands only, one full cycle after the command is sampled.
7. Up to 3 Continue operations may be initiated after iniating a Read or Write operation to burst transfer up to 4 distinct pieces of data per single
external address input. If a fourth (4th) Continue operation is initiated, the internal address wraps back to the initial external (base) address.
14
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®
READ/WRITE CONTROL STATE DIAGRAM
READ
READ
CONTINUE
WRITE
WRITE
CONTINUE
DESELECT
BANK
DESELECT
X,F,0,X or
X,X,1,X
1,T,0,X or
X,X,1,X
0,T,0,1
X,X,1,X
X,X,1,X
X,F,0,X
0,T,0,0
X,F,0,X
X,F,0,X
X,F,0,X
0,T,0,0
0,T,0,0
0,T,0,0
0,T,0,0
0,T,0,1
0,T,0,0
0,T,0,1
0,T,0,1
0,T,0,1
1,T,0,X
1,T,0,X
1,T,0,X
1,T,0,X
1,T,0,X
X,X,1,X X,X,1,X
0,T,0,1 X,F,0,X
Notes:
1. The notation “X,X,X,X” controlling the state transitions above indicate the states of inputs E1, E, ADV, and W respectively.
2. If (E2 = EP2 and E3 = EP3) then E = “T” else E = “F”.
3. “1” = input “high”; “0” = input “low”; “X” = input “don’t care”; “T” = input “true”; “F” = input “false”.
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ADVANCE INFORMATION Rev. 00A
06/13/02
ABSOLUTE MAXIMUM RATINGS
(All voltages reference to GND )
Symbol Description Value Unit
VCC Voltage on VCC Pins –0.5 to 2.5 V
VCCQ Voltage in VCCQ Pins –0.5 to 2.3V V
VI/O Voltage on I/O Pins –0.5 to VCCQ +0.5 (≤ 2.3 V max.) V
VIN Voltage on Other Input Pins –0.5 to VCCQ +0.5 (≤ 2.3 V max.) V
IIN Input Current on Any Pin ±100 mA d c
IOUT Output Current on Any Pin ±100 mA d c
TJMaximum Junction Temperature 125 °C
TSTG Storage Temperature -55 to 125 °C
Note:
Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Operation should be limited to Recommended
Operating Conditions. Exposure to conditions exceeding Recommended Operating Conditions, for an extended period of time, may
affect reliability of this component.
CURRENT STATE & NEXT STATE DEFINITION FOR READ/WRITE CONTROL STATE DIAGRAM
ƒ ƒ ƒ ƒ
n n+1 n+2 n+3
Current State Next State
CK
Command
ƒ Transition
Current State (n)
Input Command Code
Next State (n+1)
KEY
POWER SUPPLY CHARACTERISTICS (TA = 0 min., 25 typ, 70 max °C)
Symbol Parameter Min. Typ. Max. Unit
VCC Supply Voltage 1.7 1.8 1.9 V
VCCQ(1) 1.8 V I/O Supply Voltage 1.7 1.8 V CC V
1.5 V I/O Supply Voltage 1.4 1.5 1.6 V V
Note:
1. Unless otherwise noted, all performance specifications quoted are evaluated for worst case at both 1.4 V ≤ VCCQ ≤ 1.6V
(i.e., 1.5 V I/O) and 1.7 V ≤ VCCQ ≤ 1.9 V (i.e., 1.8 V I/O) and quoted at whichever condition is worst case.
16
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IS61LSCS51236 ISSI
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CMOS I/O DC INPUT CHARACTERISTICS
Symbol Parameter VCCQ Min. Typ. Max. Unit
VIH CMOS Input High Voltage 1.8 1.2 —
VCCQ + 0.3
V
1.5 1.0 —
VCCQ + 0.3
VIL CMOS Input Low Voltage 1.8 –0.3 — 0.6 V
1.5 –0.3 — 0.5
Note:
For devices supplied with CMOS input buffers. Compatible with both 1.8 V and 1.5 V I/O drivers.
I/O CAPACITANCE (TA = 25 °C, f = 1 MHZ)
Symbol Parameter Test conditions Min. Max. Unit
CAAddress Input Capacitance VIN = 0 V — 3.5 pF
CBControl Input Capacitance VIN = 0 V — 3.5 pF
CCK Clock Input Capacitance VIN = 0 V — 3.5 pF
CDQ Data Output Capacitance VOUT = 0 V — 4.5 pF
CCQ CQ Clock Output Capacitance VOUT = 0 V — 4.5 pF
Note: These parameters are sampled and not 100% tested.
Undershoot Measurement and Timing Overshoot Measurement and Timing
20% tKC
50%
GND
VIH
GND - 1.0V
20% t
KC
50%
V
CC
+ 1.0V
V
CC
V
IL
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ADVANCE INFORMATION Rev. 00A
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AC TEST CONDITIONS
(VCC = 1.8V ± 0.1V, TA = 0 to 85°C)
Parameter Symbol Conditions Units
VCCQ 1.5V±0.1 1.8 ±0.1 V
Input High Level VIH 1.25 1.4 V
Input Low Level VIL 0.25 0.4 V
Input Rise & Fall Time 2.0 2.0 V/ns
Input Reference Level 0.75 0.9 V
Clock Input High Voltage VKIH 1.25 1.4 V
Clock Input Low Voltage VKIL 0.25 0.4 V
Clock Input Rise & Fall Time 2.0 2.0 V/ns
Clock Input Reference Level 0.75 0.9 V
Output Reference Level 0.75 0.9 V
Output Load Conditions ZQ = VIH see below see below
Notes:
1. Include scope and jig capacitance.
2. Test conditions as specified with output loading as shown unless otherwise noted.
AC TEST LOADS
DQ
0.75V
50Ω
50Ω
16.7Ω
16.7Ω
50Ω
16.7Ω
0.75V
50Ω
5 pF
5 pF
VCCQ = 1.5V
DQ
0.9V
50Ω
50Ω
16.7Ω
16.7Ω
50Ω
16.7Ω
0.9V
50Ω
5 pF
5 pF
VCCQ = 1.8V
Figure 1 (VCCQ = 1.5V) Figure 2 (VCCQ = 1.8V)
18
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IS61LSCS25672
IS61LSCS51236 ISSI
®
SELECTABLE IMPEDANCE OUTPUT DRIVER DC ELECTRICAL CHARACTERISTICS
Symbol Parameter Test Conditions Min. Max. Units
VOHL(1) Low Drive Output High Voltage IOHL = –4 mA VCCQ – 0.4 — V
VOLL(1) Low Drive Output Low Voltage IOLL = 4 mA — 0.4 V
VOHH(2) High Drive Output High Voltage IOHH = –8 mA VCCQ – 0.4 — V
VOLH(2) High Drive Output Low Voltage IOLH = 8 mA — 0.4 V
Notes:
1. ZQ = 1; High Impedance output driver setting
2. ZQ = 0; Low Impedance output driver setting
OUTPUT RESISTANCE
Symbol Parameter Test Conditions Min. Typ. Max. Units
ROUT Output Resistance
VOH, VOL = VCCQ/2
17 25 33 Ω
ZQ = VIL
VOH, VOL = VCCQ/2
35 50 65 Ω
ZQ = VIH
OPERATING CURRENTS
Symbol Parameter Test Conditions -333 -300 Units
Com. Ind. Com. Ind.
ICC Operating Current E1 < VIL Max. Pipeline x72 800 800 mA
tKHKH > tKHKH Min. x36 700 70 0
All other inputs
VIL > VIN > VIH
ISB1Bank Deselect Current E1 < VIH Min. or Pipeline x72 250 250 mA
& & E2 or E3 False x36 225 225
ISB2Chip Disable Current tKHKH > tKHKH Min.
All other inputs
VIL > VIN > VIH
ISB3CMOS Deselect Current Device Deselected Pipeline x72 150 150 mA
All inputs x36 150 150
GND+0.10V > VIN > VCC–0.10V
Note: Com. = 0°C to 70°C
Ind. = –40°C to +85°C
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ADVANCE INFORMATION Rev. 00A
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DC ELECTRICAL CHARACTERISTICS
(VCC = 1.8V ±0.1V, GND = 0V, TA = 0 ° to 85°C)
Symbol Parameter Test Conditions Min Typ Max Units
ILI Input Leakage Current VIN = GND to VCCQ -5 — 5 uA
(Address, Control, Clock)
IMLI Input Leakage Current VMIN = GND to VCC -10 — 10 uA
(EP2, EP3, M2, M3, M4, ZQ)
IDLI Input Leakage Current VDIN = GND to VCCQ -10 — 10 uA
(Data)
OPERATING CURRENTS (continued)
Symbol Parameter Test Conditions -250 -225 -200 Units
Com. Ind. Com. Ind. Com. Ind.
ICC Operating Current E1 < VIL Max. Pipeline x72 650 650 650 mA
tKHKH > tKHKH Min. x36 550 550 550
All other inputs
VIL > VIN > VIH
ISB1Bank Deselect Current E1 < VIH Min. or Pipeline x72 250 250 250 mA
& & E2 or E3 False x36 225 225 225
ISB2Chip Disable Current tKHKH > tKHKH Min.
All other inputs
VIL > VIN > VIH
ISB3CMOS Deselect Current Device Deselected Pipeline x72 150 150 150 mA
All inputs x36 150 150 150
GND+0.10V > VIN > VCC–0.10V
Note: Com. = 0°C to 70°C
Ind. = –40°C to +85°C
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IS61LSCS25672
IS61LSCS51236 ISSI
®
AC ELECTRICAL CHARACTERISTICS
-333 -300 -250
Symbol Parameter Min Max Min Max Min Max Unit
tKHKH Clock Cycle Time 3.0 — 3.3 — 4.0 — ns
tKHKL Clock HIGH Time 1.2 — 1.3 — 1.5 — n s
tKLKH Clock LOW Time 1.2 — 1.3 — 1.5 — n s
tKHCX1(2) Clock High to Echo Clock Low-Z 0.5 — 0.5 — 0.5 — n s
tKHCH Clock High to Echo Clock High 0.5 1.5 0.5 1.7 0.5 2.0 ns
tCHCL(2) Echo Clock High Time
tKHKL ±200 ps tKHKL ±200 ps tKHKL ±250 ps
ns
tKLCL Clock Low to Echo Clock Low 0.5 1.5 0.5 1.7 0.5 2.0 n s
tCLCH(2) Echo Clock Low Time
tKLKH ±200 ps tKLKH ±200 ps tKLKH ±250 ps
ns
tKHCZ(1, 2) Clock High to Echo Clock High-Z — 1.5 — 1.7 — 2.0 ns
tKHQX1(1) Clock High to Output in Low-Z 0.5 — 0.5 — 0.5 — n s
tKHQV Clock High to Output Valid — 1.6 — 1.8 — 2.1 ns
tKHQX Clock High to Output Invalid 0.5 — 0.5 — 0.5 — ns
tKHQZ(1) Clock High to Output in High-Z 0.5 1.6 0.5 1.8 0.5 2.1 ns
tCHQV(2) Echo Clock High to Output Valid — 0.4 — 0.4 — 0.5 n s
tCHQX(2) Output Invalid to Echo Clock High — –0.4 — –0.4 — –0.5 ns
tAVKH Address Valid to Clock High 0.6 — 0.7 — 0.8 — ns
tKHAX Clock High to Address Don’t Care 0.4 — 0.4 — 0.5 — ns
tEVKH Enable Valid to Clock High 0.6 — 0.7 — 0.8 — ns
tKHEX Clock High to Enable Don’t Care 0.4 — 0.4 — 0.5 — ns
tWVKH Write Valid to Clock High 0.6 — 0.7 — 0.8 — n s
tKHWX Clock High to Write Don’t Care 0.4 — 0.4 — 0.5 — n s
tBVKH Byte Write Valid to Clock High 0.6 — 0.7 — 0.8 — ns
tKHBX Clock High to Byte Write Don’t Care 0.4 — 0.4 — 0.5 — ns
tDVKH Data In Valid to Clock High 0.6 — 0.7 — 0.8 — ns
tKHDX Clock High to Data In Don’t Care 0.4 — 0.4 — 0.5 — ns
tadvVKH ADV Valid to Clock High 0.6 — 0.7 — 0.8 — ns
tKHadvX Clock High to ADV Don’t Care 0.4 — 0.4 — 0.5 — ns
Notes:
1. Measured at 100 mV from steady state. Not 100% tested.
2. Guaranteed by design. Not 100% tested.
3. For any specific temperature and voltage tKHCZ < tKHCX1.
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ADVANCE INFORMATION Rev. 00A
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AC ELECTRICAL CHARACTERISTICS
-225 -200
Symbol Parameter Min Max Min Max Unit
tKHKH Clock Cycle Time 4.5 — 5.0 — ns
tKHKL Clock HIGH Time 1.8 — 2.0 — ns
tKLKH Clock LOW Time 1.8 — 2.0 — ns
tKHCX1(2) Clock High to Echo Clock Low-Z 0.5 — 0.5 — ns
tKHCH Clock High to Echo Clock High 0.5 2.5 0.5 3.0 n s
tCHCL(2) Echo Clock High Time
tKHKL ±250 ps tKHKL ±250 ps
ns
tKLCL Clock Low to Echo Clock Low 0.5 2.5 0.5 3.0 ns
tCLCH(2) Echo Clock Low Time
tKLKH ±200 ps tKLKH ±200 ps
ns
tKHCZ(1, 2) Clock High to Echo Clock High-Z — 2.5 — 3.0 ns
tKHQX1(1) Clock High to Output in Low-Z 0.5 — 0.5 — ns
tKHQV Clock High to Output Valid — 2.6 — 3.1 n s
tKHQX Clock High to Output Invalid 0.5 — 0.5 — ns
tKHQZ(1) Clock High to Output in High-Z 0.5 2.6 0.5 3.1 n s
tCHQV(2) Echo Clock High to Output Valid — 0.5 — 0.5 ns
tCHQX(2) Output Invalid to Echo Clock High — –0.5 — –0.5 n s
tAVKH Address Valid to Clock High 1.1 — 1.5 — ns
tKHAX Clock High to Address Don’t Care 0.5 — 0.5 — ns
tEVKH Enable Valid to Clock High 1.1 — 1.5 — n s
tKHEX Clock High to Enable Don’t Care 0.5 — 0.5 — n s
tWVKH Write Valid to Clock High 1.1 — 1.5 — n s
tKHWX Clock High to Write Don’t Care 0.5 — 0.5 — n s
tBVKH Byte Write Valid to Clock High 1.1 — 1.5 — ns
tKHBX Clock High to Byte Write Don’t Care 0.5 — 0.5 — ns
tDVKH Data In Valid to Clock High 1.1 — 1.5 — n s
tKHDX Clock High to Data In Don’t Care 0.5 — 0.5 — ns
tadvVKH ADV Valid to Clock High 1.1 — 1.5 — ns
tKHadvX Clock High to ADV Don’t Care 0.5 — 0.5 — n s
Notes:
1. Measured at 100 mV from steady state. Not 100% tested.
2. Guaranteed by design. Not 100% tested.
3. For any specific temperature and voltage tKHCZ < tKHCX1.
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IS61LSCS25672
IS61LSCS51236 ISSI
®
TIMING PARAMETER KEY—PIPELINED READ CYCLE TIMING
TIMING PARAMETER KEY—DOUBLE LATE WRITE MODE CONTROL AND DATA IN TIMING
Note: tnVKH = tEVKH, tWVKH, tBVKH, etc. and tKHnX = tKHEX, tKHWX, tKHBX, etc.
QB
t
KLKH
t
KHKH
t
KHKL
t
KHQZ
t
KHQX
t
KHQV
t
KHQX1
t
CQHQV
t
KHCQH
t
KHCQX1
t
CQHCQL
t
CQLCQH
t
CQHQX
t
KHCQZ
= CQ High Z
t
KHAX
t
AVKH
CDE
CK
DQ
CQ
B
ABC
CK
A
E1,E2,E3
W, Bn, ADV
t
AVKH
t
KHAX
t
AVKH
t
KHAX
DQ
DA
t
DVKH
t
KHDX
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ADVANCE INFORMATION Rev. 00A
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JTAG PORT OPERATION
Overview
These devices provide a
JTAG
Test Access Port
(TAP)
and
Boundary Scan interface using a limited set of IEEE std.
1149.1 functions. This test mode is intended to provide a
mechanism for testing the interconnect between master
(processor, controller, etc.), SRAMs, other components,
and the printed circuit board.
In conformance with a subset of IEEE std. 1149.1, these
devices contain a TAP Controller and four TAP Registers.
The TAP Registers consist of one Instruction Register
JTAG PIN DESCRIPTIONS
Pin Pin Name I/O Description
TCK Test Clock In Clocks all TAP events. All inputs are captured on the rising edge of TCK and
all outputs propagate from the falling edge of TCK.
TMS Test Mode Select In The TMS input is sampled on the rising edge of TCK. This is the command input
for the TAP controller. An undriven TMS input will produce the same result as
a logic one input level.
TDI Test Data In In The TDI input is sampled on the rising edge of TCK. This is the input side of the
serial registers placed between TDI and TDO. The register placed between TDI
and TDO is determined by the state of the TAP Controller and the instruction
that is currently loaded in the TAP Instruction Register (refer to the TAP
Controller State Diagram). An undriven TDI pin will produce the same result as
a logic one input level.
TDO Test Data Out Out Output that is active depending on the state of the TAP Controller. Output
changes in response to the falling edge of TCK. This is the output side of the
serial registers placed between TDI and TDO.
Note:
This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while
TMS is held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up.
and three Data Registers (ID, Bypass, and Boundary
Scan Registers).
Disabling the JTAG Port
It is possible to use this device without utilizing the JTAG
port. The port is reset at power-up and will remain inactive
unless clocked. To assure normal operation of the RAM
with the
JTAG
Port unused, TCK should be tied Low, TDI
and TMS may be left floating or tied to VCC . TDO should
be left unconnected.
24
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IS61LSCS51236 ISSI
®
JTAG TAP BLOCK DIAGRAM
Bypass Register
Instruction Register
ID Code Register
Boundary Scan Register
. . .
. . . . .
0
2 1 0
31 30 29 2 1 0
n 2 1 0
Test Access Port (TAP) Controller
TDI
TMS
TCK
TDO
JTAG PORT REGISTERS
Overview
The JTAG registers, refered to as Test Access Port (TAP)
registers, are selected (one at a time) via the sequences
of 1s and 0s applied to TMS as TCK is strobed. Each of
the TAP registers are serial shift registers that capture
serial input data on the rising edge of TCK and push serial
data out on the next falling edge of TCK. When a register
is selected, it is placed between the TDI and TDO pins.
Instruction Register
The Instruction Register holds the instructions that are
executed by the TAP controller when it is moved into the
Run, Test/Idle, or the various data register states. In-
structions are 3 bits long. The Instruction Register can be
loaded when it is placed between the TDI and TDO pins.
The Instruction Register is automatically preloaded with
the IDCODE instruction at power-up or whenever the
controller is placed in Test-Logic-Reset state.
Bypass Register
The Bypass Register is a single-bit register that can be
placed between TDI and TDO. It allows serial test data to
be passed through the RAM’s JTAG Port to another
device in the scan chain with as little delay as possible.
Boundary Scan Register
The Boundary Scan Register is a collection of flip flops that can be
preset by the logic level found on the RAM’s input or I/O pins. The
flip flops are then daisy chained together so the levels found can be
shifted serially out of the JTAG Port’s TDO pin. The Boundary Scan
Register also includes a number of place holder flip flops (always set
to a logic 1). The relationship between the device pins and the bits
in the Boundary Scan Register is described in the following Scan
Order Table. The Boundary Scan Register, under the control of the
TAP Controller, is loaded with the contents of the RAMs I/O ring
when the controller is in Capture-DR state and then is placed
between the TDI and TDO pins when the controller is moved to
Shift-DR state. SAMPLE-Z, SAMPLE/PRELOAD and EXTEST
instructions can be used to activate the Boundary Scan Register.
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ADVANCE INFORMATION Rev. 00A
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JTAG TAP CONTROLLER STATE DIAGRAM
Select DR
Capture DR
Shift DR
Exit1 DR
Pause DR
Exit2 DR
Update DR
Select IR
Capture IR
Shift IR
Exit1 IR
Pause IR
Exit2 IR
Update IR
Test Logic Reset
Run Test Idle 11 1
11
11
1
1
11
11
1
0
0
0
0
1
00
0
0
0
0
0
0
0
0
0
10
IDENTIFICATION (ID) REGISTER
The ID Register is a 32-bit register that is loaded with a
device and vendor specific 32-bit code when the controller
is put in Capture-DR state with the IDCODE command
loaded in the Instruction Register. The code is loaded from
a 32-bit on-chip ROM. It describes various attributes of
the RAM as indicated below. The register is then placed
between the TDI and TDO pins when the controller is
moved into Shift-DR state. Bit 0 in the register is the LSB
and the first to reach TDO when shifting begins.
Bit # 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
x72 XXXX00000000000011 0000011010101 1
x36 XXXX00000000000010 0000011010101 1
Presence Register
Die I/ O ISSI Technology
Revision Not Used
Configuration
JEDEC Vendor
Code ID Code
ID REGISTER CONTENTS
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JTAG TAP INSTRUCTION SET SUMMARY
Instruction Code Description
EXTEST(1) 000 Places the Boundary Scan Register between TDI and TDO. When EXTEST is
selected, data will be driven out of the DQ pad.
IDCODE(1,2) 001 Preloads ID Register and places it between TDI and TDO.
SAMPLE-Z(1) 010 Captures I/O ring contents. Places the Boundary Scan Register between TDI
and TDO. Forces all Data and Clock output drivers to High-Z.
RFU(1) 011 Do not use this instruction; Reserved for Future Use. Replicates BYPASS
instruction. Places Bypass Register between TDI and TDO.
SAMPLE/PRELOAD
(1)
100
Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO.
Private(1) 101 Private instruction.
RFU(1) 110 Do not use this instruction; Reserved for Future Use.
BYPASS(1) 111 Places Bypass Register between TDI and TDO.
Notes:
1. Instruction codes expressed in binary, MSB on left, LSB on right.
2. Default instruction automatically loaded at power-up and in Test-Logic-Reset state.
TAP CONTROLLER INSTRUCTION SET
Overview
There are two classes of instructions defined in the
Standard
1149.1-1990
; standard (
public
) instructions, and
device specific (private) instructions.
Some public instructions
are mandatory for
1149.1
compliance. Optional public
instructions must be implemented in prescribed ways.
The TAP on this device may be used to monitor all input
and I/O pads.This device will not perform INTEST but can
preform the preload portion of the SAMPLE/PRELOAD
command.
When the
TAP
controller is placed in
Capture-IR
state, the
two least significant bits of the instruction register are
loaded with 01. When the controller is moved to the
Shift-IR
state, the Instruction Register is placed between TDI and
TDO. In this state the desired instruction is serially loaded
through the TDI input (while the previous contents are
shifted out at TDO). For all instructions, the TAP executes
newly loaded instructions only when the controller is
moved to Update-IR state. The TAP instruction set for this
device is listed in the
JTAG TAP
Instruction Set Summary.
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ADVANCE INFORMATION Rev. 00A
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JTAG DC RECOMMENDED OPERATING CONDITIONS (TA = 0 to 85°C)
Symbol Parameter Test Conditions Min. Max. Unit
VTIH JTAG Input High Voltage 1.2 VCC +0.3 V
VTIL JTAG Input Low Voltage -0.3 0.6 V
VTOH JTAG Output High Voltage CMOS ITOH = -100µΑ VCC-0.1 — V
TTL ITOH = -8mΑVCC-0.4 —
VTOL JTAG Output Low Voltage CMOS ITOL = 100µΑ — 0.1 V
TTL ITOL = 8mΑ— 0.4
ITLI JTAG Input Leakage Current VTIN=GND to VCC -10 10 µΑ
JTAG AC TEST CONDITIONS (VCC = 1.8V ±0.1V, TA = 0 to 85°C)
Symbol Parameter Test Conditions Unit
VTIH JTAG Input High Voltage 1.6 V
VTIL JTAG Input Low Voltage 0.2 V
JTAG Input Rise & Fall Time 1.0 V/ns
JTAG Input Reference Level 0.9 V
JTAG Output Reference Level 0.9 V
JTAG Output Load Condition see AC TEST LOADS
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IS61LSCS25672
IS61LSCS51236 ISSI
®
Symbol Parameter Min Max Unit
tTHTH
TCK Cycle Time
20 — ns
tTHTL
TCK High Pulse Width
8—ns
tTLTH
TCK Low Pulse Width
8—ns
tMVTH TMS Setup Time 5 — ns
tTHMX TMS Hold Time 5 — n s
tDVTH
TDI Set Up Time
5—ns
tTHDX
TDI Hold Time
5—ns
tTLQV
TCK Low to TDO Valid
—10ns
tTLQX
TCK Low to TDO Hold
0—ns
JTAG PORT TIMING DIAGRAM
TCK
TMS
TDI
TDO
t
THTL
t
TLTH
t
THTH
t
MVTH
t
THMX
t
DVTH
t
THDX
t
TLQX
t
TLQV
JTAG PORT AC ELECTRICAL CHARACTERISTICS
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ADVANCE INFORMATION Rev. 00A
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INSTRUCTION DESCRIPTIONS
BYPASS
When the BYPASS instruction is loaded to the Instruction
Register, the Bypass Register is placed between TDI and
TDO. This occurs when the TAP controller is moved to the
Shift-DR state. This allows the board level scan path to be
shortened to facilitate testing of other devices in the scan
path.
SAMPLE/PRELOAD
SAMPLE/PRELOAD
is a Standard 1149.1 mandatory public
instruction. When the
SAMPLE/PRELOAD
instruction is
loaded in the
Instruction Register
, moving the
TAP
controller
into the Capture-DR state loads the data in the RAMs input
and I/O buffers into the Boundary Scan Register. Some
Boundary Scan Register locations are not associated with
an input or I/O pin, and are loaded with the default state
identified in the BSDL file. Because the RAM clock is
independent from the TAP Clock (TCK) it is possible for
the TAP to attempt to capture the I/O ring contents while
the input buffers are in transition (i.e. in a metastable
state). Although allowing the TAP to sample metastable
inputs will not harm the device, repeatable results cannot
be expected. RAM input signals must be stabilized for
long enough to meet the TAP’s input data capture set-up
plus hold time (tTS plus tTH ). The RAM’s clock inputs need
not be paused for any other TAP operation except captur-
ing the I/O ring contents into the Boundary Scan Register.
Moving the controller to Shift-DR state then places the
Boundary Scan Register between the TDI and TDO pins.
EXTEST
EXTEST is an IEEE 1149.1 mandatory public instruction.
It is to be executed whenever the instruction register is
loaded with all logic 0s. The EXTEST command does not
block or override the RAM’s input pins; therefore, the
RAM’s internal state is still determined by its input pins.
Typically, the Boundary Scan Register is loaded with the
desired pattern of data with the SAMPLE/PRELOAD
command. Then the EXTEST command is used to output
the Boundary Scan Register’s contents, in parallel, on the
RAM’s data output drivers on the falling edge of TCK when
the controller is in the Update-IR state.
Alternately, the Boundary Scan Register may be loaded in
parallel using the EXTEST command. When the EXTEST
instruction is selected, the state of all the RAM’s input and
I/O pins, as well as the default values at Scan Register
locations not associated with a pin (pin marked NC), are
transferred in parallel into the Boundary Scan Register on
the rising edge of TCK in the Capture-DR state, the RAM’s
output pins drive out the value of the Boundary Scan
Register location with which each output pin is associated.
IDCODE
The IDCODE instruction causes the ID ROM to be loaded
to the ID register when the controller is in Capture-DR
mode and places the ID register between the TDI and TDO
pins in Shift-DR mode. The IDCODE instruction is the
default instruction loaded in at power up and any time the
controller is placed in the Test-Logic-Reset state.
SAMPLE-Z
If the SAMPLE-Z instruction is loaded to the instruction
register, all RAM outputs are forced to inactive state
(high-Z) and the Boundary Scan Register is connected
between TDI and TDO when the TAP controller is moved
to the Shift-DR state.
RFU
These instructions are reserved for future use. In this
device they replicate the BYPASS instruction.
30
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
ADVANCE INFORMATION Rev. 00A
06/13/02
IS61LSCS25672
IS61LSCS51236 ISSI
®
BOUNDARY SCAN ORDER ASSIGNMENTS (by Exit Sequence) -PH=Place Holder
X72 Ball Loc. X36
Sequence Pkg. Ball Sequence Pkg. Ball
1A0W61A0
2AV72A
3AV83A
4AU84A
5AV95A
6AU66A
7PH
(1) U5 7 PH(1)
8AW78A
9PH
(1) U7 9 PH(1)
10 MCL T6 10 MCL
11 M3 M6 11 M3
12 M4 J6 12 M4
13 MCL K6 13 MCL
14 MCL D6 14 MCL
15 PH(1) C7 15 PH(1)
16 Be C8
17 Ba C9 16 Ba
18 Bb B8 17 Bb
19 Bf B9
20 WB6 18 W
21 ADV A6 19 ADV
22 A B7 20 A
23 E3 A8 21 E3
24 A A9 22 A
25 ZQ F6 23 ZQ
26 A A3 24 A
27 E2 A4 25 E2
28 A A5 26 A
29 A A7 27 A
B5 28 AO36
30 Bc B3 29 Bc
31 Bg B4
32 Bh C3
33 Bd C4 30 Bd
34 PH(1) C5 31 PH(1)
35 CE1C6 32CE1
36 CP2 G6 33 CP2
37 CP3 H6 34 CP3
38 CK K3 35 CK
39 M2 L6 36 M2
Note:
1. Input of PH register connected to Vss.
IS61LSCS25672
IS61LSCS51236 ISSI
®
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
31
ADVANCE INFORMATION Rev. 00A
06/13/02
BOUNDARY SCAN ORDER ASSIGNMENTS (by Exit Sequence) Continued:
X72 Ball Loc. X36
Sequence Pkg. Ball Sequence Pkg. Ball
40 SD N6 37 SD
41 MCL P6 38 MCL
42 A V3 39 A
43 A U4 40 A
44 A V4 41 A
45 A V5 42 A
46 A W5 43 A
47 A V6 44 A
48 DQd W2 45 DQd
49 DQd W1 46 DQd
50 DQd V2 47 DQd
51 DQd V1 48 DQd
52 DQd U2 49 DQd
53 DQd U1 50 DQd
54 DQd T2 51 DQd
55 DQd T1 52 DQd
56 DQPd R1 53 DQPd
57 DQPh R2
58 DQh P2
59 DQh P1
60 DQh N2
61 DQh N1
62 DQh M2
63 DQh M1
64 DQh L2
65 DQh L1
66 CQ2 K2 54 CQ2
67 CQ2 K1 55 CQ2
68 DQc J2 56 DQc
69 DQc J1 57 DQc
70 DQc H2 58 DQc
71 DQc H1 59 DQc
72 DQc G2 60 DQc
73 DQc G1 61 DQc
74 DQc F2 62 DQc
75 DQc F1 63 DQc
76 DQPc E2 64 DQPc
77 DQPg E1
78 DQg D2
79 DQg D1
80 DQg C2
81 DQg C1
32
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
ADVANCE INFORMATION Rev. 00A
06/13/02
IS61LSCS25672
IS61LSCS51236 ISSI
®
BOUNDARY SCAN ORDER ASSIGNMENTS (by Exit Sequence) Continued:
X72 Ball Loc. X36
Sequence Pkg. Ball Sequence Pkg. Ball
82 DQg B2
83 DQg B1
84 DQg A2
85 DQg A1
86 DQb A10 65 DQb
87 DQb A11 66 DQb
88 DQb B10 67 DQb
89 DQb B11 68 DQb
90 DQb C10 69 DQb
91 DQb C11 70 DQb
92 DQb D10 71 DQb
93 DQb D11 72 DQb
94 DQPb E11 73 DQPb
95 DQPf E10
96 DQf F10
97 DQf F11
98 DQf G10
99 DQf G11
100 DQf H10
101 DQf H11
102 DQf J10
103 DQf J11
104 CQ1 K11 74 CQ1
105 CQ1 K10 75 CQ1
106 DQa L10 76 DQa
107 DQa L11 77 DQa
108 DQa M10 78 DQa
109 DQa M11 79 DQa
110 DQa N10 80 DQa
111 DQa N11 81 DQa
112 DQa P10 82 DQa
113 DQa8 P11 83 DQa8
114 DQPa9 R10 84 DQPa9
115 DQPe1 R11
116 DQe2 T10
117 DQe3 T11
118 DQe4 U10
119 DQe5 U11
120 DQe6 V10
121 DQe7 V11
122 DQe8 W10
123 DQe9 W11
IS61LSCS25672
IS61LSCS51236 ISSI
®
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
33
ADVANCE INFORMATION Rev. 00A
06/13/02
ORDERING INFORMATION
Commercial Range: 0°C to 70°C
Frequency Order Part No. Package
256K x 72 200 IS61LSCS25672-200B 209-Ball BGA
225 IS61LSCS25672-225B 209-Ball BGA
250 IS61LSCS25672-250B 209-Ball BGA
300 IS61LSCS25672-300B 209-Ball BGA
333 IS61LSCS25672-333B 209-Ball BGA
512K x 36 200 IS61LSCS51236-200B 209-Ball BGA
225 IS61LSCS51236-225B 209-Ball BGA
250 IS61LSCS51236-250B 209-Ball BGA
300 IS61LSCS51236-300B 209-Ball BGA
333 IS61LSCS51236-333B 209-Ball BGA
Industrial Range: -40°C to 85°C
FrequencySpeed (ns) Order Part No. Package
TBD
