PAGE 1/23
SAMSUNG ELECTRONICS Co.,Ltd
Rev
:
S
SS
S P
PP
P E
EE
E C
CC
C I
II
I F
FF
F I
II
I C
CC
C A
AA
A T
TT
T I
II
I O
OO
O N
NN
N
MODEL : SPSWH2S26S2G
DATE OF ISSUE : 2012.11.19
ISSUE NO
:
WHITE
WHITEWHITE
WHITE SIDE
SIDESIDE
SIDE VIEW
VIEWVIEW
VIEW
CUSTOMER :
SAMSUNG
SAMSUNGSAMSUNG
SAMSUNG ELECTRONICS
ELECTRONICSELECTRONICS
ELECTRONICS CO.,
CO.,CO.,
CO., L
LL
Ltd
tdtd
td.
..
.
SAN
SANSAN
SAN #
##
#2
22
24
44
4 NONGSEO
NONGSEONONGSEO
NONGSEO-
--
-DONG
DONGDONG
DONG,
,,
, GIHEUNG
GIHEUNGGIHEUNG
GIHEUNG-
--
-GU
GUGU
GU,
,,
,
YONGIN
YONGINYONGIN
YONGIN-
--
-SI
SISI
SI,
,,
, GYEONGGI
GYEONGGIGYEONGGI
GYEONGGI-
--
-DO,
DO,DO,
DO, K
KK
KOREA
OREAOREA
OREA,
,,
, 4
44
44
44
46
66
6-
--
-7
77
71
11
11
11
1
SAMSUNGELECTRONICS CO., LTD.
DRAWN CHECKED APPROVED
CUSTOMER
CHECKED CHECKED APPROVED
PAGE 2/23
SAMSUNG ELECTRONICS Co.,Ltd
Contents
1. Product Outline ------------------------------------ 3
2. Absolute Maximum Rating -------------------- 3
3. Characteristics ------------------------------------- 3
4. Chromaticity Diagram --------------------------- 6
5. Typical Characteristic Graph ---------------- 7
6. Outline Drawing And Dimension ---------- 9
7. Package Structure ------------------------------- 10
8. Solder Conditions --------------------------------- 10
9. Reliability Test Items And Conditions -- 11
10. Taping Dimension ------------------------------ 12
11. Label Structure --------------------------------- 13
12. Reel Packing Structure ---------------------- 14
13. Aluminum Packing Bag ---------------------- 15
14. Precaution For Use ---------------------------- 16
15. Hazard Substance Analysis ----------------- 17
16. Revision History -------------------------------- 23
PAGE 3/23
SAMSUNG ELECTRONICS Co.,Ltd
1. Product Outline
1) Product Name :Side View LED (WHITE Color)
2) Features
a. Mini-Mold type : 3.8 * 1.0 * t 0.6
b. Beam Angle(
θ) : 115
0
c. GaN/Al
2
O
3
Chip &Long Time Reliability
3) Applications
-. Mobile Phone, CLP, Back-light, Indicator,etc.
2. Absolute Maximum Rating
1) Operation Forward Current ······················ 30
2) Peak Pulsed Forward Current ·················· 100
3) Reverse Voltage ··································· 5 V
4) Operating Temperature Range(Topr) ··········· -30
85
5) Storage Temperature Range(Tstg) ············· -40
100
6) Reflow Soldering Temperature ···················· 260±5
,max10sec
3. Characteristics
T
a
: 25
Electrical properties
Item Symbol Condition Rank Min. Max. Unit
Forward Voltage V
F
I
F
= 20
I0 2.7 2.9 V
J0 2.9 3.1
Reverse Current I
R
V
R
= 5V 50
PAGE 4/23
SAMSUNG ELECTRONICS Co.,Ltd
Chromaticity coordinate
Rank X Y Rank X Y
TA2
0.2655 0.2412
TG2
0.2859 0.2785
0.2689 0.2474 0.2893 0.2847
0.2689 0.2362 0.2893 0.2743
0.2655 0.2298 0.2859 0.2680
TA3
0.2655 0.2298
TG3
0.2859 0.2680
0.2689 0.2362 0.2893 0.2743
0.2689 0.2248 0.2893 0.2636
0.2655 0.2184 0.2859 0.2571
TB2
0.2689 0.2474
TH2
0.2893 0.2847
0.2723 0.2536 0.2927 0.2909
0.2723 0.2426 0.2927 0.2807
0.2689 0.2362 0.2893 0.2743
TB3
0.2689 0.2362
TH3
0.2893 0.2743
0.2723 0.2426 0.2927 0.2807
0.2723 0.2313 0.2927 0.2700
0.2689 0.2248 0.2893 0.2636
TC2
0.2723 0.2536
TI2
0.2927 0.2909
0.2757 0.2598 0.2961 0.2972
0.2757 0.2489 0.2961 0.2870
0.2723 0.2426 0.2927 0.2807
TC3
0.2723 0.2426
TI3
0.2927 0.2807
0.2757 0.2489 0.2961 0.2870
0.2757 0.2377 0.2961 0.2765
0.2723 0.2313 0.2927 0.2700
TD2
0.2757 0.2598
TJ2
0.2961 0.2972
0.2791 0.2661 0.2995 0.3034
0.2791 0.2553 0.2995 0.2934
0.2757 0.2489 0.2961 0.2870
TD3
0.2757 0.2489
TJ3
0.2961 0.2870
0.2791 0.2553 0.2995 0.2934
0.2791 0.2442 0.2995 0.2830
0.2757 0.2377 0.2961 0.2765
TE2
0.2791 0.2661
TK2
0.2995 0.3034
0.2825 0.2723 0.3029 0.3096
0.2825 0.2616 0.3029 0.2997
0.2791 0.2553 0.2995 0.2934
TE3
0.2791 0.2553
TK3
0.2995 0.2934
0.2825 0.2616 0.3029 0.2997
0.2825 0.2507 0.3029 0.2894
0.2791 0.2442 0.2995 0.2830
TF2
0.2825 0.2723
TL2
0.3029 0.3096
0.2859 0.2785 0.3063 0.3158
0.2859 0.2680 0.3063 0.3061
0.2825 0.2616 0.3029 0.2997
TF3
0.2825 0.2616
TL3
0.3029 0.2997
0.2859 0.2680 0.3063 0.3061
0.2859 0.2571 0.3063 0.2959
0.2825 0.2507 0.3029 0.2894
T
a
: 25
PAGE 5/23
SAMSUNG ELECTRONICS Co.,Ltd
*Tolerance: VF:±0.05V, IV: ±5 %, X,Y:±0.005
*Luminous intensity measuring equipment :CAS140B
T
a
: 25
Luminous Intensity
Rank Symbol Conditions Luminous Intensity Unit
AK
KA
IV I
F
= 20 mA
2500 2550
mcd
KB 2550 2600
AL
LA 2600 2650
LB 2650 2700
AM
MA 2700 2750
MB 2750 2800
AN
NA 2800 2850
NB 2850 2900
AO
OA 2900 2950
OB 2950 3000
PAGE 6/23
SAMSUNG ELECTRONICS Co.,Ltd
4. Chromaticity Diagram
PAGE 7/23
SAMSUNG ELECTRONICS Co.,Ltd
Spectrum Distribution
0
50
100
400 500 600 700
Wave Length(nm
)
Relative Emission
Intensity(%)
Ta=25
IF=20mA
5. Typical Characteristic Graph
T
a
= 25
Ambient Temp. vs.
Chromaticity Coordinate
0.280
0.285
0.290
0.295
0.300
0.305
0.310
0.290 0.295 0.300 0.305 0.310 0.315
X
Y
- 20
0
/15
50
60
80
IF=20mA
- 30
25
PAGE 8/23
SAMSUNG ELECTRONICS Co.,Ltd
Forward Current vs.
Chromaticity Coordinate
0.26
0.262
0.264
0.266
0.268
0.290 0.291 0.292 0.293 0.294 0.295
X
Y
1m
A
10m
A
20m
A
50m
A
100mA
I
F
= 20
Ambient Temp. vs.
Relative Luminous Intensity
50
60
70
80
90
100
110
120
-40 -20 0 20 40 60 80 100
Ambient Temp. (
)
Relative Luminous
Intensity(%)
-20
15
25
50
60
80
-30
0
IF=20m A
Ambient Temp. vs.
Forward Voltage
2.8
2.9
3
3.1
3.2
-40 -20 0 20 40 60 80 100
Ambient Temp. (
)
Forward Voltage
(V)
25
15
50
60
80
-30
-20
0
IF=20mA
PAGE 9/23
SAMSUNG ELECTRONICS Co.,Ltd
6. Outline Drawing and Dimension
unit:mm
Tolerance : ±0.1
Cathode Anode
PAGE 10/23
SAMSUNG ELECTRONICS Co.,Ltd
7. Package Structure
8. Solder Conditions
1) Reflow Conditions(Pb Free)
-. Reflow frequency : 2 times max.
2) For Manual Soldering
Not more than 5seconds @MAX300,under Soldering iron.
No Component Material
Frame Copper frame(Silver plated)
Package Heat-resistant polymer
LED chip GaN/Al
2
O
3
Wire Gold wire
Resin Resin
Phosphor
PAGE 11/23
SAMSUNG ELECTRONICS Co.,Ltd
9. Reliability Test Items and Conditions
1) Test Items and Results
2) Criteria for Judging the Damage
IVL :Initial Value Level
Item Symbol Test Condition Limit
Min Max
Forward Voltage VF IF= 20
-
IVL ×1.2
Luminous Intensity IV IF = 20
IVL ×0.7 -
Test ItemsTest Conditions Test
Hours/Cycles
Sample
No
Room Temperature
Life Test 25
±3
,DC30
500 h 0/50
High Temperature
humidity Life Test 60
±3
, 95%±2%RH, DC 25
500 h 0/50
High Temperature
Life Test 85
±3
,DC 8.5
500 h 0/50
Low Temperature
Life Test -30
±3
,DC 20
1000 h 0/50
Temperature
Humidity Cycle
25
~ 65
~ -10
30mA, 95%RH, 24hrs/1cycle 10 cycles 0/50
On/Off test 85
±3
, 85%±2%RH,
DC 30
,On/2sec, Off/5sec 100k cycles 0/50
Thermal Shock -45
~ 125
30min ~ 30min 100 cycles 0/50
High Temperature
Humidity Storage 60
±3
, 95%±2%RH 1000 h 0/50
High Temperature
Storage Ta=100
±3
1000 h 0/50
Low Temperature
Storage Ta=-40
±3
1000 h 0/50
Reflow Peak 260±5
for 10sec 3times 0/50
Ink Test Reflow(260
)
Keep into ink solution 24h 24h 0/50
ESD(HBM)
-R1:10
,R2:1.5
,C:100
3times
(±2kV)
0/50
PAGE 12/23
SAMSUNG ELECTRONICS Co.,Ltd
10. Taping Dimension
1) Quantity :The quantity/Reel is to be 3000pcs.
2) Cumulative Tolerance :Cumulative tolerance/10 pitches is less than ±0.2
3) Adhesion Strength of Cover Tape :Adhesion strength is to be 0.1-0.7N when the
cover tape is taken off from the carrier tape at 10
°
angle of the carrier tape.
4) Packaging :P/N, manufacturing data code No. and quantity are indicated on a
damp proof package.
More than 40mm
Unloaded tape
Mounted with
Side View LED
Leading part more
than 200~400mm
More than 100~200mm
Unloaded tape
End Start
Polarity
Ø10
30°
Ø22
Ø13
±0.2
2.0
±0.2
Tolerance ±0.2 , Unit:mm
Label
Ø180
±0.3
Ø60
±0.1
Ø13
±0.3
Ø15.4
±1.0
PAGE 13/23
SAMSUNG ELECTRONICS Co.,Ltd
11. Label Structure
: V
F
Rank (refer to page. 3)
:Chromaticity Coordinate Rank (refer to page. 4)
: I
V
Rank (refer to page. 3)
Lot Number
The Lot number is composed of the following characters.
/ I
/ 3000PCS
:Production site (S:SAMSUNG ELECTRONICS,G:Gosin(TIANJIN) China)
: L (LED)
:Product state (A:Normality, B:Bulk, C:First Production, R:Reproduction, S:Sample)
:Year (V:2011, W:2012...)
:Month (1 ~ 9, A, B)
:Day (1 ~ 9, A, B ~ V)
: SAMSUNG ELECTRONICS Product number (1 ~ 999)
:Reel number (1 ~ 999)
Rank Code
SPSWH2S26S2G I0 T A 2 KA 01
III
II
IIIII
II
IIIIIIIIII
IIIIII
IIIIIIII
IIII
IIIIIIII
IIII
IIIIIIII
IIIIII
IIIIIIIIIII
II
IIIIIIIII
GLAU14003 / I001 / 3,000pcs
IIIIIII
II
IIIIIIIIIII
IIIIII
IIIIIIII
II
IIIII
II
IIIII
II
IIIIIII
IIIIII
IIIIIIIIIIIIIIII
I0TA2KA
PAGE 14/23
SAMSUNG ELECTRONICS Co.,Ltd
12. Reel Packing Structure
Outer Box Structure
Aluminum Vinyl Bag
Reel
SIDE
Material :Paper(SW3B(B))
TYPE SIZE(mm)
L W H
7inch 250 225 190
SPSWH2S26S2G I0 T A 2 KA 01
III
II
IIIII
II
IIIIIIIIII
IIIIII
IIIIIIII
IIII
IIIIIIII
IIII
IIIIIIII
IIIIII
IIIIIIIIIII
II
IIIIIIIII
GLAU14003 / I001 / 3,000pcs
IIIIIII
II
IIIIIIIIIII
IIIIII
IIIIIIII
II
IIIII
II
IIIII
II
IIIIIII
IIIIII
IIIIIIIIIIIIIIII
SPSWH2S26S2G I0 T A 2 KA 01
III
II
IIIII
II
IIIIIIIIII
IIIIII
IIIIIIII
IIII
IIIIIIII
IIII
IIIIIIII
IIIIII
IIIIIIIIIII
II
IIIIIIIII
GLAU14003 / I001 / 3,000pcs
IIIIIII
II
IIIIIIIIIII
IIIIII
IIIIIIII
II
IIIII
II
IIIII
II
IIIIIII
IIIIII
IIIIIIIIIIIIIIII
SPSWH2S26S2G I0 T A 2 KA 01
III
II
IIIII
II
IIIIIIIIII
IIIIII
IIIIIIII
IIII
IIIIIIII
IIII
IIIIIIII
IIIIII
IIIIIIIIIII
II
IIIIIIIII
GLAU14003 / I001 / 3,000pcs
IIIIIII
II
IIIIIIIIIII
IIIIII
IIIIIIII
II
IIIII
II
IIIII
II
IIIIIII
IIIIII
IIIIIIIIIIIIIIII
[Box Label]
I0TA2KA
I0TA2KA
I0TA2KA
LED
SIDE
H
W
L
PAGE 15/23
SAMSUNG ELECTRONICS Co.,Ltd
13. Aluminium Packing Bag
SPSWH2S26S2G I0 T A 2 KA 01
III
II
IIIII
II
IIIIIIIIII
IIIIII
IIIIIIII
IIII
IIIIIIII
IIII
IIIIIIII
IIIIII
IIIIIIIIIII
II
IIIIIIIII
GLAU14003 / I001 / 3,000pcs
IIIIIII
II
IIIIIIIIIII
IIIIII
IIIIIIII
II
IIIII
II
IIIII
II
IIIIIII
IIIIII
IIIIIIIIIIIIIIII
I0TA2KA
PAGE 16/23
SAMSUNG ELECTRONICS Co.,Ltd
14. Precaution for Use
1) For over-current-proof function, customers are recommended to apply resistors to prevent
sudden change of the current caused by slight shift of the voltage.
 
2) This device should not be used in any type of fluid such as
 
water, oil, organic solvent, etc.
When washing is required, IPA is recommended to use.
 
3) When the LEDs illuminate, operating current should be decided after considering the
ambient maximum temperature.
 
4) LEDs must be stored in aclean environment.
If the LEDs are to be stored for 3months or more after being shipped from SEC(LED),
they should be packed by asealed container with nitrogen gas injected.
(Shelf life of sealed bags: 12 months, temp. 0~40
, 20~70%RH)
 
5) After storage bag is open, device subjected to soldering, solder reflow,or other high
temperature processes must be:
a. Mounted within 168 hours (7 days) at an assembly line with acondition of no
more than 30
/60%RH,
b. Stored at <10% RH
6) Repack unused Products with anti-moisture packing, fold to close any opening and then
store in adry place.
 
7) Devices require baking before mounting, if humidity card reading is >60% at 23±5
.
  
 
8) Devices must be baked for 24hours at 65±5
, if baking is required.
 
9) TheLEDs are sensitive to the static electricity and surge. It is recommended to use a
wrist band or anti-electrostatic glove when handling the LEDs.
If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause
damage or even destruction to LED devices.
Damaged LEDs may show some unusual characteristics such as increase in leak current,
lowered turn-on voltage, or abnormal lighting of LEDs at low current.
 
10) Reflow soldering should not be done more than two times.
a. Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable, it should do repairing less than 10 seconds within 250
for one times.
b. Reflow soldering should not be done more than two times.
c. When soldering, do not put stress on the LEDs during heating.
PAGE 17/23
SAMSUNG ELECTRONICS Co.,Ltd
15. Hazard Substance Analysis
PAGE 18/23
SAMSUNG ELECTRONICS Co.,Ltd
PAGE 19/23
SAMSUNG ELECTRONICS Co.,Ltd
PAGE 20/23
SAMSUNG ELECTRONICS Co.,Ltd
PAGE 21/23
SAMSUNG ELECTRONICS Co.,Ltd
PAGE 22/23
SAMSUNG ELECTRONICS Co.,Ltd
PAGE 23/23
SAMSUNG ELECTRONICS Co.,Ltd
Date Revision History Writer
Drawn Approved
2012.11.19 -. NEW Version S.Y. AN H.Y.SONG
Revision History
(Model:SPSWH2S26S2G)