PRELIMINARY DATA SHEET BIPOLAR DIGITAL INTEGRATED CIRCUIT PB1512TU 13 GHz INPUT DIVIDE BY 8 PRESCALER IC FOR SATELLITE COMMUNICATIONS DESCRIPTION The PB1512TU is a silicon germanium (SiGe) monolithic integrated circuit designed as a divide by 8 prescaler IC for satellite communications and point-to-point/multi-point radios. The package is 8-pin lead-less minimold suitable for surface mount. This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Process) silicon bipolar process. FEATURES * Operating frequency : fin = 5 to 13 GHz * Low current consumption : ICC = 48 mA @ VCC = 5.0 V * High-density surface mounting : 8-pin lead-less minimold * Supply voltage : VCC = 4.5 to 5.5 V * Division ratio :8 APPLICATIONS * Point-to-point/Multi-point radios * VSAT radios ORDERING INFORMATION Part Number Order Number PB1512TU-E2 PB1512TU-E2-A Package 8-pin lead-less minimold (Pb-Free) Note Marking 1512 Supplying Form * 8 mm wide embossed taping * Pin 5, 6, 7, 8 indicates pull-out direction of tape * Qty 5 kpcs/reel Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PB1512TU Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PU10537EJ01V0DS (1st edition) Date Published October 2004 CP(K) Printed in Japan NEC Compound Semiconductor Devices, Ltd. 2004 PB1512TU INTERNAL BLOCK DIAGRAM AND PIN CONNECTIONS (Top View) 1 Regulator Pin Name 1 VCC1 2 IN 3 GND 4 IN 5 OUT 6 GND 7 OUT 8 VCC2 7 2 3 8 Pin No. 1/2 1/2 1/2 6 5 4 SYSTEM APPLICATION EXAMPLE LNA Down-Converter PB1512TU 13 GHz Prescaler 1/8 PLL Diplexer PA 2 Up-Converter Preliminary Data Sheet PU10537EJ01V0DS PB1512TU PIN EXPLANATION Pin No. Pin Name Applied Voltage Function and Applications (V) 1 VCC1 5 Power supply pin. This pin must be equipped with bypass capacitor (example : 100 pF and 10 nF) to minimize ground impedance. 2 IN - Signal input pin. This pin should be coupled to signal source with capasitor (example : 100 pF) for DC cut. 3 GND 0 Ground pin. Ground pattern on the board should be formed as widely as possible to minimize ground impedance. 4 IN - Signal input bypass pin. This pin must be equipped with bypass capacitor (example : 100 pF) to minimize ground impedance. 5 OUT - Divided frequency output pin. This pin shoud be coupled to load device with capasitor (example : 100 pF) for DC cut. 6 GND 0 Ground pin. Ground pattern on the board should be formed as widely as possible to minimize ground impedance. 7 OUT - Divided frequency output pin. This pin should be coupled to load device with capasitor (example : 100 pF) for DC cut. 8 VCC2 5 Power supply pin. This pin must be equipped with bypass capacitor (example : 100 pF and 10 nF) to minimize ground impedance. Preliminary Data Sheet PU10537EJ01V0DS 3 PB1512TU ABSOLUTE MAXIMUM RATINGS Parameter Symbol Test Conditions Ratings Unit 6 V Supply Voltage VCC TA = +25C Total Power Dissipation PD TA = +85C Note 867 mW Rth(j-c) TA = +85C Note 75 C/W Thermal Resistance (junction to ground paddle) Operating Ambient Temperature TA -40 to +85 C Storage Temperature Tstg -55 to +150 C Note Mounted on 33 x 21 x 0.4 mm polyimide PCB, with copper patterning on both sides. RECOMMENDED OPERATING RANGE Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VCC 4.5 5.0 5.5 V Operating Ambient Temperature TA -40 +25 +85 C ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5 V, TA = -40 to +85C, ZS = ZL = 50 ) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Circuit Current ICC No Signals - 48 75 mA Input Sensitibity Pin1 fin = 5 to 6 GHz -8 - -5 dBm Pin2 fin = 6 to 12 GHz -8 - 0 dBm Pin3 fin = 12 to 13 GHz -5 - 0 dBm fin = 5 to 13 GHz, single ended, -11 -4.5 2 dBm Output Power Pout Pin = -5 dBm 4 Preliminary Data Sheet PU10537EJ01V0DS PB1512TU TYPICAL CHARACTERISTICS (TA = +25C, unless otherwise specified) INPUT SENSITIVITY vs. FREQUENCY OUTPUT POWER vs. FREQUENCY 15 5 0 Guaranteed operating range -5 -10 -15 -20 -25 -30 -35 0 5 10 VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V 15 20 Output Power Pout (dBm) Input Sensitivity Pin (dBm) 10 3 2 Pin = -5 dBm 1 0 -1 Guaranteed operating range -2 -3 -4 -5 -6 -7 -8 -9 -10 -11 -12 0 5 10 Frequency f (GHz) Frequency f (GHz) OUTPUT POWER vs. FREQUENCY INPUT SENSITIVITY vs. FREQUENCY 15 VCC = 3.0 V 5 0 Output Power Pout (dBm) Input Sensitivity Pin (dBm) 10 Guaranteed operating range -5 -10 -15 -20 -25 -30 -35 0 TA = -40C TA = +25C TA = +85C 5 10 VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V 15 20 15 20 3 2 VCC = 3.0 V 1 Pin = -5 dBm 0 -1 Guaranteed -2 operating range -3 -4 -5 -6 -7 -8 -9 -10 -11 -12 0 5 10 Frequency f (GHz) TA = -40C TA = +25C TA = +85C 15 20 Frequency f (GHz) Remark The graphs indicate nominal characteristics. Preliminary Data Sheet PU10537EJ01V0DS 5 PB1512TU MEASUREMENT CIRCUIT 100 pF 10 nF 5V 8 1 Power Supply 100 pF 50 VCC1 VCC2 IN OUT GND GND 2 7 6 3 50 5 4 IN Signal Generator 100 pF 100 pF 51 OUT 100 pF Spectrum Analyzer 51 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 6 Preliminary Data Sheet PU10537EJ01V0DS PB1512TU ILLUSTRATION OF THE MEASUREMENT CIRCUIT ASSEMBLED ON EVALUATION BOARD 100 pF 100 pF 10 nF 8 7 6 5 1 2 3 4 100 pF 100 pF 51 100 pF 51 Remarks 1. 33 x 21 x 0.4 mm double-sided copper-clad polyimide PCB 2. Back side: GND pattern 3. Solder plated on pattern 4. 5. represents cutout : Through holes Preliminary Data Sheet PU10537EJ01V0DS 7 PB1512TU PACKAGE DIMENSIONS 8-PIN LEAD-LESS MINIMOLD (UNIT: mm) (Top View) (Bottom View) (0.65) (0.65) (0.6) (0.3) 3 4 8 0.40.1 (0.6) 7 0.40.1 2 6 (1.4) 1 5 (0.35) (0.35) 5 (0.35)(0.35) 6 (0.5) (0.5) 7 (0.6) 8 2.00.1 2.20.05 2.00.1 0.160.05 8 0.125+0.1 -0.05 0.50.03 (0.25) (0.25) (0.75) 4 Preliminary Data Sheet PU10537EJ01V0DS 3 (0.75) 2 1 PB1512TU NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). (3) Keep the track length of the ground terminals as short as possible. (4) Bypass capacitance must be attached to VCC line. (5) Exposed heat sink at bottom on package must be soldered to PCB RF/DC ground. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260C or below Time at peak temperature : 10 seconds or less Time at temperature of 220C or higher : 60 seconds or less Preheating time at 120 to 180C : 12030 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260C or below Time at peak temperature : 10 seconds or less IR260 WS260 Preheating temperature (package surface temperature) : 120C or below Partial Heating Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Preliminary Data Sheet PU10537EJ01V0DS 9 PB1512TU The export of this product from Japan is prohibited without governmental license. To export or re-export this product from a country other than Japan may also be prohibited without a license from that country. Please call an NEC Compound Semiconductor Devices sales representative. * The information in this document is current as of October, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. 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M8E 00. 4 - 0110 10 Preliminary Data Sheet PU10537EJ01V0DS PB1512TU For further information, please contact NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) FAX: +852-3107-7309 TEL: +852-3107-7303 Hong Kong Head Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Taipei Branch Office FAX: +82-2-558-5209 TEL: +82-2-558-2120 Korea Branch Office NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0406