PRELIMINARY DATA SHEET
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
BIPOLAR DIGITAL INTEGRATED CIRCUIT
µ
PB1512TU
13 GHz INPUT DIVIDE BY 8 PRESCALER IC
FOR SATELLITE COMMUNICATIONS
Document No. PU10537EJ01V0DS (1st edition)
Date Published October 2004 CP(K)
Printed in Japan
NEC Compound Semiconductor Devices, Ltd. 2004
DESCRIPTION
The
µ
PB1512TU is a silicon germanium (SiGe) monolithic integrated circuit designed as a divide by 8 prescaler IC
for satellite communications and point-to-point/multi-point radios.
The package is 8-pin lead-less minimold suitable for surface mount.
This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Process) silicon bipolar process.
FEATURES
• Operating frequency : fin = 5 to 13 GHz
• Low current consumption : ICC = 48 mA @ VCC = 5.0 V
• High-density surface mounting : 8-pin lead-less minimold
• Supply voltage : VCC = 4.5 to 5.5 V
• Division ratio : 8
APPLICATIONS
• Point-to-point/Multi-point radios
• VSAT radios
ORDERING INFORMATION
Part Number Order Number Package Marking Supplying Form
µ
PB1512TU-E2
µ
PB1512TU-E2-A 8-pin lead-less minimold
(Pb-Free) Note
1512 • 8 mm wide embossed taping
• Pin 5, 6, 7, 8 indicates pull-out direction of tape
• Qty 5 kpcs/reel
Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact
your nearby sales office.
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order:
µ
PB1512TU
Preliminary Data Sheet PU10537EJ01V0DS
2
µ
PB1512TU
INTERNAL BLOCK DIAGRAM AND PIN CONNECTIONS
Pin No. Pin Name
1 VCC1
2 IN
3 GND
4 IN
5 OUT
6 GND
7 OUT
(Top View)
2
3
4
1
7
6
5
8
Regulator
1/2 1/2 1/2
8 VCC2
SYSTEM APPLICATION EXAMPLE
PLL
13 GHz Prescaler
1/8
PB1512TU
µ
LNA Down-Converter
Up-ConverterPA
Diplexer
Preliminary Data Sheet PU10537EJ01V0DS 3
µ
PB1512TU
PIN EXPLANATION
Pin No. Pin Name Applied Voltage
(V)
Function and Applications
1 VCC1 5 Power supply pin.
This pin must be equipped with bypass capacitor (example : 100 pF and 10 nF) to
minimize ground impedance.
2 IN − Signal input pin.
This pin should be coupled to signal source with capasitor (example : 100 pF) for
DC cut.
3 GND 0 Ground pin.
Ground pattern on the board should be formed as widely as possible to minimize
ground impedance.
4 IN − Signal input bypass pin.
This pin must be equipped with bypass capacitor (example : 100 pF) to minimize
ground impedance.
5 OUT − Divided frequency output pin.
This pin shoud be coupled to load device with capasitor (example : 100 pF) for DC
cut.
6 GND 0 Ground pin.
Ground pattern on the board should be formed as widely as possible to minimize
ground impedance.
7 OUT − Divided frequency output pin.
This pin should be coupled to load device with capasitor (example : 100 pF) for DC
cut.
8 VCC2 5 Power supply pin.
This pin must be equipped with bypass capacitor (example : 100 pF and 10 nF) to
minimize ground impedance.
Preliminary Data Sheet PU10537EJ01V0DS
4
µ
PB1512TU
ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Test Conditions Ratings Unit
Supply Voltage VCC TA = +25°C 6 V
Total Power Dissipation PD TA = +85°C Note 867 mW
Thermal Resistance
(junction to ground paddle)
Rth(j-c) TA = +85°C Note 75 °C/W
Operating Ambient Temperature TA −40 to +85 °C
Storage Temperature Tstg −55 to +150 °C
Note Mounted on 33 × 21 × 0.4 mm polyimide PCB, with copper patterning on both sides.
RECOMMENDED OPERATING RANGE
Parameter Symbol MIN. TYP. MAX. Unit
Supply Voltage VCC 4.5 5.0 5.5 V
Operating Ambient Temperature TA −40 +25 +85 °C
ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5 V, TA = −40 to +85°C, ZS = ZL = 50 Ω)
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
Circuit Current ICC No Signals − 48 75 mA
Input Sensitibity Pin1 fin = 5 to 6 GHz −8 − −5 dBm
Pin2 fin = 6 to 12 GHz −8 − 0 dBm
Pin3 fin = 12 to 13 GHz −5 − 0 dBm
Output Power Pout fin = 5 to 13 GHz, single ended,
Pin = −5 dBm
−11 −4.5 2 dBm
Preliminary Data Sheet PU10537EJ01V0DS 5
µ
PB1512TU
TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified)
3
2
1
0
–1
–2
–3
–4
–5
–6
–7
–8
–9
–10
–11
–120 5 10 15 20
15
10
5
0
–5
–10
–15
–20
–25
–30
–350 5 10 15 20
Output Power P
out
(dBm)
Frequency f (GHz)
Input Sensitivity P
in
(dBm)
Frequency f (GHz)
INPUT SENSITIVITY vs. FREQUENCY OUTPUT POWER vs. FREQUENCY
V
CC
= 4.5 V
V
CC
= 5.0 V
V
CC
= 5.5 V
Guaranteed
operating
range
V
CC
= 4.5 V
V
CC
= 5.0 V
V
CC
= 5.5 V
P
in
=
–
5 dBm
Guaranteed
operating range
15
10
5
0
–5
–10
–15
–20
–25
–30
–35
0 5 10 15 20
T
A
=
–
40˚C
T
A
=
+
25˚C
T
A
=
+
85˚C
V
CC
=
3.0
V
Input Sensitivity P
in
(dBm)
Frequency f (GHz)
INPUT SENSITIVITY vs. FREQUENCY
Guaranteed
operating
range
3
2
1
0
–1
–2
–3
–4
–5
–6
–7
–8
–9
–10
–11
–120 5 10 15 20
T
A
=
–
40˚C
T
A
=
+
25˚C
T
A
=
+
85˚C
V
CC
=
3.0
V
P
in
=
–
5 dBm
Output Power P
out
(dBm)
Frequency f (GHz)
OUTPUT POWER vs. FREQUENCY
Guaranteed
operating range
Remark The graphs indicate nominal characteristics.
Preliminary Data Sheet PU10537EJ01V0DS
6
µ
PB1512TU
MEASUREMENT CIRCUIT
IN
GND
IN
V
CC
1
2
3
4
1
7
6
5
8
100 pF
50 Ω
Spectrum Analyzer
100 pF
51 Ω
100 pF
51 Ω
100 pF
Signal Generator
50 Ω
OUT
GND
OUT
V
CC
2
5 V
Power Supply
100 pF 10 nF
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
Preliminary Data Sheet PU10537EJ01V0DS 7
µ
PB1512TU
ILLUSTRATION OF THE MEASUREMENT CIRCUIT ASSEMBLED ON EVALUATION BOARD
51 Ω
51 Ω
100 pF
10 nF
100 pF
100 pF
100 pF
100 pF
1
2
3
4
8
7
6
5
Remarks 1. 33 × 21 × 0.4 mm double-sided copper-clad polyimide PCB
2. Back side: GND pattern
3. Solder plated on pattern
4. represents cutout
5.
: Through holes
Preliminary Data Sheet PU10537EJ01V0DS
8
µ
PB1512TU
PACKAGE DIMENSIONS
8-PIN LEAD-LESS MINIMOLD (UNIT: mm)
123 4
8 76 5
2.2±0.05
2.0±0.1
(Top View)
0.5±0.03
4 3 2 1
56 78
0.4±0.1
0.4±0.1
(1.4)
(0.75)
(0.75)
(0.25) (0.25)
0.16±0.05
(Bottom View)
2.0±0.1
(0.35)
(0.35)
(0.35)(0.35)
(0.5)(0.5)
(0.6)(0.6)
(0.65)(0.65)
(0.6)
(0.3)
0.125
+0.1
–0.05
Preliminary Data Sheet PU10537EJ01V0DS 9
µ
PB1512TU
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the track length of the ground terminals as short as possible.
(4) Bypass capacitance must be attached to VCC line.
(5) Exposed heat sink at bottom on package must be soldered to PCB RF/DC ground.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method Soldering Conditions Condition Symbol
Infrared Reflow Peak temperature (package surface temperature) : 260°C or below
Time at peak temperature : 10 seconds or less
Time at temperature of 220°C or higher : 60 seconds or less
Preheating time at 120 to 180°C : 120±30 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
IR260
Wave Soldering Peak temperature (molten solder temperature) : 260°C or below
Time at peak temperature : 10 seconds or less
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
WS260
Partial Heating Peak temperature (terminal temperature) : 350°C or below
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Preliminary Data Sheet PU10537EJ01V0DS
10
µ
PB1512TU
The export of this product from Japan is prohibited without governmental license. To export or re-export this product from
a country other than Japan may also be prohibited without a license from that country.
Please call an NEC Compound Semiconductor Devices sales representative.
M8E 00. 4 - 0110
The information in this document is current as of October, 2004. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
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Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
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(Note)
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•
•
•
•
•
•
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)
Hong Kong Head Office
Taipei Branch Office
Korea Branch Office
TEL: +852-3107-7303
TEL: +886-2-8712-0478
TEL: +82-2-558-2120
FAX: +852-3107-7309
FAX: +886-2-2545-3859
FAX: +82-2-558-5209
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TEL: +49-211-6503-0 FAX: +49-211-6503-1327
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TEL: +1-408-988-3500 FAX: +1-408-988-0279
0406
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E-mail: salesinfo@ml.ncsd.necel.com (sales and general)
techinfo@ml.ncsd.necel.com (technical)
Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579
For further information, please contact
µ
PB1512TU
