PL IA NT Features CO M *R oH S Industry standard surface mount device RoHS compliant* Output voltage programmable from 0.75 Vdc to 5.0 Vdc via external resistor Up to 5 A output current Up to 92 % efficiency Small size, low profile Cost-efficient open frame design Low output ripple and noise High reliability Remote on/off Output overcurrent protection (non-latching) Constant switching frequency (300 kHz) Wide operating temperature range MX5A-12SA SMT Non-Isolated Power Module How to Order Description M X 5A - 12 S A Bourns(R) MX5A-12SA is a non-isolated DC-DC converter offering designers a cost and space-efficient solution with standard features such as remote on/off, precisely regulated programmable output voltage and overcurrent and overtemperature protection. These modules deliver up to 5 A of output current with load efficiency of 92 % at 5 V output. Configuration * M = Surface Mount Device Internal Identifier Output Current (Amps) Input Voltage (V) Outputs * S = Single Output Voltage (V) * A = Adjustable Fixed output voltage parts and optional features available; contact factory. Absolute Maximum Ratings Stress in excess of absolute maximum ratings may cause permanent damage to the device. Device reliability may be affected if exposed to absolute maximum ratings for extended time periods. Characteristic Min. Max. Units Continuous Input Voltage -0.3 15.0 Vdc Operating Temperature Range -40 +85 C Storage Temperature -55 +125 C Notes & Conditions See Thermal Considerations section Electrical Specifications Unless otherwise specified, specifications apply over all input voltage, resistive load and temperature conditions. Characteristic Min. Operating Input Voltage Maximum Input Current Nom. Max. Units 10.0 14.0 - 3.5 Vdc Adc Over Vin range, Io max, Vout = 5 Vdc 26 70 mA mA Vin = 12 Vdc, Io = 0 A, mod. enabled, -Vout = 0.75 Vdc -Vout = 5.0 Vdc 1.6 mA Vin = 5.0 Vdc, module disabled Input No Load Current Input Stand-by Current Inrush Transient 0.4 Notes & Conditions A2s Input Reflected Ripple Current 40 mAp-p Input Ripple Rejection 30 dB 120 Hz Caution: The power modules are not internally fused. An external input line fast-blow fuse with a maximum rating of 6 A is required. See the Safety Considerations section of this data sheet. Applications Intermediate Bus architecture Distributed power applications Workstations and servers Telecom equipment Enterprise networks including LANs/WANs Latest generation ICs (DSP, FPGA, ASIC) and microprocessor powered applications *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Specifications are subject to change without notice. Customers should verify device performance in their specific applications. 1 MX5A-12SA SMT Non-Isolated Power Module Electrical Specifications (Continued) Characteristic Min. Output Voltage Setpoint Accuracy Output Voltage Tolerance Voltage Adjustment Range Nom. Max. Units -2.0 2.0 % Vo,set Vin min, Io max, TA = 25 C -3.0 3.0 % Vo,set Over all rated in out voltage, load and temperature conditions 0.7525 5.5 Line Regulation 0.3 Vdc % Vo,set Load Regulation 0.3 % Vo,set Temperature Regulation Output Current 0.4 0.0 Output Current Limit Inception (Hiccup Mode) Output Short Circuit Current 2 Output Ripple and Noise Voltage RMS Peak-to-Peak 15 30 External Capacitance - ESR 1 m - ESR 10 m Notes & Conditions % Vo,set 5.0 Adc 200 % Io max Adc 30 75 mVrms mVpk-pk 1000 3000 F F Vo 250 mV - Hiccup Mode 1 F ceramic/10 F tantalum capacitors 5 Hz to 20 MHz bandwidth Efficiency (Vin = 5 Vdc, TA= 25 C, Full Load) 81.5 84.0 85.0 87.0 89.0 92.0 % % % % % % Vo,set = 1.2 Vdc Vo,set = 1.5 Vdc Vo,set = 1.8 Vdc Vo,set = 2.5 Vdc Vo,set = 3.3 Vdc Vo,set = 5.0 Vdc Switching Frequency 300 kHz Dynamic Load Response 2.5 A to 5 A; 5 A to 2.5 A; (i/t = 2.5 A/s; 25 C) 200 25 mV s 1 F ceramic/10 F tantalum capacitor Peak Deviation Settling Time (Vo<10 % peak deviation) 2.5 A to 5 A; 5 A to 2.5 A; (i/t = 2.5 A/s; 25 C) 75 50 mV s 2 x 150 F polymer capacitors Peak Deviation Settling Time (Vo<10 % peak deviation) General Specifications Characteristic Calculated MTBF Weight 2 Nom. Units 10,000,000 hours 2.2 (0.08) g (oz.) Notes & Conditions Specifications are subject to change without notice. Customers should verify device performance in their specific applications. MX5A-12SA SMT Non-Isolated Power Module Feature Specifications Characteristic Min. Remote Enable Open = On (Logic Low) Low = Off (Logic High) >2.5 Turn-On Delay and Rise Times Case 1: On/Off Low - Vin Applied Case 2: Vin Applied, then On/Off Set Low Case 3: Output Voltage Rise Nom. Max. Units 0.4 14 Vdc Vdc 2.5 2.5 3.0 Output Voltage Overshoot 1 10 A max. 1 mA max. msec msec msec (10 %-90 % of Vo setting) % Vo, set Io max, Vin=5.5, TA=25 C Overtemperature Protection 135 C Input Undervoltage Lockout -Turn-on Threshold -Turn-off Threshold 8.2 8.0 V V Specifications are subject to change without notice. Customers should verify device performance in their specific applications. Notes & Conditions See Thermal Consideration section 3 MX5A-12SA SMT Non-Isolated Power Module Characteristic Curves The curves provided below are typical characteristics for the MX5A-12SA modules at 25 C. For any specific test configurations or any specific test requests, please contact Bourns. 100.0 100.0 Vin=14 V Vin=12 V Vin=10 V 90.0 85.0 80.0 75.0 70.0 1.0 2.0 3.0 Output Current (A dc) 5.0 4.0 Vin=14 V Vin=12 V Vin=10 V 95.0 Efficiency (%) Efficiency (%) 2.0 3.0 Output Current (A dc) 100.0 90.0 85.0 80.0 90.0 85.0 80.0 75.0 75.0 2.0 3.0 Output Current (A dc) 70.0 1.0 5.0 4.0 Fig. 2 Efficiency vs. Output Current (Vout = 1.5 Vdc ) 100.0 2.0 3.0 Output Current (A dc) 100.0 95.0 Efficiency (%) 90.0 85.0 80.0 75.0 90.0 85.0 80.0 Vin=14 V Vin=12 V Vin=10 V 75.0 2.0 3.0 Output Current (A dc) 4.0 Fig. 3 Efficiency vs. Output Current (Vout = 1.8 Vdc ) 5.0 4.0 Fig. 5 Efficiency vs. Output Current (Vout = 3.3 Vdc ) Vin=14 V Vin=12 V Vin=10 V 95.0 Efficiency (%) 80.0 Fig. 4 Efficiency vs. Output Current (Vout = 2.5 Vdc ) Vin=14 V Vin=12 V Vin=10 V 95.0 4 85.0 70.0 1.0 5.0 4.0 100.0 70.0 1.0 90.0 75.0 Fig. 1 Efficiency vs. Output Current (Vout = 1.2 Vdc ) 70.0 1.0 Vin=14 V Vin=12 V Vin=10 V 95.0 Efficiency (%) Efficiency (%) 95.0 5.0 70.0 1.0 2.0 3.0 Output Current (A dc) 4.0 5.0 Fig. 6 Efficiency vs. Output Current (Vout = 5.0 Vdc ) Specifications are subject to change without notice. Customers should verify device performance in their specific applications. MX5A-12SA SMT Non-Isolated Power Module Output Voltage Vo (100 mV/div) Characteristic Curves (Continued) 4.00 2.00 Iin, Adc Vo, Vdc 0.00 6.00 Output Current Io (1.3 A/div) Input Current (A)/ Output Voltage (Vdc) 6.00 12.00 8.00 10.00 Input Voltage (Vdc ) Fig. 7 Input Voltage vs. Io and Vo (Vo = 2.5 Vdc , Io= 6.0 A) Output Voltage: 100 mVolt 5 s Output Current (1.3 A/Div): 2 Volt 5 s Time (5 s/div) Full Load: 10 mVolt 2.5 s No Load: 10 mVolt 2.5 s Half Load: 10 mVolt 2.5 s Output Current Io (1.3 A/div) Output Voltage Vo (10 mV/div) Output Voltage Vo (100 mV/div) Fig. 10 Transient Response - 2.5 A - 5 A Step (Vo = 3.3 Vdc ) Output Voltage: 100 mVolt 5 s Output Current (1.3 A/Div): 2 Volt 5 s Time (5 s/div) Fig. 11 Transient Response - 5 A - 2.5 A Step (Vo = 3.3 Vdc ) Full Load: 50 mVolt 2.5 s No Load: 50 mVolt 2.5 s Half Load: 50 mVolt 2.5 s Time (2.5 s/div) Fig. 9 Typical Output Ripple and Noise (Vin = 12.0 V, Vo = 3.3 V, Io = 5.0 A) Specifications are subject to change without notice. Customers should verify device performance in their specific applications. Output Current Io (0.9 A/div) Output Voltage Vo (50 mV/div) Output Voltage Vo (100 mV/div) Time (2.5 s/div) Fig. 8 Typical Output Ripple and Noise (Vin = 12.0 V, Vo = 0.75 V, Io = 5.0 A) Output Voltage: 100 mVolt 10 s Output Current (0.9 A/Div): 2 Volt 10 s Time (10 s/div) Fig. 12 Transient Response - 2.5 A - 5 A Step (Vin = 12.0 V, Vo = 12 Vdc , Cext = 2x100 F Polymer Capacitors) 5 MX5A-12SA SMT Non-Isolated Power Module Input Voltage Vin (5 V/div) Output Voltage Vo (100 mV/div) Characteristic Curves (Continued) ?? Output Voltage: 100 mVolt 10 s Output Current (0.9 A/Div): 2 Volt 10 s ??? Output Voltage Vo (1 V/div) Output Current Io (0.9 A/div) ??? On/Off Voltage Von/off (5 V/div) On/Off Voltage Von/off (5 V/div) Output Voltage Vo (0.5 V/div) Time (1 ms/div) Fig. 16 Typical Start-up with Application of Vin (Vin = 12 Vdc , Vo = 3.3 Vdc , Io = 5 A) Output Voltage Vo (1 V/div) Time (5 s/div) Fig. 13 Transient Response - 5 A - 2.5 A Step (Vin = 12 Vdc ,Vo = 3.3 Vdc , Cext = 2x100 F Polymer Caps) ?? Output Voltage: 1 Volt 1 ms Input Voltage: 5 Volt 1 ms ??? Output Voltage: 1 Volt 1 ms On/Off Voltage: 5 Volt 1 ms ?? Time (1 ms/div) Fig. 17 Typical Start-up using Remote On/Off with Prebias (Vin = 12 Vdc , Vo = 1.8 Vdc , Io = 1 A, Vbias = 1 Vdc ) ?? Output Current Io (4 A/div) Output Voltage Vo (1 V/div) On/Off Voltage Von/off (5 V/div) Time (1 ms/div) Fig. 14 Typical Start-up using Positive Remote On/Off (Vin = 12 Vdc, Vo = 3.3 Vdc, I o = 5 A) Output Voltage: 500 mVolt 1 ms On/Off Voltage: 5 Volt 1 ms ?? Output Voltage: 1 Volt 1 ms On/Off Voltage: 5 Volts 1 ms Time (1 ms/div) Fig. 15 Typical Start-up using Negative Remote On/Off with Low-ESR External Capacitors (10x100 F Polymer) Output Current (4 A/div): 20 mVolt 25 ms Time (5 ms/div) Fig. 18 Output Short Circuit Current (Vin = 12.0 Vdc , Vo = 0.75 Vdc ) (Vin = 12 Vdc , V o = 3.3 Vdc , Io = 5.0 A, Co = 1000 F) 6 Specifications are subject to change without notice. Customers should verify device performance in their specific applications. MX5A-12SA SMT Non-Isolated Power Module Characteristic Curves (Continued) 7 6 6 200 LFM 200 LFM 5 Output Current (A) Output Current (A) 5 0 LFM 100 LFM 4 3 2 1 0 15 25 35 45 55 65 75 Ambient Temperature (C) 2 1 45 55 65 75 85 (Vin = 12.0 Vdc , Vo = 3.3 Vdc ) 7 200 LFM 6 6 200 LFM 0 LFM 5 Output Current (A) 5 Output Current (A) 35 Fig. 21 Derating Output Current vs. Local Ambient Temp. and Airflow (Vin = 12.0 Vdc , Vo = 0.75 Vdc ) 100 LFM 4 3 2 1 0 15 25 Ambient Temperature (C) Fig. 19 Derating Output Current vs. Local Ambient Temp. and Airflow 7 100 LFM 3 0 15 85 0 LFM 4 25 35 45 55 65 75 85 0 LFM 4 100 LFM 3 2 1 0 15 85 Ambient Temperature (C) 35 45 55 65 75 Ambient Temperature (C) Fig. 20 Derating Output Current vs. Local Ambient Temp. and Airflow Fig. 22 Derating Output Current vs. Local Ambient Temp. and Airflow (Vin = 12.0 Vdc , Vo = 1.8 Vdc ) (Vin = 12.0 Vdc , Vo = 5.0 Vdc ) Specifications are subject to change without notice. Customers should verify device performance in their specific applications. 25 7 MX5A-12SA SMT Non-Isolated Power Module Operating Information Remote On/Off The MX5A-12SA comes standard with Active LOW with Negative On/Off logic, i.e., OPEN or LOW (< 0.4 V) will turn ON the device. To turn the device OFF, increase the voltage level above 2.4 V, placing the part into low dissipation sleep mode. The signal level of the On/Off pin input is defined with respect to ground. MX5A-12SA Fig. 23 Circuit Configuration for using Negative Logic On/Off Input Considerations The input must have a stable low impedance AC source for optimum performance. This can be accomplished with external ceramic capacitors, tantalum capacitors and/or polymer capacitors. Using low impedance tantalum capacitors requires about 20 F per Amp and an ESR of 250 m per Amp of output current. For a 5 A converter, tantalum capacitors with a combined value of 100 F and 50 m would be adequate. This can be implemented with (2) 47 F tantalum capacitors with an ESR of 100 m. Ceramic capacitors are also recommended to reduce high frequency ripple on the input. Output Considerations To maintain the specified output ripple and transient response, external capacitors must be used. An external 1 F ceramic capacitor in parallel with a 10 F low ESR tantalum capacitor will usually meet the specified performance. Improved performance can be achieved by using more capacitance. Low ESR polymer capacitors may also be used. Two 100 F, 9 m or lower ESR capacitors are recommended. Safety Information In order to comply with safety requirements the user must provide a fuse in the unearthed input line. This is to prevent earth being disconnected in the event of a failure. The converter must be installed as per guidelines outlined by the various safety approvals if safety agency approval is required for the overall system. Overtemperature Protection The device will shut down if it becomes too hot (typically 135 C - at controller IC). Once the converter cools, it automatically restarts. This feature does not guarantee the converter won't be damaged by temperatures above its rating. Overcurrent Protection The device has an internally set output current limit to protect it from overloads, placing the unit in hiccup mode. Once the overload is removed the converter automatically resumes normal operation. No user adjustments are available. An external fuse in series with the input voltage is also required for complete overload protection. Input Undervoltage Lockout The device operation is disabled if the input voltage drops below the specified input range. Once the input returns to the specified range operation automatically resumes. No user adjustments are available. 8 Specifications are subject to change without notice. Customers should verify device performance in their specific applications. MX5A-12SA SMT Non-Isolated Power Module Operating Information (Continued) Output Voltage Setting The output voltage can be programmed to any voltage between 0.75 Vdc and 5.5 Vdc by connecting a single resistor between the trim pin and the GND pin of the module, as shown in Fig. 24 below. If left open circuit the output voltage will default to 0.75 Vdc. The correct Rtrim value for a specific voltage can be calculated using the following equation: Rtrim = [10.5/(Vo-0.7525)-1] K For example, to set the MX5A-12SA to 3.3 V the following Rtrim resistor must be used: VIN (+) VO (+) ON/OFF TRIM Rtrim = [10.5/(3.3-0.7525)-1] K LOAD Rtrim GND Rtrim = 3.122 k, The closest standard 1 % E96 value is 3.09 k. Table 1 provides the Rtrim values required for some common output voltage set points. Vo (V) 0.75 1.2 1.5 1.8 2.0 2.5 3.3 5.0 MX5A-12SA Rtrim Values Rtrim (k) Open 22.46 13.05 9.024 11.78 5.009 3.122 1.472 Fig. 24 Circuit Configuration to Program Output Voltage using an External Resistor 1 % Value Open 22.6 13.0 9.09 11.8 4.99 3.09 1.47 Table 1 The output voltage of the device can also be set by applying a voltage between the TRIM and GND pins. The Vtrim equation can be written as follows: Vtrim = (0.7 - 0.0667 x{Vo - 0.7225)) To set Vo = 3.3 V, the Vtrim required would therefore be 0.530 V. Table 2 below provides the Vtrim values required for some common output voltage set points. Vo (V) 0.75 1.2 1.5 1.8 2.5 3.3 5.0 MX5A-12SA Vtrim Values Vtrim (V) Open 0.670 0.650 0.630 0.583 0.530 0.4166 Table 2 Specifications are subject to change without notice. Customers should verify device performance in their specific applications. 9 MX5A-12SA SMT Non-Isolated Power Module Operating Information (Continued) Voltage Margining Output voltage margining can be implemented as follows: 1) Trim-up: Connect a resistor, Rm-up, from the Trim pin to the ground pin for adjusting the voltage upwards, and 2) Trim-down: Connect a resistor, Rm-down, from the Trim pin to the output pin for adjusting the voltage downwards. Please consult your local Bourns Field Applications Engineer for more details and the calculation of the required resistor values. Vo Vo Vin Rmargin-down Q2 Trim On/Off Rmargin-up Rtrim Q1 COM Fig. 25 Circuit Configuration for Margining Output Voltage Thermal Considerations Sufficient cooling must always be considered to ensure reliable operation, as these devices operate in a variety of thermal environments. Factors such as ambient temperature, airflow, power dissipation and reliability must be taken into consideration. The data presented in Figures 19 to 22 is based on physical test results taken in a wind tunnel test. The test set-up is shown in Figure 27. The thermal reference points are (1) Tref1 = temp at dual Mosfet, as shown in Figure 26, and (2) Tref2 = temp at controller IC. For reliable operation, neither Tref1 or Tref2 should exceed 115 C. Air Flow Tref1 Air Flow WIND TUNNEL Airflow and ambient temp sensor probes location 8.1 (0.32) n 76.2 (3.0) C2 C3 L1 Q1 UNIT UNDER TEST PCB C1 Fig. 26 Tref1 Temperature Measurement Location 10 25.4 (1.0) Fig. 27 Thermal Test Set-up Specifications are subject to change without notice. Customers should verify device performance in their specific applications. MX5A-12SA SMT Non-Isolated Power Module Product Dimensions SIDE VIEW BOTTOM VIEW 20.3 (0.80) DIMENSIONS: MM (INCHES) 4.06 (0.160) 4.06 (0.160) 4.57 (0.180) 4.83 (0.190) 5.84 (0.230) MAX. 5.56 (0.219) REF. TOLERANCES: GND TRIM VOUT 11.43 (0.450) 8.89 (0.350) 8.64 (0.340) VIN 1.47 (0.058) 0.5 (0.02) 0.25 DECIMAL .XX (0.010) DECIMAL .X ON/OFF L1 INDUCTOR 1.5 (0.06) 2.29 (0.090) 1.57 (0.062) 1.3 (0.05) Fig. 28 Product Dimensions Coplanarity The MX5A-12SA device has a maximum coplanarity of 100 m (approx. 0.004 "), as defined by JESD22-B108. Pin Plating Composition Tin (Sn) plating over nickel (Ni). Recommended Pad Layout 17.53 (0.690) 4.06 (0.160) 4.06 (0.160) 4.83 (0.190) 4.57 (0.180) VOUT TRIM GND 8.64 (0.340) 8.89 (0.350) ON/OFF 1.5 (0.06) 1.3 (0.05) 0.25 (0.010) RECOMMENDED PAD SIZE: DIMENSIONS: MM (INCHES) VIN 3.05 2.41 X MIN. (0.120) (0.095) 3.43 2.79 X MAX. (0.135) (0.110) Fig. 29 Recommended Pad Layout Specifications are subject to change without notice. Customers should verify device performance in their specific applications. 11 MX5A-12SA SMT Non-Isolated Power Module Use in Manufacturing Environment Pick and Place Information Bourns SMT devices, packaged on tape and reel, are designed (low mass) for automated assembly using standard SMT pick and place equipment. The centrally located inductor provides the flat surface area to be used for component pick up. Variables such as nozzle style, nozzle size, handling speed, and placement pressure need to be optimized for best results. 11.43 (0.450) 6.22 (0.245) DIMENSIONS: MM (INCHES) 9.65 (0.380) 20.3 (0.80) Fig. 30 Pick and Place Location Packaging Information Devices come in 44 mm tape and reel, as per EIA-481-2. 4.00 0.10 (.157 .004) 0.4 0.10 (.016 .004) 5.90 (.232) 2.00 0.10 (.079 .004) A DIA. 1.50 +0.10/-0.00 (.049 +.004/-0.00) 1.75 0.10 (.069 .004) 20.20 0.10 (.795 .004) 20.60 (.811) B 44.00 0.10 1.732 .004) Reel Dimensions: Outside Diameter: 330.2 B 40.40 0.10 (1.591 .004) DIA. 2.00 +0.10/-0.00 (.079 +.004/-0.00) (13.00) Inside Diameter: 177.8 (7.00) Width: SECTION B-B A 16.00 0.10 (.630 .004) 44.0 (1.73) DIMENSIONS: MM (INCHES) 11.70 (.461) SECTION A-A Fig. 31 Packaging Tape Detail PCB Layout for SMT Devices * Use a solder mask defined pad design. * See specific datasheet for recommended minimum and maximum pad size. * Interconnection to internal power planes is typically required. * "Via-in-pad" design should be avoided in the SMT pads. * Solder mask should be used to eliminate solder wicking into the vias. * Low resistance and low inductance PCB layout traces should be used where possible, particularly on the output side. * A low impedance track between the input ground and output ground is very important to achieve high efficiencies. 12 Specifications are subject to change without notice. Customers should verify device performance in their specific applications. MX5A-12SA SMT Non-Isolated Power Module Use in Manufacturing Environment (Continued) Soldering Requirements Bourns recommends the following temperature profile for use on tin lead solder (Sn-Pb Eutectic) and lead free solder. For lead free solder, the maximum temperature during the mounting process should not exceed 245 C. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. However, the time above 230 C should not exceed 60 seconds. Solder Reflow Profile Temperature (C) 300 250 Peak Temp. (Pb-Free Solder) 245 C Peak Temp. (Pb Solder) 210-225 C 200 150 Soaking Zone (2 min. max.) 60-90 sec typical 0.5 - 0.6 C/sec. Preheat Zone <2.5 C/sec. 100 50 Reflow Zone (90 sec. max.) 30-60 sec. typ. 1.3 - 1.6 C/sec. Cool Down Zone Preheating Zone (2 - 4 min. max.) 0 0 15 30 45 60 75 90 105 120 135 150 165 180 195 210 225 240 255 270 285 300 Time (Seconds) Fig. 32 Suggested Reflow Profile Water Washing A non-clean solder paste system should be used for solder attach onto application boards. The parts are suitable for water washing applications. However, the user must ensure that the drying process is sufficient to remove all water from the module after washing and that the module is never powered up prior to the module being fully dried. Inspection/Rework Conventional techniques may be employed when replacing a unit in the application. Using a precision dispenser or a suitable ministencil, a suitable volume of solder paste should be applied to the cleaned pads. Reflow can be achieved by standard SMT rework techniques such as IR or techniques developed for BGA components. ESD Requirements Bourns manufactures all models in an ESD controlled environment and all product is supplied in conductive packaging to prevent ESD damage from occurring before or during shipping. All products must be unpacked and handled using approved ESD control procedures. Failure to do so may affect the lifetime of the converter. Storage The X & XT Series have an MSL rating of 1 per IPC/JEDEC J-STD-033A. Asia-Pacific: Tel: +886-2 2562-4117 * Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 * Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 * Fax: +1-951 781-5700 www.bourns.com LONGFORM REV. B 08/06 Specifications are subject to change without notice. Customers should verify device performance in their specific applications. 13