935089750512 - NXP SEMICONDUCTORS

DATA SH EET

Product speciﬁcation

Supersedes data of March 1991

File under Integrated Circuits, IC01

1999 Apr 29

INTEGRATED CIRCUITS

TDA8444; TDA8444T;

TDA8444AT

Octuple 6-bit DACs with I2C-bus

1999 Apr 29 2

Philips Semiconductors Product speciﬁcation

Octuple 6-bit DACs with I2C-bus TDA8444; TDA8444T;

TDA8444AT

FEATURES

•Eight DACs with 6-bit resolution

•Adjustable common output swing

•Push-pull outputs

•Outputs short-circuit protected

•Three programmable slave address bits

•Large supply voltage range

•Low temperature coefficient.

GENERAL DESCRIPTION

The interface circuit is a bipolar IC in a DIP16, SO16, or

SO20 package made in an I2L-compatible 18 V process.

The TDA8444 contains eight programmable 6-bit DAC

outputs, an I2C-bus slave receiver with three (two for

SO16) programmable address bits and one input (VMAX) to

set the maximum output voltage. Each DAC can be

programmed separately by a 6-bit word to 64 values, but

VMAX determines the maximum output voltage for all

DACs. The resolution will be approximately 1⁄64VMAX.

At power-on all DACs are set to their lowest value.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VCC supply voltage 4.5 12 13.2 V

ICC supply current VCC =12V −14 −mA

P power dissipation −170 −mW

VVMAX input effective voltage 1 −VCC −2.0 V

Vo(DACn) DAC output voltage VMAX =V

CC 0.1 −VCC −0.5 V

Vo(DACn)(max) maximum DAC output voltage 1 < VMAX <V

CC −2.0 −VMAX + 0.3 −V

Isource(min) minimum DAC source current data = 1FH 2 −−mA

Isink(min) minimum DAC sink current data = 1FH 2 −−mA

TYPE

NUMBER PACKAGE

NAME DESCRIPTION VERSION

TDA8444 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1

TDA8444T SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

TDA8444AT SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

1999 Apr 29 3

Philips Semiconductors Product speciﬁcation

Octuple 6-bit DACs with I2C-bus TDA8444; TDA8444T;

TDA8444AT

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

MGH513

REFERENCE

VOLTAGE

GENERATOR

DAC0

DAC1

DAC2

DAC3

DAC4

DAC5

DAC6

DAC7

A0 A1 A2

567 18

SDA

SCL

VMAX 2

VCC VEE

TDA8444

I2C BUS

SLAVE RECEIVER

1999 Apr 29 4

Philips Semiconductors Product speciﬁcation

Octuple 6-bit DACs with I2C-bus TDA8444; TDA8444T;

TDA8444AT

PINNING

SYMBOL PIN DESCRIPTION

TDA8444

(DIP16) TDA8444T

(SO16) TDA8444AT

(SO20)

VCC 1 1 1 supply voltage

VMAX 2 2 2 control input for DAC maximum output voltage

SDA 3 3 3 I2C-bus serial data input/output

SCL 4 4 4 I2C-bus serial clock

A0 5 6 7 programmable address bit 0 for I2C-bus slave receiver

A1 6 7 8 programmable address bit 1 for I2C-bus slave receiver

A2 7 −9 programmable address bit 2 for I2C-bus slave receiver

VEE 8 8 10 ground

DAC0 9 9 11 analog voltage output 0

DAC1 10 10 13 analog voltage output 1

DAC2 11 11 14 analog voltage output 2

DAC3 12 12 15 analog voltage output 3

DAC4 13 13 16 analog voltage output 4

DAC5 14 14 17 analog voltage output 5

DAC6 15 15 18 analog voltage output 6

DAC7 16 16 20 analog voltage output 7

n.c. −5 5, 6, 12, 19 not connected

Fig.2 Pin configuration (TDA8444; DIP16).

handbook, halfpage

TDA8444

MGH512

VEE DAC0

A2 DAC1

A1 DAC2

DAC3

DAC4

DAC5

DAC6

DAC7

SCL

SDA

VMAX

VCC

Fig.3 Pin configuration (TDA8444T; SO16).

handbook, halfpage

TDA8444T

MGL531

VEE DAC0

A1 DAC1

A0 DAC2

DAC3

DAC4

DAC5

DAC6

DAC7

n.c.

SCL

SDA

VMAX

VCC

1999 Apr 29 5

Philips Semiconductors Product speciﬁcation

Octuple 6-bit DACs with I2C-bus TDA8444; TDA8444T;

TDA8444AT

Fig.4 Pin configuration (TDA8444AT; SO20).

handbook, halfpage

TDA8444AT

MGL532

VCC

VMAX

SDA

SCL

n.c.

VEE

DAC7

n.c.

DAC6

DAC5

DAC4

DAC3

DAC2

DAC1

n.c.

DAC0

FUNCTIONAL DESCRIPTION

I2C-bus interface

The I2C-bus interface is a receive-only slave, which accepts data according the format shown in Table 1.

Table 1 I2C-bus format (see note 1)

Note

1. S = START condition; A2 to A0 = programmable address bits; A = Acknowledge; I3 to I0 = Instruction bits;

SD to SA = subaddress bits; X = don’t care; D5 to D0 = data bits; P = STOP condition.

Valid addresses are:

TDA8444 and TDA8444AT: 40H, 42H, 44H, 46H, 48H, 4AH, 4CH and 4EH

TDA8444T: 48H, 4AH, 4CH and 4EH (A2 is always logic 1).

All other addresses cannot be acknowledged by the circuit. The actual slave address depends on the programmable

address bits A2, A1 and A0. This way up to eight circuits can be used on one I2C-bus.

Valid instructions are: 00H to 0FH; F0H to FFH.

S 0 1 0 0 A2 A1 A0 0 A I3 I2 I1 I0 SD SC SB SA A X X D5 D4 D3 D2 D1 D0 A P

1999 Apr 29 6

Philips Semiconductors Product speciﬁcation

Octuple 6-bit DACs with I2C-bus TDA8444; TDA8444T;

TDA8444AT

The circuit will not react to other combinations of the

4 instruction bits I3 to I0 than 0 or F, but will still generate

an acknowledge. The difference between

instruction 0 and F is only important when more than one

data byte is sent within one transmission. Instruction 0

causes the data bytes to be written into the DAC-latches

with consecutive subaddresses starting with the

subaddress given in the instruction byte (auto-increment of

subaddress), while instruction F will cause a consecutive

writing of the data bytes into the same DAC-latch whose

subaddress was given in the instruction byte. In case of

only one data byte the DAC-latch with the subaddress

equal to the subaddress in the instruction byte will receive

the data.

Valid subaddresses are: 0H to 7H.

The subaddresses correspond to DAC0 to DAC7.

The Auto-Increment (AI) function of instruction 0,

however, works on all possible subaddresses 0 to F in

such a way that next to subaddress F, subaddress 0 will

follow, and so on.

The data will be latched into the DAC-latch on the

positive-going edge of the acknowledge related clock

pulse.

The specification of the SCL and SDA I/O meets the

I2C-bus specification. For protection against positive

voltage pulses on pins 3 and 4, zener diodes are

connected between these pins and VEE. This means that

normal bus line voltage should not exceed 5.5 V.

The address inputs A0, A1 and A2 can be easily

programmed by either a connection to VEE (An = 0) or VCC

(An = 1). If the inputs are left floating the result will be

An = 1.

VMAX

The VMAX input gives a means of compressing the DAC

output voltage swing. The maximum DAC output voltage

will be equal to VMAX +V

DAC(min), while the 6-bit resolution

is maintained. This enables a higher voltage resolution for

smaller output swings.

DACs

The DACs consist of a 6-bit data-latch, current switches

and an opamp. The current sources connected to the

switches have values with weights 20to 25. The sum of the

switched on currents is converted by the opamp into a

voltage between approximately 0.5 and 10.5 V if

VMAX =V

CC = 12 V. The DAC outputs are short-circuit

protected against VCC and VEE. Capacitive load on the

DAC outputs should not exceed 2 nF in order to prevent

possible oscillations at certain levels. The temperature

coefficient for each of the outputs remains in all possible

conditions well below 0.1 LSB per Kelvin.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

QUALITY SPECIFICATION

In accordance with

“SNW-FQ-611-E”

SYMBOL PARAMETER MIN. MAX. UNIT

VCC supply voltage −0.5 +18 V

ICC supply current −10 +40 mA

P(max) maximum power dissipation −500 mW

Vi(n) input voltage −0.5 +5.9 V

pins SDA and SCL −0.5 +5.9 V

pins VMAX, A0 to A2 and DAC0 to DAC7 −0.5 VCC + 0.5 V

Incurrent in all pins except VCC and VEE −±10 mA

Tstg storage temperature −65 +150 °C

Tamb operating ambient temperature −20 +70 °C

1999 Apr 29 7

Philips Semiconductors Product speciﬁcation

Octuple 6-bit DACs with I2C-bus TDA8444; TDA8444T;

TDA8444AT

THERMAL CHARACTERISTICS

Note

1. When mounted on a Printed-Circuit Board (PCB).

CHARACTERISTICS

VCC = 12 V; Tamb =25°C; unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth(j-a) thermal resistance from junction to ambient in free air

TDA8444 75 K/W

TDA8444T note 1 100 K/W

TDA8444AT note 1 85 K/W

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

VCC supply voltage 4.5 12 13.2 V

ICC supply current VMAX =V

CC =12V;

data = 00H 12 14 19 mA

P power dissipation −170 250 mW

Vrst power reset voltage 1 −4V

Pin VMAX

Vi(VMAX) input effective voltage 1 −VCC −2.0 V

Iiinput current VMAX =V

CC −−10 µA

VMAX =1V −−10 µA

Pins SDA and SCL

VIinput voltage 0 −5.5 V

VIL LOW-level input voltage −−1.0 V

VIH HIGH-level input voltage 3.0 −−V

IL LOW-level input current VSDA =V

SCL =−0.3 V −−−10 µA

IIH HIGH-level input current VSDA =V

SCL =6V −−±10 µA

PIN SDA

VOL LOW-level output voltage IL=3mA −−0.4 V

Io(sink) output sink current 3 8 −mA

Address bits (A0 to A2)

VIinput voltage 0 −VCC V

VIL LOW-level input voltage −−1.0 V

VIH HIGH-level input voltage 2.2 −−V

IL LOW-level input current VAn =V

EE −10 −15 −µA

IH HIGH-level input current VAn =V

CC −−1µA

1999 Apr 29 8

Philips Semiconductors Product speciﬁcation

Octuple 6-bit DACs with I2C-bus TDA8444; TDA8444T;

TDA8444AT

Note

1. The output voltage is typically: with Vswing =V

o(3FH) −Vo(00H) for VMAX =V

CC.

DACs (DAC0 to DAC7)

VoDAC output voltage VMAX =V

CC 0.1 −VCC −0.5 V

Vo(min) minimum output voltage data = 00H;

IL=−2mA 0.1 0.28 0.5 V

Vo(max) maximum output voltage data = 3FH;

IL=−2mA

MAX =V

CC 10.0 10.5 11.5 V

1<V

MAX <10V −note 1 −V

Io(sink) output sink current VDAC =V

CC;

data = 1FH 2815mA

o(source) output source current VDAC =V

EE;

data = 1FH −2−−6mA

ooutput impedance −2≤IL≤+2 mA;

data = 1FH −450Ω

DNL differential non-linearity VMAX =V

CC;

IL=−2mA −−±0.5 LSB

INL integral non-linearity VMAX =V

CC;

IL=−2mA −−±0.5 LSB

∆GFS DC gain match at full-scale data = 3FH;

IL=−2mA −−5%

∆G/∆data DC gain versus other DAC

data change data = 3FH;

IL=−2mA −<±0.5 −LSB

TC temperature coefﬁcient data = 3FH;

IL=−2mA −<±0.1 −LSB/K

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Vswing

VCC 2.0–()

-------------------------------- VMAX Vo00H()

+×

1999 Apr 29 9

Philips Semiconductors Product speciﬁcation

Octuple 6-bit DACs with I2C-bus TDA8444; TDA8444T;

TDA8444AT

TEST AND APPLICATION INFORMATION

Fig.5 DAC output voltage as a function of

programmed value.

VCC =12V.

handbook, halfpage

000 05 0F0A

MGH514

14 19 1E 23 28 2D 32 37 3C 3F

data (hex)

VO(DAC)

(V)

VMAX = 12 V

VMAX = 10 V

VMAX = 6 V

VMAX = 1 V

Fig.6 DAC output voltage as a function of

programmed value.

VMAX =V

CC.

handbook, halfpage

000 05 0F0A

MGL533

14 19 1E 23 28 2D 32 37 3C 3F

data (hex)

VO(DAC)

(V) VCC = 12 V

VCC = 8 V

VCC = 5 V

1999 Apr 29 10

Philips Semiconductors Product speciﬁcation

Octuple 6-bit DACs with I2C-bus TDA8444; TDA8444T;

TDA8444AT

PACKAGE OUTLINES

UNIT A

max. 1 2 b1cEe M

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT38-1 92-10-02

95-01-19

min. A

max. bmax.

1.40

1.14

0.055

0.045

0.53

0.38 0.32

0.23 21.8

21.4

0.86

0.84

6.48

6.20

0.26

0.24

3.9

3.4

0.15

0.13

0.2542.54 7.62

0.30

8.25

7.80

0.32

0.31

9.5

8.3

0.37

0.33

2.2

0.087

4.7 0.51 3.7

0.15 0.021

0.015 0.013

0.009 0.010.100.0200.19

050G09 MO-001AE

(e )

seating plane

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

(1) (1)

D(1)

DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1

1999 Apr 29 11

Philips Semiconductors Product speciﬁcation

Octuple 6-bit DACs with I2C-bus TDA8444; TDA8444T;

TDA8444AT

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZ

ywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

2.65 0.30

0.10 2.45

2.25 0.49

0.36 0.32

0.23 10.5

10.1 7.6

7.4 1.27 10.65

10.00 1.1

1.0 0.9

0.4 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT162-1

detail X

0.25

075E03 MS-013AA

pin 1 index

0.10 0.012

0.004 0.096

0.089 0.019

0.014 0.013

0.009 0.41

0.40 0.30

0.29 0.050

1.4

0.055

0.419

0.394 0.043

0.039 0.035

0.016

0.01

0.25

0.01 0.004

0.043

0.016

0.01

vMA

(A )

0 5 10 mm

scale

SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

95-01-24

97-05-22

1999 Apr 29 12

Philips Semiconductors Product speciﬁcation

Octuple 6-bit DACs with I2C-bus TDA8444; TDA8444T;

TDA8444AT

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZ

ywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

2.65 0.30

0.10 2.45

2.25 0.49

0.36 0.32

0.23 13.0

12.6 7.6

7.4 1.27 10.65

10.00 1.1

1.0 0.9

0.4 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT163-1

detail X

0.25

075E04 MS-013AC

pin 1 index

0.10 0.012

0.004 0.096

0.089 0.019

0.014 0.013

0.009 0.51

0.49 0.30

0.29 0.050

1.4

0.055

0.419

0.394 0.043

0.039 0.035

0.016

0.01

0.25

0.01 0.004

0.043

0.016

0.01

0 5 10 mm

scale

vMA

(A )

SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

95-01-24

97-05-22

1999 Apr 29 13

Philips Semiconductors Product speciﬁcation

Octuple 6-bit DACs with I2C-bus TDA8444; TDA8444T;

TDA8444AT

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our

“Data Handbook IC26; Integrated Circuit Packages”

(order code 9398 652 90011).

DIP

SOLDERING BY DIPPING OR BY WAVE

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (Tstg max). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

REPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300 °C it may remain in

contact for up to 10 seconds. If the bit temperature is

between 300 and 400 °C, contact may be up to 5 seconds.

REFLOW SOLDERING

Reflow soldering techniques are suitable for all SO

packages.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary

between 50 and 300 seconds depending on heating

method. Typical reflow temperatures range from

215 to 250 °C.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating duration: 45 minutes at

45 °C.

WAVE SOLDERING

Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

•A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering

technique should be used.

•The longitudinal axis of the package footprint must be

parallel to the solder flow.

•The package footprint must incorporate solder thieves at

the downstream end.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Maximum permissible solder temperature is 260 °C, and

maximum duration of package immersion in solder is

10 seconds, if cooled to less than 150 °C within

6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

REPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron

(less than 24 V) applied to the flat part of the lead. Contact

time must be limited to 10 seconds at up to 300 °C. When

using a dedicated tool, all other leads can be soldered in

one operation within 2 to 5 seconds between

270 and 320 °C.

1999 Apr 29 14

Philips Semiconductors Product speciﬁcation

Octuple 6-bit DACs with I2C-bus TDA8444; TDA8444T;

TDA8444AT

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

PURCHASE OF PHILIPS I2C COMPONENTS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.

Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.

Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the

components in the I2C system provided the system conforms to the I2C specification defined by

Philips. This specification can be ordered using the code 9398 393 40011.

1999 Apr 29 15

Philips Semiconductors Product speciﬁcation

Octuple 6-bit DACs with I2C-bus TDA8444; TDA8444T;

TDA8444AT

NOTES

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Argentina: see South America

Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. +61 2 9805 4455, Fax. +61 2 9805 4466

Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210

Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773

Belgium: see The Netherlands

Brazil: see South America

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,

Tel. +359 2 68 9211, Fax. +359 2 68 9102

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,

Tel. +1 800 234 7381, Fax. +1 800 943 0087

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,

72 Tat Chee Avenue, Kowloon Tong, HONG KONG,

Tel. +852 2319 7888, Fax. +852 2319 7700

Colombia: see South America

Czech Republic: see Austria

Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. +45 33 29 3333, Fax. +45 33 29 3905

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. +358 9 615 800, Fax. +358 9 6158 0920

France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. +33 1 4099 6161, Fax. +33 1 4099 6427

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. +49 40 2353 60, Fax. +49 40 2353 6300

Hungary: see Austria

India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,

Tel. +91 22 493 8541, Fax. +91 22 493 0966

Indonesia: PT Philips Development Corporation, Semiconductors Division,

Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,

Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +353 1 7640 000, Fax. +353 1 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,

TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. +82 2 709 1412, Fax. +82 2 709 1415

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. +60 3 750 5214, Fax. +60 3 757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087

Middle East: see Italy

Printed in The Netherlands 545002/750/03/pp16 Date of release: 1999 Apr 29 Document order number: 9397 750 04699