representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for
determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system
delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller,
memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility.
Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to
mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit
armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a
broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in
the DRC or adjoining countries. Intel processors manufactured before January 1, 2013 are not confirmed conflict free. The conflict
free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers
to the processor only, not to any additional included accessories, such as heatsinks/coolers.
The Recommended Customer Price (“RCP”) is pricing guidance for Intel products. Prices are for direct Intel customers, typically
represent 1,000-unit purchase quantities, and are subject to change without notice. Taxes and shipping, etc. not included. Prices may
vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price
represents individual unit. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your
appropriate Intel representative to obtain a formal price quotation.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel
components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet
IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.
WARNING: Altering clock frequency and/or voltage may: (i) reduce system stability and useful life of the system and processor; (ii)
cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or
other damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the processor beyond
its specifications. Intel assumes no responsibility that the processor, including if used with altered clock frequencies and/or voltages,
will be fit for any particular purpose. For more information, visit
http://www.intel.com/content/www/us/en/gaming/overclocking/overclocking-intel-processors.html