OPTEK Technology Inc. — 1645 Wallace Drive, Carrollton, Texas 75006
Phone: (972) 323-2200 or (800) 341-4747 FAX: (972) 323-2396 sensors@optekinc.com www.optekinc.com
Issue D 06/2012
Page 1 of 3
Optical Comparator Array
OPR5011
OPTEK reserves the right to make changes at any time in order to improve design and to supply the best product possible.
Description:
Each OPR5011 device is a hybrid sensor array that consists of three channels of the OPTEK differential optical
comparator (‘TRI-DOC”) IC. The single chip construction ensures very tight dimensional tolerances between
active areas.
Specifically designed for high-speed/high-resolution encoder applications, the open collector output switches
based on the comparison of the input photodiode’s light current levels. Logarithmic amplification of the input
signals facilitates operation over a wide range of light levels.
The surface-mountable opaque polyimide package shields the photodiodes from stray light and can withstand
multiple exposures to the most demanding soldering conditions, while the gold-plated wraparound contacts
provide exceptional storage and wetting characteristics.
See Application Bulletin 237 for handling instructions.
Features:
Precise active area location
Surface mountable
TTL compatible output
Wide supply voltage range
Applications:
High-speed applications
High-resolution applications
Applications requiring a wide
range of light levels
Part
Number
Sensor
# of
Elements
Icc (mA)
Typ / Max
Optical
Hysteresis (%)
Typical
Optical
Offset (%)
Min / Max
OPR5011 Differential Optical
Comparator 3 9 / 20 40.00 -40/+40
Ordering Information
Packaging
Chip Tray
OPR5011T Differential Optical
Comparator 3 9 / 20 40.00 -40/+40 Tape & Reel
Pin # Description Pin # Description
1 B - Output 5 N.C.
2 B - Vcc 6 A - Output
3 A + Trim 7 A - Vcc
Pin # Description Pin # Description
9 Z + Trim 13 B + Trim
10 Z -Trim 14 B -Trim
11 Z - Output
4 A -Trim 8 Common 12 Z - Vcc
Warning: Front
Window is pressure
sensitive. Do not
apply pressure or
high vacuum to
window.
NOTE: SEE PAGE 2 FOR APPLICATION CIRCUIT.
INCHES
[MILLIMETERS]
DIMENSIONS ARE IN:
Optical Comparator Array
OPR5011
OPTEK Technology Inc. — 1645 Wallace Drive, Carrollton, Texas 75006
Phone: (972) 323-2200 or (800) 341-4747 FAX: (972) 323-2396 sensors@optekinc.com www.optekinc.com
Issue D 06/2012
Page 2 of 3
OPTEK reserves the right to make changes at any time in order to improve design and to supply the best product possible.
Application Circuit - OPR5011
Notes:
(1) The 74LS04 is recommended as a means of isolating the “DOC” comparator circuitry from transients induced by inductive and
capacitive loads.
(2) It is recommended that a decoupling capacitor be placed as close as possible to the device.
Block Diagram - OPC8332
OPTEK Technology Inc. — 1645 Wallace Drive, Carrollton, Texas 75006
Phone: (972) 323-2200 or (800) 341-4747 FAX: (972) 323-2396 sensors@optekinc.com www.optekinc.com
Issue D 06/2012
Page 3 of 3
Optical Comparator Array
OPR5011
OPTEK reserves the right to make changes at any time in order to improve design and to supply the best product possible.
Absolute Maximum Ratings (TA = 25° C unless otherwise noted)
Storage and Operating Temperature -40° C to +100° C
Supply Voltage 24 V
Solder reflow time within 5°C of peak temperature is 20 to 40 seconds(1) 250° C
Power Dissipation 500 mW
Output Current 14 mA
Output Voltage 24 V
Electrical Characteristics (TA = 25° C unless otherwise noted)
SYMBOL PARAMETER MIN TYP MAX UNITS TEST CONDITIONS
ICC Supply Current - 9 20 mA VCC = 24 V
VOL Low Level Output Voltage(2) - 0.3 0.4 V IOL = 14 mA, VCC = 4.5 V
IOH High Level Output Current(3) - 0.1 1 µA VCC = VO = 20 V
OPT-HYS Optical Hysteresis(4)(7) - 40 - % VCC = 5 V, IOL = 1 mA
OPT-OFF Optical Offset(4)(7) -40 10 +40 % VCC = 5 V, IOL = 1 mA
fmax Frequency Response(5) - 1 - MHz
tlh Output Rise Time(6) - 1 - µs
thl Output Fall Time(6) - 300 - ns
VCC = 5 V
Notes:
(1) Solder time less than 5 seconds at temperature extreme.
(2) Pin (+) = 100.0 nW and Pin (-) = 1.0 µW .
(3) Pin (+) = 1.0 µW and Pin (-) = 100.0 nW.
(4) Pin (-) is held at 1.0 µW while Pin (+) is ramped from 0.5 µW to 1.5 µW and back to 0.5 µW.
(5) Pin (+) is modulated from 1.0 µW to 2.0 µW. Pin (-) is modulated from 1.0 µW to 2.0 µW with phase shifted 180° with respect to
Pin (+). Use 100 k trimpot to set the output signal to 50% duty cycle for maximum operating frequency.
(6) Measured between 10% and 90% points.
(7) Optical Hysteresis and Optical Offset are found by placing 1.0 µW of light on the inverting photodiode and ramping the light
intensity of the non-inverting input from 0.5 µW up to 1.5 µW and back down. This will produce two trigger points – an upper trigger
point and lower trigger point. These points are used to calculate the optical hysteresis and offset.
These are defined as:
% Optical Hysteresis = 100 x (P rise - P fall)
P in (-)
% Optical Offset = 100 x (P average - P (-))
P in (-)
Where:
P in (-) = Light level incident upon the “-” photodiode on the IC chip (Pin) (-) = 1.0 µW).
P rise = Value of light power level incident upon the “+” photodiode that his required to switch the digital output when the
light level is an increasing level (rising edge).
P fall = Value of light power level incident upon the “+” photodiode that is required to switch the digital output when the light
level is decreasing level (falling edge).
P average = (P rise + P fall)
2