Page 1
Formosa MS
GLASS MELF Zener Diode
Document ID Issued Date Revised Date Revision Page.
DS-221714 2008/02/10 2010/03/10 B 8
DL4728A THRU DL4764A
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2
2
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List
List.................................................................................................
Package outline...............................................................................
Features..........................................................................................
Maximum ratings .............................................................................
Electrical characteristics...................................................................
Rating and characteristic curves........................................................
Pinning information...........................................................................
Suggested solder pad layout.............................................................
Packing information..........................................................................
Reel packing....................................................................................
Suggested thermal profiles for soldering processes.............................
High reliability test capabilities...........................................................
Mechanical data...............................................................................
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Features
Silicon epitaxial planar chip strucuture.
• Surface mount glass hermetically sealed package.
Wide zener reverse voltage range 3.3V to 100V.
Other tilerance are available upon request.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
•
•
•
•
Mechanical data
•
• Case :
• Terminals :Plated terminals, solderable per MIL-STD-750,
Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.01 gram
Epoxy : UL94-VO rated flame retardant
DL-41G
Package outline
Page 2
1000mW Surface Mount Zener
Diodes - 3.3V-100V
PARAMETER CONDITIONS Symbol
VF
PD
MIN. TYP. MAX.
1.20
1000
UNIT
V
mW
Storage temperature
Operating temperature
TSTG
TJ-55
-65
+150
+175 oC
oC
o
MAXIMUM RATINGS (at T =25 C unless otherwise noted)
A
Forward voltage
Power Dissipation
I = 200 mA
F
Dimensions in inches and (millimeters)
DL-41G
.111(2.8)
.095(2.4)
.205(5.2)
.190(4.8) .024(.60)
.018(.46)
SOLDERABLE
ENDS
Formosa MS
DL4728A THRU DL4764A
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
GLASS MELF Zener Diode
Document ID Issued Date Revised Date Revision Page.
DS-221714 2008/02/10 2010/03/10 B 8
Tamb≤50℃
Page 3
o
Electrical characteristics (at T =25 C unless otherwise noted)
A
Part No.
Test
current
Zener
impedance
Leakage
current
DL4728A
DL4729A
DL4730A
DL4731A
DL4732A
DL4733A
DL4734A
DL4735A
DL4736A
DL4737A
DL4738A
DL4739A
DL4740A
DL4741A
DL4742A
DL4743A
DL4744A
DL4745A
DL4746A
DL4747A
DL4748A
DL4749A
DL4750A
DL4751A
DL4752A
DL4753A
DL4754A
DL4755A
DL4756A
DL4757A
DL4758A
DL4759A
DL4760A
DL4761A
DL4762A
DL4763A
DL4764A
Note : 5% tolerance of Zener voltage
mA
IZT Z @ I
ZT ZT IZK IR
Volts
VR
Z @ I
ZK ZK
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
100
76
69
64
58
53
49
45
41
37
34
31
28
25
23
21
19
17
15.5
14
12.5
11.5
10.5
9.5
8.5
7.5
7.0
6.5
6.0
5.5
5.0
4.5
4.0
3.7
3.3
3.0
2.0
2.5
10
10
9
9
8
7
5
2
3.5
4.0
4.5
5
7
8
9
10
14
16
20
22
23
25
35
40
45
50
60
70
80
95
110
125
150
175
200
250
350
1.00
1.00
1.00
1.00
1.00
1.00
1.00
1.00
1.00
0.50
0.50
0.50
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
100
100
50
10
10
10
10
10
10
10
10
10
10
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
1.0
1.0
1.0
1.0
1.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
7.6
8.4
9.1
9.9
11.4
12.2
13.7
15.2
16.7
18.2
20.6
22.8
25.4
27.4
29.7
32.7
35.8
38.8
42.6
47.1
51.7
56.0
62.2
69.2
76.0
400
400
400
400
500
550
600
700
700
700
700
700
700
700
700
700
700
700
750
750
750
750
750
1000
1000
1000
1000
1500
1500
1500
2000
2000
2000
2000
3000
3000
3000
Formosa MS
DL4728A THRU DL4764A
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
GLASS MELF Zener Diode
Document ID Issued Date Revised Date Revision Page.
mA(Ω)Max (Ω)Max (uA)Max
DS-221714 2008/02/10 2010/03/10 B 8
Zener
voltage
Max.
Nom.
V @ I (Volts)
Z ZT
Min.
3.14
3.42
3.71
4.09
4.47
4.85
5.32
5.89
6.46
7.13
7.79
8.65
9.50
10.45
11.40
12.35
14.25
15.20
17.10
19.00
20.90
22.80
25.65
28.50
31.35
34.20
37.05
40.85
44.65
48.45
53.20
58.90
64.60
71.25
77.90
86.45
95.00
3.47
3.78
4.10
4.52
4.94
5.36
5.88
6.51
7.14
7.88
8.61
9.56
10.5
11.55
12.60
13.65
15.75
16.80
18.90
21.00
23.10
25.20
28.35
31.50
34.65
37.80
40.95
45.15
49.35
53.55
58.80
65.10
71.40
78.75
86.10
95.55
105.0
Page 4
Rating and characteristic curves (DL4728A THRU DL4764A)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID Issued Date Revised Date Revision Page.
DS-221714 2008/02/10 2010/03/10 B 8
Figure 1. Temperature coefficients
(-55℃ to +150℃temperature range; 90% of the units are in the ranges indicated)
Figure 3. Effect of zener current on zener impedance Figure 4. Effect of zener voltage on zener impedance
Pinning information
12
2
1
Pin1 cathode
Pin2 anode
Pin Simplified outline Symbol
Page 5
Formosa MS
DL4728A THRU DL4764A
Suggested solder pad layout
Dimensions in inches and (millimeters)
A
C
B
B
0.079 (2.00)
A
0.118 (3.00)
C
0.130 (3.30)
PACKAGE
DL-41G
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
GLASS MELF Zener Diode
Document ID Issued Date Revised Date Revision Page.
DS-221714 2008/02/10 2010/03/10 B 8
Page 6
Formosa MS
DL4728A THRU DL4764A
Packing information
unit:mm
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
Item Tolerance DL-41G
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
7" Reel outside diameter
13" Reel inner diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Reel width
Overall tape thickness
Tape width
P0
P1
E
B
C
d
F
T
W
P
A
D
D
D1
D1
D2
W1
Symbol
0.1
0.1
0.1
min
min
0.5
0.1
0.3
1.0
0.1
0.1
0.1
0.1
0.1
0.1
2.0
2.0
1.50
330.00
178.00
50.00
62.00
13.00
1.75
5.50
4.00
4.00
2.00
0.23
12.00
18.00
3.00
5.30
2.70
P0
P1
E
B
d
F
W
P
A
D
D1
D2
W1
C
T
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
GLASS MELF Zener Diode
Document ID Issued Date Revised Date Revision Page.
DS-221714 2008/02/10 2010/03/10 B 8
Reel packing
Page 7
DL-41G 13" 5000 4.0 10,000 337*337*37 330 350*330*360 80,000 19.5
PACKAGE REEL SIZE REEL
COMPONENT
SPACING BOX
INNER
BOX
REEL
DIA,
CARTON
SIZE CARTON
APPROX.
GROSS WEIGHT
(kg)(pcs)(m/m)(m/m)
(m/m)
(pcs)(m/m)
(pcs)
Formosa MS
DL4728A THRU DL4764A
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
GLASS MELF Zener Diode
Document ID Issued Date Revised Date Revision Page.
Profile Feature Soldering Condition
Average ramp-up rate(TL to TP) <3 /sec
Preheat
o
-Temperature Min(Tsmin) 150 C
o
-Temperature Max(Tsmax) 200 C
-Time(min to max)(ts) 60~120sec
Tsmax to TL
o
-Ramp-upRate <3 C/sec
Time maintained above:
o
-Temperature(TL) 217 C
-Time(tL) 60~260sec
o o
Peak Temperature(TP) 255 C-0/+5 C
o
Time within 5 C of actual Peak
Temperature(tP)
o
Ramp-down Rate <6 C/sec
o
Time 25 C to Peak Temperature <6minutes
oC
3.Reflow soldering
10~30sec
1.Storage environment: Temperature=5 ~40 Humidity=55%±25%
2.Reflow soldering of surface-mount devices
o o
C C
Suggested thermal profiles for soldering processes
Critical Zone
TL to TP
TL
Tsmax
Tsmin
Ramp-up
Tp
tS
Preheat
o
t25 C to Peak
Time
25
TL
TP
Ramp-down
Temperature
DS-221714 2008/02/10 2010/03/10 B 8
Page 8
Formosa MS
DL4728A THRU DL4764A
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
GLASS MELF Zener Diode
Document ID Issued Date Revised Date Revision Page.
DS-221714 2008/02/10 2010/03/10 B 8
High reliability test capabilities
1. Solder Resistance
2. Solderability
3. High Temperature Reverse Bias
4. Pressure Cooker
5. Temperature Cycling
6. Thermal Shock
7. Humidity
8. High Temperature Storage Life
at 260 5 for 10 2sec.
immerse body into solder 1/16"±1/32"
O
at 245±5 C for 5 sec.
O
V =80% rate at T =150 C for 168 hrs.
R J
O
15P at T =121 C for 4 hrs.
SIG A
O O
-55 C to +125 C dwelled for 30 min.
and transferred for 5min. total 10 cycles.
O O
0 C for 5 min. rise to 100 C for 5 min. total 10 cycles.
O
at T =85 C, RH=85% for 1000hrs.
A
O
at 175 C for 1000 hrs.
O
± C ± MIL-STD-750D
METHOD-2031
MIL-STD-202F
METHOD-208
MIL-STD-750D
METHOD-1038
JESD22-A102
MIL-STD-750D
METHOD-1051
MIL-STD-750D
METHOD-1056
MIL-STD-750D
METHOD-1021
MIL-STD-750D
METHOD-1031
Item Test Conditions Reference
