dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 16-Bit Digital Signal Controllers with Advanced Analog Operating Conditions Timers/Output Compare/Input Capture * 3.0V to 3.6V, -40C to +150C, DC to 20 MIPS * 3.0V to 3.6V, -40C to +125C, DC to 40 MIPS * Three 16-bit timers/counters; can pair up two to make one 32-bit * Two OC modules, configurable as timers/counters * Four IC modules * Peripheral Pin Select (PPS) to allow function remap Core: 16-Bit dsPIC33F CPU * * * * Code-efficient (C and Assembly) architecture Two 40-bit wide accumulators Single-cycle (MAC/MPY) with dual data fetch Single-cycle, mixed-sign MUL plus hardware divide Clock Management * * * * * 2% internal oscillator Programmable PLLs and oscillator clock sources Fail-Safe Clock Monitor (FSCM) Independent Watchdog Timer (WDT) Fast wake-up and start-up Communication Interfaces * One UART module (10 Mbps) - With support for LIN/J2602 protocols and IrDA(R) * One 4-wire SPI module (15 Mbps) * One I2CTM module (up to 1 Mbaud) with SMBus support * PPS to allow function remap Input/Output * Low-power management modes (Sleep, Idle, Doze) * Integrated Power-on Reset and Brown-out Reset * 1.35 mA/MHz dynamic current (typical) * 55 A IPD current (typical) * Sink/Source up to 10 mA (pin-specific) for standard VOH/VOL, up to 16 mA (pin-specific) for non-standard VOH1 * 5V tolerant pins * Selectable open-drain, pull-ups, and pull-downs * Up to 5 mA overvoltage clamp current * External interrupts on all I/O pins Advanced Analog Features Qualification and Class B Support * ADC module: - Configurable as 10-bit, 1.1 Msps with four S/H (Sample-and-Hold) or 12-bit, 500 ksps with one S/H - Ten analog inputs on 28-pin devices and up to 13 analog inputs on 44-pin devices * Flexible and independent ADC trigger sources * AEC-Q100 REVG (Grade 1 -40C to +125C) * AEC-Q100 REVG (Grade 0 -40C to +150C) * Class B Safety Library, IEC 60730 Power Management (c) 2007-2011 Microchip Technology Inc. Debugger Development Support * * * * In-circuit and in-application programming Two program and two complex data breakpoints IEEE 1149.2-compatible (JTAG) boundary scan Trace and run-time watch DS70290J-page 1 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Product Families The device names, pin counts, memory sizes and peripheral availability of each family are listed below, followed by their pinout diagrams. Device Program Flash Memory (Kbytes) RAM (Kbytes) Remappable Pins 16-Bit Timer Input Capture Output Compare Std. PWM UART External Interrupts(2) SPI I2CTM I/O Pins (Max) dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 CONTROLLER FAMILIES Pins TABLE 1: dsPIC33FJ32GP202 28 32 2 16 3(1) 4 2 1 3 1 1 ADC, 10 ch 1 21 SPDIP SOIC SSOP QFN-S dsPIC33FJ32GP204 44 32 2 26 3(1) 4 2 1 3 1 1 ADC, 13 ch 1 35 QFN TQFP dsPIC33FJ16GP304 44 16 2 26 3(1) 4 2 1 3 1 1 ADC, 13 ch 1 35 QFN TQFP Note 1: 2: Packages 10-Bit/12-Bit ADC Remappable Peripherals Only two out of three timers are remappable. Only two out of three interrupts are remappable. DS70290J-page 2 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Pin Diagrams 28-Pin SPDIP, SOIC, SSOP = Pins are up to 5V tolerant 1 2 3 4 5 6 7 8 9 10 11 12 13 14 dsPIC33FJ32GP202 MCLR AN0/VREF+/CN2/RA0 AN1/VREF-/CN3/RA1 PGED1/AN2/C2IN-/RP0(1)/CN4/RB0 PGEC1/AN3/C2IN+/RP1(1)/CN5/RB1 AN4/RP2(1)/CN6/RB2 AN5/RP3(1)/CN7/RB3 VSS OSC1/CLKI/CN30/RA2 OSC2/CLKO/CN29/RA3 SOSCI/RP4(1)/CN1/RB4 SOSCO/T1CK/CN0/RA4 VDD PGED3/ASDA1/RP5(1)/CN27/RB5 28 27 26 25 24 23 22 21 20 19 18 17 16 15 AVDD AVSS AN9/RP15(1)/CN11/RB15 AN10/RP14(1)/CN12/RB14 AN11/RP13(1)/CN13/RB13 AN12/RP12(1)/CN14/RB12 PGEC2/TMS/RP11(1)/CN15/RB11 PGED2/TDI/RP10(1)/CN16/RB10 VCAP VSS TDO/SDA1/RP9(1)/CN21/RB9 TCK/SCL1/RP8(1)/CN22/RB8 INT0/RP7/CN23/RB7 PGEC3/ASCL1/RP6(1)/CN24/RB6 28-Pin QFN-S(2) AN10/RP14(1)/CN12/RB14 AVDD AVSS AN9/RP15(1)/CN11/RB15 AN1/VREF-/CN3/RA1 AN0/VREF+/CN2/RA0 MCLR = Pins are up to 5V tolerant 28 27 26 25 24 23 22 PGED1/AN2/C2IN-/RP0(1)/CN4/RB0 PGEC1/AN3/C2IN+/RP1(1)/CN5/RB1 1 21 2 20 AN12/RP12(1)/CN14/RB12 AN4/RP2(1)/CN6/RB2 3 19 PGEC2/TMS/RP11(1)(1)/CN15/RB11 AN5/RP3(1)/CN7/RB3 VSS 4 dsPIC33FJ32GP202 18 5 17 VCAP OSC1/CLKI/CN30/RA2 OSC2/CLKO/CN29/RA3 6 16 Vss 7 15 TDO/SDA1/RP9(1)/CN21/RB9 PGEC3/ASCL1/RP6/CN24/RB6 INT0/RP7(1(1))/CN23/RB7 TCK/SCL1/RP8(1)/CN22/RB8 PGED3/ASDA1/RP5(1)/CN27/RB5 SOSCI/RP4/CN1/RB4 2: PGED2/TDI/RP10/CN16/RB10 9 10 11 12 13 14 SOSCO/T1CK/CN0/RA4 VDD 8 Note 1: AN11/RP13(1)/CN13/RB13 The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals. The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 3 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Pin Diagrams (Continued) 44-Pin QFN(2) PGEC1/AN3/C2IN+/RP1(1)/CN5/RB1 PGED1/AN2/C2IN-/RP0(1)/CN4/RB0 AN1/VREF-/CN3/RA1 AN0/VREF+/CN2/RA0 MCLR AVDD AVSS AN9/RP15(1)/CN11/RB15 AN10/RP14(1)/CN12/RB14 TCK/RA7 TMS/RA10 = Pins are up to 5V tolerant 23 11 AN11/RP13(1)/CN13/RB13 24 10 AN12/RP12(1)/CN14/RB12 AN6/RP16(1)/CN8/RC0 25 9 AN7/RP17(1)/CN9/RC1 26 8 PGED2/RP10(1)/CN16/RB10 AN8/RP18(1)/CN10/RC2 27 7 VDD VSS 28 VCAP VSS OSC1/CLKI/CN30/RA2 OSC2/CLKO/CN29/RA3 30 31 3 RP25(1)/CN19/RC9 RP24(1)/CN20/RC8 RP23(1)/CN17/RC7 TDO/RA8 SOSCI/RP4(1)/CN1/RB4 32 2 RP22(1)/CN18/RC6 1 SDA1/RP9(1)/CN21/RB9 6 5 4 PGEC2/RP11(1)/CN15/RB11 SOSCO/T1CK/CN0/RA4 TDI/RA9 RP19(1)/CN28/RC3 RP20(1)/CN25/RC4 RP21(1)/CN26/RC5 VSS VDD PGED3/ASDA1/RP5(1)/CN27/RB5 PGEC3/ASCL1/RP6(1)/CN24/RB6 INT0/RP7(1)/CN23/RB7 SCL1/RP8(1)/CN22/RB8 33 dsPIC33FJ32GP204 dsPIC33FJ16GP304 34 35 36 37 38 39 40 41 42 43 44 29 22 21 20 19 18 17 16 15 14 13 12 AN4/RP2(1)/CN6/RB2 AN5/RP3(1)/CN7/RB3 Note 1: 2: DS70290J-page 4 The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals. The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to Vss externally. (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Pin Diagrams (Continued) 44-Pin TQFP 11 10 9 8 7 6 5 4 3 2 1 AN11/RP13(1)/CN13/RB13 AN12/RP12(1)/CN14/RB12 PGEC2/RP11(1)/CN15/RB11 PGED2/RP10(1)/CN16/RB10 VCAP VSS RP25(1)/CN19/RC9 RP24(1)/CN20/RC8 RP23(1)/CN17/RC7 RP22/CN18/RC6 SDA1(1)/RP9(1)/CN21/RB9 38 39 40 41 42 43 44 dsPIC33FJ32GP204 dsPIC33FJ16GP304 34 35 36 37 23 24 25 26 27 28 29 30 31 32 33 SOSCO/T1CK/CN0/RA4 TDI/RA9 RP19(1)/CN28/RC3 RP20(1)/CN25/RC4 RP21(1)/CN26/RC5 VSS VDD PGED3/ASDA1/RP5(1)/CN27/RB5 PGEC3/ASCL1/RP6(1)/CN24/RB6 INT0/ RP7(1)/CN23/RB7 SCL1/RP8(1)/CN22/RB8 AN4/RP2(1)/CN6/RB2 AN5/RP3(1)/CN7/RB3 AN6/RP16(1)/CN8/RC0 AN7/RP17(1)/CN9/RC1 AN8/RP18(1)/CN10/RC2 VDD VSS OSC1/CLKI/CN30/RA2 OSC2/CLKO/CN29/RA3 TDO/RA8 SOSCI/RP4(1)/CN1/RB4 22 21 20 19 18 17 16 15 14 13 12 PGEC1/AN3/C2IN+/RP1(1)/CN5/RB1 PGED1/AN2/C2IN-/RP0(1)/CN4/RB0 AN1/VREF-/CN3/RA1 AN0/VREF+/CN2/RA0 MCLR AVDD AVSS AN9/RP15(1)/CN11/RB15 AN10/RP14(1)/CN12/RB14 TCK/RA7 TMS/RA10 = Pins are up to 5V tolerant Note 1: The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 5 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 9 2.0 Guidelines for Getting Started with 16-bit Digital Signal Controllers .......................................................................................... 13 3.0 CPU............................................................................................................................................................................................ 17 4.0 Memory Organization ................................................................................................................................................................. 29 5.0 Flash Program Memory .............................................................................................................................................................. 55 6.0 Resets ....................................................................................................................................................................................... 61 7.0 Interrupt Controller ..................................................................................................................................................................... 71 8.0 Oscillator Configuration .............................................................................................................................................................. 97 9.0 Power-Saving Features............................................................................................................................................................ 109 10.0 I/O Ports ................................................................................................................................................................................... 115 11.0 Timer1 ...................................................................................................................................................................................... 137 12.0 Timer2/3 Feature...................................................................................................................................................................... 141 13.0 Input Capture............................................................................................................................................................................ 147 14.0 Output Compare....................................................................................................................................................................... 151 15.0 Serial Peripheral Interface (SPI)............................................................................................................................................... 155 16.0 Inter-Integrated CircuitTM (I2CTM) .............................................................................................................................................. 161 17.0 Universal Asynchronous Receiver Transmitter (UART) ........................................................................................................... 169 18.0 10-bit/12-bit Analog-to-Digital Converter (ADC) ....................................................................................................................... 175 19.0 Special Features ...................................................................................................................................................................... 189 20.0 Instruction Set Summary .......................................................................................................................................................... 197 21.0 Development Support............................................................................................................................................................... 205 22.0 Electrical Characteristics .......................................................................................................................................................... 209 23.0 High Temperature Electrical Characteristics ............................................................................................................................ 253 24.0 DC and AC Device Characteristics Graphs.............................................................................................................................. 263 25.0 Packaging Information.............................................................................................................................................................. 267 Appendix A: Revision History............................................................................................................................................................. 281 Index ................................................................................................................................................................................................. 291 The Microchip Web Site ..................................................................................................................................................................... 295 Customer Change Notification Service .............................................................................................................................................. 295 Customer Support .............................................................................................................................................................................. 295 Reader Response .............................................................................................................................................................................. 296 Product Identification System............................................................................................................................................................. 297 DS70290J-page 6 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: * Microchip's Worldwide Web site; http://www.microchip.com * Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 7 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Referenced Sources This device data sheet is based on the following individual chapters of the "dsPIC33F/PIC24H Family Reference Manual". These documents should be considered as the general reference for the operation of a particular module or device feature. Note 1: To access the documents listed below, browse to the documentation section of the dsPIC33FJ32GP204 product page of the Microchip web site (www.microchip.com). In addition to parameters, features, and other documentation, the resulting page provides links to the related family reference manual sections. * * * * * * * * * * * * * * * * * * * DS70290J-page 8 Section 1. "Introduction" (DS70197) Section 2. "CPU" (DS70204) Section 3. "Data Memory" (DS70202) Section 4. "Program Memory" (DS70202) Section 5. "Flash Programming" (DS70191) Section 6. "Interrupts (DS70184) Section 7. "Oscillator" (DS70186) Section 8. "Reset" (DS70192) Section 9. "Watchdog Timer and Power-Saving Modes" (DS70196) Section 10. "I/O Ports" (DS70193) Section 11. "Timers" (DS70205) Section 12. "Input Capture" (DS70198) Section 13. "Output Compare" (DS70209) Section 16. "Analog-to-Digital Converter (ADC)" (DS70183) Section 17. "UART" (DS70188) Section 18. "Serial Peripheral Interface (SPI)" (DS70206) Section 19. "Inter-Integrated CircuitTM (I2CTM)" (DS70195) Section 23. "CodeGuardTM Security" (DS70199) Section 25. "Device Configuration" (DS70194) (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 1.0 DEVICE OVERVIEW Note 1: This data sheet summarizes the features of the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the "dsPIC33F/PIC24H Family Reference Manual". Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F/PIC24H Family Reference Manual sections. 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. This document contains device-specific information for the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Digital Signal Controller (DSC) devices. The dsPIC33F devices contain extensive Digital Signal Processor (DSP) functionality with a high performance 16-bit microcontroller (MCU) architecture. Figure 1-1 shows a general block diagram of the core and peripheral modules in the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family of devices. Table 1-1 lists the functions of the various pins shown in the pinout diagrams. (c) 2007-2011 Microchip Technology Inc. DS70290H-page 9 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 1-1: dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 BLOCK DIAGRAM PSV and Table Data Access Control Block Y Data Bus X Data Bus Interrupt Controller 16 8 PORTA 16 16 16 Data Latch Data Latch X RAM Y RAM Address Latch Address Latch 23 PORTB 23 PCU PCH PCL Program Counter Loop Stack Control Control Logic Logic 23 16 16 PORTC 16 Address Generator Units Address Latch Remappable Pins Program Memory EA MUX Data Latch ROM Latch 24 Instruction Reg Control Signals to Various Blocks Timing Generation FRC/LPRC Oscillators Precision Band Gap Reference Voltage Regulator VCAP 16 DSP Engine Power-up Timer Divide Support 16 x 16 W Register Array 16 Oscillator Start-up Timer Power-on Reset 16-bit ALU Watchdog Timer 16 Brown-out Reset VDD, VSS Timers 1-3 IC1,2,7,8 Note: Literal Data Instruction Decode and Control OSC2/CLKO OSC1/CLKI 16 16 MCLR UART1 ADC1 OC/ PWM1-2 CNx I2C1 SPI1 Not all pins or features are implemented on all device pinout configurations. See "Pin Diagrams" for the specific pins and features present on each device. DS70290H-page 10 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 1-1: Pin Name PINOUT I/O DESCRIPTIONS Pin Type Buffer Type PPS Description AN0-AN12 I Analog No Analog input channels. CLKI CLKO I O ST/CMOS -- No No External clock source input. Always associated with OSC1 pin function. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. Optionally functions as CLKO in RC and EC modes. Always associated with OSC2 pin function. OSC1 I ST/CMOS No OSC2 I/O -- No Oscillator crystal input. ST buffer when configured in RC mode; CMOS otherwise. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. Optionally functions as CLKO in RC and EC modes. SOSCI SOSCO I O ST/CMOS -- No No 32.768 kHz low-power oscillator crystal input; CMOS otherwise. 32.768 kHz low-power oscillator crystal output. CN0-CN30 I ST No Change notification inputs. Can be software programmed for internal weak pull-ups on all inputs. IC1-IC2 IC7-IC8 I ST Yes Yes Capture inputs 1/2. Capture inputs 7/8. OCFA OC1-OC2 I O ST -- Yes Yes Compare Fault A input (for Compare Channels 1 and 2). Compare outputs 1 through 2. INT0 INT1 INT2 I I I ST ST ST No Yes Yes External interrupt 0. External interrupt 1. External interrupt 2. RA0-RA4 RA7-RA10 I/O ST No No PORTA is a bidirectional I/O port. RB0-RB15 I/O ST No PORTB is a bidirectional I/O port. RC0-RC9 I/O ST No PORTC is a bidirectional I/O port. T1CK T2CK T3CK I I I ST ST ST No Yes Yes Timer1 external clock input. Timer2 external clock input. Timer3 external clock input. U1CTS U1RTS U1RX U1TX I O I O ST -- ST -- Yes Yes Yes Yes UART1 clear to send. UART1 ready to send. UART1 receive. UART1 transmit. SCK1 SDI1 SDO1 SS1 I/O I O I/O ST ST -- ST Yes Yes Yes Yes Synchronous serial clock input/output for SPI1. SPI1 data in. SPI1 data out. SPI1 slave synchronization or frame pulse I/O. SCL1 SDA1 ASCL1 ASDA1 I/O I/O I/O I/O ST ST ST ST No No No No Synchronous serial clock input/output for I2C1. Synchronous serial data input/output for I2C1. Alternate synchronous serial clock input/output for I2C1. Alternate synchronous serial data input/output for I2C1. TMS TCK TDI TDO I I I O ST ST ST -- No No No No JTAG Test mode select pin. JTAG test clock input pin. JTAG test data input pin. JTAG test data output pin. PGED1 PGEC1 PGED2 PGEC2 PGED3 PGEC3 I/O I I/O I I/O I ST ST ST ST ST ST No No No No No No Data I/O pin for programming/debugging communication channel 1. Clock input pin for programming/debugging communication channel 1. Data I/O pin for programming/debugging communication channel 2. Clock input pin for programming/debugging communication channel 2. Data I/O pin for programming/debugging communication channel 3. Clock input pin for programming/debugging communication channel 3. Legend: CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels; PPS = Peripheral Pin Select (c) 2007-2011 Microchip Technology Inc. Analog = Analog input; O = Output; P = Power I = Input DS70290H-page 11 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Type Buffer Type PPS VCAP P -- No CPU logic filter capacitor connection. VSS P -- No Ground reference for logic and I/O pins. Pin Name Description VREF+ I Analog No Analog voltage reference (high) input. VREF- I Analog No Analog voltage reference (low) input. AVDD P P No Positive supply for analog modules. This pin must be connected at all times. MCLR I/P ST No Master Clear (Reset) input. This pin is an active-low Reset to the device. Avss P P No Ground reference for analog modules. VDD P -- No Positive supply for peripheral logic and I/O pins. Legend: CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels; PPS = Peripheral Pin Select DS70290H-page 12 Analog = Analog input; O = Output; P = Power I = Input (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 2.0 GUIDELINES FOR GETTING STARTED WITH 16-BIT DIGITAL SIGNAL CONTROLLERS Note 1: This data sheet summarizes the features of the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the "dsPIC33F/PIC24H Family Reference Manual". Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F/PIC24H Family Reference Manual sections. 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. 2.1 Basic Connection Requirements Getting started with the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family of 16-bit Digital Signal Controllers (DSCs) requires attention to a minimal set of device pin connections before proceeding with development. The following is a list of pin names, which must always be connected: * All VDD and VSS pins (see Section 2.2 "Decoupling Capacitors") * All AVDD and AVSS pins (even if ADC module is not used) (see Section 2.2 "Decoupling Capacitors") * VCAP (see Section 2.3 "CPU Logic Filter Capacitor Connection (VCAP)") * MCLR pin (see Section 2.4 "Master Clear (MCLR) Pin") * PGECx/PGEDx pins used for In-Circuit Serial ProgrammingTM (ICSPTM) and debugging purposes (see Section 2.5 "ICSP Pins") * OSC1 and OSC2 pins when external oscillator source is used (see Section 2.6 "External Oscillator Pins") 2.2 Decoupling Capacitors The use of decoupling capacitors on every pair of power supply pins, such as VDD, VSS, AVDD and AVSS is required. Consider the following criteria when using decoupling capacitors: * Value and type of capacitor: Recommendation of 0.1 F (100 nF), 10-20V. This capacitor should be a low-ESR and have resonance frequency in the range of 20 MHz and higher. It is recommended that ceramic capacitors be used. * Placement on the printed circuit board: The decoupling capacitors should be placed as close to the pins as possible. It is recommended to place the capacitors on the same side of the board as the device. If space is constricted, the capacitor can be placed on another layer on the PCB using a via; however, ensure that the trace length from the pin to the capacitor is within one-quarter inch (6 mm) in length. * Handling high frequency noise: If the board is experiencing high frequency noise, upward of tens of MHz, add a second ceramic-type capacitor in parallel to the above described decoupling capacitor. The value of the second capacitor can be in the range of 0.01 F to 0.001 F. Place this second capacitor next to the primary decoupling capacitor. In high-speed circuit designs, consider implementing a decade pair of capacitances as close to the power and ground pins as possible. For example, 0.1 F in parallel with 0.001 F. * Maximizing performance: On the board layout from the power supply circuit, run the power and return traces to the decoupling capacitors first, and then to the device pins. This ensures that the decoupling capacitors are first in the power chain. Equally important is to keep the trace length between the capacitor and the power pins to a minimum thereby reducing PCB track inductance. Additionally, the following pins may be required: * VREF+/VREF- pins used when external voltage reference for ADC module is implemented Note: The AVDD and AVSS pins must be connected independent of the ADC voltage reference source. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 13 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 2-1: RECOMMENDED MINIMUM CONNECTION 0.1 F Ceramic 10 F Tantalum R R1 VSS VDD 2.4 VCAP VDD * Device Reset * Device programming and debugging C dsPIC33F VSS VDD VSS VDD AVSS VDD AVDD VSS 0.1 F Ceramic 0.1 F Ceramic 0.1 F Ceramic L1(1) Note 1: As an option, instead of a hard-wired connection, an inductor (L1) can be substituted between VDD and AVDD to improve ADC noise rejection. The inductor impedance should be less than 1 and the inductor capacity greater than 10 mA. Where: CNV ------------f = F 2 1 f = ----------------------( 2 LC ) Master Clear (MCLR) Pin The MCLR pin provides for two specific device functions: MCLR 0.1 F Ceramic The placement of this capacitor should be close to the VCAP. It is recommended that the trace length not exceed one-quarter inch (6 mm). Refer to Section 19.2 "On-Chip Voltage Regulator" for details. (i.e., ADC conversion rate/2) During device programming and debugging, the resistance and capacitance that can be added to the pin must be considered. Device programmers and debuggers drive the MCLR pin. Consequently, specific voltage levels (VIH and VIL) and fast signal transitions must not be adversely affected. Therefore, specific values of R and C will need to be adjusted based on the application and PCB requirements. For example, as shown in Figure 2-2, it is recommended that capacitor C is isolated from the MCLR pin during programming and debugging operations. Place the components shown in Figure 2-2 within one-quarter inch (6 mm) from the MCLR pin. FIGURE 2-2: VDD 2 1 L = --------------------- ( 2f C ) 2.2.1 R(1) TANK CAPACITORS On boards with power traces running longer than six inches in length, it is suggested to use a tank capacitor for integrated circuits including DSCs to supply a local power source. The value of the tank capacitor should be determined based on the trace resistance that connects the power supply source to the device, and the maximum current drawn by the device in the application. In other words, select the tank capacitor so that it meets the acceptable voltage sag at the device. Typical values range from 4.7 F to 47 F. 2.3 EXAMPLE OF MCLR PIN CONNECTIONS CPU Logic Filter Capacitor Connection (VCAP) JP R1(2) MCLR dsPIC33F C Note 1: R 10 k is recommended. A suggested starting value is 10 k. Ensure that the MCLR pin VIH and VIL specifications are met. 2: R1 470 will limit any current flowing into MCLR from the external capacitor C, in the event of MCLR pin breakdown, due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS). Ensure that the MCLR pin VIH and VIL specifications are met. A low-ESR (< 5 Ohms) capacitor is required on the VCAP pin, which is used to stabilize the voltage regulator output voltage. The VCAP pin must not be connected to VDD, and must have a capacitor between 4.7 F and 10 F, 16V connected to ground. The type can be ceramic or tantalum. Refer to Section 22.0 "Electrical Characteristics" for additional information. DS70290J-page 14 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 2.5 ICSP Pins The PGECx and PGEDx pins are used for In-Circuit Serial Programming (ICSP) and debugging purposes. It is recommended to keep the trace length between the ICSP connector and the ICSP pins on the device as short as possible. If the ICSP connector is expected to experience an ESD event, a series resistor is recommended, with the value in the range of a few tens of Ohms, not to exceed 100 Ohms. Pull-up resistors, series diodes and capacitors on the PGECx and PGEDx pins are not recommended as they will interfere with the programmer/debugger communications to the device. If such discrete components are an application requirement, they should be removed from the circuit during programming and debugging. Alternatively, refer to the AC/DC characteristics and timing requirements information in the respective device Flash programming specification for information on capacitive loading limits and pin input voltage high (VIH) and input low (VIL) requirements. Ensure that the "Communication Channel Select" (i.e., PGECx/PGEDx pins) programmed into the device matches the physical connections for the ICSP to MPLAB(R) ICD 3 or MPLAB REAL ICETM in-circuit emulator. For more information on MPLAB ICD 3 or MPLAB REAL ICETM in-circuit emulator connection requirements, refer to the following documents that are available on the Microchip web site. * "Using MPLAB(R) ICD 3" (poster) DS51765 * "MPLAB(R) ICD 3 Design Advisory" DS51764 * "MPLAB(R) REAL ICETM In-Circuit Emulator User's Guide" DS51616 * "Using MPLAB(R) REAL ICETM" (poster) DS51749 (c) 2007-2011 Microchip Technology Inc. 2.6 External Oscillator Pins Many DSCs have options for at least two oscillators: a high-frequency primary oscillator and a low-frequency secondary oscillator (refer to Section 8.0 "Oscillator Configuration" for details). The oscillator circuit should be placed on the same side of the board as the device. Also, place the oscillator circuit close to the respective oscillator pins, not exceeding one-half inch (12 mm) distance between them. The load capacitors should be placed next to the oscillator itself, on the same side of the board. Use a grounded copper pour around the oscillator circuit to isolate them from surrounding circuits. The grounded copper pour should be routed directly to the MCU ground. Do not run any signal traces or power traces inside the ground pour. Also, if using a two-sided board, avoid any traces on the other side of the board where the crystal is placed. A suggested layout is shown in Figure 2-3. FIGURE 2-3: SUGGESTED PLACEMENT OF THE OSCILLATOR CIRCUIT Main Oscillator 13 Guard Ring 14 15 Guard Trace Secondary Oscillator 16 17 18 19 20 DS70290J-page 15 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 2.7 Oscillator Value Conditions on Device Start-up If the PLL of the target device is enabled and configured for the device start-up oscillator, the maximum oscillator source frequency must be limited to 8 MHz for start-up with PLL enabled to comply with device PLL start-up conditions. This means that if the external oscillator frequency is outside this range, the application must start-up in FRC mode first. The default PLL settings after a POR with an oscillator frequency outside this range will violate the device operating speed. Once the device powers up, the application firmware can initialize the PLL SFRs, CLKDIV and PLLDBF to a suitable value, and then perform a clock switch to the Oscillator + PLL clock source. Note that clock switching must be enabled in the device Configuration Word. 2.8 Configuration of Analog and Digital Pins During ICSP Operations If MPLAB ICD 2, MPLAB ICD 3, or MPLAB REAL ICE in-circuit emulator is selected as a debugger, it automatically initializes all of the A/D input pins (ANx) as "digital" pins, by setting all bits in the AD1PCFGL register. The bits in the registers that correspond to the A/D pins that are initialized by MPLAB ICD 3 or MPLAB REAL ICE in-circuit emulator, must not be cleared by the user application firmware; otherwise, communication errors will result between the debugger and the device. If your application needs to use certain A/D pins as analog input pins during the debug session, the user application must clear the corresponding bits in the AD1PCFGL register during initialization of the ADC module. When MPLAB ICD 3 or MPLAB REAL ICE in-circuit emulator is used as a programmer, the user application firmware must correctly configure the AD1PCFGL register. Automatic initialization of this register is only done during debugger operation. Failure to correctly configure the register(s) will result in all A/D pins being recognized as analog input pins, resulting in the port value being read as a logic `0', which may affect user application functionality. 2.9 Unused I/Os Unused I/O pins should be configured as outputs and driven to a logic-low state. Alternatively, connect a 1k to 10k resistor between VSS and the unused pins. DS70290J-page 16 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 3.0 CPU 3.1 Data Addressing Overview Note 1: This data sheet summarizes the features of the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 2. "CPU" (DS70204) of the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip web site: (www.microchip.com). The data space can be addressed as 32K words or 64 Kbytes and is split into two blocks, referred to as X and Y data memory. Each memory block has its own independent Address Generation Unit (AGU). The MCU class of instructions operates solely through the X memory AGU, which accesses the entire memory map as one linear data space. Certain DSP instructions operate through the X and Y AGUs to support dual operand reads, which splits the data address space into two parts. The X and Y data space boundary is device-specific. 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. Overhead-free circular buffers (Modulo Addressing mode) are supported in both X and Y address spaces. The Modulo Addressing removes the software boundary checking overhead for DSP algorithms. Furthermore, the X AGU circular addressing can be used with any of the MCU class of instructions. The X AGU also supports Bit-Reversed Addressing to greatly simplify input or output data reordering for radix-2 FFT algorithms. The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 CPU module has a 16-bit (data) modified Harvard architecture with an enhanced instruction set, including significant support for DSP. The CPU has a 24-bit instruction word with a variable length opcode field. The Program Counter (PC) is 23 bits wide and addresses up to 4M x 24 bits of user program memory space. The actual amount of program memory implemented varies by device. A single-cycle instruction prefetch mechanism is used to help maintain throughput and provides predictable execution. All instructions execute in a single cycle, with the exception of instructions that change the program flow, the double word move (MOV.D) instruction and the table instructions. Overhead-free program loop constructs are supported using the DO and REPEAT instructions, both of which are interruptible at any point. The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices have sixteen, 16-bit working registers in the programmer's model. Each of the working registers can serve as a data, address or address offset register. The 16th working register (W15) operates as a software Stack Pointer (SP) for interrupts and calls. The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 instruction set has two classes of instructions: MCU and DSP. These two instruction classes are seamlessly integrated into a single CPU. The instruction set includes many addressing modes and is designed for optimum C compiler efficiency. For most instructions, the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 is capable of executing a data (or program data) memory read, a working register (data) read, a data memory write and a program (instruction) memory read per instruction cycle. As a result, three parameter instructions can be supported, allowing A + B = C operations to be executed in a single cycle. The upper 32 Kbytes of the data space memory map can optionally be mapped into program space at any 16K program word boundary defined by the 8-bit Program Space Visibility Page (PSVPAG) register. The program to data space mapping feature lets any instruction access program space as if it were data space. 3.2 DSP Engine Overview The DSP engine features a high-speed 17-bit by 17-bit multiplier, a 40-bit ALU, two 40-bit saturating accumulators and a 40-bit bidirectional barrel shifter. The barrel shifter is capable of shifting a 40-bit value up to 16 bits right or left, in a single cycle. The DSP instructions operate seamlessly with all other instructions and have been designed for optimal real-time performance. The MAC instruction and other associated instructions can concurrently fetch two data operands from memory while multiplying two W registers and accumulating and optionally saturating the result in the same cycle. This instruction functionality requires that the RAM data space be split for these instructions and linear for all others. Data space partitioning is achieved in a transparent and flexible manner through dedicating certain working registers to each address space. A block diagram of the CPU is shown in Figure 3-1. The programmer's model for the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 is shown in Figure 3-2. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 17 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 3.3 Special MCU Features The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 supports 16/16 and 32/16 divide operations, both fractional and integer. All divide instructions are iterative operations. They must be executed within a REPEAT loop, resulting in a total execution time of 19 instruction cycles. The divide operation can be interrupted during any of those 19 cycles without loss of data. The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 features a 17-bit by 17-bit single-cycle multiplier that is shared by both the MCU ALU and DSP engine. The multiplier can perform signed, unsigned and mixed-sign multiplication. Using a 17-bit by 17-bit multiplier for 16-bit by 16-bit multiplication not only allows you to perform mixed-sign multiplication, it also achieves accurate results for special operations, such as (-1.0) x (-1.0). FIGURE 3-1: A 40-bit barrel shifter is used to perform up to a 16-bit left or right shift in a single cycle. The barrel shifter can be used by both MCU and DSP instructions. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 CPU CORE BLOCK DIAGRAM PSV and Table Data Access Control Block Y Data Bus X Data Bus Interrupt Controller 8 16 23 23 PCU PCH PCL Program Counter Loop Stack Control Control Logic Logic 16 16 16 Data Latch Data Latch X RAM Y RAM Address Latch Address Latch 23 16 16 16 Address Generator Units Address Latch Program Memory EA MUX Data Latch ROM Latch 24 Instruction Reg 16 Literal Data Instruction Decode and Control 16 Control Signals to Various Blocks 16 DSP Engine Divide Support 16 x 16 W Register Array 16 16-bit ALU 16 To Peripheral Modules DS70290J-page 18 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 3-2: dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 PROGRAMMER'S MODEL D15 D0 W0/WREG PUSH.S Shadow W1 DO Shadow W2 W3 Legend W4 DSP Operand Registers W5 W6 W7 Working Registers W8 W9 DSP Address Registers W10 W11 W12/DSP Offset W13/DSP Write Back W14/Frame Pointer W15/Stack Pointer Stack Pointer Limit Register SPLIM AD39 AD15 AD31 AD0 AccA DSP Accumulators AccB PC22 PC0 Program Counter 0 0 7 TBLPAG Data Table Page Address 7 0 PSVPAG Program Space Visibility Page Address 15 0 RCOUNT REPEAT Loop Counter 15 0 DCOUNT DO Loop Counter 22 0 DOSTART DO Loop Start Address DOEND DO Loop End Address 22 15 0 Core Configuration Register CORCON OA OB SA SB OAB SAB DA SRH (c) 2007-2011 Microchip Technology Inc. DC IPL2 IPL1 IPL0 RA N OV Z C STATUS Register SRL DS70290J-page 19 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 3.4 CPU Resources Many useful resources are provided on the main product page of the Microchip web site for the devices listed in this data sheet. This product page, which can be accessed using this link, contains the latest updates and additional information. Note: 3.4.1 In the event you are not able to access the product page using the link above, enter this URL in your browser: http://www.microchip.com/wwwproducts/ Devices.aspx?dDocName=en530331 KEY RESOURCES * * * * * * Section 2. "CPU" (DS70204) Code Samples Application Notes Software Libraries Webinars All related dsPIC33F/PIC24H Family Reference Manuals Sections * Development Tools DS70290J-page 20 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 3.5 CPU Control Registers REGISTER 3-1: R-0 OA SR: CPU STATUS REGISTER R-0 R/C-0 R/C-0 R-0 R/C-0 R -0 R/W-0 OB SA(1) SB(1) OAB SAB DA DC bit 15 bit 8 R/W-0(2) R/W-0(3) R/W-0(3) IPL<2:0>(2) R-0 R/W-0 R/W-0 R/W-0 R/W-0 RA N OV Z C bit 7 bit 0 Legend: C = Clear only bit R = Readable bit U = Unimplemented bit, read as `0' S = Set only bit W = Writable bit -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15 OA: Accumulator A Overflow Status bit 1 = Accumulator A overflowed 0 = Accumulator A has not overflowed bit 14 OB: Accumulator B Overflow Status bit 1 = Accumulator B overflowed 0 = Accumulator B has not overflowed bit 13 SA: Accumulator A Saturation `Sticky' Status bit(1) 1 = Accumulator A is saturated or has been saturated at some time 0 = Accumulator A is not saturated bit 12 SB: Accumulator B Saturation `Sticky' Status bit(1) 1 = Accumulator B is saturated or has been saturated at some time 0 = Accumulator B is not saturated bit 11 OAB: OA || OB Combined Accumulator Overflow Status bit 1 = Accumulators A or B have overflowed 0 = Neither Accumulators A or B have overflowed bit 10 SAB: SA || SB Combined Accumulator `Sticky' Status bit 1 = Accumulators A or B are saturated or have been saturated at some time in the past 0 = Neither Accumulator A or B are saturated Note: This bit can be read or cleared (not set). Clearing this bit will clear SA and SB. bit 9 DA: DO Loop Active bit 1 = DO loop in progress 0 = DO loop not in progress bit 8 DC: MCU ALU Half Carry/Borrow bit 1 = A carry-out from the 4th low-order bit (for byte sized data) or 8th low-order bit (for word sized data) of the result occurred 0 = No carry-out from the 4th low-order bit (for byte sized data) or 8th low-order bit (for word sized data) of the result occurred Note 1: 2: 3: This bit can be read or cleared (not set). The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority Level (IPL). The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when IPL<3> = 1. The IPL<2:0> Status bits are read only when NSTDIS = 1 (INTCON1<15>). (c) 2007-2011 Microchip Technology Inc. DS70290J-page 21 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 3-1: SR: CPU STATUS REGISTER (CONTINUED) bit 7-5 IPL<2:0>: CPU Interrupt Priority Level Status bits(2) 111 = CPU Interrupt Priority Level is 7 (15), user interrupts disabled 110 = CPU Interrupt Priority Level is 6 (14) 101 = CPU Interrupt Priority Level is 5 (13) 100 = CPU Interrupt Priority Level is 4 (12) 011 = CPU Interrupt Priority Level is 3 (11) 010 = CPU Interrupt Priority Level is 2 (10) 001 = CPU Interrupt Priority Level is 1 (9) 000 = CPU Interrupt Priority Level is 0 (8) bit 4 RA: REPEAT Loop Active bit 1 = REPEAT loop in progress 0 = REPEAT loop not in progress bit 3 N: MCU ALU Negative bit 1 = Result was negative 0 = Result was non-negative (zero or positive) bit 2 OV: MCU ALU Overflow bit This bit is used for signed arithmetic (2's complement). It indicates an overflow of a magnitude that causes the sign bit to change state. 1 = Overflow occurred for signed arithmetic (in this arithmetic operation) 0 = No overflow occurred bit 1 Z: MCU ALU Zero bit 1 = An operation that affects the Z bit has set it at some time in the past 0 = The most recent operation that affects the Z bit has cleared it (i.e., a non-zero result) bit 0 C: MCU ALU Carry/Borrow bit 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note 1: 2: 3: This bit can be read or cleared (not set). The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority Level (IPL). The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when IPL<3> = 1. The IPL<2:0> Status bits are read only when NSTDIS = 1 (INTCON1<15>). DS70290J-page 22 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 3-2: U-0 -- bit 15 U-0 -- R/W-0 SATB Legend: R = Readable bit 0' = Bit is cleared bit 11 bit 10-8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 Note 1: 2: U-0 -- R/W-0 US R/W-0 EDT(1) R-0 R-0 DL<2:0> R-0 bit 8 R/W-0 SATA bit 7 bit 15-13 bit 12 CORCON: CORE CONTROL REGISTER R/W-1 SATDW R/W-0 ACCSAT C = Clear only bit W = Writable bit `x = Bit is unknown R/C-0 IPL3(2) R/W-0 PSV R/W-0 RND R/W-0 IF bit 0 -n = Value at POR `1' = Bit is set U = Unimplemented bit, read as `0' Unimplemented: Read as `0' US: DSP Multiply Unsigned/Signed Control bit 1 = DSP engine multiplies are unsigned 0 = DSP engine multiplies are signed EDT: Early DO Loop Termination Control bit(1) 1 = Terminate executing DO loop at end of current loop iteration 0 = No effect DL<2:0>: DO Loop Nesting Level Status bits 111 = 7 DO loops active * * * 001 = 1 DO loop active 000 = 0 DO loops active SATA: AccA Saturation Enable bit 1 = Accumulator A saturation enabled 0 = Accumulator A saturation disabled SATB: AccB Saturation Enable bit 1 = Accumulator B saturation enabled 0 = Accumulator B saturation disabled SATDW: Data Space Write from DSP Engine Saturation Enable bit 1 = Data space write saturation enabled 0 = Data space write saturation disabled ACCSAT: Accumulator Saturation Mode Select bit 1 = 9.31 saturation (super saturation) 0 = 1.31 saturation (normal saturation) IPL3: CPU Interrupt Priority Level Status bit 3(2) 1 = CPU Interrupt Priority Level is greater than 7 0 = CPU Interrupt Priority Level is 7 or less PSV: Program Space Visibility in Data Space Enable bit 1 = Program space visible in data space 0 = Program space not visible in data space RND: Rounding Mode Select bit 1 = Biased (conventional) rounding enabled 0 = Unbiased (convergent) rounding enabled IF: Integer or Fractional Multiplier Mode Select bit 1 = Integer mode enabled for DSP multiply ops 0 = Fractional mode enabled for DSP multiply ops This bit will always read as `0'. The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU Interrupt Priority Level. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 23 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 3.6 Arithmetic Logic Unit (ALU) 3.7 DSP Engine The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 ALU is 16 bits wide and is capable of addition, subtraction, bit shifts and logic operations. Unless otherwise mentioned, arithmetic operations are 2's complement in nature. Depending on the operation, the ALU can affect the values of the Carry (C), Zero (Z), Negative (N), Overflow (OV) and Digit Carry (DC) Status bits in the SR register. The C and DC Status bits operate as Borrow and Digit Borrow bits, respectively, for subtraction operations. The DSP engine consists of a high-speed 17-bit x 17-bit multiplier, a barrel shifter and a 40-bit adder/subtracter (with two target accumulators, round and saturation logic). The ALU can perform 8-bit or 16-bit operations, depending on the mode of the instruction that is used. Data for the ALU operation can come from the W register array or data memory, depending on the addressing mode of the instruction. Likewise, output data from the ALU can be written to the W register array or a data memory location. The DSP engine can also perform accumulator-to-accumulator operations that require no additional data. These instructions are ADD, SUB and NEG. The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 CPU incorporates hardware support for both multiplication and division. This includes a dedicated hardware multiplier and support hardware for 16-bit-divisor division. Refer to the "dsPIC30F/33F Programmer's Reference Manual" (DS70157) for information on the SR bits affected by each instruction. 3.6.1 MULTIPLIER Using the high-speed 17-bit x 17-bit multiplier of the DSP engine, the ALU supports unsigned, signed or mixed-sign operation in several MCU multiplication modes: * * * * * * * 16-bit x 16-bit signed 16-bit x 16-bit unsigned 16-bit signed x 5-bit (literal) unsigned 16-bit unsigned x 16-bit unsigned 16-bit unsigned x 5-bit (literal) unsigned 16-bit unsigned x 16-bit signed 8-bit unsigned x 8-bit unsigned 3.6.2 DIVIDER The divide block supports 32-bit/16-bit and 16-bit/16-bit signed and unsigned integer divide operations with the following data sizes: * * * * 32-bit signed/16-bit signed divide 32-bit unsigned/16-bit unsigned divide 16-bit signed/16-bit signed divide 16-bit unsigned/16-bit unsigned divide The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 is a single-cycle instruction flow architecture; therefore, concurrent operation of the DSP engine with MCU instruction flow is not possible. However, some MCU ALU and DSP engine resources can be used concurrently by the same instruction (e.g., ED, EDAC). The DSP engine has options selected through bits in the CPU Core Control register (CORCON), as listed below: * * * * Fractional or integer DSP multiply (IF) Signed or unsigned DSP multiply (US) Conventional or convergent rounding (RND) Automatic saturation on/off for AccA (SATA), AccB (SATB) and writes to data memory (SATDW) * Accumulator Saturation mode selection (ACCSAT) A block diagram of the DSP engine is shown in Figure 3-3. TABLE 3-1: Instruction CLR ED EDAC MAC MAC MOVSAC MPY MPY MPY.N MSC DSP INSTRUCTIONS SUMMARY Algebraic Operation ACC Write Back A=0 Yes No No Yes No Yes No No No Yes A = (x - y)2 A = A + (x - y)2 A = A + (x * y) A = A + x2 No change in A A=x* y A = x2 A=-x* y A=A-x*y The quotient for all divide instructions ends up in W0 and the remainder in W1. 16-bit signed and unsigned DIV instructions can specify any W register for both the 16-bit divisor (Wn) and any W register (aligned) pair (W(m+1):Wm) for the 32-bit dividend. The divide algorithm takes one cycle per bit of divisor, so both 32-bit/16-bit and 16-bit/16-bit instructions take the same number of cycles to execute. DS70290J-page 24 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 3-3: DSP ENGINE BLOCK DIAGRAM 40 S a 40 Round t 16 u Logic r a t e 40-bit Accumulator A 40-bit Accumulator B Carry/Borrow Out Carry/Borrow In Saturate Adder Negate 40 40 40 16 X Data Bus Barrel Shifter 40 Y Data Bus Sign-Extend 32 Zero Backfill 16 32 33 17-bit Multiplier/Scaler 16 16 To/From W Array (c) 2007-2011 Microchip Technology Inc. DS70290J-page 25 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 3.7.1 MULTIPLIER The 17-bit x 17-bit multiplier is capable of signed or unsigned operation and can multiplex its output using a scaler to support either 1.31 fractional (Q31) or 32-bit integer results. Unsigned operands are zero-extended into the 17th bit of the multiplier input value. Signed operands are sign-extended into the 17th bit of the multiplier input value. The output of the 17-bit x 17-bit multiplier/scaler is a 33-bit value that is sign-extended to 40 bits. Integer data is inherently represented as a signed 2's complement value, where the Most Significant bit (MSb) is defined as a sign bit. * The range of an N-bit 2's complement integer is -2N-1 to 2N-1 - 1. * For a 16-bit integer, the data range is -32768 (0x8000) to 32767 (0x7FFF) including `0'. * For a 32-bit integer, the data range is -2,147,483,648 (0x8000 0000) to 2,147,483,647 (0x7FFF FFFF). When the multiplier is configured for fractional multiplication, the data is represented as a 2's complement fraction, where the MSb is defined as a sign bit and the radix point is implied to lie just after the sign bit (QX format). The range of an N-bit 2's complement fraction with this implied radix point is -1.0 to (1 - 21-N). For a 16-bit fraction, the Q15 data range is -1.0 (0x8000) to 0.999969482 (0x7FFF) including `0' and has a precision of 3.01518x10-5. In Fractional mode, the 16 x 16 multiply operation generates a 1.31 product that has a precision of 4.65661 x 10-10. The same multiplier is used to support the MCU multiply instructions which include integer 16-bit signed, unsigned and mixed-sign multiply operations. The MUL instruction can be directed to use byte or word sized operands. Byte operands will direct a 16-bit result, and word operands will direct a 32-bit result to the specified register(s) in the W array. 3.7.2 DATA ACCUMULATORS AND ADDER/SUBTRACTER The data accumulator consists of a 40-bit adder/subtracter with automatic sign extension logic. It can select one of two accumulators (A or B) as its pre-accumulation source and post-accumulation destination. For the ADD and LAC instructions, the data to be accumulated or loaded can be optionally scaled using the barrel shifter prior to accumulation. DS70290J-page 26 3.7.2.1 Adder/Subtracter, Overflow and Saturation The adder/subtracter is a 40-bit adder with an optional zero input into one side, and either true or complement data into the other input. * In the case of addition, the Carry/Borrow input is active-high and the other input is true data (not complemented). * In the case of subtraction, the Carry/Borrow input is active-low and the other input is complemented. The adder/subtracter generates Overflow Status bits, SA/SB and OA/OB, which are latched and reflected in the STATUS register: * Overflow from bit 39: this is a catastrophic overflow in which the sign of the accumulator is destroyed. * Overflow into guard bits 32 through 39: this is a recoverable overflow. This bit is set whenever all the guard bits are not identical to each other. The adder has an additional saturation block that controls accumulator data saturation, if selected. It uses the result of the adder, the Overflow Status bits described previously and the SAT<A:B> (CORCON<7:6>) and ACCSAT (CORCON<4>) mode control bits to determine when and to what value to saturate. Six STATUS register bits have been provided to support saturation and overflow: * OA: AccA overflowed into guard bits * OB: AccB overflowed into guard bits * SA: AccA saturated (bit 31 overflow and saturation) or AccA overflowed into guard bits and saturated (bit 39 overflow and saturation) * SB: AccB saturated (bit 31 overflow and saturation) or AccB overflowed into guard bits and saturated (bit 39 overflow and saturation) * OAB: Logical OR of OA and OB * SAB: Logical OR of SA and SB The OA and OB bits are modified each time data passes through the adder/subtracter. When set, they indicate that the most recent operation has overflowed into the accumulator guard bits (bits 32 through 39). The OA and OB bits can also optionally generate an arithmetic warning trap when set and the corresponding Overflow Trap Flag Enable bits (OVATE, OVBTE) in the INTCON1 register are set (refer to Section 7.0 "Interrupt Controller"). This allows the user application to take immediate action, for example, to correct system gain. (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 The SA and SB bits are modified each time data passes through the adder/subtracter, but can only be cleared by the user application. When set, they indicate that the accumulator has overflowed its maximum range (bit 31 for 32-bit saturation or bit 39 for 40-bit saturation) and will be saturated (if saturation is enabled). When saturation is not enabled, SA and SB default to bit 39 overflow and thus indicate that a catastrophic overflow has occurred. If the COVTE bit in the INTCON1 register is set, SA and SB bits will generate an arithmetic warning trap when saturation is disabled. The Overflow and Saturation Status bits can optionally be viewed in the STATUS Register (SR) as the logical OR of OA and OB (in bit OAB) and the logical OR of SA and SB (in bit SAB). Programs can check one bit in the STATUS register to determine if either accumulator has overflowed, or one bit to determine if either accumulator has saturated. This is useful for complex number arithmetic, which typically uses both accumulators. The device supports three Saturation and Overflow modes: * Bit 39 Overflow and Saturation: When bit 39 overflow and saturation occurs, the saturation logic loads the maximally positive 9.31 (0x7FFFFFFFFF) or maximally negative 9.31 value (0x8000000000) into the target accumulator. The SA or SB bit is set and remains set until cleared by the user application. This condition is referred to as `super saturation' and provides protection against erroneous data or unexpected algorithm problems (such as gain calculations). * Bit 31 Overflow and Saturation: When bit 31 overflow and saturation occurs, the saturation logic then loads the maximally positive 1.31 value (0x007FFFFFFF) or maximally negative 1.31 value (0x0080000000) into the target accumulator. The SA or SB bit is set and remains set until cleared by the user application. When this Saturation mode is in effect, the guard bits are not used, so the OA, OB or OAB bits are never set. * Bit 39 Catastrophic Overflow: The bit 39 Overflow Status bit from the adder is used to set the SA or SB bit, which remains set until cleared by the user application. No saturation operation is performed and the accumulator is allowed to overflow, destroying its sign. If the COVTE bit in the INTCON1 register is set, a catastrophic overflow can initiate a trap exception. 3.7.2.2 Accumulator `Write Back' The MAC class of instructions (with the exception of MPY, MPY.N, ED and EDAC) can optionally write a rounded version of the high word (bits 31 through 16) of the accumulator that is not targeted by the instruction (c) 2007-2011 Microchip Technology Inc. into data space memory. The write is performed across the X bus into combined X and Y address space. The following addressing modes are supported: * W13, Register Direct: The rounded contents of the non-target accumulator are written into W13 as a 1.15 fraction. * [W13]+ = 2, Register Indirect with Post-Increment: The rounded contents of the non-target accumulator are written into the address pointed to by W13 as a 1.15 fraction. W13 is then incremented by 2 (for a word write). 3.7.2.3 Round Logic The round logic is a combinational block that performs a conventional (biased) or convergent (unbiased) round function during an accumulator write (store). The Round mode is determined by the state of the RND bit in the CORCON register. It generates a 16-bit, 1.15 data value that is passed to the data space write saturation logic. If rounding is not indicated by the instruction, a truncated 1.15 data value is stored and the least significant word (lsw) is simply discarded. Conventional rounding zero-extends bit 15 of the accumulator and adds it to the ACCxH word (bits 16 through 31 of the accumulator). * If the ACCxL word (bits 0 through 15 of the accumulator) is between 0x8000 and 0xFFFF (0x8000 included), ACCxH is incremented. * If ACCxL is between 0x0000 and 0x7FFF, ACCxH is left unchanged. A consequence of this algorithm is that over a succession of random rounding operations, the value tends to be biased slightly positive. Convergent (or unbiased) rounding operates in the same manner as conventional rounding, except when ACCxL equals 0x8000. In this case, the Least Significant bit (bit 16 of the accumulator) of ACCxH is examined. * If it is `1', ACCxH is incremented. * If it is `0', ACCxH is not modified. Assuming that bit 16 is effectively random in nature, this scheme removes any rounding bias that may accumulate. The SAC and SAC.R instructions store either a truncated (SAC), or rounded (SAC.R) version of the contents of the target accumulator to data memory via the X bus, subject to data saturation (see Section 3.7.2.4 "Data Space Write Saturation"). For the MAC class of instructions, the accumulator write-back operation functions in the same manner, addressing combined MCU (X and Y) data space though the X bus. For this class of instructions, the data is always subject to rounding. DS70290J-page 27 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 3.7.2.4 Data Space Write Saturation 3.7.3 BARREL SHIFTER In addition to adder/subtracter saturation, writes to data space can also be saturated but without affecting the contents of the source accumulator. The data space write saturation logic block accepts a 16-bit, 1.15 fractional value from the round logic block as its input, together with overflow status from the original source (accumulator) and the 16-bit round adder. These inputs are combined and used to select the appropriate 1.15 fractional value as output to write to data space memory. The barrel shifter can perform up to 16-bit arithmetic or logic right shifts, or up to 16-bit left shifts in a single cycle. The source can be either of the two DSP accumulators or the X bus (to support multi-bit shifts of register or memory data). If the SATDW bit in the CORCON register is set, data (after rounding or truncation) is tested for overflow and adjusted accordingly: The barrel shifter is 40 bits wide, thereby obtaining a 40-bit result for DSP shift operations and a 16-bit result for MCU shift operations. Data from the X bus is presented to the barrel shifter between bit positions 16 and 31 for right shifts, and between bit positions 0 and 16 for left shifts. * For input data greater than 0x007FFF, data written to memory is forced to the maximum positive 1.15 value, 0x7FFF. * For input data less than 0xFF8000, data written to memory is forced to the maximum negative 1.15 value, 0x8000. The shifter requires a signed binary value to determine both the magnitude (number of bits) and direction of the shift operation. A positive value shifts the operand right. A negative value shifts the operand left. A value of `0' does not modify the operand. The Most significant bit of the source (bit 39) is used to determine the sign of the operand being tested. If the SATDW bit in the CORCON register is not set, the input data is always passed through unmodified under all conditions. DS70290J-page 28 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Note: MEMORY ORGANIZATION This data sheet summarizes the features of the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 4. "Program Memory" (DS70202) of the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip web site (www.microchip.com). The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 architecture features separate program and data memory spaces and buses. This architecture also allows the direct access of program memory from the data space during code execution. FIGURE 4-1: Program Address Space The program address memory space of the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices is 4M instructions. The space is addressable by a 24-bit value derived either from the 23-bit Program Counter (PC) during program execution, or from table operation or data space remapping as described in Section 4.8 "Interfacing Program and Data Memory Spaces". User application access to the program memory space is restricted to the lower half of the address range (0x000000 to 0x7FFFFF). The exception is the use of TBLRD/TBLWT operations, which use TBLPAG<7> to permit access to the Configuration bits and Device ID sections of the configuration memory space. The memory maps for the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices are shown in Figure 4-1. PROGRAM MEMORY FOR dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 DEVICES dsPIC33FJ32GP202/204 GOTO Instruction Reset Address Interrupt Vector Table Reserved Alternate Vector Table User Memory Space 4.1 User Program Flash Memory (11264 instructions) dsPIC33FJ16GP304 GOTO Instruction Reset Address Interrupt Vector Table Reserved Alternate Vector Table 0x000000 0x000002 0x000004 0x0000FE 0x000100 0x000104 0x0001FE 0x000200 0x0057FE 0x005800 Unimplemented (Read `0's) User Memory Space 4.0 User Program Flash Memory (5632 instructions) 0xF7FFFE 0xF80000 0xF80017 0xF80018 0xFEFFFE 0xFF0000 0xFFFFFE Configuration Memory Space Configuration Memory Space Reserved Reserved (c) 2007-2011 Microchip Technology Inc. 0x002BFE 0x002C00 0x7FFFFE 0x800000 Reserved DEVID (2) 0x0000FE 0x000100 0x000104 0x0001FE 0x000200 Unimplemented (Read `0's) 0x7FFFFE 0x800000 Device Configuration Registers 0x000000 0x000002 0x000004 Device Configuration Registers 0xF7FFFE 0xF80000 0xF80017 0xF80018 Reserved DEVID (2) 0xFEFFFE 0xFF0000 0xFFFFFE DS70290J-page 29 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 4.1.1 PROGRAM MEMORY ORGANIZATION 4.1.2 All dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices reserve the addresses between 0x00000 and 0x000200 for hard-coded program execution vectors. A hardware Reset vector is provided to redirect code execution from the default value of the PC on device Reset to the actual start of code. A GOTO instruction is programmed by the user application at 0x000000, with the actual address for the start of code at 0x000002. The program memory space is organized in word-addressable blocks. Although it is treated as 24 bits wide, it is more appropriate to think of each address of the program memory as a lower and upper word, with the upper byte of the upper word being unimplemented. The lower word always has an even address, while the upper word has an odd address (Figure 4-2). dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices also have two interrupt vector tables, located from 0x000004 to 0x0000FF and 0x000100 to 0x0001FF. These vector tables allow each of the many device interrupt sources to be handled by separate Interrupt Service Routines (ISRs). A more detailed discussion of the interrupt vector tables is provided in Section 7.1 "Interrupt Vector Table". Program memory addresses are always word-aligned on the lower word, and addresses are incremented or decremented by two during code execution. This arrangement provides compatibility with data memory space addressing and makes data in the program memory space accessible. FIGURE 4-2: msw Address PROGRAM MEMORY ORGANIZATION 16 8 PC Address (lsw Address) 0 0x000000 0x000002 0x000004 0x000006 00000000 00000000 00000000 00000000 Program Memory `Phantom' Byte (read as `0') DS70290J-page 30 least significant word most significant word 23 0x000001 0x000003 0x000005 0x000007 INTERRUPT AND TRAP VECTORS Instruction Width (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 4.2 Data Address Space The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 CPU has a separate 16-bit wide data memory space. The data space is accessed using separate Address Generation Units (AGUs) for read and write operations. The data memory maps is shown in Figure 4-3. All Effective Addresses (EAs) in the data memory space are 16 bits wide and point to bytes within the data space. This arrangement gives a data space address range of 64 Kbytes or 32K words. The lower half of the data memory space (that is, when EA<15> = 0) is used for implemented memory addresses, while the upper half (EA<15> = 1) is reserved for the Program Space Visibility area (see Section 4.8.3 "Reading Data from Program Memory Using Program Space Visibility"). All word accesses must be aligned to an even address. Misaligned word data fetches are not supported, so care must be taken when mixing byte and word operations, or translating from 8-bit MCU code. If a misaligned read or write is attempted, an address error trap is generated. If the error occurred on a read, the instruction underway is completed. If the instruction occurred on a write, the instruction is executed but the write does not occur. In either case, a trap is then executed, allowing the system and/or user application to examine the machine state prior to execution of the address Fault. All byte loads into any W register are loaded into the Least Significant Byte. The Most Significant Byte is not modified. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices implement up to 2 Kbytes of data memory. Should an EA point to a location outside of this area, an all-zero word or byte will be returned. A sign-extend instruction (SE) is provided to allow users to translate 8-bit signed data to 16-bit signed values. Alternatively, for 16-bit unsigned data, user applications can clear the MSB of any W register by executing a zero-extend (ZE) instruction on the appropriate address. 4.2.1 4.2.3 DATA SPACE WIDTH The data memory space is organized in byte addressable, 16-bit wide blocks. Data is aligned in data memory and registers as 16-bit words, but all data space EAs resolve to bytes. The Least Significant Bytes (LSBs) of each word have even addresses, while the Most Significant Bytes (MSBs) have odd addresses. 4.2.2 DATA MEMORY ORGANIZATION AND ALIGNMENT To maintain backward compatibility with PIC(R) MCU devices and improve data space memory usage efficiency, the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 instruction set supports both word and byte operations. As a consequence of byte accessibility, all effective address calculations are internally scaled to step through word-aligned memory. For example, the core recognizes that Post-Modified Register Indirect Addressing mode [Ws++] will result in a value of Ws + 1 for byte operations and Ws + 2 for word operations. Data byte reads will read the complete word that contains the byte, using the LSB of any EA to determine which byte to select. The selected byte is placed onto the LSB of the data path. That is, data memory and registers are organized as two parallel byte-wide entities with shared (word) address decode but separate write lines. Data byte writes only write to the corresponding side of the array or register that matches the byte address. (c) 2007-2011 Microchip Technology Inc. SFR SPACE The first 2 Kbytes of the Near Data Space, from 0x0000 to 0x07FF, is primarily occupied by Special Function Registers (SFRs). These are used by the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 core and peripheral modules for controlling the operation of the device. SFRs are distributed among the modules that they control, and are generally grouped together by module. Much of the SFR space contains unused addresses; these are read as `0'. A complete listing of implemented SFRs, including their addresses, is shown in Table 4-1 through Table 4-22. Note: 4.2.4 The actual set of peripheral features and interrupts varies by the device. Refer to the corresponding device tables and pinout diagrams for device-specific information. NEAR DATA SPACE The 8 Kbyte area between 0x0000 and 0x1FFF is referred to as the Near Data Space. Locations in this space are directly addressable via a 13-bit absolute address field within all memory direct instructions. Additionally, the whole data space is addressable using MOV instructions, which support Memory Direct Addressing mode with a 16-bit address field, or by using Indirect Addressing mode using a working register as an address pointer. DS70290J-page 31 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 4-3: DATA MEMORY MAP FOR dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 DEVICES WITH 2 Kbytes RAM MSB Address MSb 2 Kbyte SFR Space 2 Kbyte SRAM Space LSb 0x0000 0x0001 SFR Space 0x07FF 0x0801 0x0BFF 0x0001 X Data RAM (X) Y Data RAM (Y) 0x0FFF 0x1001 0x07FE 0x0800 0x0BFE 0x0C00 8 Kbyte Near data space 0x0FFE 0x1000 0x1FFF 0x2001 0x1FFE 0x2000 0x8001 0x8000 X Data Unimplemented (X) Optionally Mapped into Program Memory 0xFFFF DS70290J-page 32 LSB Address 16 bits 0xFFFE (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 4.2.5 X AND Y DATA SPACES The core has two data spaces, X and Y. These data spaces can be considered either separate (for some DSP instructions), or as one unified linear address range (for MCU instructions). The data spaces are accessed using two Address Generation Units (AGUs) and separate data paths. This feature allows certain instructions to concurrently fetch two words from RAM, thereby enabling efficient execution of DSP algorithms such as Finite Impulse Response (FIR) filtering and Fast Fourier Transform (FFT). The X data space is used by all instructions and supports all addressing modes. X data space has separate read and write data buses. The X read data bus is the read data path for all instructions that view data space as combined X and Y address space. It is also the X data prefetch path for the dual operand DSP instructions (MAC class). The Y data space is used in concert with the X data space by the MAC class of instructions (CLR, ED, EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to provide two concurrent data read paths. Both the X and Y data spaces support Modulo Addressing mode for all instructions, subject to addressing mode restrictions. Bit-Reversed Addressing mode is only supported for writes to X data space. 4.3 Program Memory Resources Many useful resources are provided on the main product page of the Microchip web site for the devices listed in this data sheet. This product page, which can be accessed using this link, contains the latest updates and additional information. Note: 4.3.1 In the event you are not able to access the product page using the link above, enter this URL in your browser: http://www.microchip.com/wwwproducts/ Devices.aspx?dDocName=en530331 KEY RESOURCES * * * * * * Section 4. "Program Memory" (DS70202) Code Samples Application Notes Software Libraries Webinars All related dsPIC33F/PIC24H Family Reference Manuals Sections * Development Tools All data memory writes, including in DSP instructions, view data space as combined X and Y address space. The boundary between the X and Y data spaces is device-dependent and is not user-programmable. All effective addresses are 16 bits wide and point to bytes within the data space. Therefore, the data space address range is 64 Kbytes, or 32K words, though the implemented memory locations vary by device. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 33 Special Function Register Maps TABLE 4-1: SFR Name CPU CORE REGISTERS MAP SFR Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets (c) 2007-2011 Microchip Technology Inc. WREG0 0000 Working Register 0 0000 WREG1 0002 Working Register 1 0000 WREG2 0004 Working Register 2 0000 WREG3 0006 Working Register 3 0000 WREG4 0008 Working Register 4 0000 WREG5 000A Working Register 5 0000 WREG6 000C Working Register 6 0000 WREG7 000E Working Register 7 0000 WREG8 0010 Working Register 8 0000 WREG9 0012 Working Register 9 0000 WREG10 0014 Working Register 10 0000 WREG11 0016 Working Register 11 0000 WREG12 0018 Working Register 12 0000 WREG13 001A Working Register 13 0000 WREG14 001C Working Register 14 0000 WREG15 001E Working Register 15 0800 SPLIM 0020 Stack Pointer Limit Register xxxx ACCAL 0022 Accumulator A Low Word Register 0000 ACCAH 0024 Accumulator A High Word Register 0000 ACCAU 0026 Accumulator A Upper Word Register 0000 ACCBL 0028 Accumulator B Low Word Register 0000 ACCBH 002A Accumulator B High Word Register 0000 ACCBU 002C Accumulator B Upper Word Register 0000 PCL 002E Program Counter Low Word Register PCH 0030 -- -- -- -- -- -- -- -- Program Counter High Byte Register 0000 TBLPAG 0032 -- -- -- -- -- -- -- -- Table Page Address Pointer Register 0000 PSVPAG 0034 -- -- -- -- -- -- -- -- Program Memory Visibility Page Address Pointer Register 0000 RCOUNT 0036 Repeat Loop Counter Register xxxx DCOUNT 0038 DCOUNT<15:0> xxxx DOSTARTL 003A DOSTARTH 003C DOENDL 003E 0000 DOSTARTL<15:1> -- -- -- -- -- -- -- -- -- -- 0 xxxx 0 xxxx DOSTARTH<5:0> 00xx DOENDL<15:1> DOENDH 0040 -- -- -- -- -- -- -- -- -- -- SR 0042 OA OB SA SB OAB SAB DA DC IPL2 IPL1 IPL0 RA N OV Z C 0000 CORCON 0044 -- -- -- US EDT SATA SATB SATDW ACCSAT IPL3 PSV RND IF 0020 Legend: DL<2:0> x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. DOENDH 00xx dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 DS70290J-page 34 4.4 CPU CORE REGISTERS MAP (CONTINUED) Bit 0 All Resets XS<15:1> 0 xxxx 004A XE<15:1> 1 xxxx 004C YS<15:1> 0 xxxx YE<15:1> 1 xxxx SFR Addr Bit 15 Bit 14 Bit 13 Bit 12 MODCON 0046 XMODEN YMODEN -- -- XMODSRT 0048 XMODEND YMODSRT YMODEND 004E XBREV 0050 BREN DISICNT 0052 -- SFR Name Legend: Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 BWM<3:0> Bit 5 Bit 3 Bit 2 YWM<3:0> Bit 1 XWM<3:0> 0000 XB<14:0> -- xxxx Disable Interrupts Counter Register xxxx x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. TABLE 4-2: CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJ32GP202 SFR Name SFR Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 CNEN1 0060 CN15IE CN14IE CN13IE CN12IE CN11IE --- -- 0062 -- -- -- CN24IE CN7IE CNEN2 CN23IE CNPU1 0068 CN7PUE CN6PUE CN5PUE CNPU2 006A Legend: Bit 4 CN30IE CN29IE CN27IE -- -- CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN30PUE CN29PUE -- -- CN27PUE Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 CN6IE CN5IE CN4IE CN3IE CN2IE CN22IE CN21IE -- CN4PUE -- CN3PUE -- CN2PUE -- CN24PUE CN23PUE CN22PUE CN21PUE -- -- -- -- x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. TABLE 4-3: -- -- Bit 0 All Resets CN1IE CN0IE 0000 -- CN1PUE CN16IE 0000 CN0PUE 0000 -- -- CN16PUE 0000 CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJ32GP204 AND dsPIC33FJ16GP304 SFR Name SFR Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 CNEN1 0060 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000 CNEN2 0062 -- CN30IE CN29IE CN28IE CN27IE CN26IE CN25IE CN24IE CN23IE CN22IE CN21IE CN20IE CN19IE CN18IE CN17IE CN16IE 0000 CNPU1 0068 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE CN8PUE CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000 CNPU2 006A CN30PUE CN29PUE CN28PUE CN27PUE CN26PUE CN25PUE CN24PUE CN23PUE CN22PUE CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE CN16PUE 0000 Legend: -- x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. All Resets DS70290J-page 35 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 (c) 2007-2011 Microchip Technology Inc. TABLE 4-1: INTERRUPT CONTROLLER REGISTER MAP SFR Name SFR Addr INTCON1 0080 NSTDIS OVAERR OVBERR COVAERR COVBERR OVATE INTCON2 0082 ALTIVT DISI Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 -- -- -- Bit 10 Bit 9 Bit 8 OVBTE COVTE -- -- -- Bit 6 SFTACERR DIV0ERR Bit 5 -- -- -- -- Bit 4 Bit 3 Bit 2 Bit 1 MATHERR ADDRERR STKERR -- -- INT2EP Bit 0 All Resets OSCFAIL -- 0000 INT1EP INT0EP 0000 IFS0 0084 -- -- AD1IF U1TXIF U1RXIF T3IF T2IF OC2IF IC2IF -- T1IF OC1IF IC1IF INT0IF 0000 IFS1 0086 -- -- INT2IF -- -- -- -- -- IC8IF IC7IF -- INT1IF CNIF -- MI2C1IF SI2C1IF 0000 IFS4 008C -- -- -- -- -- -- -- -- -- -- -- -- -- -- U1EIF -- 0000 IEC0 0094 -- -- AD1IE U1TXIE U1RXIE T3IE T2IE OC2IE IC2IE -- T1IE OC1IE IC1IE INT0IE 0000 IEC1 0096 -- -- INT2IE -- -- -- -- -- IC8IE IC7IE -- INT1IE CNIE -- IEC4 009C -- -- -- -- -- -- -- -- -- -- -- -- -- -- IPC0 00A4 -- IPC1 00A6 IPC2 00A8 IPC3 00AA -- -- -- -- -- IPC4 00AC -- CNIP<2:0> -- -- -- -- IPC5 00AE -- IC8IP<2:0> -- IPC7 00B2 -- -- -- -- -- -- -- -- -- INT2IP<2:0> -- -- -- -- IPC16 00C4 -- -- -- -- -- -- -- -- -- U1EIP<2:0> -- -- -- -- INTTREG 00E0 -- -- -- -- Legend: T1IP<2:0> -- -- T2IP<2:0> -- U1RXIP<2:0> -- -- -- SPI1IF SPI1EIF Bit 7 SPI1IE SPI1EIE OC1IP<2:0> -- -- OC2IP<2:0> -- SPI1IP<2:0> IC7IP<2:0> ILR<3:0> IC1IP<2:0> -- -- IC2IP<2:0> -- -- SPI1EIP<2:0> -- -- AD1IP<2:0> -- MI2C1IP<2:0> -- -- x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. -- -- -- MI2C1IE SI2C1IE U1EIE -- INT0IP<2:0> -- -- 0000 0000 4444 -- 4440 T3IP<2:0> 4444 -- U1TXIP<2:0> 0044 -- SI2C1IP<2:0> 4044 -- INT1IP<2:0> VECNUM<6:0> 4404 0040 0040 0000 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 DS70290J-page 36 TABLE 4-4: SFR Name TIMER REGISTER MAP SFR Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets TMR1 0100 Timer1 Register PR1 0102 Period Register 1 T1CON 0104 TMR2 0106 Timer2 Register 0000 TMR3HLD 0108 Timer3 Holding Register (for 32-bit timer operations only) xxxx TMR3 010A Timer3 Register 0000 PR2 010C Period Register 2 FFFF PR3 010E Period Register 3 T2CON 0110 TON -- TSIDL -- -- -- -- -- -- TGATE TCKPS<1:0> T32 -- TCS -- 0000 T3CON 0112 TON -- TSIDL -- -- -- -- -- -- TGATE TCKPS<1:0> -- -- TCS -- 0000 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets ICI<1:0> ICOV ICBNE ICM<2:0> ICI<1:0> ICOV ICBNE ICM<2:0> ICI<1:0> ICOV ICBNE ICM<2:0> ICI<1:0> ICOV ICBNE ICM<2:0> Bit 4 Bit 3 Legend: TSIDL -- -- -- -- -- -- FFFF TGATE SFR Addr IC1BUF 0140 IC1CON 0142 IC2BUF 0144 IC2CON 0146 IC7BUF 0158 IC7CON 015A IC8BUF 015C IC8CON 015E -- TSYNC TCS -- 0000 FFFF Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 -- -- ICSIDL -- -- -- -- Bit 8 Bit 7 Bit 6 Bit 5 Input 1 Capture Register -- xxxx ICTMR 0000 Input 2 Capture Register -- -- ICSIDL -- -- -- -- -- xxxx ICTMR 0000 Input 7 Capture Register -- -- ICSIDL -- -- -- -- -- xxxx ICTMR 0000 Input 8 Capture Register -- -- ICSIDL -- -- -- -- -- xxxx ICTMR 0000 x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. TABLE 4-7: OUTPUT COMPARE REGISTER MAP SFR Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 DS70290J-page 37 OC1RS 0180 Output Compare 1 Secondary Register OC1R 0182 Output Compare 1 Register OC1CON 0184 OC2RS 0186 Output Compare 2 Secondary Register OC2R 0188 Output Compare 2 Register OC2CON 018A Legend: TCKPS<1:0> INPUT CAPTURE REGISTER MAP SFR Name SFR Name -- x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. TABLE 4-6: Legend: TON 0000 -- -- -- -- OCSIDL OCSIDL -- -- -- -- -- -- -- -- -- -- -- -- x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. Bit 5 Bit 2 Bit 1 Bit 0 All Resets xxxx xxxx -- -- OCFLT OCTSEL OCM<2:0> 0000 xxxx xxxx -- -- OCFLT OCTSEL OCM<2:0> 0000 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 (c) 2007-2011 Microchip Technology Inc. TABLE 4-5: I2C1 REGISTER MAP SFR Name SFR Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 I2C1RCV 0200 -- -- -- -- -- -- -- -- Receive Register 0000 I2C1TRN 0202 -- -- -- -- -- -- -- -- Transmit Register 00FF I2C1BRG 0204 -- -- -- -- -- -- -- I2C1CON 0206 I2CEN -- I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 1000 I2C1STAT 0208 ACKSTAT TRSTAT -- -- -- BCL GCSTAT ADD10 IWCOL I2COV D_A P S R_W RBF TBF 0000 I2C1ADD 020A -- -- -- -- -- -- Address Register 0000 I2C1MSK 020C -- -- -- -- -- -- Address Mask Register 0000 Legend: x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. TABLE 4-9: SFR Name SFR Addr Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Baud Rate Generator Register All Resets 0000 UART1 REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 WAKE LPBACK Bit 5 Bit 4 Bit 3 ABAUD URXINV BRGH ADDEN RIDLE PERR Bit 2 Bit 1 All Resets STSEL 0000 URXDA 0110 U1MODE 0220 UARTEN -- USIDL IREN RTSMD -- UEN1 UEN0 U1STA 0222 UTXISEL1 UTXINV UTXISEL0 -- UTXBRK UTXEN UTXBF TRMT U1TXREG 0224 -- -- -- -- -- -- -- UART Transmit Register xxxx U1RXREG 0226 -- -- -- -- -- -- -- UART Receive Register 0000 U1BRG 0228 Legend: x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. TABLE 4-10: SFR Name URXISEL<1:0> PDSEL<1:0> Bit 0 FERR OERR Baud Rate Generator Prescaler 0000 SPI1 REGISTER MAP (c) 2007-2011 Microchip Technology Inc. SFR Addr Bit 15 Bit 14 Bit 13 SPI1STAT 0240 SPIEN -- SPISIDL -- -- -- -- SPI1CON1 0242 -- -- -- DISSCK DISSDO MODE16 SMP SPI1CON2 0244 FRMEN SPIFSD FRMPOL -- -- -- -- -- SPI1BUF 0248 Legend: x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 -- -- CKE SSEN SPIROV -- -- CKP MSTEN -- -- -- SPI1 Transmit and Receive Buffer Register Bit 3 Bit 2 Bit 1 Bit 0 All Resets -- -- SPITBF SPIRBF 0000 SPRE<2:0> -- -- PPRE<1:0> -- FRMDLY -- 0000 0000 0000 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 DS70290J-page 38 TABLE 4-8: PERIPHERAL PIN SELECT INPUT REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 RPINR0 0680 -- -- -- RPINR1 0682 -- -- -- RPINR3 0686 -- -- -- T3CKR<4:0> RPINR7 068E -- -- -- RPINR10 0694 -- -- -- RPINR11 0696 -- -- -- RPINR18 06A4 -- -- -- U1CTSR<4:0> RPINR20 06A8 -- -- -- SCK1R<4:0> RPINR21 06AA -- -- -- Legend: Bit 11 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets -- -- -- -- -- -- -- -- 1F00 -- -- -- INT2R<4:0> 001F -- -- -- T2CKR<4:0> 1F1F IC2R<4:0> -- -- -- IC1R<4:0> 1F1F IC8R<4:0> -- -- -- IC7R<4:0> 1F1F -- -- -- OCFAR<4:0> 001F -- -- -- U1RX<R4:0> 1F1F -- -- -- SDI1R<4:0> 1F1F -- -- -- SS1R<4:0> 001F Bit 10 Bit 9 Bit 8 INT1R<4:0> -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. TABLE 4-12: File Name Bit 12 PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR dsPIC33FJ32GP202 Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets RPOR0 06C0 -- -- -- RP1R<4:0> -- -- -- RP0R<4:0> 0000 RPOR1 06C2 -- -- -- RP3R<4:0> -- -- -- RP2R<4:0> 0000 RPOR2 06C4 -- -- -- RP5R<4:0> -- -- -- RP4R<4:0> 0000 RPOR3 06C6 -- -- -- RP7R<4:0> -- -- -- RP6R<4:0> 0000 RPOR4 06C8 -- -- -- RP9R<4:0> -- -- -- RP8R<4:0> 0000 RPOR5 06CA -- -- -- RP11R<4:0> -- -- -- RP10R<4:0> 0000 RPOR6 06CC -- -- -- RP13R<4:0> -- -- -- RP12R<4:0> 0000 RPOR7 06CE -- -- -- RP15R<4:0> -- -- -- RP14R<4:0> 0000 Legend: x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. DS70290J-page 39 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 (c) 2007-2011 Microchip Technology Inc. TABLE 4-11: PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR dsPIC33FJ32GP204 AND dsPIC33FJ16GP304 File Name Addr Bit 15 Bit 14 Bit 13 RPOR0 06C0 -- -- -- RPOR1 06C2 -- -- -- RPOR2 06C4 -- -- RPOR3 06C6 -- -- RPOR4 06C8 -- RPOR5 06CA RPOR6 Bit 11 Bit 10 Bit 9 Bit 8 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets Bit 7 Bit 6 Bit 5 RP1R<4:0> -- -- -- RP0R<4:0> 0000 RP3R<4:0> -- -- -- RP2R<4:0> 0000 -- RP5R<4:0> -- -- -- RP4R<4:0> 0000 -- RP7R<4:0> -- -- -- RP6R<4:0> 0000 -- -- RP9R<4:0> -- -- -- RP8R<4:0> 0000 -- -- -- RP11R<4:0> -- -- -- RP10R<4:0> 0000 06CC -- -- -- RP13R<4:0> -- -- -- RP12R<4:0> 0000 RPOR7 06CE -- -- -- RP15R<4:0> -- -- -- RP14R<4:0> 0000 RPOR8 06D0 -- -- -- RP17R<4:0> -- -- -- RP16R<4:0> 0000 RPOR9 06D2 -- -- -- RP19R<4:0> -- -- -- RP18R<4:0> 0000 RPOR10 06D4 -- -- -- RP21R<4:0> -- -- -- RP20R<4:0> 0000 RPOR11 06D6 -- -- -- RP23R<4:0> -- -- -- RP22R<4:0> 0000 RPOR12 06D8 -- -- -- RP25R<4:0> -- x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. -- -- RP24R<4:0> 0000 Legend: Bit 12 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 DS70290J-page 40 TABLE 4-13: ADC1 REGISTER MAP FOR dsPIC33FJ32GP204 AND dsPIC33FJ16GP304 Bit 15 Addr ADC1BUF0 0300 ADC Data Buffer 0 xxxx ADC1BUF1 0302 ADC Data Buffer 1 xxxx ADC1BUF2 0304 ADC Data Buffer 2 xxxx ADC1BUF3 0306 ADC Data Buffer 3 xxxx ADC1BUF4 0308 ADC Data Buffer 4 xxxx ADC1BUF5 030A ADC Data Buffer 5 xxxx ADC1BUF6 030C ADC Data Buffer 6 xxxx ADC1BUF7 030E ADC Data Buffer 7 xxxx ADC1BUF8 0310 ADC Data Buffer 8 xxxx ADC1BUF9 0312 ADC Data Buffer 9 xxxx ADC1BUFA 0314 ADC Data Buffer 10 xxxx ADC1BUFB 0316 ADC Data Buffer 11 xxxx ADC1BUFC 0318 ADC Data Buffer 12 xxxx ADC1BUFD 031A ADC Data Buffer 13 xxxx ADC1BUFE 031C ADC Data Buffer 14 xxxx ADC1BUFE 031E ADC Data Buffer 15 AD1CON1 0320 AD1CON2 0322 AD1CON3 0324 AD1CHS123 AD1CHS0 ADON Bit 14 -- Bit 13 ADSIDL VCFG<2:0> Bit 12 Bit 10 Bit 9 Bit 8 -- -- AD12B FORM<1:0> -- -- CSCNA CHPS<1:0> ADRC -- -- 0326 -- -- -- 0328 CH0NB -- -- AD1PCFGL 032C -- -- -- PCFG12 AD1CSSL 0330 -- -- -- CSS12 Legend: Bit 11 Bit 7 Bit 6 Bit 5 -- -- -- CH123NB<1:0> CSS11 CSS10 Bit 1 Bit 0 SIMSAM ASAM SAMP DONE BUFM ALTS ADCS<7:0> CH123SB CH0SB<4:0> PCFG11 PCFG10 Bit 2 SMPI<3:0> SAMC<4:0> -- Bit 3 xxxx SSRC<2:0> BUFS Bit 4 All Resets File Name -- -- -- CH0NA -- -- -- -- 0000 0000 0000 CH123NA<1:0> CH123SA CH0SA<4:0> 0000 0000 PCFG9 PCFG8 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000 CSS9 CSS8 CSS7 CSS6 CSS5 CSS4 CSS3 CSS2 CSS1 CSS0 0000 x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. DS70290J-page 41 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 (c) 2007-2011 Microchip Technology Inc. TABLE 4-14: ADC1 REGISTER MAP FOR dsPIC33FJ32GP202 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets File Name Addr ADC1BUF0 0300 ADC Data Buffer 0 xxxx ADC1BUF1 0302 ADC Data Buffer 1 xxxx ADC1BUF2 0304 ADC Data Buffer 2 xxxx ADC1BUF3 0306 ADC Data Buffer 3 xxxx ADC1BUF4 0308 ADC Data Buffer 4 xxxx ADC1BUF5 030A ADC Data Buffer 5 xxxx ADC1BUF6 030C ADC Data Buffer 6 xxxx ADC1BUF7 030E ADC Data Buffer 7 xxxx ADC1BUF8 0310 ADC Data Buffer 8 xxxx ADC1BUF9 0312 ADC Data Buffer 9 xxxx ADC1BUFA 0314 ADC Data Buffer 10 xxxx ADC1BUFB 0316 ADC Data Buffer 11 xxxx ADC1BUFC 0318 ADC Data Buffer 12 xxxx (c) 2007-2011 Microchip Technology Inc. ADC1BUFD 031A ADC Data Buffer 13 xxxx ADC1BUFE 031C ADC Data Buffer 14 xxxx ADC1BUFF 031E AD1CON1 0320 AD1CON2 0322 AD1CON3 0324 ADRC -- -- AD1CHS123 0326 -- -- -- AD1CHS0 0328 CH0NB -- -- AD1PCFGL 032C -- -- -- 0330 -- -- -- AD1CSSL Legend: ADC Data Buffer 15 ADON -- ADSIDL VCFG<2:0> -- -- AD12B FORM<1:0> -- -- CSCNA CHPS<1:0> -- -- xxxx SSRC<2:0> BUFS -- -- -- -- CSS11 CSS10 SAMP DONE 0000 BUFM ALTS 0000 CH123SA 0000 ADCS<7:0> CH123NB<1:0> CH123SB CH0SB<4:0> CSS12 ASAM SMPI<3:0> SAMC<4:0> PCFG12 PCFG11 PCFG10 SIMSAM -- -- -- 0000 CH123NA<1:0> CH0NA -- -- PCFG9 -- -- -- PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000 CSS9 -- -- -- CSS5 CSS4 CSS3 CSS2 CSS1 CSS0 0000 x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. CH0SA<4:0> 0000 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 DS70290J-page 42 TABLE 4-15: PORTA REGISTER MAP FOR dsPIC33FJ32GP202 Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets TRISA 02C0 -- -- -- -- -- -- -- -- -- -- -- TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 001F PORTA 02C2 -- -- -- -- -- -- -- -- -- -- -- RA4 RA3 RA2 RA1 RA0 xxxx LATA 02C4 -- -- -- -- -- -- -- -- -- -- -- LATA4 LATA3 LATA2 LATA1 LATA0 xxxx ODCA 02C6 -- -- -- -- -- -- -- -- -- -- -- ODCA4 ODCA3 ODCA2 ODCA1 ODCA0 0000 Legend: x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. File Name TABLE 4-17: PORTA REGISTER MAP FOR dsPIC33FJ32GP204 AND dsPIC33FJ16GP304 Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets TRISA 02C0 -- -- -- -- -- TRISA10 TRISA9 TRISA8 TRISA7 -- -- TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 001F PORTA 02C2 -- -- -- -- -- RA10 RA9 RA8 RA7 -- -- RA4 RA3 RA2 RA1 RA0 xxxx LATA 02C4 -- -- -- -- -- LATA10 LATA9 LATA8 LATA7 -- -- LATA4 LATA3 LATA2 LATA1 LATA0 xxxx ODCA 02C6 -- -- -- -- -- ODCA10 ODCA9 ODCA8 ODCA7 -- -- ODCA4 ODCA3 ODCA2 ODCA1 ODCA0 0000 Legend: x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. File Name TABLE 4-18: PORTB REGISTER MAP Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets TRISB 02C8 TRISB15 TRISB14 TRISB13 TRISB12 TRISB11 TRISB10 TRISB9 TRISB8 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 FFFF PORTB 02CA RB15 RB14 RB13 RB12 RB11 RB10 RB9 RB8 RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx LATB 02CC LATB15 LATB14 LATB13 LATB12 LATB11 LATB10 LATB9 LATB8 LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 xxxx ODCB 02CE ODCB15 ODCB14 ODCB13 ODCB12 ODCB11 ODCB10 ODCB9 ODCB8 ODCB7 ODCB6 ODCB5 ODCB4 ODCB3 ODCB2 ODCB1 ODCB0 0000 Legend: x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. File Name TABLE 4-19: File Name PORTC REGISTER MAP FOR dsPIC33FJ32GP204 AND dsPIC33FJ16GP304 Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets DS70290J-page 43 TRISC 02D0 -- -- -- -- -- -- TRISC9 TRISC8 TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 03FF PORTC 02D2 -- -- -- -- -- -- RC9 RC8 RC7 RC6 RC5 RC4 RC4 RC2 RC1 RC0 xxxx LATC 02D4 -- -- -- -- -- -- LATC9 LATC8 LATC7 LATC6 LATC5 LATC4 LATC4 LATC2 LATC1 LATC0 xxxx 02D6 -- -- -- -- -- -- ODCC9 ODCC8 ODCC7 ODCC6 ODCC5 ODCC4 ODCC4 ODCC2 ODCC1 ODCC0 0000 ODCC Legend: x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 (c) 2007-2011 Microchip Technology Inc. TABLE 4-16: SYSTEM CONTROL REGISTER MAP File Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets RCON 0740 TRAPR IOPUWR -- -- -- -- CM VREGS EXTR SWR SWDTEN WDTO SLEEP IDLE BOR POR xxxx(1) OSCCON 0742 -- -- CF -- LPOSCEN OSWEN 0300(2) CLKDIV 0744 ROI PLLFBD 0746 -- -- -- -- -- -- -- OSCTUN 0748 -- -- -- -- -- -- -- Legend: Note 1: 2: x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. RCON register Reset values dependent on type of Reset. OSCCON register Reset values dependent on the FOSC Configuration bits and by type of Reset. TABLE 4-21: COSC<2:0> -- DOZE<2:0> DOZEN Addr Bit 15 Bit 14 Bit 13 NVMCON 0760 WR WREN WRERR -- -- -- NVMKEY 0766 -- -- -- -- -- -- LOCK FRCDIV<2:0> PLLPOST<1:0> -- PLLPRE<4:0> 3040 PLLDIV<8:0> -- -- 0030 -- TUN<5:0> 0000 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 -- -- -- ERASE -- -- -- Bit 4 Bit 3 -- Bit 2 Bit 1 Bit 0 All Resets 0000(1) NVMOP<3:0> NVMKEY<7:0> 0000 x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. Reset value shown is for POR only. Value on other Reset states is dependent on the state of memory write or erase operations at the time of Reset. TABLE 4-22: File Name CLKLOCK IOLOCK NVM REGISTER MAP File Name Legend: Note 1: NOSC<2:0> Addr PMD REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets PMD1 0770 -- -- T3MD T2MD T1MD -- -- -- I2C1MD -- U1MD -- SPI1MD -- -- AD1MD 0000 PMD2 0772 IC8MD IC7MD -- -- -- -- IC2MD IC1MD -- -- -- -- -- -- OC2MD OC1MD 0000 Legend: x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 DS70290J-page 44 TABLE 4-20: dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 4.4.1 4.4.2 SOFTWARE STACK In addition to its use as a working register, the W15 register in the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices is also used as a software Stack Pointer. The Stack Pointer always points to the first available free word and grows from lower to higher addresses. It pre-decrements for stack pops and post-increments for stack pushes, as shown in Figure 4-4. For a PC push during any CALL instruction, the MSB of the PC is zero-extended before the push, ensuring that the MSB is always clear. Note: A PC push during exception processing concatenates the SRL register to the MSB of the PC prior to the push. The Stack Pointer Limit register (SPLIM) associated with the Stack Pointer sets an upper address boundary for the stack. SPLIM is uninitialized at Reset. As is the case for the Stack Pointer, SPLIM<0> is forced to `0' because all stack operations must be word-aligned. When an EA is generated using W15 as a source or destination pointer, the resulting address is compared with the value in SPLIM. If the contents of the Stack Pointer (W15) and the SPLIM register are equal and a push operation is performed, a stack error trap will not occur. The stack error trap will occur on a subsequent push operation. For example, to cause a stack error trap when the stack grows beyond address 0x1000 in RAM, initialize the SPLIM with the value 0x0FFE. Similarly, a Stack Pointer underflow (stack error) trap is generated when the Stack Pointer address is found to be less than 0x0800. This prevents the stack from interfering with the Special Function Register (SFR) space. A write to the SPLIM register should not be immediately followed by an indirect read operation using W15. FIGURE 4-4: Stack Grows Toward Higher Address 0x0000 15 CALL STACK FRAME 0 DATA RAM PROTECTION FEATURE The dsPIC33F product family supports Data RAM protection features that enable segments of RAM to be protected when used in conjunction with Boot and Secure Code Segment Security. BSRAM (Secure RAM segment for Boot Segment) is accessible only from the Boot Segment Flash code when enabled. SSRAM (Secure RAM segment for RAM) is accessible only from the Secure Segment Flash code when enabled. See Table 4-1 for an overview of the BSRAM and SSRAM SFRs. 4.5 Instruction Addressing Modes The addressing modes shown in Table 4-23 form the basis of the addressing modes optimized to support the specific features of individual instructions. The addressing modes provided in the MAC class of instructions differ from those in the other instruction types. 4.5.1 FILE REGISTER INSTRUCTIONS Most file register instructions use a 13-bit address field (f) to directly address data present in the first 8192 bytes of data memory (Near Data Space). Most file register instructions employ a working register, W0, which is denoted as WREG in these instructions. The destination is typically either the same file register or WREG (with the exception of the MUL instruction), which writes the result to a register or register pair. The MOV instruction allows additional flexibility and can access the entire data space. 4.5.2 MCU INSTRUCTIONS The three-operand MCU instructions are of the form: Operand 3 = Operand 1 <function> Operand 2 where: Operand 1 is always a working register (that is, the addressing mode can only be register direct), which is referred to as Wb. Operand 2 can be a W register, fetched from data memory, or a 5-bit literal. PC<15:0> 000000000 PC<22:16> <Free Word> W15 (before CALL) W15 (after CALL) POP : [--W15] PUSH : [W15++] The result location can be either a W register or a data memory location. The following addressing modes are supported by MCU instructions: * * * * * Register Direct Register Indirect Register Indirect Post-Modified Register Indirect Pre-Modified 5-bit or 10-bit Literal Note: (c) 2007-2011 Microchip Technology Inc. Not all instructions support all the addressing modes given above. Individual instructions can support different subsets of these addressing modes. DS70290J-page 45 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 4-23: FUNDAMENTAL ADDRESSING MODES SUPPORTED Addressing Mode File Register Direct Description The address of the file register is specified explicitly. Register Direct The contents of a register are accessed directly. Register Indirect The contents of Wn forms the Effective Address (EA.) Register Indirect Post-Modified The contents of Wn forms the EA. Wn is post-modified (incremented or decremented) by a constant value. Register Indirect Pre-Modified Wn is pre-modified (incremented or decremented) by a signed constant value to form the EA. Register Indirect with Register Offset The sum of Wn and Wb forms the EA. (Register Indexed) Register Indirect with Literal Offset 4.5.3 The sum of Wn and a literal forms the EA. MOVE AND ACCUMULATOR INSTRUCTIONS Move instructions and the DSP accumulator class of instructions provide a greater degree of addressing flexibility than other instructions. In addition to the Addressing modes supported by most MCU instructions, move and accumulator instructions also support Register Indirect with Register Offset Addressing mode, also referred to as Register Indexed mode. Note: For the MOV instructions, the addressing mode specified in the instruction can differ for the source and destination EA. However, the 4-bit Wb (Register Offset) field is shared by both source and destination (but typically only used by one). In summary, the following addressing modes are supported by move and accumulator instructions: * * * * * * * * Register Direct Register Indirect Register Indirect Post-modified Register Indirect Pre-modified Register Indirect with Register Offset (Indexed) Register Indirect with Literal Offset 8-bit Literal 16-bit Literal Note: 4.5.4 The two-source operand prefetch registers must be members of the set {W8, W9, W10, W11}. For data reads, W8 and W9 are always directed to the X RAGU, and W10 and W11 are always directed to the Y AGU. The effective addresses generated (before and after modification) must, therefore, be valid addresses within X data space for W8 and W9 and Y data space for W10 and W11. Note: Register Indirect with Register Offset Addressing mode is available only for W9 (in X space) and W11 (in Y space). In summary, the following addressing modes are supported by the MAC class of instructions: * * * * * Register Indirect Register Indirect Post-Modified by 2 Register Indirect Post-Modified by 4 Register Indirect Post-Modified by 6 Register Indirect with Register Offset (Indexed) 4.5.5 OTHER INSTRUCTIONS Besides the addressing modes outlined previously, some instructions use literal constants of various sizes. For example, BRA (branch) instructions use 16-bit signed literals to specify the branch destination directly, whereas the DISI instruction uses a 14-bit unsigned literal field. In some instructions, such as ADD Acc, the source of an operand or result is implied by the opcode itself. Certain operations, such as NOP, do not have any operands. Not all instructions support all the addressing modes given above. Individual instructions may support different subsets of these addressing modes. MAC INSTRUCTIONS The dual source operand DSP instructions (CLR, ED, EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also referred to as MAC instructions, use a simplified set of addressing modes to allow the user application to effectively manipulate the data pointers through register indirect tables. DS70290J-page 46 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 4.6 Modulo Addressing Note: Modulo Addressing mode is a method of providing an automated means to support circular data buffers using hardware. The objective is to remove the need for software to perform data address boundary checks when executing tightly looped code, as is typical in many DSP algorithms. Modulo Addressing can operate in either data or program space (since the data pointer mechanism is essentially the same for both). One circular buffer can be supported in each of the X (which also provides the pointers into program space) and Y data spaces. Modulo Addressing can operate on any W register pointer. However, it is not advisable to use W14 or W15 for Modulo Addressing since these two registers are used as the Stack Frame Pointer and Stack Pointer, respectively. In general, any particular circular buffer can be configured to operate in only one direction, as there are certain restrictions on the buffer start address (for incrementing buffers), or end address (for decrementing buffers), based upon the direction of the buffer. The only exception to the usage restrictions is for buffers that have a power-of-two length. As these buffers satisfy the start and end address criteria, they can operate in a bidirectional mode (that is, address boundary checks are performed on both the lower and upper address boundaries). 4.6.1 START AND END ADDRESS The Modulo Addressing scheme requires that a starting and ending address be specified and loaded into the 16-bit Modulo Buffer Address registers: XMODSRT, XMODEND, YMODSRT and YMODEND (see Table 4-1). FIGURE 4-5: Y space Modulo Addressing EA calculations assume word sized data (LSB of every EA is always clear). The length of a circular buffer is not directly specified. It is determined by the difference between the corresponding start and end addresses. The maximum possible length of the circular buffer is 32K words (64 Kbytes). 4.6.2 W ADDRESS REGISTER SELECTION The Modulo and Bit-Reversed Addressing Control register, MODCON<15:0>, contains enable flags as well as a W register field to specify the W Address registers. The XWM and YWM fields select the registers that will operate with Modulo Addressing: * If XWM = 15, X RAGU and X WAGU Modulo Addressing is disabled. * If YWM = 15, Y AGU Modulo Addressing is disabled. The X Address Space Pointer W register (XWM), to which Modulo Addressing is to be applied, is stored in MODCON<3:0> (see Table 4-1). Modulo Addressing is enabled for X data space when XWM is set to any value other than `15' and the XMODEN bit is set at MODCON<15>. The Y Address Space Pointer W register (YWM) to which Modulo Addressing is to be applied is stored in MODCON<7:4>. Modulo Addressing is enabled for Y data space when YWM is set to any value other than `15' and the YMODEN bit is set at MODCON<14>. MODULO ADDRESSING OPERATION EXAMPLE Byte Address 0x1100 MOV MOV MOV MOV MOV MOV #0x1100, W0 W0, XMODSRT #0x1163, W0 W0, MODEND #0x8001, W0 W0, MODCON MOV #0x0000, W0 ;W0 holds buffer fill value MOV #0x1110, W1 ;point W1 to buffer DO AGAIN, #0x31 MOV W0, [W1++] AGAIN: INC W0, W0 0x1163 ;set modulo start address ;set modulo end address ;enable W1, X AGU for modulo ;fill the 50 buffer locations ;fill the next location ;increment the fill value Start Addr = 0x1100 End Addr = 0x1163 Length = 0x0032 words (c) 2007-2011 Microchip Technology Inc. DS70290J-page 47 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 4.6.3 MODULO ADDRESSING APPLICABILITY Modulo Addressing can be applied to the Effective Address (EA) calculation associated with any W register. Address boundaries check for addresses equal to: * The upper boundary addresses for incrementing buffers * The lower boundary addresses for decrementing buffers It is important to realize that the address boundaries also check for addresses less than or greater than these addresses. Address changes can, therefore, jump beyond boundaries and still be adjusted correctly. Note: 4.7 The modulo corrected effective address is written back to the register only when Pre-Modify or Post-Modify Addressing mode is used to compute the effective address. When an address offset (such as [W7+W2]) is used, Modulo Address correction is performed but the contents of the register remain unchanged. Bit-Reversed Addressing Bit-Reversed Addressing mode is intended to simplify data re-ordering for radix-2 FFT algorithms. It is supported by the X AGU for data writes only. The modifier, which can be a constant value or register contents, is regarded as having its bit order reversed. The address source and destination are kept in normal order. Thus, the only operand requiring reversal is the modifier. 4.7.1 BIT-REVERSED ADDRESSING IMPLEMENTATION Bit-Reversed Addressing mode is enabled in any of these situations: If the length of a bit-reversed buffer is M = 2N bytes, the last `N' bits of the data buffer start address must be zeros. XB<14:0> is the Bit-Reversed Address modifier, or `pivot point', which is typically a constant. In the case of an FFT computation, its value is equal to half of the FFT data buffer size. Note: All bit-reversed EA calculations assume word sized data (LSB of every EA is always clear). The XB value is scaled accordingly to generate compatible (byte) addresses. When enabled, Bit-Reversed Addressing is executed only for Register Indirect with Pre-Increment or Post-Increment Addressing and word sized data writes. It will not function for any other addressing mode or for byte sized data, and normal addresses are generated instead. When Bit-Reversed Addressing is active, the W Address Pointer is always added to the address modifier (XB), and the offset associated with the Register Indirect Addressing mode is ignored. In addition, as word sized data is a requirement, the LSb of the EA is ignored (and always clear). Note: Modulo Addressing and Bit-Reversed Addressing should not be enabled together. If an application attempts to do so, Bit-Reversed Addressing will assume priority when active for the X WAGU and X WAGU Modulo Addressing will be disabled. However, Modulo Addressing will continue to function in the X RAGU. If Bit-Reversed Addressing has already been enabled by setting the BREN bit (XBREV<15>), a write to the XBREV register should not be immediately followed by an indirect read operation using the W register that has been designated as the bit-reversed pointer. * BWM bits (W register selection) in the MODCON register are any value other than `15' (the stack cannot be accessed using Bit-Reversed Addressing). * The BREN bit is set in the XBREV register. * The addressing mode used is Register Indirect with Pre-Increment or Post-Increment. DS70290J-page 48 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 4-6: BIT-REVERSED ADDRESS EXAMPLE Sequential Address b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 0 Bit Locations Swapped Left-to-Right Around Center of Binary Value b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b1 b2 b3 b4 0 Bit-Reversed Address Pivot Point XB = 0x0008 for a 16-Word Bit-Reversed Buffer TABLE 4-24: BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY) Normal Address Bit-Reversed Address A3 A2 A1 A0 Decimal A3 A2 A1 A0 Decimal 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 0 0 0 8 0 0 1 0 2 0 1 0 0 4 0 0 1 1 3 1 1 0 0 12 0 1 0 0 4 0 0 1 0 2 0 1 0 1 5 1 0 1 0 10 0 1 1 0 6 0 1 1 0 6 0 1 1 1 7 1 1 1 0 14 1 0 0 0 8 0 0 0 1 1 1 0 0 1 9 1 0 0 1 9 1 0 1 0 10 0 1 0 1 5 1 0 1 1 11 1 1 0 1 13 1 1 0 0 12 0 0 1 1 3 1 1 0 1 13 1 0 1 1 11 1 1 1 0 14 0 1 1 1 7 1 1 1 1 15 1 1 1 1 15 (c) 2007-2011 Microchip Technology Inc. DS70290J-page 49 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 4.8 Interfacing Program and Data Memory Spaces 4.8.1 Since the address ranges for the data and program spaces are 16 and 24 bits, respectively, a method is needed to create a 23-bit or 24-bit program address from 16-bit data registers. The solution depends on the interface method to be used. The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 architecture uses a 24-bit wide program space and a 16-bit wide data space. The architecture is also a modified Harvard scheme, meaning that data can also be present in the program space. To use this data successfully, it must be accessed in a way that preserves the alignment of information in both spaces. For table operations, the 8-bit Table Page register (TBLPAG) is used to define a 32K word region within the program space. This is concatenated with a 16-bit EA to arrive at a full 24-bit program space address. In this format, the Most Significant bit of TBLPAG is used to determine if the operation occurs in the user memory (TBLPAG<7> = 0) or the configuration memory (TBLPAG<7> = 1). Aside from normal execution, the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 architecture provides two methods by which program space can be accessed during operation: * Using table instructions to access individual bytes or words anywhere in the program space * Remapping a portion of the program space into the data space (Program Space Visibility) For remapping operations, the 8-bit Program Space Visibility register (PSVPAG) is used to define a 16K word page in the program space. When the Most Significant bit of the EA is `1', PSVPAG is concatenated with the lower 15 bits of the EA to form a 23-bit program space address. Unlike table operations, this limits remapping operations strictly to the user memory area. Table instructions allow an application to read or write to small areas of the program memory. This capability makes the method ideal for accessing data tables that need to be updated periodically. It also allows access to all bytes of the program word. The remapping method allows an application to access a large block of data on a read-only basis, which is ideal for look ups from a large table of static data. The application can only access the least significant word of the program word. TABLE 4-25: ADDRESSING PROGRAM SPACE Table 4-25 and Figure 4-7 show how the program EA is created for table operations and remapping accesses from the data EA. Here, P<23:0> refers to a program space word, and D<15:0> refers to a data space word. PROGRAM SPACE ADDRESS CONSTRUCTION Access Space Access Type Program Space Address <23> <22:16> <15> <14:1> Instruction Access (Code Execution) User TBLRD/TBLWT (Byte/Word Read/Write) User TBLPAG<7:0> Configuration TBLPAG<7:0> Data EA<15:0> 1xxx xxxx xxxx xxxx xxxx xxxx Program Space Visibility (Block Remap/Read) Note 1: PC<22:1> 0 0xx xxxx xxxx 0xxx xxxx User <0> 0 xxxx xxxx xxx0 Data EA<15:0> xxxx xxxx xxxx xxxx 0 PSVPAG<7:0> 0 xxxx xxxx Data EA<14:0>(1) xxx xxxx xxxx xxxx Data EA<15> is always `1' in this case, but is not used in calculating the program space address. Bit 15 of the address is PSVPAG<0>. DS70290J-page 50 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 4-7: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION Program Counter(1) Program Counter 0 0 23 bits EA Table Operations(2) 1/0 1/0 TBLPAG 8 bits 16 bits 24 bits Select Program Space (Remapping) Visibility(1) 0 1 EA 0 PSVPAG 8 bits 15 bits 23 bits User/Configuration Space Select Byte Select Note 1: The Least Significant bit (LSb) of program space addresses is always fixed as `0' to maintain word alignment of data in the program and data spaces. 2: Table operations are not required to be word-aligned. Table read operations are permitted in the configuration memory space. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 51 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 4.8.2 DATA ACCESS FROM PROGRAM MEMORY USING TABLE INSTRUCTIONS The TBLRDL and TBLWTL instructions offer a direct method of reading or writing the lower word of any address within the program space without going through data space. The TBLRDH and TBLWTH instructions are the only method to read or write the upper 8 bits of a program space word as data. The PC is incremented by two for each successive 24-bit program word. This allows program memory addresses to directly map to data space addresses. Program memory can thus be regarded as two 16-bit wide word address spaces, residing side by side, each with the same address range. TBLRDL and TBLWTL access the space that contains the least significant data word. TBLRDH and TBLWTH access the space that contains the upper data byte. Two table instructions are provided to move byte or word sized (16-bit) data to and from program space. Both function as either byte or word operations. * TBLRDL (Table Read Low): In Word mode, this instruction maps the lower word of the program space location (P<15:0>) to a data address (D<15:0>). FIGURE 4-8: In Byte mode, either the upper or lower byte of the lower program word is mapped to the lower byte of a data address. The upper byte is selected when Byte Select is `1'; the lower byte is selected when it is `0'. * TBLRDH (Table Read High): In Word mode, this instruction maps the entire upper word of a program address (P<23:16>) to a data address. Note that D<15:8>, the `phantom byte', will always be `0'. In Byte mode, this instruction maps the upper or lower byte of the program word to D<7:0> of the data address, as in the TBLRDL instruction. Note that the data will always be `0' when the upper `phantom' byte is selected (Byte Select = 1). In a similar fashion, two table instructions, TBLWTH and TBLWTL, are used to write individual bytes or words to a program space address. The details of their operation are explained in Section 5.0 "Flash Program Memory". For all table operations, the area of program memory space to be accessed is determined by the Table Page register (TBLPAG). TBLPAG covers the entire program memory space of the device, including user and configuration spaces. When TBLPAG<7> = 0, the table page is located in the user memory space. When TBLPAG<7> = 1, the page is located in configuration space. ACCESSING PROGRAM MEMORY WITH TABLE INSTRUCTIONS Program Space TBLPAG 02 23 15 0 0x000000 23 16 8 0 00000000 0x020000 0x030000 00000000 00000000 00000000 `Phantom' Byte TBLRDH.B (Wn<0> = 0) TBLRDL.B (Wn<0> = 1) TBLRDL.B (Wn<0> = 0) TBLRDL.W 0x800000 DS70290J-page 52 The address for the table operation is determined by the data EA within the page defined by the TBLPAG register. Only read operations are shown; write operations are also valid in the user memory area. (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 4.8.3 READING DATA FROM PROGRAM MEMORY USING PROGRAM SPACE VISIBILITY The upper 32 Kbytes of data space may optionally be mapped into any 16K word page of the program space. This option provides transparent access to stored constant data from the data space without the need to use special instructions (such as TBLRDH). Program space access through the data space occurs if the Most Significant bit of the data space EA is `1' and program space visibility is enabled by setting the PSV bit in the Core Control register (CORCON<2>). The location of the program memory space to be mapped into the data space is determined by the Program Space Visibility Page register (PSVPAG). This 8-bit register defines any one of 256 possible pages of 16K words in program space. In effect, PSVPAG functions as the upper 8 bits of the program memory address, with the 15 bits of the EA functioning as the lower bits. By incrementing the PC by 2 for each program memory word, the lower 15 bits of data space addresses directly map to the lower 15 bits in the corresponding program space addresses. Data reads to this area add a cycle to the instruction being executed, since two program memory fetches are required. Although each data space address 8000h and higher maps directly into a corresponding program memory address (see Figure 4-9), only the lower 16 bits of the FIGURE 4-9: 24-bit program word are used to contain the data. The upper 8 bits of any program space location used as data should be programmed with `1111 1111' or `0000 0000' to force a NOP. This prevents possible issues should the area of code ever be accidentally executed. Note: PSV access is temporarily disabled during table reads/writes. For operations that use PSV and are executed outside a REPEAT loop, the MOV and MOV.D instructions require one instruction cycle in addition to the specified execution time. All other instructions require two instruction cycles in addition to the specified execution time. For operations that use PSV, and are executed inside a REPEAT loop, these instances require two instruction cycles in addition to the specified execution time of the instruction: * Execution in the first iteration * Execution in the last iteration * Execution prior to exiting the loop due to an interrupt * Execution upon re-entering the loop after an interrupt is serviced Any other iteration of the REPEAT loop will allow the instruction using PSV to access data to execute in a single cycle. PROGRAM SPACE VISIBILITY OPERATION When CORCON<2> = 1 and EA<15> = 1: Program Space PSVPAG 02 23 15 Data Space 0 0x000000 0x0000 Data EA<14:0> 0x010000 0x018000 The data in the page designated by PSVPAG is mapped into the upper half of the data memory space... 0x8000 PSV Area 0x800000 (c) 2007-2011 Microchip Technology Inc. ...while the lower 15 bits of the EA specify an exact address within 0xFFFF the PSV area. This corresponds exactly to the same lower 15 bits of the actual program space address. DS70290J-page 53 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 NOTES: DS70290J-page 54 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 5.0 FLASH PROGRAM MEMORY ground (VSS) and Master Clear (MCLR). This allows customers to manufacture boards with unprogrammed devices and then program the digital signal controller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. Note 1: This data sheet summarizes the features of the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 5. "Flash Programming" (DS70191) of the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip web site (www.microchip.com). RTSP is accomplished using TBLRD (table read) and TBLWT (table write) instructions. With RTSP, the user application can write program memory data either in blocks or `rows' of 64 instructions (192 bytes) at a time or a single program memory word, and erase program memory in blocks or `pages' of 512 instructions (1536 bytes) at a time. 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. 5.1 The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices contain internal Flash program memory for storing and executing application code. The memory is readable, writable and erasable during normal operation over the entire VDD range. Flash memory can be programmed in two ways: * In-Circuit Serial ProgrammingTM (ICSPTM) programming capability * Run-Time Self-Programming (RTSP) ICSP allows a dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 device to be serially programmed while in the end application circuit. This is done with two lines for programming clock and programming data (one of the alternate programming pin pairs: PGECx/PGEDx), and three other lines for power (VDD), FIGURE 5-1: Table Instructions and Flash Programming Regardless of the method used, all programming of Flash memory is done with the table read and table write instructions. These allow direct read and write access to the program memory space from the data memory while the device is in normal operating mode. The 24-bit target address in the program memory is formed using bits <7:0> of the TBLPAG register and the Effective Address (EA) from a W register specified in the table instruction, as shown in Figure 5-1. The TBLRDL and the TBLWTL instructions are used to read or write to bits<15:0> of program memory. TBLRDL and TBLWTL can access program memory in both Word and Byte modes. The TBLRDH and TBLWTH instructions are used to read or write to bits<23:16> of program memory. TBLRDH and TBLWTH can also access program memory in Word or Byte mode. ADDRESSING FOR TABLE REGISTERS 24 bits Using Program Counter Program Counter 0 0 Working Reg EA Using Table Instruction 1/0 TBLPAG Reg 8 bits User/Configuration Space Select (c) 2007-2011 Microchip Technology Inc. 16 bits 24-bit EA Byte Select DS70290J-page 55 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 5.2 RTSP Operation The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Flash program memory array is organized into rows of 64 instructions or 192 bytes. RTSP allows the user application to erase a page of memory, which consists of eight rows (512 instructions) at a time, and to program one row or one word at a time. The 8-row erase pages and single row write rows are edge-aligned from the beginning of program memory, on boundaries of 1536 bytes and 192 bytes, respectively. The program memory implements holding buffers that can contain 64 instructions of programming data. Prior to the actual programming operation, the write data must be loaded into the buffers sequentially. The instruction words loaded must always be from a group of 64 boundary. The basic sequence for RTSP programming is to set up a Table Pointer, then do a series of TBLWT instructions to load the buffers. Programming is performed by setting the control bits in the NVMCON register. A total of 64 TBLWTL and TBLWTH instructions are required to load the instructions. All of the table write operations are single-word writes (two instruction cycles) because only the buffers are written. A programming cycle is required for programming each row. 5.3 Programming Operations A complete programming sequence is necessary for programming or erasing the internal Flash in RTSP mode. The processor stalls (waits) until the programming operation is finished. The programming time depends on the FRC accuracy (see Table 22-18) and the value of the FRC Oscillator Tuning register (see Register 8-4). Use the following formula to calculate the minimum and maximum values for the Row Write Time, Page Erase Time, and Word Write Cycle Time parameters (see Table 22-12). EQUATION 5-1: PROGRAMMING TIME The maximum row write time is equal to Equation 5-3. EQUATION 5-3: MAXIMUM ROW WRITE TIME 11064 Cycles T RW = ------------------------------------------------------------------------------------------------ = 1.586ms 7.37 MHz x ( 1 - 0.05 ) x ( 1 - 0.00375 ) Setting the WR bit (NVMCON<15>) starts the operation, and the WR bit is automatically cleared when the operation is finished. 5.4 Flash Memory Resources Many useful resources are provided on the main product page of the Microchip web site for the devices listed in this data sheet. This product page, which can be accessed using this link, contains the latest updates and additional information. Note: 5.4.1 In the event you are not able to access the product page using the link above, enter this URL in your browser: http://www.microchip.com/wwwproducts/ Devices.aspx?dDocName=en530331 KEY RESOURCES * * * * * * Section 5. "Flash Programming" (DS70191) Code Samples Application Notes Software Libraries Webinars All related dsPIC33F/PIC24H Family Reference Manuals Sections * Development Tools 5.5 Control Registers The two SFRs that are used to read and write the program Flash memory are: * NVMCON: Flash Memory Control Register * NVMKEY: Nonvolatile Memory Key Register T --------------------------------------------------------------------------------------------------------------------------7.37 MHz x ( FRC Accuracy )% x ( FRC Tuning )% The NVMCON register (Register 5-1) controls which blocks are to be erased, which memory type is to be programmed and the start of the programming cycle. For example, if the device is operating at +125 C, the FRC accuracy will be 5%. If the TUN<5:0> bits (see Register 8-4) are set to `b111111, the minimum row write time is equal to Equation 5-2. NVMKEY (Register 5-2) is a write-only register that is used for write protection. To start a programming or erase sequence, the user application must consecutively write 0x55 and 0xAA to the NVMKEY register. Refer to Section 5.3 "Programming Operations" for further details. EQUATION 5-2: MINIMUM ROW WRITE TIME 11064 Cycles T RW = ------------------------------------------------------------------------------------------------ = 1.435ms 7.37 MHz x ( 1 + 0.05 ) x ( 1 - 0.00375 ) DS70290J-page 56 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 5-1: NVMCON: FLASH MEMORY CONTROL REGISTER R/SO-0(1) R/W-0(1) R/W-0(1) U-0 U-0 U-0 U-0 U-0 WR WREN WRERR -- -- -- -- -- bit 15 U-0 bit 8 R/W-0(1) -- U-0 ERASE -- U-0 R/W-0(1) R/W-0(1) R/W-0(1) R/W-0(1) (2) -- NVMOP<3:0> bit 7 bit 0 Legend: SO = Settable Only bit R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15 WR: Write Control bit 1 = Initiates a Flash memory program or erase operation. The operation is self-timed and the bit is cleared by hardware once operation is complete 0 = Program or erase operation is complete and inactive bit 14 WREN: Write Enable bit 1 = Enable Flash program/erase operations 0 = Inhibit Flash program/erase operations bit 13 WRERR: Write Sequence Error Flag bit 1 = An improper program or erase sequence attempt or termination has occurred (bit is set automatically on any set attempt of the WR bit) 0 = The program or erase operation completed normally bit 12-7 Unimplemented: Read as `0' bit 6 ERASE: Erase/Program Enable bit 1 = Perform the erase operation specified by NVMOP<3:0> on the next WR command 0 = Perform the program operation specified by NVMOP<3:0> on the next WR command bit 5-4 Unimplemented: Read as `0' bit 3-0 NVMOP<3:0>: NVM Operation Select bits(2) If ERASE = 1: 1111 = Memory bulk erase operation 1101 = Erase General Segment 1100 = Erase Secure Segment 0011 = No operation 0010 = Memory page erase operation 0001 = No operation 0000 = Erase a single Configuration register byte If ERASE = 0: 1111 = No operation 1101 = No operation 1100 = No operation 0011 = Memory word program operation 0010 = No operation 0001 = Memory row program operation 0000 = Program a single Configuration register byte Note 1: 2: These bits can only be reset on POR. All other combinations of NVMOP<3:0> bits are unimplemented. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 57 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 5-2: NVMKEY: NONVOLATILE MEMORY KEY REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 -- -- -- -- -- -- -- -- bit 15 bit 8 W-0 W-0 W-0 W-0 W-0 W-0 W-0 W-0 NVMKEY<7:0> bit 7 bit 0 Legend: SO = Settable Only bit R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15-8 Unimplemented: Read as `0' bit 7-0 NVMKEY<7:0>: Key Register (Write Only) bits DS70290J-page 58 x = Bit is unknown (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 5.5.1 PROGRAMMING ALGORITHM FOR FLASH PROGRAM MEMORY 4. 5. Programmers can program one row of program Flash memory at a time. To do this, it is necessary to erase the 8-row erase page that contains the desired row. The general process is: 1. 2. 3. Read eight rows of program memory (512 instructions) and store in data RAM. Update the program data in RAM with the desired new data. Erase the block (see Example 5-1): a) Set the NVMOP bits (NVMCON<3:0>) to `0010' to configure for block erase. Set the ERASE bit (NVMCON<6>) and the WREN bit (NVMCON<14>). b) Write the starting address of the page to be erased into the TBLPAG and W registers. c) Write 0x55 to NVMKEY. d) Write 0xAA to NVMKEY. e) Set the WR bit (NVMCON<15>). The erase cycle begins and the CPU stalls for the duration of the erase cycle. When the erase is done, the WR bit is cleared automatically. EXAMPLE 5-1: For protection against accidental operations, the write initiate sequence for NVMKEY must be used to allow any erase or program operation to proceed. After the programming command has been executed, the user application must wait for the programming time until programming is complete. The two instructions following the start of the programming sequence should be NOPs, as shown in Example 5-3. ERASING A PROGRAM MEMORY PAGE ; Set up NVMCON for block erase operation MOV #0x4042, W0 MOV W0, NVMCON ; Init pointer to row to be ERASED MOV #tblpage(PROG_ADDR), W0 MOV W0, TBLPAG MOV #tbloffset(PROG_ADDR), W0 TBLWTL W0, [W0] DISI #5 MOV MOV MOV MOV BSET NOP NOP 6. Write the first 64 instructions from data RAM into the program memory buffers (see Example 5-2). Write the program block to Flash memory: a) Set the NVMOP bits to `0001' to configure for row programming. Clear the ERASE bit and set the WREN bit. b) Write 0x55 to NVMKEY. c) Write 0xAA to NVMKEY. d) Set the WR bit. The programming cycle begins and the CPU stalls for the duration of the write cycle. When the write to Flash memory is done, the WR bit is cleared automatically. Repeat steps 4 and 5, using the next available 64 instructions from the block in data RAM by incrementing the value in TBLPAG, until all 512 instructions are written back to Flash memory. #0x55, W0 W0, NVMKEY #0xAA, W1 W1, NVMKEY NVMCON, #WR (c) 2007-2011 Microchip Technology Inc. ; ; Initialize NVMCON ; ; ; ; ; ; ; ; ; ; ; ; Initialize PM Page Boundary SFR Initialize in-page EA[15:0] pointer Set base address of erase block Block all interrupts with priority <7 for next 5 instructions Write the 55 key Write the AA key Start the erase sequence Insert two NOPs after the erase command is asserted DS70290J-page 59 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 EXAMPLE 5-2: LOADING THE WRITE BUFFERS ; Set up NVMCON for row programming operations MOV #0x4001, W0 ; MOV W0, NVMCON ; Initialize NVMCON ; Set up a pointer to the first program memory location to be written ; program memory selected, and writes enabled MOV #0x0000, W0 ; MOV W0, TBLPAG ; Initialize PM Page Boundary SFR MOV #0x6000, W0 ; An example program memory address ; Perform the TBLWT instructions to write the latches ; 0th_program_word MOV #LOW_WORD_0, W2 ; MOV #HIGH_BYTE_0, W3 ; TBLWTL W2, [W0] ; Write PM low word into program latch TBLWTH W3, [W0++] ; Write PM high byte into program latch ; 1st_program_word MOV #LOW_WORD_1, W2 ; MOV #HIGH_BYTE_1, W3 ; TBLWTL W2, [W0] ; Write PM low word into program latch TBLWTH W3, [W0++] ; Write PM high byte into program latch ; 2nd_program_word MOV #LOW_WORD_2, W2 ; MOV #HIGH_BYTE_2, W3 ; TBLWTL W2, [W0] ; Write PM low word into program latch TBLWTH W3, [W0++] ; Write PM high byte into program latch * * * ; 63rd_program_word MOV #LOW_WORD_31, W2 ; MOV #HIGH_BYTE_31, W3 ; TBLWTL W2, [W0] ; Write PM low word into program latch TBLWTH W3, [W0++] ; Write PM high byte into program latch EXAMPLE 5-3: INITIATING A PROGRAMMING SEQUENCE DISI #5 MOV MOV MOV MOV BSET NOP NOP #0x55, W0 W0, NVMKEY #0xAA, W1 W1, NVMKEY NVMCON, #WR DS70290J-page 60 ; Block all interrupts with priority <7 ; for next 5 instructions ; ; ; ; ; ; Write the 55 key Write the AA key Start the erase sequence Insert two NOPs after the erase command is asserted (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 6.0 RESETS A simplified block diagram of the Reset module is shown in Figure 6-1. Note 1: This data sheet summarizes the features of the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 8. "Reset" (DS70192) of the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip web site: (www.microchip.com). Any active source of reset will make the SYSRST signal active. On system Reset, some of the registers associated with the CPU and peripherals are forced to a known Reset state and some are unaffected. 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. A POR clears all the bits, except for the POR bit (RCON<0>), that are set. The user application can set or clear any bit at any time during code execution. The RCON bits only serve as status bits. Setting a particular Reset status bit in software does not cause a device Reset to occur. The Reset module combines all reset sources and controls the device Master Reset Signal, SYSRST. The following is a list of device Reset sources: * * * * * * * * POR: Power-on Reset BOR: Brown-out Reset MCLR: Master Clear Pin Reset SWR: RESET Instruction WDTO: Watchdog Timer Reset CM: Configuration Mismatch Reset TRAPR: Trap Conflict Reset IOPUWR: Illegal Condition Device Reset - Illegal Opcode Reset - Uninitialized W Register Reset - Security Reset FIGURE 6-1: Note: Refer to the specific peripheral section or Section 3.0 "CPU" of this manual for register Reset states. All types of device Reset sets a corresponding status bit in the RCON register to indicate the type of Reset (see Register 6-1). The RCON register also has other bits associated with the Watchdog Timer and device power-saving states. The function of these bits is discussed in other sections of this manual. Note: The status bits in the RCON register should be cleared after they are read so that the next RCON register value after a device Reset is meaningful. RESET MODULE BLOCK DIAGRAM RESET Instruction Glitch Filter MCLR WDT Module Sleep or Idle VDD BOR Internal Regulator SYSRST VDD Rise Detect POR Trap Conflict Illegal Opcode Uninitialized W Register Configuration Mismatch (c) 2007-2011 Microchip Technology Inc. DS70290J-page 61 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 6.1 Resets Resources Many useful resources are provided on the main product page of the Microchip web site for the devices listed in this data sheet. This product page, which can be accessed using this link, contains the latest updates and additional information. Note: 6.1.1 In the event you are not able to access the product page using the link above, enter this URL in your browser: http://www.microchip.com/wwwproducts/ Devices.aspx?dDocName=en530331 KEY RESOURCES * * * * * * Section 8. "Reset" (DS70192) Code Samples Application Notes Software Libraries Webinars All related dsPIC33F/PIC24H Family Reference Manuals Sections * Development Tools DS70290J-page 62 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 6.2 Reset Control Registers RCON: RESET CONTROL REGISTER(1) REGISTER 6-1: R/W-0 R/W-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 TRAPR IOPUWR -- -- -- -- CM VREGS bit 15 bit 8 R/W-0 EXTR R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1 SWR SWDTEN(2) WDTO SLEEP IDLE BOR POR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15 TRAPR: Trap Reset Flag bit 1 = A Trap Conflict Reset has occurred 0 = A Trap Conflict Reset has not occurred bit 14 IOPUWR: Illegal Opcode or Uninitialized W Access Reset Flag bit 1 = An illegal opcode detection, an illegal address mode or uninitialized W register used as an Address Pointer caused a Reset 0 = An illegal opcode or uninitialized W Reset has not occurred bit 13-10 Unimplemented: Read as `0' bit 9 CM: Configuration Mismatch Flag bit 1 = A Configuration Mismatch Reset has occurred 0 = A Configuration Mismatch Reset has NOT occurred bit 8 VREGS: Voltage Regulator Standby During Sleep bit 1 = Voltage regulator is active during Sleep 0 = Voltage regulator goes into Standby mode during Sleep bit 7 EXTR: External Reset (MCLR) Pin bit 1 = A Master Clear (pin) Reset has occurred 0 = A Master Clear (pin) Reset has not occurred bit 6 SWR: Software Reset (Instruction) Flag bit 1 = A RESET instruction has been executed 0 = A RESET instruction has not been executed bit 5 SWDTEN: Software Enable/Disable of WDT bit(2) 1 = WDT is enabled 0 = WDT is disabled bit 4 WDTO: Watchdog Timer Time-out Flag bit 1 = WDT time-out has occurred 0 = WDT time-out has not occurred bit 3 SLEEP: Wake-up from Sleep Flag bit 1 = Device has been in Sleep mode 0 = Device has not been in Sleep mode Note 1: 2: All of the Reset status bits can be set or cleared in software. Setting one of these bits in software does not cause a device Reset. If the FWDTEN Configuration bit is `1' (unprogrammed), the WDT is always enabled, regardless of the SWDTEN bit setting. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 63 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 6-1: RCON: RESET CONTROL REGISTER(1) (CONTINUED) bit 2 IDLE: Wake-up from Idle Flag bit 1 = Device was in Idle mode 0 = Device was not in Idle mode bit 1 BOR: Brown-out Reset Flag bit 1 = A Brown-out Reset has occurred 0 = A Brown-out Reset has not occurred bit 0 POR: Power-on Reset Flag bit 1 = A Power-on Reset has occurred 0 = A Power-on Reset has not occurred Note 1: 2: All of the Reset status bits can be set or cleared in software. Setting one of these bits in software does not cause a device Reset. If the FWDTEN Configuration bit is `1' (unprogrammed), the WDT is always enabled, regardless of the SWDTEN bit setting. DS70290J-page 64 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 6.3 System Reset A warm Reset is the result of all other reset sources, including the RESET instruction. On warm Reset, the device will continue to operate from the current clock source as indicated by the Current Oscillator Selection bits (COSC<2:0>) in the Oscillator Control register (OSCCON<14:12>). The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family of devices have two types of Reset: * Cold Reset * Warm Reset The device is kept in a Reset state until the system power supplies have stabilized at appropriate levels and the oscillator clock is ready. The sequence in which this occurs is shown in Figure 6-2. A cold Reset is the result of a Power-on Reset (POR) or a Brown-out Reset (BOR). On a cold Reset, the FNOSC Configuration bits in the FOSC device Configuration register selects the device clock source. TABLE 6-1: OSCILLATOR DELAY Oscillator Start-up Delay Oscillator Start-up Timer PLL Lock Time Total Delay FRC, FRCDIV16, FRCDIVN TOSCD -- -- TOSCD FRCPLL TOSCD -- TLOCK TOSCD + TLOCK XT TOSCD TOST -- TOSCD + TOST HS TOSCD TOST -- TOSCD + TOST Oscillator Mode EC -- -- -- -- XTPLL TOSCD TOST TLOCK TOSCD + TOST + TLOCK HSPLL TOSCD TOST TLOCK TOSCD + TOST + TLOCK ECPLL -- -- TLOCK TLOCK SOSC TOSCD TOST -- TOSCD + TOST LPRC TOSCD -- -- TOSCD Note 1: 2: 3: TOSCD = Oscillator Start-up Delay (1.1 s max for FRC, 70 s max for LPRC). Crystal Oscillator start-up times vary with crystal characteristics, load capacitance, etc. TOST = Oscillator Start-up Timer Delay (1024 oscillator clock period). For example, TOST = 102.4 s for a 10 MHz crystal and TOST = 32 ms for a 32 kHz crystal. TLOCK = PLL lock time (1.5 ms nominal), if PLL is enabled. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 65 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 6-2: SYSTEM RESET TIMING VBOR Vbor VPOR VDD TPOR POR BOR 1 TBOR 2 3 TPWRT SYSRST 4 Oscillator Clock TOSCD TOST TLOCK 6 TFSCM FSCM 5 Device Status Reset Run Time Note 1: POR: A POR circuit holds the device in Reset when the power supply is turned on. The POR circuit is active until VDD crosses the VPOR threshold and the delay TPOR has elapsed. 2: BOR: The on-chip voltage regulator has a BOR circuit that keeps the device in Reset until VDD crosses the VBOR threshold and the delay TBOR has elapsed. The delay TBOR ensures the voltage regulator output becomes stable. 3: PWRT Timer: The programmable power-up timer continues to hold the processor in Reset for a specific period of time (TPWRT) after a BOR. The delay TPWRT ensures that the system power supplies have stabilized at the appropriate level for full-speed operation. After the delay TPWRT has elapsed, the SYSRST becomes inactive, which in turn enables the selected oscillator to start generating clock cycles. 4: Oscillator Delay: The total delay for the clock to be ready for various clock source selections are given in Table 6-1. Refer to Section 8.0 "Oscillator Configuration" for more information. 5: When the oscillator clock is ready, the processor begins execution from location 0x000000. The user application programs a GOTO instruction at the reset address, which redirects program execution to the appropriate start-up routine. 6: The Fail-Safe Clock Monitor (FSCM), if enabled, begins to monitor the system clock when the system clock is ready and the delay TFSCM elapsed. DS70290J-page 66 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 6-2: OSCILLATOR PARAMETERS Symbol Parameter Value VPOR POR threshold 1.8V nominal TPOR POR extension time 30 s maximum VBOR BOR threshold 2.5V nominal TBOR BOR extension time 100 s maximum TPWRT Programmable power-up time delay 0-128 ms nominal TFSCM Fail-Safe Clock Monitor Delay 900 s maximum Note: 6.4 When the device exits the Reset condition (begins normal operation), the device operating parameters (voltage, frequency, temperature, etc.) must be within their operating ranges, otherwise the device may not function correctly. The user application must ensure that the delay between the time power is first applied, and the time SYSRST becomes inactive, is long enough to get all operating parameters within specification. Power-on Reset (POR) A Power-on Reset (POR) circuit ensures the device is reset from power-on. The POR circuit is active until VDD crosses the VPOR threshold and the delay TPOR has elapsed. The delay TPOR ensures the internal device bias circuits become stable. 6.4.1 Brown-out Reset (BOR) and Power-up timer (PWRT) The on-chip regulator has a Brown-out Reset (BOR) circuit that resets the device when the VDD is too low (VDD < VBOR) for proper device operation. The BOR circuit keeps the device in Reset until VDD crosses VBOR threshold and the delay TBOR has elapsed. The delay TBOR ensures the voltage regulator output becomes stable. The BOR status bit in the Reset Control register (RCON<1>) is set to indicate the Brown-out Reset. The device will not run at full speed after a BOR as the VDD should rise to acceptable levels for full-speed operation. The PWRT provides power-up time delay (TPWRT) to ensure that the system power supplies have stabilized at the appropriate levels for full-speed operation before the SYSRST is released. The device supply voltage characteristics must meet the specified starting voltage and rise rate requirements to generate the POR. Refer to Section 22.0 "Electrical Characteristics" for details. The power-up timer delay (TPWRT) is programmed by the Power-on Reset Timer Value Select bits (FPWRT<2:0>) in the POR Configuration register (FPOR<2:0>), which provide eight settings (from 0 ms to 128 ms). Refer to Section 19.0 "Special Features" for further details. The POR status (POR) bit in the Reset Control (RCON<0>) register is set to indicate the Power-on Reset. Figure 6-3 shows the typical brown-out scenarios. The reset delay (TBOR + TPWRT) is initiated each time VDD rises above the VBOR trip point (c) 2007-2011 Microchip Technology Inc. DS70290J-page 67 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 6-3: BROWN-OUT SITUATIONS VDD VBOR TBOR + TPWRT SYSRST VDD VBOR TBOR + TPWRT SYSRST VDD dips before PWRT expires VDD VBOR TBOR + TPWRT SYSRST 6.5 External Reset (EXTR) The external Reset is generated by driving the MCLR pin low. The MCLR pin is a Schmitt trigger input with an additional glitch filter. Reset pulses that are longer than the minimum pulse-width will generate a Reset. Refer to Section 22.0 "Electrical Characteristics" for minimum pulse-width specifications. The External Reset (MCLR) Pin (EXTR) bit in the Reset Control (RCON) register is set to indicate the MCLR Reset. 6.5.1 EXTERNAL SUPERVISORY CIRCUIT Many systems have external supervisory circuits that generate reset signals to Reset multiple devices in the system. This external Reset signal can be directly connected to the MCLR pin to Reset the device when the rest of system is Reset. 6.5.2 INTERNAL SUPERVISORY CIRCUIT When using the internal power supervisory circuit to Reset the device, the external reset pin (MCLR) should be tied directly or resistively to VDD. In this case, the MCLR pin will not be used to generate a Reset. The external reset pin (MCLR) does not have an internal pull-up and must not be left unconnected. 6.6 Software RESET Instruction (SWR) Whenever the RESET instruction is executed, the device will assert SYSRST, placing the device in a special Reset state. This Reset state will not re-initialize the clock. The clock source in effect prior to the RESET instruction will remain. SYSRST is released at the next instruction cycle, and the reset vector fetch will commence. DS70290J-page 68 The Software Reset (Instruction) Flag bit (SWR) in the Reset Control register (RCON<6>) is set to indicate the software Reset. 6.7 Watchdog Time-out Reset (WDTO) Whenever a Watchdog time-out occurs, the device will asynchronously assert SYSRST. The clock source will remain unchanged. A WDT time-out during Sleep or Idle mode will wake-up the processor, but will not reset the processor. The Watchdog Timer Time-out Flag (WDTO) bit in the Reset Control register (RCON<4>) is set to indicate the Watchdog Reset. Refer to Section 19.4 "Watchdog Timer (WDT)" for more information on Watchdog Reset. 6.8 Trap Conflict Reset If a lower-priority hard trap occurs while a higher-priority trap is being processed, a hard trap conflict Reset occurs. The hard traps include exceptions of priority level 13 through level 15, inclusive. The address error (level 13) and oscillator error (level 14) traps fall into this category. The Trap Reset Flag bit (TRAPR) in the Reset Control register (RCON<15>) is set to indicate the Trap Conflict Reset. Refer to Section 7.0 "Interrupt Controller" for more information on trap conflict Resets. (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 6.9 Configuration Mismatch Reset each program memory section to store the data values. The upper 8 bits should be programmed with 3Fh, which is an illegal opcode value. To maintain the integrity of the Peripheral Pin Select control registers, they are constantly monitored with shadow registers in hardware. If an unexpected change in any of the registers occur (such as cell disturbances caused by ESD or other external events), a Configuration Mismatch Reset occurs. 6.10.2 Any attempts to use the uninitialized W register as an address pointer will Reset the device. The W register array (with the exception of W15) is cleared during all resets and is considered uninitialized until written to. The Configuration Mismatch Flag bit (CM) in the Reset Control register (RCON<9>) is set to indicate the Configuration Mismatch Reset. Refer to Section 10.0 "I/O Ports" for more information on the Configuration Mismatch Reset. Note: 6.10 6.10.3 The PFC occurs when the Program Counter is reloaded as a result of a Call, Jump, Computed Jump, Return, Return from Subroutine, or other form of branch instruction. Illegal Condition Device Reset The VFC occurs when the Program Counter is reloaded with an Interrupt or Trap vector. * Illegal Opcode Reset * Uninitialized W Register Reset * Security Reset Refer to Section 19.6 "Code Protection and CodeGuardTM Security" for more information on Security Reset. The Illegal Opcode or Uninitialized W Access Reset Flag bit (IOPUWR) in the Reset Control register (RCON<14>) is set to indicate the illegal condition device Reset. 6.11 Using the RCON Status Bits The user application can read the Reset Control register (RCON) after any device Reset to determine the cause of the reset. ILLEGAL OPCODE RESET A device Reset is generated if the device attempts to execute an illegal opcode value that is fetched from program memory. Note: The illegal opcode Reset function can prevent the device from executing program memory sections that are used to store constant data. To take advantage of the illegal opcode Reset, use only the lower 16 bits of TABLE 6-3: SECURITY RESET If a Program Flow Change (PFC) or Vector Flow Change (VFC) targets a restricted location in a protected segment (Boot and Secure Segment), that operation will cause a security Reset. The Configuration Mismatch Reset feature and associated Reset flag are not available on all devices. An illegal condition device Reset occurs due to the following sources: 6.10.1 UNINITIALIZED W REGISTER RESET The status bits in the RCON register should be cleared after they are read so that the next RCON register value after a device Reset will be meaningful. Table 6-3 provides a summary of the reset flag bit operation. RESET FLAG BIT OPERATION Flag Bit Set by: Cleared by: TRAPR (RCON<15>) Trap conflict event POR,BOR IOPWR (RCON<14>) Illegal opcode or uninitialized W register access or Security Reset POR,BOR CM (RCON<9>) Configuration Mismatch POR,BOR EXTR (RCON<7>) MCLR Reset POR SWR (RCON<6>) RESET instruction POR,BOR WDTO (RCON<4>) WDT time-out PWRSAV instruction, CLRWDT instruction, POR,BOR SLEEP (RCON<3>) PWRSAV #SLEEP instruction POR,BOR IDLE (RCON<2>) PWRSAV #IDLE instruction POR,BOR BOR (RCON<1>) POR, BOR -- POR (RCON<0>) POR -- Note: All Reset flag bits can be set or cleared by user software. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 69 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 NOTES: DS70290J-page 70 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 7.0 INTERRUPT CONTROLLER Note 1: This data sheet summarizes the features of the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 6. "Interrupts" (DS70184) of the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip web site (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 interrupt controller reduces the numerous peripheral interrupt request signals to a single interrupt request signal to the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 CPU. It has the following features: * Up to eight processor exceptions and software traps * Seven user-selectable priority levels * Interrupt Vector Table (IVT) with up to 118 vectors * A unique vector for each interrupt or exception source * Fixed priority within a specified user priority level * Alternate Interrupt Vector Table (AIVT) for debug support * Fixed interrupt entry and return latencies 7.1 Interrupt Vector Table The Interrupt Vector Table is shown in Figure 7-1. The IVT resides in program memory, starting at location 000004h. The IVT contains 126 vectors consisting of 8 nonmaskable trap vectors plus up to 118 sources of interrupt. In general, each interrupt source has its own vector. Each interrupt vector contains a 24-bit wide address. The value programmed into each interrupt vector location is the starting address of the associated Interrupt Service Routine (ISR). (c) 2007-2011 Microchip Technology Inc. Interrupt vectors are prioritized in terms of their natural priority; this priority is linked to their position in the vector table. Lower addresses generally have a higher natural priority. For example, the interrupt associated with vector 0 will take priority over interrupts at any other vector address. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices implement up to 21 unique interrupts and four nonmaskable traps. These are summarized in Table 7-1 and Table 7-2. 7.1.1 ALTERNATE INTERRUPT VECTOR TABLE The Alternate Interrupt Vector Table (AIVT) is located after the IVT, as shown in Figure 7-1. Access to the AIVT is provided by the ALTIVT control bit (INTCON2<15>). If the ALTIVT bit is set, all interrupt and exception processes use the alternate vectors instead of the default vectors. The alternate vectors are organized in the same manner as the default vectors. The AIVT supports debugging by providing a means to switch between an application and a support environment without requiring the interrupt vectors to be reprogrammed. This feature also enables switching between applications for evaluation of different software algorithms at run time. If the AIVT is not needed, the AIVT should be programmed with the same addresses used in the IVT. 7.2 Reset Sequence A device Reset is not a true exception because the interrupt controller is not involved in the Reset process. The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 device clears its registers in response to a Reset, which forces the PC to zero. The digital signal controller then begins program execution at location 0x000000. The user application can use a GOTO instruction at the Reset address which redirects program execution to the appropriate start-up routine. Note: Any unimplemented or unused vector locations in the IVT and AIVT should be programmed with the address of a default interrupt handler routine that contains a RESET instruction. DS70290J-page 71 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Decreasing Natural Order Priority FIGURE 7-1: Note 1: DS70290J-page 72 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 INTERRUPT VECTOR TABLE Reset - GOTO Instruction Reset - GOTO Address Reserved Oscillator Fail Trap Vector Address Error Trap Vector Stack Error Trap Vector Math Error Trap Vector Reserved Reserved Reserved Interrupt Vector 0 Interrupt Vector 1 ~ ~ ~ Interrupt Vector 52 Interrupt Vector 53 Interrupt Vector 54 ~ ~ ~ Interrupt Vector 116 Interrupt Vector 117 Reserved Reserved Reserved Oscillator Fail Trap Vector Address Error Trap Vector Stack Error Trap Vector Math Error Trap Vector Reserved Reserved Reserved Interrupt Vector 0 Interrupt Vector 1 ~ ~ ~ Interrupt Vector 52 Interrupt Vector 53 Interrupt Vector 54 ~ ~ ~ Interrupt Vector 116 Interrupt Vector 117 Start of Code 0x000000 0x000002 0x000004 0x000014 0x00007C 0x00007E 0x000080 Interrupt Vector Table (IVT)(1) 0x0000FC 0x0000FE 0x000100 0x000102 0x000114 Alternate Interrupt Vector Table (AIVT)(1) 0x00017C 0x00017E 0x000180 0x0001FE 0x000200 See Table 7-1 for the list of implemented interrupt vectors. (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 7-1: INTERRUPT VECTORS Vector Number Interrupt Request (IRQ) Number 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32-36 37 38-72 73 74-125 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24-28 29 30-64 65 65-117 TABLE 7-2: IVT Address AIVT Address Interrupt Source 0x000014 0x000114 INT0 - External Interrupt 0 0x000016 0x000116 IC1 - Input Capture 1 0x000018 0x000118 OC1 - Output Compare 1 0x00001A 0x00011A T1 - Timer1 0x00001C 0x00011C Reserved 0x00001E 0x00011E IC2 - Input Capture 2 0x000020 0x000120 OC2 - Output Compare 2 0x000022 0x000122 T2 - Timer2 0x000024 0x000124 T3 - Timer3 0x000026 0x000126 SPI1E - SPI1 Error 0x000028 0x000128 SPI1 - SPI1 Transfer Done 0x00002A 0x00012A U1RX - UART1 Receiver 0x00002C 0x00012C U1TX - UART1 Transmitter 0x00002E 0x00012E ADC1 - ADC1 0x000030 0x000130 Reserved 0x000032 0x000132 Reserved 0x000034 0x000134 SI2C1 - I2C1 Slave Events 0x000036 0x000136 MI2C1 - I2C1 Master Events 0x000038 0x000138 Reserved 0x00003A 0x00013A Change Notification Interrupt 0x00003C 0x00013C INT1 - External Interrupt 1 0x00003E 0x00013E Reserved 0x000040 0x000140 IC7 - Input Capture 7 0x000042 0x000142 IC8 - Input Capture 8 0x000044-0x00004C 0x000144-0x00014C Reserved 0x00004E 0x00014E INT2 - External Interrupt 2 0x000050-0x000094 0x000150-0x000194 Reserved 0x000096 0x000196 U1E - UART1 Error 0x000098-0x0000FE 0x000198-0x0001FE Reserved TRAP VECTORS Vector Number IVT Address AIVT Address Trap Source 0 0x000004 0x000104 1 0x000006 0x000106 Oscillator Failure 2 0x000008 0x000108 Address Error Reserved 3 0x00000A 0x00010A Stack Error 4 0x00000C 0x00010C Math Error 5 0x00000E 0x00010E Reserved 6 0x000010 0x000110 Reserved 7 0x000012 0x000112 Reserved (c) 2007-2011 Microchip Technology Inc. DS70290J-page 73 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 7.3 Interrupt Resources Many useful resources are provided on the main product page of the Microchip web site for the devices listed in this data sheet. This product page, which can be accessed using this link, contains the latest updates and additional information. Note: 7.3.1 In the event you are not able to access the product page using the link above, enter this URL in your browser: http://www.microchip.com/wwwproducts/ Devices.aspx?dDocName=en530331 KEY RESOURCES * * * * * * Section 6. "Interrupts" (DS70184) Code Samples Application Notes Software Libraries Webinars All related dsPIC33F/PIC24H Family Reference Manuals Sections * Development Tools 7.4 Interrupt Control and Status Registers dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices implement a total of 17 registers for the interrupt controller: * * * * * * Interrupt Control Register 1 (INTCON1) Interrupt Control Register 2 (INTCON2) Interrupt Flag Status Registers (IFSx) Interrupt Enable Control Registers (IECx) Interrupt Priority Control Registers (IPCx) Interrupt Control and Status Register (INTTREG) 7.4.1 INTCON1 AND INTCON2 Global interrupt control functions are controlled from INTCON1 and INTCON2. INTCON1 contains the Interrupt Nesting Disable (NSTDIS) bit as well as the control and status flags for the processor trap sources. The INTCON2 register controls the external interrupt request signal behavior and the use of the Alternate Interrupt Vector Table. 7.4.2 IFSx The IFS registers maintain all of the interrupt request flags. Each source of interrupt has a status bit, which is set by the respective peripherals or external signal and is cleared via software. 7.4.3 IECx The IEC registers maintain all of the interrupt enable bits. These control bits are used to individually enable interrupts from the peripherals or external signals. 7.4.4 IPCx The IPC registers are used to set the Interrupt Priority Level (IPL) for each source of interrupt. Each user interrupt source can be assigned to one of eight priority levels. 7.4.5 INTTREG The INTTREG register contains the associated interrupt vector number and the new CPU Interrupt priority Level, which are latched into the vector number (VECNUM<6:0>) and Interrupt level bits (ILR<3:0>) in the INTTREG register. The new Interrupt Priority Level is the priority of the pending interrupt. The interrupt sources are assigned to the IFSx, IECx and IPCx registers in the same sequence that they are listed in Table 7-1. For example, the INT0 (External Interrupt 0) is shown as having vector number 8 and a natural order priority of 0. Thus, the INT0IF bit is found in IFS0<0>, the INT0IE bit in IEC0<0>, and the INT0IP bits in the first position of IPC0 (IPC0<2:0>). 7.4.6 STATUS REGISTERS Although they are not specifically part of the interrupt control hardware, two of the CPU Control registers contain bits that control interrupt functionality: * The CPU STATUS register, SR, contains the IPL<2:0> bits (SR<7:5>). These bits indicate the current CPU Interrupt Priority Level. The user can change the current CPU priority level by writing to the IPL bits. * The CORCON register contains the IPL3 bit which, together with IPL<2:0>, also indicates the current CPU priority level. IPL3 is a read-only bit, so that trap events cannot be masked by the user software. All Interrupt bits and registers are described in Register 7-1 through Register 7-19. DS70290J-page 74 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 7-1: SR: CPU STATUS REGISTER(1) R-0 R-0 R/C-0 R/C-0 R-0 R/C-0 R -0 R/W-0 OA OB SA SB OAB SAB DA DC bit 15 bit 8 R/W-0(3) R/W-0(3) R/W-0(3) R-0 R/W-0 R/W-0 R/W-0 R/W-0 IPL2(2) IPL1(2) IPL0(2) RA N OV Z C bit 7 bit 0 Legend: C = Clear only bit R = Readable bit U = Unimplemented bit, read as `0' S = Set only bit W = Writable bit -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown IPL<2:0>: CPU Interrupt Priority Level Status bits(2) 111 = CPU Interrupt Priority Level is 7 (15), user interrupts disabled 110 = CPU Interrupt Priority Level is 6 (14) 101 = CPU Interrupt Priority Level is 5 (13) 100 = CPU Interrupt Priority Level is 4 (12) 011 = CPU Interrupt Priority Level is 3 (11) 010 = CPU Interrupt Priority Level is 2 (10) 001 = CPU Interrupt Priority Level is 1 (9) 000 = CPU Interrupt Priority Level is 0 (8) bit 7-5 Note 1: 2: 3: For complete register details, see Register 3-1. The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when IPL<3> = 1. The IPL<2:0> Status bits are read-only when NSTDIS bit (INTCON1<15>) = 1. REGISTER 7-2: U-0 -- bit 15 U-0 -- R/W-0 SATB Legend: R = Readable bit 0' = Bit is cleared Note 1: 2: U-0 -- R/W-0 US R/W-0 EDT R-0 R-0 DL<2:0> R-0 bit 8 R/W-0 SATA bit 7 bit 3 CORCON: CORE CONTROL REGISTER(1) R/W-1 SATDW R/W-0 ACCSAT C = Clear only bit W = Writable bit `x = Bit is unknown R/C-0 IPL3(2) R/W-0 PSV R/W-0 RND R/W-0 IF bit 0 -n = Value at POR `1' = Bit is set U = Unimplemented bit, read as `0' IPL3: CPU Interrupt Priority Level Status bit 3(2) 1 = CPU Interrupt Priority Level is greater than 7 0 = CPU Interrupt Priority Level is 7 or less For complete register details, see Register 3-2. The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU Interrupt Priority Level. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 75 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 7-3: INTCON1: INTERRUPT CONTROL REGISTER 1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 NSTDIS OVAERR OVBERR COVAERR COVBERR OVATE OVBTE COVTE bit 15 bit 8 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 SFTACERR DIV0ERR -- MATHERR ADDRERR STKERR OSCFAIL -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15 NSTDIS: Interrupt Nesting Disable bit 1 = Interrupt nesting is disabled 0 = Interrupt nesting is enabled bit 14 OVAERR: Accumulator A Overflow Trap Flag bit 1 = Trap was caused by overflow of Accumulator A 0 = Trap was not caused by overflow of Accumulator A bit 13 OVBERR: Accumulator B Overflow Trap Flag bit 1 = Trap was caused by overflow of Accumulator B 0 = Trap was not caused by overflow of Accumulator B bit 12 COVAERR: Accumulator A Catastrophic Overflow Trap Flag bit 1 = Trap was caused by catastrophic overflow of Accumulator A 0 = Trap was not caused by catastrophic overflow of Accumulator A bit 11 COVBERR: Accumulator B Catastrophic Overflow Trap Flag bit 1 = Trap was caused by catastrophic overflow of Accumulator B 0 = Trap was not caused by catastrophic overflow of Accumulator B bit 10 OVATE: Accumulator A Overflow Trap Enable bit 1 = Trap overflow of Accumulator A 0 = Trap disabled bit 9 OVBTE: Accumulator B Overflow Trap Enable bit 1 = Trap overflow of Accumulator B 0 = Trap disabled bit 8 COVTE: Catastrophic Overflow Trap Enable bit 1 = Trap on catastrophic overflow of Accumulator A or B enabled 0 = Trap disabled bit 7 SFTACERR: Shift Accumulator Error Status bit 1 = Math error trap was caused by an invalid accumulator shift 0 = Math error trap was not caused by an invalid accumulator shift bit 6 DIV0ERR: Arithmetic Error Status bit 1 = Math error trap was caused by a divide by zero 0 = Math error trap was not caused by a divide by zero bit 5 Unimplemented: Read as `0' bit 4 MATHERR: Arithmetic Error Status bit 1 = Math error trap has occurred 0 = Math error trap has not occurred bit 3 ADDRERR: Address Error Trap Status bit 1 = Address error trap has occurred 0 = Address error trap has not occurred DS70290J-page 76 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 7-3: INTCON1: INTERRUPT CONTROL REGISTER 1 (CONTINUED) bit 2 STKERR: Stack Error Trap Status bit 1 = Stack error trap has occurred 0 = Stack error trap has not occurred bit 1 OSCFAIL: Oscillator Failure Trap Status bit 1 = Oscillator failure trap has occurred 0 = Oscillator failure trap has not occurred bit 0 Unimplemented: Read as `0' (c) 2007-2011 Microchip Technology Inc. DS70290J-page 77 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 7-4: INTCON2: INTERRUPT CONTROL REGISTER 2 R/W-0 R-0 U-0 U-0 U-0 U-0 U-0 U-0 ALTIVT DISI -- -- -- -- -- -- bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 -- -- -- -- -- INT2EP INT1EP INT0EP bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15 ALTIVT: Enable Alternate Interrupt Vector Table bit 1 = Use alternate vector table 0 = Use standard (default) vector table bit 14 DISI: DISI Instruction Status bit 1 = DISI instruction is active 0 = DISI instruction is not active bit 13-3 Unimplemented: Read as `0' bit 2 INT2EP: External Interrupt 2 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge bit 1 INT1EP: External Interrupt 1 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge bit 0 INT0EP: External Interrupt 0 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge DS70290J-page 78 x = Bit is unknown (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 7-5: IFS0: INTERRUPT FLAG STATUS REGISTER 0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 -- -- AD1IF U1TXIF U1RXIF SPI1IF SPI1EIF T3IF bit 15 bit 8 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 T2IF OC2IF IC2IF -- T1IF OC1IF IC1IF INT0IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15-14 Unimplemented: Read as `0' bit 13 AD1IF: ADC1 Conversion Complete Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 12 U1TXIF: UART1 Transmitter Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 11 U1RXIF: UART1 Receiver Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 10 SPI1IF: SPI1 Event Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 9 SPI1EIF: SPI1 Fault Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 8 T3IF: Timer3 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 7 T2IF: Timer2 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 6 OC2IF: Output Compare Channel 2 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 5 IC2IF: Input Capture Channel 2 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 4 Unimplemented: Read as `0' bit 3 T1IF: Timer1 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 2 OC1IF: Output Compare Channel 1 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred (c) 2007-2011 Microchip Technology Inc. x = Bit is unknown DS70290J-page 79 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 7-5: IFS0: INTERRUPT FLAG STATUS REGISTER 0 (CONTINUED) bit 1 IC1IF: Input Capture Channel 1 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 INT0IF: External Interrupt 0 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred DS70290J-page 80 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 7-6: IFS1: INTERRUPT FLAG STATUS REGISTER 1 U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 -- -- INT2IF -- -- -- -- -- bit 15 bit 8 R/W-0 R/W-0 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 IC8IF IC7IF -- INT1IF CNIF -- MI2C1IF SI2C1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15-14 Unimplemented: Read as `0' bit 13 INT2IF: External Interrupt 2 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 12-8 Unimplemented: Read as `0' bit 7 IC8IF: Input Capture Channel 8 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 6 IC7IF: Input Capture Channel 7 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 5 Unimplemented: Read as `0' bit 4 INT1IF: External Interrupt 1 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 3 CNIF: Input Change Notification Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 2 Unimplemented: Read as `0' bit 1 MI2C1IF: I2C1 Master Events Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 SI2C1IF: I2C1 Slave Events Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred (c) 2007-2011 Microchip Technology Inc. x = Bit is unknown DS70290J-page 81 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 7-7: IFS4: INTERRUPT FLAG STATUS REGISTER 4 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 -- -- -- -- -- -- -- -- bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 U-0 -- -- -- -- -- -- U1EIF -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15-2 Unimplemented: Read as `0' bit 1 U1EIF: UART1 Error Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 Unimplemented: Read as `0' DS70290J-page 82 x = Bit is unknown (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 7-8: IEC0: INTERRUPT ENABLE CONTROL REGISTER 0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 -- -- AD1IE U1TXIE U1RXIE SPI1IE SPI1EIE T3IE bit 15 bit 8 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 T2IE OC2IE IC2IE -- T1IE OC1IE IC1IE INT0IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15-14 Unimplemented: Read as `0' bit 13 AD1IE: ADC1 Conversion Complete Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 12 U1TXIE: UART1 Transmitter Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 11 U1RXIE: UART1 Receiver Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 10 SPI1IE: SPI1 Event Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 9 SPI1EIE: SPI1 Error Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 8 T3IE: Timer3 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 7 T2IE: Timer2 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 6 OC2IE: Output Compare Channel 2 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 5 IC2IE: Input Capture Channel 2 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 4 Unimplemented: Read as `0' bit 3 T1IE: Timer1 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 2 OC1IE: Output Compare Channel 1 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled (c) 2007-2011 Microchip Technology Inc. x = Bit is unknown DS70290J-page 83 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 7-8: IEC0: INTERRUPT ENABLE CONTROL REGISTER 0 (CONTINUED) bit 1 IC1IE: Input Capture Channel 1 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 0 INT0IE: External Interrupt 0 Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled DS70290J-page 84 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 7-9: IEC1: INTERRUPT ENABLE CONTROL REGISTER 1 U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 -- -- INT2IE -- -- -- -- -- bit 15 bit 8 R/W-0 R/W-0 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 IC8IE IC7IE -- INT1IE CNIE -- MI2C1IE SI2C1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15-14 Unimplemented: Read as `0' bit 13 INT2IE: External Interrupt 2 Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 12-8 Unimplemented: Read as `0' bit 7 IC8IE: Input Capture Channel 8 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 6 IC7IE: Input Capture Channel 7 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 5 Unimplemented: Read as `0' bit 4 INT1IE: External Interrupt 1 Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 3 CNIE: Input Change Notification Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 2 Unimplemented: Read as `0' bit 1 MI2C1IE: I2C1 Master Events Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 0 SI2C1IE: I2C1 Slave Events Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled (c) 2007-2011 Microchip Technology Inc. x = Bit is unknown DS70290J-page 85 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 7-10: IEC4: INTERRUPT ENABLE CONTROL REGISTER 4 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 -- -- -- -- -- -- -- -- bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 U-0 -- -- -- -- -- -- U1EIE -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15-2 Unimplemented: Read as `0' bit 1 U1EIE: UART1 Error Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 0 Unimplemented: Read as `0' DS70290J-page 86 x = Bit is unknown (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 7-11: U-0 IPC0: INTERRUPT PRIORITY CONTROL REGISTER 0 R/W-1 -- R/W-0 R/W-0 T1IP<2:0> U-0 R/W-1 -- R/W-0 R/W-0 OC1IP<2:0> bit 15 bit 8 U-0 R/W-1 -- R/W-0 IC1IP<2:0> R/W-0 U-0 R/W-1 -- R/W-0 R/W-0 INT0IP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15 Unimplemented: Read as `0' bit 14-12 T1IP<2:0>: Timer1 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as `0' bit 10-8 OC1IP<2:0>: Output Compare Channel 1 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as `0' bit 6-4 IC1IP<2:0>: Input Capture Channel 1 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as `0' bit 2-0 INT0IP<2:0>: External Interrupt 0 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled (c) 2007-2011 Microchip Technology Inc. x = Bit is unknown DS70290J-page 87 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 7-12: U-0 IPC1: INTERRUPT PRIORITY CONTROL REGISTER 1 R/W-1 -- R/W-0 R/W-0 T2IP<2:0> U-0 R/W-1 -- R/W-0 R/W-0 OC2IP<2:0> bit 15 bit 8 U-0 R/W-1 -- R/W-0 IC2IP<2:0> R/W-0 U-0 U-0 U-0 U-0 -- -- -- -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15 Unimplemented: Read as `0' bit 14-12 T2IP<2:0>: Timer2 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as `0' bit 10-8 OC2IP<2:0>: Output Compare Channel 2 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as `0' bit 6-4 IC2IP<2:0>: Input Capture Channel 2 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3-0 Unimplemented: Read as `0' DS70290J-page 88 x = Bit is unknown (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 7-13: U-0 IPC2: INTERRUPT PRIORITY CONTROL REGISTER 2 R/W-1 -- R/W-0 R/W-0 U1RXIP<2:0> U-0 R/W-1 -- R/W-0 R/W-0 SPI1IP<2:0> bit 15 bit 8 U-0 R/W-1 -- R/W-0 SPI1EIP<2:0> R/W-0 U-0 -- R/W-1 R/W-0 R/W-0 T3IP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15 Unimplemented: Read as `0' bit 14-12 U1RXIP<2:0>: UART1 Receiver Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as `0' bit 10-8 SPI1IP<2:0>: SPI1 Event Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7 Unimplemented: Read as `0' bit 6-4 SPI1EIP<2:0>: SPI1 Error Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as `0' bit 2-0 T3IP<2:0>: Timer3 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled (c) 2007-2011 Microchip Technology Inc. x = Bit is unknown DS70290J-page 89 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 7-14: IPC3: INTERRUPT PRIORITY CONTROL REGISTER 3 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 -- -- -- -- -- -- -- -- bit 15 bit 8 U-0 R/W-1 -- R/W-0 AD1IP<2:0> R/W-0 U-0 R/W-1 -- R/W-0 R/W-0 U1TXIP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15-7 Unimplemented: Read as `0' bit 6-4 AD1IP<2:0>: ADC1 Conversion Complete Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as `0' bit 2-0 U1TXIP<2:0>: UART1 Transmitter Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled DS70290J-page 90 x = Bit is unknown (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 7-15: U-0 IPC4: INTERRUPT PRIORITY CONTROL REGISTER 4 R/W-1 -- R/W-0 R/W-0 CNIP<2:0> U-0 U-0 U-0 U-0 -- -- -- -- bit 15 bit 8 U-0 R/W-1 -- R/W-0 MI2C1IP<2:0> R/W-0 U-0 -- R/W-1 R/W-0 R/W-0 SI2C1IP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15 Unimplemented: Read as `0' bit 14-12 CNIP<2:0>: Change Notification Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11-7 Unimplemented: Read as `0' bit 6-4 MI2C1IP<2:0>: I2C1 Master Events Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 Unimplemented: Read as `0' bit 2-0 SI2C1IP<2:0>: I2C1 Slave Events Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled (c) 2007-2011 Microchip Technology Inc. x = Bit is unknown DS70290J-page 91 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 7-16: U-0 IPC5: INTERRUPT PRIORITY CONTROL REGISTER 5 R/W-1 -- R/W-0 R/W-0 IC8IP<2:0> U-0 R/W-1 -- R/W-0 R/W-0 IC7IP<2:0> bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 -- -- -- -- -- R/W-1 R/W-0 R/W-0 INT1IP<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15 Unimplemented: Read as `0' bit 14-12 IC8IP<2:0>: Input Capture Channel 8 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 Unimplemented: Read as `0' bit 10-8 IC7IP<2:0>: Input Capture Channel 7 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 7-3 Unimplemented: Read as `0' bit 2-0 INT1IP<2:0>: External Interrupt 1 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled DS70290J-page 92 x = Bit is unknown (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 7-17: IPC7: INTERRUPT PRIORITY CONTROL REGISTER 7 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 -- -- -- -- -- -- -- -- bit 15 bit 8 U-0 R/W-1 -- R/W-0 INT2IP<2:0> R/W-0 U-0 U-0 U-0 U-0 -- -- -- -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15-7 Unimplemented: Read as `0' bit 6-4 INT2IP<2:0>: External Interrupt 2 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3-0 Unimplemented: Read as `0' (c) 2007-2011 Microchip Technology Inc. x = Bit is unknown DS70290J-page 93 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 7-18: IPC16: INTERRUPT PRIORITY CONTROL REGISTER 16 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 -- -- -- -- -- -- -- -- bit 15 bit 8 U-0 R/W-1 -- R/W-0 U1EIP<2:0> R/W-0 U-0 U-0 U-0 U-0 -- -- -- -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15-7 Unimplemented: Read as `0' bit 6-4 U1EIP<2:0>: UART1 Error Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3-0 Unimplemented: Read as `0' DS70290J-page 94 x = Bit is unknown (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 7-19: INTTREG: INTERRUPT CONTROL AND STATUS REGISTER U-0 U-0 U-0 U-0 -- -- -- -- R-0 R-0 R-0 R-0 ILR<3:0> bit 15 bit 8 U-0 R-0 R-0 -- R-0 R-0 R-0 R-0 R-0 VECNUM<6:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15-12 Unimplemented: Read as `0' bit 11-8 ILR<3:0>: New CPU Interrupt Priority Level bits 1111 = CPU Interrupt Priority Level is 15 * * * 0001 = CPU Interrupt Priority Level is 1 0000 = CPU Interrupt Priority Level is 0 bit 7 Unimplemented: Read as `0' bit 6-0 VECNUM<6:0>: Vector Number of Pending Interrupt bits 0111111 = Interrupt Vector pending is number 135 * * * 0000001 = Interrupt Vector pending is number 9 0000000 = Interrupt Vector pending is number 8 (c) 2007-2011 Microchip Technology Inc. x = Bit is unknown DS70290J-page 95 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 7.5 Interrupt Setup Procedures 7.5.1 INITIALIZATION To configure an interrupt source at initialization: 1. 2. Set the NSTDIS bit (INTCON1<15>) if nested interrupts are not desired. Select the user-assigned priority level for the interrupt source by writing the control bits in the appropriate IPCx register. The priority level will depend on the specific application and type of interrupt source. If multiple priority levels are not desired, the IPCx register control bits for all enabled interrupt sources can be programmed to the same non-zero value. Note: 3. 4. At a device Reset, the IPCx registers are initialized such that all user interrupt sources are assigned to priority level 4. Clear the interrupt flag status bit associated with the peripheral in the associated IFSx register. Enable the interrupt source by setting the interrupt enable control bit associated with the source in the appropriate IECx register. 7.5.2 7.5.3 TRAP SERVICE ROUTINE A Trap Service Routine (TSR) is coded like an ISR, except that the appropriate trap status flag in the INTCON1 register must be cleared to avoid re-entry into the TSR. 7.5.4 INTERRUPT DISABLE All user interrupts can be disabled using this procedure: 1. 2. Push the current SR value onto the software stack using the PUSH instruction. Force the CPU to priority level 7 by inclusive ORing the value OEh with SRL. To enable user interrupts, the POP instruction can be used to restore the previous SR value. Note: Only user interrupts with a priority level of 7 or lower can be disabled. Trap sources (level 8-level 15) cannot be disabled. The DISI instruction provides a convenient way to disable interrupts of priority levels 1-6 for a fixed period of time. Level 7 interrupt sources are not disabled by the DISI instruction. INTERRUPT SERVICE ROUTINE The method used to declare an Interrupt Service Routine (ISR) and initialize the IVT with the correct vector address depends on the programming language (C or Assembler) and the language development toolsuite used to develop the application. In general, the user application must clear the interrupt flag in the appropriate IFSx register for the source of interrupt that the ISR handles. Otherwise, the program will re-enter the ISR immediately after exiting the routine. If the ISR is coded in assembly language, it must be terminated using a RETFIE instruction to unstack the saved PC value, SRL value and old CPU priority level. DS70290J-page 96 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 OSCILLATOR CONFIGURATION The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 oscillator system provides: Note 1: This data sheet summarizes the features of the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 7. "Oscillator" (DS70186) of the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip web site (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. FIGURE 8-1: OSC1 A simplified diagram of the oscillator system is shown in Figure 8-1. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 OSCILLATOR SYSTEM DIAGRAM Primary Oscillator (POSC) XT, HS, EC R(2) S3 PLL S1 OSC2 * External and internal oscillator options as clock sources. * An on-chip PLL to scale the internal operating frequency to the required system clock frequency. * An internal FRC oscillator that can also be used with the PLL, thereby allowing full-speed operation without any external clock generation hardware. * Clock switching between various clock sources. * Programmable clock postscaler for system power savings. * A Fail-Safe Clock Monitor (FSCM) that detects clock failure and takes fail-safe measures. * An Oscillator Control register (OSCCON). * Nonvolatile Configuration bits for main oscillator selection. (1) XTPLL, HSPLL, ECPLL, FRCPLL DOZE<2:0> S2 DOZE 8.0 S1/S3 POSCMD<1:0> FCY(3) FP(3) FRCDIV FRC Oscillator FRCDIVN S7 / 2 FOSC FRCDIV<2:0> TUN<5:0> / 16 FRCDIV16 FRC LPRC LPRC Oscillator Secondary Oscillator (SOSC) SOSC SOSCO S6 S0 S5 S4 LPOSCEN SOSCI Clock Fail S7 Clock Switch Reset NOSC<2:0> FNOSC<2:0> WDT, PWRT, FSCM Timer 1 Note 1: See Figure 8-2 for PLL details. 2: If the Oscillator is used with XT or HS modes, an external parallel resistor with the value of 1 M must be connected. 3: The term FP refers to the clock source for all of the peripherals, while FCY refers to the clock source for the CPU. Throughout this document, FCY and FP are used interchangeably, except in the case of DOZE mode. FP and FCY will be different when DOZE mode is used with any ratio other than 1:1 which is the default. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 97 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 8.1 CPU Clocking System The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 device provides seven system clock options: * * * * * * * Fast RC (FRC) Oscillator FRC Oscillator with PLL Primary (XT, HS or EC) Oscillator Primary Oscillator with PLL Secondary (LP) Oscillator Low-Power RC (LPRC) Oscillator FRC Oscillator with postscaler 8.1.1 8.1.1.1 SYSTEM CLOCK SOURCES Fast RC The Fast RC (FRC) internal oscillator runs at a nominal frequency of 7.37 MHz. User software can tune the FRC frequency. User software can optionally specify a factor (ranging from 1:2 to 1:256) by which the FRC clock frequency is divided. This factor is selected using the FRCDIV<2:0> bits (CLKDIV<10:8>). 8.1.1.2 Primary The primary oscillator can use one of the following as its clock source: * XT (Crystal): Crystals and ceramic resonators in the range of 3 MHz to 10 MHz. The crystal is connected to the OSC1 and OSC2 pins. * HS (High-Speed Crystal): Crystals in the range of 10 MHz to 40 MHz. The crystal is connected to the OSC1 and OSC2 pins. * EC (External Clock): The external clock signal is directly applied to the OSC1 pin. 8.1.1.3 Secondary The secondary (LP) oscillator is designed for low power and uses a 32.768 kHz crystal or ceramic resonator. The LP oscillator uses the SOSCI and SOSCO pins. 8.1.1.4 Low-Power RC The Low-Power RC (LPRC) internal oscIllator runs at a nominal frequency of 32.768 kHz. It is also used as a reference clock by the Watchdog Timer (WDT) and Fail-Safe Clock Monitor (FSCM). 8.1.1.5 FRC The clock signals generated by the FRC and primary oscillators can be optionally applied to an on-chip Phase Locked Loop (PLL) to provide a wide range of output frequencies for device operation. PLL configuration is described in Section 8.1.3 "PLL Configuration". The FRC frequency depends on the FRC accuracy (see Table 22-18) and the value of the FRC Oscillator Tuning register (see Register 8-4). DS70290J-page 98 8.1.2 SYSTEM CLOCK SELECTION The oscillator source used at a device Power-on Reset event is selected using Configuration bit settings. The Oscillator Configuration bit settings are located in the Configuration registers in the program memory. (Refer to Section 19.1 "Configuration Bits" for further details.) The Initial Oscillator Selection Configuration bits, FNOSC<2:0> (FOSCSEL<2:0>), and the Primary Oscillator Mode Select Configuration bits, POSCMD<1:0> (FOSC<1:0>), select the oscillator source that is used at a Power-on Reset. The FRC primary oscillator is the default (unprogrammed) selection. The Configuration bits allow users to choose among 12 different clock modes, shown in Table 8-1. The output of the oscillator (or the output of the PLL if a PLL mode has been selected) FOSC is divided by 2 to generate the device instruction clock (FCY) and the peripheral clock time base (FP). FCY defines the operating speed of the device, and speeds up to 40 MHz are supported by the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 architecture. Instruction execution speed or device operating frequency, FCY, is given by: EQUATION 8-1: DEVICE OPERATING FREQUENCY OSC ------------F CY = F 2 8.1.3 PLL CONFIGURATION The primary oscillator and internal FRC oscillator can optionally use an on-chip PLL to obtain higher speeds of operation. The PLL provides significant flexibility in selecting the device operating speed. A block diagram of the PLL is shown in Figure 8-2. The output of the primary oscillator or FRC, denoted as `FIN', is divided down by a prescale factor (N1) of 2, 3, ... or 33 before being provided to the PLL's Voltage Controlled Oscillator (VCO). The input to the VCO must be selected in the range of 0.8 MHz to 8 MHz. The prescale factor `N1' is selected using the PLLPRE<4:0> bits (CLKDIV<4:0>). The PLL Feedback Divisor, selected using the PLLDIV<8:0> bits (PLLFBD<8:0>), provides a factor `M', by which the input to the VCO is multiplied. This factor must be selected such that the resulting VCO output frequency is in the range of 100 MHz to 200 MHz. The VCO output is further divided by a postscale factor `N2.' This factor is selected using the PLLPOST<1:0> bits (CLKDIV<7:6>). `N2' can be either 2, 4 or 8, and must be selected such that the PLL output frequency (FOSC) is in the range of 12.5 MHz to 80 MHz, which generates device operating speeds of 6.25-40 MIPS. (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 For a primary oscillator or FRC oscillator, output `FIN', The PLL output `FOSC' is given by: EQUATION 8-2: * If PLLDIV<8:0> = 0x1E, then M = 32. This yields a VCO output of 5 x 32 = 160 MHz, which is within the 100-200 MHz ranged needed. * If PLLPOST<1:0> = 0, then N2 = 2. This provides a Fosc of 160/2 = 80 MHz. The resultant device operating speed is 80/2 = 40 MIPS. FOSC CALCULATION M F OSC = F IN ---------------------- N1 N2 EQUATION 8-3: For example, suppose a 10 MHz crystal is being used, with "XT with PLL" being the selected oscillator mode. 1 10000000 32 OSC F CY = F ------------= --- ------------------------------------- = 40 MIPS 2 2 2 2 * If PLLPRE<4:0> = 0, then N1 = 2. This yields a VCO input of 10/2 = 5 MHz, which is within the acceptable range of 0.8-8 MHz. FIGURE 8-2: XT WITH PLL MODE EXAMPLE dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 PLL BLOCK DIAGRAM FVCO 100-200 MHz Here(1) 0.8-8.0 MHz Here(1) Source (Crystal, External Clock or Internal RC) PLLPRE X VCO 12.5-80 MHz Here(1) FOSC PLLPOST PLLDIV N1 Divide by 2-33 M Divide by 2-513 N2 Divide by 2, 4, 8 Note 1: This frequency range must be satisfied at all times. TABLE 8-1: CONFIGURATION BIT VALUES FOR CLOCK SELECTION Oscillator Mode Fast RC Oscillator with Divide-by-N (FRCDIVN) Oscillator Source POSCMD<1:0> FNOSC<2:0> See Note Internal xx 111 1, 2 110 1 101 100 011 1 1 -- 011 -- 011 1 010 010 010 001 000 -- -- 1 1 1 Internal xx Fast RC Oscillator with Divide-by-16 (FRCDIV16) Low-Power RC Oscillator (LPRC) Internal xx Secondary (Timer1) Oscillator (SOSC) Secondary xx Primary Oscillator (HS) with PLL Primary 10 (HSPLL) Primary Oscillator (XT) with PLL Primary 01 (XTPLL) Primary Oscillator (EC) with PLL Primary 00 (ECPLL) Primary Oscillator (HS) Primary 10 Primary Oscillator (XT) Primary 01 Primary Oscillator (EC) Primary 00 Fast RC Oscillator with PLL (FRCPLL) Internal xx Fast RC Oscillator (FRC) Internal xx Note 1: OSC2 pin function is determined by the OSCIOFNC Configuration bit. 2: This is the default oscillator mode for an unprogrammed (erased) device. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 99 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 8.2 Oscillator Resources Many useful resources are provided on the main product page of the Microchip web site for the devices listed in this data sheet. This product page, which can be accessed using this link, contains the latest updates and additional information. Note: 8.2.1 In the event you are not able to access the product page using the link above, enter this URL in your browser: http://www.microchip.com/wwwproducts/ Devices.aspx?dDocName=en530331 KEY RESOURCES * * * * * * Section 7. "Oscillator" (DS70186) Code Samples Application Notes Software Libraries Webinars All related dsPIC33F/PIC24H Family Reference Manuals Sections * Development Tools DS70290J-page 100 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 8.3 Oscillator Control Registers OSCCON: OSCILLATOR CONTROL REGISTER(1,3) REGISTER 8-1: U-0 R-0 -- R-0 R-0 COSC<2:0> U-0 R/W-y R/W-y R/W-y NOSC<2:0>(2) -- bit 15 bit 8 R/W-0 R/W-0 R-0 U-0 R/C-0 U-0 R/W-0 R/W-0 CLKLOCK IOLOCK LOCK -- CF -- LPOSCEN OSWEN bit 7 bit 0 Legend: y = Value set from Configuration bits on POR C = Clear only bit R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15 Unimplemented: Read as `0' bit 14-12 COSC<2:0>: Current Oscillator Selection bits (read-only) 111 = Fast RC oscillator (FRC) with Divide-by-n 110 = Fast RC oscillator (FRC) with Divide-by-16 101 = Low-Power RC oscillator (LPRC) 100 = Secondary oscillator (Sosc) 011 = Primary oscillator (XT, HS, EC) with PLL 010 = Primary oscillator (XT, HS, EC) 001 = Fast RC oscillator (FRC) with PLL 000 = Fast RC oscillator (FRC) bit 11 Unimplemented: Read as `0' bit 10-8 NOSC<2:0>: New Oscillator Selection bits(2) 111 = Fast RC oscillator (FRC) with Divide-by-n 110 = Fast RC oscillator (FRC) with Divide-by-16 101 = Low-Power RC oscillator (LPRC) 100 = Secondary oscillator (Sosc) 011 = Primary oscillator (XT, HS, EC) with PLL 010 = Primary oscillator (XT, HS, EC) 001 = Fast RC oscillator (FRC) with PLL 000 = Fast RC oscillator (FRC) bit 7 CLKLOCK: Clock Lock Enable bit If clock switching is enabled and FSCM is disabled (FOSC<FCKSM> = 0b01) 1 = Clock switching is disabled, system clock source is locked 0 = Clock switching is enabled, system clock source can be modified by clock switching bit 6 IOLOCK: Peripheral Pin Select Lock bit 1 = Peripherial Pin Select is locked, write to Peripheral Pin Select register is not allowed 0 = Peripherial Pin Select is unlocked, write to Peripheral Pin Select register is allowed bit 5 LOCK: PLL Lock Status bit (read-only) 1 = Indicates that PLL is in lock, or PLL start-up timer is satisfied 0 = Indicates that PLL is out of lock, start-up timer is in progress or PLL is disabled bit 4 Unimplemented: Read as `0' Note 1: 2: 3: Writes to this register require an unlock sequence. Refer to Section 7. "Oscillator" (DS70186) in the "dsPIC33F/PIC24H Family Reference Manual" for details. Direct clock switches between any primary oscillator mode with PLL and FRCPLL mode are not permitted. This applies to clock switches in either direction. In these instances, the application must switch to FRC mode as a transition clock source between the two PLL modes. This register is reset only on a Power-on Reset (POR). (c) 2007-2011 Microchip Technology Inc. DS70290J-page 101 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 8-1: OSCCON: OSCILLATOR CONTROL REGISTER(1,3) (CONTINUED) bit 3 CF: Clock Fail Detect bit (read/clear by application) 1 = FSCM has detected clock failure 0 = FSCM has not detected clock failure bit 2 Unimplemented: Read as `0' bit 1 LPOSCEN: Secondary (LP) Oscillator Enable bit 1 = Enable secondary oscillator 0 = Disable secondary oscillator bit 0 OSWEN: Oscillator Switch Enable bit 1 = Request oscillator switch to selection specified by NOSC<2:0> bits 0 = Oscillator switch is complete Note 1: 2: 3: Writes to this register require an unlock sequence. Refer to Section 7. "Oscillator" (DS70186) in the "dsPIC33F/PIC24H Family Reference Manual" for details. Direct clock switches between any primary oscillator mode with PLL and FRCPLL mode are not permitted. This applies to clock switches in either direction. In these instances, the application must switch to FRC mode as a transition clock source between the two PLL modes. This register is reset only on a Power-on Reset (POR). DS70290J-page 102 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 8-2: R/W-0 ROI bit 15 CLKDIV: CLOCK DIVISOR REGISTER(2) R/W-0 R/W-1 DOZE<2:0> Legend: R = Readable bit -n = Value at POR bit 14-12 bit 11 bit 10-8 bit 7-6 bit 5 Note 1: 2: R/W-0 DOZEN(1) R/W-0 R/W-0 FRCDIV<2:0> R/W-0 bit 8 R/W-0 R/W-1 PLLPOST<1:0> bit 7 bit 15 R/W-1 U-0 -- R/W-0 R/W-0 R/W-0 PLLPRE<4:0> R/W-0 R/W-0 bit 0 y = Value set from Configuration bits on POR W = Writable bit U = Unimplemented bit, read as `0' `1' = Bit is set `0' = Bit is cleared x = Bit is unknown ROI: Recover on Interrupt bit 1 = Interrupts will clear the DOZEN bit and the processor clock/peripheral clock ratio is set to 1:1 0 = Interrupts have no effect on the DOZEN bit DOZE<2:0>: Processor Clock Reduction Select bits 111 = FCY/128 110 = FCY/64 101 = FCY/32 100 = FCY/16 011 = FCY/8 (default) 010 = FCY/4 001 = FCY/2 000 = FCY/1 DOZEN: DOZE Mode Enable bit(1) 1 = DOZE<2:0> field specifies the ratio between the peripheral clocks and the processor clocks 0 = Processor clock/peripheral clock ratio forced to 1:1 FRCDIV<2:0>: Internal Fast RC Oscillator Postscaler bits 111 = FRC divide by 256 110 = FRC divide by 64 101 = FRC divide by 32 100 = FRC divide by 16 011 = FRC divide by 8 010 = FRC divide by 4 001 = FRC divide by 2 000 = FRC divide by 1 (default) PLLPOST<1:0>: PLL VCO Output Divider Select bits (also denoted as `N2', PLL postscaler) 11 = Output/8 10 = Reserved 01 = Output/4 (default) 00 = Output/2 Unimplemented: Read as `0' This bit is cleared when the ROI bit is set and an interrupt occurs. This register is reset only on a Power-on Reset (POR). (c) 2007-2011 Microchip Technology Inc. DS70290J-page 103 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 8-2: bit 4-0 Note 1: 2: CLKDIV: CLOCK DIVISOR REGISTER(2) (CONTINUED) PLLPRE<4:0>: PLL Phase Detector Input Divider bits (also denoted as `N1', PLL prescaler) 11111 = Input/33 * * * 00001 = Input/3 00000 = Input/2 (default) This bit is cleared when the ROI bit is set and an interrupt occurs. This register is reset only on a Power-on Reset (POR). DS70290J-page 104 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 8-3: PLLFBD: PLL FEEDBACK DIVISOR REGISTER(1) U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 -- -- -- -- -- -- -- PLLDIV<8> bit 15 bit 8 R/W-0 R/W-0 R/W-1 R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 PLLDIV<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-9 Unimplemented: Read as `0' bit 8-0 PLLDIV<8:0>: PLL Feedback Divisor bits (also denoted as `M', PLL multiplier) 111111111 = 513 * * * 000110000 = 50 (default) * * * 000000010 = 4 000000001 = 3 000000000 = 2 Note 1: This register is reset only on a Power-on Reset (POR). (c) 2007-2011 Microchip Technology Inc. DS70290J-page 105 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 8-4: OSCTUN: FRC OSCILLATOR TUNING REGISTER(2) U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 -- -- -- -- -- -- -- -- bit 15 bit 8 U-0 U-0 -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 TUN<5:0>(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15-6 Unimplemented: Read as `0' bit 5-0 TUN<5:0>: FRC Oscillator Tuning bits(1) 111111 = Center frequency - 0.375% (7.345 MHz) * * * 100001 = Center frequency - 11.625% (6.52 MHz) 100000 = Center frequency - 12% (6.49 MHz) 011111 = Center frequency + 11.625% (8.23 MHz) 011110 = Center frequency + 11.25% (8.20 MHz) * * * 000001 = Center frequency + 0.375% (7.40 MHz) 000000 = Center frequency (7.37 MHz nominal) Note 1: 2: x = Bit is unknown The OSCTUN functionality has been provided to help customers compensate for temperature effects on the FRC frequency over a wide range of temperatures. The tuning step size is an approximation and is neither characterized nor tested. This register is reset only on a Power-on Reset (POR). DS70290J-page 106 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 8.4 Clock Switching Operation Applications are free to switch among any of the four clock sources (Primary, LP, FRC and LPRC) under software control at any time. To limit the possible side effects of this flexibility, dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices have a safeguard lock built into the switch process. Note: 8.4.1 Primary Oscillator mode has three different submodes (XT, HS and EC), which are determined by the POSCMD<1:0> Configuration bits. While an application can switch to and from Primary Oscillator mode in software, it cannot switch among the different primary submodes without reprogramming the device. ENABLING CLOCK SWITCHING To enable clock switching, the FCKSM1 Configuration bit in the Configuration register must be programmed to `0'. (Refer to Section 19.1 "Configuration Bits" for further details.) If the FCKSM1 Configuration bit is unprogrammed (`1'), the clock switching function and Fail-Safe Clock Monitor function are disabled. This is the default setting. case, the OSWEN bit is cleared automatically and the clock switch is aborted. If a valid clock switch has been initiated, the status bits, LOCK (OSCCON<5>) and CF (OSCCON<3>) are cleared. The new oscillator is turned on by the hardware if it is not currently running. If a crystal oscillator must be turned on, the hardware waits until the Oscillator Start-up Timer (OST) expires. If the new source is using the PLL, the hardware waits until a PLL lock is detected (LOCK = 1). The hardware waits for 10 clock cycles from the new clock source and then performs the clock switch. The hardware clears the OSWEN bit to indicate a successful clock transition. In addition, the NOSC bit values are transferred to the COSC status bits. The old clock source is turned off at this time, with the exception of LPRC (if WDT or FSCM are enabled) or LP (if LPOSCEN remains set). 2. 3. 4. 5. 6. Note 1: The processor continues to execute code throughout the clock switching sequence. Timing-sensitive code should not be executed during this time. 2: Direct clock switches between any primary oscillator mode with PLL and FRCPLL mode are not permitted. This applies to clock switches in either direction. In these instances, the application must switch to FRC mode as a transition clock source between the two PLL modes. 3: Refer to Section 7. "Oscillator" (DS70186) in the "dsPIC33F/PIC24H Family Reference Manual" for details. The NOSC control bits (OSCCON<10:8>) do not control the clock selection when clock switching is disabled. However, the COSC bits (OSCCON<14:12>) reflect the clock source selected by the FNOSC Configuration bits. The OSWEN control bit (OSCCON<0>) has no effect when clock switching is disabled. It is held at `0' at all times. 8.4.2 Performing sequence: 1. 2. 3. 4. 5. OSCILLATOR SWITCHING SEQUENCE a clock switch requires this basic If desired, read the COSC bits (OSCCON<14:12>) to determine the current oscillator source. Perform the unlock sequence to allow a write to the OSCCON register high byte. Write the appropriate value to the NOSC control bits (OSCCON<10:8>) for the new oscillator source. Perform the unlock sequence to allow a write to the OSCCON register low byte. Set the OSWEN bit to initiate the oscillator switch. Once the basic sequence is completed, the system clock hardware responds automatically as follows: 1. The clock switching hardware compares COSC status bits with the new value of NOSC control bits. If they are the same, clock switch is a redundant operation. In (c) 2007-2011 Microchip Technology Inc. the the the this 8.5 Fail-Safe Clock Monitor (FSCM) The Fail-Safe Clock Monitor (FSCM) allows the device to continue to operate even in the event of an oscillator failure. The FSCM function is enabled by programming. If the FSCM function is enabled, the LPRC internal oscillator runs at all times (except during Sleep mode) and is not subject to control by the Watchdog Timer. In the event of an oscillator failure, the FSCM generates a clock failure trap event and switches the system clock over to the FRC oscillator. Then the application program can either attempt to restart the oscillator or execute a controlled shutdown. The trap can be treated as a warm Reset by simply loading the Reset address into the oscillator fail trap vector. If the PLL multiplier is used to scale the system clock, the internal FRC is also multiplied by the same factor on clock failure. Essentially, the device switches to FRC with PLL on a clock failure. DS70290J-page 107 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 NOTES: DS70290J-page 108 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 9.0 POWER-SAVING FEATURES Note 1: This data sheet summarizes the features of the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 9. "Watchdog Timer and Power-Saving Modes" (DS70196) of the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip web site (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices provide the ability to manage power consumption by selectively managing clocking to the CPU and the peripherals. In general, a lower clock frequency and a reduction in the number of circuits being clocked constitutes lower consumed power. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices can manage power consumption in four different ways: * * * * Clock frequency Instruction-based Sleep and Idle modes Software-controlled Doze mode Selective peripheral control in software Combinations of these methods can be used to selectively tailor an application's power consumption while still maintaining critical application features, such as timing-sensitive communications. 9.1 Clock Frequency and Clock Switching dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices allow a wide range of clock frequencies to be selected under application control. If the system clock configuration is not locked, users can choose low-power or high-precision oscillators by simply changing the NOSC bits (OSCCON<10:8>). The process of changing a system clock during operation, as well as limitations to the process, are discussed in more detail in Section 8.0 "Oscillator Configuration". EXAMPLE 9-1: 9.2 Instruction-Based Power-Saving Modes dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices have two special power-saving modes that are entered through the execution of a special PWRSAV instruction. Sleep mode stops clock operation and halts all code execution. Idle mode halts the CPU and code execution, but allows peripheral modules to continue operation. The Assembler syntax of the PWRSAV instruction is shown in Example 9-1. Note: SLEEP_MODE and IDLE_MODE are constants defined in the assembler include file for the selected device. Sleep and Idle modes can be exited as a result of an enabled interrupt, WDT time-out or a device Reset. When the device exits these modes, it is said to wake-up. 9.2.1 SLEEP MODE The following occur in Sleep mode: * The system clock source is shut down. If an on-chip oscillator is used, it is turned off. * The device current consumption is reduced to a minimum, provided that no I/O pin is sourcing current. * The Fail-Safe Clock Monitor does not operate, since the system clock source is disabled. * The LPRC clock continues to run if the WDT is enabled. * The WDT, if enabled, is automatically cleared prior to entering Sleep mode. * Some device features or peripherals may continue to operate. This includes items such as the input change notification on the I/O ports, or peripherals that use an external clock input. * Any peripheral that requires the system clock source for its operation is disabled. The device will wake-up from Sleep mode on any of the these events: * Any interrupt source that is individually enabled * Any form of device Reset * A WDT time-out On wake-up from Sleep mode, the processor restarts with the same clock source that was active when Sleep mode was entered. PWRSAV INSTRUCTION SYNTAX PWRSAV #SLEEP_MODE PWRSAV #IDLE_MODE ; Put the device into SLEEP mode ; Put the device into IDLE mode (c) 2007-2011 Microchip Technology Inc. DS70290J-page 109 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 9.2.2 IDLE MODE The following occur in Idle mode: * The CPU stops executing instructions. * The WDT is automatically cleared. * The system clock source remains active. By default, all peripheral modules continue to operate normally from the system clock source, but can also be selectively disabled (see Section 9.4 "Peripheral Module Disable"). * If the WDT or FSCM is enabled, the LPRC also remains active. The device will wake from Idle mode on any of these events: * Any interrupt that is individually enabled. * Any form of device Reset * A WDT time-out Doze mode is enabled by setting the DOZEN bit (CLKDIV<11>). The ratio between peripheral and core clock speed is determined by the DOZE<2:0> bits (CLKDIV<14:12>). There are eight possible configurations, from 1:1 to 1:128, with 1:1 being the default setting. Programs can use Doze mode to selectively reduce power consumption in event-driven applications. This allows clock-sensitive functions, such as synchronous communications, to continue without interruption while the CPU idles, waiting for something to invoke an interrupt routine. An automatic return to full-speed CPU operation on interrupts can be enabled by setting the ROI bit (CLKDIV<15>). By default, interrupt events have no effect on Doze mode operation. On wake-up from Idle mode, the clock is reapplied to the CPU and instruction execution will begin (2-4 cycles later), starting with the instruction following the PWRSAV instruction, or the first instruction in the ISR. For example, suppose the device is operating at 20 MIPS and the CAN module has been configured for 500 kbps based on this device operating speed. If the device is placed in Doze mode with a clock frequency ratio of 1:4, the CAN module continues to communicate at the required bit rate of 500 kbps, but the CPU now starts executing instructions at a frequency of 5 MIPS. 9.2.3 9.4 INTERRUPTS COINCIDENT WITH POWER SAVE INSTRUCTIONS Any interrupt that coincides with the execution of a PWRSAV instruction is held off until entry into Sleep or Idle mode has completed. The device then wakes up from Sleep or Idle mode. 9.3 Doze Mode The preferred strategies for reducing power consumption are changing clock speed and invoking one of the power-saving modes. In some circumstances, however, these are not practical. For example, it may be necessary for an application to maintain uninterrupted synchronous communication, even while it is doing nothing else. Reducing system clock speed can introduce communication errors, while using a power-saving mode can stop communications completely. Doze mode is a simple and effective alternative method to reduce power consumption while the device is still executing code. In this mode, the system clock continues to operate from the same source and at the same speed. Peripheral modules continue to be clocked at the same speed, while the CPU clock speed is reduced. Synchronization between the two clock domains is maintained, allowing the peripherals to access the SFRs while the CPU executes code at a slower rate. DS70290J-page 110 Peripheral Module Disable The Peripheral Module Disable (PMD) registers provide a method to disable a peripheral module by stopping all clock sources supplied to that module. When a peripheral is disabled using the appropriate PMD control bit, the peripheral is in a minimum power consumption state. The control and status registers associated with the peripheral are also disabled, so writes to those registers will have no effect and read values will be invalid. A peripheral module is enabled only if both the associated bit in the PMD register is cleared and the peripheral is supported by the specific dsPIC(R) DSC variant. If the peripheral is present in the device, it is enabled in the PMD register by default. Note: If a PMD bit is set, the corresponding module is disabled after a delay of one instruction cycle. Similarly, if a PMD bit is cleared, the corresponding module is enabled after a delay of one instruction cycle (assuming the module control registers are already configured to enable module operation). (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 9.5 Power-Saving Resources Many useful resources are provided on the main product page of the Microchip web site for the devices listed in this data sheet. This product page, which can be accessed using this link, contains the latest updates and additional information. Note: 9.5.1 In the event you are not able to access the product page using the link above, enter this URL in your browser: http://www.microchip.com/wwwproducts/ Devices.aspx?dDocName=en530331 KEY RESOURCES * Section 9. "Watchdog Timer and Power-Saving Modes" (DS70196) * Code Samples * Application Notes * Software Libraries * Webinars * All related dsPIC33F/PIC24H Family Reference Manuals Sections * Development Tools (c) 2007-2011 Microchip Technology Inc. DS70290J-page 111 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 9.6 Power-Saving Control Registers REGISTER 9-1: PMD1: PERIPHERAL MODULE DISABLE CONTROL REGISTER 1 U-0 U-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 -- -- T3MD T2MD T1MD -- -- -- bit 15 bit 8 R/W-0 U-0 R/W-0 U-0 R/W-0 U-0 U-0 R/W-0 I2C1MD -- U1MD -- SPI1MD -- -- AD1MD(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15-14 Unimplemented: Read as `0' bit 13 T3MD: Timer3 Module Disable bit 1 = Timer3 module is disabled 0 = Timer3 module is enabled bit 12 T2MD: Timer2 Module Disable bit 1 = Timer2 module is disabled 0 = Timer2 module is enabled bit 11 T1MD: Timer1 Module Disable bit 1 = Timer1 module is disabled 0 = Timer1 module is enabled bit 10-8 Unimplemented: Read as `0' bit 7 I2C1MD: I2C1 Module Disable bit 1 = I2C1 module is disabled 0 = I2C1 module is enabled bit 6 Unimplemented: Read as `0' bit 5 U1MD: UART1 Module Disable bit 1 = UART1 module is disabled 0 = UART1 module is enabled bit 4 Unimplemented: Read as `0' bit 3 SPI1MD: SPI1 Module Disable bit 1 = SPI1 module is disabled 0 = SPI1 module is enabled bit 2-1 Unimplemented: Read as `0' bit 0 AD1MD: ADC1 Module Disable bit(1) 1 = ADC1 module is disabled 0 = ADC1 module is enabled Note 1: x = Bit is unknown PCFGx bits have no effect if the ADC module is disabled by setting this bit. In this case, all port pins multiplexed with ANx will be in Digital mode. DS70290J-page 112 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 9-2: PMD2: PERIPHERAL MODULE DISABLE CONTROL REGISTER 2 R/W-0 R/W-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 IC8MD IC7MD -- -- -- -- IC2MD IC1MD bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 -- -- -- -- -- -- OC2MD OC1MD bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15 IC8MD: Input Capture 8 Module Disable bit 1 = Input Capture 8 module is disabled 0 = Input Capture 8 module is enabled bit 14 IC7MD: Input Capture 2 Module Disable bit 1 = Input Capture 7 module is disabled 0 = Input Capture 7 module is enabled bit 13-10 Unimplemented: Read as `0' bit 9 IC2MD: Input Capture 2 Module Disable bit 1 = Input Capture 2 module is disabled 0 = Input Capture 2 module is enabled bit 8 IC1MD: Input Capture 1 Module Disable bit 1 = Input Capture 1 module is disabled 0 = Input Capture 1 module is enabled bit 7-2 Unimplemented: Read as `0' bit 1 OC2MD: Output Compare 2 Module Disable bit 1 = Output Compare 2 module is disabled 0 = Output Compare 2 module is enabled bit 0 OC1MD: Output Compare 1 Module Disable bit 1 = Output Compare 1 module is disabled 0 = Output Compare 1 module is enabled (c) 2007-2011 Microchip Technology Inc. x = Bit is unknown DS70290J-page 113 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 NOTES: DS70290J-page 114 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 10.0 I/O PORTS Note 1: This data sheet summarizes the features of the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 10. "I/O Ports" (DS70193) of the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip web site (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. All of the device pins (except VDD, VSS, MCLR and OSC1/CLKI) are shared among the peripherals and the parallel I/O ports. All I/O input ports feature Schmitt Trigger inputs for improved noise immunity. 10.1 Parallel I/O (PIO) Ports A parallel I/O port that shares a pin with a peripheral is generally subservient to the peripheral. The peripheral's output buffer data and control signals are provided to a pair of multiplexers. The multiplexers select whether the peripheral or the associated port FIGURE 10-1: has ownership of the output data and control signals of the I/O pin. The logic also prevents "loop through", in which a port's digital output can drive the input of a peripheral that shares the same pin. Figure 10-1 shows how ports are shared with other peripherals and the associated I/O pin to which they are connected. When a peripheral is enabled and the peripheral is actively driving an associated pin, the use of the pin as a general purpose output pin is disabled. The I/O pin can be read, but the output driver for the parallel port bit is disabled. If a peripheral is enabled, but the peripheral is not actively driving a pin, that pin can be driven by a port. All port pins have three registers directly associated with their operation as digital I/O. The data direction register (TRISx) determines whether the pin is an input or an output. If the data direction bit is a `1', then the pin is an input. All port pins are defined as inputs after a Reset. Reads from the latch (LATx) read the latch. Writes to the latch, write the latch. Reads from the port (PORTx) read the port pins, while writes to the port pins write the latch. Any bit and its associated data and control registers that are not valid for a particular device will be disabled. That means the corresponding LATx and TRISx registers and the port pin will read as zeros. When a pin is shared with another peripheral or function that is defined as an input only, it is nevertheless regarded as a dedicated port because there is no other competing source of outputs. BLOCK DIAGRAM OF A TYPICAL SHARED PORT STRUCTURE Peripheral Module Output Multiplexers Peripheral Input Data Peripheral Module Enable Peripheral Output Enable Peripheral Output Data PIO Module Read TRIS I/O 1 Output Enable 0 1 Output Data 0 Data Bus D WR TRIS CK Q I/O Pin TRIS Latch D WR LAT + WR Port Q CK Data Latch Read LAT Input Data Read Port (c) 2007-2011 Microchip Technology Inc. DS70290J-page 115 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 10.2 Open-Drain Configuration In addition to the PORT, LAT and TRIS registers for data control, some port pins can also be individually configured for either digital or open-drain output. This is controlled by the Open-Drain Control register, ODCx, associated with each port. Setting any of the bits configures the corresponding pin to act as an open-drain output. The open-drain feature allows the generation of outputs higher than VDD (e.g., 5V) on any desired 5V tolerant pins by using external pull-up resistors. The maximum open-drain voltage allowed is the same as the maximum VIH specification. See "Pin Diagrams" for the available pins and their functionality. 10.3 Configuring Analog Port Pins The AD1PCFG and TRIS registers control the operation of the analog-to-digital (A/D) port pins. The port pins that are desired as analog inputs must have their corresponding TRIS bit set (input). If the TRIS bit is cleared (output), the digital output level (VOH or VOL) will be converted. The AD1PCFGL register has a default value of 0x0000; therefore, all pins that share ANx functions are analog (not digital) by default. When the PORT register is read, all pins configured as analog input channels will read as cleared (a low level). Pins configured as digital inputs will not convert an analog input. Analog levels on any pin that is defined as a digital input (including the ANx pins) can cause the input buffer to consume current that exceeds the device specifications. 10.4 One instruction cycle is required between a port direction change or port write operation and a read operation of the same port. Typically this instruction would be a NOP. Examples are shown in Example 10-1 and Example 10-2. This also applies to PORT bit operations, such as BSET PORTB, # RB0, which are single cycle read-modify-write. All PORT bit operations, such as MOV PORTB, W0 or BSET PORTB, # RBx, read the pin and not the latch. 10.5 MOV MOV NOP BTSS Four control registers are associated with the CN module. The CNEN1 and CNEN2 registers contain the interrupt enable control bits for each of the CN input pins. Setting any of these bits enables a CN interrupt for the corresponding pins. Each CN pin also has a weak pull-up connected to it. The pull-ups act as a current source connected to the pin, and eliminate the need for external resistors when push button or keypad devices are connected. The pull-ups are enabled separately using the CNPU1 and CNPU2 registers, which contain the control bits for each of the CN pins. Setting any of the control bits enables the weak pull-ups for the corresponding pins. Pull-ups on change notification pins should always be disabled when the port pin is configured as a digital output. PORT WRITE/READ 0xFF00, W0 W0, TRISBB ;Configure PORTB<15:8> as inputs ;and PORTB<7:0> as outputs ;Delay 1 cycle ;Next Instruction PORTB, #13 EXAMPLE 10-2: Input Change Notification The input change notification function of the I/O ports allows the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices to generate interrupt requests to the processor in response to a change-of-state on selected input pins. This feature can detect input change-of-states even in Sleep mode, when the clocks are disabled. Depending on the device pin count, up to 31 external signals (CNx pin) can be selected (enabled) for generating an interrupt request on a change-of-state. Note: EXAMPLE 10-1: I/O Port Write/Read Timing PORT BIT OPERATIONS Incorrect: BSET BSET PORTB, #RB1 PORTB, #RB6 ;Set PORTB<RB1> high ;Set PORTB<RB6> high PORTB, #RB1 ;Set PORTB<RB1> high PORTB, #RB6 ;Set PORTB<RB6> high LATB, LATB1 LATB, LATB6 ;Set PORTB<RB1> high ;Set PORTB<RB6> high Correct: BSET NOP BSET NOP Preferred: BSET BSET DS70290J-page 116 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 10.6 Peripheral Pin Select A major challenge in general-purpose devices is providing the largest possible set of peripheral features while minimizing the conflict of features on I/O pins. The challenge is even greater on low-pin count devices. In an application where more than one peripheral must be assigned to a single pin, inconvenient workarounds in application code or a complete redesign may be the only option. Peripheral Pin Select configuration enables peripheral set selection and placement on a wide range of I/O pins. By increasing the pinout options available on a particular device, programmers can better tailor the microcontroller to their entire application, rather than trimming the application to fit the device. The Peripheral Pin Select configuration feature operates over a fixed subset of digital I/O pins. Programmers can independently map the input and/or output of most digital peripherals to any one of these I/O pins. Peripheral Pin Select is performed in software, and generally does not require the device to be reprogrammed. Hardware safeguards are included that prevent accidental or spurious changes to the peripheral mapping, once it has been established. 10.6.1 AVAILABLE PINS The Peripheral Pin Select feature is used with a range of up to 26 pins. The number of available pins depends on the particular device and its pin count. Pins that support the Peripheral Pin Select feature include the designation "RPn" in their full pin designation, where "RP" designates a remappable peripheral and "n" is the remappable pin number. 10.6.2 CONTROLLING PERIPHERAL PIN SELECT Peripheral Pin Select features are controlled through two sets of special function registers: one to map peripheral inputs, and one to map outputs. Because they are separately controlled, a particular peripheral's input and output (if the peripheral has both) can be placed on any selectable function pin without constraint. The association of a peripheral to a peripheral selectable pin is handled in two different ways, depending on whether an input or output is being mapped. (c) 2007-2011 Microchip Technology Inc. 10.6.2.1 Input Mapping The inputs of the Peripheral Pin Select options are mapped on the basis of the peripheral. A control register associated with a peripheral dictates the pin it will be mapped to. The RPINRx registers are used to configure peripheral input mapping (see Register 10-1 through Register 10-9). Each register contains sets of 5-bit fields, with each set associated with one of the remappable peripherals. Programming a given peripheral's bit field with an appropriate 5-bit value maps the RPn pin with that value to that peripheral. For any given device, the valid range of values for any bit field corresponds to the maximum number of Peripheral Pin Selections supported by the device. Figure 10-2 Illustrates remappable pin selection for U1RX input. Note: For input mapping only, the Peripheral Pin Select (PPS) functionality does not have priority over the TRISx settings. Therefore, when configuring the RPn pin for input, the corresponding bit in the TRISx register must also be configured for input (i.e., set to `1'). FIGURE 10-2: REMAPPABLE MUX INPUT FOR U1RX U1RXR<4:0> 0 RP0 1 RP1 2 U1RX input to peripheral RP2 25 RP25 DS70290J-page 117 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REMAPPABLE PERIPHERAL INPUTS(1) TABLE 10-1: Function Name Register Configuration Bits External Interrupt 1 INT1 RPINR0 INT1R<4:0> External Interrupt 2 INT2 RPINR1 INT2R<4:0> Timer2 External Clock T2CK RPINR3 T2CKR<4:0> Timer3 External Clock T3CK RPINR3 T3CKR<4:0> Input Capture 1 IC1 RPINR7 IC1R<4:0> Input Capture 2 IC2 RPINR7 IC2R<4:0> Input Capture 7 IC7 RPINR10 IC7R<4:0> Input Capture 8 IC8 RPINR10 IC8R<4:0> Input Name Output Compare Fault A OCFA RPINR11 OCFAR<4:0> UART1 Receive U1RX RPINR18 U1RXR<4:0> U1CTS RPINR18 U1CTSR<4:0> UART1 Clear To Send SPI1 Data Input SDI1 RPINR20 SDI1R<4:0> SPI1 Clock Input SCK1IN RPINR20 SCK1R<4:0> SS1IN RPINR21 SS1R<4:0> SPI1 Slave Select Input Note 1: 10.6.2.2 Unless otherwise noted, all inputs use the Schmitt input buffers. Output Mapping In contrast to inputs, the outputs of the Peripheral Pin Select options are mapped on the basis of the pin. In this case, a control register associated with a particular pin dictates the peripheral output to be mapped. The RPORx registers are used to control output mapping. Like the RPINRx registers, each register contains sets of 5-bit fields, with each set associated with one RPn pin (see Register 10-10 through Register 10-22). The value of the bit field corresponds to one of the peripherals, and that peripheral's output is mapped to the pin (see Table 10-2 and Figure 10-3). The list of peripherals for output mapping also includes a null value of `00000' because of the mapping technique. This permits any given pin to remain unconnected from the output of any of the pin selectable peripherals. FIGURE 10-3: MULTIPLEXING OF REMAPPABLE OUTPUT FOR RPn RPnR<4:0> Default U1TX Output Enable U1RTS Output Enable 0 3 4 Output Enable OC1 Output Enable OC2 Output Enable Default U1TX Output U1RTS Output 18 19 0 3 4 RPn Output Data OC1 Output OC2 Output DS70290J-page 118 18 19 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 10-2: OUTPUT SELECTION FOR REMAPPABLE PIN (RPn) Function RPnR<4:0> Output Name NULL 00000 RPn tied to default port pin U1TX 00011 RPn tied to UART1 Transmit U1RTS 00100 RPn tied to UART1 Ready To Send SDO1 00111 RPn tied to SPI1 Data Output SCK1OUT 01000 RPn tied to SPI1 Clock Output SS1OUT 01001 RPn tied to SPI1 Slave Select Output OC1 10010 RPn tied to Output Compare 1 OC2 10011 RPn tied to Output Compare 2 10.6.3 CONTROLLING CONFIGURATION CHANGES Because peripheral remapping can be changed during run time, some restrictions on peripheral remapping are needed to prevent accidental configuration changes. dsPIC33F devices include three features to prevent alterations to the peripheral map: * Control register lock sequence * Continuous state monitoring * Configuration bit pin select lock 10.6.3.1 Control Register Lock Under normal operation, writes to the RPINRx and RPORx registers are not allowed. Attempted writes appear to execute normally, but the contents of the registers remain unchanged. To change these registers, they must be unlocked in hardware. The register lock is controlled by the IOLOCK bit (OSCCON<6>). Setting IOLOCK prevents writes to the control registers; clearing IOLOCK allows writes. To set or clear IOLOCK, a specific command sequence must be executed: 1. 2. 3. Write 0x46 to OSCCON<7:0>. Write 0x57 to OSCCON<7:0>. Clear (or set) IOLOCK as a single operation. Note: Unlike the similar sequence with the oscillator's LOCK bit, IOLOCK remains in one state until changed. This allows all of the Peripheral Pin Selects to be configured with a single unlock sequence followed by an update to all control registers, then locked with a second lock sequence. 10.6.3.2 Continuous State Monitoring In addition to being protected from direct writes, the contents of the RPINRx and RPORx registers are constantly monitored in hardware by shadow registers. If an unexpected change in any of the registers occurs (such as cell disturbances caused by ESD or other external events), a Configuration Mismatch Reset will be triggered. 10.6.3.3 Configuration Bit Pin Select Lock As an additional level of safety, the device can be configured to prevent more than one write session to the RPINRx and RPORx registers. The IOL1WAY Configuration bit (FOSC<5>) blocks the IOLOCK bit from being cleared after it has been set once. In the default (unprogrammed) state, IOL1WAY is set, restricting users to one write session. Programming IOL1WAY allows user applications unlimited access (with the proper use of the unlock sequence) to the Peripheral Pin Select registers. MPLAB(R) C30 provides built-in C language functions for unlocking the OSCCON register: __builtin_write_OSCCONL(value) __builtin_write_OSCCONH(value) See MPLAB(R) IDE Help for more information. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 119 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 10.7 1. 2. In some cases, certain pins as defined in TABLE 22-9: "DC Characteristics: I/O Pin Input Specifications" under "Injection Current", have internal protection diodes to VDD and VSS. The term "Injection Current" is also referred to as "Clamp Current". On designated pins, with sufficient external current limiting precautions by the user, I/O pin input voltages are allowed to be greater or less than the data sheet absolute maximum ratings with nominal VDD with respect to the VSS and VDD supplies. Note that when the user application forward biases either of the high or low side internal input clamp diodes, that the resulting current being injected into the device that is clamped internally by the VDD and VSS power rails, may affect the ADC accuracy by four to six counts. I/O pins that are shared with any analog input pin, (i.e., ANx), are always analog pins by default after any reset. Consequently, any pin(s) configured as an analog input pin, automatically disables the digital input pin buffer. As such, any attempt to read a digital input pin will always return a `0' regardless of the digital logic level on the pin if the analog pin is configured. To use a pin as a digital I/O pin on a shared ANx pin, the user application needs to configure the analog pin Configuration registers in the ADC module, (i.e., ADxPCFGL, AD1PCFGH), by setting the appropriate bit that corresponds to that I/O port pin to a `1'. On devices with more than one ADC, both analog pin configurations for both ADC modules must be configured as a digital I/O pin for that pin to function as a digital I/O pin. Note: 3. I/O Helpful Tips Although it is not possible to use a digital input pin when its analog function is enabled, it is possible to use the digital I/O output function, TRISx = 0x0, while the analog function is also enabled. However, this is not recommended, particularly if the analog input is connected to an external analog voltage source, which would create signal contention between the analog signal and the output pin driver. Most I/O pins have multiple functions. Referring to the device pin diagrams in the data sheet, the priorities of the functions allocated to any pins are indicated by reading the pin name from left-to-right. The left most function name takes precedence over any function to its right in the naming convention. For example: AN16/T2CK/T7CK/RC1. This indicates that AN16 is the highest priority in this example and will supersede all other functions to its right in the list. Those other functions to its right, even if enabled, would not work as long as any other function to its left was enabled. This rule applies to all of the functions listed for a given pin. DS70290J-page 120 4. 5. Each CN pin has a configurable internal weak pull-up resistor. The pull-ups act as a current source connected to the pin, and eliminates the need for external resistors in certain applications. The internal pull-up is to ~(VDD-0.8) not VDD. This is still above the minimum VIH of CMOS and TTL devices. When driving LEDs directly, the I/O pin can source or sink more current than what is specified in the VOH/IOH and VOL/IOL DC characteristic specification. The respective IOH and IOL current rating only applies to maintaining the corresponding output at or above the VOH and at or below the VOL levels. However, for LEDs unlike digital inputs of an externally connected device, they are not governed by the same minimum VIH/VIL levels. An I/O pin output can safely sink or source any current less than that listed in the absolute maximum rating section of the data sheet. For example: VOH = 2.4v @ IOH = -8 mA and VDD = 3.3V The maximum output current sourced by any 8 mA I/O pin = 12 mA. LED source current < 12 mA is technically permitted. Refer to the VOH/IOH graphs in Section 22.0 "Electrical Characteristics" for additional information. 10.8 I/O Resources Many useful resources are provided on the main product page of the Microchip web site for the devices listed in this data sheet. This product page, which can be accessed using this link, contains the latest updates and additional information. Note: 10.8.1 In the event you are not able to access the product page using the link above, enter this URL in your browser: http://www.microchip.com/wwwproducts/ Devices.aspx?dDocName=en530331 KEY RESOURCES * * * * * * Section 10. "I/O Ports" (DS70193) Code Samples Application Notes Software Libraries Webinars All related dsPIC33F/PIC24H Family Reference Manual sections * Development Tools (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 10.9 Peripheral Pin Select Registers The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices implement 17 registers for remappable peripheral configuration: * Input Remappable Peripheral Registers (9) * Output Remappable Peripheral Registers (8) Note: Input and Output Register values can only be changed if OSCCON[IOLOCK] = 0. See Section 10.6.3.1 "Control Register Lock" for a specific command sequence. REGISTER 10-1: RPINR0: PERIPHERAL PIN SELECT INPUT REGISTER 0 U-0 U-0 U-0 -- -- -- R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 INT1R<4:0> bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 -- -- -- -- -- -- -- -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as `0' bit 12-8 INT1R<4:0>: Assign External Interrupt 1 (INTR1) to the corresponding RPn pin 11111 = Input tied to Vss 11001 = Input tied to RP25 * * * 00001 = Input tied to RP1 00000 = Input tied to RP0 bit 7-0 Unimplemented: Read as `0' (c) 2007-2011 Microchip Technology Inc. DS70290J-page 121 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 10-2: RPINR1: PERIPHERAL PIN SELECT INPUT REGISTER 1 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 -- -- -- -- -- -- -- -- bit 15 bit 8 U-0 U-0 U-0 -- -- -- R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 INT2R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-5 Unimplemented: Read as `0' bit 4-0 INT2R<4:0>: Assign External Interrupt 2 (INTR2) to the corresponding RPn pin 11111 = Input tied to Vss 11001 = Input tied to RP25 * * * 00001 = Input tied to RP1 00000 = Input tied to RP0 DS70290J-page 122 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 10-3: RPINR3: PERIPHERAL PIN SELECT INPUT REGISTER 3 U-0 U-0 U-0 -- -- -- R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 T3CKR<4:0> bit 15 bit 8 U-0 U-0 U-0 -- -- -- R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 T2CKR<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as `0' bit 12-8 T3CKR<4:0>: Assign Timer3 External Clock (T3CK) to the corresponding RPn pin 11111 = Input tied to Vss 11001 = Input tied to RP25 * * * 00001 = Input tied to RP1 00000 = Input tied to RP0 bit 7-5 Unimplemented: Read as `0' bit 4-0 T2CKR<4:0>: Assign Timer2 External Clock (T2CK) to the corresponding RPn pin 11111 = Input tied to Vss 11001 = Input tied to RP25 * * * 00001 = Input tied to RP1 00000 = Input tied to RP0 (c) 2007-2011 Microchip Technology Inc. DS70290J-page 123 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 10-4: RPINR7: PERIPHERAL PIN SELECT INPUT REGISTER 7 U-0 U-0 U-0 -- -- -- R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 IC2R<4:0> bit 15 bit 8 U-0 U-0 U-0 -- -- -- R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 IC1R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as `0' bit 12-8 IC2R<4:0>: Assign Input Capture 2 (IC2) to the corresponding RPn pin 11111 = Input tied to Vss 11001 = Input tied to RP25 * * * 00001 = Input tied to RP1 00000 = Input tied to RP0 bit 7-5 Unimplemented: Read as `0' bit 4-0 IC1R<4:0>: Assign Input Capture 1 (IC1) to the corresponding RPn pin 11111 = Input tied to Vss 11001 = Input tied to RP25 * * * 00001 = Input tied to RP1 00000 = Input tied to RP0 DS70290J-page 124 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 10-5: RPINR10: PERIPHERAL PIN SELECT INPUT REGISTER 10 U-0 U-0 U-0 -- -- -- R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 IC8R<4:0> bit 15 bit 8 U-0 U-0 U-0 -- -- -- R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 IC7R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15-13 Unimplemented: Read as `0' bit 12-8 IC8R<4:0>: Assign Input Capture 8 (IC8) to the corresponding RPn pin 11111 = Input tied to Vss 11001 = Input tied to RP25 * * * 00001 = Input tied to RP1 00000 = Input tied to RP0 bit 7-5 Unimplemented: Read as `0' bit 4-0 IC7R<4:0>: Assign Input Capture 7 (IC7) to the corresponding RPn pin 11111 = Input tied to Vss 11001 = Input tied to RP25 * * * 00001 = Input tied to RP1 00000 = Input tied to RP0 (c) 2007-2011 Microchip Technology Inc. x = Bit is unknown DS70290J-page 125 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 10-6: RPINR11: PERIPHERAL PIN SELECT INPUT REGISTER 11 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 -- -- -- -- -- -- -- -- bit 15 bit 8 U-0 U-0 U-0 -- -- -- R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 OCFAR<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-5 Unimplemented: Read as `0' bit 4-0 OCFAR<4:0>: Assign Output Capture A (OCFA) to the corresponding RPn pin 11111 = Input tied to Vss 11001 = Input tied to RP25 * * * 00001 = Input tied to RP1 00000 = Input tied to RP0 DS70290J-page 126 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 10-7: RPINR18: PERIPHERAL PIN SELECT INPUT REGISTER 18 U-0 U-0 U-0 -- -- -- R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 U1CTSR<4:0> bit 15 bit 8 U-0 U-0 U-0 -- -- -- R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 U1RXR<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as `0' bit 12-8 U1CTSR<4:0>: Assign UART 1 Clear to Send (U1CTS) to the corresponding RPn pin 11111 = Input tied to Vss 11001 = Input tied to RP25 * * * 00001 = Input tied to RP1 00000 = Input tied to RP0 bit 7-5 Unimplemented: Read as `0' bit 4-0 U1RXR<4:0>: Assign UART 1 Receive (U1RX) to the corresponding RPn pin 11111 = Input tied to Vss 11001 = Input tied to RP25 * * * 00001 = Input tied to RP1 00000 = Input tied to RP0 (c) 2007-2011 Microchip Technology Inc. DS70290J-page 127 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 10-8: RPINR20: PERIPHERAL PIN SELECT INPUT REGISTER 20 U-0 U-0 U-0 -- -- -- R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 SCK1R<4:0> bit 15 bit 8 U-0 U-0 U-0 -- -- -- R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 SDI1R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as `0' bit 12-8 SCK1R<4:0>: Assign SPI 1 Clock Input (SCK1IN) to the corresponding RPn pin 11111 = Input tied to Vss 11001 = Input tied to RP25 * * * 00001 = Input tied to RP1 00000 = Input tied to RP0 bit 7-5 Unimplemented: Read as `0' bit 4-0 SDI1R<4:0>: Assign SPI 1 Data Input (SDI1) to the corresponding RPn pin 11111 = Input tied to Vss 11001 = Input tied to RP25 * * * 00001 = Input tied to RP1 00000 = Input tied to RP0 DS70290J-page 128 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 10-9: RPINR21: PERIPHERAL PIN SELECT INPUT REGISTER 21 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 -- -- -- -- -- -- -- -- bit 15 bit 8 U-0 U-0 U-0 -- -- -- R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 SS1R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-5 Unimplemented: Read as `0' bit 4-0 SS1R<4:0>: Assign SPI1 Slave Select Input (SS1IN) to the corresponding RPn pin 11111 = Input tied to Vss 11001 = Input tied to RP25 * * * 00001 = Input tied to RP1 00000 = Input tied to RP0 (c) 2007-2011 Microchip Technology Inc. DS70290J-page 129 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 10-10: RPOR0: PERIPHERAL PIN SELECT OUTPUT REGISTER 0 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP1R<4:0> bit 15 bit 8 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP0R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as `0' bit 12-8 RP1R<4:0>: Peripheral Output Function is Assigned to RP1 Output Pin (see Table 10-2 for peripheral function numbers) bit 7-5 Unimplemented: Read as `0' bit 4-0 RP0R<4:0>: Peripheral Output Function is Assigned to RP0 Output Pin (see Table 10-2 for peripheral function numbers) REGISTER 10-11: RPOR1: PERIPHERAL PIN SELECT OUTPUT REGISTER 1 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP3R<4:0> bit 15 bit 8 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP2R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as `0' bit 12-8 RP3R<4:0>: Peripheral Output Function is Assigned to RP3 Output Pin (see Table 10-2 for peripheral function numbers) bit 7-5 Unimplemented: Read as `0' bit 4-0 RP2R<4:0>: Peripheral Output Function is Assigned to RP2 Output Pin (see Table 10-2 for peripheral function numbers) DS70290J-page 130 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 10-12: RPOR2: PERIPHERAL PIN SELECT OUTPUT REGISTER 2 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP5R<4:0> bit 15 bit 8 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP4R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as `0' bit 12-8 RP5R<4:0>: Peripheral Output Function is Assigned to RP5 Output Pin (see Table 10-2 for peripheral function numbers) bit 7-5 Unimplemented: Read as `0' bit 4-0 RP4R<4:0>: Peripheral Output Function is Assigned to RP4 Output Pin (see Table 10-2 for peripheral function numbers) REGISTER 10-13: RPOR3: PERIPHERAL PIN SELECT OUTPUT REGISTER 3 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP7R<4:0> bit 15 bit 8 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP6R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as `0' bit 12-8 RP7R<4:0>: Peripheral Output Function is Assigned to RP7 Output Pin (see Table 10-2 for peripheral function numbers) bit 7-5 Unimplemented: Read as `0' bit 4-0 RP6R<4:0>: Peripheral Output Function is Assigned to RP6 Output Pin (see Table 10-2 for peripheral function numbers) (c) 2007-2011 Microchip Technology Inc. DS70290J-page 131 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 10-14: RPOR4: PERIPHERAL PIN SELECT OUTPUT REGISTER 4 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP9R<4:0> bit 15 bit 8 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP8R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as `0' bit 12-8 RP9R<4:0>: Peripheral Output Function is Assigned to RP9 Output Pin (see Table 10-2 for peripheral function numbers) bit 7-5 Unimplemented: Read as `0' bit 4-0 RP8R<4:0>: Peripheral Output Function is Assigned to RP8 Output Pin (see Table 10-2 for peripheral function numbers) REGISTER 10-15: RPOR5: PERIPHERAL PIN SELECT OUTPUT REGISTER 5 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP11R<4:0> bit 15 bit 8 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP10R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as `0' bit 12-8 RP11R<4:0>: Peripheral Output Function is Assigned to RP11 Output Pin (see Table 10-2 for peripheral function numbers) bit 7-5 Unimplemented: Read as `0' bit 4-0 RP10R<4:0>: Peripheral Output Function is Assigned to RP10 Output Pin (see Table 10-2 for peripheral function numbers) DS70290J-page 132 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 10-16: RPOR6: PERIPHERAL PIN SELECT OUTPUT REGISTER 6 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP13R<4:0> bit 15 bit 8 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP12R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as `0' bit 12-8 RP13R<4:0>: Peripheral Output Function is Assigned to RP13 Output Pin (see Table 10-2 for peripheral function numbers) bit 7-5 Unimplemented: Read as `0' bit 4-0 RP12R<4:0>: Peripheral Output Function is Assigned to RP12 Output Pin (see Table 10-2 for peripheral function numbers) REGISTER 10-17: RPOR7: PERIPHERAL PIN SELECT OUTPUT REGISTER 7 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP15R<4:0> bit 15 bit 8 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP14R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as `0' bit 12-8 RP15R<4:0>: Peripheral Output Function is Assigned to RP15 Output Pin (see Table 10-2 for peripheral function numbers) bit 7-5 Unimplemented: Read as `0' bit 4-0 RP14R<4:0>: Peripheral Output Function is Assigned to RP14 Output Pin (see Table 10-2 for peripheral function numbers) (c) 2007-2011 Microchip Technology Inc. DS70290J-page 133 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 10-18: RPOR8: PERIPHERAL PIN SELECT OUTPUT REGISTER 8 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP17R<4:0> bit 15 bit 8 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP16R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as `0' bit 12-8 RP17R<4:0>: Peripheral Output Function is Assigned to RP17 Output Pin (see Table 10-2 for peripheral function numbers) bit 7-5 Unimplemented: Read as `0' bit 4-0 RP16R<4:0>: Peripheral Output Function is Assigned to RP16 Output Pin (see Table 10-2 for peripheral function numbers) REGISTER 10-19: RPOR9: PERIPHERAL PIN SELECT OUTPUT REGISTER 9 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP19R<4:0> bit 15 bit 8 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP18R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as `0' bit 12-8 RP19R<4:0>: Peripheral Output Function is Assigned to RP19 Output Pin (see Table 10-2 for peripheral function numbers) bit 7-5 Unimplemented: Read as `0' bit 4-0 RP18R<4:0>: Peripheral Output Function is Assigned to RP18 Output Pin (see Table 10-2 for peripheral function numbers) DS70290J-page 134 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 10-20: RPOR10: PERIPHERAL PIN SELECT OUTPUT REGISTER 10 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP21R<4:0> bit 15 bit 8 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP20R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as `0' bit 12-8 RP21R<4:0>: Peripheral Output Function is Assigned to RP21 Output Pin (see Table 10-2 for peripheral function numbers) bit 7-5 Unimplemented: Read as `0' bit 4-0 RP20R<4:0>: Peripheral Output Function is Assigned to RP20 Output Pin (see Table 10-2 for peripheral function numbers) REGISTER 10-21: RPOR11: PERIPHERAL PIN SELECT OUTPUT REGISTER 11 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP23R<4:0> bit 15 bit 8 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP22R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as `0' bit 12-8 RP23R<4:0>: Peripheral Output Function is Assigned to RP23 Output Pin (see Table 10-2 for peripheral function numbers) bit 7-5 Unimplemented: Read as `0' bit 4-0 RP22R<4:0>: Peripheral Output Function is Assigned to RP22 Output Pin (see Table 10-2 for peripheral function numbers) (c) 2007-2011 Microchip Technology Inc. DS70290J-page 135 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 10-22: RPOR12: PERIPHERAL PIN SELECT OUTPUT REGISTER 12 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP25R<4:0> bit 15 bit 8 U-0 U-0 U-0 -- -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RP24R<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as `0' bit 12-8 RP25R<4:0>: Peripheral Output Function is Assigned to RP25 Output Pin (see Table 10-2 for peripheral function numbers) bit 7-5 Unimplemented: Read as `0' bit 4-0 RP24R<4:0>: Peripheral Output Function is Assigned to RP24 Output Pin (see Table 10-2 for peripheral function numbers) DS70290J-page 136 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 11.0 TIMER1 Timer1 also supports these features: * Timer gate operation * Selectable prescaler settings * Timer operation during CPU Idle and Sleep modes * Interrupt on 16-bit Period register match or falling edge of external gate signal Note 1: This data sheet summarizes the features of the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 11. "Timers" (DS70205) of the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip web site: (www.microchip.com). Figure 11-1 illustrates a block diagram of the 16-bit timer module. To configure Timer1 for operation: 1. 2. 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. 3. 4. The Timer1 module is a 16-bit timer, which can serve as the time counter for the real-time clock, or operate as a free-running interval timer/counter. Timer1 can operate in three modes: 5. 6. * 16-bit Timer * 16-bit Synchronous Counter * 16-bit Asynchronous Counter FIGURE 11-1: Set the TON bit (= 1) in the T1CON register. Select the timer prescaler ratio using the TCKPS<1:0> bits in the T1CON register. Set the Clock and Gating modes using the TCS and TGATE bits in the T1CON register. Set or clear the TSYNC bit in the T1CON register to select synchronous or asynchronous operation. Load the timer period value into the PR1 register. If interrupts are required, set the interrupt enable bit, T1IE. Use the priority bits, T1IP<2:0>, to set the interrupt priority. 16-BIT TIMER1 MODULE BLOCK DIAGRAM TCKPS<1:0> SOSCO/ T1CK 1x SOSCEN SOSCI Gate Sync 01 TCY 00 Prescaler 1, 8, 64, 256 TGATE TCS TGATE Set T1IF 2 TON 1 Q D 0 Q CK Reset 0 TMR1 1 Equal Comparator Sync TSYNC PR1 (c) 2007-2011 Microchip Technology Inc. DS70290J-page 137 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 11.1 Timer Resources Many useful resources are provided on the main product page of the Microchip web site for the devices listed in this data sheet. This product page, which can be accessed using this link, contains the latest updates and additional information. Note: 11.1.1 In the event you are not able to access the product page using the link above, enter this URL in your browser: http://www.microchip.com/wwwproducts/ Devices.aspx?dDocName=en530331 KEY RESOURCES * * * * * * Section 11. "Timers" (DS70205) Code Samples Application Notes Software Libraries Webinars All related dsPIC33F/PIC24H Family Reference Manuals Sections * Development Tools DS70290J-page 138 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 11.2 Timer1 Control Register REGISTER 11-1: T1CON: TIMER1 CONTROL REGISTER R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 TON -- TSIDL -- -- -- -- -- bit 15 bit 8 U-0 R/W-0 -- TGATE R/W-0 R/W-0 TCKPS<1:0> U-0 R/W-0 R/W-0 U-0 -- TSYNC TCS -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15 TON: Timer1 On bit 1 = Starts 16-bit Timer1 0 = Stops 16-bit Timer1 bit 14 Unimplemented: Read as `0' bit 13 TSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-7 Unimplemented: Read as `0' bit 6 TGATE: Timer1 Gated Time Accumulation Enable bit When TCS = 1: This bit is ignored. When TCS = 0: 1 = Gated time accumulation enabled 0 = Gated time accumulation disabled bit 5-4 TCKPS<1:0> Timer1 Input Clock Prescale Select bits 11 = 1:256 10 = 1:64 01 = 1:8 00 = 1:1 bit 3 Unimplemented: Read as `0' bit 2 TSYNC: Timer1 External Clock Input Synchronization Select bit When TCS = 1: 1 = Synchronize external clock input 0 = Do not synchronize external clock input When TCS = 0: This bit is ignored. bit 1 TCS: Timer1 Clock Source Select bit 1 = External clock from pin T1CK (on the rising edge) 0 = Internal clock (FCY) bit 0 Unimplemented: Read as `0' (c) 2007-2011 Microchip Technology Inc. x = Bit is unknown DS70290J-page 139 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 NOTES: DS70290J-page 140 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 12.0 TIMER2/3 FEATURE Note 1: This data sheet summarizes the features of the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 11. "Timers" (DS70205) of the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip web site (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. For 32-bit timer/counter operation, Timer2 is the least significant word (lsw), and Timer3 is the most significant word (msw) of the 32-bit timers. Note: 12.1 1. 2. 3. 4. As a 32-bit timer, the Timer2/3 feature permits operation in three modes: 5. The Timer2/3 feature also supports: * * * * * Timer gate operation Selectable Prescaler Settings Timer operation during Idle and Sleep modes Interrupt on a 32-bit Period Register Match Time Base for Input Capture and Output Compare Modules (Timer2 and Timer3 only) * ADC1 Event Trigger (Timer2/3 only) Individually, all eight of the 16-bit timers can function as synchronous timers or counters. They also offer the features listed above, except for the event trigger. The operating modes and enabled features are determined by setting the appropriate bit(s) in the T2CON and T3CON registers. T2CON registers are shown in generic form in Register 12-1. T3CON registers are shown in Register 12-2. (c) 2007-2011 Microchip Technology Inc. 32-Bit Operation To configure the Timer2/3 feature for 32-bit operation: The Timer2/3 feature has 32-bit timers that can also be configured as two independent 16-bit timers with selectable operating modes. * Two Independent 16-bit timers (Timer2 and Timer3) with all 16-bit operating modes (except Asynchronous Counter mode) * Single 32-bit timer (Timer2/3) * Single 32-bit synchronous counter (Timer2/3) For 32-bit operation, T3CON control bits are ignored. Only T2CON control bit is used for setup and control. Timer2 clock and gate inputs are used for the 32-bit timer modules, but an interrupt is generated with the Timer3 interrupt flags. 6. Set the corresponding T32 control bit. Select the prescaler ratio for Timer2 using the TCKPS<1:0> bits. Set the Clock and Gating modes using the corresponding TCS and TGATE bits. Load the timer period value. PR3 contains the most significant word of the value, while PR2 contains the least significant word. If interrupts are required, set the interrupt enable bit, T3IE. Use the priority bits T3IP<2:0> to set the interrupt priority. While Timer2 controls the timer, the interrupt appears as a Timer3 interrupt. Set the corresponding TON bit. The timer value at any point is stored in the register pair TMR3:TMR2. TMR3 always contains the most significant word of the count, while TMR2 contains the least significant word. To configure any of the timers for individual 16-bit operation: 1. 2. 3. 4. 5. 6. Clear the T32 bit corresponding to that timer. Select the timer prescaler ratio using the TCKPS<1:0> bits. Set the Clock and Gating modes using the TCS and TGATE bits. Load the timer period value into the PRx register. If interrupts are required, set the interrupt enable bit, TxIE. Use the priority bits, TxIP<2:0>, to set the interrupt priority. Set the TON bit. DS70290J-page 141 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TIMER2/3 (32-BIT) BLOCK DIAGRAM(1) FIGURE 12-1: 1x T2CK Gate Sync 01 TCY 00 TGATE Q 1 Set T3IF Q 0 Equal Prescaler 1, 8, 64, 256 TGATE TCS D CK PR2 PR3 ADC Event Trigger(2) TCKPS<1:0> 2 TON Comparator MSb LSb TMR3 Reset TMR2 Sync 16 Read TMR2 Write TMR2 16 16 TMR3HLD 16 Data Bus<15:0> Note 1: 2: The 32-bit timer control bit, T32, must be set for 32-bit timer/counter operation. All control bits are respective to the T2CON register. The ADC event trigger is available only on Timer2/3. FIGURE 12-2: TIMER2 (16-BIT) BLOCK DIAGRAM T2CK 1x Gate Sync TGATE TON TCKPS<1:0> 2 Prescaler 1, 8, 64, 256 01 00 1 Set T2IF 0 Reset Equal Q D Q CK TMR2 TCS TCY TGATE Sync Comparator PR2 DS70290J-page 142 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 12.2 Timer Resources Many useful resources are provided on the main product page of the Microchip web site for the devices listed in this data sheet. This product page, which can be accessed using this link, contains the latest updates and additional information. Note: 12.2.1 In the event you are not able to access the product page using the link above, enter this URL in your browser: http:// www.microchip.com/wwwproducts/ Devices.aspx?dDocName=en530331 KEY RESOURCES * * * * * * Section 11. "Timers" (DS70205) Code Samples Application Notes Software Libraries Webinars All related dsPIC33F/PIC24H Family Reference Manuals Sections * Development Tools (c) 2007-2011 Microchip Technology Inc. DS70290J-page 143 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 12.3 Timer2/3 Control Registers REGISTER 12-1: T2CON CONTROL REGISTER R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 TON -- TSIDL -- -- -- -- -- bit 15 bit 8 U-0 R/W-0 -- TGATE R/W-0 R/W-0 TCKPS<1:0> R/W-0 U-0 R/W-0 U-0 T32 -- TCS -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15 TON: Timer2 On bit When T32 = 1: 1 = Starts 32-bit Timer2/3 0 = Stops 32-bit Timer2/3 When T32 = 0: 1 = Starts 16-bit Timer2 0 = Stops 16-bit Timer2 bit 14 Unimplemented: Read as `0' bit 13 TSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-7 Unimplemented: Read as `0' bit 6 TGATE: Timer2 Gated Time Accumulation Enable bit When TCS = 1: This bit is ignored. When TCS = 0: 1 = Gated time accumulation enabled 0 = Gated time accumulation disabled bit 5-4 TCKPS<1:0>: Timer2 Input Clock Prescale Select bits 11 = 1:256 10 = 1:64 01 = 1:8 00 = 1:1 bit 3 T32: 32-bit Timer Mode Select bit 1 = Timer2 and Timer3 form a single 32-bit timer 0 = Timer2 and Timer3 act as two 16-bit timers bit 2 Unimplemented: Read as `0' bit 1 TCS: Timer2 Clock Source Select bit 1 = External clock from pin T2CK (on the rising edge) 0 = Internal clock (FCY) bit 0 Unimplemented: Read as `0' DS70290J-page 144 x = Bit is unknown (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 12-2: R/W-0 TON(2) T3CON CONTROL REGISTER U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 -- TSIDL(1) -- -- -- -- -- bit 15 bit 8 U-0 R/W-0 -- TGATE(2) R/W-0 R/W-0 TCKPS<1:0>(2) U-0 -- U-0 R/W-0 U-0 -- TCS(2) -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15 TON: Timer3 On bit(2) 1 = Starts 16-bit Timer3 0 = Stops 16-bit Timer3 bit 14 Unimplemented: Read as `0' bit 13 TSIDL: Stop in Idle Mode bit(1) 1 = Discontinue timer operation when device enters Idle mode 0 = Continue timer operation in Idle mode bit 12-7 Unimplemented: Read as `0' bit 6 TGATE: Timer3 Gated Time Accumulation Enable bit(2) When TCS = 1: This bit is ignored. When TCS = 0: 1 = Gated time accumulation enabled 0 = Gated time accumulation disabled bit 5-4 TCKPS<1:0>: Timer3 Input Clock Prescale Select bits(2) 11 = 1:256 prescale value 10 = 1:64 prescale value 01 = 1:8 prescale value 00 = 1:1 prescale value bit 3-2 Unimplemented: Read as `0' bit 1 TCS: Timer3 Clock Source Select bit(2) 1 = External clock from T3CK pin 0 = Internal clock (FOSC/2) bit 0 Unimplemented: Read as `0' Note 1: 2: x = Bit is unknown When 32-bit timer operation is enabled (T32 = 1) in the Timer Control register (T2CON<3>), the TSIDL bit must be cleared to operate the 32-bit timer in Idle mode. When the 32-bit timer operation is enabled (T32 = 1) in the Timer Control register (T2CON<3>), these bits have no effect. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 145 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 NOTES: DS70290J-page 146 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 13.0 INPUT CAPTURE Note 1: This data sheet summarizes the features of the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 12. "Input Capture" (DS70198) of the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip web site (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. The input capture module is useful in applications requiring frequency (period) and pulse measurement. The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices support up to eight input capture channels. The input capture module captures the 16-bit value of the selected Time Base register when an event occurs at the ICx pin. The events that cause a capture event are listed below in three categories: FIGURE 13-1: * Simple Capture Event modes: - Capture timer value on every falling edge of input at ICx pin - Capture timer value on every rising edge of input at ICx pin * Capture timer value on every edge (rising and falling). * Prescaler Capture Event modes: - Capture timer value on every 4th rising edge of input at ICx pin - Capture timer value on every 16th rising edge of input at ICx pin Each input capture channel can select one of two 16-bit timers (Timer2 or Timer3) for the time base. The selected timer can use either an internal or external clock. Other operational features include: * Device wake-up from capture pin during CPU Sleep and Idle modes * Interrupt on input capture event * 4-word FIFO buffer for capture values - Interrupt optionally generated after 1, 2, 3 or 4 buffer locations are filled * Use of input capture to provide additional sources of external interrupts INPUT CAPTURE BLOCK DIAGRAM From 16-bit Timers TMR2 TMR3 16 16 1 Edge Detection Logic and Clock Synchronizer Prescaler Counter (1, 4, 16) ICx Pin ICM<2:0> (ICxCON<2:0>) Mode Select ICTMR (ICxCON<7>) FIFO 3 0 FIFO R/W Logic ICOV, ICBNE (ICxCON<4:3>) ICxBUF ICxI<1:0> ICxCON System Bus Interrupt Logic Set Flag ICxIF (in IFSn Register) Note: An `x' in a signal, register or bit name denotes the number of the capture channel. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 147 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 13.1 Input Capture Resources Many useful resources are provided on the main product page of the Microchip web site for the devices listed in this data sheet. This product page, which can be accessed using this link, contains the latest updates and additional information. Note: 13.1.1 In the event you are not able to access the product page using the link above, enter this URL in your browser: http://www.microchip.com/wwwproducts/ Devices.aspx?dDocName=en530331 KEY RESOURCES * * * * * * Section 12. "Input Capture" (DS70198) Code Samples Application Notes Software Libraries Webinars All related dsPIC33F/PIC24H Family Reference Manuals Sections * Development Tools DS70290J-page 148 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 13.2 Input Capture Registers REGISTER 13-1: ICxCON: INPUT CAPTURE x CONTROL REGISTER U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 -- -- ICSIDL -- -- -- -- -- bit 15 bit 8 R/W-0 R/W-0 ICTMR R/W-0 ICI<1:0> R-0, HC R-0, HC ICOV ICBNE R/W-0 R/W-0 R/W-0 ICM<2:0> bit 7 bit 0 Legend: HC = Cleared in hardware R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as `0' bit 13 ICSIDL: Input Capture Module Stop in Idle Control bit 1 = Input capture module will halt in CPU Idle mode 0 = Input capture module will continue to operate in CPU Idle mode bit 12-8 Unimplemented: Read as `0' bit 7 ICTMR: Input Capture Timer Select bits 1 = TMR2 contents are captured on capture event 0 = TMR3 contents are captured on capture event bit 6-5 ICI<1:0>: Select Number of Captures per Interrupt bits 11 = Interrupt on every fourth capture event 10 = Interrupt on every third capture event 01 = Interrupt on every second capture event 00 = Interrupt on every capture event bit 4 ICOV: Input Capture Overflow Status Flag bit (read-only) 1 = Input capture overflow occurred 0 = No input capture overflow occurred bit 3 ICBNE: Input Capture Buffer Empty Status bit (read-only) 1 = Input capture buffer is not empty, at least one more capture value can be read 0 = Input capture buffer is empty bit 2-0 ICM<2:0>: Input Capture Mode Select bits 111 = Input capture functions as interrupt pin only when device is in Sleep or Idle mode (Rising edge detect only, all other control bits are not applicable.) 110 = Unused (module disabled) 101 = Capture mode, every 16th rising edge 100 = Capture mode, every 4th rising edge 011 = Capture mode, every rising edge 010 = Capture mode, every falling edge 001 = Capture mode, every edge (rising and falling) (ICI<1:0> bits do not control interrupt generation for this mode.) 000 = Input capture module turned off (c) 2007-2011 Microchip Technology Inc. DS70290J-page 149 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 NOTES: DS70290J-page 150 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 14.0 OUTPUT COMPARE The Output Compare module can select either Timer2 or Timer3 for its time base. The module compares the value of the timer with the value of one or two compare registers depending on the operating mode selected. The state of the output pin changes when the timer value matches the compare register value. The Output Compare module generates either a single output pulse or a sequence of output pulses, by changing the state of the output pin on the compare match events. The Output Compare module can also generate interrupts on compare match events. Note 1: This data sheet summarizes the features of the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 13. "Output Compare" (DS70209) of the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip web site (www.microchip.com). The Output Compare module has multiple operating modes: 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. FIGURE 14-1: * * * * * * * Active-Low One-Shot mode Active-High One-Shot mode Toggle mode Delayed One-Shot mode Continuous Pulse mode PWM mode without fault protection PWM mode with fault protection OUTPUT COMPARE MODULE BLOCK DIAGRAM Set Flag bit OCxIF OCxRS Output Logic OCxR S Q R 3 OCM<2:0> Mode Select Comparator 0 16 1 OCTSEL 0 1 Output Enable OCx Output Enable Logic OCFA 16 TMR2 TMR3 (c) 2007-2011 Microchip Technology Inc. TMR2 Rollover TMR3 Rollover DS70290J-page 151 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 14.1 Output Compare Modes application must disable the associated timer when writing to the output compare control registers to avoid malfunctions. Configure the Output Compare modes by setting the appropriate Output Compare Mode bits (OCM<2:0>) in the Output Compare Control register (OCxCON<2:0>). Table 14-1 lists the different bit settings for the Output Compare modes. Figure 14-2 illustrates the output compare operation for various modes. The user TABLE 14-1: See Section 13. "Output Compare" (DS70209) in the "dsPIC33F/PIC24H Family Reference Manual" for OCxR and OCxRS register restrictions. OUTPUT COMPARE MODES OCM<2:0> Mode 000 001 010 011 100 101 110 Module Disabled Active-Low One-Shot Active-High One-Shot Toggle Mode Delayed One-Shot Continuous Pulse mode PWM mode without fault protection PWM mode with fault protection 111 Note: FIGURE 14-2: OCx Pin Initial State Controlled by GPIO register 0 1 Current output is maintained 0 0 0, if OCxR is zero 1, if OCxR is non-zero 0, if OCxR is zero 1, if OCxR is non-zero OCx Interrupt Generation -- OCx Rising edge OCx Falling edge OCx Rising and Falling edge OCx Falling edge OCx Falling edge No interrupt OCFA Falling edge for OC1 to OC4 OUTPUT COMPARE OPERATION Output Compare Mode enabled Timer is reset on period match OCxRS TMRy OCxR Active-Low One-Shot (OCM = 001) Active-High One-Shot (OCM = 010) Toggle Mode (OCM = 011) Delayed One-Shot (OCM = 100) Continuous Pulse Mode (OCM = 101) PWM Mode (OCM = 110 or 111) DS70290J-page 152 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 14.2 Output Compare Resources Many useful resources are provided on the main product page of the Microchip web site for the devices listed in this data sheet. This product page, which can be accessed using this link, contains the latest updates and additional information. Note: 14.2.1 In the event you are not able to access the product page using the link above, enter this URL in your browser: http://www.microchip.com/wwwproducts/ Devices.aspx?dDocName=en530331 KEY RESOURCES * * * * * * Section 13. "Output Compare" (DS70209) Code Samples Application Notes Software Libraries Webinars All related dsPIC33F/PIC24H Family Reference Manuals Sections * Development Tools (c) 2007-2011 Microchip Technology Inc. DS70290J-page 153 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 14.3 Output Compare Register REGISTER 14-1: OCxCON: OUTPUT COMPARE x CONTROL REGISTER U-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 -- -- OCSIDL -- -- -- -- -- bit 15 bit 8 U-0 U-0 U-0 R-0 HC R/W-0 -- -- -- OCFLT OCTSEL R/W-0 R/W-0 R/W-0 OCM<2:0> bit 7 bit 0 Legend: HC = Cleared in Hardware HS = Set in Hardware R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-14 Unimplemented: Read as `0' bit 13 OCSIDL: Stop Output Compare in Idle Mode Control bit 1 = Output Compare x will halt in CPU Idle mode 0 = Output Compare x will continue to operate in CPU Idle mode bit 12-5 Unimplemented: Read as `0' bit 4 OCFLT: PWM Fault Condition Status bit 1 = PWM Fault condition has occurred (cleared in hardware only) 0 = No PWM Fault condition has occurred (This bit is only used when OCM<2:0> = 111.) bit 3 OCTSEL: Output Compare Timer Select bit 1 = Timer3 is the clock source for Compare x 0 = Timer2 is the clock source for Compare x bit 2-0 OCM<2:0>: Output Compare Mode Select bits 111 = PWM mode on OCx, Fault pin enabled 110 = PWM mode on OCx, Fault pin disabled 101 = Initialize OCx pin low, generate continuous output pulses on OCx pin 100 = Initialize OCx pin low, generate single output pulse on OCx pin 011 = Compare event toggles OCx pin 010 = Initialize OCx pin high, compare event forces OCx pin low 001 = Initialize OCx pin low, compare event forces OCx pin high 000 = Output compare channel is disabled DS70290J-page 154 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 15.0 SERIAL PERIPHERAL INTERFACE (SPI) Note 1: This data sheet summarizes the features of the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 18. "Serial Peripheral Interface (SPI)" (DS70206) of the "dsPIC33F/ PIC24H Family Reference Manual", which is available from the Microchip web site (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. FIGURE 15-1: The Serial Peripheral Interface (SPI) module is a synchronous serial interface useful for communicating with other peripheral or microcontroller devices. These peripheral devices can be serial EEPROMs, shift registers, display drivers, Analog-to-Digital Converters (ADC), etc. The SPI module is compatible with Motorola(R) SPI and SIOP. Each SPI module consists of a 16-bit shift register, SPIxSR (where x = 1 or 2), used for shifting data in and out, and a buffer register, SPIxBUF. A control register, SPIxCON, configures the module. Additionally, a status register, SPIxSTAT, indicates status conditions. The serial interface consists of 4 pins: * * * * SDIx (serial data input) SDOx (serial data output) SCKx (shift clock input or output) SSx (active-low slave select) In Master mode operation, SCK is a clock output. In Slave mode, it is a clock input. SPI MODULE BLOCK DIAGRAM SCKx SSx 1:1 to 1:8 Secondary Prescaler Sync Control 1:1/4/16/64 Primary Prescaler Select Edge Control Clock SPIxCON1<1:0> Shift Control SPIxCON1<4:2> SDOx Enable Master Clock bit 0 SDIx FCY SPIxSR Transfer Transfer SPIxRXB SPIxTXB SPIxBUF Read SPIxBUF Write SPIxBUF 16 Internal Data Bus (c) 2007-2011 Microchip Technology Inc. DS70290J-page 155 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 15.1 1. In Frame mode, if there is a possibility that the master may not be initialized before the slave: a) If FRMPOL (SPIxCON2<13>) = 1, use a pull-down resistor on SSx. b) If FRMPOL = 0, use a pull-up resistor on SSx. Note: 2. 5. This will insure that during power-up and initialization the master/slave will not lose sync due to an errant SCK transition that would cause the slave to accumulate data shift errors for both transmit and receive appearing as corrupted data. SPI Resources Many useful resources are provided on the main product page of the Microchip web site for the devices listed in this data sheet. This product page, which can be accessed using this link, contains the latest updates and additional information. Note: 15.2.1 In the event you are not able to access the product page using the link above, enter this URL in your browser: http:// www.microchip.com/wwwproducts/ Devices.aspx?dDocName=en530331 KEY RESOURCES * Section 18. "Serial Peripheral Interface (SPI)" (DS70206) * Code Samples * Application Notes * Software Libraries * Webinars * All related dsPIC33F/PIC24H Family Reference Manuals Sections * Development Tools FRMEN (SPIxCON2<15>) = 1 and SSEN (SPIxCON1<7>) = 1 are exclusive and invalid. In Frame mode, SCKx is continuous and the Frame sync pulse is active on the SSx pin, which indicates the start of a data frame. Note: 4. 15.2 This insures that the first frame transmission after initialization is not shifted or corrupted. In non-framed 3-wire mode, (i.e., not using SSx from a master): a) If CKP (SPIxCON1<6>) = 1, always place a pull-up resistor on SSx. b) If CKP = 0, always place a pull-down resistor on SSx. Note: 3. SPI Helpful Tips Not all third-party devices support Frame mode timing. Refer to the SPI electrical characteristics for details. In Master mode only, set the SMP bit (SPIxCON1<9>) to a `1' for the fastest SPI data rate possible. The SMP bit can only be set at the same time or after the MSTEN bit (SPIxCON1<5>) is set. To avoid invalid slave read data to the master, the user's master software must guarantee enough time for slave software to fill its write buffer before the user application initiates a master write/read cycle. It is always advisable to preload the SPIxBUF transmit register in advance of the next master transaction cycle. SPIxBUF is transferred to the SPI shift register and is empty once the data transmission begins. DS70290J-page 156 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 15.3 SPI Control Registers REGISTER 15-1: SPIxSTAT: SPIx STATUS AND CONTROL REGISTER R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 SPIEN -- SPISIDL -- -- -- -- -- bit 15 bit 8 U-0 R/C-0 U-0 U-0 U-0 U-0 R-0 R-0 -- SPIROV -- -- -- -- SPITBF SPIRBF bit 7 bit 0 Legend: C = Clearable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15 SPIEN: SPIx Enable bit 1 = Enables module and configures SCKx, SDOx, SDIx and SSx as serial port pins 0 = Disables module bit 14 Unimplemented: Read as `0' bit 13 SPISIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-7 Unimplemented: Read as `0' bit 6 SPIROV: Receive Overflow Flag bit 1 = A new byte/word is completely received and discarded. The user software has not read the previous data in the SPIxBUF register 0 = No overflow has occurred. bit 5-2 Unimplemented: Read as `0' bit 1 SPITBF: SPIx Transmit Buffer Full Status bit 1 = Transmit not yet started, SPIxTXB is full 0 = Transmit started, SPIxTXB is empty Automatically set in hardware when CPU writes SPIxBUF location, loading SPIxTXB. Automatically cleared in hardware when SPIx module transfers data from SPIxTXB to SPIxSR. bit 0 SPIRBF: SPIx Receive Buffer Full Status bit 1 = Receive complete, SPIxRXB is full 0 = Receive is not complete, SPIxRXB is empty Automatically set in hardware when SPIx transfers data from SPIxSR to SPIxRXB. Automatically cleared in hardware when core reads SPIxBUF location, reading SPIxRXB. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 157 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 15-2: SPIXCON1: SPIx CONTROL REGISTER 1 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 -- -- -- DISSCK DISSDO MODE16 SMP CKE(1) bit 15 bit 8 R/W-0 R/W-0 (2) CKP SSEN R/W-0 R/W-0 MSTEN R/W-0 R/W-0 R/W-0 (3) R/W-0 PPRE<1:0>(3) SPRE<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as `0' bit 12 DISSCK: Disable SCKx pin bit (SPI Master modes only) 1 = Internal SPI clock is disabled, pin functions as I/O 0 = Internal SPI clock is enabled bit 11 DISSDO: Disable SDOx pin bit 1 = SDOx pin is not used by module; pin functions as I/O 0 = SDOx pin is controlled by the module bit 10 MODE16: Word/Byte Communication Select bit 1 = Communication is word-wide (16 bits) 0 = Communication is byte-wide (8 bits) bit 9 SMP: SPIx Data Input Sample Phase bit Master mode: 1 = Input data sampled at end of data output time 0 = Input data sampled at middle of data output time Slave mode: SMP must be cleared when SPIx is used in Slave mode. bit 8 CKE: SPIx Clock Edge Select bit(1) 1 = Serial output data changes on transition from active clock state to Idle clock state (see bit 6) 0 = Serial output data changes on transition from Idle clock state to active clock state (see bit 6) bit 7 SSEN: Slave Select Enable bit (Slave mode)(2) 1 = SSx pin used for Slave mode 0 = SSx pin not used by module. Pin controlled by port function bit 6 CKP: Clock Polarity Select bit 1 = Idle state for clock is a high level; active state is a low level 0 = Idle state for clock is a low level; active state is a high level bit 5 MSTEN: Master Mode Enable bit 1 = Master mode 0 = Slave mode Note 1: 2: 3: The CKE bit is not used in the Framed SPI modes. Program this bit to `0' for the Framed SPI modes (FRMEN = 1). This bit must be cleared when FRMEN = 1. Do not set both Primary and Secondary prescalers to a value of 1:1. DS70290J-page 158 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 15-2: SPIXCON1: SPIx CONTROL REGISTER 1 (CONTINUED) bit 4-2 SPRE<2:0>: Secondary Prescale bits (Master mode)(3) 111 = Secondary prescale 1:1 110 = Secondary prescale 2:1 * * * 000 = Secondary prescale 8:1 bit 1-0 PPRE<1:0>: Primary Prescale bits (Master mode)(3) 11 = Primary prescale 1:1 10 = Primary prescale 4:1 01 = Primary prescale 16:1 00 = Primary prescale 64:1 Note 1: 2: 3: The CKE bit is not used in the Framed SPI modes. Program this bit to `0' for the Framed SPI modes (FRMEN = 1). This bit must be cleared when FRMEN = 1. Do not set both Primary and Secondary prescalers to a value of 1:1. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 159 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 15-3: SPIxCON2: SPIx CONTROL REGISTER 2 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 U-0 FRMEN SPIFSD FRMPOL -- -- -- -- -- bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 U-0 -- -- -- -- -- -- FRMDLY -- bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15 FRMEN: Framed SPIx Support bit 1 = Framed SPIx support enabled (SSx pin used as frame sync pulse input/output) 0 = Framed SPIx support disabled bit 14 SPIFSD: Frame Sync Pulse Direction Control bit 1 = Frame sync pulse input (slave) 0 = Frame sync pulse output (master) bit 13 FRMPOL: Frame Sync Pulse Polarity bit 1 = Frame sync pulse is active-high 0 = Frame sync pulse is active-low bit 12-2 Unimplemented: Read as `0' bit 1 FRMDLY: Frame Sync Pulse Edge Select bit 1 = Frame sync pulse coincides with first bit clock 0 = Frame sync pulse precedes first bit clock bit 0 Unimplemented: This bit must not be set to `1' by the user application DS70290J-page 160 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 16.0 INTER-INTEGRATED CIRCUITTM (I2CTM) Note 1: This data sheet summarizes the features of the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 19. "Inter-Integrated CircuitTM (I2CTM)" (DS70195) of the "dsPIC33F/ PIC24H Family Reference Manual", which is available on the Microchip web site (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. 16.1 Operating Modes The hardware fully implements all the master and slave functions of the I2C Standard and Fast mode specifications, as well as 7-bit and 10-bit addressing. The I2C module can operate either as a slave or a master on an I2C bus. The following types of I2C operation are supported: * * * I2C slave operation with 7-bit addressing I2C slave operation with 10-bit addressing I2C master operation with 7-bit or 10-bit addressing For details about the communication sequence in each of these modes, refer to the "dsPIC33F/PIC24H Family Reference Manual". The Inter-Integrated Circuit (I2C) module provides complete hardware support for both Slave and Multi-Master modes of the I2C serial communication standard, with a 16-bit interface. The I2C module has a 2-pin interface: * The SCLx pin is clock * The SDAx pin is data The I2C module offers the following key features: * I2C interface supporting both Master and Slave modes of operation * I2C Slave mode supports 7-bit and 10-bit addressing * I2C Master mode supports 7-bit and 10-bit addressing * I2C port allows bidirectional transfers between master and slaves * Serial clock synchronization for I2C port can be used as a handshake mechanism to suspend and resume serial transfer (SCLREL control) * I2C supports multi-master operation, detects bus collision and arbitrates accordingly (c) 2007-2011 Microchip Technology Inc. DS70290J-page 161 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 16-1: I2CTM BLOCK DIAGRAM (X = 1) Internal Data Bus I2CxRCV SCLx Read Shift Clock I2CxRSR LSb SDAx Address Match Match Detect Write I2CxMSK Write Read I2CxADD Read Start and Stop Bit Detect Write Start and Stop Bit Generation Control Logic I2CxSTAT Collision Detect Read Write I2CxCON Acknowledge Generation Read Clock Stretching Write I2CxTRN LSb Read Shift Clock Reload Control BRG Down Counter Write I2CxBRG Read TCY/2 DS70290J-page 162 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 16.2 I2C Resources Many useful resources are provided on the main product page of the Microchip web site for the devices listed in this data sheet. This product page, which can be accessed using this link, contains the latest updates and additional information. Note: 16.2.1 In the event you are not able to access the product page using the link above, enter this URL in your browser: http:// www.microchip.com/wwwproducts/ Devices.aspx?dDocName=en530331 KEY RESOURCES * Section 13. "Inter-Integrated CircuitTM (I2CTM)" (DS70195) * Code Samples * Application Notes * Software Libraries * Webinars * All related dsPIC33F/PIC24H Family Reference Manuals Sections * Development Tools (c) 2007-2011 Microchip Technology Inc. 16.3 I2C Registers I2CxCON and I2CxSTAT are control and status registers, respectively. The I2CxCON register is readable and writable. The lower six bits of I2CxSTAT are read-only. The remaining bits of the I2CSTAT are read/write. * I2CxRSR is the shift register used for shifting data. * I2CxRCV is the receive buffer and the register to which data bytes are written, or from which data bytes are read. * I2CxTRN is the transmit register to which bytes are written during a transmit operation. * The I2CxADD register holds the slave address. * A status bit, ADD10, indicates 10-bit Address mode. * I2CxBRG acts as the Baud Rate Generator (BRG) reload value. In receive operations, I2CxRSR and I2CxRCV together form a double-buffered receiver. When I2CxRSR receives a complete byte, it is transferred to I2CxRCV, and an interrupt pulse is generated. DS70290J-page 163 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 16-1: I2CxCON: I2Cx CONTROL REGISTER R/W-0 U-0 R/W-0 R/W-1 HC R/W-0 R/W-0 R/W-0 R/W-0 I2CEN -- I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 HC R/W-0 HC R/W-0 HC R/W-0 HC R/W-0 HC GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN bit 7 bit 0 Legend: U = Unimplemented bit, read as `0' R = Readable bit W = Writable bit HS = Set in hardware HC = Cleared in hardware -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15 I2CEN: I2Cx Enable bit 1 = Enables the I2Cx module and configures the SDAx and SCLx pins as serial port pins 0 = Disables the I2Cx module. All I2C pins are controlled by port functions bit 14 Unimplemented: Read as `0' bit 13 I2CSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters an Idle mode 0 = Continue module operation in Idle mode bit 12 SCLREL: SCLx Release Control bit (when operating as I2CTM slave) 1 = Release SCLx clock 0 = Hold SCLx clock low (clock stretch) If STREN = 1: Bit is R/W (i.e., software can write `0' to initiate stretch and write `1' to release clock). Hardware clear at beginning of slave transmission. Hardware clear at end of slave reception. If STREN = 0: Bit is R/S (i.e., software can only write `1' to release clock). Hardware clear at beginning of slave transmission. bit 11 IPMIEN: Intelligent Peripheral Management Interface (IPMI) Enable bit 1 = IPMI mode is enabled; all addresses Acknowledged 0 = IPMI mode disabled bit 10 A10M: 10-bit Slave Address bit 1 = I2CxADD is a 10-bit slave address 0 = I2CxADD is a 7-bit slave address bit 9 DISSLW: Disable Slew Rate Control bit 1 = Slew rate control disabled 0 = Slew rate control enabled bit 8 SMEN: SMBus Input Levels bit 1 = Enable I/O pin thresholds compliant with SMBus specification 0 = Disable SMBus input thresholds bit 7 GCEN: General Call Enable bit (when operating as I2C slave) 1 = Enable interrupt when a general call address is received in the I2CxRSR (module is enabled for reception) 0 = General call address disabled bit 6 STREN: SCLx Clock Stretch Enable bit (when operating as I2C slave) Used in conjunction with SCLREL bit. 1 = Enable software or receive clock stretching 0 = Disable software or receive clock stretching DS70290J-page 164 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 16-1: I2CxCON: I2Cx CONTROL REGISTER (CONTINUED) bit 5 ACKDT: Acknowledge Data bit (when operating as I2C master, applicable during master receive) Value that will be transmitted when the software initiates an Acknowledge sequence. 1 = Send NACK during Acknowledge 0 = Send ACK during Acknowledge bit 4 ACKEN: Acknowledge Sequence Enable bit (when operating as I2C master, applicable during master receive) 1 = Initiate Acknowledge sequence on SDAx and SCLx pins and transmit ACKDT data bit. Hardware clear at end of master Acknowledge sequence 0 = Acknowledge sequence not in progress bit 3 RCEN: Receive Enable bit (when operating as I2C master) 1 = Enables Receive mode for I2C. Hardware clear at end of eighth bit of master receive data byte 0 = Receive sequence not in progress bit 2 PEN: Stop Condition Enable bit (when operating as I2C master) 1 = Initiate Stop condition on SDAx and SCLx pins. Hardware clear at end of master Stop sequence 0 = Stop condition not in progress bit 1 RSEN: Repeated Start Condition Enable bit (when operating as I2C master) 1 = Initiate Repeated Start condition on SDAx and SCLx pins. Hardware clear at end of master Repeated Start sequence 0 = Repeated Start condition not in progress bit 0 SEN: Start Condition Enable bit (when operating as I2C master) 1 = Initiate Start condition on SDAx and SCLx pins. Hardware clear at end of master Start sequence 0 = Start condition not in progress (c) 2007-2011 Microchip Technology Inc. DS70290J-page 165 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 16-2: I2CxSTAT: I2Cx STATUS REGISTER R-0 HSC R-0 HSC U-0 U-0 U-0 R/C-0 HS R-0 HSC R-0 HSC ACKSTAT TRSTAT -- -- -- BCL GCSTAT ADD10 bit 15 bit 8 R/C-0 HS R/C-0 HS R-0 HSC R/C-0 HSC R/C-0 HSC R-0 HSC R-0 HSC R-0 HSC IWCOL I2COV D_A P S R_W RBF TBF bit 7 bit 0 Legend: U = Unimplemented bit, read as `0' R = Readable bit W = Writable bit HS = Set in hardware HSC = Hardware set/cleared -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15 ACKSTAT: Acknowledge Status bit (when operating as I2C master, applicable to master transmit operation) 1 = NACK received from slave 0 = ACK received from slave Hardware set or clear at end of slave Acknowledge. bit 14 TRSTAT: Transmit Status bit (when operating as I2C master, applicable to master transmit operation) 1 = Master transmit is in progress (8 bits + ACK) 0 = Master transmit is not in progress Hardware set at beginning of master transmission. Hardware clear at end of slave Acknowledge. bit 13-11 Unimplemented: Read as `0' bit 10 BCL: Master Bus Collision Detect bit 1 = A bus collision has been detected during a master operation 0 = No collision Hardware set at detection of bus collision. bit 9 GCSTAT: General Call Status bit 1 = General call address was received 0 = General call address was not received Hardware set when address matches general call address. Hardware clear at Stop detection. bit 8 ADD10: 10-bit Address Status bit 1 = 10-bit address was matched 0 = 10-bit address was not matched Hardware set at match of 2nd byte of matched 10-bit address. Hardware clear at Stop detection. bit 7 IWCOL: Write Collision Detect bit 1 = An attempt to write the I2CxTRN register failed because the I2C module is busy 0 = No collision Hardware set at occurrence of write to I2CxTRN while busy (cleared by software). bit 6 I2COV: Receive Overflow Flag bit 1 = A byte was received while the I2CxRCV register is still holding the previous byte 0 = No overflow Hardware set at attempt to transfer I2CxRSR to I2CxRCV (cleared by software). bit 5 D_A: Data/Address bit (when operating as I2C slave) 1 = Indicates that the last byte received was data 0 = Indicates that the last byte received was device address Hardware clear at device address match. Hardware set by reception of slave byte. bit 4 P: Stop bit 1 = Indicates that a Stop bit has been detected last 0 = Stop bit was not detected last Hardware set or clear when Start, Repeated Start or Stop detected. DS70290J-page 166 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 16-2: I2CxSTAT: I2Cx STATUS REGISTER (CONTINUED) bit 3 S: Start bit 1 = Indicates that a Start (or Repeated Start) bit has been detected last 0 = Start bit was not detected last Hardware set or clear when Start, Repeated Start or Stop detected. bit 2 R_W: Read/Write Information bit (when operating as I2C slave) 1 = Read - indicates data transfer is output from slave 0 = Write - indicates data transfer is input to slave Hardware set or clear after reception of I 2C device address byte. bit 1 RBF: Receive Buffer Full Status bit 1 = Receive complete, I2CxRCV is full 0 = Receive not complete, I2CxRCV is empty Hardware set when I2CxRCV is written with received byte. Hardware clear when software reads I2CxRCV. bit 0 TBF: Transmit Buffer Full Status bit 1 = Transmit in progress, I2CxTRN is full 0 = Transmit complete, I2CxTRN is empty Hardware set when software writes I2CxTRN. Hardware clear at completion of data transmission. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 167 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 16-3: I2CxMSK: I2Cx SLAVE MODE ADDRESS MASK REGISTER U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 -- -- -- -- -- -- AMSK9 AMSK8 bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 AMSK7 AMSK6 AMSK5 AMSK4 AMSK3 AMSK2 AMSK1 AMSK0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-10 Unimplemented: Read as `0' bit 9-0 AMSKx: Mask for Address bit x Select bit 1 = Enable masking for bit x of incoming message address; bit match not required in this position 0 = Disable masking for bit x; bit match required in this position DS70290J-page 168 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 17.0 UNIVERSAL ASYNCHRONOUS RECEIVER TRANSMITTER (UART) Note 1: This data sheet summarizes the features of the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 17. "UART" (DS70188) of the "dsPIC33F/PIC24H Family Reference Manual", which is available on the Microchip web site (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. The Universal Asynchronous Receiver Transmitter (UART) module is one of the serial I/O modules available in the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 device family. The UART is a full-duplex asynchronous system that can communicate with peripheral devices, such as personal computers, LIN/J2602, RS-232 and RS-485 interfaces. The module also supports a hardware flow control option with the UxCTS and UxRTS pins and also includes an IrDA(R) encoder and decoder. FIGURE 17-1: The primary features of the UART module are: * Full-Duplex, 8-bit or 9-bit Data Transmission through the UxTX and UxRX pins * Even, odd or no parity options (for 8-bit data) * One or two stop bits * Hardware Flow Control Option with UxCTS and UxRTS pins * Fully Integrated Baud Rate Generator with 16-bit prescaler * Baud rates ranging from 10 Mbps to 38 bps at 40 MIPS * 4-deep first-in-first-out (FIFO) Transmit Data Buffer * 4-Deep FIFO Receive Data Buffer * Parity, framing and buffer overrun error detection * Support for 9-bit mode with Address Detect (9th bit = 1) * Transmit and Receive interrupts * A separate interrupt for all UART error conditions * Loopback mode for diagnostic support * Support for Sync and Break characters * Support for automatic baud rate detection * IrDA(R) encoder and decoder logic * 16x baud clock output for IrDA(R) support A simplified block diagram of the UART module is shown in Figure 17-1. The UART module consists of these key hardware elements: * Baud Rate Generator * Asynchronous Transmitter * Asynchronous Receiver UART SIMPLIFIED BLOCK DIAGRAM Baud Rate Generator IrDA(R) BCLK Hardware Flow Control UxRTS UxCTS UART Receiver UxRX UART Transmitter UxTX (c) 2007-2011 Microchip Technology Inc. DS70290J-page 169 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 17.1 1. 2. UART Helpful Tips In multi-node direct-connect UART networks, UART receive inputs react to the complementary logic level defined by the URXINV bit (UxMODE<4>), which defines the idle state, the default of which is logic high, (i.e., URXINV = 0). Because remote devices do not initialize at the same time, it is likely that one of the devices, because the RX line is floating, will trigger a start bit detection and will cause the first byte received after the device has been initialized to be invalid. To avoid this situation, the user should use a pull-up or pull-down resistor on the RX pin depending on the value of the URXINV bit. a) If URXINV = 0, use a pull-up resistor on the RX pin. b) If URXINV = 1, use a pull-down resistor on the RX pin. The first character received on a wake-up from Sleep mode caused by activity on the UxRX pin of the UART module will be invalid. In Sleep mode, peripheral clocks are disabled. By the time the oscillator system has restarted and stabilized from Sleep mode, the baud rate bit sampling clock relative to the incoming UxRX bit timing is no longer synchronized, resulting in the first character being invalid. This is to be expected. DS70290J-page 170 17.2 UART Resources Many useful resources are provided on the main product page of the Microchip web site for the devices listed in this data sheet. This product page, which can be accessed using this link, contains the latest updates and additional information. Note: 17.2.1 In the event you are not able to access the product page using the link above, enter this URL in your browser: http://www.microchip.com/wwwproducts/ Devices.aspx?dDocName=en530331 KEY RESOURCES * * * * * * Section 17. "UART" (DS70188) Code Samples Application Notes Software Libraries Webinars All related dsPIC33F/PIC24H Family Reference Manuals Sections * Development Tools (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 17.3 UART Control Registers REGISTER 17-1: R/W-0 UxMODE: UARTx MODE REGISTER U-0 UARTEN(1) -- R/W-0 R/W-0 R/W-0 U-0 USIDL IREN(2) RTSMD -- R/W-0 R/W-0 UEN<1:0> bit 15 bit 8 R/W-0 HC R/W-0 R/W-0, HC R/W-0 R/W-0 WAKE LPBACK ABAUD URXINV BRGH R/W-0 R/W-0 PDSEL<1:0> R/W-0 STSEL bit 7 bit 0 Legend: HC = Hardware Clearable R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15 UARTEN: UARTx Enable bit(1) 1 = UARTx is enabled; all UARTx pins are controlled by UARTx as defined by UEN<1:0> 0 = UARTx is disabled; all UARTx pins are controlled by port latches; UARTx power consumption minimal bit 14 Unimplemented: Read as `0' bit 13 USIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12 IREN: IrDA(R) Encoder and Decoder Enable bit(2) 1 = IrDA(R) encoder and decoder enabled 0 = IrDA(R) encoder and decoder disabled bit 11 RTSMD: Mode Selection for UxRTS Pin bit 1 = UxRTS pin in Simplex mode 0 = UxRTS pin in Flow Control mode bit 10 Unimplemented: Read as `0' bit 9-8 UEN<1:0>: UARTx Enable bits 11 = UxTX, UxRX and BCLK pins are enabled and used; UxCTS pin controlled by port latches 10 = UxTX, UxRX, UxCTS and UxRTS pins are enabled and used 01 = UxTX, UxRX and UxRTS pins are enabled and used; UxCTS pin controlled by port latches 00 = UxTX and UxRX pins are enabled and used; UxCTS and UxRTS/BCLK pins controlled by port latches bit 7 WAKE: Wake-up on Start bit Detect During Sleep Mode Enable bit 1 = UARTx will continue to sample the UxRX pin; interrupt generated on falling edge; bit cleared in hardware on following rising edge 0 = No wake-up enabled bit 6 LPBACK: UARTx Loopback Mode Select bit 1 = Enable Loopback mode 0 = Loopback mode is disabled bit 5 ABAUD: Auto-Baud Enable bit 1 = Enable baud rate measurement on the next character - requires reception of a Sync field (55h) before other data; cleared in hardware upon completion 0 = Baud rate measurement disabled or completed Note 1: 2: Refer to Section 17. "UART" (DS70188) in the "dsPIC33F/PIC24H Family Reference Manual" for information on enabling the UART module for receive or transmit operation. This feature is only available for the 16x BRG mode (BRGH = 0). (c) 2007-2011 Microchip Technology Inc. DS70290J-page 171 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 17-1: UxMODE: UARTx MODE REGISTER (CONTINUED) bit 4 URXINV: Receive Polarity Inversion bit 1 = UxRX Idle state is `0' 0 = UxRX Idle state is `1' bit 3 BRGH: High Baud Rate Enable bit 1 = BRG generates 4 clocks per bit period (4x baud clock, High-Speed mode) 0 = BRG generates 16 clocks per bit period (16x baud clock, Standard mode) bit 2-1 PDSEL<1:0>: Parity and Data Selection bits 11 = 9-bit data, no parity 10 = 8-bit data, odd parity 01 = 8-bit data, even parity 00 = 8-bit data, no parity bit 0 STSEL: Stop Bit Selection bit 1 = Two Stop bits 0 = One Stop bit Note 1: 2: Refer to Section 17. "UART" (DS70188) in the "dsPIC33F/PIC24H Family Reference Manual" for information on enabling the UART module for receive or transmit operation. This feature is only available for the 16x BRG mode (BRGH = 0). DS70290J-page 172 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 17-2: R/W-0 UxSTA: UARTx STATUS AND CONTROL REGISTER R/W-0 UTXISEL1 UTXINV R/W-0 UTXISEL0 U-0 -- R/W-0 HC R/W-0 R-0 R-1 UTXBRK UTXEN(1) UTXBF TRMT bit 15 bit 8 R/W-0 R/W-0 URXISEL<1:0> R/W-0 R-1 R-0 R-0 R/C-0 R-0 ADDEN RIDLE PERR FERR OERR URXDA bit 7 bit 0 Legend: HC = Hardware cleared C = Clear only bit R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15,13 UTXISEL<1:0>: Transmission Interrupt Mode Selection bits 11 = Reserved; do not use 10 = Interrupt when a character is transferred to the Transmit Shift Register, and as a result, the transmit buffer becomes empty 01 = Interrupt when the last character is shifted out of the Transmit Shift Register; all transmit operations are completed 00 = Interrupt when a character is transferred to the Transmit Shift Register (this implies there is at least one character open in the transmit buffer) bit 14 UTXINV: Transmit Polarity Inversion bit If IREN = 0: 1 = UxTX Idle state is `0' 0 = UxTX Idle state is `1' If IREN = 1: 1 = IrDA(R) encoded UxTX Idle state is `1' 0 = IrDA(R) encoded UxTX Idle state is `0' bit 12 Unimplemented: Read as `0' bit 11 UTXBRK: Transmit Break bit 1 = Send Sync Break on next transmission - Start bit, followed by twelve `0' bits, followed by Stop bit; cleared by hardware upon completion 0 = Sync Break transmission disabled or completed bit 10 UTXEN: Transmit Enable bit(1) 1 = Transmit enabled, UxTX pin controlled by UARTx 0 = Transmit disabled, any pending transmission is aborted and buffer is reset. UxTX pin controlled by port bit 9 UTXBF: Transmit Buffer Full Status bit (read-only) 1 = Transmit buffer is full 0 = Transmit buffer is not full, at least one more character can be written bit 8 TRMT: Transmit Shift Register Empty bit (read-only) 1 = Transmit Shift Register is empty and transmit buffer is empty (the last transmission has completed) 0 = Transmit Shift Register is not empty, a transmission is in progress or queued bit 7-6 URXISEL<1:0>: Receive Interrupt Mode Selection bits 11 = Interrupt is set on UxRSR transfer making the receive buffer full (i.e., has 4 data characters) 10 = Interrupt is set on UxRSR transfer making the receive buffer 3/4 full (i.e., has 3 data characters) 0x = Interrupt is set when any character is received and transferred from the UxRSR to the receive buffer. Receive buffer has one or more characters Note 1: Refer to Section 17. "UART" (DS70188) in the "dsPIC33F/PIC24H Family Reference Manual" for information on enabling the UART module for transmit operation. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 173 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 17-2: UxSTA: UARTx STATUS AND CONTROL REGISTER (CONTINUED) bit 5 ADDEN: Address Character Detect bit (bit 8 of received data = 1) 1 = Address Detect mode enabled. If 9-bit mode is not selected, this does not take effect 0 = Address Detect mode disabled bit 4 RIDLE: Receiver Idle bit (read-only) 1 = Receiver is Idle 0 = Receiver is active bit 3 PERR: Parity Error Status bit (read-only) 1 = Parity error has been detected for the current character (character at the top of the receive FIFO) 0 = Parity error has not been detected bit 2 FERR: Framing Error Status bit (read-only) 1 = Framing error has been detected for the current character (character at the top of the receive FIFO) 0 = Framing error has not been detected bit 1 OERR: Receive Buffer Overrun Error Status bit (read/clear only) 1 = Receive buffer has overflowed 0 = Receive buffer has not overflowed. Clearing a previously set OERR bit (1 0 transition) will reset the receiver buffer and the UxRSR to the empty state bit 0 URXDA: Receive Buffer Data Available bit (read-only) 1 = Receive buffer has data, at least one more character can be read 0 = Receive buffer is empty Note 1: Refer to Section 17. "UART" (DS70188) in the "dsPIC33F/PIC24H Family Reference Manual" for information on enabling the UART module for transmit operation. DS70290J-page 174 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 18.0 10-BIT/12-BIT ANALOG-TO-DIGITAL CONVERTER (ADC) Note 1: This data sheet summarizes the features of the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 16. "Analog-to-Digital Converter (ADC)" (DS70183) of the "dsPIC33F/PIC24H Family Reference Manual", which is available on the Microchip web site (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices have up to 13 Analog-to-Digital Conversion (ADC) module input channels. The AD12B bit (AD1CON1<10>) allows each of the ADC modules to be configured as either a 10-bit, 4-sample-and-hold ADC (default configuration) or a 12-bit, 1-sample-and-hold ADC. Note: 18.1 The ADC module must be disabled before the AD12B bit can be modified. * * * * * * * In the 12-bit configuration, conversion speeds of up to 500 ksps are supported. * There is only one sample and hold (S/H) amplifier in the 12-bit configuration, so simultaneous sampling of multiple channels is not supported. Depending on the particular device pinout, the ADC can have up to 13 analog input pins, designated AN0 through AN12. In addition, there are two analog input pins for external voltage reference connections. These voltage reference inputs can be shared with other analog input pins. The actual number of analog input pins and external voltage reference input configuration will depend on the specific device. Refer to the specific device data sheet for further details. A block diagram of the ADC for the dsPIC33FJ16GP304 and dsPIC33FJ32GP204 devices is shown in Figure 18-1. A block diagram of the ADC for the dsPIC33FJ32GP202 device is shown in Figure 18-2. 18.2 Successive Approximation (SAR) conversion Conversion speeds of up to 1.1 Msps Up to 13 analog input pins External voltage reference input pins Simultaneous sampling of up to four analog input pins Automatic Channel Scan mode Selectable conversion trigger source Selectable Buffer Fill modes Four result alignment options (signed/unsigned, fractional/integer) Operation during CPU Sleep and Idle modes 16-word conversion result buffer (c) 2007-2011 Microchip Technology Inc. ADC Initialization To configure the ADC module: 1. 2. 3. Key Features The 10-bit ADC configuration has the following key features: * * * * * The 12-bit ADC configuration supports all the above features, except: 4. 5. 6. 7. Select port pins as analog inputs (AD1PCFGH<15:0> or AD1PCFGL<15:0>). Select voltage reference source to match expected range on analog inputs (AD1CON2<15:13>). Select the analog conversion clock to match desired data rate with processor clock (AD1CON3<7:0>). Determine how many sample-and-hold channels will be used (AD1CON2<9:8> and AD1PCFGH<15:0> or AD1PCFGL<15:0>). Select the appropriate sample/conversion sequence (AD1CON1<7:5> and AD1CON3<12:8>). Select the way conversion results are presented in the buffer (AD1CON1<9:8>). c) Turn on the ADC module (AD1CON1<15>). Configure ADC interrupt (if required): a) Clear the AD1IF bit. b) Select ADC interrupt priority. DS70290J-page 175 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 18-1: ADC1 MODULE BLOCK DIAGRAM FOR dsPIC33FJ16GP304 AND dsPIC33FJ32GP204 DEVICES AN0 AN12 CHANNEL SCAN CH0SA<4:0> CH0 S/H0 + CH0SB<4:0> - CSCNA AN1 VREFL CH0NA CH0NB AN0 VREF+(1) AVDD VREF -(1) AVSS AN3 S/H1 + - CH123SA CH123SB CH1(2) AN6 AN9 VCFG<2:0> VREFL ADC1BUF0 ADC1BUF1 ADC1BUF2 VREFH CH123NA CH123NB VREFL SAR ADC AN1 AN4 S/H2 CH123SA CH123SB CH2(2) + ADC1BUFE - ADC1BUFF AN7 AN10 VREFL CH123NA CH123NB AN2 AN5 S/H3 + CH123SA CH123SB CH3(2) - AN8 AN11 VREFL CH123NA CH123NB Alternate Input Selection Note 1: 2: VREF+, VREF- inputs can be multiplexed with other analog inputs. Channels 1, 2 and 3 are not applicable for the 12-bit mode of operation. DS70290J-page 176 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 18-2: ADC1 MODULE BLOCK DIAGRAM FOR dsPIC33FJ32GP202 DEVICES AN0 AN12 CHANNEL SCAN CH0SA<4:0> CH0 S/H0 + CH0SB<4:0> - CSCNA AN1 VREFL CH0NA CH0NB AN0 VREF+(1) AVDD VREF -(1) AVSS AN3 S/H1 + - CH123SA CH123SB CH1(2) AN9 VCFG<2:0> VREFL ADC1BUF0 ADC1BUF1 ADC1BUF2 VREFH VREFL CH123NA CH123NB SAR ADC AN1 AN4 S/H2 CH123SA CH123SB CH2 + ADC1BUFE - ADC1BUFF (2) AN10 VREFL CH123NA CH123NB AN2 AN5 S/H3 + CH3 CH123SA CH123SB (2) - AN11 VREFL CH123NA CH123NB Alternate Input Selection Note 1: 2: VREF+, VREF- inputs can be multiplexed with other analog inputs. Channels 1, 2 and 3 are not applicable for the 12-bit mode of operation. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 177 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 18-3: ADC CONVERSION CLOCK PERIOD BLOCK DIAGRAM AD1CON3<15> ADC Internal RC Clock(2) 0 TAD AD1CON3<5:0> 1 6 TOSC(1) X2 TCY ADC Conversion Clock Multiplier 1, 2, 3, 4, 5,..., 64 Note 1: 2: 18.3 1. 2. 3. 4. Refer to Figure 8-2 for the derivation of FOSC when the PLL is enabled. If the PLL is not used, FOSC is equal to the clock frequency. TOSC = 1/FOSC. See the ADC Electrical Characteristics for the exact RC clock value. ADC Helpful Tips The SMPI<3:0> (AD1CON2<5:2>) control bits: a) Determine when the ADC interrupt flag is set and an interrupt is generated if enabled. b) When the CSCNA bit (AD1CON2<10>) is set to `1', determines when the ADC analog scan channel list defined in the AD1CSSL/AD1CSSH registers starts over from the beginning. c) On devices without a DMA peripheral, determines when ADC result buffer pointer to ADC1BUF0-ADC1BUFF, gets reset back to the beginning at ADC1BUF0. On devices without a DMA module, the ADC has 16 result buffers. ADC conversion results are stored sequentially in ADC1BUF0-ADC1BUFF regardless of which analog inputs are being used subject to the SMPI<3:0> bits (AD1CON2<5:2>) and the condition described in 1c above. There is no relationship between the ANx input being measured and which ADC buffer (ADC1BUF0-ADC1BUFF) that the conversion results will be placed in. On devices with a DMA module, the ADC module has only 1 ADC result buffer, (i.e., ADC1BUF0), per ADC peripheral and the ADC conversion result must be read either by the CPU or DMA controller before the next ADC conversion is complete to avoid overwriting the previous value. The DONE bit (AD1CON1<0>) is only cleared at the start of each conversion and is set at the completion of the conversion, but remains set indefinitely even through the next sample phase until the next conversion begins. If application code is monitoring the DONE bit in any kind of software loop, the user must consider this DS70290J-page 178 5. behavior because the CPU code execution is faster than the ADC. As a result, in manual sample mode, particularly where the users code is setting the SAMP bit (AD1CON1<1>), the DONE bit should also be cleared by the user application just before setting the SAMP bit. On devices with two ADC modules, the ADCxPCFG registers for both ADC modules must be set to a logic `1' to configure a target I/O pin as a digital I/O pin. Failure to do so means that any alternate digital input function will always see only a logic `0' as the digital input buffer is held in Disable mode. 18.4 ADC Resources Many useful resources are provided on the main product page of the Microchip web site for the devices listed in this data sheet. This product page, which can be accessed using this link, contains the latest updates and additional information. Note: 18.4.1 In the event you are not able to access the product page using the link above, enter this URL in your browser: http://www.microchip.com/wwwproducts/ Devices.aspx?dDocName=en530331 KEY RESOURCES * Section 16. "Analog-to-Digital Converter (ADC)" (DS70183) * Code Samples * Application Notes * Software Libraries * Webinars * All related dsPIC33F/PIC24H Family Reference Manuals Sections * Development Tools (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 18.5 ADC Control Registers REGISTER 18-1: AD1CON1: ADC1 CONTROL REGISTER 1 R/W-0 U-0 R/W-0 U-0 U-0 R/W-0 ADON -- ADSIDL -- -- AD12B R/W-0 R/W-0 FORM<1:0> bit 15 bit 8 R/W-0 R/W-0 R/W-0 SSRC<2:0> U-0 R/W-0 R/W-0 R/W-0 HC,HS R/C-0 HC, HS -- SIMSAM ASAM SAMP DONE bit 7 bit 0 Legend: HC = Cleared by hardware HS = Set by hardware C = Clear only bit R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15 ADON: ADC Operating Mode bit 1 = ADC module is operating 0 = ADC is off bit 14 Unimplemented: Read as `0' bit 13 ADSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode bit 12-11 Unimplemented: Read as `0' bit 10 AD12B: 10-bit or 12-bit Operation Mode bit 1 = 12-bit, 1-channel ADC operation 0 = 10-bit, 4-channel ADC operation bit 9-8 FORM<1:0>: Data Output Format bits For 10-bit operation: 11 = Signed fractional (DOUT = sddd dddd dd00 0000, where s = .NOT.d<9>) 10 = Fractional (DOUT = dddd dddd dd00 0000) 01 = Signed integer (DOUT = ssss sssd dddd dddd, where s = .NOT.d<9>) 00 = Integer (DOUT = 0000 00dd dddd dddd) For 12-bit operation: 11 = Signed fractional (DOUT = sddd dddd dddd 0000, where s = .NOT.d<11>) 10 = Fractional (DOUT = dddd dddd dddd 0000) 01 = Signed Integer (DOUT = ssss sddd dddd dddd, where s = .NOT.d<11>) 00 = Integer (DOUT = 0000 dddd dddd dddd) bit 7-5 SSRC<2:0>: Sample Clock Source Select bits 111 = Internal counter ends sampling and starts conversion (auto-convert) 110 = Reserved 101 = Motor Control PWM2 interval ends sampling and starts conversion 100 = Reserved 011 = Motor Control PWM1 interval ends sampling and starts conversion 010 = GP timer 3 compare ends sampling and starts conversion 001 = Active transition on INT0 pin ends sampling and starts conversion 000 = Clearing sample bit ends sampling and starts conversion bit 4 Unimplemented: Read as `0' bit 3 SIMSAM: Simultaneous Sample Select bit (applicable only when CHPS<1:0> = 01 or 1x) When AD12B = 1, SIMSAM is: U-0, Unimplemented, Read as `0' 1 = Samples CH0, CH1, CH2, CH3 simultaneously (when CHPS<1:0> = 1x); or Samples CH0 and CH1 simultaneously (when CHPS<1:0> = 01) 0 = Samples multiple channels individually in sequence (c) 2007-2011 Microchip Technology Inc. DS70290J-page 179 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 18-1: AD1CON1: ADC1 CONTROL REGISTER 1 (CONTINUED) bit 2 ASAM: ADC Sample Auto-Start bit 1 = Sampling begins immediately after last conversion. SAMP bit is auto-set 0 = Sampling begins when SAMP bit is set bit 1 SAMP: ADC Sample Enable bit 1 = ADC sample-and-hold amplifiers are sampling 0 = ADC sample-and-hold amplifiers are holding If ASAM = 0, software can write `1' to begin sampling. Automatically set by hardware if ASAM = 1. If SSRC = 000, software can write `0' to end sampling and start conversion. If SSRC 000, automatically cleared by hardware to end sampling and start conversion. bit 0 DONE: ADC Conversion Status bit 1 = ADC conversion cycle is completed 0 = ADC conversion not started or in progress Automatically set by hardware when ADC conversion is complete. Software can write `0' to clear DONE status (software not allowed to write `1'). Clearing this bit will NOT affect any operation in progress. Automatically cleared by hardware at start of a new conversion. DS70290J-page 180 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 18-2: R/W-0 AD1CON2: ADC1 CONTROL REGISTER 2 R/W-0 R/W-0 VCFG<2:0> U-0 U-0 R/W-0 -- -- CSCNA R/W-0 R/W-0 CHPS<1:0> bit 15 bit 8 R-0 U-0 BUFS -- R/W-0 R/W-0 R/W-0 R/W-0 SMPI<3:0> R/W-0 R/W-0 BUFM ALTS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15-13 x = Bit is unknown VCFG<2:0>: Converter Voltage Reference Configuration bits 000 001 010 011 1xx ADREF+ ADREF- AVDD External VREF+ AVDD External VREF+ AVDD AVSS AVSS External VREFExternal VREFAvss bit 12-11 Unimplemented: Read as `0' bit 10 CSCNA: Scan Input Selections for CH0+ during Sample A bit 1 = Scan inputs 0 = Do not scan inputs bit 9-8 CHPS<1:0>: Select Channels Utilized bits When AD12B = 1, CHPS<1:0> is: U-0, Unimplemented, Read as `0' 1x = Converts CH0, CH1, CH2 and CH3 01 = Converts CH0 and CH1 00 = Converts CH0 bit 7 BUFS: Buffer Fill Status bit (valid only when BUFM = 1) 1 = ADC is currently filling second half of buffer, user application should access data in the first half 0 = ADC is currently filling first half of buffer, user application should access data in the second half bit 6 Unimplemented: Read as `0' bit 5-2 SMPI<3:0>: Sample/Convert Sequences Per Interrupt Selection bits 1111 = Interrupts at the completion of conversion for each 16th sample/convert sequence 1110 = Interrupts at the completion of conversion for each 15th sample/convert sequence * * * 0001 = Interrupts at the completion of conversion for each 2nd sample/convert sequence 0000 = Interrupts at the completion of conversion for each sample/convert sequence bit 1 BUFM: Buffer Fill Mode Select bit 1 = Starts filling first half of buffer on first interrupt and the second half of buffer on next interrupt 0 = Always starts filling buffer from the beginning bit 0 ALTS: Alternate Input Sample Mode Select bit 1 = Uses channel input selects for Sample A on first sample and Sample B on next sample 0 = Always uses channel input selects for Sample A (c) 2007-2011 Microchip Technology Inc. DS70290J-page 181 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 18-3: AD1CON3: ADC1 CONTROL REGISTER 3 R/W-0 U-0 U-0 ADRC -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 SAMC<4:0>(1) bit 15 bit 8 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ADCS<7:0>(2) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15 ADRC: ADC Conversion Clock Source bit 1 = ADC internal RC clock 0 = Clock derived from system clock bit 14-13 Unimplemented: Read as `0' bit 12-8 SAMC<4:0>: Auto Sample Time bits(1) 11111 = 31 TAD * * * 00001 = 1 TAD 00000 = 0 TAD bit 7-0 ADCS<7:0>: ADC Conversion Clock Select bits(2) 11111111 = Reserved * * * * 01000000 = Reserved 00111111 = TCY * (ADCS<7:0> + 1) = 64 * TCY = TAD * * * 00000010 = TCY * (ADCS<7:0> + 1) = 3 * TCY = TAD 00000001 = TCY * (ADCS<7:0> + 1) = 2 * TCY = TAD 00000000 = TCY * (ADCS<7:0> + 1) = 1 * TCY = TAD Note 1: 2: x = Bit is unknown This bit only used if AD1CON1<7:5> (SSRC<2:0>) = 111. This bit is not used if AD1CON3<15> (ADRC) = 1. DS70290J-page 182 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 18-4: AD1CHS123: ADC1 INPUT CHANNEL 1, 2, 3 SELECT REGISTER U-0 U-0 U-0 U-0 U-0 -- -- -- -- -- R/W-0 R/W-0 CH123NB<1:0> R/W-0 CH123SB bit 15 bit 8 U-0 U-0 U-0 U-0 U-0 -- -- -- -- -- R/W-0 R/W-0 CH123NA<1:0> R/W-0 CH123SA bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15-11 Unimplemented: Read as `0' bit 10-9 CH123NB<1:0>: Channel 1, 2, 3 Negative Input Select for Sample B bits dsPIC33FJ32GP202 devices only: If AD12B = 1: 11 = Reserved 10 = Reserved 01 = Reserved 00 = Reserved x = Bit is unknown If AD12B = 0: 11 = CH1 negative input is AN9, CH2 negative input is AN10, CH3 negative input is AN11 10 = Reserved 01 = CH1, CH2, CH3 negative input is VREF00 = CH1, CH2, CH3 negative input is VREFdsPIC33FJ32GP204 and dsPIC33FJ16GP304 devices only: If AD12B = 1: 11 = Reserved 10 = Reserved 01 = Reserved 00 = Reserved If AD12B = 0: 11 = CH1 negative input is AN9, CH2 negative input is AN10, CH3 negative input is AN11 10 = CH1 negative input is AN6, CH2 negative input is AN7, CH3 negative input is AN8 01 = CH1, CH2, CH3 negative input is VREF00 = CH1, CH2, CH3 negative input is VREFbit 8 CH123SB: Channel 1, 2, 3 Positive Input Select for Sample B bit If AD12B = 1: 1 = Reserved 0 = Reserved If AD12B = 0: 1 = CH1 positive input is AN3, CH2 positive input is AN4, CH3 positive input is AN5 0 = CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2 bit 7-3 Unimplemented: Read as `0' (c) 2007-2011 Microchip Technology Inc. DS70290J-page 183 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 18-4: bit 2-1 AD1CHS123: ADC1 INPUT CHANNEL 1, 2, 3 SELECT REGISTER (CONTINUED) CH123NA<1:0>: Channel 1, 2, 3 Negative Input Select for Sample A bits dsPIC33FJ32GP202 devices only: If AD12B = 1: 11 = Reserved 10 = Reserved 01 = Reserved 00 = Reserved If AD12B = 0: 11 = CH1 negative input is AN9, CH2 negative input is AN10, CH3 negative input is AN11 10 = Reserved 01 = CH1, CH2, CH3 negative input is VREF00 = CH1, CH2, CH3 negative input is VREFdsPIC33FJ32GP204 and dsPIC33FJ16GP304 devices only: If AD12B = 1: 11 = Reserved 10 = Reserved 01 = Reserved 00 = Reserved If AD12B = 0: 11 = CH1 negative input is AN9, CH2 negative input is AN10, CH3 negative input is AN11 10 = CH1 negative input is AN6, CH2 negative input is AN7, CH3 negative input is AN8 01 = CH1, CH2, CH3 negative input is VREF00 = CH1, CH2, CH3 negative input is VREF- bit 0 CH123SA: Channel 1, 2, 3 Positive Input Select for Sample A bit If AD12B = 1: 1 = Reserved 0 = Reserved If AD12B = 0: 1 = CH1 positive input is AN3, CH2 positive input is AN4, CH3 positive input is AN5 0 = CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2 DS70290J-page 184 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 18-5: AD1CHS0: ADC1 INPUT CHANNEL 0 SELECT REGISTER R/W-0 U-0 U-0 CH0NB -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CH0SB<4:0> bit 15 bit 8 R/W-0 U-0 U-0 CH0NA -- -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CH0SA<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15 CH0NB: Channel 0 Negative Input Select for Sample B bit 1 = Channel 0 negative input is AN1 0 = Channel 0 negative input is VREF- bit 14-13 Unimplemented: Read as `0' bit 12-8 CH0SB<4:0>: Channel 0 Positive Input Select for Sample B bits dsPIC33FJ32GP204 and dsPIC33FJ16GP304 devices only: 01100 = Channel 0 positive input is AN12 * * * 00010 = Channel 0 positive input is AN2 00001 = Channel 0 positive input is AN1 00000 = Channel 0 positive input is AN0 x = Bit is unknown dsPIC33FJ32GP202 devices only: 01100 = Channel 0 positive input is AN12 * * * 01000 = Reserved 00111 = Reserved 00110 = Reserved * * * 00010 = Channel 0 positive input is AN2 00001 = Channel 0 positive input is AN1 00000 = Channel 0 positive input is AN0 bit 7 CH0NA: Channel 0 Negative Input Select for Sample A bit 1 = Channel 0 negative input is AN1 0 = Channel 0 negative input is VREF- bit 6-5 Unimplemented: Read as `0' (c) 2007-2011 Microchip Technology Inc. DS70290J-page 185 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 18-5: bit 4-0 AD1CHS0: ADC1 INPUT CHANNEL 0 SELECT REGISTER (CONTINUED) CH0SA<4:0>: Channel 0 Positive Input Select for Sample A bits dsPIC33FJ32GP204 and dsPIC33FJ16GP304 devices only: 01100 = Channel 0 positive input is AN12 * * * 00010 = Channel 0 positive input is AN2 00001 = Channel 0 positive input is AN1 00000 = Channel 0 positive input is AN0 dsPIC33FJ32GP202 devices only: 01100 = Channel 0 positive input is AN12 * * * 01000 = Reserved 00111 = Reserved 00110 = Reserved * * * 00010 = Channel 0 positive input is AN2 00001 = Channel 0 positive input is AN1 00000 = Channel 0 positive input is AN0 DS70290J-page 186 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 REGISTER 18-6: AD1CSSL: ADC1 INPUT SCAN SELECT REGISTER LOW(1,2) U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 -- -- -- CSS12 CSS11 CSS10 CSS9 CSS8 bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CSS7 CSS6 CSS5 CSS4 CSS3 CSS2 CSS1 CSS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared bit 15-13 Unimplemented: Read as `0' bit 12-0 CSS<12:0>: ADC Input Scan Selection bits 1 = Select ANx for input scan 0 = Skip ANx for input scan x = Bit is unknown Note 1: On devices without 13 analog inputs, all AD1CSSL bits can be selected by the user application. However, inputs selected for scan without a corresponding input on device converts VREFL. 2: CSSx = ANx, where x = 0 through 12. REGISTER 18-7: AD1PCFGL: ADC1 PORT CONFIGURATION REGISTER LOW(1,2,3) U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 -- -- -- PCFG12 PCFG11 PCFG10 PCFG9 PCFG8 bit 15 bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR `1' = Bit is set `0' = Bit is cleared x = Bit is unknown bit 15-13 Unimplemented: Read as `0' bit 12-0 PCFG<12:0>: ADC Port Configuration Control bits 1 = Port pin in Digital mode, port read input enabled, ADC input multiplexer connected to AVSS 0 = Port pin in Analog mode, port read input disabled, ADC samples pin voltage Note 1: On devices without 13 analog inputs, all PCFG bits are R/W by user software. However, the PCFG bits are ignored on ports without a corresponding input on device. PCFGx = ANx, where x = 0 through 12. The PCFGx bits have no effect if the ADC module is disabled by setting ADxMD bit in the PMDx Register. In this case, all port pins multiplexed with ANx will be in Digital mode. 2: 3: (c) 2007-2011 Microchip Technology Inc. DS70290J-page 187 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 NOTES: DS70290J-page 188 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 19.0 SPECIAL FEATURES Note: 19.1 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices provide nonvolatile memory implementation for device Configuration bits. Refer to Section 25. "Device Configuration" (DS70194) of the "dsPIC33F/PIC24H Family Reference Manual", for more information on this implementation. This data sheet summarizes the features of the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the "dsPIC33F/PIC24H Family Reference Manual". Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F/PIC24H Family Reference Manual sections. The Configuration bits can be programmed (read as `0'), or left unprogrammed (read as `1'), to select various device configurations. These bits are mapped starting at program memory location 0xF80000. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices include several features intended to maximize application flexibility and reliability, and minimize cost through elimination of external components. These are: * * * * * * Flexible configuration Watchdog Timer (WDT) Code Protection and CodeGuardTM Security JTAG Boundary Scan Interface In-Circuit Serial ProgrammingTM (ICSPTM) In-Circuit Emulation TABLE 19-1: Address 0xF80000 Configuration Bits The Device Configuration register map is shown in Table 19-1. The individual Configuration bit descriptions for the Configuration registers are shown in Table 19-2. Note that address 0xF80000 is beyond the user program memory space. It belongs to the configuration memory space (0x800000-0xFFFFFF), which can only be accessed using table reads and table writes. DEVICE CONFIGURATION REGISTER MAP Name Bit 7 Bit 6 Bit 5 Bit 4 FBS -- -- -- -- Bit 3 Bit 2 Bit 1 BSS<2:0> BWRP 0xF80002 Reserved -- -- -- -- -- -- 0xF80004 FGS -- -- -- -- -- GSS<1:0> IESO -- 0xF80006 FOSCSEL 0xF80008 FOSC 0xF8000A FWDT 0xF8000C FPOR FCKSM<1:0> FWDTEN WINDIS -- -- -- WDTPRE Reserved(2) Reserved(1) -- IOL1WAY -- -- GWRP FNOSC<2:0> -- OSCIOFNC POSCMD<1:0> WDTPOST<3:0> ALTI2C -- -- -- 0xF8000E FICD 0xF80010 FUID0 User Unit ID Byte 0 0xF80012 FUID1 User Unit ID Byte 1 0xF80014 FUID2 User Unit ID Byte 2 0xF80016 FUID3 User Unit ID Byte 3 JTAGEN Bit 0 FPWRT<2:0> -- ICS<1:0> Legend: -- = unimplemented bit, read as `0'. Note 1: These bits are reserved for use by development tools and must be programmed as `1'. 2: These bits are reserved and always read as `1'. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 189 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 19-2: CONFIGURATION BITS DESCRIPTION RTSP Effect Bit Field Register Description BWRP FBS Immediate Boot Segment Program Flash Write Protection 1 = Boot segment may be written 0 = Boot segment is write-protected BSS<2:0> FBS Immediate dsPIC33FJ32GP202 and dsPIC33FJ32GP204 Devices Only Boot Segment Program Flash Code Protection Size X11 = No Boot program Flash segment Boot space is 768 Instruction Words (except interrupt vectors) 110 = Standard security; boot program Flash segment ends at 0x0007FE 010 = High security; boot program Flash segment ends at 0x0007FE Boot space is 3840 Instruction Words (except interrupt vectors) 101 = Standard security; boot program Flash segment, ends at 0x001FFE 001 = High security; boot program Flash segment ends at 0x001FFE Boot space is 7936 Instruction Words (except interrupt vectors) 100 = Standard security; boot program Flash segment ends at 0x003FFE 000 = High security; boot program Flash segment ends at 0x003FFE BSS<2:0> FBS Immediate dsPIC33FJ16GP304 Devices Only Boot Segment Program Flash Code Protection Size X11 = No Boot program Flash segment Boot space is 768 Instruction Words (except interrupt vectors) 110 = Standard security; boot program Flash segment ends at 0x0007FE 010 = High security; boot program Flash segment ends at 0x0007FE Boot space is 3840 Instruction Words (except interrupt vectors) 101 = Standard security; boot program Flash segment, ends at 0x001FFE 001 = High security; boot program Flash segment ends at 0x001FFE Boot space is 5376 Instruction Words (except interrupt vectors) 100 = Standard security; boot program Flash segment ends at 0x002BFE 000 = High security; boot program Flash segment ends at 0x002BFE GSS<1:0> FGS Immediate General Segment Code-Protect bit 11 = User program memory is not code-protected 10 = Standard security 0x = High security GWRP FGS Immediate General Segment Write-Protect bit 1 = User program memory is not write-protected 0 = User program memory is write-protected IESO FNOSC<2:0> DS70290J-page 190 FOSCSEL Immediate Two-speed Oscillator Start-up Enable bit 1 = Start-up device with FRC, then automatically switch to the user-selected oscillator source when ready 0 = Start-up device with user-selected oscillator source FOSCSEL If clock switch is enabled, RTSP effect is on any device Reset; otherwise, Immediate Initial Oscillator Source Selection bits 111 = Internal Fast RC (FRC) oscillator with postscaler 110 = Internal Fast RC (FRC) oscillator with divide-by-16 101 = LPRC oscillator 100 = Secondary (LP) oscillator 011 = Primary (XT, HS, EC) oscillator with PLL 010 = Primary (XT, HS, EC) oscillator 001 = Internal Fast RC (FRC) oscillator with PLL 000 = FRC oscillator (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 19-2: CONFIGURATION BITS DESCRIPTION (CONTINUED) RTSP Effect Bit Field Register FCKSM<1:0> FOSC Immediate Clock Switching Mode bits 1x = Clock switching is disabled, Fail-Safe Clock Monitor is disabled 01 = Clock switching is enabled, Fail-Safe Clock Monitor is disabled 00 = Clock switching is enabled, Fail-Safe Clock Monitor is enabled IOL1WAY FOSC Immediate Peripheral Pin Select Configuration bit 1 = Allow only one reconfiguration 0 = Allow multiple reconfigurations OSCIOFNC FOSC Immediate OSC2 Pin Function bit (except in XT and HS modes) 1 = OSC2 is clock output 0 = OSC2 is general purpose digital I/O pin POSCMD<1:0> FOSC Immediate Primary Oscillator Mode Select bits 11 = Primary oscillator disabled 10 = HS Crystal Oscillator mode 01 = XT Crystal Oscillator mode 00 = EC (External Clock) mode FWDTEN FWDT Immediate Watchdog Timer Enable bit 1 = Watchdog Timer always enabled (LPRC oscillator cannot be disabled. Clearing the SWDTEN bit in the RCON register will have no effect.) 0 = Watchdog Timer enabled/disabled by user software (LPRC can be disabled by clearing the SWDTEN bit in the RCON register) WINDIS FWDT Immediate Watchdog Timer Window Enable bit 1 = Watchdog Timer in Non-Window mode 0 = Watchdog Timer in Window mode WDTPRE FWDT Immediate Watchdog Timer Prescaler bit 1 = 1:128 0 = 1:32 WDTPOST<3:0> FWDT Immediate Watchdog Timer Postscaler bits 1111 = 1:32,768 1110 = 1:16,384 * * * 0001 = 1:2 0000 = 1:1 ALTI2C FPOR Immediate Alternate I2CTM pins 1 = I2C mapped to SDA1/SCL1 pins 0 = I2C mapped to ASDA1/ASCL1 pins FPWRT<2:0> FPOR Immediate Power-on Reset Timer Value Select bits 111 = PWRT = 128 ms 110 = PWRT = 64 ms 101 = PWRT = 32 ms 100 = PWRT = 16 ms 011 = PWRT = 8 ms 010 = PWRT = 4 ms 001 = PWRT = 2 ms 000 = PWRT = Disabled JTAGEN FICD Immediate JTAG Enable bit 1 = JTAG enabled 0 = JTAG disabled (c) 2007-2011 Microchip Technology Inc. Description DS70290J-page 191 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 19-2: CONFIGURATION BITS DESCRIPTION (CONTINUED) Bit Field Register ICS<1:0> FICD DS70290J-page 192 RTSP Effect Description Immediate ICD Communication Channel Select bits 11 = Communicate on PGEC1 and PGED1 10 = Communicate on PGEC2 and PGED2 01 = Communicate on PGEC3 and PGED3 00 = Reserved, do not use (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 19.2 On-Chip Voltage Regulator All of the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices power their core digital logic at a nominal 2.5V. This can create a conflict for designs that are required to operate at a higher typical voltage, such as 3.3V. To simplify system design, all devices in the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family incorporate an on-chip regulator that allows the device to run its core logic from VDD. The regulator provides power to the core from the other VDD pins. When the regulator is enabled, a low-ESR (less than 5 ohms) capacitor (such as tantalum or ceramic) must be connected to the VCAP pin (Figure 19-1). This helps to maintain the stability of the regulator. The recommended value for the filter capacitor is provided in Table 22-13 located in Section 22.1 "DC Characteristics". Note: It is important for the low-ESR capacitor to be placed as close as possible to the VCAP pin. On a POR, it takes approximately 20 s for the on-chip voltage regulator to generate an output voltage. During this time, designated as TSTARTUP, code execution is disabled. TSTARTUP is applied every time the device resumes operation after any power-down. FIGURE 19-1: CONNECTIONS FOR THE ON-CHIP VOLTAGE REGULATOR(1,2,3) 19.3 BOR: Brown-out Reset The Brown-out Reset (BOR) module is based on an internal voltage reference circuit that monitors the regulated voltage VCAP. The main purpose of the BOR module is to generate a device Reset when a brown-out condition occurs. Brown-out conditions are generally caused by glitches on the AC mains (for example, missing portions of the AC cycle waveform due to bad power transmission lines, or voltage sags due to excessive current draw when a large inductive load is turned on). A BOR generates a Reset pulse, which resets the device. The BOR selects the clock source, based on the device Configuration bit values (FNOSC<2:0> and POSCMD<1:0>). If an oscillator mode is selected, the BOR activates the Oscillator Start-up Timer (OST). The system clock is held until OST expires. If the PLL is used, the clock is held until the LOCK bit (OSCCON<5>) is `1'. Concurrently, the PWRT time-out (TPWRT) will be applied before the internal Reset is released. If TPWRT = 0 and a crystal oscillator is being used, a nominal delay of TFSCM = 100 is applied. The total delay in this case is TFSCM. The BOR Status bit (RCON<1>) is set to indicate that a BOR has occurred. The BOR circuit continues to operate while in Sleep or Idle modes and resets the device should VDD fall below the BOR threshold voltage. 3.3V dsPIC33F VDD VCAP CEFC 10 F Note 1: 2: 3: VSS These are typical operating voltages. Refer to Table 22-13 for the full operating ranges of VDD and VCAP. It is important for the low-ESR capacitor to be placed as close as possible to the VCAP pin. Typical VCAP pin voltage = 2.5V when VDD VDDMIN. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 193 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 19.4 Watchdog Timer (WDT) 19.4.2 For dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices, the WDT is driven by the LPRC oscillator. When the WDT is enabled, the clock source is also enabled. 19.4.1 PRESCALER/POSTSCALER The nominal WDT clock source from LPRC is 32 kHz. This feeds a prescaler than can be configured for either 5-bit (divide-by-32) or 7-bit (divide-by-128) operation. The prescaler is set by the WDTPRE Configuration bit. With a 32 kHz input, the prescaler yields a nominal WDT time-out period (TWDT) of 1 ms in 5-bit mode, or 4 ms in 7-bit mode. A variable postscaler divides down the WDT prescaler output and allows for a wide range of time-out periods. The postscaler is controlled by the WDTPOST<3:0> Configuration bits (FWDT<3:0>), which allow the selection of 16 settings, from 1:1 to 1:32,768. Using the prescaler and postscaler, time-out periods ranging from 1 ms to 131 seconds can be achieved. The WDT, prescaler and postscaler are reset: * On any device Reset * On the completion of a clock switch, whether invoked by software (i.e., setting the OSWEN bit after changing the NOSC bits) or by hardware (i.e., Fail-Safe Clock Monitor) * When a PWRSAV instruction is executed (i.e., Sleep or Idle mode is entered) * When the device exits Sleep or Idle mode to resume normal operation * By a CLRWDT instruction during normal execution Note: SLEEP AND IDLE MODES If the WDT is enabled, it will continue to run during Sleep or Idle modes. When the WDT time-out occurs, the device will wake the device and code execution will continue from where the PWRSAV instruction was executed. The corresponding SLEEP or IDLE bits (RCON<3:2>) will need to be cleared in software after the device wakes up. 19.4.3 ENABLING WDT The WDT is enabled or disabled by the FWDTEN Configuration bit in the FWDT Configuration register. When the FWDTEN Configuration bit is set, the WDT is always enabled. The WDT flag bit, WDTO (RCON<4>), is not automatically cleared following a WDT time-out. To detect subsequent WDT events, the flag must be cleared in software. The WDT can be optionally controlled in software when the FWDTEN Configuration bit has been programmed to `0'. The WDT is enabled in software by setting the SWDTEN control bit (RCON<5>). The SWDTEN control bit is cleared on any device Reset. The software WDT option allows the user application to enable the WDT for critical code segments and disable the WDT during non-critical segments for maximum power savings. Note: If the WINDIS bit (FWDT<6>) is cleared, the CLRWDT instruction should be executed by the application software only during the last 1/4 of the WDT period. This CLRWDT window can be determined by using a timer. If a CLRWDT instruction is executed before this window, a WDT Reset occurs. The CLRWDT and PWRSAV instructions clear the prescaler and postscaler counts when executed. FIGURE 19-2: WDT BLOCK DIAGRAM All Device Resets Transition to New Clock Source Exit Sleep or Idle Mode PWRSAV Instruction CLRWDT Instruction Watchdog Timer Sleep/Idle WDTPRE SWDTEN FWDTEN WDTPOST<3:0> RS Prescaler (divide by N1) LPRC Clock WDT Wake-up 1 RS Postscaler (divide by N2) 0 WINDIS WDT Reset WDT Window Select CLRWDT Instruction DS70290J-page 194 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 19.5 JTAG Interface dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices implement a JTAG interface, which supports boundary scan device testing, as well as in-circuit programming. Detailed information on this interface will be provided in future revisions of the document. 19.6 The dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 product families offer the intermediate implementation of CodeGuardTM Security. CodeGuard Security enables multiple parties to securely share resources (memory, interrupts and CODE FLASH SECURITY SEGMENT SIZES FOR 32 KBYTE DEVICES CONFIG BITS Note: Refer to Section 23. "CodeGuardTM Security" (DS70199) in the "dsPIC33F/PIC24H Family Reference Manual" for further information on usage, configuration and operation of CodeGuard Security. TABLE 19-4: CODE FLASH SECURITY SEGMENT SIZES FOR 16 KBYTE DEVICES CONFIG BITS VS = 256 IW BSS<2:0>=x11 0K When coupled with software encryption libraries, CodeGuardTM Security can be used to securely update Flash even when multiple IPs reside on the single chip. The code protection features are controlled by the Configuration registers: FBS and FGS. The Secure segment and RAM is not implemented. Code Protection and CodeGuardTM Security TABLE 19-3: peripherals) on a single chip. This feature helps protect individual Intellectual Property in collaborative system designs. GS = 11008 IW 0x000000 0x0001FE 0x000200 0x0007FE 0x000800 0x001FFE 0x002000 0x003FFE 0x004000 VS = 256 IW BSS<2:0>=x11 0K GS = 5376 IW 0x0057FE VS = 256 IW BSS<2:0>=x10 BS = 768 IW 256 GS = 10240 IW VS = 256 IW BSS<2:0>=x01 BS = 3840 IW 768 GS = 7168 IW VS = 256 IW BSS<2:0>=x00 BS = 7936 IW 1792 GS = 3072 IW (c) 2007-2011 Microchip Technology Inc. 0x000000 0x0001FE 0x000200 0x0007FE 0x000800 0x001FFE 0x002000 0x003FFE 0x004000 VS = 256 IW BSS<2:0>=x10 256 GS = 4608 IW 0x0057FE 0x000000 0x0001FE 0x000200 0x0007FE 0x000800 0x001FFE 0x002000 0x003FFE 0x004000 VS = 256 IW BSS<2:0>=x01 0x0057FE BS = 3840 IW 768 GS = 1536 IW 0x0057FE 0x000000 0x0001FE 0x000200 0x0007FE 0x000800 0x001FFE 0x002000 0x003FFE 0x004000 BS = 768 IW VS = 256 IW BSS<2:0>=x00 1792 BS = 5376 IW 0x000000 0x0001FE 0x000200 0x0007FE 0x000800 0x001FFE 0x002000 0x002BFE 0x000000 0x0001FE 0x000200 0x0007FE 0x000800 0x001FFE 0x002000 0x002BFE 0x000000 0x0001FE 0x000200 0x0007FE 0x000800 0x001FFE 0x002000 0x002BFE 0x000000 0x0001FE 0x000200 0x0007FE 0x000800 0x001FFE 0x002000 0x002BFE DS70290J-page 195 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 19.7 In-Circuit Serial Programming dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family digital signal controllers can be serially programmed while in the end application circuit. This is done with two lines for clock and data and three other lines for power, ground and the programming sequence. Serial programming allows customers to manufacture boards with unprogrammed devices and then program the digital signal controller just before shipping the product. Serial programming also allows the most recent firmware or a custom firmware to be programmed. Refer to the "dsPIC33F/PIC24H Flash Programming Specification" (DS70152) document for details about In-Circuit Serial Programming (ICSP). Any of the three pairs of programming clock/data pins can be used: * PGEC1 and PGED1 * PGEC2 and PGED2 * PGEC3 and PGED3 DS70290J-page 196 19.8 In-Circuit Debugger When MPLAB(R) ICD 2 is selected as a debugger, the in-circuit debugging functionality is enabled. This function allows simple debugging functions when used with MPLAB IDE. Debugging functionality is controlled through the PGECx (Emulation/Debug Clock) and PGEDx (Emulation/Debug Data) pin functions. Any of the three pairs of debugging clock/data pins can be used: * PGEC1 and PGED1 * PGEC2 and PGED2 * PGEC3 and PGED3 To use the in-circuit debugger function of the device, the design must implement ICSP connections to MCLR, VDD, VSS, and the PGECx/PGEDx pin pair. In addition, when the feature is enabled, some of the resources are not available for general use. These resources include the first 80 bytes of data RAM and two I/O pins. (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 20.0 Note: INSTRUCTION SET SUMMARY This data sheet summarizes the features of the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the "dsPIC33F/PIC24H Family Reference Manual". Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F/PIC24H Family Reference Manual sections. The dsPIC33F instruction set is identical to that of the dsPIC30F. Most instructions are a single program memory word (24 bits). Only three instructions require two program memory locations. Each single-word instruction is a 24-bit word, divided into an 8-bit opcode, which specifies the instruction type and one or more operands, which further specify the operation of the instruction. The instruction set is highly orthogonal and is grouped into five basic categories: * * * * * Word or byte-oriented operations Bit-oriented operations Literal operations DSP operations Control operations Table 20-1 shows the general symbols used in describing the instructions. The dsPIC33F instruction set summary in Table 20-2 lists all the instructions, along with the status flags affected by each instruction. Most word or byte-oriented W register instructions (including barrel shift instructions) have three operands: * The first source operand, which is typically a register `Wb' without any address modifier * The second source operand, which is typically a register `Ws' with or without an address modifier * The destination of the result, which is typically a register `Wd' with or without an address modifier However, word or byte-oriented file register instructions have two operands: Most bit-oriented instructions (including rotate/shift instructions) have two operands: simple * The W register (with or without an address modifier) or file register (specified by the value of `Ws' or `f') * The bit in the W register or file register (specified by a literal value or indirectly by the contents of register `Wb') The literal instructions that involve data movement can use some of the following operands: * A literal value to be loaded into a W register or file register (specified by `k') * The W register or file register where the literal value is to be loaded (specified by `Wb' or `f') However, literal instructions that involve arithmetic or logical operations use some of the following operands: * The first source operand, which is a register `Wb' without any address modifier * The second source operand, which is a literal value * The destination of the result (only if not the same as the first source operand), which is typically a register `Wd' with or without an address modifier The MAC class of DSP instructions can use some of the following operands: * The accumulator (A or B) to be used (required operand) * The W registers to be used as the two operands * The X and Y address space prefetch operations * The X and Y address space prefetch destinations * The accumulator write back destination The other DSP instructions do not involve any multiplication and can include: * The accumulator to be used (required) * The source or destination operand (designated as Wso or Wdo, respectively) with or without an address modifier * The amount of shift specified by a W register `Wn' or a literal value The control instructions can use some of the following operands: * A program memory address * The mode of the table read and table write instructions * The file register specified by the value `f' * The destination, which could be either the file register `f' or the W0 register, which is denoted as `WREG' (c) 2007-2011 Microchip Technology Inc. DS70290J-page 197 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Most instructions are a single word. Certain double-word instructions are designed to provide all of the required information in these 48 bits. In the second word, the 8 MSbs are `0's. If this second word is executed as an instruction (by itself), it will execute as a NOP. The double-word instructions execute in two instruction cycles. Most single-word instructions are executed in a single instruction cycle, unless a conditional test is true, or the Program Counter is changed as a result of the instruction. In these cases, the execution takes two instruction cycles with the additional instruction cycle(s) executed as a NOP. Notable exceptions are the BRA (unconditional/computed branch), indirect CALL/GOTO, TABLE 20-1: all table reads and writes and RETURN/RETFIE instructions, which are single-word instructions but take two or three cycles. Certain instructions that involve skipping over the subsequent instruction require either two or three cycles if the skip is performed, depending on whether the instruction being skipped is a single-word or two-word instruction. Moreover, double-word moves require two cycles. Note: For more details on the instruction set, refer to the "16-bit MCU and DSC Programmer's Reference Manual" (DS70157). SYMBOLS USED IN OPCODE DESCRIPTIONS Field #text Description Means literal defined by "text" (text) Means "content of text" [text] Means "the location addressed by text" { } Optional field or operation <n:m> Register bit field .b Byte mode selection .d Double-Word mode selection .S Shadow register select .w Word mode selection (default) Acc One of two accumulators {A, B} AWB Accumulator write back destination address register {W13, [W13]+ = 2} bit4 4-bit bit selection field (used in word addressed instructions) {0...15} C, DC, N, OV, Z MCU Status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero Expr Absolute address, label or expression (resolved by the linker) f File register address {0x0000...0x1FFF} lit1 1-bit unsigned literal {0,1} lit4 4-bit unsigned literal {0...15} lit5 5-bit unsigned literal {0...31} lit8 8-bit unsigned literal {0...255} lit10 10-bit unsigned literal {0...255} for Byte mode, {0:1023} for Word mode lit14 14-bit unsigned literal {0...16384} lit16 16-bit unsigned literal {0...65535} lit23 23-bit unsigned literal {0...8388608}; LSb must be `0' None Field does not require an entry, may be blank OA, OB, SA, SB DSP Status bits: AccA Overflow, AccB Overflow, AccA Saturate, AccB Saturate PC Program Counter Slit10 10-bit signed literal {-512...511} Slit16 16-bit signed literal {-32768...32767} Slit6 6-bit signed literal {-16...16} Wb Base W register {W0..W15} Wd Destination W register { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] } Wdo Destination W register { Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] } Wm,Wn Dividend, Divisor working register pair (direct addressing) DS70290J-page 198 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 20-1: SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED) Field Description Wm*Wm Multiplicand and Multiplier working register pair for Square instructions {W4 * W4,W5 * W5,W6 * W6,W7 * W7} Wm*Wn Multiplicand and Multiplier working register pair for DSP instructions {W4 * W5,W4 * W6,W4 * W7,W5 * W6,W5 * W7,W6 * W7} Wn One of 16 working registers {W0..W15} Wnd One of 16 destination working registers {W0...W15} Wns One of 16 source working registers {W0...W15} WREG W0 (working register used in file register instructions) Ws Source W register { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] } Wso Source W register { Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] } Wx X data space prefetch address register for DSP instructions {[W8]+ = 6, [W8]+ = 4, [W8]+ = 2, [W8], [W8]- = 6, [W8]- = 4, [W8]- = 2, [W9]+ = 6, [W9]+ = 4, [W9]+ = 2, [W9], [W9]- = 6, [W9]- = 4, [W9]- = 2, [W9 + W12], none} Wxd X data space prefetch destination register for DSP instructions {W4...W7} Wy Y data space prefetch address register for DSP instructions {[W10]+ = 6, [W10]+ = 4, [W10]+ = 2, [W10], [W10]- = 6, [W10]- = 4, [W10]- = 2, [W11]+ = 6, [W11]+ = 4, [W11]+ = 2, [W11], [W11]- = 6, [W11]- = 4, [W11]- = 2, [W11 + W12], none} Wyd Y data space prefetch destination register for DSP instructions {W4...W7} (c) 2007-2011 Microchip Technology Inc. DS70290J-page 199 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 20-2: Base Instr # 1 2 3 4 INSTRUCTION SET OVERVIEW Assembly Mnemonic ADD ADDC AND ASR Assembly Syntax # of # of Words Cycles Description Status Flags Affected ADD Acc Add Accumulators 1 1 ADD f f = f + WREG 1 1 OA,OB,SA,SB C,DC,N,OV,Z ADD f,WREG WREG = f + WREG 1 1 C,DC,N,OV,Z ADD #lit10,Wn Wd = lit10 + Wd 1 1 C,DC,N,OV,Z ADD Wb,Ws,Wd Wd = Wb + Ws 1 1 C,DC,N,OV,Z ADD Wb,#lit5,Wd Wd = Wb + lit5 1 1 C,DC,N,OV,Z OA,OB,SA,SB ADD Wso,#Slit4,Acc 16-bit Signed Add to Accumulator 1 1 ADDC f f = f + WREG + (C) 1 1 C,DC,N,OV,Z ADDC f,WREG WREG = f + WREG + (C) 1 1 C,DC,N,OV,Z ADDC #lit10,Wn Wd = lit10 + Wd + (C) 1 1 C,DC,N,OV,Z ADDC Wb,Ws,Wd Wd = Wb + Ws + (C) 1 1 C,DC,N,OV,Z ADDC Wb,#lit5,Wd Wd = Wb + lit5 + (C) 1 1 C,DC,N,OV,Z AND f f = f .AND. WREG 1 1 N,Z AND f,WREG WREG = f .AND. WREG 1 1 N,Z AND #lit10,Wn Wd = lit10 .AND. Wd 1 1 N,Z AND Wb,Ws,Wd Wd = Wb .AND. Ws 1 1 N,Z AND Wb,#lit5,Wd Wd = Wb .AND. lit5 1 1 N,Z ASR f f = Arithmetic Right Shift f 1 1 C,N,OV,Z ASR f,WREG WREG = Arithmetic Right Shift f 1 1 C,N,OV,Z ASR Ws,Wd Wd = Arithmetic Right Shift Ws 1 1 C,N,OV,Z ASR Wb,Wns,Wnd Wnd = Arithmetic Right Shift Wb by Wns 1 1 N,Z ASR Wb,#lit5,Wnd Wnd = Arithmetic Right Shift Wb by lit5 1 1 N,Z f,#bit4 Bit Clear f 1 1 None None 5 BCLR BCLR BCLR Ws,#bit4 Bit Clear Ws 1 1 6 BRA BRA C,Expr Branch if Carry 1 1 (2) None BRA GE,Expr Branch if greater than or equal 1 1 (2) None BRA GEU,Expr Branch if unsigned greater than or equal 1 1 (2) None BRA GT,Expr Branch if greater than 1 1 (2) None BRA GTU,Expr Branch if unsigned greater than 1 1 (2) None BRA LE,Expr Branch if less than or equal 1 1 (2) None BRA LEU,Expr Branch if unsigned less than or equal 1 1 (2) None BRA LT,Expr Branch if less than 1 1 (2) None BRA LTU,Expr Branch if unsigned less than 1 1 (2) None BRA N,Expr Branch if Negative 1 1 (2) None BRA NC,Expr Branch if Not Carry 1 1 (2) None BRA NN,Expr Branch if Not Negative 1 1 (2) None BRA NOV,Expr Branch if Not Overflow 1 1 (2) None BRA NZ,Expr Branch if Not Zero 1 1 (2) None BRA OA,Expr Branch if Accumulator A overflow 1 1 (2) None BRA OB,Expr Branch if Accumulator B overflow 1 1 (2) None BRA OV,Expr Branch if Overflow 1 1 (2) None 7 8 9 BSET BSW BTG BRA SA,Expr Branch if Accumulator A saturated 1 1 (2) None BRA SB,Expr Branch if Accumulator B saturated 1 1 (2) None BRA Expr Branch Unconditionally 1 2 None BRA Z,Expr Branch if Zero 1 1 (2) None BRA Wn Computed Branch 1 2 None BSET f,#bit4 Bit Set f 1 1 None BSET Ws,#bit4 Bit Set Ws 1 1 None BSW.C Ws,Wb Write C bit to Ws<Wb> 1 1 None BSW.Z Ws,Wb Write Z bit to Ws<Wb> 1 1 None BTG f,#bit4 Bit Toggle f 1 1 None BTG Ws,#bit4 Bit Toggle Ws 1 1 None DS70290J-page 200 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 20-2: Base Instr # 10 11 12 13 INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic BTSC BTSS BTST BTSTS Assembly Syntax Description # of # of Words Cycles Status Flags Affected BTSC f,#bit4 Bit Test f, Skip if Clear 1 1 (2 or 3) None BTSC Ws,#bit4 Bit Test Ws, Skip if Clear 1 1 (2 or 3) None BTSS f,#bit4 Bit Test f, Skip if Set 1 1 (2 or 3) None BTSS Ws,#bit4 Bit Test Ws, Skip if Set 1 1 (2 or 3) None BTST f,#bit4 Bit Test f 1 1 Z BTST.C Ws,#bit4 Bit Test Ws to C 1 1 C BTST.Z Ws,#bit4 Bit Test Ws to Z 1 1 Z BTST.C Ws,Wb Bit Test Ws<Wb> to C 1 1 C Z BTST.Z Ws,Wb Bit Test Ws<Wb> to Z 1 1 BTSTS f,#bit4 Bit Test then Set f 1 1 Z BTSTS.C Ws,#bit4 Bit Test Ws to C, then Set 1 1 C BTSTS.Z Ws,#bit4 Bit Test Ws to Z, then Set 1 1 Z 14 CALL CALL lit23 Call subroutine 2 2 None CALL Wn Call indirect subroutine 1 2 None 15 CLR CLR f f = 0x0000 1 1 None CLR WREG WREG = 0x0000 1 1 None CLR Ws Ws = 0x0000 1 1 None CLR Acc,Wx,Wxd,Wy,Wyd,AWB Clear Accumulator 1 1 OA,OB,SA,SB 16 CLRWDT CLRWDT Clear Watchdog Timer 1 1 WDTO,Sleep 17 COM COM f f=f 1 1 N,Z COM f,WREG WREG = f 1 1 N,Z COM Ws,Wd Wd = Ws 1 1 N,Z CP f Compare f with WREG 1 1 C,DC,N,OV,Z CP Wb,#lit5 Compare Wb with lit5 1 1 C,DC,N,OV,Z CP Wb,Ws Compare Wb with Ws (Wb - Ws) 1 1 C,DC,N,OV,Z CP0 f Compare f with 0x0000 1 1 C,DC,N,OV,Z CP0 Ws Compare Ws with 0x0000 1 1 C,DC,N,OV,Z CPB f Compare f with WREG, with Borrow 1 1 C,DC,N,OV,Z CPB Wb,#lit5 Compare Wb with lit5, with Borrow 1 1 C,DC,N,OV,Z CPB Wb,Ws Compare Wb with Ws, with Borrow (Wb - Ws - C) 1 1 C,DC,N,OV,Z 18 19 20 CP CP0 CPB 21 CPSEQ CPSEQ Wb, Wn Compare Wb with Wn, skip if = 1 1 (2 or 3) None 22 CPSGT CPSGT Wb, Wn Compare Wb with Wn, skip if > 1 1 (2 or 3) None 23 CPSLT CPSLT Wb, Wn Compare Wb with Wn, skip if < 1 1 (2 or 3) None 24 CPSNE CPSNE Wb, Wn Compare Wb with Wn, skip if 1 1 (2 or 3) None 25 DAW DAW Wn Wn = decimal adjust Wn 1 1 C 26 DEC DEC f f=f-1 1 1 C,DC,N,OV,Z DEC f,WREG WREG = f - 1 1 1 C,DC,N,OV,Z DEC Ws,Wd Wd = Ws - 1 1 1 C,DC,N,OV,Z DEC2 f f=f-2 1 1 C,DC,N,OV,Z DEC2 f,WREG WREG = f - 2 1 1 C,DC,N,OV,Z DEC2 Ws,Wd Wd = Ws - 2 1 1 C,DC,N,OV,Z DISI #lit14 Disable Interrupts for k instruction cycles 1 1 None 27 28 DEC2 DISI (c) 2007-2011 Microchip Technology Inc. DS70290J-page 201 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 20-2: Base Instr # 29 INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic DIV Assembly Syntax # of # of Words Cycles Description Status Flags Affected DIV.S Wm,Wn Signed 16/16-bit Integer Divide 1 18 N,Z,C,OV DIV.SD Wm,Wn Signed 32/16-bit Integer Divide 1 18 N,Z,C,OV DIV.U Wm,Wn Unsigned 16/16-bit Integer Divide 1 18 N,Z,C,OV DIV.UD Wm,Wn Unsigned 32/16-bit Integer Divide 1 18 N,Z,C,OV Signed 16/16-bit Fractional Divide 1 18 N,Z,C,OV None 30 DIVF DIVF 31 DO DO #lit14,Expr Do code to PC + Expr, lit14 + 1 times 2 2 DO Wn,Expr Do code to PC + Expr, (Wn) + 1 times 2 2 None Wm,Wn 32 ED ED Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance (no accumulate) 1 1 OA,OB,OAB, SA,SB,SAB 33 EDAC EDAC Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance 1 1 OA,OB,OAB, SA,SB,SAB 34 EXCH EXCH Wns,Wnd Swap Wns with Wnd 1 1 None 35 FBCL FBCL Ws,Wnd Find Bit Change from Left (MSb) Side 1 1 C 36 FF1L FF1L Ws,Wnd Find First One from Left (MSb) Side 1 1 C 37 FF1R FF1R Ws,Wnd Find First One from Right (LSb) Side 1 1 C 38 GOTO GOTO Expr Go to address 2 2 None GOTO Wn Go to indirect 1 2 None INC f f=f+1 1 1 C,DC,N,OV,Z INC f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z C,DC,N,OV,Z 39 40 41 INC INC2 IOR INC Ws,Wd Wd = Ws + 1 1 1 INC2 f f=f+2 1 1 C,DC,N,OV,Z INC2 f,WREG WREG = f + 2 1 1 C,DC,N,OV,Z C,DC,N,OV,Z INC2 Ws,Wd Wd = Ws + 2 1 1 IOR f f = f .IOR. WREG 1 1 N,Z IOR f,WREG WREG = f .IOR. WREG 1 1 N,Z IOR #lit10,Wn Wd = lit10 .IOR. Wd 1 1 N,Z IOR Wb,Ws,Wd Wd = Wb .IOR. Ws 1 1 N,Z IOR Wb,#lit5,Wd Wd = Wb .IOR. lit5 1 1 N,Z OA,OB,OAB, SA,SB,SAB 42 LAC LAC Wso,#Slit4,Acc Load Accumulator 1 1 43 LNK LNK #lit14 Link Frame Pointer 1 1 None 44 LSR LSR f f = Logical Right Shift f 1 1 C,N,OV,Z LSR f,WREG WREG = Logical Right Shift f 1 1 C,N,OV,Z LSR Ws,Wd Wd = Logical Right Shift Ws 1 1 C,N,OV,Z LSR Wb,Wns,Wnd Wnd = Logical Right Shift Wb by Wns 1 1 N,Z LSR Wb,#lit5,Wnd Wnd = Logical Right Shift Wb by lit5 1 1 N,Z MAC Wm*Wn,Acc,Wx,Wxd,Wy,Wyd , AWB Multiply and Accumulate 1 1 OA,OB,OAB, SA,SB,SAB MAC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square and Accumulate 1 1 OA,OB,OAB, SA,SB,SAB MOV f,Wn Move f to Wn 1 1 None MOV f Move f to f 1 1 N,Z MOV f,WREG Move f to WREG 1 1 None MOV #lit16,Wn Move 16-bit literal to Wn 1 1 None MOV.b #lit8,Wn Move 8-bit literal to Wn 1 1 None MOV Wn,f Move Wn to f 1 1 None MOV Wso,Wdo Move Ws to Wd 1 1 None MOV WREG,f None 45 46 47 MAC MOV MOVSAC Move WREG to f 1 1 MOV.D Wns,Wd Move Double from W(ns):W(ns + 1) to Wd 1 2 None MOV.D Ws,Wnd Move Double from Ws to W(nd + 1):W(nd) 1 2 None Prefetch and store accumulator 1 1 None MOVSAC DS70290J-page 202 Acc,Wx,Wxd,Wy,Wyd,AWB (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 20-2: Base Instr # 48 INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic MPY Assembly Syntax Description # of # of Words Cycles Status Flags Affected MPY Wm*Wn,Acc,Wx,Wxd,Wy,Wyd Multiply Wm by Wn to Accumulator 1 1 OA,OB,OAB, SA,SB,SAB MPY Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square Wm to Accumulator 1 1 OA,OB,OAB, SA,SB,SAB 49 MPY.N MPY.N Wm*Wn,Acc,Wx,Wxd,Wy,Wyd -(Multiply Wm by Wn) to Accumulator 1 1 None 50 MSC MSC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd , AWB Multiply and Subtract from Accumulator 1 1 OA,OB,OAB, SA,SB,SAB 51 MUL MUL.SS Wb,Ws,Wnd {Wnd + 1, Wnd} = signed(Wb) * signed(Ws) 1 1 None MUL.SU Wb,Ws,Wnd {Wnd + 1, Wnd} = signed(Wb) * unsigned(Ws) 1 1 None MUL.US Wb,Ws,Wnd {Wnd + 1, Wnd} = unsigned(Wb) * signed(Ws) 1 1 None MUL.UU Wb,Ws,Wnd {Wnd + 1, Wnd} = unsigned(Wb) * unsigned(Ws) 1 1 None MUL.SU Wb,#lit5,Wnd {Wnd + 1, Wnd} = signed(Wb) * unsigned(lit5) 1 1 None MUL.UU Wb,#lit5,Wnd {Wnd + 1, Wnd} = unsigned(Wb) * unsigned(lit5) 1 1 None 52 53 54 NEG NOP POP MUL f W3:W2 = f * WREG 1 1 None NEG Acc Negate Accumulator 1 1 OA,OB,OAB, SA,SB,SAB NEG f f=f+1 1 1 C,DC,N,OV,Z NEG f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z NEG Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z NOP No Operation 1 1 None NOPR No Operation 1 1 None POP f Pop f from Top-of-Stack (TOS) 1 1 None POP Wdo Pop from Top-of-Stack (TOS) to Wdo 1 1 None POP.D Wnd Pop from Top-of-Stack (TOS) to W(nd):W(nd + 1) 1 2 None Pop Shadow Registers 1 1 All f Push f to Top-of-Stack (TOS) 1 1 None PUSH Wso Push Wso to Top-of-Stack (TOS) 1 1 None PUSH.D Wns Push W(ns):W(ns + 1) to Top-of-Stack (TOS) 1 2 None POP.S 55 PUSH PUSH Push Shadow Registers 1 1 None Go into Sleep or Idle mode 1 1 WDTO,Sleep Expr Relative Call 1 2 None Wn Computed Call 1 2 None REPEAT #lit14 Repeat Next Instruction lit14 + 1 times 1 1 None REPEAT Wn Repeat Next Instruction (Wn) + 1 times 1 1 None PUSH.S 56 PWRSAV PWRSAV 57 RCALL RCALL RCALL 58 REPEAT #lit1 59 RESET RESET Software device Reset 1 1 None 60 RETFIE RETFIE Return from interrupt 1 3 (2) None 61 RETLW RETLW Return with literal in Wn 1 3 (2) None 62 RETURN RETURN Return from Subroutine 1 3 (2) None 63 RLC RLC f f = Rotate Left through Carry f 1 1 C,N,Z RLC f,WREG WREG = Rotate Left through Carry f 1 1 C,N,Z RLC Ws,Wd Wd = Rotate Left through Carry Ws 1 1 C,N,Z RLNC f f = Rotate Left (No Carry) f 1 1 N,Z RLNC f,WREG WREG = Rotate Left (No Carry) f 1 1 N,Z RLNC Ws,Wd Wd = Rotate Left (No Carry) Ws 1 1 N,Z RRC f f = Rotate Right through Carry f 1 1 C,N,Z RRC f,WREG WREG = Rotate Right through Carry f 1 1 C,N,Z RRC Ws,Wd Wd = Rotate Right through Carry Ws 1 1 C,N,Z 64 65 RLNC RRC #lit10,Wn (c) 2007-2011 Microchip Technology Inc. DS70290J-page 203 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 20-2: Base Instr # 66 67 INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic RRNC SAC Assembly Syntax # of # of Words Cycles Description Status Flags Affected RRNC f f = Rotate Right (No Carry) f 1 1 RRNC f,WREG WREG = Rotate Right (No Carry) f 1 1 N,Z N,Z RRNC Ws,Wd Wd = Rotate Right (No Carry) Ws 1 1 N,Z SAC Acc,#Slit4,Wdo Store Accumulator 1 1 None SAC.R Acc,#Slit4,Wdo Store Rounded Accumulator 1 1 None Ws,Wnd Wnd = sign-extended Ws 1 1 C,N,Z None 68 SE SE 69 SETM SETM f f = 0xFFFF 1 1 SETM WREG WREG = 0xFFFF 1 1 None SETM Ws Ws = 0xFFFF 1 1 None SFTAC Acc,Wn Arithmetic Shift Accumulator by (Wn) 1 1 OA,OB,OAB, SA,SB,SAB SFTAC Acc,#Slit6 Arithmetic Shift Accumulator by Slit6 1 1 OA,OB,OAB, SA,SB,SAB SL f f = Left Shift f 1 1 C,N,OV,Z SL f,WREG WREG = Left Shift f 1 1 C,N,OV,Z SL Ws,Wd Wd = Left Shift Ws 1 1 C,N,OV,Z SL Wb,Wns,Wnd Wnd = Left Shift Wb by Wns 1 1 N,Z SL Wb,#lit5,Wnd Wnd = Left Shift Wb by lit5 1 1 N,Z SUB Acc Subtract Accumulators 1 1 OA,OB,OAB, SA,SB,SAB SUB f f = f - WREG 1 1 C,DC,N,OV,Z SUB f,WREG WREG = f - WREG 1 1 C,DC,N,OV,Z SUB #lit10,Wn Wn = Wn - lit10 1 1 C,DC,N,OV,Z SUB Wb,Ws,Wd Wd = Wb - Ws 1 1 C,DC,N,OV,Z SUB Wb,#lit5,Wd Wd = Wb - lit5 1 1 C,DC,N,OV,Z 70 71 72 73 74 75 76 SFTAC SL SUB SUBB SUBR SUBBR SWAP SUBB f f = f - WREG - (C) 1 1 C,DC,N,OV,Z SUBB f,WREG WREG = f - WREG - (C) 1 1 C,DC,N,OV,Z SUBB #lit10,Wn Wn = Wn - lit10 - (C) 1 1 C,DC,N,OV,Z SUBB Wb,Ws,Wd Wd = Wb - Ws - (C) 1 1 C,DC,N,OV,Z SUBB Wb,#lit5,Wd Wd = Wb - lit5 - (C) 1 1 C,DC,N,OV,Z SUBR f f = WREG - f 1 1 C,DC,N,OV,Z SUBR f,WREG WREG = WREG - f 1 1 C,DC,N,OV,Z SUBR Wb,Ws,Wd Wd = Ws - Wb 1 1 C,DC,N,OV,Z C,DC,N,OV,Z SUBR Wb,#lit5,Wd Wd = lit5 - Wb 1 1 SUBBR f f = WREG - f - (C) 1 1 C,DC,N,OV,Z SUBBR f,WREG WREG = WREG - f - (C) 1 1 C,DC,N,OV,Z SUBBR Wb,Ws,Wd Wd = Ws - Wb - (C) 1 1 C,DC,N,OV,Z C,DC,N,OV,Z SUBBR Wb,#lit5,Wd Wd = lit5 - Wb - (C) 1 1 SWAP.b Wn Wn = nibble swap Wn 1 1 None SWAP Wn Wn = byte swap Wn 1 1 None 77 TBLRDH TBLRDH Ws,Wd Read Prog<23:16> to Wd<7:0> 1 2 None 78 TBLRDL TBLRDL Ws,Wd Read Prog<15:0> to Wd 1 2 None 79 TBLWTH TBLWTH Ws,Wd Write Ws<7:0> to Prog<23:16> 1 2 None 80 TBLWTL TBLWTL Ws,Wd Write Ws to Prog<15:0> 1 2 None 81 ULNK ULNK Unlink Frame Pointer 1 1 None 82 XOR XOR f f = f .XOR. WREG 1 1 N,Z XOR f,WREG WREG = f .XOR. WREG 1 1 N,Z XOR #lit10,Wn Wd = lit10 .XOR. Wd 1 1 N,Z XOR Wb,Ws,Wd Wd = Wb .XOR. Ws 1 1 N,Z XOR Wb,#lit5,Wd Wd = Wb .XOR. lit5 1 1 N,Z ZE Ws,Wnd Wnd = Zero-extend Ws 1 1 C,Z,N 83 ZE DS70290J-page 204 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 21.0 DEVELOPMENT SUPPORT The PIC(R) microcontrollers and dsPIC(R) digital signal controllers are supported with a full range of software and hardware development tools: * Integrated Development Environment - MPLAB(R) IDE Software * Compilers/Assemblers/Linkers - MPLAB C Compiler for Various Device Families - HI-TECH C(R) for Various Device Families - MPASMTM Assembler - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB Assembler/Linker/Librarian for Various Device Families * Simulators - MPLAB SIM Software Simulator * Emulators - MPLAB REAL ICETM In-Circuit Emulator * In-Circuit Debuggers - MPLAB ICD 3 - PICkitTM 3 Debug Express * Device Programmers - PICkitTM 2 Programmer - MPLAB PM3 Device Programmer * Low-Cost Demonstration/Development Boards, Evaluation Kits, and Starter Kits 21.1 MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16/32-bit microcontroller market. The MPLAB IDE is a Windows(R) operating system-based application that contains: * A single graphical interface to all debugging tools - Simulator - Programmer (sold separately) - In-Circuit Emulator (sold separately) - In-Circuit Debugger (sold separately) * A full-featured editor with color-coded context * A multiple project manager * Customizable data windows with direct edit of contents * High-level source code debugging * Mouse over variable inspection * Drag and drop variables from source to watch windows * Extensive on-line help * Integration of select third party tools, such as IAR C Compilers The MPLAB IDE allows you to: * Edit your source files (either C or assembly) * One-touch compile or assemble, and download to emulator and simulator tools (automatically updates all project information) * Debug using: - Source files (C or assembly) - Mixed C and assembly - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power. (c) 2007-2011 Microchip Technology Inc. DS70290H-page 205 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 21.2 MPLAB C Compilers for Various Device Families The MPLAB C Compiler code development systems are complete ANSI C compilers for Microchip's PIC18, PIC24 and PIC32 families of microcontrollers and the dsPIC30 and dsPIC33 families of digital signal controllers. These compilers provide powerful integration capabilities, superior code optimization and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 21.3 HI-TECH C for Various Device Families The HI-TECH C Compiler code development systems are complete ANSI C compilers for Microchip's PIC family of microcontrollers and the dsPIC family of digital signal controllers. These compilers provide powerful integration capabilities, omniscient code generation and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. The compilers include a macro assembler, linker, preprocessor, and one-step driver, and can run on multiple platforms. 21.4 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for PIC10/12/16/18 MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel(R) standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM Assembler features include: 21.5 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: * Efficient linking of single libraries instead of many smaller files * Enhanced code maintainability by grouping related modules together * Flexible creation of libraries with easy module listing, replacement, deletion and extraction 21.6 MPLAB Assembler, Linker and Librarian for Various Device Families MPLAB Assembler produces relocatable machine code from symbolic assembly language for PIC24, PIC32 and dsPIC devices. MPLAB C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: * * * * * * Support for the entire device instruction set Support for fixed-point and floating-point data Command line interface Rich directive set Flexible macro language MPLAB IDE compatibility * Integration into MPLAB IDE projects * User-defined macros to streamline assembly code * Conditional assembly for multi-purpose source files * Directives that allow complete control over the assembly process DS70290H-page 206 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 21.7 MPLAB SIM Software Simulator The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC(R) DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C Compilers, and the MPASM and MPLAB Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. 21.8 MPLAB REAL ICE In-Circuit Emulator System MPLAB REAL ICE In-Circuit Emulator System is Microchip's next generation high-speed emulator for Microchip Flash DSC and MCU devices. It debugs and programs PIC(R) Flash MCUs and dsPIC(R) Flash DSCs with the easy-to-use, powerful graphical user interface of the MPLAB Integrated Development Environment (IDE), included with each kit. The emulator is connected to the design engineer's PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with incircuit debugger systems (RJ11) or with the new highspeed, noise tolerant, Low-Voltage Differential Signal (LVDS) interconnection (CAT5). The emulator is field upgradable through future firmware downloads in MPLAB IDE. In upcoming releases of MPLAB IDE, new devices will be supported, and new features will be added. MPLAB REAL ICE offers significant advantages over competitive emulators including low-cost, full-speed emulation, run-time variable watches, trace analysis, complex breakpoints, a ruggedized probe interface and long (up to three meters) interconnection cables. (c) 2007-2011 Microchip Technology Inc. 21.9 MPLAB ICD 3 In-Circuit Debugger System MPLAB ICD 3 In-Circuit Debugger System is Microchip's most cost effective high-speed hardware debugger/programmer for Microchip Flash Digital Signal Controller (DSC) and microcontroller (MCU) devices. It debugs and programs PIC(R) Flash microcontrollers and dsPIC(R) DSCs with the powerful, yet easyto-use graphical user interface of MPLAB Integrated Development Environment (IDE). The MPLAB ICD 3 In-Circuit Debugger probe is connected to the design engineer's PC using a high-speed USB 2.0 interface and is connected to the target with a connector compatible with the MPLAB ICD 2 or MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3 supports all MPLAB ICD 2 headers. 21.10 PICkit 3 In-Circuit Debugger/ Programmer and PICkit 3 Debug Express The MPLAB PICkit 3 allows debugging and programming of PIC(R) and dsPIC(R) Flash microcontrollers at a most affordable price point using the powerful graphical user interface of the MPLAB Integrated Development Environment (IDE). The MPLAB PICkit 3 is connected to the design engineer's PC using a full speed USB interface and can be connected to the target via an Microchip debug (RJ-11) connector (compatible with MPLAB ICD 3 and MPLAB REAL ICE). The connector uses two device I/O pins and the reset line to implement in-circuit debugging and In-Circuit Serial ProgrammingTM. The PICkit 3 Debug Express include the PICkit 3, demo board and microcontroller, hookup cables and CDROM with user's guide, lessons, tutorial, compiler and MPLAB IDE software. DS70290H-page 207 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 21.11 PICkit 2 Development Programmer/Debugger and PICkit 2 Debug Express 21.13 Demonstration/Development Boards, Evaluation Kits, and Starter Kits The PICkitTM 2 Development Programmer/Debugger is a low-cost development tool with an easy to use interface for programming and debugging Microchip's Flash families of microcontrollers. The full featured Windows(R) programming interface supports baseline (PIC10F, PIC12F5xx, PIC16F5xx), midrange (PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30, dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit microcontrollers, and many Microchip Serial EEPROM products. With Microchip's powerful MPLAB Integrated Development Environment (IDE) the PICkitTM 2 enables in-circuit debugging on most PIC(R) microcontrollers. In-Circuit-Debugging runs, halts and single steps the program while the PIC microcontroller is embedded in the application. When halted at a breakpoint, the file registers can be examined and modified. A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. The PICkit 2 Debug Express include the PICkit 2, demo board and microcontroller, hookup cables and CDROM with user's guide, lessons, tutorial, compiler and MPLAB IDE software. 21.12 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular, detachable socket assembly to support various package types. The ICSPTM cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an MMC card for file storage and data applications. DS70290H-page 208 The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEMTM and dsPICDEMTM demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ(R) security ICs, CAN, IrDA(R), PowerSmart battery management, SEEVAL(R) evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Also available are starter kits that contain everything needed to experience the specified device. This usually includes a single application and debug capability, all on one board. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits. (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 22.0 ELECTRICAL CHARACTERISTICS This section provides an overview of dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 electrical characteristics. Additional information will be provided in future revisions of this document as it becomes available. Absolute maximum ratings for the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 family are listed below. Exposure to these maximum rating conditions for extended periods can affect device reliability. Functional operation of the device at these or any other conditions above the parameters indicated in the operation listings of this specification is not implied. Absolute Maximum Ratings(1) Ambient temperature under bias.............................................................................................................-40C to +125C Storage temperature .............................................................................................................................. -65C to +160C Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V Voltage on any pin that is not 5V tolerant with respect to VSS(4) .................................................... -0.3V to (VDD + 0.3V) Voltage on any 5V tolerant pin with respect to VSS when VDD 3.0V(4) ................................................... -0.3V to +5.6V Voltage on any 5V tolerant pin with respect to Vss when VDD < 3.0V(4) ...................................................... -0.3V to 3.6V Maximum current out of VSS pin ...........................................................................................................................300 mA Maximum current into VDD pin(2) ...........................................................................................................................250 mA Maximum current sourced/sunk by any 2x I/O pin(3) ................................................................................................8 mA Maximum current sourced/sunk by any 4x I/O pin(3) ..............................................................................................15 mA Maximum current sourced/sunk by any 8x I/O pin(3) ..............................................................................................25 mA Maximum current sunk by all ports .......................................................................................................................200 mA Maximum current sourced by all ports(2) ...............................................................................................................200 mA Note 1: Stresses above those listed under "Absolute Maximum Ratings" can cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods can affect device reliability. 2: Maximum allowable current is a function of device maximum power dissipation (see Table 22-2). 3: Exceptions are CLKOUT, which is able to sink/source 25 mA, and the VREF+, VREF-, SCLx, SDAx, PGECx and PGEDx pins, which are able to sink/source 12 mA. 4: Refer to the "Pin Diagrams" section for 5V tolerant pins. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 209 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 22.1 DC Characteristics TABLE 22-1: OPERATING MIPS VS. VOLTAGE Max MIPS Characteristic VDD Range (in Volts) Temp Range (in C) -- VBOR-3.6V(1) -40C to +85C 40 -- VBOR-3.6V(1) -40C to +125C 40 Note 1: dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Device is functional at VBORMIN < VDD < VDDMIN. Analog modules such as the ADC will have degraded performance. Device functionality is tested but not characterized. Refer to parameter BO10 in Table 22-11 for the minimum and maximum BOR values. TABLE 22-2: THERMAL OPERATING CONDITIONS Rating Symbol Min Typ Max Unit Operating Junction Temperature Range TJ -40 -- +125 C Operating Ambient Temperature Range TA -40 -- +85 C Operating Junction Temperature Range TJ -40 -- +155 C Operating Ambient Temperature Range TA -40 -- +125 C Industrial Temperature Devices Extended Temperature Devices Power Dissipation: Internal chip power dissipation: PINT = VDD x (IDD - IOH) PD PINT + PI/O W PDMAX (TJ - TA)/ JA W I/O Pin Power Dissipation: I/O = ({VDD - VOH} x IOH) + (VOL x IOL) Maximum Allowed Power Dissipation TABLE 22-3: THERMAL PACKAGING CHARACTERISTICS Characteristic Package Thermal Resistance, 44-pin QFN Package Thermal Resistance, 44-pin TFQP Package Thermal Resistance, 28-pin SPDIP Package Thermal Resistance, 28-pin SOIC Package Thermal Resistance, 28-pin SSOP Package Thermal Resistance, 28-pin QFN-S Note 1: Symbol Typ Max Unit Notes JA JA JA JA JA JA 32 -- C/W 1 45 -- C/W 1 45 -- C/W 1 50 -- C/W 1 71 -- C/W 1 35 -- C/W 1 Junction to ambient thermal resistance, Theta-JA ( JA) numbers are achieved by package simulations. DS70290J-page 210 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-4: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Param Symbol No. Characteristic Min Typ(1) Max Units 3.0 -- 3.6 V Conditions Operating Voltage DC10 Supply Voltage VDD -- (2) Industrial and Extended DC12 VDR RAM Data Retention Voltage 1.8 -- -- V -- DC16 VPOR VDD Start Voltage to ensure internal Power-on Reset signal -- -- VSS V -- DC17 SVDD VDD Rise Rate to ensure internal Power-on Reset signal 0.03 -- -- Note 1: 2: V/ms 0-3.0V in 0.1s Data in "Typ" column is at 3.3V, 25C unless otherwise stated. This is the limit to which VDD can be lowered without losing RAM data. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 211 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Parameter No.(2) Typical(3) Max Units Conditions Operating Current (IDD)(1) DC20d 20 30 mA -40C DC20a 19 22 mA +25C DC20b 19 25 mA +85C DC20c 19 30 mA +125C DC21d 28 40 mA -40C DC21a 27 30 mA +25C DC21b 27 32 mA +85C DC21c 27 36 mA +125C DC22d 33 50 mA -40C DC22a 33 40 mA +25C DC22b 33 40 mA +85C DC22c 33 50 mA +125C DC23d 44 60 mA -40C DC23a 43 50 mA +25C DC23b 42 55 mA +85C DC23c 41 65 mA +125C DC24d 55 75 mA -40C DC24a 54 65 mA +25C DC24b 52 70 mA +85C DC24c 51 80 mA +125C Note 1: 2: 3: 3.3V 10 MIPS(3) 3.3V 16 MIPS(3) 3.3V 20 MIPS(3) 3.3V 30 MIPS(3) 3.3V 40 MIPS IDD is primarily a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements are as follows: * Oscillator is configured in EC mode with PLL, OSC1 is driven with external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required) * CLKO is configured as an I/O input pin in the Configuration Word * All I/O pins are configured as inputs and pulled to VSS * MCLR = VDD, WDT and FSCM are disabled * CPU, SRAM, program memory and data memory are operational * No peripheral modules are operating; however, every peripheral is being clocked (defined PMDx bits are set to zero and unimplemented PMDx bits are set to one) * CPU executing while(1) statement * JTAG is disabled These parameters are characterized but not tested in manufacturing. Data in "Typ" column is at 3.3V, +25C unless otherwise stated. DS70290J-page 212 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-6: DC CHARACTERISTICS: IDLE CURRENT (IIDLE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Parameter No.(2) Typical(3) Max Units Conditions Idle Current (IIDLE): Core OFF Clock ON Base Current(1) DC40d 7 20 mA -40C DC40a 6 7 mA +25C DC40b 6 10 mA +85C DC40c 6 20 mA +125C DC41d 10 20 mA -40C DC41a 8 9 mA +25C DC41b 8 10 mA +85C DC41c 8 20 mA +125C DC42d 11 20 mA -40C DC42a 10 10 mA +25C DC42b 10 12 mA +85C DC42c 10 20 mA +125C DC43d 14 25 mA -40C DC43a 13 14 mA +25C DC43b 13 15 mA +85C DC43c 13 25 mA +125C DC44d 14 25 mA -40C DC44a 17 20 mA +25C DC44b 17 20 mA +85C DC44c 18 30 mA +125C Note 1: 2: 3: 3.3V 10 MIPS(3) 3.3V 16 MIPS(3) 3.3V 20 MIPS(3) 3.3V 30 MIPS(3) 3.3V 40 MIPS Base IIDLE current is measured as follows: * CPU core is off, oscillator is configured in EC mode and external clock active, OSC1 is driven with external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required) * CLKO is configured as an I/O input pin in the Configuration Word * All I/O pins are configured as inputs and pulled to VSS * MCLR = VDD, WDT and FSCM are disabled * No peripheral modules are operating; however, every peripheral is being clocked (defined PMDx bits are set to zero and unimplemented PMDx bits are set to one) * JTAG is disabled These parameters are characterized but not tested in manufacturing. Data in "Typ" column is at 3.3V, +25C unless otherwise stated. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 213 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Parameter No.(5) Typical(2) Max Units Conditions Power-Down Current (IPD)(1) DC60d 55 500 A -40C DC60a 63 300 A +25C DC60b 85 350 A +85C DC60c 146 600 A +125C DC61d 8 15 A -40C DC61a 2 3 A +25C DC61b 2 2 A +85C DC61c 3 5 A +125C Note 1: 2: 3: 4: 5: 3.3V Base Power-Down Current(3,4) 3.3V Watchdog Timer Current: IWDT(3,5) IPD (Sleep) current is measured as follows: * CPU core is off, oscillator is configured in EC mode and external clock active, OSC1 is driven with external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required) * CLKO is configured as an I/O input pin in the Configuration Word * All I/O pins are configured as inputs and pulled to VSS * MCLR = VDD, WDT and FSCM are disabled, all peripheral modules are disabled (PMDx bits are all ones) * VREGS bit (RCON<8>) = 0 (i.e., core regulator is set to stand-by while the device is in Sleep mode) * RTCC is disabled. * JTAG is disabled Data in the "Typ" column is at 3.3V, +25C unless otherwise stated. The Watchdog Timer Current is the additional current consumed when the WDT module is enabled. This current should be added to the base IPD current. These currents are measured on the device containing the most memory in this family. These parameters are characterized, but are not tested in manufacturing. DS70290J-page 214 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-8: DC CHARACTERISTICS: DOZE CURRENT (IDOZE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Parameter No. Typical(2) Max Doze Ratio Units Conditions Doze Current (IDOZE)(1) DC73a 41 51 1:2 mA DC73f 20 28 1:64 mA DC73g 19 24 1:128 mA DC70a 40 46 1:2 mA DC70f 18 20 1:64 mA DC70g 18 20 1:128 mA DC71a 40 46 1:2 mA DC71f 18 25 1:64 mA DC71g 18 20 1:128 mA DC72a 39 55 1:2 mA DC72f 18 30 1:64 mA DC72g 18 25 1:128 mA Note 1: 2: -40C 3.3V 40 MIPS +25C 3.3V 40 MIPS +85C 3.3V 40 MIPS +125C 3.3V 40 MIPS IDOZE is primarily a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDOZE measurements are as follows: * Oscillator is configured in EC mode and external clock active, OSC1 is driven with external square wave from rail-to-rail with overshoot/undershoot < 250 mV * CLKO is configured as an I/O input pin in the Configuration Word * All I/O pins are configured as inputs and pulled to VSS * MCLR = VDD, WDT and FSCM are disabled * CPU, SRAM, program memory and data memory are operational * No peripheral modules are operating; however, every peripheral is being clocked (defined PMDx bits are set to zero and unimplemented PMDx bits are set to one) * CPU executing while(1) statement * JTAG is disabled Data in the "Typ" column is at 3.3V, +25C unless otherwise stated. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 215 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-9: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Param Symbol No. VIL Characteristic Min Typ(1) Max Units Conditions Input Low Voltage DI10 I/O pins VSS -- 0.2 VDD V DI15 MCLR VSS -- 0.2 VDD V DI16 I/O Pins with OSC1 or SOSCI VSS -- 0.2 VDD V DI18 SDAx, SCLx VSS -- 0.3 VDD V SMBus disabled DI19 SDAx, SCLx VSS -- 0.8 V SMBus enabled VIH Input High Voltage DI20 I/O Pins Not 5V Tolerant(4) I/O Pins 5V Tolerant(4) 0.7 VDD 0.7 VDD -- -- VDD 5.5 V V -- DI28 SDAx, SCLx 0.7 VDD -- 5.5 V SMBus disabled SDAx, SCLx 2.1 -- 5.5 V SMBus enabled 50 250 400 A VDD = 3.3V, VPIN = VSS DI29 ICNPU CNx Pull-up Current DI30 IIL Input Leakage Current(2,3) DI50 I/O Pins 5V Tolerant(4) -- -- 2 A VSS VPIN VDD, Pin at high-impedance DI51 I/O Pins Not 5V Tolerant(4) -- -- 1 A VSS VPIN VDD, Pin at high-impedance, -40C TA +85C DI51a I/O Pins Not 5V Tolerant(4) -- -- 2 A Shared with external reference pins, -40C TA +85C DI51b I/O Pins Not 5V Tolerant(4) -- -- 3.5 A VSS VPIN VDD, Pin at high-impedance, -40C TA +125C DI51c I/O Pins Not 5V Tolerant(4) -- -- 8 A Analog pins shared with external reference pins, -40C TA +125C DI55 MCLR -- -- 2 A VSS VPIN VDD DI56 OSC1 -- -- 2 A VSS VPIN VDD, XT and HS modes Note 1: 2: 3: 4: 5: 6: 7: 8: 9: Data in "Typ" column is at 3.3V, 25C unless otherwise stated. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as current sourced by the pin. See "Pin Diagrams" for a list of digital-only and analog pins. VIL source < (VSS - 0.3). Characterized but not tested. Non-5V tolerant pins VIH source > (VDD + 0.3), 5V tolerant pins VIH source > 5V or devices with USB, "D+" and "D-" VIH source > (VUSB + 0.3). Characterized but not tested. Digital 5V tolerant pins cannot tolerate any "positive" input injection current from input sources > 5V. Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts. Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted provided the mathematical "absolute instantaneous" sum of the input injection currents from all pins do not exceed the specified limit. Characterized but not tested. DS70290J-page 216 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-9: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS (CONTINUED) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Param Symbol No. IICL Characteristic Min Typ(1) Max Units 0 -- -5(5,8) mA All pins except VDD, VSS, AVDD, AVSS, MCLR, VCAP, SOSCI, SOSCO, and RB14 All pins except VDD, VSS, AVDD, AVSS, MCLR, VCAP, SOSCI, SOSCO, RB14, and digital 5V-tolerant designated pins Input Low Injection Current DI60a IICH Input High Injection Current DI60b IICT DI60c 3: 4: 5: 6: 7: 8: 9: 0 -- +5(6,7,8) mA -20(9) -- +20(9) mA Total Input Injection Current (sum of all I/O and control pins) Note 1: 2: Conditions Absolute instantaneous sum of all input injection currents from all I/O pins ( | IICL + | IICH | ) IICT Data in "Typ" column is at 3.3V, 25C unless otherwise stated. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as current sourced by the pin. See "Pin Diagrams" for a list of digital-only and analog pins. VIL source < (VSS - 0.3). Characterized but not tested. Non-5V tolerant pins VIH source > (VDD + 0.3), 5V tolerant pins VIH source > 5V or devices with USB, "D+" and "D-" VIH source > (VUSB + 0.3). Characterized but not tested. Digital 5V tolerant pins cannot tolerate any "positive" input injection current from input sources > 5V. Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts. Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted provided the mathematical "absolute instantaneous" sum of the input injection currents from all pins do not exceed the specified limit. Characterized but not tested. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 217 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-10: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Param. Symbol DO10 DO20 VOL VOH Characteristic Min. Typ. Max. Units Conditions Output Low Voltage I/O Pins: 2x Sink Driver Pins - All pins not defined by 4x or 8x driver pins -- -- 0.4 V IOL 3 mA, VDD = 3.3V Output Low Voltage I/O Pins: 4x Sink Driver Pins - RA0, RA1, RB5, RB6, RB8, RB9, RB14 -- -- 0.4 V IOL 6 mA, VDD = 3.3V Output Low Voltage I/O Pins: 8x Sink Driver Pins - OSCO, CLKO, RA3 -- -- 0.4 V IOL 10 mA, VDD = 3.3V Output High Voltage I/O Pins: 2x Source Driver Pins - All pins not defined by 4x or 8x driver pins 2.4 -- -- V IOL -3 mA, VDD = 3.3V Output High Voltage I/O Pins: 4x Source Driver Pins - RA0, RA1, RB5, RB6, RB8, RB9, RB14 2.4 -- -- V IOL -6 mA, VDD = 3.3V 2.4 -- -- V IOL -10 mA, VDD = 3.3V 1.5 -- -- 2.0 -- -- 3.0 -- -- IOH -2 mA, VDD = 3.3V See Note 1 1.5 -- -- IOH -12 mA, VDD = 3.3V See Note 1 2.0 -- -- 3.0 -- -- IOH -3 mA, VDD = 3.3V See Note 1 1.5 -- -- IOH -16 mA, VDD = 3.3V See Note 1 2.0 -- -- 3.0 -- -- Output High Voltage I/O Pins: 8x Source Driver Pins - OSCO, CLKO, RA3 Output High Voltage I/O Pins: 2x Source Driver Pins - All pins not defined by 4x or 8x driver pins DO20A VOH1 Output High Voltage 4x Source Driver Pins - RA0, RA1, RB5, RB6, RB8, RB9, RB14 Output High Voltage 8x Source Driver Pins - OSCO, CLKO, RA3 Note 1: IOH -6 mA, VDD = 3.3V See Note 1 V V V IOH -5 mA, VDD = 3.3V See Note 1 IOH -11 mA, VDD = 3.3V See Note 1 IOH -12 mA, VDD = 3.3V See Note 1 IOH -4 mA, VDD = 3.3V See Note 1 Parameters are characterized, but not tested. DS70290J-page 218 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-11: ELECTRICAL CHARACTERISTICS: BOR Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Param No. BO10 Note 1: 2: Characteristic(1) Symbol Min Typ Max Units Conditions BOR Event on VDD transition high-to-low 2.40 -- 2.55 V See Note 2 VBOR Parameters are for design guidance only and are not tested in manufacturing. Device is functional at VBORMIN < VDD < VDDMIN. Analog modules such as the ADC will have degraded performance. Device functionality is tested but not characterized. TABLE 22-12: DC CHARACTERISTICS: PROGRAM MEMORY Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Param Symbol No. D130 D131 D132B D134 EP VPR VPEW TRETD D135 IDDP D136a Characteristic(3) Program Flash Memory Cell Endurance VDD for Read VDD for Self-Timed Write Characteristic Retention Min Typ(1) Max Units Conditions 10,000 VMIN VMIN 20 -- -- -- -- -- 3.6 3.6 -- E/W V V Year -40 C to +125 C VMIN = Minimum operating voltage VMIN = Minimum operating voltage Provided no other specifications are violated, -40 C to +125 C -- 10 -- mA TRW Supply Current during Programming Row Write Time 1.32 -- 1.74 ms D136b TRW Row Write Time 1.28 -- 1.79 ms D137a TPE Page Erase Time 20.1 -- 26.5 ms D137b TPE Page Erase Time 19.5 -- 27.3 ms D138a TWW Word Write Cycle Time 42.3 -- 55.9 s D138b TWW Word Write Cycle Time 41.1 -- 57.6 s Note 1: 2: 3: TRW = 11064 FRC cycles, TA = +85C, See Note 2 TRW = 11064 FRC cycles, TA = +150C, See Note 2 TPE = 168517 FRC cycles, TA = +85C, See Note 2 TPE = 168517 FRC cycles, TA = +150C, See Note 2 TWW = 355 FRC cycles, TA = +85C, See Note 2 TWW = 355 FRC cycles, TA = +150C, See Note 2 Data in "Typ" column is at 3.3V, 25C unless otherwise stated. Other conditions: FRC = 7.37 MHz, TUN<5:0> = b'011111 (for Min), TUN<5:0> = b'100000 (for Max). This parameter depends on the FRC accuracy (see Table 22-18) and the value of the FRC Oscillator Tuning register (see Register 8-4). For complete details on calculating the Minimum and Maximum time see Section 5.3 "Programming Operations". These parameters are assured by design, but are not characterized or tested in manufacturing. TABLE 22-13: INTERNAL VOLTAGE REGULATOR SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Param No. -- Note 1: Symbol Characteristics Min External Filter Capacitor 4.7 Value(1) Typical VCAP voltage = 2.5V when VDD VDDMIN. CEFC (c) 2007-2011 Microchip Technology Inc. Typ Max Units Comments 10 -- F Capacitor must be low series resistance (< 5 ohms) DS70290J-page 219 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 22.2 AC Characteristics and Timing Parameters The information contained in this section defines dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 AC characteristics and timing parameters. TABLE 22-14: TEMPERATURE AND VOLTAGE SPECIFICATIONS - AC Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Operating voltage VDD range as described in Table 22-1. AC CHARACTERISTICS FIGURE 22-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS Load Condition 1 - for all pins except OSC2 Load Condition 2 - for OSC2 VDD/2 CL Pin RL VSS CL Pin RL = 464 CL = 50 pF for all pins except OSC2 15 pF for OSC2 output VSS TABLE 22-15: CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS Param Symbol No. Characteristic Min Typ Max Units Conditions DO50 COSC2 OSC2/SOSC2 pin -- -- 15 pF In XT and HS modes when external clock is used to drive OSC1 DO56 CIO All I/O pins and OSC2 -- -- 50 pF EC mode DO58 CB SCLx, SDAx -- -- 400 pF In I2CTM mode DS70290J-page 220 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 22-2: EXTERNAL CLOCK TIMING Q1 Q2 Q3 Q4 Q1 Q2 OS30 OS30 Q3 Q4 OSC1 OS20 OS31 OS31 OS25 CLKO OS41 OS40 TABLE 22-16: EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. OS10 Symbol FIN OS20 TOSC Min Typ(1) Max Units External CLKI Frequency(4) (External clocks allowed only in EC and ECPLL modes) DC -- 40 MHz EC Oscillator Crystal Frequency(5) 3.5 10 -- -- -- 10 40 33 MHz MHz kHz XT HS SOSC TOSC = 1/FOSC(4) 12.5 -- DC ns Characteristic Time(2,4) Conditions -- OS25 TCY Instruction Cycle 25 -- DC ns OS30 TosL, TosH External Clock in (OSC1)(5) High or Low Time 0.375 x TOSC -- 0.625 x TOSC ns EC OS31 TosR, TosF External Clock in (OSC1)(5) Rise or Fall Time -- -- 20 ns EC OS40 TckR CLKO Rise Time(3,5) -- 5.2 -- ns -- OS41 TckF CLKO Fall Time(3,5) -- 5.2 -- ns -- OS42 GM External Oscillator Transconductance(6) 14 16 18 mA/V Note 1: 2: 3: 4: 5: 6: -- VDD = 3.3V TA = +25C Data in "Typ" column is at 3.3V, 25C unless otherwise stated. Instruction cycle period (TCY) equals two times the input oscillator time-base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits can result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at "min." values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the "max." cycle time limit is "DC" (no clock) for all devices. Measurements are taken in EC mode. The CLKO signal is measured on the OSC2 pin. These parameters are characterized by similarity, but are tested in manufacturing at FIN = 40 MHz only. These parameters are characterized by similarity, but are not tested in manufacturing. Data for this parameter is preliminary. This parameter is characterized, but is not tested in manufacturing. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 221 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-17: PLL CLOCK TIMING SPECIFICATIONS (VDD = 3.0V TO 3.6V) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param Symbol No. OS50 FPLLI OS51 FSYS OS52 OS53 TLOCK DCLK Note 1: 2: 3: Characteristic Min Typ(1) Max Units PLL Voltage Controlled Oscillator (VCO) Input Frequency Range(2) On-Chip VCO System Frequency(3) PLL Start-up Time (Lock Time)(3) CLKO Stability (Jitter)(3) 0.8 -- 8 MHz 100 -- 200 MHz 0.9 -3 1.5 0.5 3.1 3 ms % Conditions ECPLL, XTPLL modes -- -- Measured over 100 ms period Data in "Typ" column is at 3.3V, 25C unless otherwise stated. These parameters are characterized by similarity, but are tested in manufacturing at 7.7 MHz input only. These parameters are characterized by similarity, but are not tested in manufacturing. This specification is based on clock cycle by clock cycle measurements. To calculate the effective jitter for individual time bases or communication clocks use this formula: D CLK Peripheral Clock Jitter = ----------------------------------------------------------------------F OSC ------------------------------------------------------------ Peripheral Bit Rate Clock For example: Fosc = 32 MHz, DCLK = 3%, SPI bit rate clock, (i.e., SCK) is 2 MHz. D CLK 3% 3% SPI SCK Jitter = ------------------------------ = ---------- = -------- = 0.75% 4 16 MHz- 32 ------------------ 2 MHz TABLE 22-18: AC CHARACTERISTICS: INTERNAL RC ACCURACY AC CHARACTERISTICS Param No. Characteristic Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for industrial -40C TA +125C for Extended Min Typ Max Units Conditions Internal FRC Accuracy @ FRC Frequency = 7.37 MHz(1) F20a FRC -2 -- +2 % -40C TA +85C VDD = 3.0-3.6V F20b FRC -5 -- +5 % -40C TA +125C VDD = 3.0-3.6V Note 1: Frequency calibrated at 25C and 3.3V. TUN bits can be used to compensate for temperature drift. TABLE 22-19: INTERNAL RC ACCURACY AC CHARACTERISTICS Param No. Characteristic Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Min Typ Max Units Conditions LPRC @ 32.768 kHz(1,2) F21a LPRC -15 6 +15 % -40C TA +85C VDD = 3.0-3.6V F21b LPRC -40 -- +40 % -40C TA +125C VDD = 3.0-3.6V Note 1: 2: Change of LPRC frequency as VDD changes. LPRC impacts the Watchdog Timer Time-out Period (TWDT1). See Section 19.4 "Watchdog Timer (WDT)" for more information. DS70290J-page 222 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 22-3: I/O TIMING CHARACTERISTICS I/O Pin (Input) DI35 DI40 I/O Pin (Output) New Value Old Value DO31 DO32 Note: Refer to Figure 22-1 for load conditions. TABLE 22-20: I/O TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(2) Min Typ(1) Max Units Conditions DO31 TIOR Port Output Rise Time -- 10 25 ns -- DO32 TIOF Port Output Fall Time -- 10 25 ns -- DI35 TINP INTx Pin High or Low Time (input) 25 -- -- ns -- DI40 TRBP CNx High or Low Time (input) 2 -- -- TCY -- Note 1: 2: Data in "Typ" column is at 3.3V, 25C unless otherwise stated. These parameters are characterized, but are not tested in manufacturing. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 223 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 22-4: VDD RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING CHARACTERISTICS SY12 MCLR SY10 Internal POR PWRT Time-out OSC Time-out SY11 SY30 Internal Reset Watchdog Timer Reset SY13 SY20 SY13 I/O Pins SY35 FSCM Delay Note: Refer to Figure 22-1 for load conditions. DS70290J-page 224 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-21: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Param Symbol No. Min Typ(2) Max Characteristic Units Conditions SY10 TMCL MCLR Pulse-Width (low)(1) 2 -- -- s -40C to +85C SY11 TPWRT Power-up Timer Period -- 2 4 8 16 32 64 128 -- ms -40C to +85C User programmable SY12 TPOR Power-on Reset Delay(3) 3 10 30 s -40C to +85C SY13 TIOZ I/O High-Impedance from MCLR Low or Watchdog Timer Reset(1) 0.68 0.72 1.2 s -- SY20 TWDT1 Watchdog Timer Time-out Period(1) -- -- -- ms See Section 19.4 "Watchdog Timer (WDT)" and LPRC parameter F21a (Table 22-19). SY30 TOST Oscillator Start-up Time -- 1024 TOSC -- -- TOSC = OSC1 period SY35 TFSCM Fail-Safe Clock Monitor Delay(1) -- 500 900 s -40C to +85C Note 1: 2: 3: These parameters are characterized but not tested in manufacturing. Data in "Typ" column is at 3.3V, 25C unless otherwise stated. These parameters are characterized, but are not tested in manufacturing. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 225 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 22-5: TIMER1, 2 AND 3 EXTERNAL CLOCK TIMING CHARACTERISTICS TxCK Tx11 Tx10 Tx15 OS60 Tx20 TMRx Note: Refer to Figure 22-1 for load conditions. TABLE 22-22: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS(1) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. TA10 TA11 TA15 Symbol TTXH TTXL TTXP Characteristic(2) TxCK High Time TxCK Low Time Min Typ Max Units Conditions Synchronous, no prescaler 0.5 TCY + 20 -- -- ns Must also meet parameter TA15 Synchronous, with prescaler 10 -- -- ns Asynchronous 10 -- -- ns Synchronous, no prescaler 0.5 TCY + 20 -- -- ns Synchronous, with prescaler 10 -- -- ns Asynchronous 10 -- -- ns TCY + 40 -- -- ns Greater of: 20 ns or (TCY + 40)/N -- -- -- TxCK Input Period Synchronous, no prescaler Synchronous, with prescaler Asynchronous OS60 Ft1 TA20 TCKEXTMRL Delay from External TxCK Clock Edge to Timer Increment Note 1: 2: SOSC1/T1CK Oscillator Input frequency Range (oscillator enabled by setting bit TCS (T1CON<1>)) Must also meet parameter TA15 -- N = prescale value (1, 8, 64, 256) 20 -- -- ns -- DC -- 50 kHz -- 0.5 TCY -- 1.5 TCY -- -- Timer1 is a Type A. These parameters are characterized by similarity, but are not tested in manufacturing. DS70290J-page 226 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-23: TIMER2 EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ Max Units Conditions TB10 TtxH TxCK High Synchronous mode Time Greater of: 20 or (TCY + 20)/N -- -- ns Must also meet parameter TB15 N = prescale value (1, 8, 64, 256) TB11 TtxL TxCK Low Synchronous Time mode Greater of: 20 or (TCY + 20)/N -- -- ns Must also meet parameter TB15 N = prescale value (1, 8, 64, 256) TB15 TtxP TxCK Input Period Synchronous mode Greater of: 40 or (2 TCY + 40)/N -- -- ns N = prescale value (1, 8, 64, 256) TB20 TCKEXTMRL Delay from External TxCK Clock Edge to Timer Increment 0.75 TCY + 40 -- 1.75 TCY + 40 ns Note 1: -- These parameters are characterized, but are not tested in manufacturing. TABLE 22-24: TIMER3 EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ Max Units Conditions TC10 TtxH TxCK High Time Synchronous TCY + 20 -- -- ns Must also meet parameter TC15 TC11 TtxL TxCK Low Time Synchronous TCY + 20 -- -- ns Must also meet parameter TC15 TC15 TtxP TxCK Input Period Synchronous, with prescaler 2 TCY + 40 -- -- ns N = prescale value (1, 8, 64, 256) TC20 TCKEXTMRL Delay from External TxCK Clock Edge to Timer Increment 0.75 TCY + 40 -- 1.75 TCY + 40 ns Note 1: -- These parameters are characterized, but are not tested in manufacturing. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 227 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 22-6: INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS ICx IC10 IC11 IC15 Note: Refer to Figure 22-1 for load conditions. TABLE 22-25: INPUT CAPTURE TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol IC10 TccL ICx Input Low Time No Prescaler IC11 TccH ICx Input High Time No Prescaler IC15 TccP ICx Input Period Characteristic(1) Min Max Units Conditions 0.5 TCY + 20 -- ns -- With Prescaler 10 -- ns 0.5 TCY + 20 -- ns 10 -- ns (TCY + 40)/N -- ns With Prescaler Note 1: -- N = prescale value (1, 4, 16) These parameters are characterized but not tested in manufacturing. FIGURE 22-7: OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS OCx (Output Compare or PWM Mode) OC10 OC11 Note: Refer to Figure 22-1 for load conditions. TABLE 22-26: OUTPUT COMPARE MODULE TIMING REQUIREMENTS AC CHARACTERISTICS Param Symbol No. Characteristic(1) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Min Typ Max Units Conditions OC10 TccF OCx Output Fall Time -- -- -- ns See parameter D032 OC11 TccR OCx Output Rise Time -- -- -- ns See parameter D031 Note 1: These parameters are characterized but not tested in manufacturing. DS70290J-page 228 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 22-8: OC/PWM MODULE TIMING CHARACTERISTICS OC20 OCFA/OCFB OC15 Active OCx Tri-state TABLE 22-27: SIMPLE OC/PWM MODE TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ Max Units Conditions OC15 TFD Fault Input to PWM I/O Change -- -- TCY + 20 ns -- OC20 TFLT Fault Input Pulse-Width TCY + 20 -- -- ns -- Note 1: These parameters are characterized but not tested in manufacturing. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 229 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-28: SPIx MAXIMUM DATA/CLOCK RATE SUMMARY Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Maximum Data Rate Master Transmit Only (Half-Duplex) 15 MHz Table 22-29 9 MHz -- 9 MHz -- 15 MHz -- Master Transmit/Receive (Full-Duplex) Slave Transmit/Receive (Full-Duplex) CKE -- -- Table 22-30 -- Table 22-31 -- CKP SMP 0,1 0,1 0,1 1 0,1 1 -- 0 0,1 1 Table 22-32 1 0 0 11 MHz -- -- Table 22-33 1 1 0 15 MHz -- -- Table 22-34 0 1 0 11 MHz -- -- Table 22-35 0 0 0 FIGURE 22-9: SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY CKE = 0) TIMING CHARACTERISTICS SCKx (CKP = 0) SP10 SP21 SP20 SP20 SP21 SCKx (CKP = 1) SP35 Bit 14 - - - - - -1 MSb SDOx SP30, SP31 LSb SP30, SP31 Note: Refer to Figure 22-1 for load conditions. FIGURE 22-10: SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY CKE = 1) TIMING CHARACTERISTICS SP36 SCKx (CKP = 0) SP10 SP21 SP20 SP20 SP21 SCKx (CKP = 1) SP35 SDOx MSb Bit 14 - - - - - -1 LSb SP30, SP31 Note: Refer to Figure 22-1 for load conditions. DS70290J-page 230 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-29: SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions See Note 3 SP10 TscP Maximum SCK Frequency -- -- 15 MHz SP20 TscF SCKx Output Fall Time -- -- -- ns See parameter DO32 and Note 4 SP21 TscR SCKx Output Rise Time -- -- -- ns See parameter DO31 and Note 4 SP30 TdoF SDOx Data Output Fall Time -- -- -- ns See parameter DO32 and Note 4 SP31 TdoR SDOx Data Output Rise Time -- -- -- ns See parameter DO31 and Note 4 SP35 TscH2doV, TscL2doV SDOx Data Output Valid after SCKx Edge -- 6 20 ns -- SP36 TdiV2scH, TdiV2scL SDOx Data Output Setup to First SCKx Edge 30 -- -- ns -- Note 1: 2: 3: 4: These parameters are characterized, but are not tested in manufacturing. Data in "Typ" column is at 3.3V, 25C unless otherwise stated. The minimum clock period for SCKx is 66.7 ns. Therefore, the clock generated in Master mode must not violate this specification. Assumes 50 pF load on all SPIx pins. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 231 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 22-11: SPIx MASTER MODE (FULL-DUPLEX, CKE = 1, CKP = X, SMP = 1) TIMING CHARACTERISTICS SP36 SCKx (CKP = 0) SP10 SP21 SP20 SP20 SP21 SCKx (CKP = 1) SP35 Bit 14 - - - - - -1 MSb SDOx SP30, SP31 SP40 SDIx LSb MSb In LSb In Bit 14 - - - -1 SP41 Note: Refer to Figure 22-1 for load conditions. TABLE 22-30: SPIx MASTER MODE (FULL-DUPLEX, CKE = 1, CKP = x, SMP = 1) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions See Note 3 SP10 SP20 TscP TscF Maximum SCK Frequency SCKx Output Fall Time -- -- -- -- 9 -- MHz ns SP21 TscR SCKx Output Rise Time -- -- -- ns SP30 TdoF SDOx Data Output Fall Time -- -- -- ns SP31 TdoR SDOx Data Output Rise Time -- -- -- ns SP35 TscH2doV, SDOx Data Output Valid after -- 6 20 ns TscL2doV SCKx Edge TdoV2sc, SDOx Data Output Setup to 30 -- -- ns -- TdoV2scL First SCKx Edge TdiV2scH, Setup Time of SDIx Data 30 -- -- ns -- TdiV2scL Input to SCKx Edge TscH2diL, Hold Time of SDIx Data Input 30 -- -- ns -- TscL2diL to SCKx Edge These parameters are characterized, but are not tested in manufacturing. Data in "Typ" column is at 3.3V, 25C unless otherwise stated. The minimum clock period for SCKx is 111 ns. The clock generated in Master mode must not violate this specification. Assumes 50 pF load on all SPIx pins. SP36 SP40 SP41 Note 1: 2: 3: 4: DS70290J-page 232 See parameter DO32 and Note 4 See parameter DO31 and Note 4 See parameter DO32 and Note 4 See parameter DO31 and Note 4 -- (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 22-12: SPIx MASTER MODE (FULL-DUPLEX, CKE = 0, CKP = X, SMP = 1) TIMING CHARACTERISTICS SCKx (CKP = 0) SP10 SP21 SP20 SP20 SP21 SCKx (CKP = 1) SP35 MSb SDOx Bit 14 - - - - - -1 SP30, SP31 SDIx MSb In LSb SP30, SP31 LSb In Bit 14 - - - -1 SP40 SP41 Note: Refer to Figure 22-1 for load conditions. TABLE 22-31: SPIx MASTER MODE (FULL-DUPLEX, CKE = 0, CKP = x, SMP = 1) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions -40C to +125C and see Note 3 See parameter DO32 and Note 4 See parameter DO31 and Note 4 See parameter DO32 and Note 4 See parameter DO31 and Note 4 -- SP10 TscP Maximum SCK Frequency -- -- 9 MHz SP20 TscF SCKx Output Fall Time -- -- -- ns SP21 TscR SCKx Output Rise Time -- -- -- ns SP30 TdoF SDOx Data Output Fall Time -- -- -- ns SP31 TdoR SDOx Data Output Rise Time -- -- -- ns SP35 TscH2doV, SDOx Data Output Valid after -- 6 20 ns TscL2doV SCKx Edge TdoV2scH, SDOx Data Output Setup to 30 -- -- ns -- TdoV2scL First SCKx Edge TdiV2scH, Setup Time of SDIx Data 30 -- -- ns -- TdiV2scL Input to SCKx Edge TscH2diL, Hold Time of SDIx Data Input 30 -- -- ns -- TscL2diL to SCKx Edge These parameters are characterized, but are not tested in manufacturing. Data in "Typ" column is at 3.3V, 25C unless otherwise stated. The minimum clock period for SCKx is 111 ns. The clock generated in Master mode must not violate this specification. Assumes 50 pF load on all SPIx pins. SP36 SP40 SP41 Note 1: 2: 3: 4: (c) 2007-2011 Microchip Technology Inc. DS70290J-page 233 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 22-13: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 0, SMP = 0) TIMING CHARACTERISTICS SP60 SSx SP52 SP50 SCKx (CKP = 0) SP70 SP73 SP72 SP72 SP73 SCKx (CKP = 1) SP35 MSb SDOx Bit 14 - - - - - -1 LSb SP30,SP31 SDI SDIx MSb In Bit 14 - - - -1 SP51 LSb In SP41 SP40 Note: Refer to Figure 22-1 for load conditions. DS70290J-page 234 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-32: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 0, SMP = 0) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions See Note 3 SP70 SP72 TscP TscF Maximum SCK Input Frequency SCKx Input Fall Time -- -- -- -- 15 -- MHz ns SP73 TscR SCKx Input Rise Time -- -- -- ns SP30 TdoF SDOx Data Output Fall Time -- -- -- ns SP31 TdoR SDOx Data Output Rise Time -- -- -- ns SP35 TscH2doV, TscL2doV TdoV2scH, TdoV2scL TdiV2scH, TdiV2scL SDOx Data Output Valid after SCKx Edge SDOx Data Output Setup to First SCKx Edge Setup Time of SDIx Data Input to SCKx Edge -- 6 20 ns See parameter DO32 and Note 4 See parameter DO31 and Note 4 See parameter DO32 and Note 4 See parameter DO31 and Note 4 -- 30 -- -- ns -- 30 -- -- ns -- SP41 TscH2diL, TscL2diL Hold Time of SDIx Data Input to SCKx Edge 30 -- -- ns -- SP50 TssL2scH, TssL2scL SSx to SCKx or SCKx Input 120 -- -- ns -- SP51 TssH2doZ SSx to SDOx Output High-Impedance(4) 10 -- 50 ns -- SP52 TscH2ssH SSx after SCKx Edge TscL2ssH 1.5 TCY + 40 -- -- ns See Note 4 SP60 TssL2doV SDOx Data Output Valid after -- -- 50 ns -- SSx Edge These parameters are characterized, but are not tested in manufacturing. Data in "Typ" column is at 3.3V, 25C unless otherwise stated. The minimum clock period for SCKx is 66.7 ns. Therefore, the SCK clock generated by the Master must not violate this specification. Assumes 50 pF load on all SPIx pins. SP36 SP40 Note 1: 2: 3: 4: (c) 2007-2011 Microchip Technology Inc. DS70290J-page 235 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 22-14: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 1, SMP = 0) TIMING CHARACTERISTICS SP60 SSx SP52 SP50 SCKx (CKP = 0) SP70 SP73 SP72 SP72 SP73 SCKx (CKP = 1) SP35 SP52 MSb SDOx Bit 14 - - - - - -1 LSb SP30,SP31 SDI SDIx MSb In Bit 14 - - - -1 SP51 LSb In SP41 SP40 Note: Refer to Figure 22-1 for load conditions. DS70290J-page 236 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-33: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 1, SMP = 0) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions See Note 3 SP70 TscP Maximum SCK Input Frequency -- -- 11 MHz SP72 TscF SCKx Input Fall Time -- -- -- ns See parameter DO32 and Note 4 SP73 TscR SCKx Input Rise Time -- -- -- ns See parameter DO31 and Note 4 SP30 TdoF SDOx Data Output Fall Time -- -- -- ns See parameter DO32 and Note 4 SP31 TdoR SDOx Data Output Rise Time -- -- -- ns See parameter DO31 and Note 4 SP35 TscH2doV, SDOx Data Output Valid after TscL2doV SCKx Edge -- 6 20 ns -- SP36 TdoV2scH, SDOx Data Output Setup to TdoV2scL First SCKx Edge 30 -- -- ns -- SP40 TdiV2scH, TdiV2scL Setup Time of SDIx Data Input to SCKx Edge 30 -- -- ns -- SP41 TscH2diL, TscL2diL Hold Time of SDIx Data Input to SCKx Edge 30 -- -- ns -- SP50 TssL2scH, TssL2scL SSx to SCKx or SCKx Input 120 -- -- ns -- SP51 TssH2doZ SSx to SDOx Output High-Impedance(4) 10 -- 50 ns -- SP52 TscH2ssH SSx after SCKx Edge TscL2ssH 1.5 TCY + 40 -- -- ns See Note 4 SP60 TssL2doV SDOx Data Output Valid after SSx Edge -- -- 50 ns -- Note 1: 2: 3: 4: These parameters are characterized, but are not tested in manufacturing. Data in "Typ" column is at 3.3V, 25C unless otherwise stated. The minimum clock period for SCKx is 91 ns. Therefore, the SCK clock generated by the Master must not violate this specification. Assumes 50 pF load on all SPIx pins. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 237 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 22-15: SPIx SLAVE MODE (FULL-DUPLEX CKE = 0, CKP = 1, SMP = 0) TIMING CHARACTERISTICS SSX SP52 SP50 SCKX (CKP = 0) SP70 SP73 SP72 SP72 SP73 SCKX (CKP = 1) SP35 MSb SDOX Bit 14 - - - - - -1 LSb SP51 SP30,SP31 SDIX MSb In Bit 14 - - - -1 LSb In SP41 SP40 Note: Refer to Figure 22-1 for load conditions. DS70290J-page 238 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-34: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 1, SMP = 0) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions See Note 3 SP70 TscP Maximum SCK Input Frequency -- -- 15 MHz SP72 TscF SCKx Input Fall Time -- -- -- ns See parameter DO32 and Note 4 SP73 TscR SCKx Input Rise Time -- -- -- ns See parameter DO31 and Note 4 SP30 TdoF SDOx Data Output Fall Time -- -- -- ns See parameter DO32 and Note 4 SP31 TdoR SDOx Data Output Rise Time -- -- -- ns See parameter DO31 and Note 4 SP35 TscH2doV, SDOx Data Output Valid after TscL2doV SCKx Edge -- 6 20 ns -- SP36 TdoV2scH, SDOx Data Output Setup to TdoV2scL First SCKx Edge 30 -- -- ns -- SP40 TdiV2scH, TdiV2scL Setup Time of SDIx Data Input to SCKx Edge 30 -- -- ns -- SP41 TscH2diL, TscL2diL Hold Time of SDIx Data Input to SCKx Edge 30 -- -- ns -- SP50 TssL2scH, TssL2scL SSx to SCKx or SCKx Input 120 -- -- ns -- SP51 TssH2doZ SSx to SDOx Output High-Impedance(4) 10 -- 50 ns -- SP52 TscH2ssH SSx after SCKx Edge TscL2ssH 1.5 TCY + 40 -- -- ns See Note 4 Note 1: 2: 3: 4: These parameters are characterized, but are not tested in manufacturing. Data in "Typ" column is at 3.3V, 25C unless otherwise stated. The minimum clock period for SCKx is 66.7 ns. Therefore, the SCK clock generated by the Master must not violate this specification. Assumes 50 pF load on all SPIx pins. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 239 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 22-16: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 0, SMP = 0) TIMING CHARACTERISTICS SSX SP52 SP50 SCKX (CKP = 0) SP70 SP73 SP72 SP72 SP73 SCKX (CKP = 1) SP35 MSb SDOX Bit 14 - - - - - -1 LSb SP51 SP30,SP31 SDIX MSb In Bit 14 - - - -1 LSb In SP41 SP40 Note: Refer to Figure 22-1 for load conditions. DS70290J-page 240 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-35: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 0, SMP = 0) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions See Note 3 SP70 TscP Maximum SCK Input Frequency -- -- 11 MHz SP72 TscF SCKx Input Fall Time -- -- -- ns See parameter DO32 and Note 4 SP73 TscR SCKx Input Rise Time -- -- -- ns See parameter DO31 and Note 4 SP30 TdoF SDOx Data Output Fall Time -- -- -- ns See parameter DO32 and Note 4 SP31 TdoR SDOx Data Output Rise Time -- -- -- ns See parameter DO31 and Note 4 SP35 TscH2doV, SDOx Data Output Valid after TscL2doV SCKx Edge -- 6 20 ns -- SP36 TdoV2scH, SDOx Data Output Setup to TdoV2scL First SCKx Edge 30 -- -- ns -- SP40 TdiV2scH, TdiV2scL Setup Time of SDIx Data Input to SCKx Edge 30 -- -- ns -- SP41 TscH2diL, TscL2diL Hold Time of SDIx Data Input to SCKx Edge 30 -- -- ns -- SP50 TssL2scH, TssL2scL SSx to SCKx or SCKx Input 120 -- -- ns -- SP51 TssH2doZ SSx to SDOx Output High-Impedance(4) 10 -- 50 ns -- SP52 TscH2ssH SSx after SCKx Edge TscL2ssH 1.5 TCY + 40 -- -- ns See Note 4 Note 1: 2: 3: 4: These parameters are characterized, but are not tested in manufacturing. Data in "Typ" column is at 3.3V, 25C unless otherwise stated. The minimum clock period for SCKx is 91 ns. Therefore, the SCK clock generated by the Master must not violate this specification. Assumes 50 pF load on all SPIx pins. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 241 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 22-17: I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE) SCLx IM31 IM34 IM30 IM33 SDAx Stop Condition Start Condition Note: Refer to Figure 22-1 for load conditions. FIGURE 22-18: I2Cx BUS DATA TIMING CHARACTERISTICS (MASTER MODE) IM20 IM21 IM11 IM10 SCLx IM11 IM26 IM10 IM25 IM33 SDAx In IM40 IM40 IM45 SDAx Out Note: Refer to Figure 22-1 for load conditions. DS70290J-page 242 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-36: I2Cx BUS DATA TIMING REQUIREMENTS (MASTER MODE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param Symbol No. IM10 IM11 IM20 IM21 IM25 IM26 IM30 IM31 IM33 IM34 IM40 IM45 IM50 IM51 Note 1: 2: 3: 4: Characteristic(3) Min(1) Max Units Conditions TLO:SCL Clock Low Time 100 kHz mode TCY/2 (BRG + 1) -- s -- -- s -- 400 kHz mode TCY/2 (BRG + 1) -- s -- 1 MHz mode(2) TCY/2 (BRG + 1) -- s -- THI:SCL Clock High Time 100 kHz mode TCY/2 (BRG + 1) -- s -- 400 kHz mode TCY/2 (BRG + 1) -- s -- 1 MHz mode(2) TCY/2 (BRG + 1) SDAx and SCLx 100 kHz mode -- 300 ns CB is specified to be TF:SCL Fall Time from 10 to 400 pF 300 ns 400 kHz mode 20 + 0.1 CB (2) -- 100 ns 1 MHz mode -- 1000 ns CB is specified to be TR:SCL SDAx and SCLx 100 kHz mode Rise Time from 10 to 400 pF 400 kHz mode 20 + 0.1 CB 300 ns -- 300 ns 1 MHz mode(2) 100 kHz mode 250 -- ns -- TSU:DAT Data Input Setup Time 400 kHz mode 100 -- ns 40 -- ns 1 MHz mode(2) 100 kHz mode 0 -- s -- THD:DAT Data Input Hold Time 400 kHz mode 0 0.9 s 0.2 -- s 1 MHz mode(2) -- s Only relevant for TSU:STA Start Condition 100 kHz mode TCY/2 (BRG + 1) Setup Time Repeated Start -- s 400 kHz mode TCY/2 (BRG + 1) condition (2) 1 MHz mode TCY/2 (BRG + 1) -- s -- s After this period the THD:STA Start Condition 100 kHz mode TCY/2 (BRG + 1) Hold Time first clock pulse is -- s 400 kHz mode TCY/2 (BRG + 1) generated 1 MHz mode(2) TCY/2 (BRG + 1) -- s -- s -- TSU:STO Stop Condition 100 kHz mode TCY/2 (BRG + 1) Setup Time -- s 400 kHz mode TCY/2 (BRG + 1) -- s 1 MHz mode(2) TCY/2 (BRG + 1) -- ns -- THD:STO Stop Condition 100 kHz mode TCY/2 (BRG + 1) -- ns Hold Time 400 kHz mode TCY/2 (BRG + 1) -- ns 1 MHz mode(2) TCY/2 (BRG + 1) 100 kHz mode -- 3500 ns -- TAA:SCL Output Valid From Clock 400 kHz mode -- 1000 ns -- (2) -- 400 ns -- 1 MHz mode 4.7 -- s Time the bus must be TBF:SDA Bus Free Time 100 kHz mode free before a new 400 kHz mode 1.3 -- s transmission can start 0.5 -- s 1 MHz mode(2) Bus Capacitive Loading -- 400 pF -- CB Pulse Gobbler Delay 65 390 ns See Note 4 TPGD BRG is the value of the I2C Baud Rate Generator. Refer to Section 19. "Inter-Integrated Circuit (I2CTM)" (DS70195) in the "dsPIC33F/PIC24H Family Reference Manual". Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only). These parameters are characterized by similarity, but are not tested in manufacturing. Typical value for this parameter is 130ns. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 243 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 22-19: I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE) SCLx IS34 IS31 IS30 IS33 SDAx Stop Condition Start Condition FIGURE 22-20: I2Cx BUS DATA TIMING CHARACTERISTICS (SLAVE MODE) IS20 IS21 IS11 IS10 SCLx IS30 IS26 IS31 IS25 IS33 SDAx In IS40 IS40 IS45 SDAx Out DS70290J-page 244 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-37: I2Cx BUS DATA TIMING REQUIREMENTS (SLAVE MODE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param Symbol IS10 IS11 Characteristic(2) TLO:SCL Clock Low Time THI:SCL Clock High Time IS20 TF:SCL SDAx and SCLx Fall Time IS21 TR:SCL SDAx and SCLx Rise Time IS25 IS26 IS30 IS31 IS33 IS34 IS40 IS45 IS50 Note Min Max Units 100 kHz mode 4.7 -- s 400 kHz mode 1.3 -- s 1 MHz mode(1) 100 kHz mode 0.5 4.0 -- -- s s 400 kHz mode 0.6 -- s 1 MHz mode(1) 100 kHz mode 400 kHz mode 1 MHz mode(1) 100 kHz mode 400 kHz mode 0.5 -- 20 + 0.1 CB -- -- 20 + 0.1 CB -- 300 300 100 1000 s ns ns ns ns Conditions Device must operate at a minimum of 1.5 MHz Device must operate at a minimum of 10 MHz -- Device must operate at a minimum of 1.5 MHz Device must operate at a minimum of 10 MHz -- CB is specified to be from 10 to 400 pF CB is specified to be from 10 to 400 pF 300 ns 1 MHz mode(1) -- 300 ns TSU:DAT Data Input 100 kHz mode 250 -- ns -- Setup Time 400 kHz mode 100 -- ns 1 MHz mode(1) 100 -- ns THD:DAT Data Input 100 kHz mode 0 -- s -- Hold Time 400 kHz mode 0 0.9 s 1 MHz mode(1) 0 0.3 s TSU:STA Start Condition 100 kHz mode 4.7 -- s Only relevant for Repeated Setup Time Start condition 400 kHz mode 0.6 -- s 1 MHz mode(1) 0.25 -- s THD:STA Start Condition 100 kHz mode 4.0 -- s After this period, the first Hold Time clock pulse is generated 400 kHz mode 0.6 -- s (1) 0.25 -- s 1 MHz mode TSU:STO Stop Condition 100 kHz mode 4.7 -- s -- Setup Time 400 kHz mode 0.6 -- s 1 MHz mode(1) 0.6 -- s THD:ST Stop Condition 100 kHz mode 4000 -- ns -- O Hold Time 400 kHz mode 600 -- ns 1 MHz mode(1) 250 -- ns TAA:SCL Output Valid 100 kHz mode 0 3500 ns -- From Clock 400 kHz mode 0 1000 ns 1 MHz mode(1) 0 350 ns TBF:SDA Bus Free Time 100 kHz mode 4.7 -- s Time the bus must be free before a new transmission 400 kHz mode 1.3 -- s can start 1 MHz mode(1) 0.5 -- s CB Bus Capacitive Loading -- 400 pF -- 1: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only). 2: These parameters are characterized by similarity, but not tested in manufacturing. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 245 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-38: ADC MODULE SPECIFICATIONS AC CHARACTERISTICS Param Symbol No. Characteristic Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Min. Typ Max. Units Lesser of VDD + 0.3 or 3.6 V VSS + 0.3 V Conditions Device Supply AD01 AVDD Module VDD Supply(2) AD02 AVSS Module VSS Supply(2) AD05 VREFH Reference Voltage High Greater of VDD - 0.3 or 3.0 -- VSS - 0.3 -- -- -- Reference Inputs AD05a AD06 VREFL Reference Voltage Low AD06a AVSS + 2.5 -- AVDD V See Note 1 3.0 -- 3.6 V VREFH = AVDD VREFL = AVSS = 0, see Note 2 AVSS -- AVDD - 2.5 V See Note 1 0 -- 0 V VREFH = AVDD VREFL = AVSS = 0, see Note 2 AD07 VREF Absolute Reference Voltage(2) 2.5 -- 3.6 V VREF = VREFH - VREFL AD08 IREF Current Drain -- -- 250 -- 550 10 A A ADC operating, See Note 1 ADC off, See Note 1 Operating Current -- -- 7.0 2.7 9.0 3.2 mA mA 10-bit ADC mode, See Note 2 12-bit ADC mode, See Note 2 AD08a IAD Analog Input AD12 VINH Input Voltage Range VINH(2) VINL -- VREFH V This voltage reflects Sample and Hold Channels 0, 1, 2, and 3 (CH0-CH3), positive input AD13 VINL Input Voltage Range VINL(2) VREFL -- AVSS + 1V V This voltage reflects Sample and Hold Channels 0, 1, 2, and 3 (CH0-CH3), negative input AD17 RIN Recommended Impedance of Analog Voltage Source(3) -- -- -- -- 200 200 10-bit ADC 12-bit ADC Note 1: 2: 3: These parameters are not characterized or tested in manufacturing. These parameters are characterized, but are not tested in manufacturing. These parameters are assured by design, but are not characterized or tested in manufacturing. DS70290J-page 246 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-39: ADC MODULE SPECIFICATIONS (12-BIT MODE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min. Typ Max. Units Conditions ADC Accuracy (12-bit Mode) - Measurements with external VREF+/VREF-(3) AD20a Nr Resolution(4) AD21a INL Integral Nonlinearity -2 -- +2 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD22a DNL Differential Nonlinearity >-1 -- <1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD23a GERR Gain Error -- 3.4 10 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD24a EOFF Offset Error -- 0.9 5 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD25a -- Monotonicity -- -- -- -- 12 data bits bits -- Guaranteed(1) ADC Accuracy (12-bit Mode) - Measurements with internal VREF+/VREF-(3) Resolution(4) AD20a Nr 12 data bits bits -- AD21a INL Integral Nonlinearity -2 -- AD22a DNL Differential Nonlinearity >-1 -- +2 LSb VINL = AVSS = 0V, AVDD = 3.6V <1 LSb VINL = AVSS = 0V, AVDD = 3.6V AD23a GERR Gain Error -- AD24a EOFF Offset Error -- 10.5 20 LSb VINL = AVSS = 0V, AVDD = 3.6V 3.8 10 LSb VINL = AVSS = 0V, AVDD = 3.6V AD25a -- Monotonicity -- -- -- -- Dynamic Performance (12-bit AD30a THD Total Harmonic Distortion AD31a SINAD Signal to Noise and Distortion AD32a SFDR Spurious Free Dynamic Range AD33a FNYQ Input Signal Bandwidth AD34a ENOB Effective Number of Bits Note 1: 2: 3: 4: Guaranteed(1) Mode)(2) -- -- -75 dB -- 68.5 69.5 -- dB -- 80 -- -- dB -- -- -- 250 kHz -- 11.09 11.3 -- bits -- The A/D conversion result never decreases with an increase in the input voltage, and has no missing codes. These parameters are characterized by similarity, but are not tested in manufacturing. These parameters are characterized, but are tested at 20 ksps only. Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 247 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 22-40: ADC MODULE SPECIFICATIONS (10-BIT MODE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min. Typ Max. Units Conditions ADC Accuracy (10-bit Mode) - Measurements with external VREF+/VREF-(3) AD20b Nr Resolution(4) AD21b INL Integral Nonlinearity -1.5 -- +1.5 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD22b DNL Differential Nonlinearity >-1 -- <1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD23b GERR Gain Error -- 3 6 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD24b EOFF Offset Error -- 2 5 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V AD25b -- Monotonicity -- -- -- -- 10 data bits bits -- Guaranteed(1) ADC Accuracy (10-bit Mode) - Measurements with internal VREF+/VREF-(3) AD20b Nr Resolution(4) AD21b INL Integral Nonlinearity -1 -- AD22b DNL Differential Nonlinearity >-1 -- AD23b GERR Gain Error -- 7 15 LSb VINL = AVSS = 0V, AVDD = 3.6V AD24b EOFF Offset Error -- 3 7 LSb VINL = AVSS = 0V, AVDD = 3.6V AD25b -- Monotonicity -- -- -- -- 10 data bits Dynamic Performance (10-bit bits -- +1 LSb VINL = AVSS = 0V, AVDD = 3.6V <1 LSb VINL = AVSS = 0V, AVDD = 3.6V Guaranteed(1) Mode)(2) AD30b THD Total Harmonic Distortion -- -- -64 dB -- AD31b SINAD Signal to Noise and Distortion 57 58.5 -- dB -- AD32b SFDR Spurious Free Dynamic Range 72 -- -- dB -- AD33b FNYQ Input Signal Bandwidth -- -- 550 kHz -- AD34b ENOB Effective Number of Bits 9.16 9.4 -- bits -- Note 1: 2: 3: 4: The A/D conversion result never decreases with an increase in the input voltage, and has no missing codes. These parameters are characterized by similarity, but are not tested in manufacturing. These parameters are characterized, but are tested at 20 ksps only. Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts. DS70290J-page 248 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 22-21: ADC CONVERSION (12-BIT MODE) TIMING CHARACTERISTICS (ASAM = 0, SSRC<2:0> = 000) AD50 ADCLK Instruction Execution Set SAMP Clear SAMP SAMP AD61 AD60 TSAMP AD55 DONE AD1IF 1 2 3 4 5 6 7 8 9 1 - Software sets AD1CON. SAMP to start sampling. 5 - Convert bit 11. 2 - Sampling starts after discharge period. TSAMP is described in Section 16. "Analog-to-Digital Converter (ADC)" (DS70183) in the "dsPIC33F/PIC24H Family Reference Manual". 3 - Software clears AD1CON. SAMP to start conversion. 6 - Convert bit 10. 4 - Sampling ends, conversion sequence starts. 9 - One TAD for end of conversion. 7 - Convert bit 1. 8 - Convert bit 0. TABLE 22-41: ADC CONVERSION (12-BIT MODE) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min. Typ Max. Units Conditions Clock Parameters AD50 TAD ADC Clock Period(2) AD51 tRC ADC Internal RC Oscillator Period(2) AD55 tCONV Conversion Time(2) AD56 FCNV Throughput Rate(2) AD57 TSAMP Sample Time(2) AD60 tPCS Conversion Start from Sample Trigger(2) 2.0 TAD AD61 tPSS Sample Start from Setting Sample (SAMP) bit(2) AD62 tCSS Conversion Completion to Sample Start (ASAM = 1)(2) AD63 tDPU 117.6 -- -- ns -- -- 250 -- ns -- 14 TAD -- ns -- -- -- 500 Ksps -- 3.0 TAD -- -- -- -- -- 3.0 TAD -- 2.0 TAD -- 3.0 TAD -- -- -- 0.5 TAD -- -- -- -- -- 20 s -- Conversion Rate -- Timing Parameters Note 1: 2: Time to Stabilize Analog Stage from ADC Off to ADC On(2) Auto Convert Trigger not selected Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity performance, especially at elevated temperatures. These parameters are characterized but not tested in manufacturing. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 249 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 FIGURE 22-22: ADC CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS (CHPS<1:0> = 01, SIMSAM = 0, ASAM = 0, SSRC<2:0> = 000) AD50 ADCLK Instruction Execution Set SAMP Clear SAMP SAMP AD61 AD60 AD55 TSAMP AD55 DONE AD1IF Buffer(0) Buffer(1) 1 2 3 4 5 6 7 8 5 6 7 1 - Software sets AD1CON. SAMP to start sampling. 5 - Convert bit 9. 2 - Sampling starts after discharge period. TSAMP is described in Section 16. "Analog-to-Digital Converter (ADC)" (DS70183) in the "dsPIC33F/PIC24H Family Reference Manual". 3 - Software clears AD1CON. SAMP to start conversion. 6 - Convert bit 8. 8 7 - Convert bit 0. 8 - One TAD for end of conversion. 4 - Sampling ends, conversion sequence starts. FIGURE 22-23: ADC CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS (CHPS<1:0> = 01, SIMSAM = 0, ASAM = 1, SSRC<2:0> = 111, SAMC<4:0> = 00001) AD50 ADCLK Instruction Set ADON Execution SAMP TSAMP AD55 TSAMP AD55 AD55 AD1IF DONE 1 2 3 4 5 1 - Software sets AD1CON. ADON to start AD operation. 6 7 3 4 5 6 8 5 - Convert bit 0. 2 - Sampling starts after discharge period. TSAMP is described in 6 - One TAD for end of conversion. Section 16. "Analog-to-Digital Converter (ADC)" (DS70183) in the 7 - Begin conversion of next channel. "dsPIC33F/PIC24H Family Reference Manual". 3 - Convert bit 9. 8 - Sample for time specified by SAMC<4:0>. 4 - Convert bit 8. DS70290J-page 250 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 ADC CONVERSION (10-BIT MODE) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param Symbol No. Characteristic Min. Typ(1) Max. Units Conditions Clock Parameters Period(1) AD50 TAD ADC Clock AD51 tRC ADC Internal RC Oscillator Period(1) 76 -- -- ns -- -- 250 -- ns -- Conversion Rate Time(1) -- 12 TAD -- -- -- -- -- 1.1 Msps -- 2.0 TAD -- -- -- -- AD55 tCONV Conversion AD56 FCNV Throughput Rate(1) AD57 TSAMP Sample Time(1) Timing Parameters AD60 tPCS Conversion Start from Sample Trigger(1) 2.0 TAD -- 3.0 TAD -- AD61 tPSS Sample Start from Setting Sample (SAMP) bit(1) 2.0 TAD -- 3.0 TAD -- -- AD62 tCSS Conversion Completion to Sample Start (ASAM = 1)(1) -- 0.5 TAD -- -- -- AD63 tDPU Time to Stabilize Analog Stage from ADC Off to ADC On(1) -- -- 20 s -- Note 1: 2: Auto-Convert Trigger not selected These parameters are characterized but not tested in manufacturing. Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity performance, especially at elevated temperatures. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 251 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 NOTES: DS70290J-page 252 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 23.0 HIGH TEMPERATURE ELECTRICAL CHARACTERISTICS This section provides an overview of dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 electrical characteristics for devices operating in an ambient temperature range of -40C to +150C. The specifications between -40C to +150C are identical to those shown in Section 22.0 "Electrical Characteristics" for operation between -40C to +125C, with the exception of the parameters listed in this section. Parameters in this section begin with an H, which denotes High temperature. For example, parameter DC10 in Section 22.0 "Electrical Characteristics" is the Industrial and Extended temperature equivalent of HDC10. Absolute maximum ratings for the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 high temperature devices are listed below. Exposure to these maximum rating conditions for extended periods can affect device reliability. Functional operation of the device at these or any other conditions above the parameters indicated in the operation listings of this specification is not implied. Absolute Maximum Ratings(1) Ambient temperature under bias(4) .........................................................................................................-40C to +150C Storage temperature .............................................................................................................................. -65C to +160C Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V Voltage on any pin that is not 5V tolerant with respect to VSS(5) .................................................... -0.3V to (VDD + 0.3V) Voltage on any 5V tolerant pin with respect to VSS when VDD < 3.0V(5) .................................................... -0.3V to 3.6V Voltage on any 5V tolerant pin with respect to VSS when VDD 3.0V(5) .................................................... -0.3V to 5.6V Maximum current out of VSS pin .............................................................................................................................60 mA Maximum current into VDD pin(2) .............................................................................................................................60 mA Maximum junction temperature............................................................................................................................. +155C Maximum current sourced/sunk by any 2x I/O pin(3) ................................................................................................2 mA Maximum current sourced/sunk by any 4x I/O pin(3) ................................................................................................4 mA Maximum current sourced/sunk by any 8x I/O pin(3) ................................................................................................8 mA Maximum current sunk by all ports combined ........................................................................................................70 mA Maximum current sourced by all ports combined(2) ................................................................................................70 mA Note 1: Stresses above those listed under "Absolute Maximum Ratings" can cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods can affect device reliability. 2: Maximum allowable current is a function of device maximum power dissipation (see Table 23-2). 3: Unlike devices at 125C and below, the specifications in this section also apply to the CLKOUT, VREF+, VREF-, SCLx, SDAx, PGCx, and PGDx pins. 4: AEC-Q100 reliability testing for devices intended to operate at 150C is 1,000 hours. Any design in which the total operating time from 125C to 150C will be greater than 1,000 hours is not warranted without prior written approval from Microchip Technology Inc. 5: Refer to the "Pin Diagrams" section for 5V tolerant pins. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 253 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 23.1 High Temperature DC Characteristics TABLE 23-1: OPERATING MIPS VS. VOLTAGE Characteristic VDD Range (in Volts) Temperature Range (in C) HDC5 VBOR to 3.6V(1) -40C to +150C Note 1: Max MIPS dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 20 Device is functional at VBORMIN < VDD < VDDMIN. Analog modules such as the ADC will have degraded performance. Device functionality is tested but not characterized. Refer to parameter BO10 in Table 22-11 for the minimum and maximum BOR values. TABLE 23-2: THERMAL OPERATING CONDITIONS Rating Symbol Min Typ Max Unit Operating Junction Temperature Range TJ -40 -- +155 C Operating Ambient Temperature Range TA -40 -- +150 C High Temperature Devices Power Dissipation: Internal chip power dissipation: PINT = VDD x (IDD - IOH) PD PINT + PI/O W PDMAX (TJ - TA)/JA W I/O Pin Power Dissipation: I/O = ({VDD - VOH} x IOH) + (VOL x IOL) Maximum Allowed Power Dissipation TABLE 23-3: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +150C for High Temperature DC CHARACTERISTICS Parameter No. Symbol Characteristic Min Typ Max Units 3.0 3.3 3.6 V Conditions Operating Voltage HDC10 Supply Voltage VDD DS70290J-page 254 -- -40C to +150C (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 23-4: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +150C for High Temperature DC CHARACTERISTICS Parameter No. Typical Max Units Conditions Power-Down Current (IPD)(3) HDC60e 250 2000 A +150C 3.3V Base Power-Down Current(1,3) HDC61c 3 5 A +150C 3.3V Watchdog Timer Current: IWDT(2,4) Note 1: 2: 3: 4: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and pulled to VSS. WDT, etc., are all switched off, and VREGS (RCON<8>) = 1. The current is the additional current consumed when the module is enabled. This current should be added to the base IPD current. These currents are measured on the device containing the most memory in this family. These parameters are characterized, but are not tested in manufacturing. TABLE 23-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +150C for High Temperature DC CHARACTERISTICS Parameter No. Typical(1) Max Units HDC20 19 35 mA +150C 3.3V 10 MIPS HDC21 27 45 mA +150C 3.3V 16 MIPS 33 55 mA +150C 3.3V 20 MIPS HDC22 Note 1: Conditions These parameters are characterized, but are not tested in manufacturing. TABLE 23-6: DC CHARACTERISTICS: DOZE CURRENT (IDOZE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +150C for High Temperature DC CHARACTERISTICS Parameter No. Typical(1) Max Doze Ratio Units HDC72a 39 45 1:2 mA HDC72f 18 25 1:64 mA HDC72g 18 25 1:128 mA Note 1: Conditions +150C 3.3V 20 MIPS Parameters with Doze ratios of 1:2 and 1:64 are characterized, but are not tested in manufacturing. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 255 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 23-7: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for High Temperature DC CHARACTERISTICS Param. Symbol DO10 DO20 VOL VOH Characteristic Min. Typ. Max. Units Conditions Output Low Voltage I/O Pins: 2x Sink Driver Pins - All pins not defined by 4x or 8x driver pins -- -- 0.4 V IOL 1.8 mA, VDD = 3.3V See Note 1 Output Low Voltage I/O Pins: 4x Sink Driver Pins - RA0, RA1, RB5, RB6, RB8, RB9, RB14 -- -- 0.4 V IOL 3.6 mA, VDD = 3.3V See Note 1 Output Low Voltage I/O Pins: 8x Sink Driver Pins - OSCO, CLKO, RA3 -- -- 0.4 V IOL 6 mA, VDD = 3.3V See Note 1 Output High Voltage I/O Pins: 2x Source Driver Pins - All pins not defined by 4x or 8x driver pins 2.4 -- -- V IOL -1.8 mA, VDD = 3.3V See Note 1 Output High Voltage I/O Pins: 4x Source Driver Pins - RA0, RA1, RB5, RB6, RB8, RB9, RB14 2.4 -- -- V IOL -3 mA, VDD = 3.3V See Note 1 2.4 -- -- V IOL -6 mA, VDD = 3.3V See Note 1 1.5 -- -- 2.0 -- -- 3.0 -- -- IOH -1.4 mA, VDD = 3.3V See Note 1 1.5 -- -- IOH -3.9 mA, VDD = 3.3V See Note 1 2.0 -- -- 3.0 -- -- IOH -2 mA, VDD = 3.3V See Note 1 1.5 -- -- IOH -7.5 mA, VDD = 3.3V See Note 1 2.0 -- -- 3.0 -- -- Output High Voltage I/O Pins: 8x Source Driver Pins - OSCO, CLKO, RA3 Output High Voltage I/O Pins: 2x Source Driver Pins - All pins not defined by 4x or 8x driver pins DO20A VOH1 Output High Voltage 4x Source Driver Pins - RA0, RA1, RB5, RB6, RB8, RB9, RB14 Output High Voltage 8x Source Driver Pins -OSCO, CLKO, RA3 Note 1: IOH -1.9 mA, VDD = 3.3V See Note 1 V V V IOH -1.85 mA, VDD = 3.3V See Note 1 IOH -3.7 mA, VDD = 3.3V See Note 1 IOH -6.8 mA, VDD = 3.3V See Note 1 IOH -3 mA, VDD = 3.3V See Note 1 Parameters are characterized, but not tested. DS70290J-page 256 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 23.2 AC Characteristics and Timing Parameters Parameters in this section begin with an H, which denotes High temperature. For example, parameter OS53 in Section 22.2 "AC Characteristics and Timing Parameters" is the Industrial and Extended temperature equivalent of HOS53. The information contained in this section defines dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 AC characteristics and timing parameters for high temperature devices. However, all AC timing specifications in this section are the same as those in Section 22.2 "AC Characteristics and Timing Parameters", with the exception of the parameters listed in this section. TABLE 23-8: TEMPERATURE AND VOLTAGE SPECIFICATIONS - AC Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +150C for High Temperature Operating voltage VDD range as described in Table 23-1. AC CHARACTERISTICS FIGURE 23-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS Load Condition 1 - for all pins except OSC2 Load Condition 2 - for OSC2 VDD/2 CL Pin RL VSS CL Pin RL = 464 CL = 50 pF for all pins except OSC2 15 pF for OSC2 output VSS TABLE 23-9: PLL CLOCK TIMING SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40C TA +150C for High Temperature Param No. Symbol Characteristic CLKO Stability (Jitter)(1) Min Typ Max Units -5 0.5 5 % Conditions Measured over 100 ms period HOS53 DCLK Note 1: These parameters are characterized by similarity, but are not tested in manufacturing. This specification is based on clock cycle by clock cycle measurements. To calculate the effective jitter for individual time bases or communication clocks use this formula: D CLK Peripheral Clock Jitter = ----------------------------------------------------------------------F OSC ------------------------------------------------------------ Peripheral Bit Rate Clock For example: Fosc = 32 MHz, DCLK = 5%, SPI bit rate clock, (i.e., SCK) is 2 MHz. D CLK 5% 5% SPI SCK Jitter = ------------------------------ = ---------- = -------- = 1.25% 4 16 MHz- 32 ------------------ 2 MHz (c) 2007-2011 Microchip Technology Inc. DS70290J-page 257 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 23-10: SPIx MASTER MODE (CKE = 0) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40C TA +150C for High Temperature Param No. Symbol Characteristic(1) Min Typ Max Units Conditions HSP35 TscH2doV, SDOx Data Output Valid after TscL2doV SCKx Edge -- 10 25 ns -- HSP40 TdiV2scH, Setup Time of SDIx Data Input TdiV2scL to SCKx Edge 28 -- -- ns -- HSP41 TscH2diL, TscL2diL 35 -- -- ns -- Note 1: These parameters are characterized but not tested in manufacturing. Hold Time of SDIx Data Input to SCKx Edge TABLE 23-11: SPIx MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40C TA +150C for High Temperature Param No. Symbol Characteristic(1) Min Typ Max Units Conditions HSP35 TscH2doV, SDOx Data Output Valid after TscL2doV SCKx Edge -- 10 25 ns -- HSP36 TdoV2sc, TdoV2scL 35 -- -- ns -- HSP40 TdiV2scH, Setup Time of SDIx Data Input TdiV2scL to SCKx Edge 28 -- -- ns -- HSP41 TscH2diL, TscL2diL 35 -- -- ns -- Note 1: SDOx Data Output Setup to First SCKx Edge Hold Time of SDIx Data Input to SCKx Edge These parameters are characterized but not tested in manufacturing. DS70290J-page 258 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 23-12: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40C TA +150C for High Temperature Param No. Characteristic(1) Symbol Min Typ Max Units Conditions HSP35 TscH2doV, TscL2doV SDOx Data Output Valid after SCKx Edge -- -- 35 ns -- HSP40 TdiV2scH, TdiV2scL Setup Time of SDIx Data Input to SCKx Edge 25 -- -- ns -- HSP41 TscH2diL, TscL2diL Hold Time of SDIx Data Input to SCKx Edge 25 -- -- ns -- HSP51 TssH2doZ SSx to SDOx Output High-Impedance 15 -- 55 ns Note 1: 2: See Note 2 These parameters are characterized but not tested in manufacturing. Assumes 50 pF load on all SPIx pins. TABLE 23-13: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS AC CHARACTERISTICS Param No. Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +150C for High Temperature Characteristic(1) Symbol Min Typ Max Units Conditions HSP35 TscH2doV, SDOx Data Output Valid after TscL2doV SCKx Edge -- -- 35 ns -- HSP40 TdiV2scH, Setup Time of SDIx Data Input TdiV2scL to SCKx Edge 25 -- -- ns -- HSP41 TscH2diL, TscL2diL Hold Time of SDIx Data Input to SCKx Edge 25 -- -- ns -- HSP51 TssH2doZ SSx to SDOX Output High-Impedance 15 -- 55 ns HSP60 TssL2doV SDOx Data Output Valid after SSx Edge -- -- 55 ns Note 1: 2: These parameters are characterized but not tested in manufacturing. Assumes 50 pF load on all SPIx pins. See Note 2 -- TABLE 23-14: INTERNAL RC ACCURACY AC CHARACTERISTICS Param No. Characteristic Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +150C for Extended Min Typ Max Units -70 -- +70 % Conditions LPRC @ 32.768 kHz(1,2) HF21 Note 1: 2: LPRC -40C TA +150C VDD = 3.0-3.6V Change of LPRC frequency as VDD changes. LPRC accuracy impacts the Watchdog Timer Time-out Period (TWDT1). See Section 19.4 "Watchdog Timer (WDT)" for more information. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 259 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 23-15: ADC MODULE SPECIFICATIONS AC CHARACTERISTICS Param No. Symbol Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +150C for High Temperature Characteristic Min Typ Max Units 600 50 A A Conditions Reference Inputs HAD08 Note 1: 2: Current Drain IREF -- -- 250 -- ADC operating, See Note 1 ADC off, See Note 1 These parameters are not characterized or tested in manufacturing. These parameters are characterized, but are not tested in manufacturing. TABLE 23-16: ADC MODULE SPECIFICATIONS (12-BIT MODE)(3) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40C TA +150C for High Temperature Param No. Symbol Characteristic Min Typ Max Units Conditions ADC Accuracy (12-bit Mode) - Measurements with External VREF+/VREF-(1) HAD20a Nr Resolution(3) HAD21a INL Integral Nonlinearity HAD22a DNL Differential Nonlinearity HAD23a GERR HAD24a EOFF 12 data bits bits -- -2 -- +2 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V > -1 -- <1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V Gain Error -2 -- 10 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V Offset Error -3 -- 5 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V ADC Accuracy (12-bit Mode) - Measurements with Internal VREF+/VREF-(1) HAD20a Nr Resolution(3) HAD21a INL Integral Nonlinearity 12 data bits HAD22a DNL Differential Nonlinearity HAD23a GERR Gain Error HAD24a EOFF Offset Error -2 bits -- LSb VINL = AVSS = 0V, AVDD = 3.6V -- +2 > -1 -- <1 LSb VINL = AVSS = 0V, AVDD = 3.6V 2 -- 20 LSb VINL = AVSS = 0V, AVDD = 3.6V 2 -- 10 LSb VINL = AVSS = 0V, AVDD = 3.6V Dynamic Performance (12-bit Mode)(2) HAD33a FNYQ Note 1: 2: 3: These parameters are characterized, but are tested at 20 ksps only. These parameters are characterized by similarity, but are not tested in manufacturing. Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts. DS70290J-page 260 Input Signal Bandwidth -- -- 200 kHz -- (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 23-17: ADC MODULE SPECIFICATIONS (10-BIT MODE)(3) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40C TA +150C for High Temperature Param No. Symbol Characteristic Min Typ Max Units Conditions ADC Accuracy (10-bit Mode) - Measurements with External VREF+/VREF-(1) HAD20b Nr Resolution(3) HAD21b INL Integral Nonlinearity HAD22b DNL Differential Nonlinearity HAD23b GERR HAD24b EOFF 10 data bits bits -- -3 -- 3 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V > -1 -- <1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V Gain Error -5 -- 6 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V Offset Error -1 -- 5 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V ADC Accuracy (10-bit Mode) - Measurements with Internal VREF+/VREF-(1) HAD20b Nr Resolution(3) HAD21b INL Integral Nonlinearity HAD22b DNL Differential Nonlinearity HAD23b GERR HAD24b EOFF 10 data bits Note 1: 2: 3: -- -2 -- 2 LSb VINL = AVSS = 0V, AVDD = 3.6V > -1 -- <1 LSb VINL = AVSS = 0V, AVDD = 3.6V Gain Error -5 -- 15 LSb VINL = AVSS = 0V, AVDD = 3.6V Offset Error -1.5 -- 7 LSb VINL = AVSS = 0V, AVDD = 3.6V Dynamic Performance (10-bit HAD33b FNYQ bits Input Signal Bandwidth -- -- Mode)(2) 400 kHz -- These parameters are characterized, but are tested at 20 ksps only. These parameters are characterized by similarity, but are not tested in manufacturing. Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 261 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE 23-18: ADC CONVERSION (12-BIT MODE) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40C TA +150C for High Temperature Param No. Symbol Characteristic Min Typ Max Units Conditions -- -- ns -- -- 400 Ksps -- Clock Parameters HAD50 TAD (1) ADC Clock Period 147 Conversion Rate HAD56 Note 1: FCNV Throughput Rate(1) -- These parameters are characterized but not tested in manufacturing. TABLE 23-19: ADC CONVERSION (10-BIT MODE) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40C TA +150C for High Temperature Param No. Symbol Characteristic Min Typ Max Units Conditions -- ns -- 800 Ksps -- Clock Parameters HAD50 TAD ADC Clock Period(1) HAD56 FCNV Throughput Rate(1) Note 1: These parameters are characterized but not tested in manufacturing. 104 -- Conversion Rate DS70290J-page 262 -- -- (c) 2007-2011 Microchip Technology Inc. DC AND AC DEVICE CHARACTERISTICS GRAPHS Note: The graphs provided following this note are a statistical summary based on a limited number of samples and are provided for design guidance purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore, outside the warranted range. FIGURE 24-1: VOH - 2x DRIVER PINS -0.040 -0.016 -0.035 3.6V IOH (A) -0.012 -0.010 3V -0.008 -0.006 3.3V -0.025 3V -0.020 -0.015 -0.004 -0.010 -0.002 -0.005 0.000 0.00 3.6V -0.030 3.3V IOH (A) -0.014 VOH - 8x DRIVER PINS FIGURE 24-3: 0.50 1.00 1.50 2.00 2.50 3.00 3.50 0.000 0.00 4.00 1.00 2.00 VOH (V) FIGURE 24-2: VOH - 4x DRIVER PINS FIGURE 24-4: 3.6V -0.070 IOH (A) IOH (A) 3V -0.015 -0.010 DS70290J-page 263 3.00 4.00 VOH - 16x DRIVER PINS 3.6V -0.060 3.3V -0.020 3.3V -0.050 3V -0.040 -0.030 -0.020 -0.005 0.000 0.00 4.00 -0.080 -0.030 -0.025 3.00 VOH (V) -0.010 0.50 1.00 1.50 2.00 VOH (V) 2.50 3.00 3.50 4.00 0.000 0.00 1.00 2.00 VOH (V) dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 (c) 2007-2011 Microchip Technology Inc. 24.0 FIGURE 24-7: VOL - 2x DRIVER PINS 0.060 0.020 0.018 3.6V 0.016 3.6V 0.050 3.3V 3.3V 0.014 0.040 3V 0.012 IOL (A) IOL (A) VOL - 8x DRIVER PINS 0.010 0.008 3V 0.030 0.020 0.006 0.004 0.010 0.002 0.000 0.00 1.00 2.00 3.00 0.000 0.00 4.00 1.00 FIGURE 24-6: VOL - 4x DRIVER PINS FIGURE 24-8: 3.00 4.00 VOL - 16x DRIVER PINS 0.120 0.040 0.035 3.6V 0.030 3.6V 0.100 3.3V 0.025 3.3V 0.080 3V IOL (A) (c) 2007-2011 Microchip Technology Inc. IOL (A) 2.00 VOL (V) VOL (V) 0.020 0.015 3V 0.060 0.040 0.010 0.020 0.005 0.000 0.00 1.00 2.00 VOL (V) 3.00 4.00 0.000 0.00 1.00 2.00 VOL (V) 3.00 4.00 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 DS70290J-page 264 FIGURE 24-5: TYPICAL IPD CURRENT @ VDD = 3.3V, +85C FIGURE 24-11: 700 60.00 600 50.00 500 Current (mA) IPD Current [A] TYPICAL IDOZE CURRENT @ VDD = 3.3V, +85C 400 300 40.00 30.00 20.00 200 10.00 100 0 0.00 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 Temperature Celsius TYPICAL IDD CURRENT @ VDD = 3.3V, +85C FIGURE 24-10: 1:2 1:64 1:128 Doze Ratio FIGURE 24-12: TYPICAL IIDLE CURRENT @ VDD = 3.3V, +85C 25 60 50 20 40 IIDLLE Current (mA) Average (mA) 1:1 PMD = 0, with PLL 30 20 15 10 DS70290J-page 265 5 10 PMD = 0, no PLL 0 0 10 20 30 FCY (MIPS) 40 50 60 0 0 10 20 MIPS 30 40 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 (c) 2007-2011 Microchip Technology Inc. FIGURE 24-9: TYPICAL FRC FREQUENCY @ VDD = 3.3V FIGURE 24-14: 35 7450 33 7400 LPRC Frequency (kHz) L 31 7350 Frequen ncy (kHz) TYPICAL LPRC FREQUENCY @ VDD = 3.3V 7300 7250 7200 29 27 25 23 21 19 7150 7100 17 15 -40 -30 -20 -10 0 10 20 30 40 50 60 70 Temperature Celsius 80 90 100 110 120 -40 -30 -20 -10 0 10 20 30 40 50 60 70 Temperature Celsius 80 90 100 110 120 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 DS70290J-page 266 FIGURE 24-13: dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 25.0 PACKAGING INFORMATION 25.1 Package Marking Information 28-Lead SPDIP Example dsPIC33FJ32GP 202-E/SP e3 0730235 XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN 28-Lead SOIC Example XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX YYWWNNN 28-Lead SSOP Example XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN Legend: XX...X Y YY WW NNN e3 * Note: dsPIC33FJ32GP 202-E/SO e3 0730235 33FJ32GP 202-E/SS e3 0730235 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. If the full Microchip part number cannot be marked on one line, it is carried over to the next line, thus limiting the number of available characters for customer-specific information. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 267 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 25.1 Package Marking Information (Continued) 28-Lead QFN-S Example XXXXXXXX XXXXXXXX YYWWNNN 44-Lead QFN 33FJ32GP 202E/MM e3 0730235 Example XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX YYWWNNN 44-Lead TQFP Example XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX YYWWNNN Legend: XX...X Y YY WW NNN e3 * Note: dsPIC33FJGP MC204-E/ML e3 0730235 dsPIC33FJ 32GP204 -E/PT e3 0730235 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. If the full Microchip part number cannot be marked on one line, it is carried over to the next line, thus limiting the number of available characters for customer-specific information. DS70290J-page 268 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 25.2 Package Details 28-Lead Skinny Plastic Dual In-Line (SP) - 300 mil Body [SPDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE 1 E1 1 2 3 D E A2 A L c b1 A1 b e eB Units Dimension Limits Number of Pins INCHES MIN N NOM MAX 28 Pitch e Top to Seating Plane A - - .200 Molded Package Thickness A2 .120 .135 .150 Base to Seating Plane A1 .015 - - Shoulder to Shoulder Width E .290 .310 .335 Molded Package Width E1 .240 .285 .295 Overall Length D 1.345 1.365 1.400 Tip to Seating Plane L .110 .130 .150 Lead Thickness c .008 .010 .015 b1 .040 .050 .070 b .014 .018 .022 eB - - Upper Lead Width Lower Lead Width Overall Row Spacing .100 BSC .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-070B (c) 2007-2011 Microchip Technology Inc. DS70290J-page 269 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS70290J-page 270 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging (c) 2007-2011 Microchip Technology Inc. DS70290J-page 271 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS70290J-page 272 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 /HDG3ODVWLF6KULQN6PDOO2XWOLQH 66 PP%RG\>6623@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D N E E1 1 2 NOTE 1 b e c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c) 2007-2011 Microchip Technology Inc. DS70290J-page 273 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS70290J-page 274 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 /HDG3ODVWLF4XDG)ODW1R/HDG3DFNDJH 00 [[PP%RG\>4)16@ ZLWKPP&RQWDFW/HQJWK 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D D2 EXPOSED PAD e E2 E b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c) 2007-2011 Microchip Technology Inc. DS70290J-page 275 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 /HDG3ODVWLF4XDG)ODW1R/HDG3DFNDJH 00 [[PP%RG\>4)16@ ZLWKPP&RQWDFW/HQJWK 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ DS70290J-page 276 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D D2 EXPOSED PAD e E E2 b 2 2 1 N 1 N NOTE 1 TOP VIEW K L BOTTOM VIEW A A3 A1 Units Dimension Limits Number of Pins MILLIMETERS MIN N NOM MAX 44 Pitch e Overall Height A 0.80 0.65 BSC 0.90 1.00 Standoff A1 0.00 0.02 0.05 Contact Thickness A3 0.20 REF Overall Width E Exposed Pad Width E2 Overall Length D Exposed Pad Length D2 6.30 6.45 6.80 b 0.25 0.30 0.38 Contact Length L 0.30 0.40 0.50 Contact-to-Exposed Pad K 0.20 - - Contact Width 8.00 BSC 6.30 6.45 6.80 8.00 BSC Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-103B (c) 2007-2011 Microchip Technology Inc. DS70290J-page 277 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 /HDG3ODVWLF4XDG)ODW1R/HDG3DFNDJH 0/ [PP%RG\>4)1@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ DS70290J-page 278 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 44-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D D1 E e E1 N b NOTE 1 1 2 3 NOTE 2 A c A2 A1 L L1 Units Dimension Limits Number of Leads MILLIMETERS MIN N NOM MAX 44 Lead Pitch e Overall Height A - 0.80 BSC - Molded Package Thickness A2 0.95 1.00 1.05 Standoff A1 0.05 - 0.15 Foot Length L 0.45 0.60 0.75 Footprint L1 1.20 1.00 REF Foot Angle Overall Width E 12.00 BSC Overall Length D 12.00 BSC Molded Package Width E1 10.00 BSC Molded Package Length D1 10.00 BSC 0 3.5 7 Lead Thickness c 0.09 - 0.20 Lead Width b 0.30 0.37 0.45 Mold Draft Angle Top 11 12 13 Mold Draft Angle Bottom 11 12 13 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Chamfers at corners are optional; size may vary. 3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-076B (c) 2007-2011 Microchip Technology Inc. DS70290J-page 279 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS70290J-page 280 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 APPENDIX A: REVISION HISTORY Revision A (July 2007) This is the initial released version of the document. Revision B (June 2008) This revision includes minor typographical and formatting changes throughout the data sheet text. The major changes are referenced by their respective section in the following table. TABLE A-1: MAJOR SECTION UPDATES Section Name "High-Performance, 16-bit Digital Signal Controllers" Update Description Added Extended Interrupts column to Remappable Peripherals in the Controller Families table and Note 2 (see Table 1). Added Note 1 to all pin diagrams, which references RPn pin usage by remappable peripherals (see "Pin Diagrams"). Section 1.0 "Device Overview" Changed PORTA pin name from RA15 to RA10 (see Table 1-1). Section 3.0 "Memory Organization" Added SFR definitions (ACCAL, ACCAH, ACCAU, ACCBL, ACCBH, and ACCBU) to the CPU Core Register Map (see Table 3-1). Updated Reset value for CORCON (see Table 3-1). Updated Reset values for the following SFRs: IPC1, IPC3-IPC5, IPC7, IPC16 and INTTREG (see Table 3-4). Updated the Reset value for CLKDIV in the System Control Register Map (see Table 3-20). Section 6.0 "Resets" Entire section was replaced to maintain consistency with other dsPIC33F data sheets. Section 7.0 "Oscillator Configuration" Removed the first sentence of the third clock source item (External Clock) in Section 7.1.1.2 "Primary". Updated the default bit values for DOZE and FRCDIV in the Clock Divisor Register (see Register 7-2). Added the center frequency in the OSCTUN register for the FRC Tuning bits (TUN<5:0>) value 011111 and updated the center frequency for bits value 011110 (see Register 7-4). Section 8.0 "Power-Saving Features" Added the following two registers: * PMD1: Peripheral Module Disable Control Register 1 * PMD2: Peripheral Module Disable Control Register 2 Section 9.0 "I/O Ports" Added paragraph and Table 9-1 to Section 9.1.1 "Open-Drain Configuration", which provides details on I/O pins and their functionality. Removed the following sections, which are now available in the related section of the dsPIC33F/PIC24H Family Reference Manual: * 9.4.2 "Available Peripherals" * 9.4.3.3 "Mapping" * 9.4.5 "Considerations for Peripheral Pin Selection" Section 13.0 "Output Compare" (c) 2007-2011 Microchip Technology Inc. Replaced sections 13.1, 13.2 and 13.3 and related figures and tables with entirely new content. DS70290J-page 281 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE A-1: MAJOR SECTION UPDATES (CONTINUED) Section Name Update Description Section 14.0 "Serial Peripheral Interface (SPI)" Removed the following sections, which are now available in the related section of the dsPIC33F/PIC24H Family Reference Manual: * 14.1 "Interrupts" * 14.2 "Receive Operations" * 14.3 "Transmit Operations" * 14.4 "SPI Setup" (retained Figure 14-1: SPI Module Block Diagram) Section 15.0 "Inter-Integrated Circuit (I2CTM)" Removed the following sections, which are now available in the related section of the dsPIC33F/PIC24H Family Reference Manual: * 15.3 "I2C Interrupts" * 15.4 "Baud Rate Generator" (retained Figure 15-1: I2C Block Diagram) * 15.5 "I2C Module Addresses" * 15.6 "Slave Address Masking" * 15.7 "IPMI Support" * 15.8 "General Call Address Support" * 15.9 "Automatic Clock Stretch" * 15.10 "Software Controlled Clock Stretching (STREN = 1)" * 15.11 "Slope Control" * 15.12 "Clock Arbitration" * 15.13 "Multi-Master Communication, Bus Collision, and Bus Arbitration" * 15.14 "Peripheral Pin Select Limitations" Section 16.0 "Universal Removed the following sections, which are now available in the related Asynchronous Receiver Transmitter section of the dsPIC33F/PIC24H Family Reference Manual: (UART)" * 16.1 "UART Baud Rate Generator" * 16.2 "Transmitting in 8-bit Data Mode" * 16.3 "Transmitting in 9-bit Data Mode" * 16.4 "Break and Sync Transmit Sequence" * 16.5 "Receiving in 8-bit or 9-bit Data Mode" * 16.6 "Flow Control Using UxCTS and UxRTS Pins" * 16.7 "Infrared Support" Removed IrDA references and Note 1, and updated the bit and bit value descriptions for UTXINV (UxSTA<14>) in the UARTx Status and Control Register (see Register 16-2). Section 17.0 "10-bit/12-bit Analogto-Digital Converter (ADC)" Removed Equation 17-1: ADC Conversion Clock Period and Figure 17-2: ADC Transfer Function (10-Bit Example). Added ADC1 Module Block Diagram for dsPIC33FJ16GP304 and dsPIC33FJ32GP204 Devices (Figure 18-1) and ADC1 Module Block Diagram FOR dsPIC33FJ32GP202 Devices (Figure 17-2). Added Note 2 to Figure 17-3: ADC Conversion Clock Period Block Diagram. Added device-specific information to Note 1 in the ADC1 Input Scan Select Register Low (see Register 17-6), and updated the default bit value for bits 12-10 (CSS12-CSS10) from U-0 to R/W-0. Added device-specific information to Note 1 in the ADC1 Port Configuration Register Low (see Register 17-7), and updated the default bit value for bits 12-10 (PCFG12-PCFG10) from U-0 to R/W-0. DS70290J-page 282 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE A-1: MAJOR SECTION UPDATES (CONTINUED) Section Name Section 18.0 "Special Features" Update Description Added FICD register information for address 0xF8000E in the Device Configuration Register Map (see Table 18-1). Added FICD register content (BKBUG, COE, JTAGEN, and ICS<1:0> to the dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Configuration Bits Description (see Table 18-2). Added a note regarding the placement of low-ESR capacitors, after the second paragraph of Section 18.2 "On-Chip Voltage Regulator" and to Figure 18-1. Removed the words "if enabled" from the second sentence in the fifth paragraph of Section 18.3 "BOR: Brown-out Reset". Section 21.0 "Electrical Characteristics" Updated Max MIPS value for -40C to +125C temperature range in Operating MIPS vs. Voltage (see Table 21-1). Removed Typ value for parameter DC12 (see Table 22-4). Updated MIPS conditions for parameters DC24c, DC44c, DC72a, DC72f and DC72g (see Table 21-5, Table 21-6 and Table 21-8). Added Note 4 (reference to new table containing digital-only and analog pin information to I/O Pin Input Specifications (see Table 21-9). Updated Typ, Min, and Max values for Program Memory parameters D136, D137, and D138 (see Table 21-12). Updated Max value for Internal RC Accuracy parameter F21 for -40C TA +125C condition and added Note 2 (see Table 21-19). Removed all values for Reset, Watchdog Timer, Oscillator Start-up Timer, and Power-up Timer parameter SY20 and updated conditions, which now refers to Section 18.4 "Watchdog Timer (WDT)" and LPRC parameter F21a (see Table 21-21). Updated Min and Typ values for parameters AD60, AD61, AD62 and AD63 and removed Note 3 (see Table 21-37). Updated Min and Typ values for parameters AD60, AD61, AD62 and AD63 and removed Note 3 (see Table 21-38). (c) 2007-2011 Microchip Technology Inc. DS70290J-page 283 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Revision C (December 2008) This revision includes minor typographical and formatting changes throughout the data sheet text. The major changes are referenced by their respective section in the following table. TABLE A-2: MAJOR SECTION UPDATES Section Name Update Description "High-Performance, 16-bit Digital Signal Controllers" Updated all pin diagrams to denote the pin voltage tolerance (see "Pin Diagrams"). Section 2.0 "Guidelines for Getting Started with 16-bit Digital Signal Controllers" Added new section to the data sheet that provides guidelines on getting started with 16-bit Digital Signal Controllers. Section 10.0 "I/O Ports" Updated 5V tolerant status for I/O pin RB4 from Yes to No (see Table 10-1). Section 22.0 "Electrical Characteristics" Removed the maximum value for parameter DC12 (RAM Data Retention Voltage) in Table 22-4. Updated typical values for Operating Current (IDD) and added Note 3 in Table 22-5. Updated typical and maximum values for Idle Current (IIDLE): Core OFF Clock ON Base Current and added Note 3 in Table 22-6. Updated typical and maximum values for Power Down Current (IPD) and added Note 5 in Table 22-7. Updated typical and maximum values for Doze Current (IDOZE) and added Note 2 in Table 22-8. Added Note 3 to Table 22-12. Updated minimum value for Internal Voltage Regulator Specifications in Table 22-13. Added parameter OS42 (GM) and Notes 4, 5, and 6 to Table 22-16. Added Notes 2 and 3 to Table 22-17. Added Note 2 to Table 22-20. Added Note 2 to Table 22-21. Added Note 2 to Table 22-22. Added Note 1 to Table 22-23. Added Note 1 to Table 22-24. Added Note 3 to Table 22-32. Added Note 2 to Table 22-33. Updated typical value for parameter AD08 (ADC in operation) and added Notes 2 and 3 in Table 22-34. Updated minimum, typical, and maximum values for parameters AD23a, AD24a, AD30a, AD32a, AD32a, and AD34a, and added Notes 2 and 3 in Table 22-35. Updated minimum, typical, and maximum values for parameters AD23b, AD24b, AD30b, AD32b, AD32b, and AD34b, and added Notes 2 and 3 in Table 22-36. DS70290J-page 284 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Revision D (October 2009) This revision includes minor typographical and formatting changes throughout the data sheet text. Global changes include: * Changed all instances of OSCI to OSC1 and OSCO to OSC2. * Changed all instances of PGCx/EMUCx and PGDx/EMUDx (where x = 1, 2 or 3) to PGECx and PGEDx. Changed all instances of VDDCORE and VDDCORE/VCAP to VCAP/VDDCORE All other major changes are referenced by their respective section in the following table. TABLE A-3: MAJOR SECTION UPDATES Section Name Update Description "High-Performance, 16-bit Digital Signal Controllers" Added Note 2 to the 28-Pin QFN-S and 44-Pin QFN pin diagrams, which references pin connections to VSS. Section 8.0 "Oscillator Configuration" Updated the Oscillator System Diagram (see Figure 8-1). Added Note 1 to the Oscillator Tuning (OSCTUN) register (see Register 8-4). Section 10.0 "I/O Ports" Removed Table 10-1 and added reference to pin diagrams for I/O pin availability and functionality. Section 15.0 "Serial Peripheral Interface (SPI)" Added Note 2 to the SPIx Control Register 1 (see Register 15-2). Section 17.0 "Universal Asynchronous Receiver Transmitter (UART)" Updated the UTXINV bit settings in the UxSTA register and added Note 1 (see Register 17-2). Section 22.0 "Electrical Characteristics" Updated the Min value for parameter DC12 (RAM Retention Voltage) and added Note 4 to the DC Temperature and Voltage Specifications (see Table 22-4). Updated the Min value for parameter DI35 (see Table 22-20). Updated AD08 and added reference to Note 2 for parameters AD05a, AD06a and AD08a (see Table 22-34). (c) 2007-2011 Microchip Technology Inc. DS70290J-page 285 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Revision E (November 2009) The revision includes the following global update: * Added Note 2 to the shaded table that appears at the beginning of each chapter. This new note provides information regarding the availability of registers and their associated bits This revision also includes minor typographical and formatting changes throughout the data sheet text. All other major changes are referenced by their respective section in the following table. TABLE A-4: MAJOR SECTION UPDATES Section Name Update Description "High-Performance, 16-bit Digital Signal Controllers" Added information on high temperature operation (see "Operating Range:"). Section 10.0 "I/O Ports" Changed the reference to digital-only pins to 5V tolerant pins in the second paragraph of Section 10.2 "Open-Drain Configuration". Section 17.0 "Universal Asynchronous Receiver Transmitter (UART)" Updated the two baud rate range features to: 10 Mbps to 38 bps at 40 MIPS. Section 18.0 "10-bit/12-bit Analog-to-Digital Converter (ADC)" Updated the ADC1 block diagrams (see Figure 18-1 and Figure 18-2). Section 19.0 "Special Features" Updated the second paragraph and removed the fourth paragraph in Section 19.1 "Configuration Bits". Section 22.0 "Electrical Characteristics" Updated the Absolute Maximum Ratings for high temperature and added Note 4. Updated the Device Configuration Register Map (see Table 19-1). Updated the SPIx Module Slave Mode (CKE = 1) Timing Characteristics (see Figure 22-12). Updated the Internal RC Accuracy parameter numbers (see Table 22-18 and Table 22-19). Section 23.0 "High Temperature Electrical Characteristics" Added new chapter with high temperature specifications. "Product Identification System" Added the "H" definition for high temperature. Revision F (November 2009) This revision includes minor typographical and formatting changes throughout the data sheet text. All other major changes are referenced by their respective section in the following table. TABLE A-5: MAJOR SECTION UPDATES Section Name "High-Performance, 16-bit Digital Signal Controllers" DS70290J-page 286 Update Description Updated MIPS rating from 16 to 20 for high temperature devices in "Operating Range:" and in TABLE 22-1: "Operating MIPS vs. Voltage". (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Revision G (January 2011) This revision includes typographical and formatting changes throughout the data sheet text. In addition, all instances of VDDCORE have been removed. All other major changes are referenced by their respective section in the following table. TABLE A-6: MAJOR SECTION UPDATES Section Name Update Description High-Performance, 16-bit Digital Signal Controllers Added the SSOP package information (see "Packaging:", Table 1, and "Pin Diagrams"). Section 2.0 "Guidelines for Getting Started with 16-bit Digital Signal Controllers" Updated the title of Section 2.3 "CPU Logic Filter Capacitor Connection (VCAP)". The frequency limitation for device PLL start-up conditions was updated in Section 2.7 "Oscillator Value Conditions on Device Start-up". The second paragraph in Section 2.9 "Unused I/Os" was updated. Section 3.0 "CPU" Removed references to DMA in the CPU Core Block Diagram (see Figure 3-1). Section 4.0 "Memory Organization" Updated the data memory reference in the third paragraph in Section 4.2 "Data Address Space". The All Resets values for the following SFRs in the Timer Register Map were changed (see Table 4-5): * TMR1 * TMR2 * TMR3 Section 8.0 "Oscillator Configuration" Added Note 3 to the OSCCON: Oscillator Control Register (see Register 8-1). Added Note 2 to the CLKDIV: Clock Divisor Register (see Register 8-2). Added Note 1 to the PLLFBD: PLL Feedback Divisor Register (see Register 8-3). Added Note 2 to the OSCTUN: FRC Oscillator Tuning Register (see Register 8-4). Section 18.0 "10-bit/12-bit Analog-to-Digital Updated the VREFL references in the ADC1 module block diagrams (see Figure 18-1 and Figure 18-2). Converter (ADC)" Section 19.0 "Special Features" Added a new paragraph and removed the third paragraph in Section 19.1 "Configuration Bits". Added the column "RTSP Effects" to the Configuration Bits Descriptions (see Table 19-2). Section 24.0 "Packaging Information" (c) 2007-2011 Microchip Technology Inc. Added the 28-Lead SSOP package information (see Section 24.1 "Package Marking Information" and Section 24.2 "Package Details"). DS70290J-page 287 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 TABLE A-6: MAJOR SECTION UPDATES (CONTINUED) Section Name Section 22.0 "Electrical Characteristics" Update Description Added the 28-pin SSOP Thermal Packaging Characteristics (see Table 22-3). Removed Note 4 from the DC Temperature and Voltage Specifications (see Table 22-4). Updated the maximum value for parameters DI18 and DI19 and added parameters DI28, DI29, DI60a, DI60b, and DI60c to the I/O Pin Input Specifications (see Table 22-9). Updated Note 3 in the PLL Clock Timing Specifications (see Table 22-17). Removed Note 2 from the AC Characteristics: Internal RC Accuracy (see Table 22-18). Updated the characteristic description for parameter DI35 in the I/O Timing Requirements (see Table 22-20). Updated all SPI specifications (see Table 22-28 through Table 22-35 and Figure 22-10 through Figure 22-16). Added Note 4 to the 12-bit mode ADC Module Specifications (see Table 22-39). Added Note 4 to the 10-bit mode ADC Module Specifications (see Table 22-40). Section 23.0 "High Temperature Electrical Characteristics" Updated all ambient temperature end range values to +150C throughout the chapter. Updated the storage temperature end range to +160C. Updated the maximum junction temperature from +145C to +155C. Updated Note 1 in the PLL Clock Timing Specifications (see Table 23-10). Added Note 3 to the 12-bit Mode ADC Module Specifications (see Table 23-17). Added Note 3 to the 10-bit Mode ADC Module Specifications (see Table 23-18). "Product Identification System" DS70290J-page 288 Added the "SS" definition for the SSOP package. (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Revision H (July 2011) This revision includes typographical and formatting changes throughout the data sheet text. All other major changes are referenced by their respective section in the following table. TABLE A-7: MAJOR SECTION UPDATES Section Name Update Description Section 19.0 "Special Features" Added Note 3 to the Connections for the On-chip Voltage Regulator diagram (see Figure 19-1). Section 22.0 "Electrical Characteristics" Removed Note 3 and parameter DC10 (VCORE) from the DC Temperature and Voltage Specifications (see Table 22-4). Updated the Characteristics definition and Conditions for parameter BO10 in the Electrical Characteristics: BOR (see Table 22-11). Added Note 1 to the Internal Voltage Regulator Specifications (see Table 22-13). Revision J (June 2012) This revision includes typographical and formatting changes throughout the data sheet text. In addition, where applicable, new sections were added to each peripheral chapter that provide information and links to related resources, as well as helpful tips. For examples, see Section 8.2 "Oscillator Resources" and Section 18.3 "ADC Helpful Tips". All other major changes are referenced by their respective section in the following table. TABLE A-8: MAJOR SECTION UPDATES Section Name Update Description Section 22.0 "Electrical Characteristics" Added Note 1 to the Operating MIPS vs. Voltage (see Table 22-1). Updated the notes in the following tables: * Operating Current (IDD) (see Table 22-5) * Idle Current (IIDLE) (see Table 22-6) * Power-Down Current (IPD) (see Table 22-7) * Doze Current (IDOZE) (see Table 22-8) Updated the conditions for Program Memory parameters D136b, D137b, and D138b (TA = +150C) (see Table 22-12). Section 23.0 "High Temperature Electrical Characteristics" Removed Table 23-8: DC Characteristics: Program Memory. Section 24.0 "DC and AC Device Characteristics Graphs" Added new chapter. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 289 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 NOTES: DS70290J-page 290 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 INDEX A A/D Converter ................................................................... 175 Initialization ............................................................... 175 Key Features............................................................. 175 AC Characteristics .................................................... 220, 257 ADC Module.............................................................. 260 ADC Module (10-bit Mode) ....................................... 261 ADC Module (12-bit Mode) ....................................... 260 Internal RC Accuracy ................................................ 222 Load Conditions ................................................ 220, 257 ADC Module ADC11 Register Map ...................................... 39, 41, 42 Alternate.............................................................................. 71 Alternate Interrupt Vector Table .......................................... 71 Alternate Interrupt Vector Table (AIVT) .............................. 71 Arithmetic Logic Unit (ALU)................................................. 24 Assembler MPASM Assembler................................................... 206 B Barrel Shifter ....................................................................... 28 Bit-Reversed Addressing .................................................... 48 Example ...................................................................... 49 Implementation ........................................................... 48 Sequence Table (16-Entry)......................................... 49 Block Diagrams 16-bit Timer1 Module ................................................ 137 A/D Module ....................................................... 176, 177 Connections for On-Chip Voltage Regulator............. 193 Device Clock ......................................................... 97, 99 DSP Engine ................................................................ 25 dsPIC33F .................................................................... 10 dsPIC33F CPU Core................................................... 18 Input Capture ............................................................ 147 Output Compare ....................................................... 151 PLL.............................................................................. 99 Reset System.............................................................. 61 Shared Port Structure ............................................... 115 SPI ............................................................................ 155 Timer2 (16-bit) .......................................................... 142 Timer2/3 (32-bit) ....................................................... 142 UART ........................................................................ 169 Watchdog Timer (WDT) ............................................ 194 C C Compilers MPLAB C18 .............................................................. 206 Clock Switching................................................................. 107 Enabling .................................................................... 107 Sequence.................................................................. 107 Code Examples Erasing a Program Memory Page............................... 59 Initiating a Programming Sequence............................ 60 Loading Write Buffers ................................................. 60 Port Write/Read ........................................................ 116 PWRSAV Instruction Syntax..................................... 109 Code Protection ........................................................ 189, 195 Configuration Bits.............................................................. 189 Description (Table).................................................... 190 Configuration Register Map .............................................. 189 Configuring Analog Port Pins ............................................ 116 CPU Control Register .......................................................... 21 CPU Clocking System......................................................... 98 (c) 2007-2011 Microchip Technology Inc. Options ....................................................................... 98 Selection..................................................................... 98 Customer Change Notification Service............................. 295 Customer Notification Service .......................................... 295 Customer Support............................................................. 295 D Data Accumulators and Adder/Subtractor .......................... 26 Data Space Write Saturation ...................................... 28 Overflow and Saturation ............................................. 26 Round Logic ............................................................... 27 Write Back .................................................................. 27 Data Address Space........................................................... 31 Alignment.................................................................... 31 Memory Map for dsPIC33F Devices with 8 KBs RAM 32 Near Data Space ........................................................ 31 Software Stack ........................................................... 45 Width .......................................................................... 31 DC and AC Characteristics Graphs and Tables ................................................... 263 DC Characteristics............................................................ 210 Doze Current (IDOZE)................................................ 255 High Temperature..................................................... 254 I/O Pin Input Specifications ...................................... 216 I/O Pin Output Specifications............................ 218, 256 Idle Current (IDOZE) .................................................. 215 Idle Current (IIDLE) .................................................... 213 Operating Current (IDD) ............................................ 212 Operating MIPS vs. Voltage ..................................... 254 Power-Down Current (IPD)........................................ 214 Power-down Current (IPD) ........................................ 255 Program Memory...................................................... 219 Temperature and Voltage......................................... 254 Temperature and Voltage Specifications.................. 211 Thermal Operating Conditions.................................. 254 Development Support ....................................................... 205 DSP Engine ........................................................................ 24 Multiplier ..................................................................... 26 E Electrical Characteristics .................................................. 209 AC..................................................................... 220, 257 Equations Device Operating Frequency...................................... 98 Errata .................................................................................... 7 F Flash Program Memory ...................................................... 55 Control Registers........................................................ 56 Operations .................................................................. 56 Programming Algorithm.............................................. 59 RTSP Operation ......................................................... 56 Table Instructions ....................................................... 55 Flexible Configuration ....................................................... 189 H High Temperature Electrical Characteristics .................... 253 I I/O Ports ........................................................................... 115 Parallel I/O (PIO) ...................................................... 115 Write/Read Timing.................................................... 116 I2 C Operating Modes ...................................................... 161 DS70290J-page 291 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Registers ................................................................... 163 I2C Module I2C1 Register Map ...................................................... 38 In-Circuit Debugger ........................................................... 196 In-Circuit Emulation........................................................... 189 In-Circuit Serial Programming (ICSP) ....................... 189, 196 Input Capture Registers ................................................................... 149 Input Change Notification.................................................. 116 Instruction Addressing Modes............................................. 45 File Register Instructions ............................................ 45 Fundamental Modes Supported.................................. 46 MAC Instructions......................................................... 46 MCU Instructions ........................................................ 45 Move and Accumulator Instructions ............................ 46 Other Instructions........................................................ 46 Instruction Set Overview ................................................................... 200 Summary................................................................... 197 Instruction-Based Power-Saving Modes ........................... 109 Idle ............................................................................ 110 Sleep ......................................................................... 109 Internal RC Oscillator Use with WDT ........................................................... 194 Internet Address................................................................ 295 Interrupt Control and Status Registers................................ 74 IECx ............................................................................ 74 IFSx............................................................................. 74 INTCON1 .................................................................... 74 INTCON2 .................................................................... 74 IPCx ............................................................................ 74 Interrupt Setup Procedures ................................................. 96 Initialization ................................................................. 96 Interrupt Disable.......................................................... 96 Interrupt Service Routine ............................................ 96 Trap Service Routine .................................................. 96 Interrupt Vector Table (IVT) ................................................ 71 Interrupts Coincident with Power Save Instructions.......... 110 J JTAG Boundary Scan Interface ........................................ 189 M Memory Organization.......................................................... 29 Microchip Internet Web Site .............................................. 295 Modulo Addressing ............................................................. 47 Applicability ................................................................. 48 Operation Example ..................................................... 47 Start and End Address ................................................ 47 W Address Register Selection .................................... 47 MPLAB ASM30 Assembler, Linker, Librarian ................... 206 MPLAB Integrated Development Environment Software .. 205 MPLAB PM3 Device Programmer..................................... 208 MPLAB REAL ICE In-Circuit Emulator System................. 207 MPLINK Object Linker/MPLIB Object Librarian ................ 206 N NVM Module Register Map............................................................... 44 O Open-Drain Configuration ................................................. 116 Output Compare................................................................ 151 Registers ................................................................... 154 DS70290J-page 292 P Packaging ......................................................................... 267 Details....................................................................... 269 Marking ............................................................. 267, 268 Peripheral Module Disable (PMD) .................................... 110 Pinout I/O Descriptions (table)............................................ 11 PMD Module Register Map .............................................................. 44 PORTA Register Map .............................................................. 43 PORTB Register Map .............................................................. 43 Power-on Reset (POR)....................................................... 67 Power-Saving Features .................................................... 109 Clock Frequency and Switching ............................... 109 Program Address Space..................................................... 29 Construction ............................................................... 50 Data Access from Program Memory Using Program Space Visibility..................................... 53 Data Access from Program Memory Using Table Instructions ............................................... 52 Data Access from, Address Generation ..................... 51 Memory Map............................................................... 29 Table Read Instructions TBLRDH ............................................................. 52 TBLRDL.............................................................. 52 Visibility Operation ...................................................... 53 Program Memory Interrupt Vector ........................................................... 30 Organization ............................................................... 30 Reset Vector ............................................................... 30 R Reader Response............................................................. 296 Registers AD1CHS0 (ADC1 Input Channel 0 Select ................ 185 AD1CHS123 (ADC1 Input Channel 1, 2, 3 Select)... 183 AD1CON1 (ADC1 Control 1) .................................... 179 AD1CON2 (ADC1 Control 2) .................................... 181 AD1CON3 (ADC1 Control 3) .................................... 182 AD1CSSL (ADC1 Input Scan Select Low)................ 187 AD1PCFGL (ADC1 Port Configuration Low) ............ 187 CLKDIV (Clock Divisor) ............................................ 103 CORCON (Core Control) ...................................... 23, 75 I2CxCON (I2Cx Control) ........................................... 164 I2CxMSK (I2Cx Slave Mode Address Mask) ............ 168 I2CxSTAT (I2Cx Status) ........................................... 166 ICxCON (Input Capture x Control)............................ 149 IEC0 (Interrupt Enable Control 0) ................... 83, 85, 86 IFS0 (Interrupt Flag Status 0) ..................................... 79 IFS1 (Interrupt Flag Status 1) ..................................... 81 IFS4 (Interrupt Flag Status 4) ..................................... 82 INTCON1 (Interrupt Control 1).................................... 76 INTCON2 (Interrupt Control 2).................................... 78 INTTREG Interrupt Control and Status Register ........ 95 IPC0 (Interrupt Priority Control 0) ............................... 87 IPC1 (Interrupt Priority Control 1) ............................... 88 IPC16 (Interrupt Priority Control 16) ........................... 94 IPC2 (Interrupt Priority Control 2) ............................... 89 IPC3 (Interrupt Priority Control 3) ............................... 90 IPC4 (Interrupt Priority Control 4) ............................... 91 IPC5 (Interrupt Priority Control 5) ............................... 92 IPC7 (Interrupt Priority Control 7) ............................... 93 NVMCOM (Flash Memory Control)....................... 57, 58 OCxCON (Output Compare x Control) ..................... 154 OSCCON (Oscillator Control) ................................... 101 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 OSCTUN (FRC Oscillator Tuning) ............................ 106 PLLFBD (PLL Feedback Divisor).............................. 105 PMD1 (Peripheral Module Disable Control Register 1) ........................................................ 112 PMD2 (Peripheral Module Disable Control Register 2) ........................................................ 113 RCON (Reset Control) ................................................ 63 SPIxCON1 (SPIx Control 1)...................................... 158 SPIxCON2 (SPIx Control 2)...................................... 160 SPIxSTAT (SPIx Status and Control) ....................... 157 SR (CPU Status)................................................... 21, 75 T1CON (Timer1 Control)........................................... 139 TxCON (T2CON, T4CON, T6CON or T8CON Control) ................................................ 144 TyCON (T3CON, T5CON, T7CON or T9CON Control) ................................................ 145 UxMODE (UARTx Mode).......................................... 171 UxSTA (UARTx Status and Control)......................... 173 Reset Illegal Opcode ....................................................... 61, 69 Trap Conflict.......................................................... 68, 69 Uninitialized W Register........................................ 61, 69 Reset Sequence ................................................................. 71 Resets ................................................................................. 61 S Serial Peripheral Interface (SPI) ....................................... 155 Software Reset Instruction (SWR) ...................................... 68 Software Simulator (MPLAB SIM)..................................... 207 Software Stack Pointer, Frame Pointer CALL Stack Frame...................................................... 45 Special Features of the CPU ............................................ 189 SPI Module SPI1 Register Map...................................................... 38 Symbols Used in Opcode Descriptions............................. 198 System Control Register Map............................................................... 44 T Temperature and Voltage Specifications AC ..................................................................... 220, 257 Timer1 ............................................................................... 137 Timer2/3, Timer4/5, Timer6/7 and Timer8/9 ..................... 141 Timing Characteristics CLKO and I/O ........................................................... 223 Timing Diagrams 10-bit A/D Conversion............................................... 250 10-bit A/D Conversion (CHPS = 01, SIMSAM = 0, ASAM = 0, SSRC = 000) .................................. 250 12-bit A/D Conversion (ASAM = 0, SSRC = 000) ..... 249 Brown-out Situations................................................... 68 (c) 2007-2011 Microchip Technology Inc. External Clock .......................................................... 221 I2Cx Bus Data (Master Mode) .................................. 242 I2Cx Bus Data (Slave Mode) .................................... 244 I2Cx Bus Start/Stop Bits (Master Mode)................... 242 I2Cx Bus Start/Stop Bits (Slave Mode)..................... 244 Input Capture (CAPx) ............................................... 228 OC/PWM .................................................................. 229 Output Compare (OCx) ............................................ 228 Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer ......................................... 224 Timer1, 2, 3, 4, 5, 6, 7, 8, 9 External Clock .............. 226 Timing Requirements ADC Conversion (10-bit mode) ................................ 262 ADC Conversion (12-bit Mode) ................................ 262 CLKO and I/O ........................................................... 223 External Clock .......................................................... 221 Input Capture............................................................ 228 SPIx Master Mode (CKE = 0) ................................... 258 SPIx Module Master Mode (CKE = 1) ...................... 258 SPIx Module Slave Mode (CKE = 0) ........................ 259 SPIx Module Slave Mode (CKE = 1) ........................ 259 Timing Specifications 10-bit A/D Conversion Requirements ....................... 251 12-bit A/D Conversion Requirements ....................... 249 I2Cx Bus Data Requirements (Master Mode)........... 243 I2Cx Bus Data Requirements (Slave Mode)............. 245 Output Compare Requirements................................ 228 PLL Clock ......................................................... 222, 257 Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-out Reset Requirements......................................... 225 Simple OC/PWM Mode Requirements ..................... 229 Timer1 External Clock Requirements....................... 226 Timer2 External Clock Requirements....................... 227 Timer3 External Clock Requirements....................... 227 U UART Module UART1 Register Map ................................................. 38 Using the RCON Status Bits............................................... 69 V Voltage Regulator (On-Chip) ............................................ 193 W Watchdog Time-out Reset (WDTR).................................... 68 Watchdog Timer (WDT)............................................ 189, 194 Programming Considerations ................................... 194 WWW Address ................................................................. 295 WWW, On-Line Support ....................................................... 7 DS70290J-page 293 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 NOTES: DS70290J-page 294 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives * * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under "Support", click on "Customer Change Notification" and follow the registration instructions. (c) 2007-2011 Microchip Technology Inc. DS70290J-page 295 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 Literature Number: DS70290J Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS70290J-page 296 (c) 2007-2011 Microchip Technology Inc. dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. dsPIC 33 FJ 32 GP2 02 T E / SP - XXX Examples: a) Microchip Trademark Architecture dsPIC33FJ32GP202-E/SP: General-purpose dsPIC33, 32-Kbyte program memory, 28-pin, Extended temp., SPDIP package. Flash Memory Family Program Memory Size (Kbyte) Product Group Pin Count Tape and Reel Flag (if applicable) Temperature Range Package Pattern Architecture: 33 = 16-bit Digital Signal Controller Flash Memory Family: FJ = Flash program memory, 3.3V Product Group: GP2 GP3 = = General purpose family General purpose family Pin Count: 02 03 = = 28-pin 44-pin Temperature Range: I E H = = = -40 C to +85 C (Industrial) -40 C to +125 C (Extended) -40 C to +150 C (High) Package: SP SO SS ML PT MM = = = = = = Skinny Plastic Dual In-Line - 300 mil body (SPDIP) Plastic Small Outline - Wide - 7.5 mm body (SOIC) Plastic Shrink Small Outline - 5.3 mm body (SSOP) Plastic Quad, No Lead Package - 8x8 mm body (QFN) Plastic Thin Quad Flatpack - 10x10x1 mm body (TQFP) Plastic Quad, No Lead Package - 6x6 mm body (QFN-S) (c) 2007-2011 Microchip Technology Inc. DS70290J-page 297 dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304 NOTES: DS70290J-page 298 (c) 2007-2011 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2007-2011, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-62076-334-6 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == (c) 2007-2011 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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