05161 U0408FC3.3C thru U0408FC36C UNBUMPED FLIP CHIP ARRAY APPLICATIONS Cellular Phones MCM Boards Wireless Communication Circuits IR LEDs SMART & PCMCIA Cards IEC COMPATIBILITY (EN61000-4) 61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns FEATURES ESD Protection > 25 kilovolts Available in Voltages Ranging From 3.3V to 36V 250 Watts Peak Pulse Power per Line (tp = 8/20s) Bidirectional Configuration & Monolithic Structure Protects 4 to 7 Lines RoHS Compliant MECHANICAL CHARACTERISTICS Standard EIA Chip Size: 0408 Weight 0.73 milligrams (Approximate) Available in Lead-Free Plating Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270C Flammability Rating UL 94V-0 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 Device Marking On Reel PIN CONFIGURATION 05161.R5 5/07 1 www.protekdevices.com U0408FC3.3C thru U0408FC36C DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25C Unless Otherwise Specified PARAMETER SYMBOL VALUE UNITS PPP 250 Watts TA -55 to 150 C TSTG -55 to 150 C Peak Pulse Power (tp = 8/20s) - See Figure 1 Operating Temperature Storage Temperature ELECTRICAL CHARACTERISTICS PER LINE PART NUMBER (See Note 1) U0408FC3.3C U0408FC05C U0408FC08C U0408FC12C U0408FC15C U0408FC24C U0408FC36C @ 25C Unless Otherwise Specified RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM LEAKAGE CURRENT (See Note 2) TYPICAL CAPACITANCE VWM VOLTS @ 1mA V(BR) VOLTS @ IP = 1A VC VOLTS @8/20s VC @ IPP @VWM ID A @0V, 1 MHz C pF 3.3 5.0 8.0 12.0 15.0 24.0 36.0 4.0 6.0 8.5 13.3 16.7 26.7 40.0 7.0 9.8 13.4 19.0 24.0 43.0 64.0 12.5V @ 20A 14.7V @ 17A 19.2V @ 13A 29.7V @ 9.0A 35.7V @ 7.0A 55.0V @ 5.0A 84.0V @ 3.0A 75* 10** 10*** 1 1 1 1 150 100 75 50 40 30 25 Note 1: All devices are bidirectional. Electrical characteristics apply in both directions. Note 2: *Maximum leakage current < 5A @ 2.8V. **Maximum leakage current <500nA @ 3.3V. ***Maximum leakage current <200nA @ 5V. FIGURE 1 PEAK PULSE POWER VS PULSE TIME 120 IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Current - Watts 10,000 1,000 250W, 8/20s Waveform 100 10 0.01 05161.R5 5/07 FIGURE 2 PULSE WAVE FORM tf 100 TEST WAVEFORM PARAMETERS tf = 8s td = 20s Peak Value IPP 80 e-t 60 40 td = t I /2 PP 20 0 1 10 100 td - Pulse Duration - s 1,000 10,000 2 0 5 10 15 t - Time - s 20 25 30 www.protekdevices.com *U.S. Patent No. Des. "D456,367S" U0408FC3.3C thru U0408FC36C GRAPHS FIGURE 3 POWER DERATING CURVE 100 Peak Pulse Power 8/20s % Of Rated Power 80 60 40 20 Average Power 0 0 25 50 75 100 125 TA - Ambient Temperature - C 150 FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE FOR U0408FC05C 5 Volts per Division 35 25 15 5 -5 ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR U0408FC05C VC - Clamping Voltage - Volts 14 12 10 8 6 4 2 0 0 5 10 15 20 IPP - Peak Pulse Current - Amps 05161.R5 5/07 3 www.protekdevices.com U0408FC3.3C thru U0408FC36C APPLICATION INFORMATION PRINTED CIRCUIT BOARD RECOMMENDATIONS VALUE PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183C) Soldering Maximum Temperature 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION REQUIREMENTS Non-Solder Mask Defined Pad 0.275mm DIA. Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. TP Temperature - C Ramp-up Ramp-down TL TSMAX 155 TSMIN 140 TS - Preheat t 25C to Peak 30-60 seconds 05161.R5 5/07 Ramp-up 15 seconds 4 Solder Time 15-20 seconds Ramp-down www.protekdevices.com *U.S. Patent No. Des. "D456,367S" U0408FC3.3C thru U0408FC36C U0408 PACKAGE OUTLINE & DIMENSIONS PACKAGE DIMENSIONS TOP SIDE A B C PACKAGE OUTLINE DIM MILLIMETERS INCHES A 0.56 NOM 0.022 NOM B 0.86 NOM 0.034 NOM C 0.99 0.0254 0.039 0.001 E 0.15 SQ 0.006 SQ F 2.0 0.0254 0.079 0.001 I 0.406 NOM 0.016 NOM NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002"). E F Metalized Die Contact END I PAD DIMENSIONS MOUNTING PAD LAYOUT - Option 1 D A C MILLIMETERS INCHES A C D E F G H I 0.51 0.30 0.46 0.20 0.15 SQ 0.71 0.99 0.51 0.020 0.012 0.018 0.008 0.006 SQ 0.028 0.039 0.020 E DIE SOLDER CONTACT DIM NOTE: H G 1. Preferred: Using 0.1mm (0.004") stencil. F I SOLDER PADS SOLDER PRINT 0.010" - 0.012" DIA. SOLDER MASK Outline & Dimensions: Rev 3 - 2/04, 06026 05161.R5 5/07 5 www.protekdevices.com U0408FC3.3C thru U0408FC36C U0408 PACKAGE OUTLINE & DIMENSIONS PACKAGE DIMENSIONS MOUNTING PAD LAYOUT - Option 2 DIM COPPER CONTACT 0.009" [0.23] DIA. A DIE SOLDER CONTACT MILLIMETERS INCHES A 0.51 0.020 F 0.15 SQ 0.006 SQ G 0.71 0.028 H 0.99 0.039 I 0.51 0.020 H G NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002"). 3. Preferred: Using 0.1mm (0.004") stencil. Outline & Dimensions: Rev 3 - 2/04, 06026 I F TAPE & REEL ORIENTATION SOLDER PRINT 0.014" [0.36] DIA. SOLDER MASK Quad Die - 0408 NOTE: 1. Top view of tape. Solder bumps are face down in tape package. TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA 481. 2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., U0408FC05C-T75-1). 3. 8mm Paper Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-2 (i.e., U0408FC05C-T75-2). COPYRIGHT (c) ProTek Devices 2007 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. 05161.R5 5/07 6 ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com www.protekdevices.com *U.S. Patent No. Des. "D456,367S"