6
05161.R5 5/07 www.protekdevices.com
*U.S. Patent No. Des. “D456,367S”
U0408FC3.3C
thru
U0408FC36C
U0408 PACKAGE OUTLINE & DIMENSIONS
COPYRIGHT © ProTek Devices 2007
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s
and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
A
F
G
H
I
0.51
0.15 SQ
0.71
0.99
0.51
0.020
0.006 SQ
0.028
0.039
0.020
DIM MILLIMETERS INCHES
PACKAGE DIMENSIONS
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad
and outline: .xxx ± 0.05mm (± 0.002”).
3.
Preferred:
Using 0.1mm (0.004”) stencil.
MOUNTING PAD LAYOUT - Option 2
TAPE & REEL ORDERING NOMENCLA-
TURE
1. Surface mount product is taped and
reeled in accordance with EIA 481.
2.
8mm Plastic Tape:
7 Inch Reels - 5,000
pieces per reel. Ordering Suffix: -T75-1
(i.e., U0408FC05C-T75-1).
3.
8mm Paper Tape:
7 Inch Reels - 5,000
pieces per reel. Ordering Suffix: -T75-2
(i.e., U0408FC05C-T75-2).
Outline & Dimensions: Rev 3 - 2/04, 06026
TAPE & REEL ORIENTATION
NOTE:
1. Top view of tape. Solder bumps are face
down in tape package.
Quad Die - 0408
COPPER CONTACT 0.009” [0.23] DIA.
SOLDER PRINT 0.014” [0.36] DIA.
A
H
I
F
G
SOLDER
MASK
DIE
SOLDER
CONTACT