2016-09-26 Infrared Emitter (850 nm) Version 1.5 SFH 4550 Features: * High Power Infrared LED * Narrow emission angle 3 * Very high radiant intensity * UL version available ( details & test conditions on request) Applications Infrared Illumination for cameras * * Data transmission * Sensor technology * Smoke detectors Notes Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Ordering Information Type: Radiant Intensity Ordering Code Ie [mW/sr] IF= 100 mA, tp= 20 ms SFH 4550 1100 ( 630) Q65110A1772 SFH 4550 E9548 (UL) 1100 ( 630) Q65110A8097 SFH 4550-EWFW 630 ... 2000 Q65110A7758 SFH 4550-FW 1000 ... 2000 Q65111A1633 Note: Measured at a solid angle of = 0.001 sr 2016-09-26 1 Version 1.5 SFH 4550 Maximum Ratings (TA = 25 C) Parameter Symbol Values Unit Operation and storage temperature range Top; Tstg -40 ... 100 C Reverse voltage VR 5 V Forward current IF 100 Surge current (tp 100 s, D = 0) IFSM 1 Power consumption Ptot 180 ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) VESD 2 Thermal resistance junction - ambient 1) page 8 RthJA 450 mA A mW kV K/W Characteristics (TA = 25 C) Parameter Symbol Values Unit Peak wavelength (IF = 100 mA, tp = 20 ms) (typ) peak 860 nm Centroid wavelength (IF = 100 mA, tp = 20 ms) (typ) centroid 850 nm Spectral bandwidth at 50% of Imax (IF = 100 mA, tp = 20 ms) (typ) 30 nm Half angle (typ) 3 Dimensions of active chip area (typ) LxW Rise and fall time of Ie ( 10% and 90% of Ie max) (IF = 100 mA, RL = 50 ) (typ) tr, tf Forward voltage (IF = 100 mA, tp = 20 ms) Forward voltage (IF = 1 A, tp = 100 s) 0.3 x 0.3 mm x mm 12 ns (typ (max)) VF 1.5 ( 1.8) V (typ (max)) VF 2.4 ( 3) V Reverse current (VR = 5 V) IR not designed for reverse operation A Total radiant flux (IF=100 mA, tp=20 ms) (typ) e 70 mW Temperature coefficient of Ie or e (IF = 100 mA, tp = 20 ms) (typ) TCI -0.5 %/K Temperature coefficient of VF (IF = 100 mA, tp = 20 ms) (typ) TCV -0.7 mV / K Temperature coefficient of wavelength (IF = 100 mA, tp = 20 ms) (typ) TC 0.3 nm / K 2016-09-26 2 Version 1.5 SFH 4550 Grouping (TA = 25 C) Group Min Radiant Intensity Max Radiant Intensity Typ Radiant Intensity IF= 100 mA, tp= 20 ms IF= 100 mA, tp= 20 ms IF = 1 A, tp = 25 s Ie, min [mW / sr] Ie, max [mW / sr] Ie, typ [mW / sr] SFH 4550-EW 630 1250 7500 SFH 4550-FW 1000 2000 12000 SFH 4550-GW 1600 3200 19000 Note: Measured at a solid angle of = 0.001 sr Only one group in one packing unit (variation lower 2:1). Relative Spectral Emission 2) page 8 Irel = f(), TA = 25C Radiant Intensity 2) page 8 Ie / Ie(100 mA) = f(IF), single pulse, tp = 25 s, TA= 25C OHF04132 100 OHL01715 101 I rel % Ie I e (100 mA) 80 100 5 60 10-1 40 5 10-2 20 5 0 700 750 800 850 10-3 0 10 nm 950 2016-09-26 5 10 1 5 10 2 mA 10 3 IF 3 Version 1.5 SFH 4550 Forward Current 2) page 8 IF = f(VF), single pulse, tp = 100 s, TA= 25C Max. Permissible Forward Current IF, max = f(TA), RthJA = 450 K / W OHR00880 125 F mA IF 100 OHL01713 100 A 10-1 5 75 10-2 5 50 10-3 25 0 5 0 20 40 60 10-4 80 C 100 T IF OHF05438 t 1.0 0.9 A IF 0.8 IF T 0.6 0.4 1.5 2 2.5 V 3 OHF05587 t D = TP tP IF T 0.7 D= 0.8 1 Permissible Pulse Handling Capability IF = f(tp), T A = 85 C, duty cycle D = parameter tP D = TP 0.5 VF Permissible Pulse Handling Capability IF = f(tp), TA = 25 C, duty cycle D = parameter 1.2 A 0 0.005 0.01 0.02 0.033 0.05 0.1 0.2 0.5 1 0.6 0.5 0.4 0.3 0.2 0.2 D= 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 0.1 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp 2016-09-26 tp 4 Version 1.5 SFH 4550 Radiation Characteristics 2) page 8 Irel = f(), TA= 25C 40 30 20 10 0 50 OHL01718 1.0 0.8 0.6 60 0.4 70 0.2 80 0 90 100 1.0 0.8 0.6 0.4 0 20 40 60 80 Package Outline 9.0 (0.354) 1.8 (0.071) 1.2 (0.047) 29 (1.142) 27 (1.063) o4.8 (0.189) Cathode 5.7 (0.224) 0.6 (0.024) 5.1 (0.201) Chip position 0.4 (0.016) Dimensions in mm (inch). Package 5mm Radial (T 1 3/4), Epoxy 2016-09-26 5.9 (0.232) 5.5 (0.217) 7.5 (0.295) 0.8 (0.031) 0.5 (0.020) 2.54 (0.100) spacing 0.6 (0.024) 0.4 (0.016) Area not flat 7.8 (0.307) o5.1 (0.201) 8.2 (0.323) 5 GEXY6271 100 120 Version 1.5 SFH 4550 Approximate Weight: 0.3 g Note Packing information is available on the internet (online product catalog). Recommended Solder Pad Dimensions in mm. Note: pad 1: cathode 2016-09-26 6 Version 1.5 SFH 4550 TTW Soldering IEC-61760-1 TTW OHA04645 300 10 s max., max. contact time 5 s per wave C T 250 235 C - 260 C First wave Second wave Continuous line: typical process Dotted line: process limits T < 150 K 200 Cooling Preheating ca. 3.5 K/s typical 150 ca. 2 K/s 130 C 120 C 100 C 100 ca. 5 K/s Typical 50 0 0 20 40 60 80 100 120 140 160 180 200 220 s 240 t Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. 2016-09-26 7 Version 1.5 SFH 4550 Glossary 1) Thermal resistance: junction -ambient, mounted on PC-board (FR4), padsize 16 mm2 each 2) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 2016-09-26 8 Version 1.5 SFH 4550 Published by OSRAM Opto Semiconductors GmbH Leibnizstrae 4, D-93055 Regensburg www.osram-os.com (c) All Rights Reserved. 2016-09-26 9