Surface Mount
Sockets
Terminals
Type-638 Type-647
Molded only
1FGAXXX638X
FootprintDash#
If Applicable
TerminalPlating
G - Gold
T - Tin
TerminalType
See Left
BodyType
F - FR-4
M - Molded
A
AX
= Standard Adapter
(BGA Body + .079(2mm))
= Extraction Slot Adapter
(BGA Body + .157(4mm))
HowToOrder
Pitch
B = .059 (1.5mm) Pitch
G = .050 (1.27mm) Pitch
NumberofPins
96 - 736
See BGA Footprint pages
Rev. 14-A Page155
inch/(mm)
.193
(4.90)
.018/(0.45)
Dia.
.031/(0.78)
Dia. C' Sink
.018/(0.45)
Dia.
.182
(4.62)
all Grid Array
Socketing System
BGAAdapters
Features:
Terminals:
Plating:
BodyMaterial:
Soldering BGA to adapter subjects
BGA to less thermal stress than
soldering BGA to a mother board
due to the adapters lower mass.
Countersink in head of pin allows
easy positioning of BGA onto
adapter.
Head above insulator in adapter
allows visual inspection for solder
shorts in both X & Y axis.
Custom adapters available for heat
sink attachment.
Extraction slot for tool #5082-2
shown on page 163.
Brass - Copper Alloy 360,
ASTM-B-16
Terminal TL: Tin Lead over Nickel
Terminal G: Gold over Nickel
FR-4 Glass Epoxy, U.L. Rated 94V-O
B.G.A.
BGA Body + .157/(4.0)
BGA Body + .079/(2.0)
.079/(2.0)
Detail A
B.G.A.
.039/(1.0)
Detail C
ExtractionSlotAdapter
(Mates with Extraction Slot & Guide Box Socket)
StandardAdapter
(Mates with Standard Socket)
5EnergyWay,P .O.Box1019,WestWarwick,RI02893USATel.800-424-9850/401-823-5200•Fax401-823-8723•Emailadvintcorp@aol.com•Internet
ADVANCED
INTERCONNECTIONS
®®
AfterSoldering
PCB
Ball Grid Array
BGA
Adapter
Solder
Joints
BGA
Adapter
Socket
Before Soldering
BGA
BGA
Adapter
BGA
Adapter
Socket
PCB
FR-4 only