Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, 6.3 - 250 VDC (Commercial & Automotive Grade) Overview KEMET's Floating Electrode with Flexible Termination capacitor (FF-CAP) combines two existing KEMET technologies- Floating Electrode and Flexible Termination. The floating electrode component utilizes a cascading internal electrode design configured to form multiple capacitors in series within a single monolithic structure. This unique configuration results in enhanced voltage and ESD performance over standard capacitor designs while allowing for a fail-open condition if mechanically damaged (cracked). The flexible termination component utilizes a conductive silver epoxy between the base metal and nickel barrier layers of KEMET's standard termination system in order to establish pliability while maintaining terminal strength, solderability and electrical performance. Both technologies address the primary failure mode of MLCCs- flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. Although neither technology can eliminate the potential for mechanical damage that may propagate during extreme environmental and/or handling conditions, the combination of these two technologies provide the ultimate level of protection against a low IR or short circuit condition. The FF-CAP complements KEMET's Open Mode, Floating Electrode (FE-CAP), Flexible Termination (FT-CAP) and KEMET Power Solutions (KPS) product lines by providing an ultimate fail-safe design optimized for low to mid range capacitance values. These devices exhibit a predictable change in capacitance with respect to time and voltage and boast a minimal change in capacitance with reference to ambient temperature. Capacitance change is limited to 15% from -55C to +125C. In addition to Commercial Grade, Automotive Grade devices are available which meet the demanding Automotive Electronics Council's AEC-Q200 qualification requirements. Ordering Information C Ceramic 0805 Y Case Size Specification/ (L" x W") Series 0603 0805 1206 1210 1812 Y = Floating Electrode with Flexible Termination 104 K 5 R Capacitance Code (pF) Capacitance Tolerance Voltage Dielectric 9 = 6.3 V 8 = 10 V 4 = 16 V 3 = 25 V 5 = 50 V 1 = 100 V 2 = 200 V A = 250 V R = X7R 2 Significant Digits + Number of Zeros J = 5% K = 10% M = 20% A C TU Failure Rate/ Termination Finish1 Design A = N/A C = 100% Matte Sn L = SnPb (5% minimum) Packaging/Grade (C-Spec)2 Blank = Bulk TU = 7" Reel Unmarked TM = 7" Reel Marked AUTO = Automotive Grade 7" Reel Unmarked Additional termination finish options may be available. Contact KEMET for details. SnPb termination finish option is not available on automotive grade product. 2 Additional reeling or packaging options may be available. Contact KEMET for details. 1 1,2 One world. One KEMET (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1015_X7R_FF-CAP_SMD * 2/27/2013 1 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Dimensions - Millimeters (Inches) L W B T S Metric Size Code L Length W Width B Bandwidth S Separation Minimum 0603 1608 1.60 (.064) 0.17 (.007) 0.80 (.032) 0.15 (.006) 0.45 (.018) 0.15 (.006) 0.58 (.023) 0805 2012 2.00 (.079) 0.20 (.008) 1.25 (.049) 0.20 (.008) 0.50 (0.02) 0.25 (.010) 0.75 (.030) 1206 3216 3.30 (.130) 0.40 (.016) 1.60 (.063) 0.20 (.008) 1210 3225 3.30 (.130) 0.40 (.016) 2.50 (.098) 0.20 (.008) See Table 2 for 0.60 (.024) 0.25 (.010) Thickness 0.60 (.024) 0.25 (.010) 1812 4532 4.50 (.178) 0.40 (.016) 3.20 (.126) 0.30 (.012) 0.70 (.028) 0.35 (.014) T Thickness Benefits * * * * * * * -55C to +125C operating temperature range Superior flex performance (up to 5 mm) Floating Electrode/fail open design Low to mid capacitance flex mitigation Pb-Free and RoHS Compliant EIA 0603, 0805, 1206, 1210, and 1812 case sizes DC voltage ratings of 6.3 V, 10 V, 16 V, 25 V, 50 V, 100 V, 200 V, and 250 V * * * * * N/A Mounting Technique Solder Wave or Solder Reflow Solder Reflow Only Ceramic Surface Mount EIA Size Code Capacitance offerings ranging from 180 pF to 0.22 F Available capacitance tolerances of 5%, 10%, and 20% Commercial & Automotive (AEC-Q200) grades available Non-polar device, minimizing installation concerns 100% pure matte tin-plated termination finish allowing for excellent solderability * SnPb termination finish option available upon request (5% minimum) Applications Typical applications include circuits with a direct battery or power source connection, critical and safety relevant circuits without (integrated) current limitation and any application that is subject to high levels of board flexure or temperature cycling. Examples include raw power input side filtering (power plane/bus), high current applications (automobile battery line) and circuits that cannot be fused to open. Markets include consumer, medical, industrial (power supply), automotive, aerospace and telecom. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1015_X7R_FF-CAP_SMD * 2/27/2013 2 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Qualification/Certification Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance & Reliability. Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC-Q200, Stress Test Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC-Q200, please visit their website at www.aecouncil.com. Environmental Compliance Pb-Free and RoHS Compliant (excluding SnPb termination finish option). Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range -55C to +125C Capacitance Change with Reference to +25C and 0 VDC Applied (TCC) 15% Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0% Dielectric Withstanding Voltage Dissipation Factor (DF) Maximum Limit @ 25C Insulation Resistance (IR) Limit @ 25C 250% of rated voltage (5 1 seconds and charge/discharge not exceeding 50 mA) 5% (6.3 and 10 V), 3.5% (16 and 25 V) and 2.5% (50 to 250 V) See Insulation Resistance Limit Table (Rated voltage applied for 120 5 seconds @ 25C) Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours. To obtain IR limit, divide M-F value by the capacitance and compare to G limit. Select the lower of the two limits. Capacitance and dissipation factor (DF) measured under the following conditions: 1 kHz 50 Hz and 1.0 0.2 Vrms if capacitance 10 F 120 Hz 10 Hz and 0.5 0.1 Vrms if capacitance > 10 F Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1015_X7R_FF-CAP_SMD * 2/27/2013 3 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Rated DC Voltage Dielectric Capacitance Value Dissipation Factor (Maximum %) > 25 X7R 16/25 Capacitance Shift Insulation Resistance 20% 10% of Initial Limit 3.0 All 5.0 < 16 7.5 Insulation Resistance Limit Table (X7R Dielectric) EIA Case Size 1,000 Megohm Microfarads or 100 G 500 Megohm Microfarads or 10 G 0201 N/A ALL 0402 < 0.012 F 0.012 F 0603 < 0.047 F 0.047 F 0805 < 0.047 F 0.047 F 1206 < 0.22 F 0.22 F 1210 < 0.39 F 0.39 F 1808 ALL N/A 1812 < 2.2 F 2.2 F 1825 ALL N/A 2220 < 10 F 10 F 2225 ALL N/A (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1015_X7R_FF-CAP_SMD * 2/27/2013 4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Table 1A - Capacitance Range/Selection Waterfall (0603 - 0805 Case Sizes) 200 250 CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DG DG DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DG DG DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DG DG DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DG DG DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DG DG DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC Voltage DC 250 50 CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB 200 25 100 16 CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB 100 10 CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB 50 6.3 CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB 25 A 16 2 10 1 6.3 5 200 25 3 100 16 4 50 10 8 200 Cap Code J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J 9 100 Capacitance 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 2 CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB Voltage Code 9 8 4 3 5 1 2 9 8 4 3 5 1 2 A Capacitance Tolerance 180 pF 220 pF 270 pF 330 pF 390 pF 470 pF 560 pF 680 pF 820 pF 1,000 pF 1,200 pF 1,500 pF 1,800 pF 2,200 pF 2,700 pF 3,300 pF 3,900 pF 4,700 pF 5,600 pF 6,800 pF 8,200 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 F 1 50 Voltage DC C0805Y 5 25 3 16 4 10 Cap Code 8 6.3 Capacitance C0603Y 9 6.3 Series Voltage Code K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K Series M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions C0603Y (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com Roll Over for Order Info. C0805Y C1015_X7R_FF-CAP_SMD * 2/27/2013 5 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Table 1B - Capacitance Range/Selection Waterfall (1206 - 1812 Case Sizes) 250 A GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB 250 2 200 1 200 5 100 3 100 A 50 2 50 1 25 5 25 3 A 3 5 1 2 A 250 4 250 100 8 200 50 1 2 FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC A 9 8 4 C1206Y FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FD FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC 200 5 FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC 100 3 FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC 50 EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB 25 4 EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB 16 8 EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EB 10 9 Series EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC 6.3 Voltage DC Voltage Code EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC 250 EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC 200 EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC 100 M M M M M M M M M M M M M M M M M M M M M M M M M M M M M 9 100 25 K K K K K K K K K K K K K K K K K K K K K K K K K K K K K 50 Cap Code J J J J J J J J J J J J J J J J J J J J J J J J J J J J J 25 Capacitance EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC 16 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 10 1,000 pF 1,200 pF 1,500 pF 1,800 pF 2,200 pF 2,700 pF 3,300 pF 3,900 pF 4,700 pF 5,600 pF 6,800 pF 8,200 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 F 0.12 F 0.15 F 0.18 F 0.22 F A Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions 6.3 Capacitance Tolerance 2 50 1 25 5 16 3 10 4 C1812Y 6.3 8 250 9 Voltage DC 200 Voltage Code 16 Cap Code C1210Y 10 Capacitance C1206Y 6.3 Series 3 5 1 2 C1210Y C1812Y Table 2 - Chip Thickness/Packaging Quantities Paper Quantity Plastic Quantity Thickness Code Case Size Thickness Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel CB DC DD DG EB EC FB FC FD GB 0603 0805 0805 0805 1206 1206 1210 1210 1210 1812 0.80 0.07 0.78 0.10 0.90 0.10 1.25 0.15 0.78 0.10 0.90 0.10 0.78 0.10 0.90 0.10 0.95 0.10 1.00 0.10 4,000 0 0 0 4,000 0 0 0 0 0 10,000 0 0 0 10,000 0 0 0 0 0 0 4,000 4,000 2,500 4,000 4,000 4,000 4,000 4,000 1,000 0 10,000 10,000 10,000 10,000 10,000 10,000 10,000 10,000 4,000 Thickness Code Case Size Thickness Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel Paper Quantity Plastic Quantity Package quantity based on finished chip thickness specifications. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com Roll Over for Order Info. C1015_X7R_FF-CAP_SMD * 2/27/2013 6 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Table 3 - Chip Capacitor Land Pattern Design Recommendations per IPC-7351 EIA Size Code Metric Size Code 0603 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 1608 0.85 1.25 1.10 4.00 2.10 0.75 1.05 1.00 3.10 1.50 0.65 0.85 0.90 2.40 1.20 0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.80 0.95 1.35 2.80 1.70 1206 3216 1.60 1.65 1.90 5.90 2.90 1.50 1.45 1.80 5.00 2.30 1.40 1.25 1.70 4.30 2.00 1210 3225 1.60 1.65 2.80 5.90 3.80 1.50 1.45 2.70 5.00 3.20 1.40 1.25 2.60 4.30 2.90 1812 4532 2.10 1.80 3.60 7.00 4.60 2.00 1.60 3.50 6.10 4.00 1.90 1.40 3.40 5.40 3.70 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC-7351). Soldering Process Recommended Soldering Technique: * Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 * All other EIA case sizes are limited to solder reflow only Recommended Soldering Profile: * KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020 (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1015_X7R_FF-CAP_SMD * 2/27/2013 7 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Table 4 - Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS-C-6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds. Board Flex JIS-C-6429 Appendix 2, Note: Standard termination system - 2.0 mm (minimum) for all except 3 mm for C0G. Flexible termination system - 3.0 mm (minimum). Magnification 50 X. Conditions: Solderability J-STD-002 a) Method B, 4 hours @ 155C, dry heat @ 235C b) Method B @ 215C category 3 c) Method D, category 3 @ 260C Temperature Cycling JESD22 Method JA-104 Biased Humidity MIL-STD-202 Method 103 Moisture Resistance MIL-STD-202 Method 106 1,000 Cycles (-55C to +125C). Measurement at 24 hours +/- 2 hours after test conclusion. Load Humidity: 1,000 hours 85C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement at 24 hours +/- 2 hours after test conclusion. Low Volt Humidity: 1,000 hours 85C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours +/- 2 hours after test conclusion. t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered. Measurement at 24 hours +/- 2 hours after test conclusion. -55C/+125C. Note: Number of cycles required - 300, maximum transfer time - 20 seconds, dwell time - 15 minutes. Air - Air. Thermal Shock MIL-STD-202 Method 107 High Temperature Life MIL-STD-202 Method 108 /EIA-198 Storage Life MIL-STD-202 Method 108 150C, 0 VDC for 1,000 hours. Vibration MIL-STD-202 Method 204 5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10 - 2,000 Hz Mechanical Shock MIL-STD-202 Method 213 Figure 1 of Method 213, Condition F. Resistance to Solvents MIL-STD-202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent. 1,000 hours at 125C (85C for X5R, Z5U and Y5V) with 2 X rated voltage applied. Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature- reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40C and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1015_X7R_FF-CAP_SMD * 2/27/2013 8 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Construction Reference A B C D Item Material Finish Termination Barrier Layer System Epoxy Layer Base Metal 100% Matte Sn SnPb (5% min) Ni Ag Cu E Inner Electrode Ni F Dielectric Material BaTiO3 Note: Image is exaggerated in order to clearly identify all components of construction. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1015_X7R_FF-CAP_SMD * 2/27/2013 9 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Capacitor Marking (Optional): These surface mount multilayer ceramic capacitors are normally supplied unmarked. If required, they can be marked as an extra cost option. Marking is available on most KEMET devices but must be requested using the correct ordering code identifier(s). If this option is requested, two sides of the ceramic body will be laser marked with a "K" to identify KEMET, followed by two characters (per EIA-198 - see table below) to identify the capacitance value. EIA 0603 case size devices are limited to the "K" character only. Marking appears in legible contrast. Illustrated below is an example of an MLCC with laser marking of "KA8", which designates a KEMET device with rated capacitance of 100 F. Orientation of marking is vendor optional. _ KA8 Laser marking option is not available on: * C0G, Ultra Stable X8R and Y5V dielectric devices * EIA 0402 case size devices * EIA 0603 case size devices with Flexible Termination option. * KPS Commercial and Automotive Grade stacked devices. Alpha Character 9 Capacitance (pF) For Various Alpha/Numeral Identifiers Numeral 0 1 2 3 4 5 6 7 8 100,000,000 Capacitance (pF) A 0.1 10 10 100 1,000 10,000 100,000 1,000,000 10,000,000 B 0.11 1.1 11 110 1,100 11,000 110,000 1,100,000 11,000,000 110,000,000 C 0.12 12 12 120 1,200 12,000 120,000 1,200,000 12,000,000 120,000,000 D 0.13 13 13 130 1,300 13,000 130,000 1,300,000 13,000,000 130,000,000 E 0.15 15 15 150 1,500 15,000 150,000 1,500,000 15,000,000 150,000,000 160,000,000 F 0.16 16 16 160 1,600 16,000 160,000 1,600,000 16,000,000 G 0.18 18 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000 H 0.2 20 20 200 2,000 20,000 200,000 2,000,000 20,000,000 200,000,000 J 0.22 22 22 220 2,200 22,000 220,000 2,200,000 22,000,000 220,000,000 K 0.24 2.4 24 240 2,400 24,000 240,000 2,400,000 24,000,000 240,000,000 L 0.27 2.7 27 270 2,700 27,000 270,000 2,700,000 27,000,000 270,000,000 M 0.3 30 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000 N 0.33 33 33 330 3,300 33,000 330,000 3,300,000 33,000,000 330,000,000 P 0.36 36 36 360 3,600 36,000 360,000 3,600,000 36,000,000 360,000,000 Q 0.39 39 39 390 3,900 39,000 390,000 3,900,000 39,000,000 390,000,000 R 0.43 43 43 430 4,300 43,000 430,000 4,300,000 43,000,000 430,000,000 S 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 470,000,000 T 0.51 5.1 51 510 5,100 51,000 510,000 5,100,000 51,000,000 510,000,000 U 0.56 56 56 560 5,600 56,000 560,000 5,600,000 56,000,000 560,000,000 V 0.62 62 62 620 6,200 62,000 620,000 6,200,000 62,000,000 620,000,000 W 0.68 68 68 680 6,800 68,000 680,000 6,800,000 68,000,000 680,000,000 X 0.75 75 75 750 7,500 75,000 750,000 7,500,000 75,000,000 750,000,000 Y 0.82 82 82 820 8,200 82,000 820,000 8,200,000 82,000,000 820,000,000 Z 0.91 9.1 91 910 9,100 91,000 910,000 9,100,000 91,000,000 910,000,000 a 0.25 25 25 250 2,500 25,000 250,000 2,500,000 25,000,000 250,000,000 b 0.35 35 35 350 3,500 35,000 350,000 3,500,000 35,000,000 350,000,000 d 0.4 40 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000 e 0.45 45 45 450 4,500 45,000 450,000 4,500,000 45,000,000 450,000,000 f 0.5 50 50 500 5,000 50,000 500,000 5,000,000 50,000,000 500,000,000 m 0.6 60 60 600 6,000 60,000 600,000 6,000,000 60,000,000 600,000,000 n 0.7 70 70 700 7,000 70,000 700,000 7,000,000 70,000,000 700,000,000 t 0.8 80 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000 y 0.9 90 90 900 9,000 90,000 900,000 9,000,000 90,000,000 900,000,000 (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1015_X7R_FF-CAP_SMD * 2/27/2013 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar Code Label Anti-Static Reel (R) Embossed Plastic* or Punched Paper Carrier. ET KEM Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 and 2225 Military) Sprocket Holes Embossment or Punched Cavity 8 mm, 12 mm or 16 mm Carrier Tape 178 mm (7.00") or 330 mm (13.00") Anti-Static Cover Tape (.10 mm (.004") Maximum Thickness) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 - Carrier Tape Configuration - Embossed Plastic & Punched Paper (mm) EIA Case Size Tape Size (W)* Pitch (P1)* 01005 - 0402 8 2 0603 - 1210 8 4 1805 - 1808 12 4 1812 12 8 KPS 1210 12 8 KPS 1812 & 2220 16 12 Array 0508 & 0612 8 4 *Refer to Figures 1 & 2 for W and P1 carrier tape reference locations. *Refer to Tables 6 & 7 for tolerance specifications. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1015_X7R_FF-CAP_SMD * 2/27/2013 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Figure 1 - Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ODo [10 pitches cumulative tolerance on tape 0.2 mm] Po E1 Ao F Ko W B1 E2 Bo S1 P1 T1 Center Lines of Cavity OD 1 Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o. Embossment For cavity size, see Note 1 Table 4 User Direction of Unreeling Table 6 - Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions -- Millimeters (Inches) Tape Size D0 8 mm 12 mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) 16 mm D1 Minimum Note 1 1.0 (0.039) 1.5 (0.059) E1 P0 1.75 0.10 (0.069 0.004) 4.0 0.10 (0.157 0.004) R Reference S1 Minimum Note 2 Note 3 25.0 (0.984) 2.0 0.05 0.600 (0.079 0.002) (0.024) 30 (1.181) P2 T Maximum T1 Maximum 0.600 (0.024) 0.100 (0.004) Variable Dimensions -- Millimeters (Inches) Tape Size Pitch 8 mm Single (4 mm) 12 mm Single (4 mm) & Double (8 mm) 16 mm Triple (12 mm) B1 Maximum Note 4 4.35 (0.171) 8.2 (0.323) 12.1 (0.476) E2 Minimum 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) F P1 3.5 0.05 (0.138 0.002) 5.5 0.05 (0.217 0.002) 7.5 0.05 (0.138 0.002) 4.0 0.10 (0.157 0.004) 8.0 0.10 (0.315 0.004) 12.0 0.10 (0.157 0.004) T2 Maximum 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) W Maximum 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) A0,B0 & K0 Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20 maximum for 8 and 12 mm tapes and 10 maximum for 16 mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4). (e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1015_X7R_FF-CAP_SMD * 2/27/2013 12 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Figure 2 - Punched (Paper) Carrier Tape Dimensions P2 T Po ODo [10 pitches cumulative tolerance on tape 0.2 mm] E1 A0 F P1 T1 T1 Top Cover Tape W E2 B0 Bottom Cover Tape G Cavity Size, See Note 1, Table 7 Center Lines of Cavity Bottom Cover Tape User Direction of Unreeling Table 7 - Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions -- Millimeters (Inches) Tape Size D0 E1 P0 P2 T1 Maximum G Minimum 8 mm 1.5 +0.10 -0.0 (0.059 +0.004 -0.0) 1.75 0.10 (0.069 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) 0.10 (0.004) Maximum 0.75 (0.030) R Reference Note 2 25 (0.984) T Maximum W Maximum A0 B 0 1.1 (0.098) 8.3 (0.327) 8.3 (0.327) Variable Dimensions -- Millimeters (Inches) Tape Size Pitch 8 mm Half (2 mm) 8 mm Single (4 mm) E2 Minimum 6.25 (0.246) F 3.5 0.05 (0.138 0.002) P1 2.0 0.05 (0.079 0.002) 4.0 0.10 (0.157 0.004) Note 1 1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20 maximum (see Figure 3). d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6). (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1015_X7R_FF-CAP_SMD * 2/27/2013 13 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 - Maximum Component Rotation T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Width (mm) 8,12 16 - 200 Bo Maximum Rotation ( 20 10 T) Typical Component Centerline Ao Figure 4 - Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum 16 mm Tape s Tape Maximum Width (mm) Rotation ( 8,12 20 16 - 56 10 72 - 200 5 S) Figure 5 - Bending Radius Embossed Carrier Punched Carrier 1.0 mm maximum 1.0 mm maximum R Bending Radius (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com R C1015_X7R_FF-CAP_SMD * 2/27/2013 14 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Figure 6 - Reel Dimensions Full Radius, See Note W3 (Includes Access Hole at Slot Location (O 40 mm minimum) flange distortion at outer edge) W2 (Measured at hub) D A N (See Note) C (Arbor hole diameter) B (see Note) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 - Reel Dimensions Metric will govern Constant Dimensions -- Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 0.20 (7.008 0.008) or 330 0.20 (13.000 0.008) 1.5 (0.059) 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) 20.2 (0.795) 12 mm 16 mm Variable Dimensions -- Millimeters (Inches) Tape Size N Minimum W1 W2 Maximum W3 50 (1.969) 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) Shall accommodate tape width without interference 8 mm 12 mm 16 mm (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1015_X7R_FF-CAP_SMD * 2/27/2013 15 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Figure 7 - Tape Leader & Trailer Dimensions Embossed Carrier Carrier Tape Punched Carrier 8 mm & 12 mm only END Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm Minimum Components 100 mm Minimum Leader 400 mm Minimum Top Cover Tape Figure 8 - Maximum Camber Elongated sprocket holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm Maximum, either direction Straight Edge 250 mm (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1015_X7R_FF-CAP_SMD * 2/27/2013 16 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) KEMET Corporation World Headquarters Europe Asia Southern Europe Paris, France Tel: 33-1-4646-1006 Northeast Asia Hong Kong Tel: 852-2305-1168 Mailing Address: P.O. Box 5928 Greenville, SC 29606 Sasso Marconi, Italy Tel: 39-051-939111 Shenzhen, China Tel: 86-755-2518-1306 www.kemet.com Tel: 864-963-6300 Fax: 864-963-6521 Central Europe Landsberg, Germany Tel: 49-8191-3350800 Corporate Offices Fort Lauderdale, FL Tel: 954-766-2800 Kamen, Germany Tel: 49-2307-438110 North America Northern Europe Bishop's Stortford, United Kingdom Tel: 44-1279-460122 2835 KEMET Way Simpsonville, SC 29681 Southeast Lake Mary, FL Tel: 407-855-8886 Espoo, Finland Tel: 358-9-5406-5000 Northeast Wilmington, MA Tel: 978-658-1663 Beijing, China Tel: 86-10-5829-1711 Shanghai, China Tel: 86-21-6447-0707 Taipei, Taiwan Tel: 886-2-27528585 Southeast Asia Singapore Tel: 65-6586-1900 Penang, Malaysia Tel: 60-4-6430200 Bangalore, India Tel: 91-806-53-76817 Central Novi, MI Tel: 248-994-1030 West Milpitas, CA Tel: 408-433-9950 Mexico Guadalajara, Jalisco Tel: 52-33-3123-2141 Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of KEMET Electronics Corporation. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1015_X7R_FF-CAP_SMD * 2/27/2013 17 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Other KEMET Resources Tools Resource Location Configure A Part: CapEdge http://capacitoredge.kemet.com SPICE & FIT Software http://www.kemet.com/spice Search Our FAQs: KnowledgeEdge http://www.kemet.com/keask Electrolytic LifeCalculator http://www.kemet.com:8080/elc Product Information Resource Location Products Technical Resources (Including Soldering Techniques) RoHS Statement Quality Documents http://www.kemet.com/products http://www.kemet.com/technicalpapers http://www.kemet.com/rohs http://www.kemet.com/qualitydocuments Product Request Resource Location Sample Request Engineering Kit Request http://www.kemet.com/sample http://www.kemet.com/kits Contact Resource Location Website Contact Us Investor Relations www.kemet.com http://www.kemet.com/contact http://www.kemet.com/ir Call Us 1-877-MyKEMET Twitter http://twitter.com/kemetcapacitors Disclaimer All product specifications, statements, information and data (collectively, the "Information") are subject to change without notice. All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute - and we specifically disclaim - any warranty concerning suitability for a specific customer application or use. This Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained. Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not be required. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1015_X7R_FF-CAP_SMD * 2/27/2013 18 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade) Digitally signed by Jeannette Calvo DN: c=US, st=FL, l=Fort Lauderdale, o=KEMET Corp., ou=Marketing Communications, cn=Jeannette Calvo, email=jeannettecalvo@kemet.com Date: 2013.03.12 14:59:06 -04'00' (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1015_X7R_FF-CAP_SMD * 2/27/2013 19