DATA SH EET
Product specification 2003 Apr 01
DISCRETE SEMICONDUCTORS
BZA800AVL series
Quadruple low capacitance ESD
suppressor
b
ook, halfpage
MBD127
2003 Apr 01 2
Philips Semiconductors Product specification
Quadruple low capacitance ESD suppressor BZA800AVL series
FEATURES
•Low diode capacitance
•Low leakage current
•SOT353 (SC-88A) surface mount package
•Common anode configuration.
APPLICATIONS
•Communication systems
•Computers and peripherals
•Audio and video equipment.
DESCRIPTION
Monolithictransientvoltagesuppressordiodeinafivelead
SOT353 (SC-88A) package for 4-bit wide ESD transient
suppression.
MARKING
PINNING
TYPE NUMBER MARKING CODE
BZA856AVL R3
BZA862AVL R2
BZA868AVL R1
PIN DESCRIPTION
1 cathode 1
2 common anode
3 cathode 2
4 cathode 3
5 cathode 4
handbook, halfpage
MGT580
3
1
5
4
32
1
4
5
2
Fig.1 Simplified outline (SOT353; SC-88A) and
symbol.
2003 Apr 01 3
Philips Semiconductors Product specification
Quadruple low capacitance ESD suppressor BZA800AVL series
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. DC working current limited by Ptot(max).
2. Device mounted on standard printed-circuit board.
ESD STANDARDS COMPLIANCE
THERMAL CHARACTERISTICS
Note
1. Solder point of common anode (pin 2).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Per diode
IZworking current Tamb =25°C−note 1 mA
IFcontinuous forward current Tamb =25°C−200 mA
IFSM non-repetitive peak forward current tp= 1 ms; square pulse −3.5 A
Ptot total power dissipation Tamb =25°C; note 2; see Fig.5 −300 mW
PZSM non repetitive peak reverse power
dissipation square pulse; tp=1ms −6W
T
stg storage temperature −65 +150 °C
Tjjunction temperature −150 °C
ESD electrostatic discharge IEC 61000-4-2 (contact discharge) 30 −kV
HBM MIL-Std 883 10 −kV
STANDARD CONDITIONS
IEC 61000-4-2, level 4 (ESD) >15 kV (air); >8 kV (contact discharge)
HBM MIL-Std 883, class 3 >4 kV
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Rth j-a thermal resistance from junction to
ambient all diodes loaded 410 K/W
Rth j-s thermal resistance from junction to
solder point; note 1 one diode loaded 200 K/W
all diodes loaded 185 K/W
2003 Apr 01 4
Philips Semiconductors Product specification
Quadruple low capacitance ESD suppressor BZA800AVL series
ELECTRICAL CHARACTERISTICS
Tj=25°C unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VFforward voltage IF= 200 mA −−1.2 V
IRreverse current
BZA856AVL VR=3V −−200 nA
BZA862AVL VR=4V −−100 nA
BZA868AVL VR= 4.3 V −−20 nA
VZworking voltage IZ=1mA
BZA856AVL 5.32 5.6 5.88 V
BZA862AVL 5.89 6.2 6.51 V
BZA868AVL 6.46 6.8 7.14 V
rdif differential resistance IZ=1mA
BZA856AVL −−200 Ω
BZA862AVL −−150 Ω
BZA868AVL −−100 Ω
SZtemperature coefficient IZ=1mA
BZA856AVL −1.3 −mV/K
BZA862AVL −2.4 −mV/K
BZA868AVL −2.9 −mV/K
Cddiode capacitance f = 1 MHz; VR=0
BZA856AVL −22 28 pF
BZA862AVL −18 22 pF
BZA868AVL −16 19 pF
diode capacitance f = 1 MHz; VR=5V
BZA856AVL −12 17 pF
BZA862AVL −912pF
BZA868AVL −811pF
I
ZSM non-repetitive peak reverse current tp= 1 ms; Tamb =25°C
BZA856AVL −−0.90 A
BZA862AVL −−0.85 A
BZA868AVL −−0.80 A
2003 Apr 01 5
Philips Semiconductors Product specification
Quadruple low capacitance ESD suppressor BZA800AVL series
handbook, halfpage
10
1
10−1
MLD997
10−210−11tp (ms)
IZSM
(A)
10
BZA856AVL
BZA862AVL/BZA868AVL
Fig.2 Maximum non-repetitive peak reverse
current as a function of pulse time.
handbook, halfpage
10
1
102
MLD999
10−210−11tp (ms)
PZSM
(W)
10
BZA862AVL
BZA856AVL
BZA868AVL
Fig.3 Maximum non-repetitive peak reverse
power dissipation as a function of pulse
duration (square pulse).
handbook, halfpage
05
26
6
10
14
18
22
1234
V
R
(V)
Cd
(pF)
MLD998
BZA862AVL
BZA868AVL
BZA856AVL
Fig.4 Diode capacitance as a function of reverse
voltage; typical values.
Tj=25°C; f = 1 MHz.
handbook, halfpage
050 T
amb (°C)
Ptot
(mW)
100 150
400
300
100
0
200
MLD793
Fig.5 Power derating curve.
2003 Apr 01 6
Philips Semiconductors Product specification
Quadruple low capacitance ESD suppressor BZA800AVL series
handbook, full pagewidth
MLE004
450 Ω
50 Ω
Note 1: attenuator is only used for open
socket high voltage measurements
IEC 1000-4-2 network
CZ = 150 pF; RZ = 330 Ω1/4 BZA800AVL
RG 223/U
50 Ω coax
RZ
CZ
ESD TESTER DIGITIZING
OSCILLOSCOPE
10×
ATTENUATOR
note 1
GND GND1
GND2
GND3
GND
GND
unclamped +1 kV ESD voltage waveform
(IEC 1000-4-2 network) clamped +1 kV ESD voltage waveform
(IEC 1000-4-2 network)
unclamped −1 kV ESD voltage waveform
(IEC 1000-4-2 network) clamped −1 kV ESD voltage waveform
(IEC 1000-4-2 network)
vertical scale = 5 V/div
horizontal scale = 50 ns/div
BZA868AVL
BZA862AVL
BZA856AVL
vertical scale = 200 V/div
horizontal scale = 50 ns/div
vertical scale = 200 V/div
horizontal scale = 50 ns/div vertical scale = 5 V/div
horizontal scale = 50 ns/div
Fig.6 ESD clamping test set-up and waveforms.
2003 Apr 01 7
Philips Semiconductors Product specification
Quadruple low capacitance ESD suppressor BZA800AVL series
APPLICATION INFORMATION
Typical common anode application
A quadruple transient suppressor in a SOT353 package makes it possible to protect four separate lines using only one
package. Two simplified examples are shown in Figs.7 and 8.
handbook, full pagewidth
GND
keyboard,
terminal,
printer,
etc. I/O
BZA800AVL
A
B
C
D
FUNCTIONAL
DECODER
MLE006
Fig.7 Computer interface protection.
handbook, full pagewidth
MLE007
I/O
ROM
RAM
CPU
CLOCK
GND
VDD
VGG
data bus
control bus
address bus
BZA800AVL
Fig.8 Microprocessor protection.
2003 Apr 01 8
Philips Semiconductors Product specification
Quadruple low capacitance ESD suppressor BZA800AVL series
Device placement and printed-circuit board layout
Circuit board layout is of extreme importance in the
suppression of transients. The clamping voltage of the
BZA800AVL is determined by the peak transient current
and the rate of rise of that current (di/dt). Since parasitic
inductances can further add to the clamping voltage
(V = L di/dt) the series conductor lengths on the
printed-circuit board should be kept to a minimum. This
includes the lead length of the suppression element.
In addition to minimizing conductor length the following
printed-circuit board layout guidelines are recommended:
1. Place the suppression element close to the input
terminals or connectors
2. Keep parallel signal paths to a minimum
3. Avoid running protection conductors in parallel with
unprotected conductors
4. Minimize all printed-circuit board loop areas including
power and ground loops
5. Minimize the length of the transient return path to
ground
6. Avoidusingsharedtransientreturnpathstoacommon
ground point.
2003 Apr 01 9
Philips Semiconductors Product specification
Quadruple low capacitance ESD suppressor BZA800AVL series
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT353
wBM
b
p
D
e
1
e
A
A
1
L
p
Q
detail X
HE
E
vMA
AB
y
0 1 2 mm
scale
c
X
132
45
Plastic surface mounted package; 5 leads SOT353
UNIT A1
max bpcD
E (2) e1HELpQywv
mm 0.1 0.30
0.20 2.2
1.8
0.25
0.10 1.35
1.15 0.65
e
1.3 2.2
2.0 0.2 0.10.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15 0.25
0.15
A
1.1
0.8
97-02-28SC-88A
2003 Apr 01 10
Philips Semiconductors Product specification
Quadruple low capacitance ESD suppressor BZA800AVL series
DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
LEVEL DATA SHEET
STATUS(1) PRODUCT
STATUS(2)(3) DEFINITION
I Objective data Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III Product data Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseoratanyotherconditionsabovethosegiveninthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentation orwarrantythatsuch applicationswillbe
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomersusingorsellingtheseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
2003 Apr 01 11
Philips Semiconductors Product specification
Quadruple low capacitance ESD suppressor BZA800AVL series
NOTES
© Koninklijke Philips Electronics N.V. 2003 SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Philips Semiconductors – a world wide company
Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
Printed in The Netherlands 613514/01/pp12 Date of release: 2003 Apr 01 Document order number: 9397 750 10886
