EB52W4C30N-32.768M EB52W4 C 30 N -32.768M Series 3.3Vdc LVCMOS PCB SMD TCXO Operating Temperature Range -20C to +70C Nominal Frequency 32.768MHz Control Voltage None (No Connect on Pin 1) Frequency Stability 3.0ppm Maximum ELECTRICAL SPECIFICATIONS Nominal Frequency 32.768MHz Frequency Stability 3.0ppm Maximum (Inclusive of Operating Temperature Range) Frequency Stability vs. Input Voltage 0.3ppm Maximum (5%) Aging at 25C 1ppm/Year Maximum Frequency Stability vs. Load 0.2ppm Maximum (2pF) Operating Temperature Range -20C to +70C Supply Voltage 3.3Vdc 5% Input Current 35mA Maximum Output Voltage Logic High (Voh) 90% of Vdd Minimum Output Voltage Logic Low (Vol) 10% of Vdd Maximum Rise/Fall Time 10nSec Maximum (Measured at 20% to 80% of waveform) Duty Cycle 50% 10% (Measured at 50% of waveform) Load Drive Capability 15pF Maximum Output Logic Type CMOS Control Voltage None (No Connect on Pin 1) Internal Trim 3ppm Minimum (Top of Can) Modulation Bandwidth 10kHz Minimum (Measured at -3dB with a Control Voltage of 1.65Vdc) Input Impedance 10kOhms Typical Phase Noise -70dBc at 10Hz Offset, -100dBc at 100Hz Offset, -130dBc at 1kHz Offset, -140dBc at 10kHz Offset, 145dBc at 100kHz Offset (Typical Values Fo=19.200MHz at 25C at Nominal Vdd and Vc) Storage Temperature Range -40C to +85C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS Fine Leak Test MIL-STD-883, Method 1014 Condition A (Internal Crystal Only) Gross Leak Test MIL-STD-883, Method 1014 Condition C (Internal Crystal Only) Lead Integrity MIL-STD-883, Method 2004 Mechanical Shock MIL-STD-202, Method 213 Condition C Resistance to Soldering Heat MIL-STD-202, Method 210 Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010 Vibration MIL-STD-883, Method 2007 Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 1 of 4 EB52W4C30N-32.768M MECHANICAL DIMENSIONS (all dimensions in millimeters) 1.5 0.3 DIA 3.5 0.5 4.5 0.3 1.7 0.4 4.0 0.3 4 3 11.7 0.5 PIN CONNECTION 1 No Connect 2 Ground 3 Output 4 Supply Voltage LINE MARKING 7.62 0.30 4.0 0.3 1 ECLIPTEK 2 32.768M M=MHz 3 XXYZZ XX=Ecliptek Manufacturing Code Y=Last Digit of the Year ZZ=Week of the Year 1 2 1.0 0.1 18.3 0.5 21.3 0.5 Suggested Solder Pad Layout All Dimensions in Millimeters 1.6 (X4) 3.5 (X4) Solder Land (X4) 14.8 5.9 All Tolerances are 0.1 CLOCK OUTPUT OUTPUT WAVEFORM VOH 80% of Waveform 50% of Waveform 20% of Waveform VOL Fall Time Rise Time TW T Duty Cycle (%) = TW/T x 100 www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 2 of 4 EB52W4C30N-32.768M Test Circuit for CMOS Output Frequency Counter Oscilloscope + + Power Supply _ Current Meter _ Supply Voltage (VDD) Probe (Note 2) Output + Voltage Meter _ 0.01F (Note 1) 0.1F (Note 1) Ground CL (Note 3) No Connect or Tri-State Note 1: An external 0.1F low frequency tantalum bypass capacitor in parallel with a 0.01F high frequency ceramic bypass capacitor close to the package ground and VDD pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 3 of 4 EB52W4C30N-32.768M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 240C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 5C/second Maximum N/A 150C N/A 60 - 120 Seconds 5C/second Maximum 150C 200 Seconds Maximum 240C Maximum 240C Maximum 1 Time / 230C Maximum 2 Times 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time 5C/second Maximum N/A Level 1 Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 4 of 4