SILICON POWER CUBE CORP 20E D M@ 4253906 o000e08 1 35A-100A POWER ms eEOA FEATURES W@ Seven Standard Diode Circuits are available Single-Phase Bridge; 3-Phase Bridge; Diode eka Doubler; Center Tap Common Cathode; Center i Tap Common Anode; 3-Phase Common Cathode Half-Wave Bridge and 3-Phase Common Anode Half-Wave Bridge HM SPCs unitized power hybrid technology provides highly efficient thermal management for greatly expanded cyclic life Hi High terminal-to-base isolation of 2500VAC RMS Insulated terminal barrier available, M25E Ei =UL Component Recognition PARAMETER SYM. | UNITS |. SPECIFICATION LIMITS __ CONDITIONS . DC Output Current, 1 (Max.) lo A 35 60 100 Tc = 100C, Max. (Table 1) DC Output Current, 3 (Max.) lo A 50 60 100 Tc = 100C, Max. (Table 1) One-Cycle Surge Current (Peak) lism A 300 1000 2000 60Hz Sine Wave, Non-Repetitive (Fig. 2) (*t for Fusing (Max.) I*t AS 375 4150 | 16,700 | 60Hz Sine Wave Reverse Blocking Voltage (Max.) Varna Vv 200-1200 200-1600 Ty = 150C 3 Leakage Current (Max.) lan mA 3 5 Ts = 150C @ Varm & 18 1,25 14 omen iri Forward Voltage Drop (Max.) Ve Vv @ 100A @ 100A | @ 200A Ty = 28C (Fig. 3) Isolation Voltage (Min.) Viso. Vrms 2500 Any Terminal-to-Base Junction Operating Temp. (Range) Ts C 40 to +150 Storage Temperature (Range) Tste C 40 to +150 Thermal Resistance (Case-to-Sink) Rc-s C/W 0.1 0.07 With Thermal Grease Thermal Resistance Per Device (Table 1) (Junction-to-Case) Rs-c C/W 18 1.25 1.0 See page 55 for terminal derating curves 7 See pages 53 and 54 for circuit Case Style M25/M25E-R M50 configurations and outline dimensions Table 1 Thermal Resistance/Module and Maximum DC Output Current j Rs- (C/W) MAX. DC OUTPUT CURRENT (A) UIT E CIRC Tye M25, M25E SERIES M50 SERIES : M25, M25E SERIES M50 SERIES SB-R 0.45 0.31 0.25 35 60 100 TB 0.30 0.21 0.17 50 60 100 DD* 0.90 0.62 0,50 20 35 50 cc 0.90 0.62 0.50 35 60 100 CA 0.90 0.62 0.50 35 60 100 THC 0.60 0.42 0.33 50 60 100 7 THA 0.60 0.42 0.33 50 60 100 ue NOTE: Average current at 180 40SILICON POWER CUBE CORP 20 D mm 8253908 goo0207 0 mH [-Q3-0 PART NUMBER DESIGNATION CODE M25 50 TB 600R = aa CASE STYLE | f M25, M25E OR M50 BLOCKING VOLTAGE MAX. DC OUTPUT CURRENT 200V 4000V (See Table 1) 4cov 1200V CIRCUIT DESIGNATION ' 600V 1400V 800V 1600V CIRCUIT CONFIGURATIONS (See page 55 for characteristic curves) CIRCUIT CASE M25/M25E ; CASE M50 CIRCUIT TYPE |nesignaTion| CIRCUIT SCHEMATICS TERMINAL LOCATIONS TERMINAL LOCATIONS + AA SINGLE PHASE SB-R AGI RID oo GE AC2 x & + Pad THREE-PHASE AC1 ot a BRIDGE TB AC2 (see note) ac3*> TL AAA + DIODE DOUBLER DD AC C ACH CENTER TAP COMMON cc + CATHODE AC2 ACI CENTER TAP COMMON CA 2 ANOOE AC2 THREE PHASE AC1 opt COMMON CATHODE THC AG2 e_bt-+-> HALF WAVE + BRIDGE AC3 > THREE PHASE AC1 +q Woe COMMON ANODE THA AC2 4-7-2 HALF WAVE NOTE Add R at end of part number to reverse polarity of output terminals 4iSILICON POWER CUBE CORP | 8253908 oogge10 7 mT 23-09 125 OUTLINE/MOUNTING DIMENSIONS (See page 52 & 53 for product data) DIM. INCHES MILLIMETERS : MAX. | MIN. | MAX. | MIN. 5 A | 2510 | 2.490 | 63.80 | 63.20 B | 0510 | 0.490 | 13.00 | 12.40 Cc | 0.880 | 0.860 | 22.40 | 21.80 D | 1.255 | 1.245 | 31.90 | 31.60 E | 0.205 | 0.195 | 5.20 | 4.95 F | 1.010 | 0.940 | 25.60 | 23.90 G__| 0500 | 0.560 | 14.99 | 14.22 J L 031 x 250 H 1.970 | 1.940 | 50.00 | 49.30 | 4 [=] [] oe FASTONS J 7.930 | 1.900 | 49.00 | 48.20 F ppd K K | 0.067 | 0.057 | 1.70 | 1.44 } 8 4 MOUNTING TORQUE REQUIRED: T . (A) Mounting Screws ............ 20 in.-lbs. | M25E OUTLINE/MOUNTING DIMENSIONS Gase M25E, which features an insulated ter- minal barrir, can be substituted for case M25 as all electrical specifications are tdentical. DIM. INCHES MILLIMETERS MAX. | MIN. | MAX. | MIN. A_ | 2510 | 2.490 | 63.80 | 63.20 B_ | 0.610 | 0.490 | 13.00 | 12,40 c_ | 0.880 | 0.860 | 22.40 [ 21.80 D | 1.255 | 1.245 [31.90 | 31.60 - E | 0.205 | 0.195 | 5.20 | 4.95 F_ | 4.010 | 0.940 | 25.60 | 23.90 ~ G_| 0590 | ose0 | 14.99 | 14.22 H_ | 1.970 | 1.040 [ 30.00 | 49.30 iirfotiietin J | 4.930 | 1.900 [49.00 [48.20 | ribadiiyag fell | K 0.067 | 0.057 | 1.70 | 1.44 F pep ie ta Up a) L_ | 0.940 | 0.860 | 23.88 | 21.85 at ' b Vi e | m | 0.052 [ 0.048 | 1.92 | 1.22 Kd [ MOUNTING TORQUE REQUIRED: (A) Mounting Screws ............ 20 in.-Ibs. DIM. INCHES MILLIMETERS MAX. | MIN. | MAX. | MIN, A | 2300 | 2.240 | 58.4 | 56.9 B | 1.645 | 1.605 | 41.8 | 407 c | 1.085 | 1.055 | 276 | 268 D | 1.800 | 1.740 | 45.7 | 442 E | 0182 | 0172] 46 | 44 F | 4.140 | 1.100 | 29.0 | 27.9 G | 1.015 | 0.985 | 25.8 | 25.0 | | | H | 1.890 | 1.870 | 48.0 | 47.5 wd Li | | MOUNTING TORQUE REQUIRED: 3 4-1 (8) Terminal Studs (Screws Supilied, Unriounted) 80 ini. A 42C SILICON POWER CUBE CORP ede D Mmm 6253904 0000211 4 mT) 3-0OF CHARACTERISTIC CURVES (See page 52 & 53 for product data) 1800 = o 2 & 3 ae 1500 = s & ii 1200 fz : a4 900 oO $f oa 600 3 Aa > a5 a *O 300 ac x <x < = 2 0 ac 1 10 oo 60 PY 10 100 1000 NUMBER OF CYCLES AT 60Hz PEAK CURRENT (AMPS) FIGURE 2 MAX, NON-REPETITIVE SURGE FIGURE 3 FORWARD VOLTAGE DROP CURRENT VS. DURATION VS, CURRENT (@ 150C) THERMAL DERATING CURVES @ 150 | 126 @ 150 138 E & 2 ~ E 3S $ 125 S 3] 130 9 $ 125 140 2 = : & = P 5 100 LS 21 134 $ % 100 142 5 B 9 E E FE < 75 = 138 y < 76 144 wy G \ 17) a < 2 50 142 & 50 146 \\ bs) e 2 Ww 25 146 i 25 1485 2 o 150 2 0 150 0 20 40 60 80 10025 50 75 100 125 150 0 20 40 60 80 10025 50 75 100 125 150 LOAD GURRENT AMBIENT TEMP. (C) LOAD CURRENT AMBIENT TEMP. (C) FIGURE 4 THERMAL DERATING CURVES FIGURE 5 THERMAL DERATING CURVES M50100 (SINGLE PHASE) M50100 (THREE PHASE) aw 60 114 a 126 E = E 2 7 = 50 120 O $ a 130 9 = & S A z a Zz a 9 40 126 fi 5 134 ti < 30 132 w < 138 w B Q a g 2 2 138 @ 3 142 a Qa psd a D3 G 10 144 $ cc 146 3 = 2 o 150 Qo 9 150 0 10 20 30 40 50 25 50 75 100 125 150 0 10 20 30 40 50 25 50 75 100 125 150 LOAD GURRENT AMBIENT TEMP. (C) LOAO CURRENT AMBIENT TEMP. (C) FIGURE 6 THERMAL DERATING CURVES FIGURE 7 THERMAL DERATING CURVES M2535 (SB) M2550 (TB) g 160 85 a 60 E = = < 125 9 9 < 125 75 9 z a = & Zz 1 10 Z 100 90 6 "8 a < 75 118 w & 75 105 w a. ae Q a a wo as < a < a 80 Sow: 129 @ 50 120 a a & RS) Ds a > 26 we 140 3 25 135 = = Ss = 2 0 160 9 0 450 0 10 20 30 40 50 25 50 75 100 125 150 0 10 20 30 40 50 25 50 75 100 125 160 LOAD CURRENT AMBIENT TEMP. (C) LOAD CURRENT AMBIENT TEMP, (C) FIGURE 8 THERMAL DERATING CURVES FIGURE 9 THERMAL DERATING CURVES M5060 (SINGLE PHASE) M5060 (THREE PHASE) A EXAMPLE: Knowing maximum output current and maximum ambient temperature, use derating curves to determine required heat sink and maximum allowable base plate temperature. On left hand power dissipation curve, locate the point corresponding to maximum output current. Extend a line to the right from that point to the intersection of vertical line on right hand chart corresponding to maximum ambient temperature, From heat sink curve, read directly or extrapolate required heat sink size. Extend the line farther to the right and read on the tight hand scale the maximum ailowable base plate temperature, 43