IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL 32Mb Async/Page/Burst CellularRAM 1.5 Overview The IS66WVC2M16EALL/CLL is an integrated memory device containing 32Mbit Pseudo Static Random Access Memory using a self-refresh DRAM array organized as 2M words by 16 bits. The device includes several power saving modes : Reduced Array Refresh mode where data is retained in a portion of the array and Temperature Controlled Refresh. Both these modes reduce standby current drain. The device can be operated in a standard asynchronous mode and high performance burst mode. The die has separate power rails, VDDQ and VSSQ for the I/O to be run from a separate power supply from the device core. Features Single device supports asynchronous , page, and burst operation Mixed Mode supports asynchronous write and synchronous read operation Dual voltage rails for optional performance ALL: VDD 1.7V~1.95V, VDDQ 1.7V~1.95V CLL: VDD 1.7V~1.95V, VDDQ 2.7V~3.6V Asynchronous mode read access : 70ns Interpage Read access : 70ns Intrapage Read access : 25ns Burst mode for Read and Write operation 4, 8, 16,32 or Continuous Low Power Consumption Asynchronous Operation < 30 mA Intrapage Read < 20mA Burst operation < 45 mA (@133Mhz) Standby < 150 uA(max.) Deep power-down (DPD) < 3uA (Typ) Low Power Feature Reduced Array Refresh Temperature Controlled Refresh Deep power-down (DPD) mode Operation Frequency up to 133Mhz Operating temperature Range Industrial -40C~85C Package: 54-ball VFBGA Copyright (c) 2016 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 1 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL General Description CellularRAMTM (Trademark of MicronTechnology Inc.) products are high-speed, CMOS pseudo-static random access memory developed for low-power, portable applications. The 32Mb DRAM core device is organized as 2 Meg x 16 bits. This device is a variation of the industry-standard Flash control interface that dramatically increase READ/WRITE bandwidth compared with other low-power SRAM or Pseudo SRAM offerings. To operate seamlessly on a burst Flash bus, CellularRAM products have incorporated a transparent self-refresh mechanism. The hidden refresh requires no additional support from the system memory controller and has no significant impact on device read/write performance. Two user-accessible control registers define device operation. The bus configuration register (BCR) defines how the CellularRAM device interacts with the system memory bus and is nearly identical to its counterpart on burst mode Flash devices. The refresh configuration register (RCR) is used to control how refresh is performed on the DRAM array. These registers are automatically loaded with default settings during power-up and can be updated anytime during normal operation. Special attention has been focused on standby current consumption during self refresh. CellularRAM products include three mechanisms to minimize standby current. Partial array refresh (PAR) enables the system to limit refresh to only that part of the DRAM array that contains essential data. Temperature-compensated refresh (TCR) uses an on-chip sensor to adjust the refresh rate to match the device temperature -- the refresh rate decreases at lower temperatures to minimize current consumption during standby. Deep power-down (DPD) enables the system to halt the refresh operation altogether when no vital information is stored in the device. The system-configurable refresh mechanisms are adjusted through the RCR. This CellularRAM device is compliant with the industry-standard CellularRAM 1.5 feature set established by the CellularRAM Workgroup. It includes support for both variable and fixed latency, with three drive strengths, a variety of wrap options, and a device ID register (DIDR). A0~A20 Address Decode Logic Refresh Configuration Register (RCR) 2048K X 16 DRAM Memory Array Input /Output Mux And Buffers Device ID Register (DIDR) Bus Configuration Register (BCR) CE# WE# OE# CLK ADV# CRE LB# UB# WAIT Control Logic Rev. A1 | Oct. 2016 DQ0~DQ15 [ Functional Block Diagram] www.issi.com - SRAM@issi.com 2 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL 54Ball VFBGA Ball Assignment [Top View] (Ball Down) Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 3 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Signal Descriptions All signals for the device are listed below in Table 1. Table 1. Signal Descriptions Symbol Type Description VDD Power Supply Core Power supply (1.7V~1.95V) VDDQ Power Supply I/O Power supply (1.7V~1.95V) VSS Power Supply All VSS supply pins must be connected to Ground VSSQ Power Supply All VSSQ supply pins must be connected to Ground DQ0~DQ15 Input / Output Data Inputs/Outputs (DQ0~DQ15) A0~A21 Input Address Input(A0~A21) LB# Input Lower Byte select UB# Input Upper Byte select CE# Input Chip Enable/Select OE# Input Output Enable WE# Input Write Enable CRE Input Control Register Enable: When CRE is HIGH, READ and WRITE operations access registers. ADV# Input Address Valid signal Indicates that a valid address is present on the address inputs. Address can be latched on the rising edge of ADV# during asynchronous Read and Write operations. ADV# can be held LOW during asynchronous Read and Write operations. CLK Input Clock Latches addresses and commands on the first rising CLK edge when ADV# is active in synchronous mode. CLK must be kept static Low during asynchronous Read/Write operations and Page Read access operations. WAIT Output WAIT Data valid signal during burst Read/Write operation. WAIT is used to arbitrate collisions between refresh and Read/Write operation. WAIT is also asserted at the end of a row unless wrapping within the burst length. WAIT is asserted and should be ignored during asynchronous and page mode operation. WAIT is gated by CE# and is high-Z when CE# is high. ALL: VDD 1.7V~1.95V, VDDQ 1.7V~1.95V CLL: VDD 1.7V~1.95V, VDDQ 2.7V~3.6V Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 4 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Functional Description All functions for the device are listed below in Table 2. Table 2. Functional Descriptions Mode Power CLK1 ADV# CE# OE# WE# CRE2 UB#/ LB# WAIT3 DQ [15:0]4 Note Asynchronous Mode Read Active L L L L H L L Low-Z Data-out 5 Write Active L L L X L L L Low-Z Data-in 5 Standby Stand by L X H X X L X High-Z High-Z 6,7 No Operation Idle L X L X X L X Low-Z X 5,7 Configuration Register Write Active L L L H L H X Low-Z High-Z Configuration Register Read Active L L L L H H L Low-Z Config-Reg Out Deep PowerDown DPD L X H X X X X High-Z High-Z 10 Synchronous Mode (Burst Mode) Async read Active L L L L H L L Low-Z Data-Out 5 Async write Active L L L X L L L Low-Z Data-In 5 Standby Stand by L X H X X L X High-Z High-Z 6,7 No operation Idle L X L X X L X Low-Z X 5,8 Initial burst read Active L L X H L L Low-Z X 5,8 Initial burst write Active L L H L L X Low-Z X 5,8 Burst continue Active H L X X X L Low-Z Data-In or Data-Out 5,8 Burst suspend Active X L H X X X Low-Z High-Z 5,8 Configuration register write Active L L H L H X Low-Z High-Z 8,11 Configuration register read Active L L L H H L Low-Z Config-Reg Out 8,11 Deep PowerDown DPD X H X X X X High-Z High-Z 10 Rev. A1 | Oct. 2016 X L www.issi.com - SRAM@issi.com 5 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Notes 1. CLK must be LOW during Async Read and Async Write modes. CLK must be LOW to achieve low standby current during standby mode and DPD modes. CLK must be static (LOW or HIGH) during burst suspend. 2. Configuration registers are accessed when CRE is HIGH during the address portion of a READ or WRITE cycle. 3. WAIT polarity is configured through the bus configuration register (BCR[10]). 4. When UB# and LB# are in select mode (LOW), DQ0~DQ15 are affected as shown. When only LB# is in select mode, DQ0~DQ7 are affected as shown. When only UB# is in select mode, DQ8~DQ15 are affected as shown. 5. The device will consume active power in this mode whenever addresses are changed 6. When the device is in standby mode, address inputs and data inputs/outputs are internally isolated from any external influence. 7. Vin=VDDQ or 0V, all device pins be static (unswitched) in order to achieve standby current. 8. Burst mode operation is initialized through the bus configuration register (BCR[15]). 9. Byte operation can be supported Write & Read at asynchronous mode and Write at synchronous mode. 10. DPD is initiated when CE# transition from LOW to HIGH after writing RCR[4] to 0. DPD is maintained until CE# transitions from HIGH to LOW 11. Initial cycle. Following cycles are the same as BURST CONTINUE. CE# must stay LOW for the equivalent of a single word burst (as indicated by WAIT). 12. When the BCR is configured for sync mode, sync READ and sync WRITE and async WRITE are supported. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 6 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Functional Description In general, this device is high-density alternatives to SRAM and Pseudo SRAM products popular in low-power, portable applications. The 64Mb device contains a 67,108,864-bit DRAM core organized as 4,194,304 addresses by 16 bits. This device implements the same high-speed bus interface found on burst mode Flash products. The CellularRAM bus interface supports both asynchronous and burst mode transfers. Page mode accesses are also included as a bandwidth-enhancing extension to the asynchronous read protocol. Power-Up Initialization CellularRAM products include an on-chip voltage sensor used to launch the power-up initialization process. Initialization will configure the BCR and the RCR with their default settings (see Table 3 and Table 8). VDD and VDDQ must be applied simultaneously. When they reach a stable level at or above 1.7V, the device will require 150s to complete its self-initialization process. During the initialization period, CE# should remain HIGH. When initialization is complete, the device is ready for normal operation. Figure 1: Power-Up Initialization Timing VDD=1.7V tPU > 150us VDD VDDQ Rev. A1 | Oct. 2016 Device Initialization www.issi.com - SRAM@issi.com Device ready for normal operation 7 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Bus Operating Modes CellularRAM products incorporate a burst mode interface targeted at low-power, wireless applications. This bus interface supports asynchronous, page mode, and burst mode read and write transfers. The specific interface supported is defined by the value loaded into the bus configuration register. Page mode is controlled by the refresh configuration register (RCR[7]). Burst Mode Operation Burst mode operations enable high-speed synchronous READ and WRITE operations. Burst operations consist of a multi-clock sequence that must be performed in an ordered fashion. After CE# goes LOW, the address to access is latched on the rising edge of the next clock that ADV# is LOW. During this first clock rising edge, WE# indicates whether the operation is going to be a READ (WE#=HIGH) or WRITE(WE#=LOW). The size of a burst can be specified in the BCR either as a fixed length or continuous. Fixed-length bursts consist of four, eight, sixteen, or thirty-two words. Continuous bursts have the ability to start at a specified address and burst to the end of the row. (Row length of 128 words or 256 words is a manufacturer option.) The latency count stored in the BCR defines the number of clock cycles that elapse before the initial data value is transferred between the processor and CellularRAM device. The initial latency for READ operations can be configured as fixed or variable. (WRITE operations always use fixed latency). Variable latency allows the CellularRAM to be configured for minimum latency at high clock frequencies, but the controller must monitor WAIT to detect any conflict with refresh cycles.(see Figure 26). Fixed latency outputs the first data word after the worst-case access delay, including allowance for refresh collisions. The initial latency time and clock speed determine the latency count setting. Fixed latency is used when the controller cannot monitor WAIT. Fixed latency also provides improved performance at lower clock frequencies. The WAIT output asserts when a burst is initiated and de-asserts to indicate when data is to be transferred into (or out of) the memory. WAIT will again be asserted at the boundary of the row unless wrapping within the burst length. To access other devices on the same bus without the timing penalty of the initial latency for a new burst, burst mode can be suspended. Bursts are suspended by stopping CLK. CLK must be stopped LOW. If another device will use the data bus while the burst is suspended, OE# should be taken HIGH to disable the CellularRAM outputs; otherwise, OE# can remain LOW. Note that the WAIT output will continue to be active, and as a result no other devices should directly share the WAIT connection to the controller. To continue the burst sequence, OE# is taken LOW, then CLK is restarted after valid data is available on the bus. CE# LOW time is limited by refresh considerations. CE# must not stay LOW longer than tCEM. If a burst suspension will cause CE# to remain LOW for longer than tCEM, CE# should be taken HIGH and the burst restarted with a new CE# LOW/ADV# LOW cycle. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 8 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Burst Read Operation After CE# goes LOW, the address to access is latched on the rising edge of the next clock that ADV# is LOW. During this first clock rising edge, WE# indicates whether the operation is going to be a READ (WE# = HIGH, Figure 2) Then the data needs to be output to data bus (DQ0~DQ15) according to set WAIT states. The WAIT output asserts when a burst is initiated, and de-asserts to indicate when data is to be transferred into (or out of ) the memory. WAIT will again be asserted at the boundary of a row, unless wrapping within the burst length. A full 4 word synchronous read access is shown in Figure 2 and the AC characteristics are specified in Table 16. Figure 2. Synchronous Read Access Timing tABA tCLK CLK VALID ADDRESS Address tSP tHD tACLK DQ0DQ15 tKOH VALID OUTPUT tSP ADV# VALID OUTPUT tHZ tHD tSP tHD tHD WE# tOLZ tOHZ tBOE OE# tHZ tCEW WAIT tCBPH tCEM CE# tSP VALID OUTPUT tHD tCSP UB#/LB# VALID OUTPUT tKHTL HiZ Read Burst Identified (WE#=HIGH) Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 9 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Burst Write Operation After CE# goes LOW, the address to access is latched on the rising edge of the next clock that ADV# is LOW. During this first clock rising edge, WE# indicates whether the operation is going to be a WRITE (WE# =LOW, Figure 3). Data is placed to the data bus (DQ0~DQ15) with consecutive clock cycles when WAIT de-asserts. The WAIT output asserts when a burst is initiated, and de-asserts to indicate when data is to be transferred into (or out of ) the memory. WAIT will again be asserted at the boundary of a row, unless wrapping within the burst length. A full 4 word synchronous write access is shown in Figure 3 and the AC characteristics are specified in Table 18. Figure 3. Synchronous Write Access Timing tCLK CLK VALID ADDRESS Address tSP DQ0DQ15 tSP tHD tHD DATA IN DATA IN DATA IN DATA IN tAS tAS ADV# tHD tCSP tCEM CE# tCBPH tSP UB#/LB# tHD tHD tSP WE# tHD tCEW WAIT tKHTL HiZ Write Burst Identified (WE#=LOW) Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 10 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Asynchronous Mode Asynchronous mode uses industry-standard SRAM control signals (CE#, OE#, WE#, UB#, and LB#). READ operations (Figure 4) are initiated by bringing CE#, OE#, UB#/LB# LOW while keeping WE# HIGH. Valid data will be driven out of the I/Os after the specified access time has elapsed. WRITE operations (Figure 5) occur when CE#, WE#, UB#/LB# are driven LOW. During asynchronous WRITE operations, the OE# level is a "Don't Care," and WE# will override OE#. The data to be written is latched on the rising edge of CE#, WE#, UB#/LB# (whichever occurs first). Asynchronous operations (page mode disabled) can either use the ADV input to latch the address, or ADV can be driven LOW during the entire READ/WRITE operations During asynchronous operation, the CLK input must be held LOW. WAIT will be driven during asynchronous READs, and its state should be ignored. WE# must not be held LOW longer than tCEM. Figure 4. Asynchronous Read Access Timing (ADV# LOW) tRC = READ cycle Time Address VALID ADDRESS DQ0DQ15 VALID OUTPUT CE# UB#/LB# OE# WE# Notes: 1. ADV# must remain LOW for PAGE MODE operation. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 11 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 5. Asynchronous Write Access Timing (ADV# LOW) tWC = WRITE cycle Time Address VALID ADDRESS DQ0DQ15 VALID OUTPUT CE# UB#/LB# WE# < tCEM OE# Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 12 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Page Mode READ Operation Page mode is a performance-enhancing extension to the legacy asynchronous READ operation. In page-mode-capable products, an initial asynchronous read access is preformed, then adjacent addresses can be read quickly by simply changing the low-order address. Addresses A[3:0] are used to determine the members of the 16-address CellularRAM page. Any change in addresses A[4] or higher will initiate a new tAA access time. Figure 6 shows the timing for a page mode access. Page mode takes advantage of the fact that adjacent addresses can be read in a shorter period of time than random addresses. WRITE operations do not include comparable page mode functionality. During asynchronous page mode operation, the CLK input must be held LOW. CE# must be driven HIGH upon completion of a page mode access. WAIT will be driven while the device is enabled and its state should be ignored. Page mode is enabled by setting RCR[7] to HIGH. ADV must be driven LOW during all page mode READ accesses. Due to refresh considerations, CE# must not be LOW longer than tCEM. Figure 6. Page Mode READ Operation (ADV# LOW) Address ADD0 tAA DQ0DQ15 ADD1 tAPA D0 ADD2 tAPA D1 ADD3 tAPA D2 D3 CE# UB#/LB# OE# WE# Notes: 1. ADV# must remain LOW for PAGE MODE operation. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 13 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Mixed-Mode Operation The device can support a combination of synchronous READ and asynchronous READ and WRITE operations when the BCR is configured for synchronous operation. The asynchronous READ and WRITE operations require that the clock (CLK) remain LOW during the entire sequence. The ADV# signal can be used to latch the target address, or it can remain LOW during the entire WRITE operation. CE# can remain LOW when transitioning between mixed-mode operations with fixed latency enabled; however, the CE# LOW time must not exceed tCEM. Mixed-mode operation facilitates a seamless interface to legacy burst mode Flash memory controllers. See Figure 45 for the "Asynchronous WRITE Followed by Burst READ" timing diagram. WAIT Operation WAIT output on the CellularRAM device is typically connected to a shared, system-level WAIT signal. The shared WAIT signal is used by the processor to coordinate transactions with multiple memories on the synchronous bus. When a synchronous READ or WRITE operation has been initiated, WAIT goes active to indicate that the CellularRAM device requires additional time before data can be transferred. For READ operations, WAIT will remain active until valid data is output from the device. For WRITE operations, WAIT will indicate to the memory controller when data will be accepted into the CellularRAM device. When WAIT transitions to an inactive state, the data burst will progress on successive rising clock edges. During a burst cycle CE# must remain asserted until the first data is valid. Bringing CE# HIGH during this initial latency may cause data corruption. When using variable initial access latency (BCR[14] = 0), the WAIT output performs an arbitration role for READ operations launched while an on-chip refresh is in progress. If a collision occurs, the WAIT pin is asserted for additional clock cycles until the refresh has completed (see Figure 26). When the refresh operation has completed, the READ operation will continue normally. WAIT will be asserted but should be ignored during asynchronous READ and WRITE and page READ operations. WAIT will be High-Z during asynchronous WRITE operations. By using fixed initial latency (BCR[14] = 1), this CellularRAM device can be used in burst mode without monitoring the WAIT pin. However, WAIT can still be used to determine when valid data is available at the start of the burst and at the end of the row. If wait is not monitored, the controller must stop burst accesses at row boundaries on its own. UB#/LB# Operation The UB#/LB# enable signals support byte-wide data WRITEs. During WRITE operations, any disabled bytes will not be transferred to the RAM array and the internal value will remain unchanged. During an asynchronous WRITE cycle, the data to be written is latched on the rising edge of CE#, WE#, UB#, and LB# whichever occurs first. UB#/LB# must be LOW during synchronous READ cycles. When UB#/LB# are disabled (HIGH) during an operation, the device will disable the data bus from receiving or transmitting data. Although the device will seem to be deselected, it remains in an active mode as long as CE# remains LOW. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 14 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Low-Power Feature Standby Mode Operation During standby, the device current consumption is reduced to the level necessary to perform the DRAM refresh operation. Standby operation occurs when CE# is HIGH. The device will enter a reduced power state upon completion of a READ or WRITE operation, or when the address and control inputs remain static for an extended period of time. This mode will continue until a change occurs to the address or control inputs. Temperature-Compensated Refresh Temperature-compensated refresh (TCR) allows for adequate refresh at different temperatures. This CellularRAM device includes an on-chip temperature sensor that automatically adjusts the refresh rate according to the operating temperature. The device continually adjusts the refresh rate to match that temperature. Partial-Array Refresh Partial-array refresh (PAR) restricts refresh operation to a portion of the total memory array. This feature enables the device to reduce standby current by refreshing only that part of the memory array required by the host system. The refresh options are full array, one-half array, one-quarter array, one-eighth array, or none of the array. The mapping of these partitions can start at either the beginning or the end of the address map (see Table 9). READ and WRITE operations to address ranges receiving refresh will not be affected. Data stored in addresses not receiving refresh will become corrupted. When re-enabling additional portions of the array, the new portions are available immediately upon writing to the RCR. Deep Power-Down Operation Deep power-down (DPD) operation disables all refresh-related activity. This mode is used if the system does not require the storage provided by the CellularRAM device. Any stored data will become corrupted when DPD is enabled. When refresh activity has been re-enabled, the CellularRAM device will require 150s to perform an initialization procedure before normal operations can resume. During this 150s period, the current consumption will be higher than the specified standby levels, but considerably lower than the active current specification. DPD can be enabled by writing to the RCR using CRE or the software access sequence; DPD starts when CE# goes HIGH. DPD is disabled the next time CE# goes LOW and stays LOW for at least 10us. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 15 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Registers Two user-accessible configuration registers define the device operation. The bus configuration register (BCR) defines how the CellularRAM interacts with the system memory bus and is nearly identical to its counterpart on burst mode Flash devices. The refresh configuration register (RCR) is used to control how refresh is performed on the DRAM array. These registers are automatically loaded with default settings during power-up, and can be updated any time the devices are operating in a standby state. A DIDR provides information on the device manufacturer, CellularRAM generation, and the specific device configuration. The DIDR is read-only. Access Using CRE The registers can be accessed using either a synchronous or an asynchronous operation when the configuration register enable (CRE) input is HIGH (see Figures 7 through 10). When CRE is LOW, a READ or WRITE operation will access the memory array. The configuration register values are written via A[21:0]. In an asynchronous WRITE, the values are latched into the configuration register on the rising edge of ADV#, CE#, or WE#, whichever occurs first; LB# and UB# are "Don't Care" The BCR is accessed when A[19:18] is 10b; the RCR is accessed when A[19:18] is 00b; the DIDR is accessed when A[19:18] is 01b. For READs, address inputs other than A[19:18] are "Don't Care," and register bits 15:0 are output on DQ[15:0]. Immediately after performing a configuration register READ or WRITE operation, reading the memory array is highly recommended Figure 7: Configuration Register WRITE - Asynchronous Mode, Followed by READ ARRAY Operation Address VALID ADDRESS OPCODE1 tAVS tAVH DQ0DQ151 tAVS tAVH VALID OUTPUT tVS tAADV tVP ADV# tVP tCVS tCVS tCW CE# tCPH tHZ tCO tBA UB#/LB# tWP WE# Write Address Bus Value to Control Register OE# tAVS tOLZ tOE tAVH CRE2 Notes: 1. A[19:18] = 00b to load RCR, and 10b to load BCR. 2. CRE must be HIGH to access registers. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 16 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 8: Configuration Register WRITE - Synchronous Mode Followed by READ ARRAY Operation tABA tCLK CLK Address VALID ADDRESS OPCODE2 tSP tHD tSP tHD tACLK DQ0DQ15 tKOH VALID VALID VALID VALID OUTPUTOUTPUTOUTPUTOUTPUT tSP tHD ADV# tCBPH3 tCSP tCEM tCEM CE# tHD UB#/LB# tSP tHD WE# tOHZ tBOE OE# WAIT tCEW tKHTL HiZ tHZ tCEW tKHTL tHD CRE4 tSP Notes: 1. Non-default BCR settings for configuration register WRITE in synchronous mode, followed by READ ARRAY operation: Variable Latency code two (four clocks); WAIT active LOW; WAIT asserted during delay. 2. A[19:18] = 00b to load RCR, 10b to load BCR. 3. CE# must remain LOW to complete a burst-of-one WRITE. WAIT must be monitored additional WAIT cycles caused by refresh collisions require a corresponding number of additional CE# LOW cycles. 4. CRE must be HIGH to access registers. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 17 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 9: Configuration Register READ - Asynchronous Mode Followed by DATA READ tAA Select Control Register1 Address tAVS VALID ADDRESS tAVH DQ0DQ15 tAVS tAVH VALID OUTPUT CR Valid tAADV tAADV tVP ADV# tVP tCPP tCO CE# tCPH tHZ tCO tBLZ tBA UB#/LB# tBA WE# tOLZ tOE OE# tAVS tOE tAVH CRE2 Notes: 1. A[19:18] = 00b to read RCR, 10b to read BCR, and 01b to read DIDR 2. CRE must be HIGH to access registers. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 18 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 10: Configuration Register READ - Synchronous Mode Followed by Data READ tABA tCLK CLK Select Control Register2 Address VALID ADDRESS tACLK tSP tHD DQ0DQ15 tKOH tSP tHD CR valid tSP ADV# tACLK tKOH VALID VALID VALID VALID OUTPUTOUTPUTOUTPUTOUTPUT tHD tCBPH3 tCSP tCEM tABA CE# tHD tSP UB#/LB# tSP tHD WE# tOHZ tBOE OE# WAIT tCEW tKTHL HiZ tHZ tCEW tKHTL tHD CRE4 tSP Notes: 1. Non-default BCR settings for configuration register READ in synchronous mode, followed by READ ARRAY operation: Variable Latency code two (four clocks); WAIT active LOW; WAIT asserted during delay. 2. A[19:18] = 00b to read RCR, 10b to read BCR, to 01b to read DIDR. 3. CE# must remain LOW to complete a burst-of-one READ. WAIT must be monitored additional WAIT cycles caused by refresh collisions require a corresponding number of additional CE# LOW cycles. 4. CRE must be HIGH to access registers. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 19 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Software Access Sequence Software access of the configuration registers uses a sequence of asynchronous READ and asynchronous WRITE operations. The contents of the configuration registers can be read or modified using the software sequence. The configuration registers are loaded using a four-step sequence consisting of two asynchronous READ operations followed by two asynchronous WRITE operations (see Figure 11). The read sequence is virtually identical except that an asynchronous READ is performed during the fourth operation (see Figure 12). The address used during all READ and WRITE operations is the highest address of the CellularRAM device being accessed (3FFFFFh); the contents of this address are not changed by using this sequence. The data value presented during the third operation (WRITE) in the sequence defines whether the BCR or the RCR is to be accessed. If the data is 0000h, the sequence will access the RCR; if the data is 0001h, the sequence will access the BCR; if the data is 0002h, the sequence will access the DIDR. During the fourth operation, DQ[15:0] transfer data in to or out of bits 15:0 of the control registers. The use of the software sequence does not affect the ability to perform the standard (CRE-controlled) method of loading the configuration registers. However, the software nature of this access mechanism eliminates the need for the control register enable (CRE) pin. If the software mechanism is used, the CRE pin can simply be tied to VSS. The port line often used for CRE control purposes is no longer required. Figure 11 : Configuration Register Write Address MAX ADDRESS DQ0DQ15 CE# MAX ADDRESS OUTPUT DATA Read MAX ADDRESS OUTPUT DATA Read MAX ADDRESS CR VALUE IN *Note1 Write Write UB#/LB# WE# OE# Notes : 1. RCR : 0000h , BCR : 0001h Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 20 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 12 : Configuration Register Read Address MAX ADDRESS DQ0DQ15 CE# MAX ADDRESS OUTPUT DATA Read MAX ADDRESS OUTPUT DATA Read MAX ADDRESS CR VALUE OUT *Note1 Write Read UB#/LB# WE# OE# Notes : 1. RCR : 0000h , BCR : 0001h , DIDR : 0002h Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 21 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Bus Configuration Register The BCR defines how the CellularRAM device interacts with the system memory bus. Table 3 describes the control bits in the BCR. At power-up, the BCR is set to 9D1Fh. The BCR is accessed using CRE and A[19:18] = 10b, or through the configuration register software sequence with DQ[15:0] = 0001h on the third cycle. Table 3. Bus configuration Register Remark Bit Number Definition 21-20 Reserved Must be set to "0" 19 - 18 Register Select 00 = Select RCR 01 = Select DIDR 10 = Select BCR 17 - 16 Reserved Must be set to "0" 15 Operating mode 14 Initial Latency 0 = Variable (default) 1 = Fixed 13 - 11 Latency Count Code 10 WAIT Polarity 9 Reserved 8 WAIT Configuration 7-6 Reserved 000 = 001 = 010 = 011 = 100 = 101 = 110 = 111 = reserved reserved 2 3 (default) 4 5 6 reserved 0 = Active LOW : Data valid at WAIT HIGH 1 = Active HIGH : Data valid at WAIT LOW (default) Must be set to "0" 0 = Asserted during delay 1 = Asserted one data cycle before delay (default) Must be set to "0" 00 = 01 = 10 = 11 = Full drive 1/2 Drive (default) 1/4 Drive Reserved 5-4 Output Impedance 3 Burst mode 0 = Burst wrap within the burst length 1 = Burst no wrap (default) Burst Length 001 = 4 words 010 = 8 words 011 = 16 words 100 = 32 words 111 = continuous (default) Others = Reserved 2-0 Notes : 0 = Synchronous burst access mode 1 = Asynchronous access mode (default) 1.Burst wrap and length apply to both READ and WRITE operations. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 22 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Burst Length (BCR[2:0]) Default = Continuous Burst Burst lengths define the number of words the device outputs during burst READ and WRITE operations. The device supports a burst length of four, eight, sixteen, or thirty-two words. The device can also be set in continuous burst mode where data is accessed sequentially up to the end of the row. Burst Wrap (BCR[3]) Default = No Wrap The burst-wrap option determines if a 4-, 8-, 16, 32-word READ or WRITE burst wraps within the burst length, or steps through sequential addresses. If the wrap option is not enabled, the device accesses data from sequential addresses up to the end of the row. Table 4. Sequence and Burst Length Starting Address Wrap BL4 BL8 BL16 BL32 Continuous DEC BCR[3] Linear Linear Linear Linear Linear 0 0-1-2-3 0-1-2-3-4-5-6-7 0-1-2-3- *** -12-13-14-15 0-1-2-3- *** -28-29-30-31 0-1-2-3-4-5-6- *** 1 1-2-3-0 1-2-3-4-5-6-7-0 1-2-3-4- *** -13-14-15-0 1-2-3-4- *** -29-30-31-0 1-2-3-4-5-6-7- *** 2 2-3-0-1 2-3-4-5-6-7-0-1 2-3-4-5- *** -14-15-0-1 2-3-4-5- *** -30-31-0-1 2-3-4-5-6-7-8- *** 3 3-0-1-2 3-4-5-6-7-0-1-2 3-4-5-6- *** -15-0-1-2 3-4-5-6- *** -31-0-1-2 3-4-5-6-7-8-9- *** *** *** *** *** *** *** 6 6-7-4-5 6-7-0-1-2-3-4-5 6-7-8-9- *** -2-3-4-5 6-7-8-9- *** -2-3-4-5 6-7-8-9-10-11-12- *** 7-4-5-6 7-0-1-2-3-4-5-6 7-8-9-10- *** -3-4-5-6 7-8-9-10- *** -3-4-5-6 7-8-9-10-11-12-13- *** *** *** *** *** *** 14 14-15-12-13 14-15-8-9-10-11-12-13 14-15-0-1- *** -10-11-12-13 30-31-0-1- *** -26-27-28-29 14-15-16-17-18-19-20*** 15 15-12-13-14 15-8-9-10-11-12-13-14 15-0-1-2-3- *** -11-13-13-14 31-0-1-2-3- *** -27-28-29-30 15-16-17-18-19-20-21*** *** *** *** *** *** *** 254 254-255-252-253 254-255-248-*** -252-253 254-255-240-241- *** -252-253 254-255-224-225- *** -252-253 254-255-0-1-2-*** 255 255-252-253-254 255-248-249- *** -253-254 255-240-241-242- *** -253-254 255-224-225-226- *** -253-254 255-0-1-2-*** 0 0-1-2-3 0-1-2-3-4-5-6-7 0-1-2-3-4- *** -12-13-14-15 0-1-2-3- *** -28-29-30-31 0-1-2-3-4-5-6- *** 1 1-2-3-4 1-2-3-4-5-6-7-8 1-2-3-4- *** -13-14-15-16 1-2-3-4- *** -29-30-31-32 1-2-3-4-5-6-7- *** 2 2-3-4-5 2-3-4-5-6-7-8-9 2-3-4-5- *** -14-15-16-17 2-3-4-5- *** -30-31-32-33 2-3-4-5-6-7-8- *** 3 3-4-5-6 3-4-5-6-7-8-9-10 3-4-5-6- *** -15-16-17-18 3-4-5-6- *** -31-32-33-34 3-4-5-6-7-8-9- *** *** *** *** *** *** *** 7 *** "0" Wrap 6 7 *** "1" No Wrap 6-7-8-9 6-7-8-9-10-11-12-13 6-7-8-9- *** -18-19-20-21 6-7-8-9- *** -34-35-36-37 6-7-8-9-10-11-12- *** 7-8-9-10 7-8-9-10-11-12-13-14 7-8-9-10- *** -19-20-21-22 7-8-9-10- *** -35-36-37-38 7-8-9-10-11-12-13- *** *** *** *** *** *** 14 14-15-16-17 14-15-16-17-18-19-20-21 14-15-16-17- *** - 26-27-28-29 14-15-16-17- *** - 42-43-44-45 14-15-16-17-18-19-20*** 15 15-16-17-18 15-16-17-18-19-20-21-22 15-16-17-18- *** -27-28-29-30 15-16-17-18- *** -43-44-45-46 15-16-17-18-19-20-21*** *** *** *** *** *** *** 254 254-255 254-255 254-255 254-255 254-255 255 255 255 255 255 255 Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 23 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Drive Strength (BCR[5:4]) Default = Outputs Use Half-Drive Strength The output driver strength can be altered to full, one-half, or one-quarter strength to adjust for different data bus loading scenarios. The reduced-strength options are intended for stacked chip (Flash + CellularRAM) environments when there is a dedicated memory bus. The reduced-drive-strength option minimizes the noise generated on the data bus during READ operations. Full output drive strength should be selected when using a discrete CellularRAM device in a more heavily loaded data bus environment. Outputs are configured at half-drive strength during testing. See Table 5 for additional information. Table 5. Drive Strength BCR[5] BCR[4] Drive Strength Impedance Typ () Use Recommendation 0 0 Full 25 ~ 30 CL = 30pF to 50pF 0 1 1/2(Default) 50 CL = 15pF to 30pF 104MHz at light load 1 0 1/4 100 CL = 15pF or lower 1 1 Reserved WAIT Configuration (BCR[8]) Default = WAIT Transitions One Clock Before Data Valid/Invalid The WAIT configuration bit is used to determine when WAIT transitions between the asserted and the de-asserted state with respect to valid data presented on the data bus. The memory controller will use the WAIT signal to coordinate data transfer during synchronous READ and WRITE operations. When BCR[8] = 0, data will be valid or invalid on the clock edge immediately after WAIT transitions to the de-asserted or asserted state respectively. When BCR[8] = 1, the WAIT signal transitions one clock period prior to the data bus going valid or invalid (see Figure 13). Figure 13. WAIT Configuration During Burst Operation CLK DQ0DQ15 VALID OUTPUT VALID OUTPUT VALID OUTPUT VALID OUTPUT WAIT BCR[8]=0 Data valid/invalid in current cycle WAIT BCR[8]=1 Data valid/invalid in next cycle Notes : Non-default BCR setting : WAIT active LOW WAIT Polarity (BCR[10]) Default = WAIT Active HIGH The WAIT polarity bit indicates whether an asserted WAIT output should be HIGH or LOW. This bit will determine whether the WAIT signal requires a pull-up or pull-down resistor to maintain the de-asserted state. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 24 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Latency Counter Code (BCR[13:11]) Default = 3 The latency counter bits determine how many clocks occur between the beginning of a READ or WRITE operation and the first data value transferred. Latency codes from two to six are supported (see Tables 6 and 7, Figure 14, and Figure 15). Initial Access Latency (BCR[14]) Default = Variable Variable initial access latency outputs data after the number of clocks set by the latency counter. However, WAIT must be monitored to detect delays caused by collisions with refresh operations. Fixed initial access latency outputs the first data at a consistent time that allows for worst-case refresh collisions. The latency counter must be configured to match the initial latency and the clock frequency. It is not necessary to monitor WAIT with fixed initial latency. The burst begins after the number of clock cycles configured by the latency counter. (See Table 7 and Figure 15) Table 6. Variable Latency Configuration Codes (BCR[14] = 0) Latency Latency Configuration Codes BCR [13:11] Max Input CLK Frequency (MHz) Normal Refresh Collision -96 -12 66 (15.0ns) 52 (18.5ns) 104 (9.62ns) 80 (12.5ns) - - 010 2 (4 clocks) 3 4 011 3 (5 clocks)-default 4 6 100 4 (6 clocks) 5 8 Reserved - - others Notes: 1. Latency is the number of clock cycles from the initialization of a burst operation until data appears. Data is transferred on the next clock cycle. 2. Write Operation can be supported with Latency Codes, and has no relationship with Refresh Collision. Figure 14. Latency Counter (Variable Latency, No Refresh Collision) A[21:0] VALID ADDRESS CLK ADV# Code 2 (4 clocks) DQ0DQ15 VALID ADDRESS DQ0DQ15 VALID ADDRESS DQ0DQ15 VALID ADDRESS Rev. A1 | Oct. 2016 Code 3 (5 clocks) : Default VALID OUTPUT Code 4 (6 clocks) VALID OUTPUT VALID OUTPUT VALID OUTPUT VALID OUTPUT VALID OUTPUT www.issi.com - SRAM@issi.com 25 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Table 7. Fixed Latency Configuration Codes (BCR[14] = 1) Latency Configuration Code BCR [13:11] Latency Count (N) Max Input CLK Frequency (MHz) -96 -12 010 2 (3 clocks) 2 33 (30ns) 25 (40ns) 011 3 (4 clocks)-default 3 52 (19.2ns) 40 (25ns) 100 4 (5 clocks) 4 66 (15.0ns) 52 (19.2ns) 101 5 (6 clocks) 5 75 (13.3ns) 66 (15.0ns) 110 6 (7 clocks) 6 104 (9.62ns) 80 (12.5ns) Reserved - - - others Figure 15. Latency Counter (Fixed Latency) Cycle N CLK ADV# tAADV CE# tCO tAA A[21:0] VALID ADDRESS DQ0DQ15 (READ) DQ0DQ15 (WRITE) VALID OUTPUT VALID OUTPUT VALID OUTPUT VALID INPUT VALID INPUT VALID INPUT Burst Identified (ADV#=LOW) Operating Mode (BCR[15]) Default = Synchronous Operation The operating mode bit selects either synchronous burst operation or the default asynchronous mode of operation Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 26 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Refresh Configuration Register The refresh configuration register (RCR) defines how the CellularRAM device performs its transparent self refresh. Altering the refresh parameters can dramatically reduce current consumption during standby mode. Table 8 describes the control bits used in the RCR. At power-up, the RCR is set to 0010h The RCR is accessed using CRE and A[19:18] = 00b, or through the configuration register software access sequence with DQ = 0000h on the third cycle (see "Registers") Table 8. Refresh Configuration Register Bit Number Definition 20-21 Reserved Must be set to "0" 19 - 18 Register Select 00 = Select RCR 01 = Select DIDR 10 = Select BCR 17 - 8 Reserved Must be set to "0" 7 Page 6-5 Reserved 4 DPD 3 Reserved 2-0 Rev. A1 | Oct. 2016 Partial Refresh Remark 0 = Page Mode disabled (default) 1 = Page Mode enable Setting is ignored (Default 00b) 0 = DPD enable 1 = DPD disable (default) Must be set to "0" 000 = 001 = 010 = 011 = 100 = 101 = 110 = 111 = Full array (default) Bottom 1/2 array Bottom 1/4 array Bottom 1/8 array None of array Top 1/2 array Top 1/4 array Top 1/8 array www.issi.com - SRAM@issi.com 27 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Partial-Array Refresh (RCR[2:0]) Default = Full Array Refresh The PAR bits restrict refresh operation to a portion of the total memory array. This feature allows the device to reduce standby current by refreshing only that part of the memory array required by the host system. The refresh options are full array, one-half array, one-quarter array, one-eighth array, or none of the array. The mapping of these partitions can start at either the beginning or the end of the address map (see Table 9) Table 9. 64Mb Address Patterns for PAR (RCR[4]=1) RCR[2] RCR[1] RCR[0] Active Section Address Space Size Density 0 0 0 Full 000000h ~ 3FFFFFh 4MX16 64Mb 0 0 1 Bottom 1/2 array 000000h ~ 1FFFFFh 2MX16 32Mb 0 1 0 Bottom 1/4 array 000000h ~ 0FFFFFh 1MX16 16Mb 0 1 1 Bottom 1/8 array 000000h ~ 07FFFFh 512KX16 8Mb 1 0 0 None of array 0 1 0 1 Top 1/2 array 200000h ~ 3FFFFFh 2MX16 32Mb 1 1 0 Top 1/4 array 300000h ~ 3FFFFFh 1MX16 16Mb 1 1 1 Top 1/8 array 380000h ~ 3FFFFFh 512KX16 8Mb 0Mb Deep Power-Down (RCR[4]) Default = DPD Disabled The deep power-down bit enables and disables all refresh-related activity. This mode is used if the system does not require the storage provided by the CellularRAM device. Any stored data will become corrupted when DPD is enabled. When refresh activity has been re-enabled, the CellularRAM device will require 150s to perform an initialization procedure before normal operations can resume. Deep power-down is enabled by setting RCR[4] = 0 and taking CE# HIGH. Taking CE# LOW disables DPD and sets RCR[4] = 1; it is not necessary to write to the RCR to disable DPD. DPD can be enabled using CRE or the software sequence to access the RCR. BCR and RCR values (other than BCR[4]) are preserved during DPD. Page Mode Operation (RCR[7]) Default = Disabled The Page mode operation bit determines whether page mode is enabled for asynchronous READ operations. In the power-up default state, page mode is disabled Device Identification Register The DIDR provides information on the device manufacturer, CellularRAM generation, and the specific device configuration. Table 10 describes the bit fields in the DIDR. This register is read-only. The DIDR is accessed with CRE HIGH and A[19:18] = 01b, or through the software access sequence with DQ = 0002h on the third cycle. Table 10. Device Identification Register Mapping Bit Field DIDR[15] DIDR[14:11] DIDR[10:8] DIDR[7:5] DIDR[4:0] Field Name Row Length Device Version Device Density CellularRAM Generation Vendor ID Length - words Bit Setting Version Bit Setting Density Bit Setting Genera tion Bit Setting Vendor Bit Setting 128 0b 1st 0000b 64Mb 010b CR1.5 010b ISSI 00101b 256 1b 2nd 0001b 128Mb 011b CR2.0 011b Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 28 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Electrical Characteristics (ALL) Table 11. Absolute Maximum Ratings Parameter Rating Voltage to Any Ball Except VDD, VDDQ Relative to VSS -0.3V to VDDQ + 0.3V Voltage on VDD Supply Relative to VSS -0.2V to +2.45V Voltage on VDDQ Supply Relative to VSS -0.2V to +2.45V Storage Temperature (plastic) -55C to +150C Operating Temperature (case) -40C to +85C Soldering Temperature and Time +260C 10s (solder ball only) Notes: Stresses greater than those listed may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Table 12. Electrical Characteristics and Operating Conditions Industrial Temperature (-40C < TC < +85C) Description Conditions MIN MAX Unit VDD 1.7 1.95 V I/O Supply Voltage VDDQ 1.7 1.95 V Input High Voltage VIH VDDQ-0.4 VDDQ+0.2 V 1 Input Low Voltage VIL -0.20 0.4 V 2 0.80 VDDQ V 3 3 Supply Voltage Symbol Note Output High Voltage IOH = -0.2mA VOH Output Low Voltage IOL = +0.2mA VOL 0.20 VDDQ V VIN = 0 to VDDQ ILI 1 uA Output Leakage Current OE#=VIH or Chip Disabled ILO 1 uA Operating Current Conditions MAX Unit Note Input Leakage Current Symbol TYP Asynchronous Random READ/WRITE IDD1 -70 30 mA 4 Asynchronous PAGE READ IDD1P -70 20 mA 4 104Mhz 35 80Mhz 30 mA 4 104Mhz 30 80Mhz 25 mA 4 104Mhz 35 80Mhz 30 mA 4 uA 5 Initial Access, Burst READ/WRITE VIN = VDDQ or 0V Chip enabled, IOUT = 0 IDD2 Continuous Burst READ IDD3R Continuous Burst WRITE IDD3W Standby Current Rev. A1 | Oct. 2016 VIN=VDDQ or 0V CE#=VDDQ ISB www.issi.com - SRAM@issi.com 180 29 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Electrical Characteristics (CLL) Table 11. Absolute Maximum Ratings Parameter Rating Voltage to Any Ball Except VDD, VDDQ Relative to VSS -0.3V to VDDQ + 0.3V Voltage on VDD Supply Relative to VSS -0.2V to +2.45V Voltage on VDDQ Supply Relative to VSS -0.2V to +4.0V Storage Temperature (plastic) -55C to +150C Operating Temperature (case) -40C to +85C Soldering Temperature and Time +260C 10s (solder ball only) Notes: Stresses greater than those listed may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Table 12. Electrical Characteristics and Operating Conditions Industrial Temperature (-40C < TC < +85C) Description Conditions MIN MAX Unit VDD 1.7 1.95 V I/O Supply Voltage VDDQ 2.7 3.6 V Input High Voltage VIH VDDQ-0.4 VDDQ+0.2 V 1 Input Low Voltage VIL -0.20 0.4 V 2 0.80 VDDQ V 3 3 Supply Voltage Symbol Note Output High Voltage IOH = -0.2mA VOH Output Low Voltage IOL = +0.2mA VOL 0.20 VDDQ V VIN = 0 to VDDQ ILI 1 uA Output Leakage Current OE#=VIH or Chip Disabled ILO 1 uA Operating Current Conditions MAX Unit Note Input Leakage Current Symbol TYP Asynchronous Random READ/WRITE IDD1 -70 30 mA 4 Asynchronous PAGE READ IDD1P -70 20 mA 4 104Mhz 35 80Mhz 30 mA 4 104Mhz 30 80Mhz 25 mA 4 104Mhz 35 80Mhz 30 mA 4 uA 5 Initial Access, Burst READ/WRITE VIN = VDDQ or 0V Chip enabled, IOUT = 0 IDD2 Continuous Burst READ IDD3R Continuous Burst WRITE IDD3W Standby Current Rev. A1 | Oct. 2016 VIN=VDDQ or 0V CE#=VDDQ ISB www.issi.com - SRAM@issi.com 180 30 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Notes: 1. Input signals may overshoot to VDDQ + 1.0V for periods less than 2ns during transitions. 2. Input signals may undershoot to Vss - 1.0V for periods less than 2ns during transitions. 3. BCR[5:4] = 01b (default setting of one-half drive strength). 4. This parameter is specified with the outputs disabled to avoid external loading effects. User must add required current to drive output capacitance expected in the actual system. 5. ISB (MAX) values measured with PAR set to FULL ARRAY at +85C. In order to achieve low standby current, all inputs must be driven to either VDDQ or VSS. ISB might be set slightly higher for up to 500ms after power-up, or when entering standby mode. Table 13. Deep Power-Down Specifications Description Deep Power-Down (ALL/CLL) Notes: Conditions Symbol TYP MAX Unit VIN=VDDQ or 0V VDD,VDDQ=1.95V, +85C IDPD 3 10 uA Typical (TYP) IDPD value applies across all operating temperatures and voltages. Table 14. Capacitance Description Input Capacitance Input/Output Capacitance (DQ) Notes: Conditions Symbol MIN MAX Unit Note TC=+25C; f=1Mhz; VIN=0V CIN 2.0 6.0 pF 1 CIO 3.5 6 pF 1 1. These parameters are verified in device characterization and are not 100% tested. Figure 16. AC Input/Output Reference Waveform VDDQ VDDQ/22 Output Test Points VSS VDDQ/23 Output Notes: 1. AC test inputs are driven at VDDQ for a logic 1 and VSS for a logic 0. Input rise and fall times (10% to 90%) < 1.6ns. 2. Input timing begins at VDDQ/2. 3. Output timing ends at VDDQ/2. Figure 17. Output Load Circuit Test Point 50 DUT VDDQ/2 30pF Notes: All tests are performed with the outputs configured for default setting of half drive strength (BCR[5:4] = 01b). Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 31 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL AC Characteristics Table15 . Asynchronous READ Cycle Timing Requirements Symbol Parameter 70ns Min Max Unit Notes tAA Address Acess Time 70 ns tAADV ADV# Access Time 70 ns tAPA Page Access Time 25 ns tAVH Address hold from ADV# HIGH 2 ns tAVS Address setup to ADV# HIGH 5 ns tBA UB#, LB# Access Time 70 ns tBHZ UB#, LB# Disable to High-Z Output 8 ns 1 tBLZ UB#, LB# Enable to Low-Z Output ns 2 tCEM Maximum CE# pulse width 4 us 3 tCEW CE# low to WAIT Valid 7.5 ns tCO Chip Select Access Time 70 ns tCVS CE# low to ADV# HIGH tHZ Chip Disable to DQ and WAIT High-Z Output tLZ Chip enable to Low-Z output tOE OE# low to Valid Output tOH Output hold from address change tOHZ Output disable to DQ High-Z output tOLZ Output enable to Low-Z output tPC 10 1 7 ns 8 10 20 5 ns 1 ns 2 ns ns 8 ns 1 3 ns 2 Page READ cycle time 20 ns tRC READ cycle time 70 ns tVP ADV# Low pulse width 5 ns Notes: 1. Low-Z to High-Z timings are tested with the circuit shown in Figure 17. The High-Z timings measure a 100mV transition from either VOH or VOL toward VDDQ/2. 2. High-Z to Low-Z timings are tested with the circuit shown in Figure 17. The Low-Z timings measure a 100mV transition away from the High-Z (VDDQ/2) level toward either VOH or VOL. 3. Page mode enable only Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 32 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Table16 . Burst READ Cycle Timing Requirements -7010 -7008 Symbol Parameter tAA Address Acess Time (Fixed Latency) 70 70 ns tAADV ADV# Access Time (Fixed Latency) 70 70 ns tABA Burst to READ Access Time (Variable Latency) 45.5 59 ns tACLK CLK to Output Delay 7 9 ns tAVH Address hold from ADV# HIGH (Fixed Latency) tBOE Burst OE# LOW to Output Valid tCBPH CE# High between Subsequent Burst or Mixed-Mode Operations tCEM Maximum CE# Pulse width tCEW CE# low to WAIT Valid tCLK CLK Period tCO Chip Select Access Time (Fixed Latency) tCSP CE# Setup Time to Active CLK Edge 3 4 ns tHD Hold Time from Active CLK Edge 2 2 ns tHZ Chip Disable to DQ and WAIT High-Z Output Min Max 2 Min 5 20 7.5 9.62 1 ns 1 4 us 1 7.5 ns ns 12.5 70 Note ns 6 4 Unit ns 2 20 1 Max 70 ns 8 8 ns 1.6 1.8 ns 7 9 ns 8 ns 2 3 tKHKL CLK rise or fall Time tKHTL CLK to WAIT Valid tKOH Output HOLD from CLK 2 2 tKP CLK HIGH or LOW time 3 4 tOHZ Output disable to DQ High-Z Output tOLZ Output enable to DQ Low-Z output 3 3 ns tSP Setup time to Active CLK Edge 3 3 ns 8 2 Notes: 1. A refresh opportunity must be provided every tCEM. A refresh opportunity is satisfied by either of the following two conditions : a) clocked CE#, or b) CE# HIGH for longer than 15ns 2. Low-Z to High-Z timings are tested with the circuit shown in Figure 17. The High-Z timings measure a 100mV transition from either VOH or VOL toward VDDQ/2. 3. High-Z to Low-Z timings are tested with the circuit shown in Figure 17. The Low-Z timings measure a 100mV transition away from the High-Z (VDDQ/2) level toward either VOH or VOL. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 33 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Table17 . Asynchronous WRITE Cycle Timing Requirements Symbol Parameter 70ns Min Max Unit tAS Address and ADV# LOW Setup Time 0 ns tAVH Address hold from ADV# HIGH 2 ns tAVS Address setup to ADV# HIGH 5 ns tAW Address Valid to End of Write 70 ns tBW UB#, LB# Select to End of Write 70 ns tCEW CE# low to WAIT Valid 1 tCPH CE# HIGH between Subsequent Asynchronous cycles 5 ns tCVS CE# low to ADV# HIGH 7 ns tCW Chip Enable to End of Write 70 ns tDH Data Hold from Write Time 0 ns tDW Data Write Setup Time 20 ns tHZ Chip Disable to DQ and WAIT High-Z Output tLZ Chip enable to Low-Z output tOW 7.5 8 Notes ns ns 1 10 ns 2 End WRITE to Low-Z output 5 ns 2 tVP ADV# Low pulse width 5 ns tVS ADV# Setup to End of Write 70 ns tWC WRITE cycle time 70 ns tWHZ WRITE to DQ High-Z Output tWP WRITE Pulse Width tWPH tWR 8 ns 1 45 ns 3 WRITE pulse width HIGH 10 ns WRITE Recovery Time 0 ns Notes: 1. Low-Z to High-Z timings are tested with the circuit shown in Figure 17. The High-Z timings measure a 100mV transition from either VOH or VOL toward VDDQ/2. 2. High-Z to Low-Z timings are tested with the circuit shown in Figure 17. The Low-Z timings measure a 100mV transition away from the High-Z (VDDQ/2) level toward either VOH or VOL. 3. WE# must be limited to tCEM (4us) Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 34 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Table18 . Burst WRITE Cycle Timing Requirements Symbol -7010 Parameter Min -7008 Max Min Max Unit Note 1 tAS Address and ADV# LOW Setup Time 0 0 ns tAVH Address hold from ADV# HIGH (Fixed Latency) 2 2 ns tCBPH CE# High between Subsequent Burst or Mixed-Mode Operations 5 6 ns 2 tCEM Maximum CE# Pulse width 4 us 2 tCEW CE# low to WAIT Valid 7.5 ns tCLK CLK Period tCSP 4 1 7.5 1 9.62 12.5 ns CE# Setup Time to Active CLK Edge 3 4 ns tHD Hold Time from Active CLK Edge 2 2 ns tHZ Chip Disable to DQ and WAIT High-Z Output tKHKL CLK rise or fall Time tKHTL CLK to WAIT Valid 8 8 ns 1.6 1.8 ns 7 9 ns tKP CLK HIGH or LOW time 3 4 ns tSP Setup time to Active CLK Edge 3 3 ns 3 Notes: 1. tAS required if tCSP > 20ns. 2. A refresh opportunity must be provided every tCEM. A refresh opportunity is satisfied by either of the following two conditions : a) clocked CE#, or b) CE# HIGH for longer than 15ns 3. Low-Z to High-Z timings are tested with the circuit shown in Figure 17. The High-Z timings measure a 100mV transition from either VOH or VOL toward VDDQ/2. Table19 . Initialization and DPD Timing Requirements Symbol Parameter -70 Min Max Unit tDPD Time from DPD entry to DPD exit 150 us tDPDX CE# LOW time to exit DPD 10 us tPU Initialization Period (required before normal operations) Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 150 Notes us 35 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Timing Diagrams Figure 18: Power-Up Initialization Timing VDD, VDDQ=1.7V VDD(MIN) tPU > 150us Device ready for normal operation Device Initialization Figure 19: DPD Entry and Exit Timing Parameters tDPD tDPDX tPU DPD Enabled DPD Exit CE# Write RCR[4]=0 Device Initialization Device ready for normal operation Figure 20: Asynchronous READ tRC VALID ADDRESS Address tAA DQ0DQ15 VALID OUTPUT ADV# CE# tCO tHZ tLZ tBHZ tBA UB#/LB# tOLZ tOE OE# WE# tCEW HiZ tHZ WAIT Rev. A1 | Oct. 2016 tOHZ www.issi.com - SRAM@issi.com HiZ 36 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 21: Asynchronous READ Using ADV# tAA VALID ADDRESS Address tAVS tAVH DQ0DQ15 VALID OUTPUT tAADV tVP ADV# tCVS CE# tCO tHZ tLZ tBHZ tBA UB#/LB# tOLZ tOE OE# WE# tCEW HiZ tHZ WAIT Rev. A1 | Oct. 2016 tOHZ www.issi.com - SRAM@issi.com HiZ 37 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 22: PAGE MODE READ tRC VALID ADDRESS A4-A21 tPC VALID ADDRESS A0-A3 VALID ADDRESS tAA VALID ADDRESS VALID ADDRESS tAPA DQ0DQ15 VALID OUTPUT VALID OUTPUT VALID OUTPUT VALID OUTPUT tOH ADV# tCO CE# tHZ tLZ tBHZ tBA UB#/LB# tOHZ tOLZ tOE OE# WE# tCEW tHZ HiZ WAIT Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com HiZ 38 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 23: CLK Timings for Burst Operations tCLK tKHKL Notes : tCLK tKP tKP 1. For Burst timing diagrams, non-default BCR settings are shown Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 39 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 24: Single Access Burst READ Operation - Variable Latency without refresh collision tABA tCLK CLK VALID ADDRESS Address tSP tACLK tHD DQ0DQ15 tKOH VALID OUTPUT tSP ADV# tCSP CE# tHD tHD tCEM tSP UB#/LB# WE# tHD tOLZ tBOE OE# tHZ tCEW WAIT tKHTL HiZ Read Burst Identified (WE#=HIGH) Notes: 1. Non-default variable latency BCR settings for single-access burst READ operation: Variable Latency code two (four clocks); WAIT active LOW; WAIT asserted during delay. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 40 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 25: Four-Word Burst READ Operation - Variable Latency without refresh collision tABA tCLK CLK VALID ADDRESS Address tSP tACLK tHD DQ0DQ15 tKOH VALID OUTPUT tSP ADV# VALID OUTPUT tHZ tHD tSP tHD tHD WE# tOLZ tOHZ tBOE OE# tHZ tCEW WAIT tCBPH tCEM CE# tSP VALID OUTPUT tHD tCSP UB#/LB# VALID OUTPUT tKHTL HiZ Read Burst Identified (WE#=HIGH) Notes: 1. Non-default variable latency BCR settings for 4-word burst READ operation: Variable Latency code two (four clocks); WAIT active LOW; WAIT asserted during delay. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 41 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 26: Four-Word Burst READ Operation - Variable Latency with refresh collision tCLK CLK VALID ADDRESS Address tSP tACLK tHD DQ0DQ15 tKOH VALID OUTPUT tSP ADV# VALID OUTPUT tHZ tHD tCBPH tCEM CE# tSP tSP VALID OUTPUT tHD tCSP UB#/LB# VALID OUTPUT tHD tHZ tHD WE# tOLZ tBOE OE# tCEW WAIT tKHTL HiZ Read Burst Identified (WE#=HIGH) Notes: 1. Non-default variable latency BCR settings for 4-word burst READ operation: Latency code two (three clocks); WAIT active LOW; WAIT asserted during delay. 2. If refresh collision happened, WAIT will be asserted between the latency count number of clock cycles and 2x the latency count Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 42 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 27: Single Access Burst READ Operation - Fixed Latency tCLK CLK tAA VALID ADDRESS Address tSP tKOH tAVH DQ0DQ15 VALID OUTPUT tAADV tSP ADV# tHD tHD tCO tCSP CE# tCEM tSP UB#/LB# tSP tHZ tHD tHD WE# tOHZ tOLZ tBOE OE# tHZ tCEW WAIT tKHTL HiZ Read Burst Identified (WE#=HIGH) Notes: 1. Non-default fixed latency BCR settings for single-access burst READ operation: Fixed Latency; Latency code four (five clocks); WAIT active LOW; WAIT asserted during delay. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 43 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 28: Four-Word Burst READ Operation - Fixed Latency tCLK CLK tAA VALID ADDRESS Address tSP tKOH tAVH DQ0DQ15 VALID OUTPUT VALID OUTPUT VALID OUTPUT VALID OUTPUT tHZ tAADV tSP ADV# tHD tCO tHD tCSP tCEM CE# tSP UB#/LB# tSP tCBPH tHD tHD WE# tOLZ tBOE OE# tHZ tCEW WAIT tKHTL HiZ Read Burst Identified (WE#=HIGH) Notes: 1. Non-default fixed latency BCR settings for 4-word burst READ operation: Fixed latency; latency code two (three clocks); WAIT active LOW; WAIT asserted during delay. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 44 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 29: READ Burst Suspend CLK Note2 VALID ADDRESS Address tSP tKOH tHD DQ0DQ15 VALID OUTPUT VALID OUTPUT VALID OUTPUT VALID OUTPUT VALID OUTPUT VALID OUTPUT tHZ tAADV tSP ADV# tHD tCO tCSP tHD tCBPH tHD tHD tCEM CE# tSP UB#/LB# tHD tSP tHD WE# tOLZ tBOE OE# Note3 tHZ tCEW WAIT HiZ tKHTL Notes: 1. Non-default BCR settings for READ burst suspend: Fixed or variable latency; Variable Latency code two (four clocks); WAIT active LOW; WAIT asserted during delay. 2. CLK can be stopped LOW or HIGH, but must be static, with no LOW-to-HIGH transitions during burst suspend. 3. OE# can stay LOW during BURST SUSPEND. If OE# is LOW, DQ[15:0] will continue to output valid data. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 45 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 30: Burst READ at End of Row (Wrap Off) tCLK CLK Address DQ0DQ15 VALID OUTPUT VALID OUTPUT VALID OUTPUT End of Row (A[7:0]=FFh) ADV# VIH NOTE2 CE# UB#/LB# VIH tHZ VIL VIL WE# OE# VIL tKHTL tHZ WAIT Notes: 1. Non-default BCR settings for burst WRITE at end of row: fixed or variable latency; WAIT active LOW; WAIT asserted during delay. 2. For burst READs, CE# must go HIGH before the second CLK after the WAIT period begins (before the second CLK after WAIT asserts with BCR[8] = 0, or before the third CLK after WAIT asserts with BCR[8] = 1). Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 46 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 31: CE#-Controlled Asynchronous WRITE tWC VALID ADDRESS Address tAW DQ0DQ15 tWR VALID INPUT tAS tLZ tDW tWHZ ADV# tCW CE# tDH tHZ tBW UB#/LB# OE# tWPH tWP WE# tCEW WAIT Rev. A1 | Oct. 2016 tHZ HiZ www.issi.com - SRAM@issi.com HiZ 47 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 32: LB#/UB#-Controlled Asynchronous WRITE tWC VALID ADDRESS Address tAW DQ0DQ15 tWR VALID INPUT tLZ tDW tWHZ ADV# tCW CE# tDH tHZ tAS tBW UB#/LB# OE# tWPH tWP WE# tCEW WAIT Rev. A1 | Oct. 2016 tHZ HiZ www.issi.com - SRAM@issi.com HiZ 48 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 33: WE#-Controlled Asynchronous WRITE tWC VALID ADDRESS Address tAW DQ0DQ15 tWR VALID INPUT tAS tLZ tDW tWHZ ADV# tCW CE# tDH tHZ tBW UB#/LB# tAS OE# tWPH tWP WE# tCEW WAIT Rev. A1 | Oct. 2016 tHZ HiZ www.issi.com - SRAM@issi.com HiZ 49 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 34: Asynchronous WRITE Using ADV# tAW tAS VALID ADDRESS Address tAVS tAVH tDW DQ0DQ15 tDH VALID DATA tVS tVP ADV# tAS tCVS CE# tCW tBW UB#/LB# tWP WE# tCEW WAIT Rev. A1 | Oct. 2016 tHZ HiZ www.issi.com - SRAM@issi.com HiZ 50 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 35: Four-Word Burst WRITE Operation - Variable Latency tCLK CLK VALID ADDRESS Address tSP DQ0DQ15 tSP tHD DATA IN tAS NOTE3 tHD DATA IN DATA IN tAS ADV# tHD tCSP tCEM CE# tCBPH tSP UB#/LB# tSP WE# WAIT DATA IN HiZ tHD tHD tHD tCEW tKHTL NOTE2 Write Burst Identified (WE#=LOW) Notes: 1. Non-default BCR settings for burst WRITE operation, with fixed-length burst of 4, burst wrap enabled: Variable latency; Variable Latency code two (four clocks); WAIT active LOW; WAIT asserted during delay. 2. WAIT asserts for LC cycles for both fixed and variable latency. LC = latency code (BCR[13:11]). 3. tAS required if tCSP > 20ns. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 51 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 36: Four-Word Burst WRITE Operation - Fixed Latency tCLK CLK VALID ADDRESS Address tSP DQ0DQ15 tSP tHD DATA IN tAS NOTE3 tHD DATA IN DATA IN DATA IN tAVH tAS ADV# tHD tCSP tCEM CE# tCBPH tSP UB#/LB# tSP WE# tHD tHD tHD tCEW WAIT tKHTL HiZ NOTE2 Write Burst Identified (WE#=LOW) Notes: 1. Non-default BCR settings for burst WRITE operation, with fixed-length burst of 4, burst wrap enabled: Fixed latency; latency code two (three clocks); WAIT active LOW; WAIT asserted during delay. 2. WAIT asserts for LC cycles for both fixed and variable latency. LC = latency code (BCR[13:11]). 3. tAS required if tCSP > 20ns. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 52 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 37: Burst WRITE at End-of-Row (Wrap Off) tCLK CLK Address ADV# VIH UB#/LB# WE# OE# VIH tKHTL tHZ tHZ WAIT NOTE2 CE# VIH tHZ VIL DQ0DQ15 VALID INPUT VALID INPUT VALID INPUT End of Row (A[7:0]=FFh) Notes: 1. Non-default BCR settings for burst WRITE at end of row: fixed or variable latency; WAIT active LOW; WAIT asserted during delay. 2. For burst WRITEs, CE# must go HIGH before the second CLK after the WAIT period begins (before the second CLK after WAIT asserts with BCR[8] = 0, or before the third CLK after WAIT asserts with BCR[8] = 1). Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 53 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 38: Burst WRITE followed by Burst READ tABA tCLK CLK VALID ADDRESS Address tSP tHD DQ0DQ15 VALID ADDRESS tSP tHD tSP tHD tACLK tKOH VALID VALID VALID VALID OUTPUTOUTPUTOUTPUTOUTPUT DATA IN DATA IN DATA IN DATA IN tAS tAS ADV# tCBPH tCSP tCEM tCEM CE# tSPtHD tHD UB#/LB# tSP tHD WE# tOLZ tBOE OE# WAIT tOHZ tCEW HiZ tKHTL HiZ tHZ tCEW tKHTL Notes: 1. Non-default BCR settings for burst WRITE followed by burst READ; Variable Latency code two (four clocks); WAIT active LOW; WAIT asserted during delay. 2. A refresh opportunity must be provided every tCEM. A refresh opportunity is satisfied by either of the following two conditions: a) clocked CE# HIGH, or b) CE# HIGH for longer than 15ns. CE# can stay LOW between burst READ and burst WRITE operations, but CE# must not remain LOW longer than tCEM. See burst interrupt diagram (Figure 39 through 44) for cases where CE# stay LOW between bursts. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 54 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 39: Burst READ interrupted by Burst READ WRITE burst interrupted with new READ CLK VALID ADDRESS Address tSP VALID ADDRESS tACLK tHD DQ0DQ15 tACLK tKOH tKOH VALID VALID VALID VALID OUTPUT OUTPUT OUTPUT OUTPUT VALID OUTPUT tOHZ tSP ADV# tHD tCSP tCEM (Note3) CE# UB#/LB# tSP tHD WE# tOLZ WAIT tBOE tBOE OE# tCEW tOHZ tKHTL tHZ HiZ Notes: 1. Non-default BCR settings for burst READ interrupted by burst READ : fixed or variable latency; Variable Latency code 2 (4 clocks); WAIT active LOW; WAIT asserted during delay. All bursts shown for variable latency; no refresh collision. 2. Burst interrupt shown on first allowable clock (such as after the first data received by the controller). 3. CE# can stay LOW between burst operations, but CE# must not remain LOW longer than tCEM Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 55 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 40: Burst READ interrupted by Burst WRITE WRITE burst interrupted with new WRITE CLK VALID ADDRESS Address tSP VALID ADDRESS tACLK tHD DQ0DQ15 tKOH VALID OUTPUT VALID INPUT VALID INPUT VALID INPUT VALID INPUT tOHZ ADV# tCSP tCEM (Note3) tHD CE# UB#/LB# tSP tHD WE# tBOE OE# WAIT tCEW tKHTL HiZ Notes: 1. Non-default BCR settings for burst READ interrupted by burst WRITE: fixed or variable latency; Variable Latency code 2 (4 clocks); WAIT active LOW; WAIT asserted during delay. All bursts shown for variable latency; no refresh collision. 2. Burst interrupt shown on first allowable clock (such as after the first data received by the controller). 3. CE# can stay LOW between burst operations, but CE# must not remain LOW longer than tCEM Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 56 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 41: Burst WRITE interrupted by Burst READ - Variable Latency Mode WRITE burst interrupted with new READ CLK VALID ADDRESS Address tSP VALID ADDRESS tACLK tKOH tHD DQ0DQ15 VALID VALID VALID VALID OUTPUT OUTPUT OUTPUT OUTPUT VALID INPUT tSP ADV# tHD tCSP tCEM (Note 3) CE# UB#/LB# tSP tHD WE# tOLZ tBOE OE# WAIT tOHZ tCEW tKHTL tHZ HiZ Notes: 1. Non-default BCR settings for burst WRITE interrupted by burst READ in variable latency mode: fixed or variable latency; Variable Latency code 2 (4 clocks); WAIT active LOW; WAIT asserted during delay. All bursts shown for variable latency; no refresh collision. 2. Burst interrupt shown on first allowable clock (such as after first data word written). 3. CE# can stay LOW between burst operations, but CE# must not remain LOW longer than tCEM. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 57 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 42: Burst WRITE interrupted by Burst WRITE - Variable Latency Mode WRITE burst interrupted with new WRITE CLK Address VALID ADDRESS tSP tHD DQ0DQ15 ADV# VALID ADDRESS VALID INPUT tSP VALID INPUT VALID INPUT VALID INPUT VALID INPUT tHD tHD tCSP tCEM (Note 3) CE# UB#/LB# tSP tHD WE# OE# tCEW tKHTL WAIT Notes: 1. Non-default BCR settings for burst WRITE interrupted by WRITE: fixed or variable latency; Variable Latency code 2 (4 clocks); WAIT active LOW; WAIT asserted during delay. All bursts shown for variable latency; no refresh collision. 2. Burst interrupt shown on first allowable clock (such as after the first data received by the controller). Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 58 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 43: Burst WRITE interrupted by Burst READ - Fixed Latency Mode WRITE burst interrupted with new READ CLK VALID ADDRESS Address tSP VALID ADDRESS tACLK tKOH tAVH DQ0DQ15 VALID VALID VALID VALID OUTPUT OUTPUT OUTPUT OUTPUT VALID INPUT tSP ADV# tHD tCSP tCEM (Note 3) CE# UB#/LB# tSP tHD WE# tOLZ tBOE OE# WAIT tOHZ tCEW tKHTL tHZ HiZ Notes: 1. Non-default BCR settings for burst WRITE interrupted by burst READ in fixed latency mode: fixed latency; Variable Latency code 2 (4 clocks); WAIT active LOW; WAIT asserted during delay. 2. Burst interrupt shown on first allowable clock (such as after first data word written). 3. CE# can stay LOW between burst operations, but CE# must not remain LOW longer than tCEM. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 59 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 44: Burst WRITE interrupted by Burst WRITE - Fixed Latency Mode CLK Address VALID ADDRESS tSP tAVH DQ0DQ15 ADV# VALID ADDRESS VALID INPUT tSP VALID INPUT VALID INPUT VALID INPUT VALID INPUT tHD tCSP tCEM (Note 3) tHD CE# UB#/LB# tSP tHD WE# OE# tCEW tKHTL WAIT Notes: 1. Non-default BCR settings for burst WRITE interrupted by burst WRITE in fixed latency mode: fixed latency; Variable Latency code 2 (4 clocks); WAIT active LOW; WAIT asserted during delay. 2. Burst interrupt shown on first allowable clock (such as after first data word written). 3. CE# can stay LOW between burst operations, but CE# must not remain LOW longer than tCEM. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 60 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 45: Asynchronous WRITE followed by Burst READ tCLK CLK tAW tWR VALID ADDRESS VALID ADDRESS Address tDS DQ0DQ15 tSP tHD tDH tACLK VALID DATA tKOH VALID OUTPUT tVS tSP tHD tVP ADV# tCVS NOTE2 tCBPH tCW CE# tBW UB#/LB# tCSP tHD tSP tHD tWP WE# tOLZ tBOE OE# tHZ WAIT tKHTL HiZ Notes: 1. Non-default BCR settings for asynchronous WRITE followed by burst READ: fixed or variable latency; Variable Latency code 2 (4 clocks); WAIT active LOW; WAIT asserted during delay. 2. When transitioning between asynchronous and variable-latency burst operations, CE# must go HIGH. CE# can stay LOW when transitioning to fixed-latency burst READs. A refresh opportunity must be provided every tCEM. A refresh opportunity is satisfied by either of the following two conditions: a) clocked CE# HIGH or b) CE# HIGH for longer than 15ns. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 61 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 46: Asynchronous WRITE (ADV# LOW) followed by Burst READ tCLK tWC CLK tWR tAW VALID ADDRESS Address tAS tLZ tWHZ VALID ADDRESS tDW DQ0DQ15 tSP tHD tDH tKOH VALID OUTPUT VALID DATA tSP tHD ADV# NOTE2 tCBPH tCW CE# tBW UB#/LB# WE# tACLK tWPH tCSP tHD tSP tHD tWP tOLZ tBOE OE# tCEW WAIT HiZ tHZ tHZ HiZ tKHTL Notes: 1. Non-default BCR settings for asynchronous WRITE followed by burst READ: fixed or variable latency; Variable Latency code 2 (4 clocks); WAIT active LOW; WAIT asserted during delay. 2. When transitioning between asynchronous and variable-latency burst operations, CE# must go HIGH. CE# can stay LOW when transitioning to fixed-latency burst READs. A refresh opportunity must be provided every tCEM. A refresh opportunity is satisfied by either of the following two conditions: a) clocked CE# HIGH or b) CE# HIGH for longer than 15ns. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 62 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 47: Burst READ Followed by Asynchronous WRITE (WE#-Controlled) tABA tCLK tWC CLK tAW VALID ADDRESS Address tWR VALID ADDRESS tACLK tSP tHD DQ0DQ15 tAS tKOH tWHZ tDW VALID OUTPUT tDH VALID DATA tLZ tSP tHD ADV# tCSP CE# tHD tCEM tSP UB#/LB# tCW tHD tBW tWP WE# tOLZ tBOE OE# tHZ tCEW WAIT HiZ tKHTL tCEW tHZ HiZ Notes: 1. Non-default BCR settings for burst READ followed by asynchronous WE#-controlled WRITE: fixed or variable latency; Variable Latency code 2 (4 clocks); WAIT active LOW; WAIT asserted during delay. 2. When transitioning between asynchronous and variable-latency burst operations, CE# must go HIGH. CE# can stay LOW when transitioning from fixed-latency burst READs. A refresh opportunity must be provided every tCEM. A refresh opportunity is satisfied by either of the following two conditions: a) clocked CE# HIGH or b) CE# HIGH for longer than 15ns. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 63 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 48: Burst READ Followed by Asynchronous WRITE Using ADV# tABA tCLK tWC CLK tAW VALID ADDRESS Address VALID ADDRESS tACLK tSP tHD DQ0DQ15 tAS tKOH tWHZ tDW VALID OUTPUT tCSP CE# tLZ tHD tCEM tSP UB#/LB# tDH VALID DATA tSP tHD ADV# tWR tCVS tHD tCW tBW tWP WE# tOLZ tBOE OE# tHZ tCEW WAIT HiZ tKHTL tCEW HiZ tHZ HiZ Notes: 1. Non-default BCR settings for burst READ followed by asynchronous WRITE using ADV#: fixed or variable latency; Variable Latency code 2 (4 clocks); WAIT active LOW; WAIT asserted during delay. 2. When transitioning between asynchronous and variable-latency burst operations, CE# must go HIGH. CE# can stay LOW when transitioning from fixed-latency burst READs. A refresh opportunity must be provided every tCEM. A refresh opportunity is satisfied by either of the following two conditions: a) clocked CE# HIGH or b) CE# HIGH for longer than 15ns. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 64 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 49: Asynchronous WRITE followed by Asynchronous READ - ADV# LOW tWC tAW tWR tRC VALID ADDRESS VALID ADDRESS Address tAS tLZ tWHZ tDW DQ0DQ15 tDH tAA VALID DATA VALID OUTPUT ADV# tCPH tCW CE# tHZ tCO tHZ Note1 tBHZ tBLZ tBA tBW UB#/LB# tOLZ tWPH WE# tWP tCEW WAIT HiZ tOHZ tOE OE# tHZ HiZ tCEW HiZ Notes: 1. When configured for synchronous mode (BCR[15] = 0), CE# must remain HIGH for at least 5ns (tCPH) to schedule the appropriate refresh interval. Otherwise, tCPH is only required after CE#-controlled WRITEs. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 65 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Figure 50: Asynchronous WRITE followed by Asynchronous READ tWC tAW tWR tRC VALID ADDRESS VALID ADDRESS Address tAS tWHZ tDW DQ0DQ15 tDH tAA VALID OUTPUT VALID DATA tLZ ADV# tCVS CE# tCW tHZ tBLZ tBHZ tBA tBW UB#/LB# tCO tOLZ tWPH WE# tCEW WAIT HiZ tWP tOHZ tOE OE# tHZ tCEW HiZ tHZ HiZ Notes: 1. When configured for synchronous mode (BCR[15] = 0), CE# must remain HIGH for at least 5ns (tCPH) to schedule the appropriate refresh interval. Otherwise, tCPH is only required after CE#-controlled WRITEs. Rev. A1 | Oct. 2016 www.issi.com - SRAM@issi.com 66 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Ordering Information ALL: VDD 1.7V~1.95V, VDDQ 1.7V~1.95V Industrial Temperature Range: (-40oC to +85oC) Config. Speed (ns) Frequency (MHz) Order Part No. Package 2Mx16 70 133 IS66WVC2M16EALL-7013BLI 54-ball VFBGA 104 IS66WVC2M16EALL-7010BLI 54-ball VFBGA 80 IS66WVC2M16EALL-7008BLI 54-ball VFBGA Ordering Information CLL: VDD 1.7V~1.95V, VDDQ 2.7V~3.6V Industrial Temperature Range: (-40oC to +85oC) Config. Speed (ns) Frequency (MHz) 2Mx16 70 Rev. A1 | Oct. 2016 Order Part No. Package 133 IS66WVC2M16ECLL-7013BLI 54-ball VFBGA 104 IS66WVC2M16ECLL-7010BLI 54-ball VFBGA 80 IS66WVC2M16ECLL-7008BLI 54-ball VFBGA www.issi.com - SRAM@issi.com 67 IS66WVC2M16EALL/CLL IS67WVC2M16EALL/CLL Rev. 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