BCW66G BCW66G NPN General Purpose Amplifier * This device is designed for general purpose amplifier applications at collector currents to 500mA. * Sourced from process 13. 3 2 1 SOT-23 Mark: EG 1. Base 2. Emitter 3. Collector Absolute Maximum Ratings * TC=25C unless otherwise noted Symbol VCEO Collector-Emitter Voltage Parameter Value 45 VCBO Collector-Base Voltage 75 V VEBO Emitter-Base Voltage 5 V IC Collector Current TJ, TSTG Operating and Storage Junction Temperature Range - Continuous Units V 1 A - 55 ~ +150 C * These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. NOTES: 1. These ratings are based on a maximum junction temperature of 150degrees C. 2. These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations. Electrical Characteristics TC=25C unless otherwise noted Symbol BVCBO Parameter Collector-Base Breakdown Voltage Test Condition IC = 10A BVCEO Collector-Emitter Breakdown Voltage IC = 10mA 45 V BVEBO Emitter-Base Breakdown Voltage IE = 10A 5 V ICES Collector Cut-off Current VCB = 45V, IE = 0 VCB = 45V, IE = 0 Typ. Max. 20 TA = 150C IEBO Emitter Cut-off Current VEB = 4V hFE DC Current Gain VCE = 10V, IC = 100A VCE = 1V, IC = 10mA VCE = 1V, IC = 100mA VCE = 2V, IC = 500mA VCE(sat) Min. 75 50 110 160 60 Units V nA 20 A 20 nA 400 0.3 0.7 V Collector-Emitter Saturation Voltage IC = 100mA, IB = 10mA IC = 500mA, IB = 50mA VBE(sat) Base-Emitter Saturation Voltage IC = 500mA, IB = 50mA 2 V Cobo Output Capacitance VCB = 10V, f = 1MHz 12 pF Cibo Input Capacitance VEB = 0.5V, f = 1MHz fT Current gain Bandwidth Product VCE = 10V, IC = 20mA, f = 100MHz NF Noise Figure VCE = 5V, IC = 0.2mA, RS = 1k, f = 1KHz, BW = 200Hz 10 dB ton Turn-On Time ns Turn-Off Time IB1 = IB2 = 15mA IC = 150mA, RL = 150 100 toff (c)2002 Fairchild Semiconductor Corporation 80 100 pF MHz 400 Rev. A1, August 2002 PD Symbol Total Device Dissipation Derate above 25C Parameter Max. 350 2.8 Units mW mW/C RJA Thermal Resistance, Junction to Ambient 357 C/W (c)2002 Fairchild Semiconductor Corporation Min. Typ. Rev. A1, August 2002 BCW66G Thermal Characteristics BCW66G Package Dimensions 0.10 0.10 2.40 0.40 0.03 1.30 0.45~0.60 0.20 MIN SOT-23 0.03~0.10 0.38 REF 0.40 0.03 +0.05 0.12 -0.023 0.96~1.14 0.97REF 2.90 0.10 0.95 0.03 0.95 0.03 1.90 0.03 0.508REF Dimensions in Millimeters (c)2002 Fairchild Semiconductor Corporation Rev. A1, August 2002 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM FACTTM ActiveArrayTM FACT Quiet seriesTM BottomlessTM FAST(R) FASTrTM CoolFETTM CROSSVOLTTM FRFETTM GlobalOptoisolatorTM DOMETM EcoSPARKTM GTOTM E2CMOSTM HiSeCTM EnSignaTM I2CTM Across the board. Around the world.TM The Power FranchiseTM Programmable Active DroopTM ImpliedDisconnectTM ISOPLANARTM LittleFETTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerTrench(R) QFETTM QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM TruTranslationTM UHCTM UltraFET(R) VCXTM DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. (c)2002 Fairchild Semiconductor Corporation Rev. I1